Module 1 - Introduction To Manufacturing Processes
Module 1 - Introduction To Manufacturing Processes
Manufacturing processes
Materials processing technologies
Types and properties of engineered materials
Physics based modelling approach at different scale –
continuum to Nano
Evaluation of properties of manufactured products
Statistical and data driven modelling approach
Manufacturing processes
Joining
Machining
Casting Finishing
Forming
Assembly
Design – Most economic manner
Production – Selection of
Understanding of important process parameters
Manufacturing process Development of new techniques
and modification of existing
technologies
Production process – can not be solved by conventional methods
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Unconventional manufacturing processes
Manufacturing processes
Oxides are reduced, but other elements are mixed with iron such as
Carbon – 3 – 4.5%
Manganese – 0.15 – 2.5%
Phosphorus – 0.1 – 2 5 Pig iron
Silicon – 1 – 3 %
Sulfur – 0.05 – 0.1 %
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Materials processing technologies
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Types of engineered materials
Metals/metallic materials Ceramics & Glasses
•good conductors of electricity and •thermally and electrically
heat insulating
•lustrous appearance •resistant to high temperatures
•susceptible to corrosion and harsh environments
•strong, but deformable •hard, but brittle
Composites Polymers
•consist of more than one material type •very large molecules
•designed to display a combination of •low density, low weight
properties of each component •maybe extremely flexible
Advanced materials – (Magnetic information storage, liquid crystal display, fiber optics)
PVC
Polymer
Thermosetting: at elevated temperature it is soften with
increasing temperature. When it cooled, becomes harder and
stronger. No chemical change is involved. Thermosetting
polymer is significantly stronger and more rigid than
thermoplastic
Thermoplastic: Soften over a range of temperature. It is
formed by injection molding. Large amount of permanent
deformation is available. Having useful strength.
Thermoplastic - heat forming
Thermoset - heat setting
Thermoplastic - bonds are covalent
Thermoset - bonds are covalent and crosslinked
Elastomers
Elastomer: Elastic polymer, special class of linear polymer
that display large amount of elastic deformation
Acquire crosslinked structure
Composites
Laminar
Particle Reinforced
Fibre Reinforced
Ceramics and Glasses
Complex compounds and solutions that contain both
metallic and nonmetallic elements (C, N, O, P, or S)
typically hard and brittle
exhibit high strength and high melting points
exhibit low thermal and electrical conductivity
Good chemical and thermal stability, good creep
resistance
Can be made amorphous structure with a random pattern,
like glass (silicates)
Applications: Pottery, brick, tile, glass, ovenware, magnets,
refractories, cutting tools
Types: Aluminum oxide, Magnesium oxide, silicon oxide,
silicon nitride
Semiconductors
Conduct electricity intermediately (Neither good
conductor nor good insulator)
Si, Ge, Sn in periodic table serve as a boundary between
metallic and nonmetallic elements
Si and Ge are widely used semiconductors
O to Te(Tellurium) and Zn to Hg (Mercury) are used
with Si and Ge to form a semi conductor
GaAs (Gallium Arsenide) which is used as a high
temperature rectifier and a laser material
CdS which is used as a low-cost solar cell for conversion
of solar energy to electrical energy
Some ceramics display semi-conducting behavior, e.g.,
ZnO which is widely used in color television
Crystal Structure in Metals
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Physics based modelling approach at different scale –
continuum to Nano
The general format to represent a physical system
Equilibrium system – Form governing equations
Dynamic system (Analyse the kinematics) – Form
governing equations
May use constitutive equation
With essential and natural boundary conditions
Also need initial condition
Constitutive equation relates two different physical
quantities
It does not directly follow physical laws
It can be combined with other equations such as
equilibrium and kinematical equations which do
represent physical laws 30
Physics based modelling approach at different scale –
continuum to Nano
The constitutive law parameter can be derived from
experimental observation – called phenomenological
modelling
The methodology is to explicitly include variables from
physics as internal state variables
The other possibility is to determine the format of the
constitutive equation based on knowledge about the
physical mechanisms causing the deformation (For
example, Failure mechanism)
An alternate to phenomenological modelling is to derive
constitutive equations from low-scale where laws of physics is well
understood
For example: parameters for grain size models for microstructural
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evolution
Physics based modelling approach at different scale –
continuum to Nano
Example: Determine the material property Young’s modulus
from experiment and use it to develop mathematical
continuum model that predicts material’s response.
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Importance of Multiscale Methods?
Limitations of industrial simulations today:
a) Continuum models are good, but not always adequate
• Problems in fracture and failure of solids require improved
constitutive models to describe material behavior
• Macroscopic material properties of new materials and
composites are not readily available, while they are needed in
simulation-based design
• Detailed atomistic information is required in regions of high
deformation or discontinuity
b) Molecular dynamics simulations
• Limited to small domains (~ 106 - 108 atoms) and small time
frames ( ~ nanoseconds)
• Experiments, even on nano-systems, involve much larger systems
over longer times 33
Hierarchical vs. Concurrent
Hierarchical approach
– Use known information at one scale to generate
model for larger scale
– Information passing typically through some sort of
averaging process
– Example: bonding models/potentials, constitutive laws
Concurrent approach
– Perform simulations at different length scales
simultaneously
– Relationships between length scales are dynamic
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Multi-scale model
Continuum methods: Assume that matter is continuous and treat the
properties of the system as field quantities. Numerically solve balance
equations coupled with phenomenological equations to predict the
properties of the systems.
Pros:
– Can in principle handle systems of any (macroscopic) size and
dynamic processes on longer timescales.
Cons:
• Require input (elastic tensors, diffusion coefficients, equations of
state, etc.) from experiment or from a lower-scale methods that
can be difficult to obtain.
• Cannot explain results that depend on the electronic or molecular
level of detail.
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Multi-scale model
Connection between the scales: Upscaling
Using results from a lower-scale calculation to obtain
parameters for a higher-scale method. This is relatively
easy to do; deductive approach. Examples:
• Calculation of phenomenological coefficients (e.g.
elastic tensors, viscosities, diffusivities) from atomistic
simulations for later use in a continuum model.
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Multi-scale model
Connection between the scales: Downscaling
• Using higher-scale information (often experimental) to build
parameters for lower-scale methods. This is more difficult, due to
the non-uniqueness problem.
• For example, the results from a meso-scale simulation do not
contain atomistic detail, but it would be desirable to be able to use
such results to return to the atomistic simulation level. Inductive
approach.
• Example:
The stress- strain curve for a randomly oriented polycrystal can be
used to predict the 𝜏 − 𝛾 curve for a single crystal
ഥ and 𝜎 = M
𝜀𝑥 = 𝛾/M ഥ 𝜏 are used ഥ - Taylor factor
M
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Challenges in Multiscale modeling
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Evaluation of properties of
manufactured products
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Properties evaluation
Characteristics of sample by different experimental
techniques
Physical properties: Density, melting point, optical
properties, thermal properties of specific heat, coefficient of
thermal expansion and thermal conductivity, electrical
conductivity, and magnetic properties
Microstructural characterization: Optical microscope,
Scanning electron microscopy, X-ray diffraction
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Mechanical Properties
Ductility and Brittleness
Toughness
True stress-strain curve (Mostly increasing order)
Elongation – uniform and non-
uniform, necking
Strain-hardening
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Dynamic Properties
Loading condition in engineering components
Impact load or rapidly change in magnitude
Repeated cycle of loading and unloading
Frequent change in mode of loading
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Properties evaluation
Physical properties: Standard experimental methodologies
Microstructural measurement:
Average grain size and distribution – line intercept
method
Residual stress - X-ray diffraction (XRD) method,
Neutron diffraction
Chemical composition of a metallic sample – Energy
Dispersive X-Ray Analysis (EDX)
Various phases in component – XRD method
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Statistical and data driven modelling approach
Sensors - to provide the data through data acquisition system
Mainly in the form of current, voltage or directly temperature
Sensor data can be used for online monitoring of the system
such that collected data may be passed to the robotic system
The data can be used for offline properties evaluation
Sensors - directly measure technological parameters
including voltage, current and wire feed speed
These data is mostly use for online monitoring of the system
Optical sensors
A laser beam that is projected in a scanning motion across
the seam
A CCD (Charged Coupled Device) is used to measure
features of the weld joint in combination with a 51laser
stripe
Sensors for technological parameters
Measuring of temperature
Contact (thermocouples) or non-contact (thermo vision
camera or infrared thermometer) method
Measuring of temperature
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Other sensors in fusion welding
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Data acquisition
Fractal theory
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Thank you
for your kind attention
End of Module 1
Introduction to Manufacturing processes
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