Anybus® CompactCom™ M30

HARDWARE DESIGN GUIDE

HMSI-168-31 4.0 ENGLISH
Important User Information
Liability
Every care has been taken in the preparation of this document. Please inform HMS Industrial Networks AB of any
inaccuracies or omissions. The data and illustrations found in this document are not binding. We, HMS Industrial
Networks AB, reserve the right to modify our products in line with our policy of continuous product development.
The information in this document is subject to change without notice and should not be considered as a commit-
ment by HMS Industrial Networks AB. HMS Industrial Networks AB assumes no responsibility for any errors that
may appear in this document.

There are many applications of this product. Those responsible for the use of this device must ensure that all the
necessary steps have been taken to verify that the applications meet all performance and safety requirements in-
cluding any applicable laws, regulations, codes, and standards.

HMS Industrial Networks AB will under no circumstances assume liability or responsibility for any problems that
may arise as a result from the use of undocumented features, timing, or functional side effects found outside the
documented scope of this product. The effects caused by any direct or indirect use of such aspects of the product
are undefined, and may include e.g. compatibility issues and stability issues.

The examples and illustrations in this document are included solely for illustrative purposes. Because of the many
variables and requirements associated with any particular implementation, HMS Industrial Networks AB cannot as-
sume responsibility for actual use based on these examples and illustrations.

Intellectual Property Rights

HMS Industrial Networks AB has intellectual property rights relating to technology embodied in the product de-
scribed in this document. These intellectual property rights may include patents and pending patent applications in
the USA and other countries.

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Table of Contents Page

1 Preface ............................................................................................................................... 3
1.1 About this Document ......................................................................................................3
1.2 Related Documents .......................................................................................................3
1.3 Document history...........................................................................................................3
1.4 Document Conventions ..................................................................................................4
1.5 Document Specific Conventions......................................................................................4
1.6 Trademark Information ...................................................................................................5

2 Introduction ...................................................................................................................... 6
2.1 General Description .......................................................................................................6
2.2 Features .......................................................................................................................6
2.3 Passive vs. Active ..........................................................................................................7
2.4 M12 Connector ..............................................................................................................7

3 Host Interface................................................................................................................... 8
3.1 Overview.......................................................................................................................8
3.2 Connector .....................................................................................................................9
3.3 Host Interface Signals ..................................................................................................10
3.4 Signal Descriptions ......................................................................................................12

4 Parallel Interface Operation........................................................................................ 16

4.1 General Information .....................................................................................................16
4.2 Parallel Interface Signals ..............................................................................................17
4.3 Function Table (CE, R/W, OE, D[0...7]) ..........................................................................17
4.4 Timing Diagrams..........................................................................................................18
4.5 Network Identification ...................................................................................................20

5 Serial Interface Operation ........................................................................................... 21

5.1 General Description .....................................................................................................21
5.2 Serial Interface Signals.................................................................................................21
5.3 Baud Rate Accuracy ....................................................................................................21

6 General Purpose I/O ..................................................................................................... 22

6.1 General.......................................................................................................................22
6.2 Functional Description..................................................................................................22

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Table of Contents

A Implementation Guidelines ........................................................................................ 23

A.1 Module Compatibility....................................................................................................23
A.2 Additional Address Lines (A[11...13]) .............................................................................23
A.3 Network Status LED outputs (LED[1A...2B])...................................................................24
A.4 Typical Implementation (3.3 V) ......................................................................................26
A.5 Interfacing to 5V Logic..................................................................................................27
A.6 Power Supply Considerations .......................................................................................29
A.7 Bypass Capacitance ....................................................................................................30
A.8 3.3 V Regulation ..........................................................................................................30

B Mechanical Specification ............................................................................................ 31

B.1 Overview.....................................................................................................................32
B.2 M12 Connector ............................................................................................................33
B.3 Footprint .....................................................................................................................34
B.4 Housing Preparations...................................................................................................35
B.5 Slot Cover ...................................................................................................................36
B.6 Host Connector............................................................................................................37
B.7 Fastening Mechanics ...................................................................................................41

C Technical Specification ............................................................................................... 43

C.1 Environmental .............................................................................................................43
C.2 Shock and Vibration .....................................................................................................43
C.3 Electrical Characteristics ..............................................................................................44
C.4 Regulatory Compliance ................................................................................................45

D Anybus CompactCom 30 without Housing ............................................................ 46

D.1 General Information .....................................................................................................46
D.2 Ordering Information ....................................................................................................47
D.3 Footprint .....................................................................................................................48
D.4 Host Connectors ..........................................................................................................49
D.5 Height Restrictions.......................................................................................................49
D.6 Assembly ....................................................................................................................50
D.7 Dimensions .................................................................................................................50
D.8 M12 Connectors ..........................................................................................................59

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1 Preface
1.1 About this Document
This document is intended to provide a good understanding of the mechanical and electrical
properties of the Anybus CompactCom platform. It does not cover any of the network specific
features offered by the Anybus CompactCom 30 products; this information is available in the
appropriate Network Guide.

The reader of this document is expected to be familiar with hardware design and communica-
tion systems in general. For additional information, documentation, support etc., please visit the
support website at www.anybus.com/support.

1.2 Related Documents

Document Author Document ID
Anybus CompactCom 30 Software Design Guide HMS
Anybus CompactCom B30 Design Guide HMS
Anybus CompactCom Host Application Implementation HMS HMSI-27-334
Guide
Anybus CompactCom Network Guides (separate document HMS
for each supported fieldbus or network system)
Low-Cost, Low-Power Level Shifting in Mixed-Voltage (5V, Texas Instruments
3.3V) Systems (SCBA002A)
LT1767 Data Sheet Linear Technology
EN 60950 IEC
EN 61000 IEC
EN 55011 IEC

1.3 Document history

Version Date Description
1.00 - 3.10 See earlier versions
4.0 Moved from FM to XML
Misc. updates

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1.4 Document Conventions

Ordered lists are used for instructions that must be carried out in sequence:
1. First do this
2. Then do this
Unordered (bulleted) lists are used for:
• Itemized information
• Instructions that can be carried out in any order
...and for action-result type instructions:
► This action...
➨ leads to this result
Bold typeface indicates interactive parts such as connectors and switches on the hardware, or
menus and buttons in a graphical user interface.

Monospaced text is used to indicate program code and other

kinds of data input/output such as configuration scripts.

This is a cross-reference within this document: Document Conventions, p. 4

This is an external link (URL): www.hms-networks.com

This is additional information which may facilitate installation and/or operation.

This instruction must be followed to avoid a risk of reduced functionality and/or

damage to the equipment, or to avoid a network security risk.

Caution
This instruction must be followed to avoid a risk of personal injury.

WARNING
This instruction must be followed to avoid a risk of death or serious injury.

1.5 Document Specific Conventions

• The terms “Anybus” or “module” refers to the Anybus CompactCom module.
• The terms “host” or “host application” refer to the device that hosts the Anybus.
• Hexadecimal values are written in the format NNNNh or 0xNNNN, where NNNN is the hex-
adecimal value.
• A byte always consists of 8 bits.
• All dimensions in this document have a tolerance of ±0.20mm unless otherwise stated.
• Outputs are TTL compliant unless otherwise stated.
• Signals which are “pulled to GND” are connected to GND via a resistor.
• Signals which are “pulled to 3V3” are connected to 3V3 via a resistor.

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• Signals which are “tied to GND” are directly connect GND,

• Signals which are “tied to 3V3” are directly connected to 3V3.

1.6 Trademark Information

Anybus® is a registered trademark of HMS Industrial Networks AB.

All other trademarks are the property of their respective holders.

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2 Introduction
2.1 General Description
All Anybus CompactCom module implementations share the same footprint and electrical inter-
face, allowing the host application to support all major networking systems using the same
hardware platform. In the same way all Anybus CompactCom B30 share footprint and electrical
interface. This document describes the hardware details of the Anybus CompactCom M30 mod-
ules, both with and without housing. Please consult the Anybus CompactCom B30 Design
Guide for specific information about the Anybus CompactCom B30 brick solution.

This a class A product. In a domestic environment, this product may cause radio
interference in which case the user may be required to take adequate measures.
This product contains ESD (Electrostatic Discharge) sensitive parts that may be
damaged if ESD control procedures are not followed. Static control precautions are
required when handling the product. Failure to observe this may cause damage to
the product.

2.2 Features
• Integrated protocol stack handling (where applicable)
• Galvanically isolated network interface (where applicable)
• On-board network status indications according to each network standard (where
applicable)
• On-board network connectors according to each network standard
• Compact size (52 x 50 mm, 2” x 1.97”)
• Firmware upgradable (FLASH technology)
• 3.3 V design
• Low power consumption
• Parallel & serial interface modes
• Precompliance tested for network conformance (where applicable). Not finalized. All Any-
bus CompactCom versions will be precertified for network conformance. While this is done
to ensure that the final product can be certified, it does not necessarily mean that the final
product does not require recertification. Contact HMS for further information.
• Precompliance tested for CE & UL.
• Version with M12 connector available for PROFINET (2-port), EtherNet/IP (2-port), Mod-
busTCP (2-port), PROFIBUS DP-V1, EtherCAT, and DeviceNet
• Support for functional safety communication (PROFINET 2-port)

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2.3 Passive vs. Active

The Anybus CompactCom 30 product family features two types of communication modules:

Active CompactCom An active module integrates the complete network functionality (i.e. the protocol
Modules stack and the physical interface) in the same package in order to provide network
data exchange in an uniform manner.

Passive CompactCom A passive module uses a subset of the host interface signals, and generally
Modules operates on the physical level of a serial signal (i.e. RS-232, RS-485 etc.), or
enables serial data exchange on another medium/protocol such as USB or
Ethernet (serial server).

Both types of modules can be supported in the host application by implementing the proper host
interface signals. For more information, see Module Compatibility, p. 23.

2.4 M12 Connector

A number of the Anybus CompactCom M30 modules are available with M12 connectors instead
of the usual network connector.

The M12 connector gives the opportunity to raise the IP rating of a product up to IP67. However,
the standard Anybus CompactCom housing does not qualify for IP ratings above IP20. If a high-
er rating is needed, careful design of housings and/or module fronts is necessary. It is then rec-
ommended to use the Anybus CompactCom M30 without housing, and design a new housing/
front that fulfills the requirements for IP67.

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3 Host Interface
This chapter describes the low level properties of the Anybus CompactCom interface

3.1 Overview
The Anybus CompactCom has two different host communication interfaces, corresponding to
different operating modes. The figure below illustrates the basic properties of these interfaces
as well as various I/O and control signals, and how they relate to the host application.

Parallel Interface
A0 ... A13 Flash RAM
D0 ... D7

CE

Communications Controller
OE
R/W

Physical Interface
IRQ

Network
Host Anybus
CPU Tx
Rx
Serial Interface CPU

GOP[0...1]
GIP[0...1] I/O

RESET
OM[0...2]
MI[0...1]
MD[0...1]

Fig. 1

Please note that only one communication interface at a time is available. Which one is decided
at startup.

3.1.1 Parallel Interface

From an external point of view, the parallel interface is a common 8-bit parallel slave port inter-
face, which can easily be incorporated into any microprocessor based system that has an exter-
nal address/data bus. Generally, implementing this type of interface is comparable to
implementing an 8-bit or 16-bit wide SRAM. Additionally, the parallel interface features an inter-
rupt request line, allowing the host application to service the module only when actually needed.

3.1.2 Serial Interface (UART)

Compared to the serial interface, the parallel interface generally offers much higher perform-
ance. However, in some applications this solution may be impractical, e.g. when the host CPU
doesn’t have an external address/data bus etc. In such cases, the serial interface provides a
simple way of interfacing the module via a common asynchronous serial interface.

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3.2 Connector
The Anybus CompactCom uses a 50–pin CompactFlash™ style connector. The pinning is seen
from the host application side of the CompactCom module

RESET

LED2B
LED1B
GOP0
GIP0
OM1
MD1

VDD
VSS

VSS
A13

IRQ
A11

MI1
CE
D6
D4
D2
D0
A1
A3
A5
A7
A9

Tx
25 1
50 26

LED2A
LED1A
VSS
A0
A2
A4
A6
A8
A10
A12
D7
D5
D3
D1
VDD
VSS
OM0
OM2
R/W
OE
GOP1
GIP1

Rx
MI0
MD0
Fig. 2

See .Host Interface Signals, p. 10 for information on how each pin is used in the different
modes.

The host interface is not pin compatible with the CompactFlash™ standard. Also,
prior to exchanging a module, power should be turned off or the MD (module
detection signals should be used to shut down communication and power when
the module is removed. Failure to observe this may cause damage to the host
product and/or the Anybus CompactCom module.

Pin type Definition

I Input, CMOS (3.3 V)
O Output, CMOS (3.3 V)
BI Bidirectional, Tristate
PWR Power supply inputs
NC Not connected

None of the host interface signals are 5 V tolerant.

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3.3 Host Interface Signals

Each signal presented in the tables below is described in detail later in this document.

Also note that the passive CompactCom modules use a limited number of the host interface
signals.

For mechanical properties, dimensions, etc. see Mechanical Specification, p. 31.

For electrical characteristics, see Electrical Characteristics, p. 44.

3.3.1 Active Modules

Position Signal Type Function
36, 11, 35 OM[0...2] I Operating Mode
27, 2 MI[0...1] O Module Identification
8 RESET I Reset Input, active low
26, 25 MD[0...1] O Module Detection
14, 39, 15, 40, 16, 41, D[0...7] BI Parallel Interface
17, 42 Please note that when the serial interface is used by the
49, 24, 48, 23, 47, 22, A[0...13] I Anybus CompactCom 30 module, signals A12 and A13
46, 21, 45, 20, 44, 19, can be used for functional safety communication (Anybus
43, 18 CompactCom 30 PROFINET 2-Port module only). For
more information, see "Safety Serial Interface (PROFI-
10 CE I NET 2-port only)" on page 15.
33 OE I
34 R/W I
9 IRQ O
28 Rx I Serial Interface
3 Tx O
30 LED2A O Network Status LED Outputs
29 LED1A O
5 LED2B O
4 LED1B O
6, 31 GIP[0...1] I General Purpose I/O
7, 32 GOP[0...1] O
13, 38 VDD PW- Power Supply
R
1, 12, 37, 50 VSS PW- Ground
R

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3.3.2 Passive Modules

Position Signal Type Function
27, 2 MI[0...1] O Module Identification
8 RESET I Reset Input, active low
26, 25 MD[0...1] O Module Detection
14, 39, 15, 40, 16, 41, D[0...7] BI Parallel Interface
17, 42 The type of a passive module can be identified from host
10 CE I interface signals D0-D7 (on the parallel interface) if CE
(10) and OE (33) are set to low and R/W (34) to high, see
34 R/W I also "Network Identification" on page 21.
33 OE I
28 Rx I Serial Interface
3 Tx O
30 LED2A O Network Status LED Outputs
29 LED1A O
5 LED2B O
4 LED1B O
6 GIP[0...1] I General Purpose I/O
7 GOP[0...1] O
13, 38 VDD PW- Power Supply
R
1, 12, 37, 50 VSS PW- Ground
R
9, 11, 18, 19, 20, 21, 22, - NC (not used)
23, 24, 31, 32, 35, 36,
43, 44, 45, 46, 47, 48, 49

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3.4 Signal Descriptions

3.4.1 OM[0...2] (Operating Mode)
On active modules, these inputs select which interface that should be used to exchange data
(parallel or serial) and, if the serial interface option is used, the operating baud rate. The state of
these signals is sampled once during startup, i.e. any changes requires a reset in order to have
effect.

The state of these signals must be stable prior to releasing the RESET signal. Failure to observe
this may result in faulty or unexpected behavior.

Setting Operating Mode

OM2 OM1 OM0 Parallel interface State Serial interface State
LOW LOW LOW Enabled (disabled, se note below)
LOW LOW HIGH (disabled, see note below) Enabled, baud rate: 19.2 kbps
LOW HIGH LOW Enabled, baud rate: 57.6 kbps
LOW HIGH HIGH Enabled, baud rate: 115.2 kbps
HIGH LOW LOW Enabled, baud rate: 625 kbps
HIGH LOW HIGH (reserved)
HIGH HIGH LOW
HIGH HIGH HIGH Service mode

LOW = VIL

HIGH = VIH

For more information regarding the parallel and serial interfaces, see Parallel Interface Opera-
tion, p. 16 and Serial Interface Operation, p. 21.

These signals have no effect on passive modules; instead the communication settings are de-
termined by other network specific factors. Furthermore, a subset of the parallel interface sig-
nals are used for network identification purposes, see Additional Address Lines (A[11...13]), p.
23.

3.4.2 MI[0,,,1] (Module Identification)

These signals indicate which type of module that is connected. It is recommended to check the
state of these signals before accessing the module.

State Module Type

MI0 MI1
LOW LOW Anybus CompactCom (Active module)
HIGH LOW Anybus CompactCom (Passive module)
LOW HIGH (reserved)
HIGH HIGH

LOW = VOL

HIGH = VOH

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3.4.3 RESET (Reset Input)

The reset input is active low. It must be connected to a host application controllable output pin
in order to handle the power up sequence, voltage deviations and to be able to support network
reset requests.

The module does not feature any internal reset regulation. To establish a reliable interface, the
host application is solely responsible for resetting the module when the supply voltage is out-
side the specified range. If this requirement is not fulfilled, a power brown-out (a drop in voltage)
may cause unwanted side-effects such as data loss in nonvolatile memory etc.

There is no Schmitt trigger circuitry on this input, which means that the module requires a fast
rise time of the reset signal, preferably equal to the slew rate of typical logical circuits. A simple
RC circuit is for example not sufficient to guarantee stable operation, as the slew rate from logic
0 to logic 1 is too slow.

The rise time of the reset signal should be as fast as possible, and must not
exceed 30 ns. The signal is not under any circumstances allowed to be left floating.
Use a pull-down to prevent this.

The following requirements must be met by the reset regulator connected to the reset input
signal.

Power Up

Power Power
On Stable

3.3V

Power

0V t
tA

tB
VIH

RESET

VIL t

Fig. 3

Power up time limits are given in the table below:

Symbol Min. Max. Definition

tA - 50 ms Power supply rise time (0.1 VCC to 0.9 VCC).
tB 100ms - Safety margin.

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Restart
The reset pulse duration must be at least 100 µs in order for the Anybus CompactCom M30 to
properly recognize a reset.

tC

VIH

RESET

VIL t

Fig. 4

Symbol Min. Max. Definition

tC 100 µs - Reset pulse width.

3.4.4 Parallel Interface

For a description of the parallel interface signals, see Parallel Interface Operation, p. 16.

3.4.5 Serial Interface

For a description of the serial interface signals, see Serial Interface Operation, p. 21.

3.4.6 Safety Serial Interface (PROFINET 2–port only)

If the parallel interface is used for the host application, the serial interface can be used for func-
tional safety communication, using an add on safety module. If the host application uses the se-
rial interface, an extra serial channel, only for functional safety communication, will be used:

Position Signal Type Function

43 ASM_Rx I Functional safety communication. If a Safety
Module is connected, these signals must not be
18 ASM_Tx O
tied to VDD.

Functional safety communication is only available for Anybus CompactCom 30 PROFINET 2-

port. For more information, see the Anybus CompactCom 30 PROFINET 2-port Network Guide.

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3.4.7 Network Status LED Outputs

In some applications, the module may be mounted in a fashion that does not enable the user to
see the on-board network indication LEDs. The LED[1A....2B] outputs are directly connected to
the internal CPU and the on-board LEDs, and can be used to relay the network status indica-
tions to elsewhere on the host application.

Note that these outputs are unbuffered and thus not capable of driving LEDs directly. If unused,
leave them unconnected.

The placement and the numbering of the LEDs in the picture are given as an example. Please
refer to the network guides for each specific module.

Led # Corresponding Front View

Signals
1 LED1A Fieldbus connector M12 connectors
LED1B
1 2
1 2
2 LED2A
LED2B

See also Network Status LED outputs (LED[1A...2B]), p. 24.

3.4.8 General Purpose I/O

See General Purpose I/O, p. 22.

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4 Parallel Interface Operation

4.1 General Information
Passive and active modules behave slightly differently concerning the parallel interface:

Active Modules On active modules, the parallel interface is based on an asynchronous dual port
memory architecture, allowing the Anybus module to be interfaced directly as a
memory mapped peripheral.

For increased efficiency, an optional interrupt request signal (IRQ) allows the host
application to service the Anybus module only when necessary. Polled operation
is also possible, albeit at the cost of a slightly overhead.

On active modules, the parallel interface must be enabled using OM[0... 2].

See also OM[0...2] (Operating Mode), p. 12

Passive Modules The passive modules use a subset of the parallel interface signals to provide
means of network identification. Unlike active modules, it is not necessary to
activate this functionality using OM[0... 2]. The serial interface remains enabled
and is used as the main channel of communication.

See also Network Identification, p. 20

See also Module Compatibility, p. 23.

The parallel interface does not support sequential or nonsequential burst access
methods.

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4.2 Parallel Interface Signals

The parallel interface uses the following signals:

Signal Description Notes

A[0...10] Mandatory address input signals. Tie to VSS when unused
Selects source/target location in shared memory.
A Additional address input signals (optional) Please note that if a Safety Mod-
[11...13] (See Additional Address Lines (A[11...13]), p. 23) ule is connected, these signals
must not be tied to VDD.
Tie to VDD when unused
D[0...7] Bidirectional data bus. Target location is specified by A[0...13] Tie to VSS when unused
CE Bus chip enable; enables parallel access to the module when A[0...13] must be stable while CE
low. is active.
Tie to VDD when unused
R/W Bus read/write; enables input on D[0...7] when low. Tie to VDD when unused
OE Bus output enable; enables output on D[0...7] when low. Tie to VDD when unused
IRQ Active low Interrupt Request signal. Asserted by the Anybus Leave unconnected if unused
module, and de-asserted (i.e. acknowledged) by the host ap-
plication by reading the Status Register (3FFFh). Please note
that due to technical reasons, the module may acknowledge
interrupts even if OE has not been asserted, if this address
(3FFFh) is present on the bus while CE is active.
The use of this signal is optional though highly recommended.
Even if the host application lacks interrupt capabilities, it is
recommended to connect this signal to an input port to simpli-
fy software design.
This signal must be pulled to VDD on the host application side
to prevent spurious interrupts during startup.

There are no internal pullup resistors on any of the signals above.

It is important to connect the serial interface signals correctly for proper functioning of the paral-
lel interface. See Serial Interface Signals, p. 21 for details.

4.3 Function Table (CE, R/W, OE, D[0...7])

CE R/W OE D[0...7] State Comment
HIG- X X High impedance Module not selected.
H
LOW LOW X Data Input Data on D[0...7] is written to shared memory.
(Write)
LOW HIG- LOW Data Output Data from shared memory is available on D[0...7]
H (Read)
LOW HIG- HIG- High impedance Module is selected, but D[0...7] is in a high impedance state.
H H

X = Don’t care

LOW = VIL

HIGH = VIH

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4.4 Timing Diagrams

• Timing depends on capacitive load. The figures in this section are valid for loads up to 25
pF.
• CE must be high at least 3 ns between two accesses. This is applicable in both Read and
Write Cycle.

4.4.1 Read Access Timing

R/W = HIGH

Symbol Parameter Min. Max. Unit

tAV Address Valid After Chip Enable - 7 ns
tAA Address Access Time - 30
tACE Chip Enable Access Time - 30
tAR Read Access Time - 15
tAH Address Hold Time 0 -
tLZ Output Low-Z Time 0 -
tHZ Output High-Z Time - 15

• tAR: Start of valid data depends on which timing becomes effective last; tAR, tACE or tAA
• tLZ: Timing depends on which signal is asserted last, OE or CE
• tHZ Timing depends on which signal is de-asserted first, OE or CE

Address Address Valid

tACE tAH

CE
tAV tAR tHZ

OE
tLZ tHZ
[0...7]
D (Out) Data Valid
tLZ

tAA

Fig. 5

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4.4.2 Write Access Timing

Symbol Parameter Min. Max. Unit
tWC Write Cycle Time 30 - ns
tSW Chip Enable to End-of-Write 25 -
tAW Address Valid to End-of-Write 25 -
tAS Address Set-up Time 0 -
tWP Write Pulse Width 25 -
tAH Address Hold Time 0
tAV Address Valid After Chip Enable - 7
tDW Data Valid to End-of-Write 15 -
tDH Data Hold Time 0 -

• tAS: Timing depends on which enable signal (CE or R/W) is asserted last
• tWP: A write occurs during the overlap (tSW or tWP) of CE = LOW and R/W = LOW

Timing depends on capacitive load. The figures in this section are valid for loads up to 25 pF.

Write Cycle (R/W controlled timing)

OE = Don’t care

tAV tWC

Address
tAH
tAW

CE
tAS tWP tAH

R/W
tDW tDH
[0...7]
D (In)

Fig. 6

Write Cycle (CE controlled timing)

OE = HIGH

tWC
Address
tAW
CE
tAS tSW tAH
R/W
tDW tDH
[0...7]
D (In)

Fig. 7

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Parallel Interface Operation 20 (64)

4.5 Network Identification

As mentioned previously, the host application can detect the module type by examining the
state of the MI[0...1] signals. On passive modules, the network type can then be established by
reading a byte in the range 3800h... 38FFh. In case of active modules, the network type is re-
trieved by means of the host interface protocol (consult the Anybus CompactCom Software De-
sign Guide for further information).

The type of a passive module can also be identified from host interface signals D0-D7 (on the
parallel interface) if CE (10) and OE (33) are set to low and R/W (34) to high.

In case the host application for some reason cannot use the MI[0...1] signals, it is still possible
to retrieve the module and network type as follows:
1. Release RESET
2. Wait at least 1–5 s (if only using passive modules, skip this step)
This time correlates to the start-up procedure (Initial Handshake) described in the Anybus
CompactCom Software Design Guide.
3. Read a byte in the range 3800h... 38FFh
The result obtained while reading from the range 3800h... 38FFh shall be interpreted as follows:

Value Module Type & Network

00h Active module (network type identified by means of the host communication protocol)
01h Passive module, RS232
02h Passive module, RS422
03h Passive module, USB
04h (reserved for future use)
05h Passive module, Bluetooth
06h (reserved for future use)
07h (reserved for future use)
08h... 09h (reserved for future use)
0Ah Passive module, RS485
(0Bh... FFh) (reserved for future use)

See also...
• Passive vs. Active, p. 7
• General Information, p. 16
• Module Compatibility, p. 23
• Anybus CompactCom 30 Software Design Guide

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Serial Interface Operation 21 (64)

5 Serial Interface Operation

5.1 General Description
The serial interface is a common asynchronous serial interface, which can easily be interfaced
directly to a micro controller or UART (For connection examples etc., see Interfacing to 5V Log-
ic, p. 27).

The serial interface is handled differently depending on which type of module that is used (ac-
tive or passive), see below.

Active Modules On active modules, the serial interface is activated using the (OM[0...2]) inputs,
which are also used to select the operating baud rate (see OM[0...2] (Operating
Mode), p. 12).

Other communication settings are fixed to the following values:

Data bits: 8

Parity: None

Stop bits: 1

Passive Modules On passive modules, the serial interface is always active (regardless of the state
of the OM[0...2] inputs), and the communication settings are determined by other
factors (network specific).

5.2 Serial Interface Signals

The serial interface option uses only two signals:

Signal Description Notes

Tx TTL-compliant asynchronous serial transmit Leave this signal unconnected when unused.
output.
This signal must be pulled to VDD on the host
application side.
Rx Asynchronous serial receive. (This input is Tie this signal to VDD when unused.
not 5V tolerant)
This signal must be pulled to VDD on the host
application side.

It is important to connect the parallel interface signals correctly for proper functioning of the seri-
al interface. See Parallel Interface Signals, p. 17 for details.

5.3 Baud Rate Accuracy

As with most asynchronous communication devices, the actual baud rate used on the Anybus
CompactCom may differ slightly from the ideal baud rate.

The baud rate error of the Anybus module is less than ±1.5%. For proper operation, it is recom-
mended that the baud rate accuracy in the host application lies within ±1.5% from the ideal
value.

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General Purpose I/O 22 (64)

6 General Purpose I/O

6.1 General
The functionality of these signals is module type dependent. These signals have no dedicated
function, but it is still generally recommended to connect these signals to discreet inputs/outputs
in the host application to be prepared for future functionality.

Signal Description Notes

GIP0 General Input Port 0 Active high general purpose input ports. Preferably, connect
these inputs to discreet outputs in the host application.
GIP1 General Input Port 1
These signals should be pulled to VSS on the host application.
These ports can be used as outputs when extended LED func-
tionality is enabled, see below.
Tie to VSS if unused.
GOP0 General Output Port 0 Active low general purpose output ports. Preferably, connect
these outputs to interrupt capable inputs on the host application.
GOP1 General Output Port 1
These signals should be pulled to VDD on the host application.
If unused, leave these signals unconnected.

6.2 Functional Description

As mentioned previously, the function of these signals is different depending on module type.
Please check the Implementation Details section in the network appendix for each module for
more information.

6.2.1 Active Modules

At the time of writing, some active modules use these signals. For example, the General Pur-
pose IO signals can, together with the LED[1A....2B] outputs, for some networks be used for ex-
tended LED functionality. However it is strongly recommended to implement the signals in the
host application in order to be prepared for future functionality, whether or not they are used at
the time being. Please consult the network appendices for more information.

6.2.2 Passive Modules

The following functionality has been defined for these signals when using passive modules:

Signal Function Notes

GIP0 DE Data Enable; enables data transmission on half duplex networks such as RS-
485.
GIP1 (reserved) Preferably, connect this input to a discreet output in the host application.
GOP0 CA Communication Active; indicates if the connected network is ready for
communication.
GOP1 (reserved) Preferably, connect this output to a discreet input in the host application.

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Appendix A: Implementation Guidelines 23 (64)

A Implementation Guidelines
A.1 Module Compatibility
A.1.1 General
As mentioned previously, the Anybus CompactCom M30 product family holds two major types
of communication modules called “Passive” and “Active”. Both types can be supported in the
host application by implementing the proper host interface signals, see table below.

A.1.2 Compatibility Chart

Host Interface Implementation Compatibility
General Purpose Serial Interface Parallel Interface Active Modules Passive Modules
I/O
Yes Yes Yes Yes Yes
Yes No
No Yes No
No Yes Yes (Yes)
Yes No
No Yes

A.2 Additional Address Lines (A[11...13])

At the time of writing, address lines 11-13 are unused. Future products may however utilize
these extra address lines to accommodate a larger amount of high speed network I/O. To be
able to take advantage of this future functionality, it is recommended to implement as many of
the address lines as possible.

Unused address lines must be tied to VDD in order to maintain software compatibility and keep
the memory map intact, see table below. If a Safety Module is connected, A12 and A13 must not
be tied to VDD, though.

Available Address Recommendation

Lines
11 Implement A[0...10]. Tie A[11...13] to VDD
12 Implement A[0...11]. Tie A[12...13] to VDD
13 Implement A[0...12]. Tie A[13] to VDD
14 Implement A[0...13]

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Appendix A: Implementation Guidelines 24 (64)

A.3 Network Status LED outputs (LED[1A...2B])

A.3.1 General
The LED[1A....2B] outputs can be used to relay the network status LEDs to elsewhere on the
host application.

Note that it is the responsibility of the host application to ensure that each LED output is con-
nected to a LED of the correct color (on active modules, it is possible to retrieve this information
from the Anybus Object (01h); consult the general Anybus CompactCom Software Design
Guide for more information).

An overview of the LED colors used are presented below. Most networks use the standard con-
figuration, but there are a few exceptions.

Network LED1A LED1B LED2A LED2B

Standard configuration (Profi- Green Red Green Red
bus DP-V1 and DP-V0, Devi-
ceNet,CANopen, Ethernet
Modbus-TCP, CC-Link etc.)
Modbus RTU Yellow
RS232 - - -
RS422
RS485
USB

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Appendix A: Implementation Guidelines 25 (64)

A.3.2 Buffering
The outputs are unbuffered, and cannot drive LEDs directly. In this example, a LED is con-
nected to one of the LED outputs of the Anybus module via an NPN transistor.

VDD

LEDnn NPN

Fig. 8

The LED[1A....2B] outputs can, together with the General Purpose IO signals, for some networks
be used for extended LED functionality. Please consult the network appendices for more
information.

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Appendix A: Implementation Guidelines 26 (64)

A.4 Typical Implementation (3.3 V)

The example in the figure below shows a typical implementation with both parallel- and serial
communications, allowing the host application to support passive modules as well as active
modules in either serial or parallel mode.

Note that to increase readability, certain signals have intentionally been left out from this
example.

A0 ... A13 A0 ... A13

D0 ... D7 D0 ... D7

CHIP SELECT CE
WRITE R/W
READ OE
VDD

4.7k 4.7k 4.7k

Rx Tx
Tx Rx

IO PORT 1 (Interrupt Input) IRQ

IO PORT 2 (Output) RESET

4.7k VDD
Host Application
CPU (3.3V)
4.7k 4.7k

IO PORT 3 (Input) GOP0

IO PORT 4 (Input) GOP1
IO PORT 5 (Output) GIP0
IO PORT 6 (Output) GIP1
VDD 4.7k 4.7k

4.7k 4.7k

IO PORT 7 (Input) MI0

IO PORT 8 (Input) MI1

MD0
IO PORT 9 (Input) 74LVC32 MD1
(3.3V)

VDD
OM0
OM1
OM2

4.7k 4.7k 4.7k

Fig. 9

As with many common microcontrollers, the direction of the IO PORT pins on the CPU in this ex-
ample is determined during power up; hence the pullup/pulldown resistors on the signals marked
“IO PORT (OUTPUT) n”.

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Appendix A: Implementation Guidelines 27 (64)

A.5 Interfacing to 5V Logic

The Anybus CompactCom is not 5 V tolerant. This means that a level shifting circuit of some
sort is required when interfacing the module in systems based on 5 V logic. To better under-
stand the issues involved when designing mixed voltage systems, it is recommended to read
“Low-Cost, Low-Power Level Shifting in Mixed-Voltage (5 V, 3.3 V)” Systems (Publication:
SCBA002A) by Texas Instruments.

The example in the figure below uses four 74LVC245 bus transceivers powered with 3.3 V to
buffer the signals towards the Anybus CompactCom M30. The CHIPSELECT and READ sig-
nals from the host application CPU are fed into a 74LVC32 logical OR gate (also powered by
3.3 V) of which the output is used to control the direction of the bus transceiver that buffers the
data bus.

Note that to increase readability, certain signals have intentionally been left out from this
example.

A0 A0 B0 A0
A1 A1 B1 A1
A2 A2 B2 A2

74LVC245 (3.3V)
A3 A3 B3 A3
A4 A4 B4 A4
A5 A5 B5 A5
A6 A6 B6 A6
A7 A7 B7 A7
VDD DIR
OE

A8 A0 B0 A8
A9 A1 B1 A9
A10 A2 B2 A10
74LVC245 (3.3V)

A11 A3 B3 A11
A12 A4 B4 A12
A13 A5 B5 A13
A6 B6 Rx
VDD A7 B7 VDD
VDD DIR
OE
4.7k 4.7k

Tx Tx
Rx

D0 A0 B0 D0
D1 A1 B1 D1
Host Application D2 A2 B2 D2
74LVC245 (3.3V)

CPU (5V) D3
D4
A3 B3 D3
D4
A4 B4
D5 A5 B5 D5
D6 A6 B6 D6
D7 A7 B7 D7
DIR
74LVC32 OE
(3.3V)

CHIP SELECT A0 B0 CE
WRITE A1 B1 R/W
READ A2 B2 OE
74LVC245 (3.3V)

IO PORT 1 (Output) A3 B3 GIP0

IO PORT 2 (Output) A4 B4 GIP1
A5 B5
4.7k 4.7k A6 B6 VDD
A7 B7 4.7k 4.7k
VDD DIR
OE
4.7k

GOP0
GOP1
IO PORT 3 (Input)
IO PORT 4 (Input)
IO PORT 5 (Interrupt Input)
IRQ
IO PORT 6 (Output)
74LVC32 RESET
4.7k (3.3V)

Fig. 10

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Appendix A: Implementation Guidelines 28 (64)

As with many common microcontrollers, the direction of the IO PORT pins on the CPU in this ex-
ample is determined during power up; hence the pullup/pulldown resistors on the signals marked
“IO PORT (OUTPUT) n”.

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Appendix A: Implementation Guidelines 29 (64)

A.6 Power Supply Considerations

A.6.1 General
The Anybus CompactCom platform in itself is designed to be extremely power efficient. The ex-
act power requirements for a particular networking systems will however vary a lot depending
on to the components used in the actual bus circuitry.

While some systems usually require less than 250 mA of supply current, some high perform-
ance networks, or networks which require the use of legacy ASIC technology, will consume up
to 500 mA, or in rare cases even as much as 1000 mA.

As an aid when designing the power supply electronics, the networks have been divided into
classes based on their power consumption as follows.
• Class A
This class includes systems which consume less than 250 mA of supply current.
• Class B
This class includes systems which consume up to 500 mA of supply current.
• Class C
This class includes systems which consume up to 1000 mA of supply current.
The following table lists the currently supported networking systems and their correspond-
ing class.
Network Class A Class B Class C
CANopen Yes Yes Yes
DeviceNet
Modbus RTU
Profibus DP-V1
RS232 (Passive)
RS422/485 (Passive)
USB (Passive)
EtherNet/IP
Profibus DP-V0
CompoNet
Profinet
Modbus-TCP
BACnet MSTP
Bluetooth (Passive)
Sercos III No
EtherCAT
Profinet 2-Port
Ethernet/IP 2-Port
CC-Link
BACnet/IP 2-Port
Modbus-TCP 2-Port
ControlNet No

A power supply designed to fulfill Class A requirements (250 mA), will be able to support all net-
works belonging to class A, but none of the networks in Class B and C.

A power supply designed to fulfill Class C requirements, will be able to support all networks.

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Appendix A: Implementation Guidelines 30 (64)

A.7 Bypass Capacitance

The power supply inputs must have adequate bypass capacitance for high-frequency noise
suppression. It is therefore recommended to add extra bulk capacitors near the power supply
inputs:

Reference Value (Ceramic)

C1 22 µF / 6.3 V
C2 100 nF / 16 V

An example is shown in the picture below.

3.3 V
3V3

C1 C2

GND
GND

Fig. 11

A.8 3.3 V Regulation

The following example uses the LT1767 from Linear Technology to provide a stable 3.3 V power
source for the module. Note that all capacitors in this example are of ceramic type.

BAV70
5V
VDD (3.3V)

LT1767 100nF
(16V)
BOOST

Vin Vsw
10uH
SHDN
22uF 100nF C1 C2
Vc FB
SYNC

(6.3V) (16V)
GND

1,5nF
(50V)
10uF
(6.3V)
4k7
SS14
GND

Fig. 12

For detailed information regarding this example, consult the data sheet for the LT1767 (Linear
Technology).

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Appendix B: Mechanical Specification 31 (64)

B Mechanical Specification
This a class A product. In a domestic environment, this product may cause radio
interference in which case the user may be required to take adequate measures.
This product contains ESD (Electrostatic Discharge) sensitive parts that may be
damaged if ESD control procedures are not followed. Static control precautions are
required when handling the product. Failure to observe this may cause damage to
the product.

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 32 (64)

B.1 Overview

The dimensions below are given in millimeters and include a tolerance of ±0.20 mm.

18.9

18.1
A Grounding (GND) Mechanics

8.4 B Functional Earth (FE) Mechanics

C Fastening Mechanics
0

1.3

1.7

3.4
51.8

50.7

49.2

39.6

33.7

R3

42.1 48 50.1

22.3

Fig. 13

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 33 (64)

B.2 M12 Connector

The modules that are equipped with M12 connectors, either have two female connectors or one
female and one male connector.

The dimensions below are given in millimeters and include a tolerance of ±0.10 mm.

3,4
22,3
12,7

50,7

62,7

64,7
21

50,1

Fig. 14
50,7
22,3

62,7
64,7
12,7

67

21

50,1

Fig. 15

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Appendix B: Mechanical Specification 34 (64)

B.3 Footprint

The dimensions below are given in millimeters and include a tolerance of ±0.10 mm.

For a footprint for the Anybus CompactCom host connector, see Host Connector, p. 37

Reserved Area

GND Plane (Coated)

4,4
B
A GND Plane (Conductive)
9,8 6,5
7,3

A B PE Area (Conductive)
51,0

33,0

33,0

44,0
Support Holes

Host Application PCB

Via (Connection to GND)

CF Connector Outline
6,9

,5
R1

9,4 5,5 7,0 3,0*

31,0

49,0
*Depending on Compact Flash connector. The plane/vias
50,5 may not be in contact with the pads for pins.

Fig. 16

Area Description
Reserved Area To ensure isolation and mechanical compatibility, it is strongly advised that this area is
kept completely free from components and signal lines.
Under no circumstances may components, via holes, or signal lines, be placed on the
PCB-layer facing the Anybus module. Failure to comply with this requirement may in-
duce EMC/EMI problems, mechanical compatibility issues, or even short circuit.
FE Area To achieve proper EMC behavior and to provide support for different cable shielding
(Conductive) standards, this area must be tin plated (preferably using Hot Air Levelling technology)
and have a stable, low impedance connection to functional earth.
GND Plane The exact shape of this area depends on the properties of the CompactFlash connec-
(Coated) tor. It is however important to follow these basic design rules:
GND Plane • The plane must be continuous and have a stable, low impedance connection to
(Conductive) GND (preferably through at least 16 vias as illustrated in the figure)

• The connection to GND should be placed beneath the CompactFlash connector

as illustrated above (see figure)

• The plane must follow the signal path through the connector

• The conductive part must be tin plated, preferably using Hot Air Levelling
technology

Support Holes These holes are used by the fastening mechanics to secure the module onto the host
application.

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 35 (64)

B.4 Housing Preparations

The dimensions below are given in millimeters and include a tolerance of ±0.10 mm.

Fig. 17

1.7

Fig. 18

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 36 (64)

B.4.1 Front

R3
R2 1
1

48.6 20.8 22.9

1.1
0.8
6.5 33.6

R 0.5
50.8

Fig. 19

B.5 Slot Cover

HMS can supply a “blind” slot-cover, which may be used to cover the Anybus CompactCom slot
when not in use, allowing the Anybus CompactCom module to be supplied as an end-user op-
tion instead of being mounted during manufacturing.

The dimensions below are given in millimeters and include a tolerance of ±0.10 mm.

50.1

22.3 19.9 13.0

50.5

40.0
8.8

1.1

3.5

Fig. 20

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 37 (64)

B.6 Host Connector

Fig. 21

The Anybus CompactCom is designed to use a compact flash connector as application connec-
tor. HMS offers a host connector, that is designed to simplify the mounting and to meet the de-
mands for a secure and stable connection of the Anybus CompactCom modules. The
dimensions of the connector and the information needed for the PCB layout are presented in
the figure on the next page.

Please note that it is recommended to mill oval holes in the PCB, to enable usage of other
connectors.

Always verify that the dimensions of another connector is compatible with this
design.

Manufacturer Part No. Web

HMS Industrial Networks SP1137 For more information visit the support pages for Anybus
CompactCom at www.anybus.com

To ensure that you receive the correct dimensions for the latest version of the contact, please
consult the support pages at www.anybus.com, where you will find all the latest available infor-
mation for the connector.

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

 Rev. Description Date Sign

Fig. 22
1.4 Added support for pins and HMS logotype 2013-09-30 RiA

1.5 Added pcb-outline to pcb-layout 2014-05-05 RiA

1.6 Updated PCB outline value 2014-07-16 RiA

Pin 25
Appendix B: Mechanical Specification

Pin 50

Pin 1

Anybus® CompactCom™ M30 Hardware Design Guide

Recommended PCB-layout
General tolerances ±0,05mm

40,2
38,7
Enable usage of
31,115 other connectors
0,635 0,45 (Second Source)
3

Position hole
8,1

Position knob
2,
4 D
3,5

15
1,7

18,5

1. Housing: LCP(Liquid Crystal Polymer) 0,9

Color:Natural,Thermoplastic,UL 94 V-0 46
+0,4 *

2. Contact: Copper Alloy Enable usage of

11,5

3. Operation voltage: 100 VAC max other connectors DETAIL D

4. Current rating: 0.5 Amp.
50,7 -0,0

5. Contact resistance: 40m ohms max.

3,6

6. lnsulation resistance: 1000M ohms min 500 VDC. 2,3

7. Dielectric withstanding voltage: 500VAC/1minute.
o o
8. Operating Temperature: -40 C to +85 C 50,87
9. Resistance to Solder Heat :
o
Temperature: 260 C
Immersion duration: 10sec. PCB outline
10.Durability: 5000 Cycles
11.Finish/Plated: * For PCB and drill-hole tolerances
Termi nal:15u" m in Au Plated on Contact Area, Owner Scale Size Weight Finishing

100u" min Tin Plated on solder area, 1:1

50u" m in Ni Under Plated over all HMS Industrial Networks AB Title
Grounded Pin: 80u" min Tin Plated on solder area, Compact Flash connector HMS
Stationsgatan 37
50u" min Ni Under Plated over all S-302 45 Halmstad
12.RoHS and REACH compliant Tel: +46 (0)35 - 17 29 00
Fax: +46 (0)35 - 17 29 09
13.Storage -25 - 65°C, 0 - 90% RH Sign: Date: Rev. Sheet: Document nr HMS nr
RiA 20120313 1.6 1 of 1 SDH-7018-202 SP1137

The information contained in this drawing is the sole property of HMS Industrial Networks AB. Any reproduction in part or whole whitout the written permission of HMS Industrial Networks AB is prohibited

HMSI-168-31
38 (64)

4.0
Appendix B: Mechanical Specification 39 (64)

B.6.1 Host Connector Considerations

When using other connectors, the following needs to be considered:

To prevent incorrect insertion and to ensure that the grounding mechanics work as intended,
use connectors with guiding rails of sufficient length (preferably longer than 19 mm), or provide
an equivalent mechanical solution.

≥19mm
Fig. 23

The distance of the connectors to the PCB has to conform to the picture below:

2.63
1.36
0

Fig. 24

It is recommended to use connectors which can be screwed into the host application board, to
minimize mechanical strain on solder joints etc.

The following connectors have been verified for use with the Anybus CompactCom:

Manufacturer Part No. Web

Tyco 1734451-1 www.tycoelectronics.com
AllConnectors 101D-TAAB-R www.allconnectors.de
Suyin 127531MB050XX04NA www.suyin.com, www.suyin-europe.com, www.
suyinusa.com
Harwin M504-8815042 www.harwin.com
M504-88 25042 Note: The dimensions of the holes for the fixing
pins of this connector are 1.8 mm, i.e. slightly
larger than the dimensions given in the figure
above.

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Appendix B: Mechanical Specification 40 (64)

B.6.2 Host Connector Pin Numbering

The surface mounted pins of the HMS compact flash connector are numbered from left to right
(see figure below), corresponding to pin numbers 1, 26, 2, 27...... 25, 50 of the host interface
connector.

1 50
26 25

Bottom view of the host connector

Fig. 25

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 41 (64)

B.7 Fastening Mechanics

To support the fastening mechanism, the host application PCB thickness must be 1.60 (±10%)
mm.
Recommended screw tightening torque is 0.25 Nm.

When fastening the module into the end product, make sure that the Anybus
module is properly aligned into the CompactFlash socket prior to applying any
force. Rough handling and/or excessive force in combination with misalignment
may cause mechanical damage to the Anybus CompactCom module and/or the
end product.

B.7.1 Fastening

2
TORX 8
0.25Nm

Fig. 26

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix B: Mechanical Specification 42 (64)

B.7.2 Removal

1
TORX 8

Fig. 27

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

Appendix C: Technical Specification 43 (64)

C Technical Specification
The properties specified in this chapter applies to all Anybus CompactCom modules unless oth-
erwise stated. Any deviations from what is stated in this chapter is specified separately in each
network appendix.

C.1 Environmental
C.1.1 Operating Temperature

Active mdules: -40 to 70°C (-40 to 158°F)

Passive modules: -40 to 70°C (-40 to 158°F)

(Tests performed according to IEC 60068-2-1 and IEC 60068-2-2)

C.1.2 Storage Temperature

Active modules: -40 to 85°C (-40 to 185°F)

Passive modules: -40 to 85°C (-40 to 185°F)

(Tests performed according to IEC 60068-2-1 and IEC 60068-2-2)

C.1.3 Humidity

Active modules: 5 to 95% non-condensing

Passive modules: 5 to 95% non-condensing

(Tests performed according to IEC 60068-2-30)

C.2 Shock and Vibration

• Shock test, operating IEC 68-2-27 half-sine 30g, 11 ms, 3 positive and 3 negative shocks in
each of three mutually perpendicular directions
• Shock test, operating IEC 68-2-27 half-sine 50g, 11 ms, 3 positive and 3 negative shocks in
each of three mutually perpendicular directions
• Sinusoidal vibration, operating IEC 68-2-6 10-500 Hz, 0.35 mm, 5g, 1oct/min., 10 double-
sweep in each of three mutually perpendicular directions.

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Appendix C: Technical Specification 44 (64)

C.3 Electrical Characteristics

C.3.1 Operating Conditions
Pin
Symbol Parameter Types Conditions Min. Typ. Max. Unit
Supply Voltage (DC) 3.15 3.30 3.45 V
VDD Ripple (AC) - - ± 100 mV
VSS Ground reference - 0.00 0.00 0.00 V
Class A - - 250 mA
Class B - - 500 mA
IIN Current consumption PWR Class C - - 1000 mA
VIH Input High Voltage I, BI - 0.7 x - VDD + V
VDD 0.2
VIL Input Low Voltage -0.2 - 0.2 x V
VDD
IOH Current, Output High O, BI - -40 - 40 mA
IOL Current, Output Low
VOH Output High Voltage IOH = -4mA 2.4 - - V
VOL Output Low Voltage IOL = 4mA - - 0.4 V

I= Input, CMOS (3.3V)

O= Output, CMOS (3.3V)

BI= Bidirectional, Tristate

PWR= Power supply inputs

C.3.2 Isolation (Host to Network)

Isolation distances for PCB between host, network, and FE (according to EN 60950-1; Pollution
Degree 2; Material Group IIIb)

Working Voltage/Transient
Voltage Distance
Isolation Barrier Creepage Clearance External Internal
Host to FE 250V/2500V 250V/2500V 2.5mm 0.4mm
Host to Network 250V/2500V 250V/2500V 2.5mm 0.4mm

C.3.3 Functional Earth & Shielding

All Anybus CompactCom modules features a cable shield filter designed according to each net-
work standard. To be able to support this, the host application must have a conductive area con-
nected to functional earth as described in Mechanical Specification, p. 31 (FE Connection Pad).

HMS cannot guarantee proper EMC behavior unless this requirement is fulfilled.

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Appendix C: Technical Specification 45 (64)

C.4 Regulatory Compliance

The certification has been documented by UL in file E214107.

C.4.1 EMC Compliance (CE)

Since the Anybus CompactCom M30 is considered a component for embedded applications, it
cannot be CE-marked as an end product. However, the Anybus CompactCom M30 family is
pre-compliance tested in a typical installation providing that all modules conforms to the EMC
directive in that installation.

Once the end product has successfully passed the EMC test using any of the Anybus Compact-
Com M30 modules, the pre-compliance test concept allows any other interface of the same type
(see Anybus CompactCom M30) in the Anybus CompactCom M30 family to be embedded in
that product without further EMC tests.

To be compliant to the EMC directive 2004/108/EC, the pre-compliance testing has been con-
ducted according to the following standards:

Emission: EN61000-6-4 EN55011 Radiated emission

EN55011 Conducted emission

Immunity: EN61000-6-2 EN61000-4-2 Electrostatic discharge

EN61000-4-3 Radiated immunity

EN61000-4-4 Fast transients/burst

EN61000-4-5 Surge immunity

EN61000-4-6 Conducted immunity

Since all Anybus CompactCom M30 modules have been evaluated according to the EMC direc-
tive through the above standards, this serve as a base for our customers when certifying Any-
bus CompactCom M30 based products.

C.4.2 UL/c-UL Compliance

The certification has been documented by UL in file E214107.

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Appendix D: Anybus CompactCom 30 without Housing 46 (64)

D Anybus CompactCom 30 without Housing

This a class A product. In a domestic environment, this product may cause radio
interference in which case the user may be required to take adequate measures.
This product contains ESD (Electrostatic Discharge) sensitive parts that may be
damaged if ESD control procedures are not followed. Static control precautions are
required when handling the product. Failure to observe this may cause damage to
the product.

D.1 General Information

In some applications the standard Anybus CompactCom plug-in housing concept cannot be
used. Instead an Anybus CompactCom 30 module without housing is mounted on the PCB, us-
ing a specially designed Anybus CompactCom Mounting Kit. This enables full Anybus Com-
pactCom functionality for all applications without loss of network compatibility or environmental
characteristics.

x2

x2

x2

Fig. 28

The kit is easy to assemble, and is based on a few plastic parts which when assembled secures
the Anybus module firmly onto the host application.

To support this concept in the host application, the PCB must be designed according to the foot-
print specification in this document.

To guarantee proper EMC behavior, it is also important that the application supports the FE
(functional earth) and grounding mechanisms found on all Anybus CompactCom modules.

Anybus CompactCom modules without housing exist in three different versions:

• with the usual fieldbus or industrial network connector
• with M12 connectors
• as brick, with a pin connector directly to the carrier board instead of a fieldbus or network
connector mounted on the Anybus CompactCom board, for more information see the Any-
bus CompactCom B30 Design Guide
If the module is equipped with M12 connectors, and front plate and housing are correctly de-
signed, the resulting product can be rated up to class IP67.

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Appendix D: Anybus CompactCom 30 without Housing 47 (64)

Fig. 29

All dimensions expressed in this document are stated in millimeters and have a tolerance of
±0.10mm unless stated otherwise.

D.2 Ordering Information

Part No. Name Contents
019180 ABCC Mounting Kit 100 x Bottom Part
100 x Top Part
100 x Screw

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Appendix D: Anybus CompactCom 30 without Housing 48 (64)

D.3 Footprint
D.3.1 Without Housing
Footprint for modules without housing.

26.6
2 x Ø4.7 4 x Ø3.2 Reserved Area

GND Plane (Coated)

26.2 6.5
24.7 A GND Plane (Conductive)
20.3 B 4.4 18.7

7.3
25.7
A B PE Area (Conductive)

16.5 Support Holes

11.3 11.3

PCB

Via (Connection to GND)

7.0 Host connector

11.5
33.8
41.7
50.7

Fig. 30

Area Description
Reserved Area To ensure isolation and mechanical compatibility, it is strongly advised that this area is
kept completely free from components and signal lines.
Under no circumstances may components, vias, or signal lines, be placed on the
PCB-layer facing the Anybus module. Failure to comply with this requirement may in-
duce EMC/EMI problems, mechanical compatibility issues, or even short circuit.
FE Area To achieve proper EMC behaviour and to provide support for different cable shielding
(Conductive) standards, this area must be tin plated (preferably using Hot Air Levelling technology)
and have a stable, low impedance connection to functional earth.
GND Plane The exact shape of this area depends on the properties of the CompactFlash connec-
(Coated) tor. It is however important to follow these basic design rules:
GND Plane • The plane must be continuous and have a stable, low impedance connection to
(Conductive) GND (preferably through at least 16 vias as illustrated in the figure)

• The connection to GND should be placed beneath the CompactFlash connector

as illustrated above (see figure)

• The plane must follow the signal path through the connector

• The conductive part must be tin plated, preferably using Hot Air Levelling
technology

Support Holes These holes are used by the mounting kit mechanics to secure the module onto the
host application.
PCB The host application PCB should be 1.6 mm thick to be able to support the fastening
mechanics.

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Appendix D: Anybus CompactCom 30 without Housing 49 (64)

D.4 Host Connectors

The following connectors have been found to be compatible with the mounting kit.

Manufacturer Part No. Comment Web

Samtec HPT-125-01-L-D-RA Through hole mounted www.
(recommended) samtec.
com
3M N7E50-D516PG-30 Surface mounted www.3m.
com

D.5 Height Restrictions

All dimensions are in millimeters

15 15 15

17.4
16.8
13

8.3

*
0

4.5

50.7 *See note 1 below

Fig. 31

To ensure stable connection to FE, use a connector that conforms to the distances from the
PCB to the pins of the host connector, that are recommended in the picture. Tolerance (0.35
mm, -0.05 mm).

The gray area in the figure above specifies the maximum height occupied by onboard compo-
nents of the Anybus module. To ensure isolation, it is recommended to add an additional 2.5
mm on top of these dimensions.

2.63
1.36
0

Fig. 32

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Appendix D: Anybus CompactCom 30 without Housing 50 (64)

D.6 Assembly

1 2

3 4

5 6

Fig. 33

D.7 Dimensions
All dimensions are in millimeters.

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Appendix D: Anybus CompactCom 30 without Housing 51 (64)

D.7.1 General

1.6

(Host Application PCB) 2.3

44.5

6 27.4

36.6 32.6

2 R 1.2
R 1.8

6
28.6

Component-free area

Fig. 34

D.7.2 Standard LED Positions

Standard Anybus CompactCom:

34.3
Module
Status

Network
Status
2.3
0
23.5

Fig. 35

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Appendix D: Anybus CompactCom 30 without Housing 52 (64)

Standard Anybus CompactCom, Ethernet versions:

Fig. 36

Anybus CompactCom for M12 connectors:

Fig. 37

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Appendix D: Anybus CompactCom 30 without Housing 53 (64)

D.7.3 Mounting Kit Parts

Unless specified otherwise all dimensions are in millimeters, tolerance ± 0.1 mm.

Bottom Part

11

30
26,3
22

15
4,5 2,6

3,7
3
2x 0
9,5
8
4
0

2,35
3,85
6,35
0

Fig. 38

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Appendix D: Anybus CompactCom 30 without Housing 54 (64)

Top Part

30
2,3
3
10

23,1
3,5
7
8

15

0,5
0
3,
3
6,3
5,4
3,9
2,4
0,9
0
8
7
4
0

Fig. 39

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Appendix D: Anybus CompactCom 30 without Housing 55 (64)

Fastening Screw
Recommended screw tightening torque is 0.3 Nm.

EJOT DELTA PT Schraube WN 5451 30x10

EJOT TORX PLUS/AUTOSERT 10IP Penetration depth: 1.00/1.30

0
6.5 -0.56

- 0.12
+0.12
2.3
±0.10
0.5
.R

0.8
Detail “X” ax “X”
max. 1.5

+0.45
- 0.45
20

10
° +3
°

1.12
140° +5°

2.09 ±0.08

+0.10
3 0

2.8

Fig. 40

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Appendix D: Anybus CompactCom 30 without Housing 56 (64)

D.7.4 D-sub

30.8

12.6

50.4

Fig. 41

D.7.5 RJ45, 2–port

12.3
11.5

2x15

32
33.6

54.5

Fig. 42

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Appendix D: Anybus CompactCom 30 without Housing 57 (64)

D.7.6 USB

12

10.9

53.2

Fig. 43

D.7.7 Pluggable Screw Terminal (5.08 mm)

27.4

7.7 8.6

18.4
1.6 4.5

51.5

Fig. 44

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Appendix D: Anybus CompactCom 30 without Housing 58 (64)

D.7.8 BNC, 2–Port

R
4.8
11

11
6.1

18.6

4.2
67.6

Fig. 45

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Appendix D: Anybus CompactCom 30 without Housing 59 (64)

D.8 M12 Connectors

D.8.1 Dimensions
Female - Female

11,9

5,25
21
64,6

50,5

47,6

8,9
8,3
Fig. 46

Female - Male
11,9

5,25

21

66,4
50,5
47,6
9,3
8,3
8,9

Fig. 47

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Appendix D: Anybus CompactCom 30 without Housing 60 (64)

D.8.2 IP Rating
To ensure that the final design will fulfill the requirements for IP67 rating, the M12 connectors
have to be firmly and tightly attached on both sides of the front plate. The dimensions for the
front plate are given below.

13,5
12

9,2
SECTION A-A

A
0,6
21
1≤x≤ 2

Fig. 48

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Appendix D: Anybus CompactCom 30 without Housing 61 (64)

21

52,7

64,6
Fig. 49

52,7

64,6

67

21

Fig. 50

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Appendix D: Anybus CompactCom 30 without Housing 62 (64)

D.8.3 M12 Connector Assembly

The M12 connector parts are not joined on the Anybus CompactCom module at delivery. The
connector has to be tightly mounted on both sides of the front plate if the design is to be rated in
class IP67. The design, preparation and manufacturing of the front plate is not offered by HMS
Industrial Networks, but has to be performed by the customer. For dimensions see M12 Con-
nectors, p. 59.

Fig. 51

There are three guides on both the inner and outer parts of the connectors for mechanical key-
ing, ensuring correct rotation of the outher parts.

Please make sure that the connectors are pushed all the way into these guides at assembly.

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Appendix D: Anybus CompactCom 30 without Housing 63 (64)

Guides for
mechanical
keying.

Fig. 52

There are also markings on the casings of the connectors to make it easier to mount the con-
nectors at the correct mounting angle.

Markings that show the correct mounting angle.

Fig. 53

Anybus® CompactCom™ M30 Hardware Design Guide HMSI-168-31 4.0

last page

© 2017 HMS Industrial Networks AB

Box 4126
300 04 Halmstad, Sweden

[email protected] HMSI-168-31 4.0.6757 / 2017-12-21