Ua747 PDF
Ua747 PDF
Ua747 PDF
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
• Short-Circuit Protection
IN − OFFSET 1N1
• Offset-Voltage Null Capability IN +
1
2
14
13 1 VCC +†
• Wide Common-Mode and Differential OFFSET 1N2 3 12 OUT
Voltage Ranges VCC − 4 11 NC
• No Latch-Up OFFSET 2N2 5 10 OUT
• Designed to Be Interchangeable With IN + 6 9 2 VCC +†
Fairchild µA747C and µA747M IN − 7 8 OFFSET 2N1
OFFSET 1N1
amplifier featuring offset-voltage null capability.
1 V CC +†
Each half is electrically similar to uA741.
IN +
IN −
The high common-mode input voltage range and
NC
the absence of latch-up make this amplifier ideal
for voltage-follower applications. The device is 3 2 1 20 19
short-circuit protected and the internal frequency OFFSET 1N2 4 18 OUT
compensation ensures stability without external NC 5 17 NC
components. A low-value potentiometer may be VCC − 6 16 NC
connected between the offset null inputs to null out NC 7 15 NC
the offset voltage as shown in Figure 2. OFFSET 2N2 8 14 OUT
9 10 11 12 13
The uA747C is characterized for operation from
2 V CC +†
0°C to 70°C; the uA747M is characterized for
IN −
IN +
NC
OFFSET 2N1
operation over the full military temperature range
of −55°C to 125°C.
ÏÏÏ
IN+ + † The two positive supply terminals (1 VCC + and 2 VCC +) are
ÏÏÏ
OUT connected together internally.
IN − −
OFFSET N1 OFFSET N2
AVAILABLE OPTIONS
PACKAGE
14-PIN 20-PIN
VIO Max
TA SMALL OUTLINE CERAMIC DIP PLASTIC DIP FLAT PACK CHIP CARRIER
AT 25°C
(D) (J) (N) (W) (FK)
0°C
to
6 mV uA747CD — uA747CN — —
70°C
−55°C
to
5 mV — uA747MJ — uA747MW uA747MFK
125°C
The D package is available taped and reeled. Add the suffix R to the device type, (i.e., uA747CDR).
! "# ! $%&" '#( Copyright 1990, Texas Instruments Incorporated
'"! " !$#""! $# )# #! #*! !#!
!'' +,( '" $"#!!- '#! #"#!!&, "&'#
#!- && $##!(
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
IN −
OUT
IN +
OFFSET N2
OFFSET N1
VCC −
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
uA747C uA747M UNIT
Supply voltage, VCC + (see Note 1) 18 22 V
Supply voltage, VCC − (see Note 1) −18 −22 V
Differential input voltage (see Note 2) ± 30 ± 30 V
Input voltage any input (see Notes 1 and 3) ± 15 ± 15 V
Voltage between any offset null terminal (N1/N2) and VCC − ± 0.5 ± 0.5 V
Duration of output short circuit (see Note 4) unlimited unlimited
Continuous total dissipation See Dissipation Rating Table
Operating free-air temperature range 0 to 70 −55 to 125 °C
Storage temperature range −65 to 150 −65 to 150 °C
Case temperature for 60 seconds FK package 260 °C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds J or W package 300 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds D or N package 260 °C
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC + and VCC −.
2. Differential voltages are at the noninverting input terminal with respect to the inverting input terminal.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output may be shorted to ground or either power supply. For the uA747M only, the unlimited duration of the short circuit applies
at (or below) 125°C case temperature or 75°C free-air temperature.
2 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
VI
Ï
−
OUT
Input +
0V
INPUT VOLTAGE
WAVEFORM CL = 100 pF RL = 2 kΩ
TEST CIRCUIT
APPLICATION INFORMATION
IN − −
OUT
IN + +
OFFSET N2
OFFSET N1
10 kΩ
To VCC −
4 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
TYPICAL CHARACTERISTICS†
INPUT OFFSET CURRENT
vs
FREE-AIR TEMPERATURE
100
90 VCC ± = ± 15 V
80
60
uA747C
50
40
30
IIIO
20
10
0
−60 −40 −20 0 20 40 60 80 100 120 140
TA − Free-Air Temperature − C
Figure 3
350 VCC ± = ± 15 V
I IB− Input Bias Current − nA
300
250
uA747C
200
150
IIB
100
50
0
−60 −40 −20 0 20 40 60 80 100 120 140
TA − Free-Air Temperature − C
Figure 4
† Data at high and low temperatures are applicable only within the rated operating free-air temperature range of the particular devices.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
TYPICAL CHARACTERISTICS
MAXIMUM PEAK-TO-PEAK MAXIMUM PEAK-TO-PEAK
OUTPUT VOLTAGE OUTPUT VOLTAGE
vs vs
LOAD RESISTANCE FREQUENCY
ÁÁÁÁÁ
28 40
VCC − Maximum Peak-to-Peak Output Voltage − V
ÁÁÁÁÁ
TA = 25°C RL = 10 kΩ
24 32 TA = 25°C
22 28
20 24
18 20
16 16
14 12
ÁÁ ÁÁ
12 8
ÁÁ 10
ÁÁ VO(PP)
4
VCC
ÁÁ 8
0.1 0.2 0.4 0.7 1 2
RL − Load Resistance − kΩ
4 7 10 ÁÁ 0
100 1k 10 k
f − Frequency − Hz
100 k 1M
Figure 5 Figure 6
RL = 2 kΩ
TA = 25°C 106
VD − Differential Voltage Amplification
TA = 25°C
200
105
100 10 4
103
40 102
ÁÁ 101
ÁÁ ÁÁ
AAVD
20
ÁÁ ÁÁ
1
AVD
A
10 10 −1
0 2 4 6 8 10 12 14 16 18 20 1 10 100 1 k 10 k 100 k 1 M 10 M 100 M
|VCC ±| − Supply Voltage − V f − Frequency − Hz
Figure 7 Figure 8
6 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SLOS009A − D971, FEBRUARY 1971 − REVISED OCTOBER 1990
TYPICAL CHARACTERISTICS
COMMON-MODE REJECTION RATIO OUTPUT VOLTAGE
vs vs
FREQUENCY ELAPSED TIME
100 28
VCC ± = ± 15 V
CMRR − Common-Mode Rejection Ratio − dB
90 RS = 50 Ω 24
TA = 25°C
80
20
VO − Output Voltage − mV
70 90%
16
60
50 12
VCC ± = ± 15 V
ÁÁ
40
8 RL = 2 kΩ
ÁÁ ÎÎÎÎÎ
30 CL = 100 pF
VO
4 TA = 25°C
20 10%
10
0
0
−4
ÎÎtr
Figure 9 Figure 10
VOLTAGE-FOLLOWER
LARGE-SIGNAL PULSE RESPONSE
8
VCC ± = ± 15 V
6 RL = 2 kΩ
CL = 100 pF
TA = 25°C
Input and Output Voltages − V
4
Output
2
0
Input
−2
−4
−6
−8
0 10 20 30 40 50 60 70 80 90
t − Time − µs
Figure 11
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 7
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
UA747CN ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UA747CN
& no Sb/Br)
UA747CNE4 ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UA747CN
& no Sb/Br)
UA747CNE4 ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type 0 to 70 UA747CN
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated