Multi-Phase PWM Controller For CPU Core Power Supply: General Description Features

®
RT8859M
Multi-Phase PWM Controller for CPU Core Power Supply

General Description Features
The RT8859M is a VR12/IMVP7 compliant CPU power z 4/3/2/1 + 1 Phase PWM Controller
controller which includes two voltage rails : a 4/3/2/1 phase z G-NAVPTM Topology
synchronous buck controller, the CORE VR, and a single z Serial VID Interface
phase buck controller, the AXG VR. The RT8859M adopts z 0.5% DAC Accuracy
G-NAVP TM (Green Native AVP), which is Richtek's z Differential Remote Voltage Sensing
proprietary topology derived from finite DC gain z Built-in ADC for Platform Programming
compensator with current mode control, making it an easy z Accurate Current Balance
setting PWM controller, meeting all Intel CPU z System Thermal Compensated AVP
requirements of AVP (Active Voltage Positioning). Based z Diode Emulation Mode at Light Load Condition for
on the G-NAVPTM topology, the RT8859M also features a Multiple and Single Phase
quick response mechanism for optimized AVP performance z Fast Transient Response
during load transient. The RT8859M supports mode z VR12 / IMVP7 Compatible Power Management
transition function with various operating states. A serial States
VID (SVID) interface is built in the RT8859M to z VR Ready Indicator
communicate with Intel VR12/IMVP7 compliant CPU. The z Thermal Throttling
RT8859M supports VID on-the-fly function with three z Current Monitor Output
different slew rates: Fast, Slow and Decay. By utilizing z Switching Frequency up to 1MHz per Phase
the G-NAVPTM topology, the operating frequency of the z OVP, UVP, OCP, NVP, UVLO
RT8859M varies with VID, load and input voltage to further z Slew Rate Setting/Address Flip Function
enhance the efficiency even in CCM. The built-in high z External No-Load Offset Setting for both Rails
accuracy DAC converts the SVID code ranging from 0.25V z DVID Improvement
to 1.52V with 5mV per step. The RT8859M integrates a z Small 56-Lead WQFN Package
high accuracy ADC for platform setting functions, such as z RoHS Compliant and Halogen Free
no-load offset or over-current level. The RT8859M provides
VR ready output signals of both CORE VR and AXG VR. Ordering Information
It also features complete fault protection functions RT8859M
including over voltage, under voltage, negative voltage, over Package Type
QW : WQFN-56L 7x7 (W-Type)
current and under voltage lockout. The RT8859M is
available in a WQFN-56L 7x7 small foot print package. Lead Plating System
G : Green (Halogen Free and Pb Free)
Z : ECO (Ecological Element with
Applications Halogen Free and Pb free)
Note :
z VR12 / IMVP7 Intel Core Supply
Richtek products are :
z Notebook/ Desktop Computer/ Servers Multi-phase CPU
` RoHS compliant and compatible with the current
Core Supply
requirements of IPC/JEDEC J-STD-020.
z AVP Step-Down Converter
` Suitable for use in SnPb or Pb-free soldering processes.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
DS8859M-07 January 2014 www.richtek.com

1
RT8859M
Pin Configurations Marking Information
(TOP VIEW) RT8859MGQW
TONSETA
RT8859MGQW : Product Number
TONSET
VRHOT
QRSET
OCSET
TSENA
DVIDA
PWM2
PWM1
PWM3
PWM4
RT8859M
DVDA
TSEN
YMDNN : Date Code
DVD
GQW
56 55 54 53 52 51 50 49 48 47 46 45 44 43
YMDNN
ISEN2P 1 42 OCSETA
ISEN2N 2 41 VCC
ISEN1N 3 40 VR_RDY
ISEN1P 4 39 VRA_RDY
ISEN3P 5 38 EN RT8859MZQW
ISEN3N 6 37 PWMA RT8859MZQW : Product Number
ISEN4N 7 36 QRSETA
GND RT8859M
ISEN4P 8 35 ISENAP YMDNN : Date Code
RSET 9 34 ISENAN ZQW
COMP 10 33 COMPA YMDNN
FB 11 57 32 FBA
RGND 12 31 RGNDA
DVID 13 30 OFSA
OFS 14 29 SR_ADDF
15 16 17 18 19 20 21 22 23 24 25 26 27 28
IMONFB
SETINIA
TMPMAX
ICCMAX
IMON
VCLK
IBIAS
ADD
VDIO
SETINI
ICCMAXA
IMONFBA
IMONA
ALERT
WQFN-56L 7x7
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2
VCCIO
RT8859M
VIN 50
12V TONSET VRA_RDY 39 VRA_RDY
VIN 49
12V TONSETA VR_RDY 40 VR_RDY
9 RSET VCLK 18 VCLK
28 IMONA VDIO 19 VDIO 5V
20
ALERT ALERT
13 DVID
OFS 14
SETINI 22
56 DVIDA 23
SETINIA
TMPMAX 24
25
DS8859M-07 January 2014

12V 48 DVD
ICCMAX
ICCMAXA 26
12V 47 DVDA
29
SR_ADDF
OFSA 30
RNTC 36
5V 44 TSENA QRSETA
QRSET 55
VCCAXG_SENSE RNTC
27 IMONFBA OCSETA 42 5V
Typical Application Circuit
Thermal Compensation at Voltage Loop
33 COMPA
32 RNTC
FBA OCSET 43 5V
RNTC
12V
12V 5V
Copyright © 2014 Richtek Technology Corporation. All rights reserved.

41 VCC
BOOT VCC
IBIAS 21
UGATE PGND
IMON 15
PHASE 37
PWM PWMA
LGATE IMONFB 16
LOAD RNTC
RT9612 TSEN 45 5V VCC_SENSE
35 ISENAP
34 ISENAN
31
RGNDA
12V 10
COMP
VSSAXG_SENSE 12V
FB 11 RNTC
12V
BOOT VCC 12V
UGATE PGND VCCIO
VCC BOOT
PHASE 53 PWM1 VRHOT 46
PWM
PGND UGATE
LGATE
PWM3 52 PWM PHASE
RT9612
4 ISEN1P LGATE
3 ISEN1N LOAD
RT9612
12V
12V ISEN3P 5
6
ISEN3N
12V
BOOT VCC 12V
UGATE PGND
VCC BOOT
PHASE PWM 54 PWM2
ADD 17 PGND UGATE
LGATE
RT9612 PWM4 51 PWM PHASE
1 ISEN2P LGATE
2 ISEN2N RT9612
ISEN4P 8
is a registered trademark of Richtek Technology Corporation.

ISEN4N 7
Chip Enable 38 EN 12
RGND
57 (Exposed Pad)
GND
VSS_SENSE
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3
RT8859M
4
VCCIO
RT8859M
VIN 50
12V TONSET VRA_RDY 39 VRA_RDY
VIN 49 TONSETA VR_RDY 40 VR_RDY
12V
9 RSET VCLK 18 VCLK
VDIO 19 VDIO
www.richtek.com
5V
28 IMONA 20
ALERT ALERT
14
RT8859M
14 OFS OFS
SETINI 22
56 DVIDA SETINIA 23
TMPMAX 24
ICCMAX 25
12V 48 DVD 26
ICCMAXA
12V 47 DVDA
SR_ADDF 29
RNTC 30
5V 44 TSENA OFSA
QRSETA 36
QRSET 55
OCSETA 42
VCCAXG_SENSE
27 IMONFBA
Thermal Compensation at Current Loop
33 COMPA
RNTC
32 OCSET 43 5V
FBA
12V
12V 5V

41 VCC
BOOT VCC
IBIAS 21
UGATE PGND
IMON 15
PHASE 37
PWM PWMA
LGATE IMONFB 16
LOAD
RT9612 RNTC
35 ISENAP TSEN 45 5V VCC_SENSE
RNTC
10
34 ISENAN COMP
31
RGNDA FB 11
12V RNTC
12V 12V
12V
VSSAXG_SENSE
VCCIO
BOOT VCC VCC
VRHOT 46 BOOT
UGATE PGND
PGND UGATE
PHASE PWM
53 PWM1 PHASE
PWM3 52 PWM
LGATE LGATE LOAD
RT9612 RT9612
4 ISEN1P
ISEN3P 5
3 ISEN1N 6
12V ISEN3N
12V
12V 12V
BOOT VCC VCC BOOT

UGATE PGND ADD 17 PGND UGATE
PHASE PWM 54 PWM2 PHASE
PWM4 51 PWM
LGATE LGATE
RT9612 RT9612
1 ISEN2P
ISEN4P 8
2 ISEN2N

ISEN4N 7
12
Chip Enable RGND
38 EN 57 (Exposed Pad)
GND
VSS_SENSE

RT8859M
13 5V
12V 50
TONSET DVID
9 RSET
23
AXG VR Disabled
SETINIA OFS 14
26 ICCMAXA SR_ADDF 29 5V
27 IMONFBA
36 QRSETA VR_RDY 40 VTT
37 VCLK 18

PWMA VTT 5V
42 OCSETA
VDIO 19
Floating 30 20
OFSA ALERT
31
RGNDA SETINI 22
32
FBA TMPMAX 24
25
33 COMPA ICCMAX
39 QRSET 55
VRA_RDY
56
DVIDA DVD 48 12V
34 ISENAN IBIAS 21
35 IMON 15
ISENAP
5V 44
TSENA
47 DVDA IMONFB 16
RNTC
12V 5V TSEN 45 5V VCC_SENSE

12V * 41 VCC
BOOT VCC
10
COMP
UGATE PGND
FB 11 RNTC
PHASE PWM
53 PWM1 12V
12V
LGATE *
5V
RT9619
VCC BOOT
4 ISEN1P VRHOT 46
3 ISEN1N
12V PGND UGATE
28 IMONA
12V PHASE
* PWM3 52 PWM
49
TONSETA
LGATE LOAD
BOOT VCC
RT9619
UGATE PGND ISEN3P 5
6
PHASE ISEN3N
PWM 54 PWM2
12V
LGATE 12V
*
RT9619
1 ISEN2P VCC BOOT
2 ISEN2N ADD 17 PGND UGATE
Chip Enable 38 PHASE
PWM4 51 PWM
EN
RNTC 43 OCSET LGATE
5V
RT9619
ISEN4P 8
ISEN4N 7
57 (Exposed Pad) 12
GND RGND
VSS_SENSE
* : Optional
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5
RT8859M
RT8859M
Functional Pin Description
Pin No. Pin Name Pin Function
4, 1, 5, 8 ISEN [1:4] P Positive Current Sense Pin of Phase 1, 2, 3 and 4.
3, 2, 6, 7 ISEN [1:4] N Negative Current Sense Pin of Phase 1, 2, 3 and 4.
Multi-Phase CORE VR Ramp Setting. This is used to set the multi-phase
9 RSET
CORE VR loop external ramp slope.
Multi-Phase CORE VR Compensation. This pin is the output node of the error
10 COMP
amplifier.
Multi-Phase CORE VR Feedback. This is the negative input node of the error
11 FB
amplifier.
Return Ground for Multi-Phase CORE VR. This pin is the negative node of the
12 RGND
differential remote voltage sensing.
Connect a resistor and a capacitor from this pin to GND to improve DVID
13 DVID
performance. Short this pin to GND if this function is not needed.
14 OFS Output Voltage Offset Setting.
Current Monitor Output. This pin outputs a voltage proportional to the output
15 IMON
current.
Current Monitor Output Gain External Setting. Connect this pin with one resistor
to CPU VCC_SENSE, while the IMON pin is connected to ground with another
16 IMONFB
resistor. The current monitor output gain can be set by the ratio of these two
resistors.
17 ADD VR Address Setting Pin.
18 VCLK Synchronous Clock from CPU.
19 VDIO Controller and CPU Data Transmission Interface.
20 ALERT SVID Alert Pin (Active Low).
Internal Bias Current Setting. Connect this pin to GND via a resistor to set the
21 IBIAS
internal current.
22 SETINI CORE VR VINITIAL Setting.
23 SETINIA AXG VR VINITIALA Setting.
ADC Input for Multi-Phase CORE VR Maximum Temperature Setting. This pin
24 TMPMAX
is also used for AXG VR’s offset selection.
ADC Input for Multi-Phase CORE VR Maximum Current Setting. This pin is also
25 ICCMAX
used for CORE VR’s offset selection.
26 ICCMAXA ADC Input for Single-Phase AXG VR Maximum Current Setting.
Single-Phase AXG VR Current Monitor Output Gain External Setting. Connect
this pin with one resistor to AXG rail VCCAXG_SENSE, while IMONA pin is
27 IMONFBA
connected to ground with another resistor. The current monitor output gain can
be set by the ratio of these two resistors.
Single-Phase AXG VR Current Monitor Output. This pin outputs a voltage
28 IMONA
proportional to the output current.
Address Flip and DVID Slew Rate Setting. Set the pin to GND if fast slew rate=
29 SR_ADDF
10mV/μs and slow slew rate = 2.5mV/μs is used.
30 OFSA AXG VR Output Voltage Offset Setting.
Return Ground for Single-Phase AXG VR. This pin is the negative node of the
31 RGNDA
differential remote voltage sensing.

6
RT8859M
Pin No. Pin Name Pin Function
Single-Phase AXG VR Feedback. This is the negative input node of the
32 FBA
error amplifier.
Single-Phase AXG VR Compensation. This pin is the output node of the
33 COMPA
error amplifier.
34 ISENAN Negative Current Sense Pin of Single-Phase AXG VR.
35 ISENAP Positive Current Sense Pin of Single-Phase AXG VR.
36 QRSETA Single-Phase AXG VR Quick Response Time Setting.
37 PW MA PWM Output for Single-Phase AXG VR.
38 EN Chip Enable (Active High)
39 VRA_RDY VR Ready Indicator of Single-Phase AXG VR.
40 VR_RDY VR Ready Indicator of Multi-Phase CORE VR.
41 VCC Chip Power. Connect this pin to 5V via an RC filter.
Single-Phase AXG VR Over Current Protection Setting. Place a
resistive voltage divider between VCC and ground and connect the joint
42 OCSETA
of the voltage divider to the OCSETA pin. The voltage at the OCSET pin
determines the over current threshold, ILIMITA .
Multi-Phase CORE VR Over Current Protection Setting. Place a
resistive voltage divider between VCC and ground and connect the joint
43 OCSET
of the voltage divider to the OCSET pin. The voltage at the OCSET pin
determines the over current threshold, ILIMIT.
44 TSENA Thermal Monitor Sense Point of AXG VR.
45 TSEN Thermal Monitor Sense Point of CORE VR.
46 VRHOT Thermal Monitor Output (Active Low).
Divided Voltage Detection of AXG VR. Connect this pin to a voltage
47 DVDA divider from the single-phase power stage input power for input voltage
detection.
Divided Voltage Detection of CORE VR. Connect this pin to a voltage
48 DVD divider from the multi-phase power stage input power for input voltage
detection.
Single-Phase AXG VR On-Time Setting. Connect this pin to VIN with
49 TONSETA
one resistor to set ripple size in PWM mode.
Multi-Phase CORE VR On-Time Setting. Connect this pin to VIN with
50 TONSET
one resistor to set ripple size in PWM mode.
51, 52, 54, 53 PW M [4 :1] PWM Output for CH1, 2, 3 and 4.
55 QRSET Multi-Phase CORE VR Quick Response Time Setting.
Connect a resistor and a capacitor from this pin to GND to improve
56 DVIDA
DVID performance. Short this pin to GND if this function is not needed.
Ground. The exposed pad must be soldered to a large PCB and
57 (Exposed Pad) GND
connected to GND for maximum power dissipation.

7
RT8859M
Function Block Diagram
SR_ADDF
VRA_RDY
IMONFBA
ICCMAXA
TMPMAX
VR_RDY
SETINIA
ICCMAX
IMONFB
VRHOT
IMONA
TSENA
SETINI
ALERT
OFSA
DVDA
TSEN
VCLK
VDIO
ADD
DVD
VCC
EN
Current Current Offset
IMON MUX
Monitor Monitor Generator UVLO
VSETA GND
VSET
From Control Logic ADC
Control &
RGNDA DAC Protection Logic
SVID XCVR QRSET
QRSETA
Soft-Start & Slew
+
Rate Control VSETA ERROR

+ AMP PWM TON
+ CMP PWMA
FBA - Offset Gen
COMPA Cancellation -
TONSETA
Set VIDA
Fast & Slow
Set VID
DVIDA 1/20 Fast & Slow To Protection Logic
DVID 1/20
OVP/UVP/NVP + ISENAP
From Control Logic OCP 20
- ISENAN
Offset OCSETA
OFS
Generator DAC
RGND
Soft-Start & Slew VSET PWM

TONSET
+
Rate Control + CMP

+
FB - Offset PWM1
- TON
Cancellation PWM2
COMP QR Gen
+ CMP PWM3
+
PHASE PWM4
- Selector
IBIAS VQR_TRIP
RSET
ISEN4P +
10 To Protection Logic
ISEN4N - Current Balance
SUM
ISEN3P + OVP/UVP/NVP OCP
10
ISEN3N -
ISEN2P +
10
ISEN2N -
ISEN1P +
10
ISEN1N -
OCSET

8
RT8859M
Table 1. VR12 VID Code Table
VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Hex Voltage
0 0 0 0 0 0 0 0 0 0 0.000
0 0 0 0 0 0 0 1 0 1 0.250
0 0 0 0 0 0 1 0 0 2 0.255
0 0 0 0 0 0 1 1 0 3 0.260
0 0 0 0 0 1 0 0 0 4 0.265
0 0 0 0 0 1 0 1 0 5 0.270
0 0 0 0 0 1 1 0 0 6 0.275
0 0 0 0 0 1 1 1 0 7 0.280
0 0 0 0 1 0 0 0 0 8 0.285
0 0 0 0 1 0 0 1 0 9 0.290
0 0 0 0 1 0 1 0 0 A 0.295
0 0 0 0 1 0 1 1 0 B 0.300
0 0 0 0 1 1 0 0 0 C 0.305
0 0 0 0 1 1 0 1 0 D 0.310
0 0 0 0 1 1 1 0 0 E 0.315
0 0 0 0 1 1 1 1 0 F 0.320
0 0 0 1 0 0 0 0 1 0 0.325
0 0 0 1 0 0 0 1 1 1 0.330
0 0 0 1 0 0 1 0 1 2 0.335
0 0 0 1 0 0 1 1 1 3 0.340
0 0 0 1 0 1 0 0 1 4 0.345
0 0 0 1 0 1 0 1 1 5 0.350
0 0 0 1 0 1 1 0 1 6 0.355
0 0 0 1 0 1 1 1 1 7 0.360
0 0 0 1 1 0 0 0 1 8 0.365
0 0 0 1 1 0 0 1 1 9 0.370
0 0 0 1 1 0 1 0 1 A 0.375
0 0 0 1 1 0 1 1 1 B 0.380
0 0 0 1 1 1 0 0 1 C 0.385
0 0 0 1 1 1 0 1 1 D 0.390
0 0 0 1 1 1 1 0 1 E 0.395
0 0 0 1 1 1 1 1 1 F 0.400
0 0 1 0 0 0 0 0 2 0 0.405
0 0 1 0 0 0 0 1 2 1 0.410
0 0 1 0 0 0 1 0 2 2 0.415
0 0 1 0 0 0 1 1 2 3 0.420
0 0 1 0 0 1 0 0 2 4 0.425
0 0 1 0 0 1 0 1 2 5 0.430
0 0 1 0 0 1 1 0 2 6 0.435
0 0 1 0 0 1 1 1 2 7 0.440
0 0 1 0 1 0 0 0 2 8 0.445

9
RT8859M
0 0 1 0 1 0 0 1 2 9 0.450
0 0 1 0 1 0 1 0 2 A 0.455
0 0 1 0 1 0 1 1 2 B 0.460
0 0 1 0 1 1 0 0 2 C 0.465
0 0 1 0 1 1 0 1 2 D 0.470
0 0 1 0 1 1 1 0 2 E 0.475
0 0 1 0 1 1 1 1 2 F 0.480
0 0 1 1 0 0 0 0 3 0 0.485
0 0 1 1 0 0 0 1 3 1 0.490
0 0 1 1 0 0 1 0 3 2 0.495
0 0 1 1 0 0 1 1 3 3 0.500
0 0 1 1 0 1 0 0 3 4 0.505
0 0 1 1 0 1 0 1 3 5 0.510
0 0 1 1 0 1 1 0 3 6 0.515
0 0 1 1 0 1 1 1 3 7 0.520
0 0 1 1 1 0 0 0 3 8 0.525
0 0 1 1 1 0 0 1 3 9 0.530
0 0 1 1 1 0 1 0 3 A 0.535
0 0 1 1 1 0 1 1 3 B 0.540
0 0 1 1 1 1 0 0 3 C 0.545
0 0 1 1 1 1 0 1 3 D 0.550
0 0 1 1 1 1 1 0 3 E 0.555
0 0 1 1 1 1 1 1 3 F 0.560
0 1 0 0 0 0 0 0 4 0 0.565
0 1 0 0 0 0 0 1 4 1 0.570
0 1 0 0 0 0 1 0 4 2 0.575
0 1 0 0 0 0 1 1 4 3 0.580
0 1 0 0 0 1 0 0 4 4 0.585
0 1 0 0 0 1 0 1 4 5 0.590
0 1 0 0 0 1 1 0 4 6 0.595
0 1 0 0 0 1 1 1 4 7 0.600
0 1 0 0 1 0 0 0 4 8 0.605
0 1 0 0 1 0 0 1 4 9 0.610
0 1 0 0 1 0 1 0 4 A 0.615
0 1 0 0 1 0 1 1 4 B 0.620
0 1 0 0 1 1 0 0 4 C 0.625
0 1 0 0 1 1 0 1 4 D 0.630
0 1 0 0 1 1 1 0 4 E 0.635
0 1 0 0 1 1 1 1 4 F 0.640
0 1 0 1 0 0 0 0 5 0 0.645
0 1 0 1 0 0 0 1 5 1 0.650
0 1 0 1 0 0 1 0 5 2 0.655

10
RT8859M
0 1 0 1 0 0 1 1 5 3 0.660
0 1 0 1 0 1 0 0 5 4 0.665
0 1 0 1 0 1 0 1 5 5 0.670
0 1 0 1 0 1 1 0 5 6 0.675
0 1 0 1 0 1 1 1 5 7 0.680
0 1 0 1 1 0 0 0 5 8 0.685
0 1 0 1 1 0 0 1 5 9 0.690
0 1 0 1 1 0 1 0 5 A 0.695
0 1 0 1 1 0 1 1 5 B 0.700
0 1 0 1 1 1 0 0 5 C 0.705
0 1 0 1 1 1 0 1 5 D 0.710
0 1 0 1 1 1 1 0 5 E 0.715
0 1 0 1 1 1 1 1 5 F 0.720
0 1 1 0 0 0 0 0 6 0 0.725
0 1 1 0 0 0 0 1 6 1 0.730
0 1 1 0 0 0 1 0 6 2 0.735
0 1 1 0 0 0 1 1 6 3 0.740
0 1 1 0 0 1 0 0 6 4 0.745
0 1 1 0 0 1 0 1 6 5 0.750
0 1 1 0 0 1 1 0 6 6 0.755
0 1 1 0 0 1 1 1 6 7 0.760
0 1 1 0 1 0 0 0 6 8 0.765
0 1 1 0 1 0 0 1 6 9 0.770
0 1 1 0 1 0 1 0 6 A 0.775
0 1 1 0 1 0 1 1 6 B 0.780
0 1 1 0 1 1 0 0 6 C 0.785
0 1 1 0 1 1 0 1 6 D 0.790
0 1 1 0 1 1 1 0 6 E 0.795
0 1 1 0 1 1 1 1 6 F 0.800
0 1 1 1 0 0 0 0 7 0 0.805
0 1 1 1 0 0 0 1 7 1 0.810
0 1 1 1 0 0 1 0 7 2 0.815
0 1 1 1 0 0 1 1 7 3 0.820
0 1 1 1 0 1 0 0 7 4 0.825
0 1 1 1 0 1 0 1 7 5 0.830
0 1 1 1 0 1 1 0 7 6 0.835
0 1 1 1 0 1 1 1 7 7 0.840
0 1 1 1 1 0 0 0 7 8 0.845
0 1 1 1 1 0 0 1 7 9 0.850
0 1 1 1 1 0 1 0 7 A 0.855
0 1 1 1 1 0 1 1 7 B 0.860

11
RT8859M
0 1 1 1 1 1 0 0 7 C 0.865
0 1 1 1 1 1 0 1 7 D 0.870
0 1 1 1 1 1 1 0 7 E 0.875
0 1 1 1 1 1 1 1 7 F 0.880
1 0 0 0 0 0 0 0 8 0 0.885
1 0 0 0 0 0 0 1 8 1 0.890
1 0 0 0 0 0 1 0 8 2 0.895
1 0 0 0 0 0 1 1 8 3 0.900
1 0 0 0 0 1 0 0 8 4 0.905
1 0 0 0 0 1 0 1 8 5 0.910
1 0 0 0 0 1 1 0 8 6 0.915
1 0 0 0 0 1 1 1 8 7 0.920
1 0 0 0 1 0 0 0 8 8 0.925
1 0 0 0 1 0 0 1 8 9 0.930
1 0 0 0 1 0 1 0 8 A 0.935
1 0 0 0 1 0 1 1 8 B 0.940
1 0 0 0 1 1 0 0 8 C 0.945
1 0 0 0 1 1 0 1 8 D 0.950
1 0 0 0 1 1 1 0 8 E 0.955
1 0 0 0 1 1 1 1 8 F 0.960
1 0 0 1 0 0 0 0 9 0 0.965
1 0 0 1 0 0 0 1 9 1 0.970
1 0 0 1 0 0 1 0 9 2 0.975
1 0 0 1 0 0 1 1 9 3 0.980
1 0 0 1 0 1 0 0 9 4 0.985
1 0 0 1 0 1 0 1 9 5 0.990
1 0 0 1 0 1 1 0 9 6 0.995
1 0 0 1 0 1 1 1 9 7 1.000
1 0 0 1 1 0 0 0 9 8 1.005
1 0 0 1 1 0 0 1 9 9 1.010
1 0 0 1 1 0 1 0 9 A 1.015
1 0 0 1 1 0 1 1 9 B 1.020
1 0 0 1 1 1 0 0 9 C 1.025
1 0 0 1 1 1 0 1 9 D 1.030
1 0 0 1 1 1 1 0 9 E 1.035
1 0 0 1 1 1 1 1 9 F 1.040
1 0 1 0 0 0 0 0 A 0 1.045
1 0 1 0 0 0 0 1 A 1 1.050
1 0 1 0 0 0 1 0 A 2 1.055
1 0 1 0 0 0 1 1 A 3 1.060
1 0 1 0 0 1 0 0 A 4 1.065

12
RT8859M
1 0 1 0 0 1 0 1 A 5 1.070
1 0 1 0 0 1 1 0 A 6 1.075
1 0 1 0 0 1 1 1 A 7 1.080
1 0 1 0 1 0 0 0 A 8 1.085
1 0 1 0 1 0 0 1 A 9 1.090
1 0 1 0 1 0 1 0 A A 1.095
1 0 1 0 1 0 1 1 A B 1.100
1 0 1 0 1 1 0 0 A C 1.105
1 0 1 0 1 1 0 1 A D 1.110
1 0 1 0 1 1 1 0 A E 1.115
1 0 1 0 1 1 1 1 A F 1.120
1 0 1 1 0 0 0 0 B 0 1.125
1 0 1 1 0 0 0 1 B 1 1.130
1 0 1 1 0 0 1 0 B 2 1.135
1 0 1 1 0 0 1 1 B 3 1.140
1 0 1 1 0 1 0 0 B 4 1.145
1 0 1 1 0 1 0 1 B 5 1.150
1 0 1 1 0 1 1 0 B 6 1.155
1 0 1 1 0 1 1 1 B 7 1.160
1 0 1 1 1 0 0 0 B 8 1.165
1 0 1 1 1 0 0 1 B 9 1.170
1 0 1 1 1 0 1 0 B A 1.175
1 0 1 1 1 0 1 1 B B 1.180
1 0 1 1 1 1 0 0 B C 1.185
1 0 1 1 1 1 0 1 B D 1.190
1 0 1 1 1 1 1 0 B E 1.195
1 0 1 1 1 1 1 1 B F 1.200
1 1 0 0 0 0 0 0 C 0 1.205
1 1 0 0 0 0 0 1 C 1 1.210
1 1 0 0 0 0 1 0 C 2 1.215
1 1 0 0 0 0 1 1 C 3 1.220
1 1 0 0 0 1 0 0 C 4 1.225
1 1 0 0 0 1 0 1 C 5 1.230
1 1 0 0 0 1 1 0 C 6 1.235
1 1 0 0 0 1 1 1 C 7 1.240
1 1 0 0 1 0 0 0 C 8 1.245
1 1 0 0 1 0 0 1 C 9 1.250
1 1 0 0 1 0 1 0 C A 1.255
1 1 0 0 1 0 1 1 C B 1.260
1 1 0 0 1 1 0 0 C C 1.265
1 1 0 0 1 1 0 1 C D 1.270

13
RT8859M
1 1 0 0 1 1 1 0 C E 1.275
1 1 0 0 1 1 1 1 C F 1.280
1 1 0 1 0 0 0 0 D 0 1.285
1 1 0 1 0 0 0 1 D 1 1.290
1 1 0 1 0 0 1 0 D 2 1.295
1 1 0 1 0 0 1 1 D 3 1.300
1 1 0 1 0 1 0 0 D 4 1.305
1 1 0 1 0 1 0 1 D 5 1.310
1 1 0 1 0 1 1 0 D 6 1.315
1 1 0 1 0 1 1 1 D 7 1.320
1 1 0 1 1 0 0 0 D 8 1.325
1 1 0 1 1 0 0 1 D 9 1.330
1 1 0 1 1 0 1 0 D A 1.335
1 1 0 1 1 0 1 1 D B 1.340
1 1 0 1 1 1 0 0 D C 1.345
1 1 0 1 1 1 0 1 D D 1.350
1 1 0 1 1 1 1 0 D E 1.355
1 1 0 1 1 1 1 1 D F 1.360
1 1 1 0 0 0 0 0 E 0 1.365
1 1 1 0 0 0 0 1 E 1 1.370
1 1 1 0 0 0 1 0 E 2 1.375
1 1 1 0 0 0 1 1 E 3 1.380
1 1 1 0 0 1 0 0 E 4 1.385
1 1 1 0 0 1 0 1 E 5 1.390
1 1 1 0 0 1 1 0 E 6 1.395
1 1 1 0 0 1 1 1 E 7 1.400
1 1 1 0 1 0 0 0 E 8 1.405
1 1 1 0 1 0 0 1 E 9 1.410
1 1 1 0 1 0 1 0 E A 1.415
1 1 1 0 1 0 1 1 E B 1.420
1 1 1 0 1 1 0 0 E C 1.425
1 1 1 0 1 1 0 1 E D 1.430
1 1 1 0 1 1 1 0 E E 1.435
1 1 1 0 1 1 1 1 E F 1.440
1 1 1 1 0 0 0 0 F 0 1.445
1 1 1 1 0 0 0 1 F 1 1.450
1 1 1 1 0 0 1 0 F 2 1.455
1 1 1 1 0 0 1 1 F 3 1.460
1 1 1 1 0 1 0 0 F 4 1.465
1 1 1 1 0 1 0 1 F 5 1.470
1 1 1 1 0 1 1 0 F 6 1.475

14
RT8859M
1 1 1 1 0 1 1 1 F 7 1.480
1 1 1 1 1 0 0 0 F 8 1.485
1 1 1 1 1 0 0 1 F 9 1.490
1 1 1 1 1 0 1 0 F A 1.495
1 1 1 1 1 0 1 1 F B 1.500
1 1 1 1 1 1 0 0 F C 1.505
1 1 1 1 1 1 0 1 F D 1.510
1 1 1 1 1 1 1 0 F E 1.515
1 1 1 1 1 1 1 1 F F 1.520

15
RT8859M
Table 2. Serial VID Command
Master Payload Slave Payload
Code Commands Description
Contents Contents
00h Not Supported N/A N/A N/A
Set new target VID code, VR jumps to new
01h SetVID_Fast VID code N/A VID target with controlled default “fast” slew
rate 12.5mV/μs.
02h SetVID_Slow VID code N/A VID target with controlled default “slow” slew
rate 3.125mV/μs.
VID target, but doest not control the slew
03h SetVID_Decay VID code N/A
rate. The output voltage decays at a rate
proportional to the load current
Byte indicating
04h SetPS N/A Set power state
power states
Pointer of
05h SetRegADR registers in data N/A Set the pointer of the data register
table
New data register
06h SetRegDAT N/A Write the contents to the data register
content
Pointer of Specified
Slave returns the contents of the specified
07h GetReg registers in data register
register as the payload.
table contents
08h
- Not Supported N/A N/A N/A
1Fh

16
RT8859M
Table 3. SVID Data and Configuration Register
Index Register Name Description Access Default
00h Vendor_ID Vendor ID RO 1Eh
01h Product_ID Product ID RO 59h
02h Product_Revision Product Revision RO 03h
05h Protocol_Version SVID Protocol version RO 01h
Bit mapped register, identifies the SVID VR
06h VR_Capability Capabilities and which of the optional telemetry RO 81h
register are supported.
10h Status_1 Data register containing the status of VR R-M, W-PWM 00h
11h Status_2 Data register containing the status of transmission. R-M, W-PWM 00h
Data register showing temperature Zone that have
12h Temperature_Zone R-M, W-PWM 00h
been entered.
Data register showing direct ADC conversion of
15h Output_Current output current, scaled to ICC_MAX = ADC full range. R-M, W-PWM 00h
Binary format (IE : 64h = 100/255 ICC_MAX)
1Ch Status_2_Lastread The register contains a copy of the Status_2 R-M, W-PWM 00h
Data register containing the maximum ICC the
21h ICC_Max platform supports. RO, Platform N/A
Binary format in A. (IE : 64h = 100A)
Data register containing the maximum temperature
the platform supports.
22h Temp_Max RO, Platform N/A
Binary format in °C. (IE : 64h = 100°C)
Not supported by AXG VR.
Data register containing the capability of fast slew
24h SR_fast rate the platform can sustain. Binary format in RO 0Ah
mV/μs. (IE : 0Ah = 10 mV/μs)
Data register containing the capability of slow slew
25h SR_slow rate. RO 02h
Binary format in mV/μs. (IE : 02h = 2mV/μs)
The register is programmed by the master and sets
30h VOUT_Max RW, Master FBh
the maximum VID.
31h VID_Setting Data register containing currently programmed VID RW, Master 00h
Register containing the current programmed power
32h Power_State RW, Master 00h
state
33h Offset Set offset in VID steps RW, Master 00h
Bit mapped data register which configures multiple
34h Multi_VR_Config RW, Master 00h
VRs’ behavior on the same bus
Scratch pad register for temporary storage of the
35h Pointer RW, Master 30h
SetRegADR pointer register
Notes :
RO = Read Only
RW = Read/Write
R-M = Read by Master
W-PWM = Write by PWM only
Platform = programmed by platform
Master = programmed by the master
PWM = programmed by the VR control IC

17
RT8859M
Absolute Maximum Ratings (Note 1)
z VCC to GND --------------------------------------------------------------------------------------------------------- −0.3V to 6.5V
z RGNDx to GND ----------------------------------------------------------------------------------------------------- −0.3V to 0.3V
z TONSETx to GND -------------------------------------------------------------------------------------------------- −0.3V to 28V
z Others ----------------------------------------------------------------------------------------------------------------- −0.3V to (VCC + 0.3V)
z Power Dissipation, PD @ TA = 25°C
WQFN−56L 7x7 ----------------------------------------------------------------------------------------------------- 3.226W
z Package Thermal Resistance (Note 2)
WQFN−56L 7x7, θJA ----------------------------------------------------------------------------------------------- 31°C/W
WQFN−56L 7x7, θJC ---------------------------------------------------------------------------------------------- 6°C/W
z Junction Temperature ---------------------------------------------------------------------------------------------- 150°C
z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------ 260°C
z Storage Temperature Range ------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model) --------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions (Note 4)

z Supply Voltage, VCC ---------------------------------------------------------------------------------------------- 4.5V to 5.5V
z Junction Temperature Range ------------------------------------------------------------------------------------- −40°C to 125°C
z Ambient Temperature Range ------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VCC = 5V, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Supply Input
Supply Current IVCC VEN = 1.05V, Not Switching -- 12 20 mA
Shutdown Current ISHDN VEN = 0V -- -- 5 μA
Reference and DAC
VDAC = 1.000 to 1.520 (No Load, Active
−0.5 0 0.5 %VID
Mode)
DAC Accuracy VFB VDAC = 0.800 to 1.000 −5 0 5 mV
VDAC = 0.500 to 0.800 −8 0 8 mV
VDAC = 0.250 to 0.500 −8 0 8 mV
RGND Current
RGND Current IRGND VEN = 1.05V, Not Switching -- -- 500 μA
Slew Rate
Set VID Slow, SR_ADDF pin = 0V 2.5 3.125 3.75
Dynamic VID Slew Rate SR mV/μs
Set VID Fast, SR_ADDF pin = 0V 10 12.5 15
Error Amplifier
DC Gain ADC RLOAD = 47kΩ -- 80 -- dB
Gain-Bandwidth Product GBW CLOAD = 5pF -- 10 -- MHz
CLOAD = 10pF (Gain = −4,
Slew Rate SR -- 5 -- V/μs
RLOAD = 47kΩ, VOUT = 0.5V to −3V)

18
RT8859M
Output Voltage Range VCOMP RLOAD = 47kΩ 0.3 -- 3.6 V
MAX Source/Sink Current IOUTEA VCOMP = 2V -- 250 -- μA
Current Sense Amplifier
Input Offset Voltage VOSCS −0.75 -- 0.75 mV
Impedance at Negative Input RISENxN 1 -- -- MΩ
Impedance at Positive Input RISENxP 1 -- -- MΩ
CORE VR -- 10 --
DC Gain V/V
AXG VR -- 20 --
Input Range VISEN_IN −50 -- 100 mV
V ISEN Linearity VISEN_ACC −30mV < V ISEN_IN < 50mV −1 -- 1 %
tON Setting
TONSETx Pin Voltage VTON IRTON = 80μA, VDAC = 0.75V -- 1.07 -- V
CCM On-Time Setting tON IRTON = 80μA, PS0, PS1 275 305 335 ns
TONSETx Input Current
IRTON 25 -- 280 μA
Range
On-Time in PS2 (Core only) tON_PS2 With Respect to PS0 tON -- 85 -- %
Minimum Off-Time tOFF -- 250 -- ns
IBIAS
IBIAS Pin Voltage VIBIAS RIBIAS = 53.6kΩ 2.09 2.14 2.19 V
QRSET
Quick Response On-Time VDAC = 0.75V, VQRSET = 1.2V,
tONx_QR -- 305 -- ns
Setting IRTON = 80μA
QRSET Source Current IQRSET Before UVLO -- 80 -- μA
No Load Line Setting VIH QRSET Voltage before VCC − 0.5 -- -- V
Threshold VIL UVLO, Relative to V CC -- -- VCC − 1.8 V
OFS Function
OFS Enable/Disable VOFS > VEN_OFS before EN
VEN_OFS 0.7 1.2 -- V
Threshold Voltage rising
VID = 1V, V OFS = 1.83V 1.62 1.63 1.64
Offset Voltage VOUT VID = 1V, V OFS = 0.9V 0.69 0.7 0.71 V
VID = 1V, V OFS = 1.2V 0.9 1 1.01
Impedance ROFS 1 -- -- MΩ
RSET Setting
RSET Voltage VRSET RSET Voltage, VDAC = 1V 0.97 1 1.03 V
Zero Current Detection
Zero Current Detection
VZCD ISEN1P (AP) − ISEN1N (AN) -- 1 -- mV
Threshold
Protection
Falling Edge, 100mV
Under Voltage Lock-out VUVLO 4.04 4.24 4.44 V
Hysteresis
(UVLO)Threshold
ΔV UVLO Falling Edge Hysteresis -- 100 -- mV
Absolute Over Voltage
VOVABS With respect to VOUT_Max 100 150 200 mV
(OVP) Protection Threshold

19
RT8859M
Divided Input Voltage VDVDx VDVDx Threshold 1.01 1.06 1.11 V
Detection (DVDx)
Threshold VDVDHYS Falling Edge Hysteresis -- 25 -- mV
Delay of UVLO, DVDx tUVLO Rising Above Threshold -- 3 -- μs
VISENxN Rising Above Threshold, Pin
Delay of OVP tOV -- 1 -- μs
OFS Disable
Measured at ISEN1N/ISENAN with
Under Voltage Protection
VUV respect to unloaded output voltage −350 −300 −250 mV
(UVP) Threshold
(UOV) (for 0.8 < UOV < 1.52)
Delay of UVP tUVP VISENxN Falling below Threshold -- 3 -- μs
Negative Voltage
VNVP After OVP, Falling Edge −100 −50 -- mV
Protection Threshold
Delay of NVP tNVP VISENxN Falling below Threshold -- 1 -- μs
GILIMIT = V OCSET / (V ISENxP
− VISENxN), VOCSET = 2.400V, 43.2 48 52.8
Current Limit Gain Setting (V ISENxP − VISENxN) = 50mV
GILIMIT V/V
(per phase) GILIMITA = VOCSETA / (V ISENAP
− VISENAN), VOCSETA = 2.4V, (VISENAP 43.2 48 52.8
− VISENAN) = 50mV
Current Limit Latch
NILIM Times of UGATE Rising -- 15 -- Times
Counter (per phase)
EN Input Logic-High VIH 0.7 -- --
Threshold V
Voltage Logic-Low VIL -- -- 0.3
Logic Inputs
EN Hysteresis VENHYS -- 30 -- mV
Leakage Current of EN IEN −1 -- 1 μA

VCLK, VDIO
Logic-High VIH 0.665 -- --
Input
V
Threshold
Voltage Logic-Low VIL -- -- 0.367
VCLK,VDIO Hysteresis VHYS -- 70 -- mV

Leakage Current of
ILEAK_IN −1 -- 1 μA
ADD,VCLK,VDIO
ALERT
ALERT Low Voltage VALERT IALERT = 10mA -- -- 0.13 V
Power On Sequence
From EN = high until VR Controller is
SVID Ready Delay Time tA -- -- 2 ms
ready to accept SVID command
st
VR_RDY Trip Threshold VTH_VR_RDY VISENxN − 1 VDAC -- −100 -- mV
VR_RDY Low Voltage VVR_RDY IVR_RDY = 4mA -- -- 0.4 V
VR_RDY Delay tVR_RDY VISENxN = VINITIAL to VR_RDY High -- 100 -- μs

20
RT8859M
Thermal Throttling
VRHOT Output Voltage V VRHOT IVRHOT = 10mA -- -- 0.13 V
Current Monitor
Current Monitor Maximum VDAC = 1V,
Output Voltage in V IMON VFB − VCC_SENSE = 100mV, 3.2 3.3 3.4 V
Operating Range RIMONFB = 10kΩ, RIMON = 330kΩ
High Impedance Output
PWMx, ALERT, VRx_RDY,
ILEAK_OUT −1 -- 1 μA
VRHOT
PWM Driving Capability
PWM Source Resistor RPWM_SOURCE -- 30 -- Ω
PWM Sink Resistor RPWM_SINK -- 15 -- Ω
DVID, DVIDA, ICCMAX, ICCMAXA, and TMPMAX Pin Current
Current Sourcing Out from
IDVIDx During dynamic VID fast event 6 8 10 μA
DVIDx Pin to GND
Current Sinking In from 5V
IICCMAX After VR_RDY -- 16 -- μA
to ICCMAX Pin
Current Sourcing Out from
IICCMAXA After VRA_RDY -- 128 -- μA
ICCMAXA Pin to GND
Current Sinking In from 5V
ITMPMAX After VR_RDY -- 16 -- μA
to TMPMAX Pin
DVID and DVIDA Maximum Voltage
Maximum Allowable
VDVIDx_MAX During Dynamic VID Event -- -- 2 V
Voltage at DVIDx Pin
SVID
SVID Frequency fSVID 5 25 26.25 MHz
SVID Clock to Data Delay tCO 4 -- 8.3 ns
Setup Time of VDIO tSU 7 -- -- ns
Hold Time of VDIO tHLD 14 -- -- ns
VINITIAL Setting
V SETINI0 For VINITIAL = 0V 0 -- 8
V SETINI0_9 For VINITIAL = 0.9V 17 -- 20
SETINIx Threshold
V SETINI1_0 For VINITIAL = 1V 32.5 -- 42.5 %V CC
Voltage
V SETINI1_1 For VINITIAL = 1.1V 57.5 -- 67.5
V SETINI1_5 For VINITIAL = 1.5V 82.5 -- 100
ADD Threshold
ADD Input Logic-Low VIL Set SVID address 0000 0001 -- -- 0.35
Threshold Logic-Medium VIM Set SVID address 0010 0011 0.7 -- 3 V
Voltage
Logic-High VIH Set SVID address 0100 0101 VCC − 0.2 -- --

21
RT8859M
ADC
CICCMAX1 VICCMAX = 12.74%VCC 29 32 35
Digital Code of ICCMAX CICCMAX2 VICCMAX = 25.284%VCC 61 64 67 decimal
CICCMAX3 VICCMAX = 50.372%VCC 125 128 131
CICCMAXA1 VICCMAX = 3.332%VCC 5 8 11
Digital Code of ICCMAXA CICCMAXA2 VICCMAX = 6.468%VCC 13 16 19 decimal
CICCMAXA3 VICCMAX = 12.74%VCC 29 32 35
CTMPMAX1 VICCMAX = 33.516%VCC 82 85 88
Digital Code of TMPMAX CTMPMAX2 VICCMAX = 39.396%VCC 97 100 103 decimal
CTMPMAX3 VICCMAX = 49.196%VCC 122 125 128
COCR1 VIMON(A) = 3.3V 252 255 255
Digital Code of Output
COCR2 VIMON(A) = 2.208V 167 170 173 decimal
Current Report
COCR3 VIMON(A) = 1.107V 82 85 88
Updating Period of Output
tOCR -- -- 500 μs
Current Report
Tolerance Band of
Temperature_Zone Trip VTSEN 20 -- 20 mV
Points b7, b6, b5
Updating Period of
tTZ -- -- 4 ms
Temperature_Zone
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

22
RT8859M
Typical Operating Characteristics
CORE VR Power On CORE VR Power Off from EN
V CORE V CORE
(1V/Div) (1V/Div)
VR_RDY VR_RDY
(2V/Div) (2V/Div)
ALERT EN
(2V/Div) (2V/Div)
VDIO PWM1
(1V/Div) (5V/Div)
VCORE = 1.1V, ILOAD = 5A VCORE = 1.1V, ILOAD = 5A
Time (100μs/Div) Time (1ms/Div)
CORE VR Dynamic VID Up CORE VR Dynamic VID Up

Fast Slew Rate Slow Slew Rate,
V CORE V CORE
(500mV/Div) (500mV/Div)
VCLK VCLK
(1V/Div) (1V/Div)
ALERT ALERT
(2V/Div) (2V/Div)
VDIO VDIO
(2V/Div) VCORE = 0.7V up to 1.2V, ILOAD = 20A (2V/Div) VCORE = 0.7V up to 1.2V, ILOAD = 20A
Time (40μs/Div) Time (100μs/Div)
CORE VR Dynamic VID Down CORE VR Dynamic VID Down

Fast Slew Rate, Slow Slew Rate,
V CORE V CORE
VCLK VCLK
(1V/Div) (1V/Div)
ALERT ALERT
(2V/Div) (2V/Div)
VDIO VDIO
(2V/Div) (2V/Div)
VCORE = 1.2V down to 0.7V, ILOAD = 20A VCORE = 1.2V down to 0.7V, ILOAD = 20A

23
RT8859M
CORE VR Load Transient Response CORE VR Load Transient Response
V CORE V CORE
70A 70A
I LOAD I LOAD
5A 5A
VCORE = 1.1V, fLOAD = 300Hz, ILOAD = 5A to 70A VCORE = 1.1V, fLOAD = 300Hz, ILOAD = 70A to 5A
CORE VR OCP CORE VR OVP & NVP
V CORE
(2V/Div)
VR_RDY V CORE
(2V/Div) (1V/Div)
PWM1 VR_RDY
(5V/Div) (1V/Div)
I LOAD PWM1
(100A/Div) (5V/Div)
VCORE = 1.1V VCORE = 1.1V
CORE VR UVP VIMON vs. Load Current

3.3
3.0
2.7
2.4
V CORE
(1V/Div) 2.1
VIMON (V)
1.8
VR_RDY 1.5
(1V/Div) 1.2
0.9
PWM1 0.6
(5V/Div)
0.3
VCORE = 1.1V, ILOAD = 1A
0.0
Time (1ms/Div) 0 10 20 30 40 50 60 70 80 90 100
Load Current (A)

24
RT8859M
AXG VR Power On AXG VR Power Off from EN
VAXG VAXG
(1V/Div) (1V/Div)
VDIO VRA_RDY
(1V/Div) (1V/Div)
ALERT EN
(1V/Div) (1V/Div)
VRA_RDY PWMA
(2V/Div) (10V/Div)
VAXG = 1.1V, ILOAD = 5A VAXG = 1.1V, ILOAD = 5A
Time (100μs/Div) Time (1ms/Div)
AXG VR Dynamic VID Up AXG VR Dynamic VID Up

Fast Slew Rate Slow Slew Rate
VAXG VAXG
VCLK VCLK
(2V/Div) (2V/Div)
VDIO VDIO
(2V/Div) (2V/Div)
ALERT ALERT
(2V/Div) VAXG = 0.7V up to 1.2V, ILOAD = 20A (2V/Div) VAXG = 0.7V up to 1.2V, ILOAD = 20A
AXG VR Dynamic VID Down AXG VR Dynamic VID Down

Fast Slew Rate, Slow Slew Rate,
VAXG VAXG
VCLK VCLK
(2V/Div) (2V/Div)
VDIO VDIO
(2V/Div) (2V/Div)
ALERT ALERT
(2V/Div) VAXG = 1.2V down to 0.7V, ILOAD = 20A (2V/Div) VAXG = 1.2V down to 0.7V, ILOAD = 20A

25
RT8859M
AXG VR Load Transient Response AXG VR Load Transient Response
VAXG VAXG
22A 22A
I LOAD I LOAD
2A 2A
VAXG = 1.1V, fLOAD = 300Hz, ILOAD = 2A to 22A VAXG = 1.1V, fLOAD = 300Hz, ILOAD = 22A to 2A
AXG VR OCP AXG VR OVP & NVP
VAXG
(2V/Div)
VAXG
(1V/Div)
VRA_RDY
(2V/Div)
VRA_RDY
(1V/Div)
PWMA
(10V/Div)
I LOAD PWMA
(50A/Div) (5V/Div)
VAXG = 1.1V VAXG = 1.1V
AXG VR UVP VIMONA vs. Load Current

3.3
3.0
VAXG 2.7
(1V/Div) 2.4
2.1
VIMONA (V)
1.8
VRA_RDY 1.5
(1V/Div) 1.2
0.9
PWMA 0.6
(5V/Div) 0.3
VAXG = 1.1V, ILOAD = 1A
0.0
Time (1ms/Div) 0 3 6 9 12 15 18 21 24 27 30
Load Current (A)

26
RT8859M
Thermal Monitoring
TSEN
(100mV/Div)
VRHOT
(1V/Div)
TSEN from 1.7V Sweep to 1.9V, ILOAD = 0A
Time (400μs/Div)

27
RT8859M
Application Information
The RT8859M is a CPU power controller which includes complete fault protection functions including over voltage,
two voltage rails : a 4/3/2/1 phase synchronous buck under voltage, negative voltage, over current and under
controller, the CORE VR, and a single phase buck voltage lockout. The RT8859M is available in a WQFN-
controller, the AXG VR. The RT8859M is compliant with 56L 7x7 small footprint package.
Intel VR12/IMVP7 voltage regulator specification to fulfill
Intel's CPU power supply requirements of both CORE and General Loop Functions
AXG voltage rails. A Serial VID (SVID) interface is built-in VR Rail Addressing and Slew rate Setting
in the RT8859M to communicate with Intel VR12/IMVP7
The voltage level at the ADD pin defines the VR addresses
compliant CPU.
of the RT8859M. User can also flip the VR address by
The RT8859M adopts G-NAVPTM (Green Native AVP), properly setting the voltage on SR_ADDF pin. There are
which is Richtek's proprietary topology derived from finite three valid voltage levels for ADD pin : VCC (5V), floating,
DC gain compensator with current mode control, making and GND. Connecting the ADD pin to one of these three
it an easy setting PWM controller, meeting all Intel CPU voltage levels can set the addresses of both CORE VR
requirements of AVP (Active Voltage Positioning). The load and AXG VR according to the following table. The All Call
line can be easily programmed by setting the DC gain of address, 1111, 1110, can only be used with SetVID or
the error amplifier. The RT8859M has fast transient SetPS commands.
response due to the G-NAVPTM commanding variable
switching frequency. Based on the G-NAVPTM topology, Address VR1 (CORE) VR1 (AXG)
ADD Level
Flip Address Address
the RT8859M also features a quick response mechanism
VCC 0100 0101
for optimized AVP performance during load transient.
No Floating 0010 0011
The G-NAVPTM topology also represents a high efficiency GND 0000 0001
system with green power concept. With the G-NAVPTM
VCC 0101 0100
topology, the RT8859M becomes a green power controller Yes Floating 0011 0010
with high efficiency under heavy load, light load, and very
GND 0001 0000
light load conditions. The RT8859M supports mode
transition function with various operating states, including The RT8859M can also program the dynamic VID slew
multi-phase, single phase and diode emulation modes. rate by setting the SR_ADDF pin. After POR, the
These different operating states allow the overall power RT8859M will detect the voltage level on the SR_ADDF
control system to have the lowest power loss. By utilizing pin and latch the status of the address and the dynamic
the G-NAVPTM topology, the operating frequency of the VID slew rate. Below is the setting table of SR_ADDF.
RT8859M varies with VID, load, and input voltage to further The recommended voltage tolerance is (recommended
enhance the efficiency even in CCM. voltage ±25mV). Make sure the voltage divider at
The built-in high accuracy DAC converts the SVID code SR_ADDF pin uses the same VCC as pin 41 (VCC).
ranging from 0.25V to 1.52V with 5mV per step. The
RT8859M supports VID on-the-fly function with three
different slew rates : Fast, Slow and Decay. The RT8859M
also builds in a high accuracy ADC for some platform
setting functions, such as no-load offset or over-current
level. The controller supports both DCR and sense resistor
current sensing. The RT8859M provides power VR ready
signals for both CORE VR and AXG VR. It also features

28
RT8859M
Recommended VR0 Fast VR0 Slow VR1 Fast VR1 Slow
Address
SR_ADDF Voltage Slew Rate Slew Rate Slew Rate Slew Rate
Flipped
(if VCC = 5V) (mV/μs) (mV/μs) (mV/μs) (mV/μs)
5 Yes 10 2.5 10 2.5
4.766 Yes 10 2.5 10 5
4.609 Yes 10 5 10 2.5
4.453 Yes 10 5 10 5
4.297 Yes 15 3.75 10 2.5
4.141 Yes 15 3.75 10 5
3.984 Yes 15 7.5 10 2.5
3.828 Yes 15 7.5 10 5
3.672 Yes 20 5 10 2.5
1.797 No 20 10 10 5
1.641 No 20 10 10 2.5
1.484 No 20 5 10 5
1.328 No 20 5 10 2.5
1.172 No 15 7.5 10 5
1.016 No 15 7.5 10 2.5
0.859 No 15 3.75 10 5
0.703 No 15 3.75 10 2.5
0.547 No 10 5 10 5
0.391 No 10 5 10 2.5
0.234 No 10 2.5 10 5
0 No 10 2.5 10 2.5

29
RT8859M
Power Ready (POR) Detection Current
Mirror
During start-up, the RT8859M will detect the voltage at
2.14V
the voltage input pins : VCC, EN, DVD and DVDA. When
+
+
-
VCC > 4.24V, VDVD > 1.06V and VDVDA > 1.06V, the -
RT8859M will recognize the power state of system to be IBIAS
ready (POR = high) and wait for enable command at the 53.6k
EN pin. After POR = high and VEN > 0.7V, the RT8859M
will enter start-up sequence for both CORE rail and AXG
Figure 2. IBIAS Setting
rail. If the voltage at any voltage pin drops below low
threshold (POR = low), the RT8859M will enter power down
ICCMAX, ICCMAXA and TMPMAX
sequence and all the functions will be disabled. Normally,
The RT8859M provides ICCMAX, ICCMAXA and TMPMAX
connecting system VTT (1.05V) to the EN pin and power
pins for platform users to set the maximum level of output
stage VIN (12V, through a voltage divider) to the DVD pin is
current or VR temperature : ICCMAX for CORE VR max
recommended. 2ms (max) after the chip has been
current, ICCMAXA for AXG VR max current, and TMPMAX
enabled, the SVID circuitry will be ready. All the protection
for CORE VR max temperature.
latches (OVP, OCP, UVP) will be cleared only after POR
= low. The condition of VEN = low will not clear these To set ICCMAX, ICCMAXA and TMPMAX, platform
latches. designers should use resistive voltage divider on these
three pins. The current of the divider should be several
CMP
VCC +
milliamps to avoid noise effect. The 3 items share the
4.24V -
DVD +
CMP same algorithms : the ADC divides 5V into 255 levels.
POR
1.06V - Therefore, the LSB = 5 / 255 = 19.6mV, which means
EN +
CMP
Chip EN 19.6mV applied to ICCMAX pin equals to 1A setting. For
0.7V - example, if the maximum level of temperature is desired
CMP
DVDA + to be 120°C, the voltage applied to TMPMAX should be
1.06V -
120 x 19.6mV = 2.352V. The ADC circuit inside these
Figure 1. Power Ready (POR) Detection
three pins will decode the voltage applied and store the
Precise Reference Current Generation maximum current/temperature setting into ICC_Max and
The RT8859M includes complicated analog circuits inside Temp_Max registers. The ADC monitors and decodes the
the controller. These analog circuits need very precise voltage at these three pins only ONCE after power up.
reference voltage/current to drive these analog devices. After ADC decoding (only once), a 128μA current will be
The RT8859M will auto generate a 2.14V voltage source generated at the ICCMAXA pin for internal use. Make sure
at the IBIAS pin, and a 53.6kΩ resistor is required to be the voltage at the ICCMAXA pin is greater than 1.55V to
connected between IBIAS and analog ground. Through guarantee proper functionality.
VCC
this connection, the RT8859M will generate a 40μA current
from the IBIAS pin to analog ground, and this 40μA current
will be mirrored inside the RT8859M for internal use. Note
ICCMAX
that other types of connection or other values of resistance
applied at the IBIAS pin may cause failure of the A/D ICCMAXA
Converter
RT8859M's functions, such as slew rate control, OFS TMPMAX
accuracy, etc. In other words, the IBIAS pin can only be

connected with a 53.6kΩ resistor to GND. The resistance
accuracy of this resistor is recommended to be 1% or I
Figure 3. ADC Pins Setting
higher.

30
RT8859M
The RT8859M will NOT take any action even when the VR Start-Up Sequence
output current or temperature exceeds its maximum The RT8859M utilizes an internal soft-start sequence which
setting at these ADC pins. The maximum level settings strictly follows Intel VR12/IMVP7 start-up sequence
at these ADC pins are different from over current protection specifications. After POR = high and EN = high, the
or over temperature protection. In other words, these controller considers all the power inputs ready and enters
maximum level setting pins are only for platform users to start-up sequence. If VINITIAL = 0, VOUT is programmed to
define their system operating conditions and these stay at 0V for 2ms waiting for SVID command. If VINITIAL
messages will only be utilized by the CPU. ≠ 0 , VOUT will ramp up to VINITIAL voltage (which is not
zero) immediately after both POR = high and EN= high.
VINITIAL Setting
After VOUT reaches target VINITIAL, VOUT will stay at VINITIAL
The initial startup voltage of the RT8859M can be set by waiting for SVID command. After the RT8859M receives
platform users through the SETINI and the SETINIA pins. valid VID code (typically SetVID_Slow command), VOUT
Voltage divider circuits are recommended to be applied to will ramp up to the target voltage with specified slew rate
the SETINI and the SETINIA pins. The initial startup voltage (see section “Data and Configuration Register”). After
relates to the SETINI pin voltage setting as shown in Table VOUT reaches target voltage (VID voltage for VINITIAL = 0 or
4. Recommended voltage setting at the SETINIA pin is VINITIAL for VINITIAL ≠ 0), the RT8859M will send out
also shown in Table 4. VR_RDY signal to indicate that the power state of the
Table 4. SETINI (SETINIA) Pin Setting RT8859M is ready. The VR ready circuit is an open-drain
structure, so a pull-up resistor connected to a voltage
Initial Startup Recommended SETINI Pin
source is recommended.
Voltage Voltage
1.5V 7 x VCC ≒ 4.375V Power Down Sequence

8
Similar to the start-up sequence, the RT8859M also
1.1V 5 x VCC ≒ 3.125V
8 utilizes a soft shutdown mechanism during turn-off. After
3 x VCC ≒ 1.875V EN = low, the internal reference voltage (positive terminal
1V
8 of compensation EA) starts ramping down with 3.125mV/
0.9V 3 x VCC ≒ 0.9375V μs slew rate, and VOUT will follow the reference voltage to
16 0V. After VOUT drops below 0.2V, the RT8859M shuts down
0V 1 x VCC ≒ 0.3125V or GND and all functions (drivers) are disabled. The VR_RDY and
16
VRA_RDY will be pulled down immediately after POR =
low or EN = low.

31
RT8859M
VCC
DVD
(DVDA)
POR
EN
SVID XX Valid xx
2ms
0.2V
VOUT, CORE
MAX Phases
PWM Hi-Z SVID defined MAX Phases Hi-Z
VOUT, AXG 0.2V

1 Phase CCM
PWMA Hi-Z SVID defined 1 Phase CCM Hi-Z
100µs
VR_RDY
100µs
VRA_RDY
Figure 4 (a). Power Sequence for the RT8859M (VINITIAL = VINITIALA = 0V)
VCC
DVD
POR
EN
SVID XX Valid xx
2ms
VINITIAL
VOUT, CORE 0.2V

MAX Phases
PWM Hi-Z SVID defined MAX Phases Hi-Z
VINITIALA
VOUT, AXG 0.2V

1 Phase CCM
PWMA Hi-Z SVID defined 1 Phase CCM Hi-Z
100µs
VR_RDY
100µs
VRA_RDY
Figure 4 (b). Power Sequence for the RT8859M (VINITIAL ≠ 0V, VINITIALA ≠ 0V)

32
RT8859M
VIN, CORE
CORE VR
HS_FET VOUT, CORE
CCRCOT L
Active Phase Determination : Before POR PWM
PWMx Driver
RX CX
CMP Logic
The number of active phases is determined by the internal RC
+
-
LS_FET
COMP2
circuitry that monitors the ISENxN voltages during start- ISENxP C
+
up. Normally, the CORE VR operates as a 4-phase PWM AI ISENxN
VCS -
controller. Pulling ISEN4N to VCC programs a 3-phase Offset C2 C1
Canceling
operation, pulling ISEN3N and ISEN4N to VCC programs COMP R2 R1
VCC_SENSE
a 2-phase operation, and pulling ISEN2N, ISEN3N and -
FB
EA RGND
ISEN4N to VCC programs a 1-phase operation. Before
+
+ VSS_SENSE
-
VDAC, CORE
POR, CORE VR detects whether the voltages of ISEN2N,
ISEN3N and ISEN4N are higher than “V CC − 1V” Figure 5. CORE VR : Simplified Schematic for Droop
respectively to decide how many phases should be active. and Remote Sense in CCM
Phase selection is only active during POR. When POR =
Droop Setting (with Temperature Compensation)
high, the number of active phases is determined and
latched. The unused ISENxP pins are recommended to It's very easy to achieve Active Voltage Positioning (AVP)
be connected to VCC and unused PWM pins can be left by properly setting the error amplifier gain due to the native
floating. droop characteristics. The target is to have
VOUT = VDAC − ILOAD x RDROOP (1)
Loop Control
Then solving the switching condition VCOMP2 = VCS in
The CORE VR adopts Richtek's proprietary G-NAVPTM
Figure 5 yields the desired error amplifier gain as
topology. G-NAVPTM is based on the finite gain peak current
AI × RSENSE
mode with CCRCOT (Constant Current Ripple Constant A V = R2 = (2)
R1 RDROOP
On-Time) topology. The output voltage, VOUT, CORE, will
where AI is the internal current sense amplifier gain. RSENSE
decrease with increasing output load current. The control
is the current sense resistor. If no external sense resistor
loop consists of PWM modulators with power stages,
present, it is the DCR of the inductor. RDROOP is the
current sense amplifiers and an error amplifier as shown
equivalent load line resistance as well as the desired static
in Figure 5.
output impedance.
Similar to the peak current mode control with finite VOUT
compensator gain, the HS_FET on-time is determined by AV2 > AV1
CCRCOT on-time generator. When load current increases,

VCS increases, the steady state COMP voltage also
increases and induces VOUT, CORE to decrease, thus AV2
achieving AVP. A near-DC offset canceling is added to the
output of EA to eliminate the inherent output offset of finite AV1
gain peak current mode controller. 0

Load Current
Figure 6. CORE VR : Error Amplifier gain (AV) Influence

on VOUT Accuracy
Since the DCR of the inductor is temperature dependent,

it affects the output accuracy at hot conditions.
Temperature compensation is recommended for the
lossless inductor DCR current sense method. Figure 7
shows a simple but effective way of compensating the

33
RT8859M
temperature variations of the sense resistor using an NTC R1b =
thermistor placed in the feedback path. RSENSE, HOT
x (R1a / /RNTC, HOT ) − (R1a / /RNTC, COLD )
C2 C1 RSENSE, COLD
⎛ RSENSE, HOT ⎞
⎜1 − R ⎟ (8)
COMP R2 R1b R1a ⎝ SENSE, COLD ⎠
VCC_SENSE
FB RNTC
-
EA RGND Droop Disable
VSS_SENSE
+
+
-
VDAC The CORE VR's droop function can be enabled or disabled

with different connections of the QRSET pin. The
Figure 7. CORE VR : Loop Setting with Temperature
connection of the QRSET pin is usually a voltage divider
Compensation
circuit which is described later in the Quick Response
Usually, R1a is set to equal RNTC (25°C). R1b is selected section. Before POR, the RT8859M will source 80μA
to linearize the NTC's temperature characteristic. For a current from the QRSET pin to the external voltage divider
given NTC, design is to get R1b and R2 and then C1 and to determine the voltage level while the RT8859M is still
C2. According to equation (2), to compensate the not powered on. Before POR, if the voltage at the QRSET
temperature variations of the sense resistor, the error pin is higher than VCC − 0.5V, the CORE VR will operate
amplifier gain (AV) should have the same temperature in droop enabled mode. If the voltage is lower than
coefficient with RSENSE. Hence VCC − 1.8V, the CORE VR will operate without droop
A V, HOT RSENSE, HOT function, which means at the DC level of DAC voltage. For
= (3)
A V, COLD RSENSE, COLD example, a 5V voltage divided by two 1kΩ resistors
From equation (2), AV can be obtained at any temperature connected to the QRSET pin generates 2.54V (5V/2 +
(T°C) as shown below : 80μA x 1kΩ/2) before POR and 2.5V (5V/2) after POR.
A V, T °C = R2
(4)
R1a // RNTC, T °C + R1b Loop Compensation
The standard formula for the resistance of NTC thermistor Optimized compensation of the CORE VR allows for best
as a function of temperature is given by : possible load step response of the regulator's output. A
RNTC, T°C = R25°C e

{(
β⎡ 1
⎢⎣ T+273 ) ( )}
− 1 ⎤
298 ⎥⎦
type-I compensator with one pole and one zero is adequate
for proper compensation. Figure 8 shows the compensation
(5)
circuit. Prior design procedure shows how to select the
Where R25°C is the thermistor's nominal resistance at room
resistive feedback components for the error amplifier gain.
temperature, β is the thermistor's material constant in
Next, C1 and C2 must be calculated for the compensation.
Kelvins, and T is the thermistor's actual temperature in
The target is to achieve constant resistive output impedance
Celsius.
over the widest possible frequency range.
To calculate DCR value at different temperature can use
The pole frequency of the compensator must be set to
the equation as below :
compensate the output capacitor ESR zero :
DCRT°C = DCR25°C x [1 + 0.00393 x (T − 25)] (6) 1
fP = (9)
where 0.00393 is the temperature coefficient of copper. 2 x π x C x RC
For a given NTC thermistor, solving equation (4) at room Where C is the capacitance of output capacitor, and RC is
temperature (25°C) yields : the ESR of output capacitor. C2 can be calculated as
R2 = AV, 25°C x (R1b + R1a // RNTC, 25°C) (7) follows :
C x RC
where AV, 25°C is the error amplifier gain at room temperature C2 = (10)
R2
and can be obtained from equation (2). R1b can be obtained
by substituting (7) to (3),

34
RT8859M
The zero of compensator has to be placed at half of the when the inductor current reverses at light or negative
switching frequency to filter the switching related noise. load currents. With reversed inductor current, the phase
Such that, goes high earlier than normal, extending the on-time by a
C1 = 1
(R1b + R1a // RNTC, 25°C ) × π × fSW (11) period equal to the HS-FET rising dead time.
For better efficiency of the given load range, the maximum
TON Setting switching frequency is suggested to be :
fS(MAX) (kHz) = 1 x
High frequency operation optimizes the application for the TON − THS−Delay
smaller component size, trading off efficiency due to higher
VDAC(MAX) + ILOAD(MAX) x ⎡⎣RON _ LS−FET + DCR − RDROOP ⎤⎦
switching losses. This may be acceptable in ultra portable
devices where the load currents are lower and the
VIN(MAX) + ILOAD(MAX) x ⎡⎣RON _ LS−FET − RON _ HS−FET ⎤⎦
controller is powered from a lower voltage supply. Low (14)
frequency operation offers the best overall efficiency at Where fS(MAX) is the maximum switching frequency, tHS-
the expense of component size and board space. Figure DELAY is the turn-on delay of HS-FET, VDAC(MAX) is the
8 shows the On-Time setting Circuit. Connect a resistor Maximum VDAC of application, VIN(MAX) is the Maximum
(RTON) between VIN,CORE and TONSET to set the on-time application Input voltage, ILOAD(MAX) is the maximum load
of UGATE : of application, RON_LS-FET is the Low side FET RDS(ON),
−12
24.4 x 10 x RTON
tON (VDAC < 1.2V) = (12) RON_HS-FET is the High side FET RDS(ON), DCRL is the
VIN − VDAC
inductor DCR, and RDROOP is the load line setting.
where tON is the UGATE turn on period, VIN is Input voltage
of the CORE VR, and VDAC is the DAC voltage. TONSET RTON R1
CCRCOT VIN, CORE
On-Time
When VDAC is larger than 1.2V, the equivalent switching Computer C1
VDAC
frequency may be over 500kHz, and this too fast switching
frequency is unacceptable. Therefore, the CORE VR On-Time
implements a pseudo constant frequency technology to
avoid this disadvantage of CCRCOT topology. When VDAC Figure 8. CORE VR : On-Time Setting with RC Filter
is larger than 1.2V, the on-time equation will be modified
to : Differential Remote Sense Setting
−12
20.33 x 10 x RTON x VDAC The CORE VR includes differential, remote-sense inputs
tON (VDAC ≥ 1.2V) =
VIN − VDAC to eliminate the effects of voltage drops along the PC
(13)
board traces, CPU internal power routes and socket
During PS2/PS3 operation, the CORE VR shrinks its on-
contacts. The CPU contains on-die sense pins, VCC_SENSE
time for the purpose of reducing output voltage ripple
and VSS_SENSE. Connect RGND to VSS_SENSE. Connect FB
caused by DCM operation. The shrink percentage is 15%
to VCC_SENSE with a resistor to build the negative input
compared with original on-time setting by equation (12)
path of the error amplifier. The VDAC and the precision
or (13). That is, after setting the PS0 operation on-time,
voltage reference are referred to RGND for accurate remote
the PS2/PS3 operation on-time is 0.85 times the original
sensing.
on-time.
On-time translates only roughly to switching frequencies. Current Sense Setting
The on-times guaranteed in the Electrical Characteristics The current sense topology of the CORE VR is continuous
are influenced by switching delays in external HS-FET. inductor current sensing. Therefore, the controller can be
Also, the dead-time effect increases the effective on-time, less noise sensitive. Low offset amplifiers are used for
which in turn reduces the switching frequency. It occurs loop control and over current detection. The internal current
only in CCM and during dynamic output voltage transitions sense amplifier gain (Ai) is fixed to be 10. The ISENxP

35
RT8859M
and ISENxN denote the positive and negative input of the implemented through the SVID interface or OFS pin. Users
current sense amplifier of any phase. can disable pin offset function by simply connecting OFS
Users can either use a current sense resistor or the pin to GND. The RT8859M will latch the OFS status after
inductor's DCR for current sensing. Using the inductor's POR.
DCR allows higher efficiency as shown in Figure 9. Refer If pin offset function is enabled, users can decide whether
to below equation for optimum transient performance : to disable SVID OFS or not by selecting proper resistor
L = R ×C values of ICCMAX pin. After receiving a valid VID, the
X X (15)
DCR
RT8859M sinks in 16μA from ICCMAX pin. The voltage on
0.36μH
RX = = 3.6kΩ (16) ICCMAX is
1mΩ x 100nF
VICCMAX = R2 x VCC − 16μA (R1//R2) (17)
VOUT, CORE R1 + R2
If VICCMAX <1V, then the output voltage is
L DCR
VOUT = VDAC − ILOAD x RDROOP + VPIN−OFS (18)
RX CX
If VICCMAX >1V, then the output voltage is
ISENxP + VX -
VOUT = VDAC − ILOAD x RDROOP + VPIN−OFS
ISENxN
+ VSVID−OFS (19)
The pin offset voltage is set by supplying a voltage into
Figure 9. CORE VR : Lossless Inductor Sensing
OFS pin. The linear range of offset pin voltage is from
Considering the inductance tolerance, the resistor RX has 0.9V to 1.83V. The pin offset voltage can be calculated as
to be tuned on board by examining the transient voltage. below :
If the output voltage transient has an initial dip below the VPIN−OFS = VOFS − 1.2V (20)
minimum load line requirement with a slow recovery, RX For example, supplying 1.3V at OFS pin will achieve
is chosen too small. Vice versa, with a resistance too 100mV offset at the output. Connecting a filter capacitor
large the output voltage transient has only a small initial between the OFS pin and GND is necessary. Designers
dip and the recovery is too fast causing a ring back. can design the offset slew rate by properly setting the
Using current sense resistor in series with the inductor filter bandwidth.
can have better accuracy, but the efficiency is a trade-off.
Operation Mode Transition
Considering the equivalent inductance (LESL) of the current
RT8859M supports operation mode transition function at
sense resistor, an RC filter is recommended. The RC filter
the CORE VR for the SetPS command of Intel's VR12/
calculation method is similar to the above mentioned
IMVP7 CPU. The default operation mode of the CORE
inductor DCR sensing method.
VR is PS0, which is full phase CCM operation. Other
Current Balance operation modes includes PS1 (single phase CCM
The CORE VR implements internal current balance operation) and PS2 (single phase DEM operation).
mechanism in the current loop. The CORE VR senses After receiving SetPS command, the CORE VR will
and compares per-phase current signal with average immediately change to the new operation state. When
current. If the sensed current of any particular phase is the CORE VR receives SetPS command of PS1 operation
larger than average current, the on-time of this phase will mode, the CORE VR operates as a single phase CCM
be adjusted to be shorter. controller, and only channel 1 is active. The CORE VR will
disable phase 2, phase 3 and phase 4 by disabling Internal
No Load Offset (SVID & Platform) PWM logic drivers at PWM2, PWM3 and PWM4 pins
The CORE VR features no load offset function which (PWM = high impedance state). Therefore, 3 external
provides the possibility of wide range positive offset of drivers which support tri-state shutdown are required for
output voltage. The no-load offset function can be compatibility with PS1 operation mode.

36
RT8859M
When the CORE VR receives SetPS command of PS2 Ramp Amplitude Adjust
operation mode, the CORE VR operates as a single phase When the CORE VR enters PS2 operation mode, the
DCM controller, and only channel 1 is active with diode internal ramp of CORE VR will be modified for the reason
emulation operation. The CORE VR will disable phase 2, of stability. In case of smooth transition into PS2, the
phase 3 and phase 4 by disabling Internal PWM logic CCM ramp amplitude should be designed properly. The
drivers at PWM2, PWM3 and PWM4 pins (PWM = high RT8859M provides RSET pin for platform users to set the
impedance state). Therefore, 4 external drivers which ramp amplitude of the CORE VR in CCM. The criteria is
support tri-state shutdown are required for compatibility to set the ramp amplitude proportional to the on-time (when
with PS2 operation state. VDAC < 1.2V). The equation will be :
If the CORE VR receives dynamic VID change command 57.6 x 10−12 = tON x (VIN − VDAC) x 1/RSET (21)
(SetVID), the CORE VR will automatically enter PS0
where 57.6 x 10−12 is an internal coefficient of analog
operation mode and all phases will be activated. After
circuit.
VOUT,CORE reaches target voltage, the CORE VR will stay
at PS0 state and ignore former SetPS command. Only According to equation (12), the RSET equation can be
re-sending SetPS command after SetVID command will simplified to :
the CORE VR be forced into PS1 or PS2 operation states RRSET = 0.4236 x RTON (22)
again.
Thermal Monitoring and Temperature Reporting
Dynamic VID Enhancement The CORE VR provides thermal monitoring function via
During a dynamic VID event, the charging (dynamic VID sensing TSEN pin voltage. Through the voltage divider
up) or discharging (dynamic VID down) current causes resistors, R1 and RNTC, the voltage of TSEN will be
unwanted load-line effect which degrades the settling time proportional to VR temperature. When VR temperature
performance. The DVID pin can be used to compensate rises, TSEN voltage also rises. The ADC circuit of the
the load-line effect, so that the output voltage can settle CORE VR monitors the voltage variation at the TSEN pin
to the target value more quickly. from 1.46V to 1.845V with 55mV resolution. This voltage
During a dynamic VID up event, the RT8859M sources is then decoded into digital format and stored into
out a current (IDVID) to DVID pin. The voltage on DVID pin Temperature_Zone register. V CC
is added to DAC during DVID rising to enhance the dynamic

VID performance. Connecting a capacitor in parallel with R2 NTC
a resistor to DVID pin is recommended.

TSEN
I DVID is 8μA during a SetVID_Fast event. If it is a R1
SetVID_Slow event, IDVID automatically shrinks to 2μA (if
slow slew rate is 0.25x fast slew rate) or 4μA (if slow slew Figure 11. CORE VR : Thermal Monitoring Circuit
rate is 0.5x fast slew rate). This function is null during a
To meet Intel's VR12/IMVP7 specification, platform users
dynamic VID down event.
have to set the TSEN voltage to meet the temperature
DAC variation of VR from 75% to 100% VR max temperature.
IDVID For example, if the VR max temperature is 100°C, platform
Slew Rate
Control DVID users have to set the TSEN voltage to be 1.515V when
Event
1/20
DVID VR temperature reaches 82°C and 1.845V when VR
+
+ temperature reaches 100°C. Detailed voltage setting

EA
- FB versus temperature variation is shown in Table 5. The
Figure 10. DVID Compensation Circuit thermometer code is implemented in Temperature_Zone
register.

37
RT8859M
Table 5. Temperature_Zone Register
SVID Thermal Comparator Trip Points Temperatures Scaled to maximum = 100%
VRHOT Alert Voltage Represents Assert bit Minimum Level
b7 b6 b5 b4 b3 b2 b1 b0
100% 97% 94% 91% 88% 85% 82% 75%
1.845V 1.79V 1.735V 1.68V 1.625V 1.57V 1.515V 1.46V
The VRHOT pin is an open-drain structure that sends out In VR12/IMVP7 specification, the voltage signal of current
active low VRHOT signal. When b6 of Temperature_Zone monitoring will be restricted by a maximum value. Platform
register asserts to 1 (when TSEN voltage rises above designers have to select RIMON to meet the maximum
1.79V), the ALERT signal will be asserted to low, which is voltage of IMON at full load. To find RIMON and RIMONFB
so-called SVID thermal alert. In the mean time, the CORE based on :
VR will assert bit 1 data to 1 in Status_1 register. The RIMON VIMON(MAX)
= (24)
ALERT assertion will be de-asserted when b5 of RIMONFB IMAX x RDROOP
Temperature_Zone register is de-asserted from 1 to 0
where the VIMON(MAX) is the maximum voltage at full load,
(which means TSEN voltage falls under 1.735V), and bit 1
and I(MAX) is the full load current of VR.
of Status_1 register will also be cleared to 0. The bit 1
assertion of Status_1 is not latched and cannot be cleared Current Mirror
by GetReg command.
VFB + 2(VISEN, Total)
When b7 of Temperature_Zone register asserts to 1 (when
OLL EN +
TSEN voltage rises above 1.845V), the VRHOT signal will VCC_SENSE
-
be asserted to low. The VRHOT assertion will be de- VFB
IMirror IMONFB RIMONFB
asserted when b6 of Temperature_Zone register is de-
asserted from 1 to 0 (which means TSEN voltage falls IMON RIMON
under 1.79V).
It is typically recommended to connect a pull-up resistor Figure 12. CORE VR : Current Monitoring Circuit
from the VRHOT pin to a voltage source.
When the droop function is disabled, VCC_SENSE no longer
Current Monitoring and Current Reporting varies with output current, so the current monitoring
function is adaptively changed internally under this
The CORE VR provides current monitoring function via
situation. The equation will be rewritten as :
sensing the voltage difference of IMONFB pin and output
voltage. In G-NAVPTM technology, the output voltage is I x RDCR x RIMON x 2
VIMON, NO_DROOP = LOAD (25)
dependent to output current, and the current monitoring RIMONFB
function is achieved by this characteristic of output voltage.
RIMON VIMON(MAX)
Figure 12 shows the current monitoring setting principle. = (26)
RIMONFB IMAX x RDCR x 2
The equivalent output current will be sensed from IMONFB
pin and mirrored to IMON pin. The resistor connected to
The ADC circuit of the CORE VR monitors the voltage
IMON pin determines voltage gain of the IMON output.
variation at the IMON pin from 0V to 3.3V, and this voltage
The current monitor indicator equation is shown as : is decoded into digital format and stored into
I x RDROOP x RIMON Output_Current register. The ADC divides 3.3V into 255
VIMON = LOAD (23)
RIMONFB levels, so LSB = 3.3V/255 = 12.941mV. Platform
where ILOAD is the output load current, RDROOP is the designers should design VIMON to be 3.3V at ICCMAX.
equivalent load line resistance, and RIMON and RIMONFB are For example, when load current = 50% x ICCMAX, VIMON
the current monitor current setting resistors. = 1.65V and Output_Current register = 7Fh.

38
RT8859M
The IMON pin is an output of the internal operational Therefore, with a little modification of equation (12), the
amplifier and sends out IMON signal. When the data of pulse width of quick response pulse can be calculated
Output_Current register reaches 255d (when IMON voltage as :
rises above 3.3V), the ALERT signal will be asserted to V
tON, QR = QRSET x tON
low, which is so-called SVID ICCMAX alert. In the mean 1.2
−12
time, the CORE VR will assert the bit 2 data to 1 in 20.33 x 10 x RTON x VQRSET
= (27)
Status_1 register. The ALERT assertion will be de-asserted VIN − VDAC
when the data of Output_Current register decreases to After generating a quick response pulse, the pulse is then
242d (when IMON voltage falls under 3.144V). The bit 2 applied to the on-time generation circuit, and all the active
assertion of Status_1 register is latched and can only be phases' on-times will be overridden by the quick response
cleared when two criteria are met : the data of pulse.
Output_Current register decreases to 242d (when IMON
Over Current Protection
voltage falls under 3.144V) and the GetReg command is
sent to the Status_1 register of the CORE VR. The CORE VR compares a programmable current limit
set point to the voltage from the current sense amplifier
Quick Response output of each phase for Over Current Protection (OCP).
Therefore, the OCP mechanism of the RT8859M
Current Mirror
implements per-phase current protections. The voltage
QR trigger
VDAC + applied to the OCSET pin defines the desired current limit
-
threshold, ILIMIT :
IMirror IMONFB RIMONFB VCC_SENSE
VOCSET = 48 x ILIMIT x RSENSE (28)
Connect a resistive voltage divider from VCC to GND, and
the joint of the resistive voltage divider is connected to
the OCSET pin as shown in Figure 14. For a given ROC2,
Figure 13. CORE VR : Quick Response Triggering
⎛ VCC ⎞
Circuit ROC1 = ROC2 x ⎜ − 1⎟ (29)
⎝ OCSET
V ⎠
The CORE VR utilizes a quick response feature to support
heavy load current demand during instantaneous load VCC
transient. The CORE VR monitors the current of the
IMONFB pin, and this current is mirrored to internal quick ROC1
response circuit. At steady state, this mirrored current OCSET
will not trigger a quick response. When the VOUT, CORE
ROC2
voltage drops abruptly due to load apply transient, the
mirrored current flowing into quick response circuit will
also increase instantaneously. When the mirrored current Figure 14. OCP Setting without Temperature
instantaneously rises above 5μA , quick response will be Compensation
triggered. The current limit is triggered when per-phase inductor
When quick response is triggered, the quick response current exceeds the current limit threshold, ILIMIT, as
circuit will generate a quick response pulse. The internal defined by VOCSET. The driver will then be forced to turn off
quick response pulse generation circuit is similar to the UGATE until the condition is cleared. If the over current
on-time generation circuit. The only difference is the condition of any phase remains valid for 15 cycles, the
QRSET pin. The voltage at the QRSET pin also influences CORE VR will trigger OCP latch. Latched OCP forces
the pulse width of quick response. A voltage divider circuit PWM into high impedance, which disables internal PWM
is recommended to be applied to the QRSET pin. logic drivers. If the over current condition is not valid for 15

39
RT8859M
continuous cycles, the OCP latch counter will be reset. ROC1b =
When OCP is triggered by the CORE VR, the AXG VR (α − 1) x ROC2 + α x REQU, HOT − REQU, COLD
(35)
will also enter soft shut down sequence. (1 − α )
If inductor DCR is used as the current sense component, where
α=
temperature compensation is recommended for proper
RSENSE, HOT DCR25°C x [1 + 0.00393 x (THOT − 25)]
protection under all conditions. Figure 15 shows a typical =
RSENSE, COLD DCR25°C x [1 + 0.00393 x (TCOLD − 25)]
OCP setting with temperature compensation.
(36)
VCC
REQU, T°C = ROC1a // RNTC, T°C (37)
ROC1a NTC Over Voltage Protection (OVP)

The over voltage protection circuit of the CORE VR
ROC1b monitors the output voltage via the ISEN1N pin after POR.
OCSET The supported maximum operating VID of the VR (V(MAX))
ROC2 is stored in the VOUT_Max register. Once VISEN1N
exceeds “V(MAX) + 150mV”, OVP is triggered and latched.
The CORE VR will try to turn on low side MOSFETs and
Figure 15. OCP Setting with Temperature Compensation
turn off high side MOSFETs of all active phases of the
Usually, ROC1a is selected to be equal to the thermistor's CORE VR to protect the CPU. When OVP is triggered by
nominal resistance at room temperature. Ideally, assume the CORE VR, the AXG VR will also enter soft shut down
VOCSET has the same temperature coefficient as RSENSE sequence. A 1μs delay is used in OVP detection circuit
(Inductor DCR) : to prevent false trigger. Note that if OFS pin is higher than
0.9V before power up, OVP will trigger at “VMAX +850mV”.
VOCSET, HOT RSENSE, HOT
= (30)
VOCSET, COLD RSENSE, COLD Negative Voltage Protection (NVP)
According to the basic circuit calculation, we can get During OVP latch state, the CORE VR also monitors the
VOCSET at any temperature: ISEN1N pin for negative voltage protection. Since the OVP
ROC2 latch will continuously turn on all low side MOSFETs of
VOCSET, T °C = VCC x
ROC1a / /RNTC, T°C + ROC1b + ROC2 the CORE VR, the CORE VR may suffer negative output
voltage. As a consequence, when the ISEN1N voltage
(31)
drops below −0.05V after triggering OVP, the CORE VR
Re-write (31) from (30) to get VOCSET at room temperature will trigger NVP to turn off all low side MOSFETs of the
CORE VR while the high side MOSFETs still remains off.
ROC1a // RNTC, COLD + ROC1b + ROC2 RSENSE, HOT
= After triggering NVP, if the output voltage rises above 0V,
ROC1a // RNTC, HOT + ROC1b + ROC2 RSENSE, COLD
(32) the OVP latch will restart to turn on all low side MOSFETs.
VOCSET, 25°C = Therefore, the output voltage may travel between 0V and
ROC2 −0.05V due to OVP latch and NVP triggering. The NVP
VCC x (33)
ROC1a / /RNTC, 25°C + ROC1b + ROC2 function will be active only after OVP is triggered. A 1μs
delay is used in NVP detection circuit to prevent false
Solving (32) and (33) yields ROC1b and ROC2 trigger.
ROC2 =
Under Voltage Protection (UVP)
α x REQU, HOT − REQU, COLD + (1 − α ) x REQU, 25°C
VCC The CORE VR implements under voltage protection of
x (1 − α ) VOUT,CORE. If ISEN1N is less than the internal reference
VOCSET, 25°C (34)

40
RT8859M
VIN, AXG
by 300mV, the CORE VR will trigger UVP latch. The UVP
HS_FET VOUT, AXG
latch will turn off both high side and low side MOSFETs. CCRCOT L
PWMA Driver
PWM
When UVP is triggered by the CORE VR, the AXG VR Logic RX CX
CMP RC
will also enter soft shut down sequence. A 3μs delay is LS_FET
+
-
ISENAP C
used in UVP detection circuit to prevent false trigger. If
COMPA2
+
AI ISENAN
VCS -
platform OFS function is enabled (OFS pin not connected
to GND), the UVP function will be disabled. Offset C2 C1
Canceling
COMPA R2 R1
Under Voltage Lock Out (UVLO) VCCAXG_SENSE
FBA
-
During normal operation, if the voltage at the VCC or DVD EA RGNDA
+
+ VSSAXG_SENSE
-
pin drops below POR threshold, the CORE VR will trigger VDAC, AXG
UVLO. The UVLO protection forces all high side MOSFETs
Figure 16. AXG VR : Simplified Schematic for Droop and
and low side MOSFETs off by shutting down internal PWM
Remote Sense in CCM
logic drivers. A 3μs delay is used in UVLO detection circuit
to prevent false trigger. Droop Setting (with Temperature Compensation)
AXG VR It's very easy to achieve Active Voltage Positioning (AVP)

by properly setting the error amplifier gain due to the native
AXG VR Disable droop characteristics. The target is to have
The AXG VR can be disabled by connecting ISENAN to a
VOUTAXG = VDACAXG − ILOAD x RDROOP (38)
voltage higher than “VCC − 1V”. If not in use, ISENAP,
, then solving the switching condition VCOMP2 = VCS in
TSENA and DVDA are recommended to be connected to
Figure 16 yields the desired error amplifier gain as
VCC, while PWMA is left floating. When AXG VR is
A x RSENSE
disabled, all SVID commands related to AXG VR will be A V = R2 = I (39)
R1 RDROOP
rejected. where AI is the internal current sense amplifier gain, RSENSE
is the current sense resistance (an external sense resistor
Loop Control
or the DCR of the inductor), and RDROOP is the equivalent
The AXG VR adopts Richtek's proprietary G-NAVPTM
load line resistance as well as the desired static output
topology. G-NAVPTM is based on the finite gain peak current
impedance.
mode with CCRCOT (Constant Current Ripple Constant
On-Time) topology. The output voltage, VOUT, AXG, will Since the DCR of the inductor is temperature dependent,
decrease with increasing output load current. The control the output accuracy may be affected at high temperature
loop consists of a PWM modulator with power stage, a conditions. Temperature compensation is recommended
current sense amplifier and an error amplifier as shown in for the lossless inductor DCR current sense method.
Figure 16. Figure 17 shows a simple but effective way of
compensating the temperature variations of the sense
Similar to the peak current mode control with finite
resistor by using an NTC thermistor placed in the feedback
compensator gain, the HS_FET on-time is determined by
path.
CCRCOT on-time generator. When load current increases, C2 C1
VCS increases, the steady state COMPA voltage also
R2 R1b R1a
increases and induces VOUT, AXG to decrease, thus achieving COMPA
VCCAXG_SENSE
AVP. A near-DC offset canceling is added to the output of FBA RNTC
-
EA RGNDA VSSAXG_SENSE
+
EA to cancel the inherent output offset of finite-gain peak +

-
VDAC,AXG
current mode controller.
Figure 17. AXG VR : Loop Setting with Temperature
Compensation

41
RT8859M
Usually, R1a is set to equal RNTC (25°C) and R1b is selected circuit which is described later in the Quick Response
to linearize the NTC's temperature characteristic. For a section. Before POR, the RT8859M will source 80μA
given NTC, the design procedure is to get R1b and R2 current from the QRSETA pin to the external voltage divider
first, and then C1 and C2 next. According to equation (39), to determine the voltage level while the RT8859M is still
to compensate the temperature variations of the sense not powered on. Before POR, if the voltage at the QRSETA
resistor, the error amplifier gain (AV) should have the same pin is higher than 4.5V, the AXG VR will operate in droop-
temperature coefficient as RSENSE. Hence : enabled mode. If the voltage is lower than 3.2V, the AXG
A V, HOT RSENSE, HOT VR will operate without droop function, which means at
= (40)
A V, COLD RSENSE, COLD the DC level of DAC voltage. For example, a 5V voltage
divided by two 1kΩ resistors connected to the QRSETA
From (37), Av can be obtained at any temperature (T°C)
pin generates 2.54V (5V/2 + 80μA x 1kΩ/2) before POR
as :
R2 and 2.5V (5V/2) after POR.
A V, T °C = (41)
R1a // RNTC, T °C + R1b
Loop Compensation
The standard formula for the resistance of NTC thermistor
Optimized compensation of the AXG VR allows for best
as a function of temperature is given by :
possible load step response of the regulator's output. A
RNTC, T°C = R25°C e

{(
β⎡ 1
⎣⎢ T+273 ) ( )}
− 1 ⎤
298 ⎦⎥ (42) type-I compensator with one pole and one zero is adequate
for a proper compensation. Figure 17 shows the
where R25°C is the thermistor's nominal resistance at room compensation circuit. Prior design procedure shows how
temperature, β is the thermistor's material constant in to select the resistive feedback components for the error
Kelvins, and T is the thermistor actual temperature in amplifier gain. Next, C1 and C2 must be calculated for the
Celsius. compensation. The target is to achieve constant resistive
To calculate DCR value at different temperatures, use the output impedance over the widest possible frequency
equation below : range.
DCRT°C = DCR25°C x [1+ 0.00393 x (T − 25)] (43) The pole frequency of the compensator must be set to
compensate the output capacitor ESR zero :
where 0.00393 is the temperature coefficient of copper.
fP = 1
For a given NTC thermistor, solving equation (41) at room (46)
2 x π x C x RC
temperature (25°C) yields
where C is the capacitance of output capacitor, and RC is
R2 = AV, 25°C x (R1b + R1a // RNTC, 25°C) (44) the ESR of output capacitor. C2 can be calculated as
where AV, 25°C is the error amplifier gain at room temperature below :
and can be obtained from equation (39). R1b can be C x RC
C2 = (47)
obtained by substituting (44) to (40), R2
R1b = The zero of compensator has to be placed at half of the
RSENSE, HOT switching frequency to filter the switching related noise.
x (R1a / /RNTC, HOT ) − (R1a / /RNTC, COLD ) Such that,
RSENSE, COLD
⎛ RSENSE, HOT ⎞
⎜1 − R C1 = 1
⎟
⎝ SENSE, COLD ⎠ (R1b + R1a / /RNTC, 25°C ) x π x fSW (48)
(45)
Droop Disable TON Setting
The AXG VR's droop function can be enabled or disabled High frequency operation optimizes the application by
with different connections of the QRSETA pin. The allowing smaller component size, but with the trade-off of
connection of the QRSETA pin is usually a voltage divider efficiency due to higher switching losses. This may be
acceptable in ultra portable devices where the load currents

42
RT8859M
are lower and the controller is powered from a lower voltage
TONSETA RTON R1
supply. Low frequency operation offers the best overall CCRCOT VIN, AXG
On-Time
efficiency at the expense of component size and board Computer C1
VDAC, AXG
space. Figure 19 shows the on-time setting circuit.
Connect a resistor (RTON) between VIN, GFX and TONSETA
On-Time
to set the on-time of UGATE :
−12
24.4 x 10 x RTON Figure 18. AXG VR : On-Time setting with RC Filter
tON (VDAC < 1.2V) = (49)
VIN − VDACGFX
Differential Remote Sense Setting
where tON is the UGATE turn-on period, VIN is the input
The AXG VR includes differential, remote sense inputs to
voltage of the AXG VR, and VDAC, AXG is the DAC voltage.
eliminate the effects of voltage drops along the PC board
When VDAC, AXG is larger than 1.2V, the equivalent switching traces, CPU internal power routes and socket contacts.
frequency may be too fast at over 500kHz, which is The CPU contains on-die sense pins VCCAXG_SENSE and
unacceptable. Therefore, the AXG VR implements a pseudo VSSAXG_SENSE. Connect the RGNDA to VSSAXG_SENSE.
constant frequency technology to avoid this disadvantage Connect the FBA to VCCAXG_SENSE with a resistor to build
of CCRCOT topology. When VDAC, AXG is larger than 1.2V, the negative input path of the error amplifier. The VDAC,AXG
the on-time equation will be modified to : and the precision voltage reference are referred to RGNDA
−12
20.33 x 10 x RTON x VDAC, AXG for accurate remote sensing.
t ON (VDAC ≥ 1.2V) =
VIN − VDAC, AXG
(50) Current Sense Setting
On-time translates only roughly to switching frequencies. The current sense topology of the AXG VR is continuous
The on-times guaranteed in the Electrical Characteristics inductor current sensing. Therefore, the controller can be
are influenced by switching delays in the external HS- less noise sensitive. Low offset amplifiers are used for
FET. Also, the dead-time effect increases the effective loop control and over current detection. The internal current
on-time, which in turn reduces the switching frequency. It sense amplifier gain (AI) is fixed to be 20. The ISENAP
occurs only in CCM, and during dynamic output voltage and ISENAN denote the positive and negative input of the
transitions when the inductor current reverses at light or current sense amplifier.
negative load currents. With reversed inductor current,
Users can either use a current sense resistor or the
the phase go high earlier than normal, extending the on-
inductor's DCR for current sensing. Using inductor's DCR
time by a period equal to the HS-FET rising dead time.
allows higher efficiency as shown in Figure 19. Refer to
For better efficiency of the given load range, the maximum
below equation for optimum transient performance :
switching frequency is suggested to be : L =R x C
X X (52)
fS(MAX) (kHz) = 1 x DCR
tON − THS−Delay
For example, choosing L = 0.36μH with 1mΩ DCR and
VDAC(MAX) + ILOAD(MAX) x ⎡⎣RON _ LS−FET + DCR − RDROOP ⎤⎦ CX = 100nF yields :
VIN(MAX) + ILOAD(MAX) x ⎡⎣RON _ LS−FET − RON _ HS−FET ⎤⎦ 0.36μH
RX = = 3.6k Ω (53)
(51) 1m Ω × 100nF
VOUT, AXG
where fS(MAX) is the maximum switching frequency, tHS-
L DCR
DELAY is the turn-on delay of HS-FET, VDAC(MAX) is the
maximum VDAC, AXG of application, VIN(MAX) is the maximum RX CX
application input voltage, ILOAD(MAX) is the maximum load + VX -

ISENAP
of application, RON_LS-FET is the Low side FET RDS(ON),
ISENAN
RON_HS-FET is the High side FET RDS(ON), DCR is the
inductor DCR, and RDROOP is the load line setting.
Figure 19. AXG VR : Lossless Inductor Sensing

43
RT8859M
Considering the inductance tolerance, the resistor RX has between the OFSA pin and GND is necessary. Designers
to be tuned on board by examining the transient voltage. can design the offset slew rate by properly setting the
If the output voltage transient has an initial dip below the filter bandwidth.
minimum load line requirement with a slow recovery, RX
is chosen too small. Vice versa, if the resistance is too Operation Mode Transition
large the output voltage transient has only a small initial The RT8859M supports operation mode transition function
dip and the recovery becomes too fast, causing a ring at AXG VR for the SetPS command of Intel VR12/IMVP7
back to occur. CPU. The default operation mode of the AXG VR is PS0,
which is CCM operation. Other operation mode includes
Using current sense resistor in series with the inductor
PS2 (single phase DEM operation).
can have better accuracy, but at the expense of efficiency.
Considering the equivalent inductance (LESL) of the After receiving SetPS command, the AXG VR will
current sense resistor, an RC filter is recommended. The immediately change to the new operation state. When
RC filter calculation method is similar to the above the AXG VR receives SetPS command of PS2 operation
mentioned inductor DCR sensing method. mode, the AXG VR operates as a single phase DCM
controller and diode emulation operation is activated.
No Load Offset (SVID & Platform) Therefore, an external driver which supports tri-state
The AXG VR features no load offset function which provides shutdown is required for compatibility with PS2 operation
the possibility of wide range positive offset of output voltage. state.
The no load offset function can be implemented through If the AXG VR receives dynamic VID change command
the SVID interface or OFSA pin. Users can disable pin (SetVID), the AXG VR will automatically enter PS0
offset function by simply connecting OFSA pin to GND. operation mode. After VOUT, AXG reaches target voltage,
The RT8859M will latch the OFSA status after POR. the AXG VR will stay at PS0 state and ignore former SetPS
If pin offset function is enabled, users can decide either to command. Only by resending SetPS command after
disable SVID OFS or not by selecting proper resistor SetVID command will the AXG VR be forced into PS2
values of TMPMAX pin. After receiving a valid VID, the operation state again.
RT8859M sinks in 16μA from TMPMAX pin. The voltage
on TMPMAX is Dynamic VID Enhancement
During a dynamic VID event, the charging (dynamic VID
VTMPMAX = R2 x VCC − 16μA (R1 // R2) (54)
R1 + R2 up) or discharging (dynamic VID down) current causes
If VTMPMAX <1V, then the output voltage is unwanted load-line effect which degrades the settling time
performance. The DVIDA pin can be used to compensate
VOUT = VDAC − ILOAD x RDROOP + VPIN−OFS (55)
the load-line effect, so that the output voltage can settle
If VTMPMAX >1V, then the output voltage is to the target value more quickly.
VOUT = VDAC − ILOAD x RDROOP + VPIN−OFS During a dynamic VID up event, the RT8859M sources
+ VSVID−OFS (56)
out a current (IDVIDA) to DVIDA pin. The voltage on DVIDA
The pin offset voltage is set by supplying a voltage into pin is added to DAC during DVID rising to enhance the
OFSA pin. The linear range of offset pin voltage is from dynamic VID performance. Connecting a capacitor in
0.9V to 1.83V. The pin offset voltage can be calculated as parallel with a resistor to DVIDA pin is recommended.
below :
IDVIDA is 8μA during a SetVID_Fast event. If it is a
VPIN−OFSA = VOFSA − 1.2V (57) SetVID_Slow event, IDVIDA automatically shrinks to 2μA
For example, supplying 1.3V at OFSA pin will achieve (if slow slew rate is 0.25x fast slew rate) or 4μA(if slow
100mV offset at the output. Connecting a filter capacitor slew rate is 0.5x fast slew rate). This function is null during
a dynamic VID down event.

44
RT8859M
DAC Table 6. Temperature_Zone register
Slew Rate VRHOT SVID Thermal Alert

IDVIDA
Control
b7 b6
DVID
Event DVIDA 100% 97%
1/20 1.845V 1.79V
+
Comparator Trip Points

+ Temperatures Scaled to maximum = 100%
EA
- FBA Voltage Represents Assert bit Minimum Level
b5 b4 b3 b2 b1 b0
Figure 20. DVID Compensation Circuit 94% 91% 88% 85% 82% 75%
1.735V 1.68V 1.625V 1.57V 1.515V 1.46V
Thermal Monitoring and Temperature Reporting The VRHOT pin is an open-drain structure that sends out
The AXG VR provides thermal monitoring function via active-low VRHOT signal. When b6 of Temperature_Zone
sensing TSENA pin voltage. Through the voltage divider register asserts to 1 (when TSENA voltage rises above
resistors, R1 and RNTC, the voltage of TSENA will be 1.79V), the ALERT signal will be asserted to low, which is
proportional to VR temperature. When VR temperature so-called SVID thermal alert. In the mean time, the AXG
rises, the TSENA voltage also rises. The ADC circuit of VR will assert the bit 1 data to 1 in Status_1 register. The
the AXG VR monitors the voltage variation at the TSENA ALERT assertion will be de-asserted when b5 of
pin from 1.46V to 1.845V with 55mV resolution. This Temperature_Zone register is de-asserted from 1 to 0
voltage is then decoded into digital format and stored into (which means TSENA voltage falls under 1.735V), and
Temperature_Zone register. the bit 1 of Status_1 register will also be cleared to 0. The
VCC bit 1 assertion of Status_1 is not latched and cannot be
cleared by GetReg command.
R2 NTC When b7 of Temperature_Zone register asserts to 1 (when

TSENA voltage rises above 1.845V), the VRHOT signal
TSENA will be asserted to low. The VRHOT assertion will be de-
asserted when b6 of Temperature_Zone register is de-
R1
asserted from 1 to 0 (which means TSENA voltage falls
under 1.79V).
Figure 21. AXG VR : Thermal Monitoring Circuit
The thermal monitoring function of the AXG VR can be
To meet Intel's VR12/IMVP7 specification, platform users
disabled by connecting TSENA to VCC. If TSENA is
have to set the TSENA voltage to meet the temperature
disabled, all the SVID commands related to
variation of VR from 75% to 100% VR max temperature.
Temperature_Zone register of the AXG VR will be rejected.
For example, if the VR max temperature is 100°C,
platform users have to set the TSENA voltage to be 1.46V Current Monitoring and Current Reporting
when VR temperature reaches 75°C and 1.845V when
The AXG VR provides current monitoring function via
VR temperature reaches 100°C. Detailed voltage setting
sensing the IMONFBA pin. In G-NAVPTM technology, the
versus temperature variation is shown in Table 6. The
output voltage is dependent on the output current, and
thermometer code is implemented in Temperature_Zone
the current monitoring function is achieved by this output
register.
voltage characteristic. Figure 22 shows the current
monitoring setting principle. The equivalent output current
will be sensed from the IMONFBA pin and mirrored to the

45
RT8859M
IMONA pin. The resistor connected to the IMONA pin designers should design VIMONA to be 3.3V at ICCMAXA.
determines the voltage gain of the IMONA output. For example, when load current = 50% x ICCMAXA,
The current monitor indicator equation is shown as : VIMONA = 1.65V and Output_Current register = 7Fh.
I x RDROOP x RIMONA The IMONA pin is an output of the internal operational
VIMONA = LOAD (58)
RIMONFBA amplifier and sends out IMONA signal. When the data of
Where ILOAD is the output load current, RDROOP is the Output_Current register reaches 255d (when IMONA
equivalent load line resistance, and RIMONA and RIMONFBA voltage rises above 3.3V), the ALERT signal will be
are the current monitor current setting resistors. asserted to low, which is so-called SVID ICCMAXA alert.
In the mean time, the AXG VR will assert the bit 2 data to
In VR12/IMVP7 specification, the voltage signal of current
1 in Status_1 register. The ALERT assertion will be de-
monitoring will be restricted by a maximum value. Platform
asserted when the data of Output_Current register
designers have to select RIMONA to meet the maximum
decreases to 242d (when IMONA voltage falls under
voltage of IMONA at full load. Find RIMONA and RIMONFBA
3.144V). The bit 2 assertion of Status_1 register is latched
based on :
and can only be cleared when two criteria are met : the
RIMONA VIMONA(MAX)
= (59) data of Output_Current register decreases to 242d (when
RIMONFBA IMAX x RDROOP
IMONA voltage falls under 3.144V) and the GetReg
where VIMONA(MAX) is the maximum voltage at full load, command is sent to the Status_1 register of the AXG VR.
and IMAX is the full load current of VR.
Quick Response
Current Mirror
Current Mirror
VFBA + 2(VISENA)
OLL EN VDAC, AXG + VCCAXG_SENSE

+ VCCAXG_SENSE QR trigger
-
-
VFBA IMirror IMONFBA RIMONFBA
IMirror IMONFBA RIMONFBA
IMONA RIMONA
Figure 23. AXG VR : Quick Response Triggering Circuit

Figure 22. AXG VR : Current Monitoring Circuit
The AXG VR utilizes a quick response feature to support
heavy load current demand during instantaneous load
When the droop function is disabled, VCCAXG_SENSE no
transient. The AXG VR monitors the current of the
longer varies with output current, so the current monitoring
IMONFBA pin, and this current is mirrored to internal quick
function is adaptively changed internally under this
response circuit. At steady state, this mirrored current
situation. The equation will be rewritten as :
will not trigger a quick response. When the VOUT, AXG voltage
2 x ILOAD x RRDCR x RIMONA
VIMONA, NO_DROOP = drops abruptly due to load apply transient, the mirrored
RIMONFBA
(60) current into quick response circuit will also increase
VIMONA(MAX) instantaneously. When the mirrored current
RIMONA
= (61) instantaneously rises above 5μA, quick response will be
RIMONFBA 2 x IMAX x RDCR
triggered.
The ADC circuit of the AXG VR monitors the voltage
When quick response is triggered, the quick response
variation at the IMONA pin from 0V to 3.3V, and this
circuit will generate a quick response pulse. The internal
voltage is decoded into digital format and stored into the
quick response pulse generation circuit is similar to the
Output_Current register. The ADC divides 3.3V into 255
on-time generation circuit. The only difference is the
levels, so LSB = 3.3V/255 = 12.941mV. Platform
QRSETA pin. The voltage at the QRSETA pin also

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RT8859M
influences the pulse width of quick response. A voltage the over current condition is not valid for 15 continuous
divider circuit is recommended to be applied to the cycles, the OCP latch counter will be reset. When OCP
QRSETA pin. Therefore, with a little modification of is triggered by the AXG VR, the CORE VR will also enter
equation (49), the pulse width of quick response pulse soft shut down sequence.
can be calculated as : If inductor DCR is used as the current sense component,
V
tON, QR = QRSETA x tON temperature compensation is recommended for proper
1.2
protection under all conditions. Figure 25 shows a typical
−12
20.33 x 10 x RTON x VQRSETA
= (62) OCP setting with temperature compensation.
VIN − VDAC, AXG
VCC
After generating a quick response pulse, the pulse is then

applied to the on-time generation circuit and the AXG VR's ROC1a NTC
on-time will be overridden by the quick response pulse.

ROC1b
Over Current Protection OCSETA

ROC2
The AXG VR compares a programmable current limit set
point to the voltage from the current sense amplifier output
Figure 25. AXG VR : OCP Setting with Temperature
of each phase for Over Current Protection (OCP).
Compensation
Therefore, the OCP mechanism of the RT8859M
implements per-phase current protections. The voltage
Usually, ROC1a is Selected to be equal to the thermistor's
applied to the OCSETA pin defines the desired current
nominal resistance at room temperature. Ideally, assume
limit threshold ILIMIT :
VOCSET has the same temperature coefficient as RSENSE
VOCSETA = 48 x ILIMIT x RSENSE (63) (Inductor DCR) :
Connect a resistive voltage divider from VCC to GND, and VOCSETA, HOT RSENSE, HOT
= (64)
the joint of the resistive voltage divider is connected to VOCSETA, COLD RSENSE, COLD
the OCSETA pin as shown in Figure 24. For a given ROC2,
According to the basic circuit calculation, we can get
⎛ VCC ⎞
ROC1 = ROC2 x ⎜ − 1⎟ VOCSETA at any temperature :
⎝ VOCSET ⎠ VOCSETA, T°C =
VCC ROC2
VCC x (65)
ROC1a / /RNTC, 25°C + ROC1b + ROC2
ROC1
OCSETA Re-write (64) from (65) to get VOCSETA at room temperature:

ROC2
ROC1a // RNTC, COLD + ROC1b + ROC2 RSENSE, HOT
=
ROC1a // RNTC, HOT + ROC1b + ROC2 RSENSE, COLD
Figure 24. AXG VR : OCP Setting without Temperature (66)
VOCSETA, 25°C =
Compensation
ROC2
VCC x (67)
The current limit is triggered when inductor current ROC1a / /RNTC, 25°C + ROC1b + ROC2
exceeds the current limit threshold, ILIMIT, as defined by
Solving (66) and (67) yields ROC1b and ROC2
VOCSETA. The driver will then be forced to turn off UGATE
until the condition is cleared. If the over current condition ROC2 =
of any phase remains valid for 15 cycles, the AXG VR will α × REQU, HOT − REQU, COLD + (1 − α ) × REQU, 25°C
trigger OCP latch. Latched OCP forces PWM into high VCC
× (1 − α ) (68)
impedance, which disables internal PWM logic drivers. If VOCSETA, 25°C

47
RT8859M
ROC1b = the AXG VR will trigger UVP latch. The UVP latch will
(α − 1) × ROC2 + α × REQU, HOT − REQU, COLD (69)
turn off both high side and low side MOSFETs. When
(1 − α ) UVP is triggered by the AXG VR, the CORE VR will also
where enter soft shut down sequence. A 3μs delay is used in
α=
UVP detection circuit to prevent false trigger. If platform
RSENSE, HOT DCR25°C × [1 + 0.00393 × (THOT − 25)]
= OFSA function is enabled (OFSA pin not connected to
RSENSE, COLD DCR25°C × [1 + 0.00393 × (TCOLD − 25)]
GND), the UVP function will be disabled.
(70)
REQU, T°C = ROC1a // RNTC, T°C (71) Under Voltage Lock Out (UVLO)
During normal operation, if the voltage at the VCC or DVD
Over Voltage Protection (OVP)
pin drops below POR threshold, the AXG VR will trigger
The over voltage protection circuit of the AXG VR monitors
UVLO. The UVLO protection forces all high side MOSFETs
the output voltage via the ISENAN pin after POR. The
and low side MOSFETs off by shutting down internal PWM
supported maximum operating VID of the VR (V(MAX) ) is
logic driver. A 3μs delay is used in UVLO detection circuit
stored in the VOUT_Max register. Once VISENAN
to prevent false trigger.
exceeds “V(MAX) + 150mV”, OVP is triggered and latched.
The AXG VR will try to turn on low side MOSFETs and Inductor Selection
turn off high side MOSFETs of the AXG VR to protect the The switching frequency and ripple current determine the
CPU. When OVP is triggered by the AXG VR, the CORE inductor value as follows :
VR will also enter shut down sequence. A 1μs delay is V − VOUT
LMIN = IN × TON (72)
used in OVP detection circuit to prevent false trigger. Note IRipple(MAX)
that if OFSA pin is higher than 0.9V before power up,
where tON is the UGATE turn-on period.
OVP would trigger when “VMAX + 850mV”.
Higher inductance yields in less ripple current and hence
Negative Voltage Protection (NVP) higher efficiency. The downside is a slower transient
During OVP latch state, the AXG VR also monitors the response of the power stage to load transients. This might
ISENAN pin for negative voltage protection. Since the OVP increase the need for more output capacitors, thus driving
latch will continuously turn on all low side MOSFETs of up the cost. Select a low loss inductor having the lowest
the AXG VR, the AXG VR may suffer negative output possible DC resistance that fits in the allotted dimensions.
voltage. As a consequence, when the ISENAN voltage The core must be large enough not to be saturated at the
drops below −0.05V after triggering OVP, the AXG VR will peak inductor current.
trigger NVP to turn off all low side MOSFETs of the AXG
VR while the high side MOSFETs still remaining off. After Output Capacitor Selection
triggering NVP, if the output voltage rises above 0V, the Output capacitors are used to obtain high bandwidth for
OVP latch will restart to turn on all low side MOSFETs. the output voltage beyond the bandwidth of the converter
Therefore, the output voltage may bounce between 0V itself. Usually, the CPU manufacturer recommends a
and −0.05V due to OVP latch and NVP triggering. The capacitor configuration. Two different kinds of output
NVP function will be active only after OVP is triggered. A capacitors are typically used : bulk capacitors closely
1μs delay is used in NVP detection circuit to prevent false located next to the inductors, and ceramic output
trigger. capacitors in close proximity to the load. Latter ones are
for mid-frequency decoupling with especially small ESR
Under Voltage Protection (UVP) and ESL values, while the bulk capacitors have to provide
The AXG VR implements under voltage protection of VOUT, enough stored energy to overcome the low frequency
AXG. If VFBA is less than the internal reference by 300mV, bandwidth gap between the regulator and the CPU.

48
RT8859M
Thermal Considerations Layout Considerations
For continuous operation, do not exceed absolute Careful PC board layout is critical to achieve low switching
maximum junction temperature. The maximum power losses and clean, stable operation. The switching power
dissipation depends on the thermal resistance of the IC stage requires particular attention. If possible, mount all
package, PCB layout, rate of surrounding airflow, and of the power components on the top side of the board
difference between junction and ambient temperature. The with their ground terminals flushed against one another.
maximum power dissipation can be calculated by the Follow these guidelines for optimum PC board layout :
following formula : ` Keep the high current paths short, especially at the
PD(MAX) = (TJ(MAX) − TA) / θJA ground terminals.
where TJ(MAX) is the maximum junction temperature, TA is ` Keep the power traces and load connections short. This
the ambient temperature, and θJA is the junction to ambient is essential for high efficiency.
thermal resistance. ` When trade-offs in trace lengths must be made, it’s
For recommended operating condition specifications, the preferable to let the inductor charging path be longer
maximum junction temperature is 125°C. The junction to than the discharging path.
ambient thermal resistance, θJA, is layout dependent. For ` Place the current sense component close to the
WQFN-56L 7x7 packages, the thermal resistance, θJA, is controller. ISENxP and ISENxN connections for current
31°C/W on a standard JEDEC 51-7 four-layer thermal test limit and voltage positioning must be made using Kelvin
board. The maximum power dissipation at TA = 25°C can sense connections to guarantee current sense accuracy.
be calculated by the following formula : The PCB trace from the sense nodes should be
PD(MAX) = (125°C − 25°C) / (31°C/W) = 3.226W for paralleled back to the controller.
WQFN-56L 7x7 package ` Route high speed switching nodes away from sensitive
The maximum power dissipation depends on the operating analog areas (COMP, FB, ISENxP, ISENxN, etc...)
ambient temperature for fixed T J (MAX) and thermal
resistance, θJA. The derating curve in Figure 26 allows
the designer to see the effect of rising ambient temperature
on the maximum power dissipation.
3.5
Four Layers PCB
Maximum Power Dissipation (W)1
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125
Ambient Temperature (°C)
Figure 26. Derating Curve of Maximum Power
Dissipation

49
RT8859M
Outline Dimension
1 1
2 2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,

but must be located within the zone indicated.
Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.150 0.250 0.006 0.010
D 6.900 7.100 0.272 0.280
D2 5.150 5.250 0.203 0.207
E 6.900 7.100 0.272 0.280
E2 5.150 5.250 0.203 0.207
e 0.400 0.016
L 0.350 0.450 0.014 0.018
W-Type 56L QFN 7x7 Package

50
RT8859M
Richtek Technology Corporation

14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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Multi-Phase PWM Controller For CPU Core Power Supply: General Description Features

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Multi-Phase PWM Controller for CPU Core Power Supply

DS8859M-07 January 2014 www.richtek.com

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DS8859M-07 January 2014

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

BOOT VCC VCC BOOT

is a registered trademark of Richtek Technology Corporation.

DS8859M-07 January 2014

DS8859M-07 January 2014

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

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DS8859M-07 January 2014 www.richtek.com

From Control Logic ADC

Rate Control VSETA ERROR

Soft-Start & Slew VSET PWM

Rate Control + CMP

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DS8859M-07 January 2014 www.richtek.com

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Recommended Operating Conditions (Note 4)

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Leakage Current of EN IEN −1 -- 1 μA

VCLK,VDIO Hysteresis VHYS -- 70 -- mV

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Time (100μs/Div) Time (1ms/Div)

CORE VR Dynamic VID Up CORE VR Dynamic VID Up

Time (40μs/Div) Time (100μs/Div)

CORE VR Dynamic VID Down CORE VR Dynamic VID Down

Time (40μs/Div) Time (100μs/Div)

DS8859M-07 January 2014 www.richtek.com

CORE VR Load Transient Response CORE VR Load Transient Response

Time (100μs/Div) Time (100μs/Div)

CORE VR OCP CORE VR OVP & NVP

Time (100μs/Div) Time (40μs/Div)

CORE VR UVP VIMON vs. Load Current

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AXG VR Power On AXG VR Power Off from EN

Time (100μs/Div) Time (1ms/Div)

AXG VR Dynamic VID Up AXG VR Dynamic VID Up

Time (40μs/Div) Time (100μs/Div)

AXG VR Dynamic VID Down AXG VR Dynamic VID Down

Time (40μs/Div) Time (100μs/Div)

DS8859M-07 January 2014 www.richtek.com

AXG VR Load Transient Response AXG VR Load Transient Response

Time (100μs/Div) Time (100μs/Div)