NOTICE: This standard has either been superceded and replaced by a new version or discontinued.

Contact ASTM International (www.astm.org) for the latest information.

Designation: B 32 – 00e1

Standard Specification for

Solder Metal1
This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (e) indicates an editorial change since the last revision or reapproval.

This standard has been approved for use by agencies of the Department of Defense.

e1 NOTE—OA value for Fe 10 in Table 1 was corrected editorially in December 2002.

1. Scope Products Including Tall Oil and Other Related Products2

1.1 This specification covers solder metal alloys (commonly D 509 Test Methods of Sampling and Grading Rosin2
known as soft solders) used in non-electronic applications, E 28 Test Method for Softening Point by Ring-and-Ball
including but not limited to, tin-lead, tin-antimony, tin- Apparatus2
antimony-copper-silver, tin-antimony-coppersilver-nickel, tin- E 29 Practice for Using Significant Digits in Test Data to
silver, tin-copper-silver, and lead-tin-silver, used for the pur- Determine Conformance with Specifications3
pose of joining together two or more metals at temperatures E 46 Test Methods for Chemical Analysis of Lead- and
below their melting points. Electronic grade solder alloys and Tin-Base Solder4
fluxed and non-fluxed solid solders for electronic soldering E 51 Method for Spectrographic Analysis of Tin Alloys by
applications are not covered by this specification as they are the Powder Technique5
under the auspices of IPC - Association Connecting Electronic E 55 Practice for Sampling Wrought Nonferrous Metals and
Industries. Alloys for Determination of Chemical Composition6
1.1.1 These solders include those alloys having a liquidus E 87 Methods for Chemical Analysis of Lead, Tin, Anti-
temperature not exceeding 800°F (430°C). mony, and Their Alloys (Photometric Method)7
1.1.2 This specification includes solders in the form of solid E 88 Practice for Sampling Nonferrous Metals and Alloys
bars, ingots, powder and special forms, and in the form of solid in Cast Form for Determination of Chemical Composition6
and flux-core ribbon, wire, and solder paste. 2.2 Federal Standard: 8
1.2 The values stated in inch-pound units are to be regarded Fed. Std. No. 123 Marking for Shipment (Civil Agencies)
as the standard. The values given in parentheses are for 2.3 Military Standard: 9
information only. MIL-STD-129 Marking for Shipment and Storage
1.3 This standard does not purport to address all of the 3. Terminology
safety concerns, if any, associated with its use. It is the
responsibility of the user of this standard to establish appro- 3.1 Definition:
priate safety and health practices and determine the applica- 3.1.1 producer, n—the primary manufacturer of the mate-
bility of regulatory limitations prior to use. rial.
3.2 Definitions of Terms Specific to This Standard:
2. Referenced Documents 3.2.1 lot, n—The term “lot” as used in this specification is
2.1 ASTM Standards: defined as follows:
D 269 Test Method for Insoluble Matter in Rosin and Rosin 3.2.1.1 Discussion—For solid solder metal, a lot consists of
Derivatives2 all solder of the same type designation, produced from the
D 464 Test Methods for Saponification Number of Naval same batch of raw materials under essentially the same
Store Products Including Tall Oil and Other Related conditions, and offered for inspection at one time.
Products2
D 465 Test Methods for Acid Number of Naval Stores
3
Annual Book of ASTM Standards, Vol 14.02.
4
Discontinued—See 1994 Annual Book of ASTM Standards, Vol 03.05.
5
Discontinued—See 1984 Annual Book of ASTM Standards, Vol 03.06.
1 6
This specification is under the jurisdiction of ASTM Committee B02 on Annual Book of ASTM Standards, Vol 03.05.
7
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee Discontinued—See 1984 Annual Book of ASTM Standards, Vol 03.05.
8
B02.02 on Refined Lead, Tin, Antimony, and Their Alloys. Available from Global Engineering Documents, 15 Inverness Way East,
Current edition approved Oct. 10, 2000. Published November 2000. Originally Englewood, CO 80112.
9
published as B 32–19 T. Last previous edition B 32-96. Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
2
Annual Book of ASTM Standards, Vol 06.03. Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.

Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.

1
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
3.2.1.2 Discussion—For flux–core solder, a lot consists of 7.2 Flux (applicable to flux-core ribbon, wire, and solder
all solder of the same core mixture, produced from the same paste):
batch of raw materials under essentially the same conditions 7.2.1 Type R—The flux is composed of Grade WW or WG
and offered for inspection at one time. gum rosin of Test Methods D 509. The rosin shall have a
3.2.2 lot number,, n—The term “lot number” as used in this toluene–insoluble matter content of not more than 0.05
specification refers to an alpha-numeric or numerical designa- weight % in accordance with Test Method D 269, a minimum
tion for a lot which is traceable to a date of manufacture. acid number of 160 mg KOH/1 g sample in accordance with
Test Methods D 465, a minimum softening point of 70°C in
4. Classification accordance with Test Method E 28, and a minimum saponifi-
4.1 Type Designation— The type designation uses the cation number of 166 in accordance with Test Methods D 464.
following symbols to properly identify the material: When solvents or plasticizers are added, they must be nonchlo-
4.1.1 Alloy Composition—The composition is identified by rinated.
a two-letter symbol and a number. The letters typically indicate 7.2.2 Type RMA—The flux is composed of rosin conform-
the chemical symbol for the critical element in the solder and ing to 7.2.1. Incorporated additives provide a material meeting
the number indicates the nominal percentage, by weight, of the the requirements of 8.1.2 for type RMA. When solvents or
critical element in the solder. The designation followed by the plasticizers are added, they must be nonchlorinated.
letters A or B distinguishes between different alloy grades of 7.2.3 Type RA—The flux is composed of rosin conforming
similar composition (see Table 1). to 7.2.1. Incorporated additives provide a material meeting the
4.1.2 Form—The form is indicated by a single letter in requirements of 8.1.2 for Type RA. When solvents or plasti-
accordance with Table 2. cizers are added, they must be nonchlorinated.
4.1.3 Flux Type—The flux type is indicated by a letter or 7.2.4 Type OA—The flux is composed of one or more
combination of letters in accordance with Table 3. water-soluble organic materials.
4.1.4 Core Condition and Flux Percentage (applicable only 7.2.5 Type OS—The flux is composed of one or more
to flux-cored solder)—The core condition and flux percentage water-insoluble organic materials, other than Types R, RMA,
is identified by a single letter and a number in accordance with and RA, which are soluble in organic solvents.
Table 4. 7.2.6 Type IS—The flux is composed of one or more
4.1.5 Powder Mesh Size and Flux Percentage (applicable inorganic salts or acids with or without an organic binder and
only to solder paste)—The powder mesh size and flux percent- solvents.
age is identified by a single letter and a number in accordance
with Table 5. 8. Physical Properties and Performance Requirements
8.1 Solder Paste—Solder paste must exhibit smoothness of
5. Ordering Information texture (no lumps) and the absence of caking and drying.
5.1 Orders for material under this specification indicate the 8.1.1 Powder Mesh Size— The solder powder mesh size
following information, as required, to adequately describe the shall be as specified (see 5.1.1 and 4.1.5) when the extracted
desired material. solder powder is tested as specified in 13.4.
5.1.1 Type designation (see 4.1), 8.1.2 Viscosity—The viscosity of solder paste and the
5.1.2 Detailed requirements for special forms, method used to determine the viscosity must be agreed upon
5.1.3 Dimensions of ribbon and wire solder (see 9.2), between the supplier and purchaser. The following variables
5.1.4 Unit weight, must be taken into account when relating one viscosity
5.1.5 Packaging (see Section 18), measurement to another type of viscometer used, spindle size
5.1.6 Marking (see Section 17), and shape, speed (r/min), temperature of sample, and the use or
5.1.7 ASTM specification number and issue, marked on (a) non-use of a helipath.
purchase order and (b) package or spool, and 8.2 Requirements for Flux—The flux must meet the physi-
5.1.8 Special requirements, as agreed upon between sup- cal and performance requirements specified in Table 6 as
plier and purchaser. applicable.
8.2.1 Solder Pool— When solder is tested as specified in
6. Materials and Manufacture 13.3.2, there must be no spattering, as indicated by the
6.1 The producer must have each lot of solder metal as presence of flux particles outside the main pool of residue. The
uniform in quality as practicable and of satisfactory appearance flux must promote spreading of the molten solder over the
in accordance with best industrial practices. Each bar, ingot, or coupon to form integrally thereon a coat of solder that shall
other form in which the solder is sold must be uniform in feather out to a thin edge. The complete edge of the solder pool
composition with the entire lot. must be clearly visible through the flux residue.
8.2.2 Dryness—When solder is tested as specified in 13.3.2,
7. Chemical Composition the surface of the residue must be free of tackiness, permitting
7.1 Solder Alloy— The solder alloy composition is as easy and complete removal of applied powdered chalk.
specified in Table 1. 8.2.3 Chlorides and Bromides Test—When the extracted
NOTE 1—By mutual agreement between supplier and purchaser, analy- flux is tested as specified in 13.3.6, the test paper will show no
sis may be required and limits established for elements or compounds not chlorides or bromides by a color change of the paper to
specified in Table 1. off-white or yellow white.

2
 TABLE 1 Solder Compositions - wt% (range or maximum)
Composition, %A Melting RangeB
Alloy Sn Pb Sb Ag Cu Cd Al Bi As Fe Zn Ni Se Solidus Liquidus UNS
Grade 1 2 3 4 5 6 7 8 9 10 11 12 13 Number
°F °C °F °C
Section 1: Solder Alloys Containing Less than 0.2 % LeadC
Sn96 Rem 0.10 0.12 3.4–3.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 ... ... 430 221 430 221 L13965
max
Sn95 Rem 0.10 0.12 4.4–4.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 ... ... 430 221 473 245 L13967
Sn94 Rem 0.10 0.12 5.4–5.8 0.08 0.005 0.005 0.15 0.05 0.02 0.005 ... ... 430 221 536 280 L13969
Sb5 94.0 min 0.20 4.5-5.5 0.015 0.08 0.005 0.005 0.15 0.05 0.04 0.005 ... ... 450 233 464 240 L13950
ED Rem 0.10 0.05 0.25–0.75 3.0–5.0 0.005 0.005 0.02 0.05 0.02 0.005 ... ... 440 225 660 349 L13935
HAD Rem 0.10 0.5–4.0 0.1–3.0 0.1–2.0 0.005 0.005 0.15 0.05 0.02 0.5–4.0 ... ... 420 216 440 227 L13955
HBD Rem 0.10 4.0–6.0 0.05–0.5 2.0–5.0 0.005 0.005 0.15 0.05 0.02 0.01 0.05–2.0 ... 460 238 660 349 L13952
HND Rem 0.10 0.05 0.05–0.15 3.5–4.5 0.005 0.005 0.15 0.05 0.02 0.005 0.15-0.25 440 225 660 350 L13933
ACD Rem 0.10 0.05 0.2–0.3 0.1–0.3 0.005 0.005 2.75– 0.05 0.02 0.005 0.001 ... 403 206 453 234 L13964
3.75
OAD Rem 0.2 0.05 0.09–0.10 2.8–3.2 0.005 0.005 0.9–1.1 0.05 0.04† 0.005 ... ... 420 216 460 238 L13937
AM Rem 0.10 0.8–1.2 0.4–0.6 2.8–3.2 0.005 0.005 0.15 0.05 0.02 0.005 ... ... 430 220 446 230 L13938
TC Rem 0.20 0.05 0.015 4.0–5.0 0.005 0.005 0.05 0.05 0.04 0.005 0.005 0.04– 419 215 660 350 L13931
0.20
WS Rem 0.10 1.0–1.5 0.2–0.6 3.5–4.5 0.005 0.005 0.02 0.05 0.02 0.005 ... ... 440 225 660 350 L13939
Section 2: Solder Alloys Containing Lead
Sn70 69.5–71.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 361 183 377 193 L13700
Sn63 62.5–63.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 361 183 361 183 L13630
Sn62 61.5–62.5 Rem 0.50 1.75–2.25 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 354 179 372 189 L13620
Sn60 59.5–61.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.03 0.02 0.005 ... 361 183 374 190 L13600
Sn50 49.5–51.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 ... 361 183 421 216 L55031
Sn45 44.5–46.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.025 0.02 0.005 ... 361 183 441 227 L54951

3
Sn40A 39.5–41.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 460 238 L54916
Sn40B 39.5–41.5 Rem 1.8–2.4 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 448 231 L54918
Sn35A 34.5–36.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 447 247 L54851
Sn35B 34.5–36.5 Rem 1.6–2.0 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 470 243 L54852
Sn30A 29.5–31.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 491 255 L54821
B 32 – 00e1

Sn30B 29.5–31.5 Rem 1.4–1.8 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 482 250 L54822
Sn25A 24.5–26.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 511 266 L54721
Sn25B 24.5–26.5 Rem 1.1–1.5 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 365 185 504 263 L54722
Sn20A 19.5–21.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 361 183 531 277 L54711
Sn20B 19.5–21.5 Rem 0.8–1.2 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 363 184 517 270 L54712
Sn15 14.5–16.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 437 225 554 290 L54560
Sn10A 9.0–11.0 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 514 268 576 302 L54520
Sn10B 9.0–11.0 Rem 0.20 1.7–2.4 0.08 0.001 0.005 0.03 0.02 0.02 0.005 ... 514 268 570 299 L54525
Sn5 4.5–5.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 586 308 594 312 L54322
Sn2 1.5–2.5 Rem 0.50 0.015 0.08 0.001 0.005 0.25 0.02 0.02 0.005 ... 601 316 611 322 L54210
Ag1.5 0.75–1.25 Rem 0.40 1.3–1.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 ... 588 309 588 309 L50132
Ag2.5 0.25 Rem 0.40 2.3–2.7 0.30 0.001 0.005 0.25 0.02 0.02 0.005 ... 580 304 580 304 L50151
Ag5.5 0.25 Rem 0.40 5.0–6.0 0.30 0.001 0.005 0.25 0.02 0.02 0.005 ... 580 304 716 380 L50180
A
For purposes of determining conformance to these limits, an observed value or calculated value obtained from analysis shall be rounded to the nearest unit in the last right-hand place of figures used in expressing
Contact ASTM International (www.astm.org) for the latest information.

the specified limit, in accordance with the rounding method of Practice E 29.
B
Temperatures given are approximations and for information only.
C
For alloys not identified, named elements shall conform to the following tolerances (wt%): >5% 60.5%, >=5% 60.25%; Impurity elements (maximum): Sn-0.2, Pb-0.2, Sb-0.5, Ag-0.015, Cu-0.08, Cd-0.005, Al-0.05,
Bi-0.15, As-0.02, Fe-0.02, Zn-0.005.
D
Grades E and OA are covered by U.S. patents held by Engelhard Corp, Mansfield, MA, and Oatey Co. Cleveland, OH respectively. Federated Fry Metals, Altoona, PA and Taracorp Inc, Atlanta, GA have applied for
patents on grades AC and TC respectively. Grades HA, HB, and HN are covered by patents assigned to J. W. Harris Co., Cincinnati, OH. Interested parties are invited to submit information regarding identification of
acceptable alternatives to these patented items to the Committee on Standards, ASTM Headquarters, 100 Barr Harbor Drive, West Conshohocken, PA 19428. Your comments will receive careful consideration at a meeting
NOTICE: This standard has either been superceded and replaced by a new version or discontinued.

of the responsible technical committee, which you may attend.

† OA value for Fe 10 was corrected editorially.
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
TABLE 2 Form 9.2 Wire solder (solid and flux-cored)—The dimensions and
Symbol Form unit weight of wire solder are specified in 5.1.3 and 5.1.4. The
B Bar tolerance on the specified outside diameter shall be 65 % or
I Ingot 60.002 in. (0.05 mm), whichever is greater.
P Powder
R Ribbon
9.3 Other Forms:
S SpecialA 9.3.1 Dimensions for ribbon and special forms will be
W Wire agreed upon between supplier and purchaser.
A
Includes pellets, preforms, etc. 9.3.2 The unit weight of solder paste is specified in 5.1.4.

TABLE 3 Flux Type 10. Workmanship, Finish, and Appearance

Symbol Description 10.1 All forms of solder must be processed in such a manner
S Solid, no flux as to be uniform in quality and free of defects that will affect
R Rosin, nonactivated life, serviceability, or appearance.
RMA Rosin, mildly activated
RA Rosin, activated
OA Organic, water-soluble 11. Sampling
OS Organic, organic solvent-soluble (other than R, RMA, or RA)
IS Inorganic acids and salts 11.1 Care must be taken to ensure that the sample selected
for testing is representative of the material. The method of
sampling consists of one of the following methods:
TABLE 4 Core Condition and Flux Percentage 11.1.1 Samples taken from the final solidified cast or fabri-
Condition cated product.
Condition
Symbol 11.1.2 Representative samples obtained from the lot of
D Dry powder molten metal during casting. The molten sample is poured into
P Plastic a cool mold, forming a bar approximately 1⁄4 in. (6.4 mm)
Percentage
Flux Percentage by Weight thick.
Symbol
11.2 Frequency of Sampling—Frequency of sampling for
Nominal Min Max determination of chemical composition shall be in accordance
1 1.1 0.8 1.5
2 2.2 1.6 2.6 with Table 7. For spools and coils, the sample is obtained by
3 3.3 2.7 3.9 cutting back 6 ft (1.8 m) of wire from the free end and then
4 4.5 4.0 5.0 taking the next 6 ft for test. In other forms, an equivalent
6A 6.0 5.1 7.0
A
sample is selected at random from the container.
Not applicable to flux types R, RMA, and RA.
11.3 Other Aspects of Sampling—Other aspects of sampling
conforms in the case of bar and ingots, to Practice E 88. For
TABLE 5 Powder Mesh Size and Flux Percentage
fabricated solders the appropriate reference is Practice E 55.
Size Symbol Powder Mesh Size
A <325 12. Specimen Preparation
B <200
C <100 12.1 Flux-Cored Ribbon and Wire Solder and Solder
Percentage Symbol Flux Percentage by Weight Paste—Each sample of flux-cored ribbon or wire solder or
Min Max
solder paste is melted in a clean container under oil and mixed
1 1 5 thoroughly. After the flux has risen to the top, the alloy is
2 6 10 poured carefully into a cool mold (care should be taken to
3 11 15
4 16 20
allow the flux and alloy to separate completely), forming a bar
5 21 25 approximately 1⁄4in. (6.4 mm) thick. The bar is cleaned of flux
6 26 30 residue and sampled for analysis as specified in 12.3.
7 >30
12.1.1 Flux Extraction Procedure:
12.1.1.1 Flux-Cored Solder—The flux core is extracted as
8.2.4 Copper Mirror Test—When tested as specified in follows: Cut a length of the flux-cored solder weighing
13.3.7, the extracted flux will have failed the test if, when approximately 150 g and seal the ends. Wipe the surface clean
examined against a white background, complete removal of the with a cloth moistened with acetone. Place the sample in a
copper film is noted, as evidenced by the white background beaker, add sufficient distilled water to cover the sample, and
showing through, and must be rejected. Discoloration of the boil for 5 to 6 min. Rinse the sample with acetone and allow to
copper due to a superficial reaction or to only a partial dry. Protecting the solder surface from contamination, cut the
reduction of the thickness of the copper film is not cause for sample into 3⁄8-in. (9.5 mm) (maximum) lengths without
rejection. crimping the cut ends. Place the cut lengths in an extraction
tube of a chemically clean soxhlet extraction apparatus and
9. Dimensions and Unit Weight extract the flux with reagent grade, 99 % isopropyl alcohol
9.1 Bar and Ingot Solder—The dimensions and unit weight until the return condensate is clear. The resistivity of water
of bar and ingot solder will be as agreed upon between supplier extract, copper mirror, and chlorides and bromides tests are
and purchaser. performed using a test solution prepared by concentrating the

4
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
TABLE 6 Requirements for Flux
Test Type R Type RMA Type RA Other Flux Types Method Section
Weight of flux see Table 4 see Table 4 see Table 4 see Table 4 13.3.1
Solder poolA see 8.2.1 see 8.2.1 see 8.2.1 see 8.2.1 13.3.2
Spread factorB 80 min 80 min 80 min not required 13.3.3
DrynessC see 8.2.2 see 8.2.2 see 8.2.2 not required 13.3.4
Resistivity of water extract 100 000 min 100 000 50 000 not required 13.3.5
(V·cm)
Chlorides and bromidesD see 8.2.3 see 8.2.3 not required not required 13.3.6
Copper mirrorE pass pass not required not required 13.3.7
A
Applicable only to composition 60/40.
B
Applicable only to composition 60/40 in the form of flux-core wire or solderpaste.
C
Applicable only to composition 60/40 in the form of flux-core wire.
D
Applicable only to flux-core wire and solderpaste.
E
Applicable only to flux-core wire.

TABLE 7 Frequency of Sampling drillings are clipped into pieces not over 1⁄2 in. (12.7 mm) in
Size of Lot, lb (kg)
Number of Samples (spools, length and mixed thoroughly. The specimen consists of not less
coils, containers or pieces) than 5 oz (143 g).
Up to 1000 (450), incl 3
Over 1000 to 10 000 (450 to 4500), incl 5
Over 10 000 (4500) 10
13. Test Methods
13.1 Visual and Dimensional Examination:
13.1.1 Ribbon and Wire Solder (Solid and Flux-Cored)—
solids content in the flux extract solution to approximately Ribbon and wire solder must be examined to verify that the
35 % by weight by evaporation of the excess solvent. The exact dimensions, unit weight, and workmanship are in accordance
solids content of the test solution are determined on an aliquot, with the applicable requirements.
dried to constant weight in a circulating air oven maintained at 13.1.2 Solder Paste— Solder paste must be examined for
85 6 3°C. smoothness of texture (no lumps), caking, drying, unit weight,
12.1.1.2 Solder Paste— The flux is extracted as follows: and workmanship in accordance with the applicable require-
Place 200 mL of reagent grade, 99 % isopropyl alcohol in a ments.
chemically clean Erlenmeyer flask. Add 40 6 2 g of solder
13.1.3 Bar and Ingot Solder—Bar and ingot solder must be
paste to the flask, cover with a watch glass, and boil for 10 to
examined to verify that the unit weight, marking, and work-
15 min using medium heat. Allow the powder to settle for 2 to
manship are in accordance with the applicable requirements.
3 min and decant the hot solution into a funnel containing filter
paper, collecting the flux extract in a chemically clean vessel. 13.2 Alloy Composition—In case of dispute, the chemical
analysis is made in accordance with Test Methods E 46,
NOTE 2—The solution in isopropyl alcohol does not necessarily have to Method E 51, and Methods E 87.
be clear. The resistivity of water extract and chlorides and bromides tests
shall be performed using a test solution prepared by concentrating the 13.3 Flux:
solids content in the flux extract solution to approximately 35 % by weight 13.3.1 Determination of Weight Percent of Flux:
by evaporation of the excess solvent. The exact solids content of the test 13.3.1.1 Select a minimum of 20 g of flux-core ribbon or
solution shall be determined on an aliquot, dried to constant weight in a wire or solder paste. Weigh the sample in a clean porcelain
circulating air oven maintained at 85 6 3°C.
crucible determining the weight to the nearest 0.01 g. Heat
12.2 Solid Ribbon and Wire Solder—Each sample of solid until the solder is completely molten. Carefully stir the molten
ribbon and wire solder is prepared in accordance with 12.1, as solder a few times to free any entrapped flux. Allow the solder
applicable. to cool until it solidifies; clean thoroughly of flux residues and
12.3 Bar and Ingot Solder—Each sample piece is cut in half reweigh the solder.
and one half marked and held in reserve. The remaining half is 13.3.1.2 Calculation— Calculate the weight percent of flux
melted in a clean container, mixed thoroughly and poured into as follows:
a cool mold, forming a bar approximately 1⁄4 in. (6.4 mm)
C2S
thick. Sampling is performed by one of the following methods: F 5 C 3 100 (1)
12.3.1 Sawing—Saw cuts are made across the bar at equal
intervals of not more than 1 in. (2.5 cm) throughout its length.
If it is impractical to melt the bar or ingot as specified above, where:
saw cuts are made across each piece at equal intervals of not F = weight percent of flux,
more than 1 in. (2.5 cm) throughout its length. No lubricants C = initial weight of solder sample, g, and
are used during sawing. The specimen consists of not less than S = final weight of solder sample, g.
5 oz (143 g) of mixed sawings. 13.3.2 Solder Pool (applicable only to composition 60/
12.3.2 Drilling—The bar is drilled at least halfway through 40)—For each sample being tested, three coupons 1.5 in. (38
from two opposite sides. A drill of about 1⁄2 in. (12.7 mm) in mm) square shall be cut from 0.063 in. (1.6 mm) thick sheet
diameter is preferred. In drilling, the holes are placed along a copper. For flux Type IA only, the coupons shall be cut from
diagonal line from one corner of the pig to the other. The cold-rolled commercial sheet steel, approximately 0.063 in.

5
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
thick. The coupons are degreased by immersion in trichloroet- all coupons being at the same level. At the end of 6 min, the coupons are
hylene or other suitable short-chain solvent. Both surfaces of removed from the oven and allowed to cool. Excess flux residue is
each coupon are cleaned to a bright finish, using a 10 % removed by washing with alcohol. The height, H, of the solder spot is
measured to the nearest 0.001 cm, and the results averaged. An amount of
fluoroboric acid dip. The coupons are washed with tap water solder paste equal to the total weight of solder paste on the five coupons
and dried thoroughly with a clean cloth. Approximately 0.2 g is melted in a small, porcelain combustion boat on a hot plate. The molten
of flux-core ribbon or wire or approximately 2 g of solder paste solder is stirred several times to free any entrapped flux. After cooling, the
is placed in the center of each coupon. (The area of the solder solder slab is removed from the boat, the excess flux removed by washing
paste must not exceed that of a 0.375 in. (9.5 mm) diameter with alcohol, and the loss of weight in water determined to the nearest
circle.) The solder is melted in an oven maintained at 315 6 0.001 g.
15°C. The solder pool is visually examined for thickness of 13.3.3.3 Calculation— The loss in weight of the solder slab
edge. When the test is completed, each coupon is inspected for in water is divided by five. This is the volume, V, of the solder
evidence of spattering of flux. to the nearest 0.001 cm3. The diameter, D, of the equivalent
13.3.3 Spread Factor (applicable only to composition Sn60, sphere is 1.2407 3 = V . The spread factor is calculated in
flux Types R, RMA, and RA in the form of flux-core wire or accordance with the following formula:
solder paste): Spread factor ~%! 5 ~D 2 H!/D 3 100 (2)
13.3.3.1 Preparation of Coupon—Five coupons 2 in. (12.9
cm2) square are cut from 0.005 in. (0.13 mm) thick electrolytic 13.3.4 Dryness (applicable only to composition Sn60, flux
copper sheets. The coupons are cleaned in a 10 % fluoroboric Types R, RMA, and RA in the form of flux-core wire) —The
acid dip. One corner of each coupon is bent upwards to permit dryness test is performed on samples prepared in accordance
handling with tweezers. The coupons are not handled with bare with 13.3.3.1 and 13.3.3.2(a) except that after heating the
hands. The coupons are vapor-degreased and then oxidized for coupons in the oven, the flux residue is not removed. The
1 h in an electric oven at 150 6 5°C for testing of flux Types coupons are allowed to cool for 1⁄2 h. Powdered chalk is dusted
R and RMA and 205 6 5°C for testing of flux Types RA. All onto the surface of the residual flux and the ability to remove
coupons must be at the same level in the oven. All coupons are the chalk from the surface of the flux by light brushing is
removed from the oven and placed in tightly closed glass observed.
bottles until ready for use. 13.3.5 Resistivity of Water Extract (applicable only to flux
Types R, RMA, and RA)—The resistivity of water extract is
13.3.3.2 Procedure:
determined using the flux test solution. Five watch glasses and
(a) Flux-Cored Wire—Ten or more turns of 0.063-in. five acid/alkali resistant, tall form graduated beakers are
(1.6-mm) diameter flux-cored solder are tightly wrapped thoroughly cleaned by washing in hot water detergent solution,
around a mandrel. The solder is cut through with a sharp blade rinsing several times with tap water followed by at least five
along the longitudinal axis of the mandrel. The rings are slid off rinses with distilled water. CAUTION—All beakers must be
the mandrel and the helix removed by flattening each ring. The covered with the watch glasses to protect the contents from
diameter of the mandrel must be of such a size so as to produce contaminants. The beakers’ dimensions are such that when the
a ring weighing 0.500 6 0.025 g. Ten rings are prepared. A conductivity cell is immersed in 50 mL of liquid contained
solder ring is placed in the center of each one of the five therein, the electrodes are fully covered. Each cleaned beaker
coupons. The coupons are placed horizontally on a flat oxi- is filled to the 50 mL mark with distilled water. The beakers are
dized copper sheet in a circulating–air oven at 205 6 5°C for immersed in a water bath maintained at 23 6 2°C. When
6 min + 10 s, with all coupons being at the same level. At the thermal equilibrium is reached, the resistivity of the distilled
end of − 0, 6 min, the coupons are removed from the oven and water in each beaker is measured at this temperature with a
allowed to cool. Excess flux residue is removed by washing conductivity bridge using a conductivity cell with a cell
with alcohol. The height, H, of the solder spot is measured to constant of approximately 0.1. The resistivity of the distilled
the nearest 0.001 cm, and the results averaged. Five additional water in each beaker must not be less than 500 000 V·cm. If
solder-ring specimens are melted together in a small, porcelain the resistivity of the water in any beaker is less than 500 000
combustion boat on a hot plate. The molten solder is stirred V·cm, the complete process above must be repeated. Two of
several times to free any entrapped flux. After cooling, the these beakers are retained as controls. Add 0.1006 0.005 cm3
solder slab is removed from the boat, the excess flux removed of the flux test solution to each of the other three beakers by
by washing with alcohol, and the loss of weight in water means of a calibrated dropper or microlitre syringe. The
determined to the nearest 0.001 g. heating of all five beakers is started simultaneously. As the
(b) Solder Paste—The coupons are removed from the contents of each beaker comes to a boil, the boiling time is for
bottles and weighed to the nearest 0.001 g. A metal washer with 1 min followed by quick cooling of the beakers, to the touch,
an internal diameter of 0.250-in. (6.4-mm) is placed in the under running tap water or by immersing in ice water. The
center of each coupon and each opening is filled with solder cooled, covered beakers are placed in a water bath maintained
paste. The excess solder paste is wiped off the washer using a at 23 6 2°C. When the thermal equilibrium is reached, the
spatula and then the washer is removed carefully. The coupons resistivity in each of the five beakers is determined at this
with solder paste are reweighed to the nearest 0.001 g. temperature as follows:
NOTE 3—The thickness of the washer is such that the solder weighs 13.3.5.1 Thoroughly wash the conductivity cell with dis-
from 0.45 to 0.55 g. The coupons are placed horizontally on a flat oxidized tilled water and immerse it in the water extract of one sample.
copper sheet in a circulating–air oven at 205 6 5°C for 6 min + 10 s, with Make instrument reading.

6
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
13.3.5.2 Thoroughly wash conductivity cell in distilled –standard flux does not comply with 8.1.2, the test must be
water and immerse in a water control. Make instrument repeated using a new copper mirror.
reading. 13.4 Powder Mesh Size (applicable only to solder paste)—
13.3.5.3 Thoroughly wash conductivity cell in distilled Place 200 mL of reagent grade, 99 % isopropranol in a
water and immerse in a water extract. Make instrument chemically clean beaker. Add 40 6 2 g of solder paste to the
reading. beaker, cover with a watch glass and boil for 10 to 15 min
13.3.5.4 Thoroughly wash conductivity cell in distilled using medium heat. Allow the powder to settle for 2 to 3 min
water and continue measuring resistivities of the remaining and decant the hot solution. Wash the powder with isopropra-
control and water extract. nol until all of the flux is removed. Replace isopropanol with
deionized or distilled water for solder pastes containing a
13.3.5.5 The resistivity of each of the controls must not be
water–soluble flux base. Completely dry the solder powder at
less than 500 000 V·cm. If the control value is less than
110°C (230°F) so that all particles are separated. A minimum
500 000 V·cm, it indicates that the water was contaminated
of 80 % of the powder must pass through the appropriate size
with water–soluble ionized materials and the entire test must be
sieve (see 4.1.5) in order to be classified for that mesh size.
repeated. The mean of the specific resistivities of the water
extracts of the flux must be calculated.
14. Inspection
13.3.6 Chlorides and Bromides Test (applicable only to flux
Types R and RMA)—One drop of the flux test solution 14.1 Unless otherwise specified in the contract or purchase
(approximately 0.05 mL/drop) is placed on a small dry piece of order, the supplier is responsible for the performance of all
silver chromate test paper. The drop shall remain on the test inspection requirements as specified herein. Except as other-
paper for 15 s prior to immersing the test paper in reagent grade wise specified in the contract or order, the supplier may use his
99 % isopropyl alcohol for 15 s to remove residual organic own or any other facilities suitable for the performance of the
materials. The test paper is dried for 10 min. The test paper is inspection requirements specified unless disapproved by the
visually examined for color change. purchaser. The purchaser reserves the right to perform any of
the inspections set forth in the specification where such
13.3.7 Copper Mirror Test (applicable only to flux Types R inspections are deemed necessary to ensure supplies and
and RMA in the form of flux-core wire): services conform to prescribed requirements.
13.3.7.1 Preparation of the Control-Standard Flux—A 14.1.1 Test Equipment and Inspection Facilities—Test and
control-standard flux is prepared by using 35 % weight of measuring equipment and inspection facilities of sufficient
Grade WW gum rosin conforming to Test Methods D 509 accuracy, quality, and quantity to permit performance of the
dissolved in reagent grade 99 % isopropyl alcohol. required inspection must be established and maintained by the
13.3.7.2 Preparation of Copper Mirror—A copper mirror supplier.
consists of a vacuum–deposited film of pure copper metal on
one surface of a flat sheet of clear, polished glass. The 15. Rejection and Rehearing
thickness of the copper film must be uniform and must permit
15.1 Material that fails to conform to the requirements of
10 6 5 % transmission of normal incident light of 5000 Å units
this specification may be rejected. Rejection must be reported
as determined with any suitable standard photoelectric spec-
to the producer or supplier promptly and in writing. In case of
trophotometer. To prevent oxidation of the copper mirror, it is
dissatisfaction with the results of the test, the producer or
recommended that the mirrors be stored in closed containers supplier may make claim for a rehearing.
which have been flushed with nitrogen. Immediately prior to
testing, the copper mirror is immersed in a 5 % solution of
16. Certification
ethylene diamine tetra acetic acid or similar chelating agent for
copper oxide, rinsed thoroughly in running water, immersed in 16.1 When specified in the purchase order or contract a
clean ethyl or methyl alcohol, and dried with clean, oil-free air. producer’s or supplier’s certification must be furnished to the
The copper film is examined in good light. The copper mirror purchaser that the material was manufactured, sampled, tested,
is acceptable if no oxide film is visible and the copper film and inspected in accordance with this specification and has
shows no visible damage. been found to meet the requirements. When specified in the
13.3.7.3 Procedure—Approximately 0.05 mL of the flux purchase order or contract, a report of the test results must be
test solution and 0.05 mL of the control–standard flux is placed furnished.
adjacent to each other on the face of a flat, vacuum–deposited
copper mirror. The dropper must not be permitted to touch the 17. Product Marking
copper surface, and the mirror is protected at all times from 17.1 The producer’s name or trademark must be stamped or
dirt, dust, and fingerprints. The mirror is placed in a horizontal cast on each bar or ingot. The alloy grade designation or
position at 23 6 2°C and 50 6 5 % relative humidity in a nominal composition, or both, must be stamped on each bar or
dust–free cabinet for 24 6 1⁄2 h. At the end of the 24-h storage ingot for identification along with the specification number.
period, the test flux and the control standard flux are removed 17.2 Each spool or container must be marked to show the
by immersing the copper mirror in clean isopropyl alcohol. The specification number, type designation, dimensions, and unit
clean mirror is examined visually for compliance of the test weight of wire or other form and lot number. The producer’s
flux and the control–standard flux with 8.1.2. If the control- name or trademark must be marked on the spool or container.

7
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
18. Packaging and Package Marking marking for shipment of such material must be in accordance
18.1 The material must be packaged to provide adequate with Fed. Std. No. 123 for civil agencies and MIL–STD–129
protection during normal handling and transportation. The type for military agencies.
of packaging and gross weight of containers will, unless 18.2 Each shipping container must be marked with the
otherwise agreed upon, be at the producer’s or supplier’s purchase order number, unit weight, and producer’s name or
discretion, provided that they are such as to ensure acceptance trademark.
by common or other carriers for safe transportation to the
delivery point. 19. Keywords
18.1.1 For bar and ingot solder a lot number must be marked 19.1 bar; flux; flux cored solder; ingot; lead–silver alloys;
on each shipping container or inside package. lead–tin alloys; lead–tin–silver alloys; powder; ribbon; solder
18.1.2 When special preservation, packaging and packing alloy; solder metal; solder uses; tin–antimony alloys; tin–cop-
requirements are agreed upon between purchaser and supplier, per alloys; tin–silver alloys; wire

ANNEX

(Mandatory Information)

A1. INTENDED USE

A1.1 Alloy Compositions: A1.1.12 Sn35B—This is the customary wiping or plumber’s

A1.1.1 Sn96—This is a special–purpose solder with a solder. Higher antimony content in wiping solders promotes
higher joint strength than tin–lead solders. It is intended for use fine grain size and greater strength.
in the food processing industry because of its nontoxic char- A1.1.13 Sn30A—This alloy is used as an automobile–body
acteristic. It also provides a fairly good color match to stainless solder and for removing heat–strippable insulation during high
steel. temperature (700 to 900°F) tinning of wires.
A1.1.2 Sn95, Sn94, E, AC, AM, and WS—These alloys are A1.1.14 Sn30B—This alloy is used as an automobile–body
intended for use in soldering medical components and jewelry solder for filling dents and seams.
applications, for joining copper pipe and tube intended for A1.1.15 Sn25A and Sn25B— These alloys are for uses
potable water systems, and for applications in the food indus-
similar to that for alloy Grades Sn20 and Sn30.
try. These alloys display excellent wetting and exhibit rela-
tively high heat resistance. A1.1.16 Sn20A—This is an automobile–body solder with a
A1.1.3 Sn70—This is a special–purpose solder where a high lower antimony content than alloy Sn20B.
tin content is necessary. It is often used for soldering zinc and A1.1.17 Sn20B—This is widely used automobile–body sol-
for coating metals. der for filling dents and seams, and for general purposes such
A1.1.4 Sn63—This tin–lead eutectic solder is commonly as protective coatings on steel sheet where a high tin content
used for soldering printed circuit boards where temperature alloy is not required.
limitations are critical and in applications where an extremely A1.1.18 Sn15—This alloy is used for coating and joining
short melting range is required. metals.
A1.1.5 Sn62—This is a special–purpose solder widely used A1.1.19 Sn10A—This alloy is used for coating and joining
for soldering silver coated surfaces. metals, and where soldered connections will be exposed to
A1.1.6 Sn60—Similar to Sn63, this solder is preferred for high operating temperatures exceeding 400°F (204°C).
soldering electrical and electronic connections and for coating A1.1.20 Sn10B—Similar to Sn10A, this alloy minimizes the
metals.
leaching of silver from silver alloy coated surfaces. It is used in
A1.1.7 Sn50—This general purpose alloy can be used for hybrid microelectronic and automotive electronic applications
non-critical electrical soldering and applications such as join-
where a high service temperature is encountered.
ing sheet metal, pipe, tubing and other structural shapes.
A1.1.8 Sn45—This is a general purpose alloy similar to A1.1.21 Sn5—This alloy is used for coating and joining
Sn50. metals, and where soldered connections will be exposed to
A1.1.9 Sn40A—This alloy can be used for the same pur- high operating temperatures exceeding 475°F (246°C). Its
poses as alloy Sn50, but it is not as workable in bit soldering wetting ability is not as good as Sn10A.
or sweating. It is frequently used for dip soldering and as a A1.1.22 Sn2—This alloy has been used to solder automo-
wiping solder for joining lead pipes and cable sheaths. bile radiator cores.
A1.1.10 Sn40B—This alloy is similar to Sn40A, but it is not A1.1.23 Sb5—This alloy is used for electrical and elec-
recommended for use on galvanized iron. tronic connections subjected to peak temperatures of approxi-
A1.1.11 Sn35A—This is a plumber’s solder similar to alloy mately 465°F. It is also used for sweating of copper tubing in
Sn35B but with a lower antimony content. solar heating, plumbing and refrigeration equipment.

8
 NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.

B 32 – 00e1
A1.1.24 Ag1.5—This alloy is used interchangeably with or cadmium, or zinc–coated or cadmium-coated iron or steel.
alloy Ag2.5, but has a better shelf life and does not develop a These intermetallic alloys have high melting points which
black surface deposit when stored under humid environmental inhibit the flow of the solder, resulting in brittle joints.
conditions.
A1.1.25 Ag2.5—The alloy is for use on copper, brass and A1.3 Flux Type :
similar metals with torch heating. It requires the use of a flux A1.3.1 Type R—Type R is intended for use in the prepara-
having a zinc chloride base to produce a good joint on untinned tion of soldered joints for high reliability electrical and
surfaces. A rosin flux is unsatisfactory on untinned surfaces. electronic applications.
This alloy is susceptible to corrosion under humid environmen- A1.3.2 Type RMA—Type RMA provides a slightly more
tal conditions. active fluxing action than Type R and is intended for similar
A1.1.26 Ag5.5—This alloy will develop a shearing strength uses.
of 1500 psi at 350°F (177°C). When soldering hard–drawn A1.3.3 Type RA—Type RA provides more active fluxing
brass or copper, the application temperature should not exceed action than Type RMA. It should be used for soldering joints
850°F (454°C). A typical application is on thermocouples for which are readily accessible so that the residues can be
aircraft engines where relatively high operating temperatures removed by cleaning agents and procedures commonly used in
will not affect strength of the solder. Precautions noted for industry. Since the fumes and particulates given off during
Ag2.5 also apply. soldering may be corrosive and contaminate the area surround-
A1.1.27 HA and OA—A lead-free solder for joining copper ing the joint, this too must be susceptible to effective cleaning
plumbing systems. It has a lower melting temperature than by the combination of materials and procedures to be used.
Grade Sb5 and is suitable for filling connections with wider There are many standard electrical soldering applications that
clearances. use this type of flux.
A1.1.28 HN, HB and TC— A lead-free solder for joining A1.3.4 Type OA—Type OA is used for general soldering
copper plumbing systems. This solder has a wide liquidus/ purposes on copper, nickel, brass, etc. Some fluxes of this type
solidus range making it useful for filling solder connections can be used for electrical and electronic soldering applications
that have wide clearances. It can also be used where service but complete removal of flux is necessary after soldering to
conditions require a solder with a higher melting temperature. prevent corrosion and current leakage.
A1.3.5 Type OS—Type OS has uses similar to Type OA.
A1.2 Soldering of Zinc and Cadmium—In as much as zinc A1.3.6 Type IS—Type IS is intended for use, exclusive of
and cadmium appear to form intermetallic alloys with the that in electrical or electronic circuits, in the preparation of
antimony in the solder, compositions Sn40B, Sn35B, Sn30B, mechanical and structural joints for all solderable metals, other
Sn25B, Sn20B and Sb5 should not be used for soldering zinc than aluminum, magnesium and their alloys.

ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentioned
in this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the risk
of infringement of such rights, are entirely their own responsibility.

This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years and
if not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standards
and should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of the
responsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you should
make your views known to the ASTM Committee on Standards, at the address shown below.

This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,
United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the above
address or at 610-832-9585 (phone), 610-832-9555 (fax), or [email protected] (e-mail); or through the ASTM website
(www.astm.org).