Internship Report

6/6/2019 Untitled document - Google Docs
Flex
Internship report
Flex India
Plot 3,Phase II,SIPCOT
Industrial Estate Sandavellur C village,
Sriperumbudur,Tamil Nadu 602106
NAME:Kusuma Nara
COLLEGE:SASTRA Deemed
University,Thanjavur,Tamil Nadu.
https://docs.google.com/document/d/1QdwYptFd2ZVx7wv2cCYB4e3eIcQIRIk_t2V7wY2FYtU/edit 1/40
CONTENTS
● ABOUT
● OBSERVATIONS
WHAT IS FLEX?
SKETCH TO
SCALE. DTA UNIT
1)SMT
2)XIAOMI TESTING
3)MOTOROLA BACKEND PROCESSING
4)HUAWEI BACKEND
PROCESSING SEZ UNIT
1)B1B
2)B400
3)B402
● ACKNOWLEDGMENT
ABOUT
An mnc company previously known as Flextronics
International ltd.It was founded on september 25,1969
by Joe Mckenzie and Barbara Ann Mckenzie,with its
headquarter situated in singapore,consisting of about
200,000 employees.
OBSERVATIONS
(WHAT IS FLEX)
Flex is a sketch to scale solutions provider that designs
and builds products to for a better connected world.It
delivers innovative designs,supply chain and services
to companies of all levels and endmarkets.
The company has adopted these values to
define themselves:
● Intense collaboration-it's simply teamwork,together
as a team with its employees it stands as a leading
company.
● Passionate customer focus-focusing for the
immense satisfaction of the customers,to reach their
expectations.
● Thoughtful, fast, disciplined execution-with proper

discipline and making thoughts run fast through their
system to find out the best ways to solve problems.
● Tenacious commitment to continuous
improvement-always making itself improve by
competing itself and bring itself upto the mark.
● Relentless drive to win-having that
relentless potential and desire to win.
(SKETCH TO SCALE)
The design developed by the customers is given to
the company for their development into an outraging
product.They develop required products for other
companies.
The company develops products for a variety of other
sectors which include:
Industries,Automotive,Building and
construction,Cloud,communication,Consumer,Digital
health,Energy,Health solutions,Lighting,Mechanical power.
Every company has and must have these three features to
run a company successfully-
Speed,scope,scale.
And the rest is about the company's guidelines for their
managers to do.
( What is ESD and its safety measures)

ESD-Electrostatic discharge is the sudden flow of
electricity between two electrically charged objects
caused by contact, an electrical short, or dielectric
breakdown. A buildup of static electricity can be caused
by electrostatic induction
All materials (insulators and conductors alike) are sources
of ESD. They are joined together in what is known as the
triboelectric series, which defines the materials
associated with positive or negative charges. Positive
charges accumulate on human skin . Negative charges
are more common to synthetic materials . The amount of
electrostatic charge that can accumulate on any item is
dependent on its capacity to store a charge. For example,
the human body can store a charge equal to 250
picofarads.
ESD is a tiny version of lightning. As the current flows

through an object, it's seeking a low impedance path to
ground to equalize potentials. In most cases, ESD currents
will travel to ground via the metal chassis frame of a
device. However, it's well known that current will travel on

every available path. In some cases, one path may be
between the PN junctions on integrated circuits to reach
ground. This current flow will burn holes visible to the
naked eye in an integrated circuit, with evidence of heat
damage to the surrounding area. One ESD event will not
disrupt equipment operation. However, repeated events
will degrade equipment's internal components over time.
Preventions:ESD coats and slippers should be
used.Gloves,stretchers,wristbands should be used.The
ground in the ESD area is placed with a mat which has two
sides,one side grounded and other side collects
charges..All the charges are neutralised by a
neutraliser.The PCB units should not be held with bare
hands and also not on the middle ,they should be held at
the ends with proper gloves.
DTA UNIT
(SMT-SURFACE MOUNT TECHNOLOGY)
The main pcb’s(printed circuit boards) are
manufactured here with proper operating machines.
The detailed process is expressed as follows(same

procedure for all smb units,here the process is detailed
by taking the jio model phone)-
● First the boards are given a barcode by the laser

machine for future purposes like tracking and their
checkings in their initial or final stages of
formation.(NOTE-the printed boards and all the
raw materials are provided by the customer.)
Coming to the main smt process where the

components are mounted onto the surface of
the board the following is detailed process.
● The boards are fitted in the pcb panel using a

keplon tape which is done manually by the workers
wearing proper gloves,wristbands,stretchers.
● PRINTING-The board is forwarded to the printing
machine where a stencil is provided by the customer is
placed inside the machine.A paste is used with consists
of the components tin,copper,silver and a flux is also
present.The paste is applied by the machine on to the
stencil which is printed on the pcb.The solder(for the
materials to settle) is being done automatically by the
machine without human effort.
● SOLDER PASTE INSPECTION-solder paste
efficiency is checked.A certain percentage is given
by the operator is the efficiency is less or more than
that limit than the board is cleaned and the printing
process is done again.
Defects may be-excessive/insufficient

paste,position,shape,bridge,upper/lower
height,heigh/less area,coplanarity etc,.
● PICK AND PLACE-Reels are loaded into the
machine (the reels are provided by the customer as
stated before).These reels contain the essential
components which include diodes,resistors,charger
pin,sim placing kit,leds etc,.The materials are
placed by the machine by the process of suction
pull technology.
● PRE AOI(AUTOMATED OPTICAL INSPECTION)-In
this process the board is inspected by the machine
regarding the well placement of the components.
Defects may be-pad overhang,solder
fillet,coplanarity,bridging,dimensions,missing/upsided
own placement of components,foreign materials etc,.
● REFLOW OVEN-There four zones in the oven
which are named as 1 .preheat~the pcb is brought
to equilibrium temperature slowly as the sudden
changes may affect the less resistant components
of the pcb.
2.soaking ~the solder paste is heated in a way

that the components fit into the pcb.
3.peak~the components are fit properly as the paste
melts.
4.freezing~as the paste melts and the components fix

in the pcb in this stage the temperature is decreased
suddenly to solidify the paste as the components mount
to the pcb and hence the components fix perfectly onto
the pcb.
● POST AOI(AUTOMATED OPTICAL INSPECTION)-

This is the inspection done once the pcb is passed
through the oven.The proper fixation of the
components is checked automatically by the
machine.Defects may be- misplacement,spread of
paste,elevation etc,.
● FVMI(FINAL VISUAL MANUAL INSPECTION)-

Manually the entire pcb is checked for any
misplacements or upliftments etc,.
Defects may be-( major defects)diodes
misplaced/broken/ elevated,improper shields,broken
antenna/ mike,USB,led,battery,tombstone,capacitor
etc,.
● Finally the pcb (which is usually a set of four) is
divided into single units automatically by a
machine.The shields are covered with metal shield
covers and the thermostat is also covered by a
pad(the process is generally known as thermal
heat padding)
● At last a final inspection is run manually and defects
are depicted.The major defects being the damage
of diodes due manual pressure on the pcb while
shield covering or the antenna breakage.
All the final pcb units are collected and proceeded

to testing unit for further processes like software
downloading and assembling.
(Jio TESTING)
Once the SMT process is complete, the PCBs are sent for
software testing.There are 4 different stages which each
PCB would have to go through before it can be packed
and sent where it can be used for mobile phones.
○ SOFTWARE DOWNLOADING-Before the

boards come to this stage they come after
AOI.The parts are checked again for errors.The
OS is fed on the board by scanning the barcode
and placing it in a machine which installs the
software on the pcb.The software downloading
consists of 36 different functions and a cycle
time of 1.35-2 secs.
○ PSN(PRODUCT SERIAL NUMBER)-In this stage
the product serial number(PSN)for each PCB is
checked.A software program called ‘MAGIC BOX’

is used to check the boards and pass them before
they go to the next stage.In case of an error which
is generally called the QLIB ERROR then the
PCB is scanned again properly.
○ CALIBRATION TEST-The calibration test is used
to check whether the PCB is getting connected to
mobile network or not and also if the functions of
the PCB are working properly.This is most
important stage of the software testing process.If
there is an error in this stage then there are two
things which can be done, they are:(Analyse the
board for any error, if it’s a soldering error or if
there are any missing components, send it to the
rework team for rectification)/(if it’s an error
regarding the functioning of the components, then
it has to be sent to the debug team for them to
rectify the errors.)
○ FUNCTIONAL TEST-In this stage all the

functions of the mobile phone are
checked: 1)charger
2)headset
3)SIM
4)SD Card
5)bluetooth
6)Wi-fi
7)LED’s
8)vibrator
9)speaker/receiver .
The most common failures are SIM Card and

SD Card failures.In that case the board is sent
back for rework.
(XIAOMI TESTING)
The process is almost same for XIAOMI as
that of JIO.It also has 4 stages:
● SOFTWARE DOWNLOADING-The OS is
downloaded and installed in the pcb.The PCB
is checked manually again for any damaged
parts or components this is known as DL.The
second part of this process is
MBT(MOTHERBOARD TESTING).It is used
to check the battery level and temperature for
the proper functioning of the board.These are
two processes in this stage.
● CALIBRATION-Functions such as
internet,gps,gsm and wifi are tested.In case
of any error the boards are sent to the
debug station for rectification.
● RADIOFREQUENCY-Functions such as
voice recording and voice note is checked by
using the principle of radiofrequency.RF is
defined as a frequency or a band of

frequencies in the range 10^4 to
10^11,suitable for use in
telecommunications.If the pcb passes this
stage then it is sent for the final test
where they are tested before packing .
● WBT(WI-FI BLUETOOTH TEST)-Functions
like bluetooth and wifi is tested.After this the
boards are manually inspected one last
time and they are packed at last.
(Motorola mobile backend processing)
The back surfaces,front glass surfaces,lenes all of

them are provided by the customer.The following are
the processes that take place.
● Banana peeling and LDA inspection, barcode
scanning- in this step the back cover provided by the
customer is inspected for any scratches or no

labelled covers and a barcode label is printed.
● Assemble MIC sleeve and pasting the waterproof
sticker and pasting the copper foil-the components
are placed by hand manually.The copper foil is a
connector to the main and sub pcb.
● Assemble the side key FPC(flexible printed cable)-
The side button which we feel in the mobile are due
to this setup where the buttons are attached and this
is set into the back cover.
● Assemble the volume key and a support for
these cables to be held in the back cover.
● Sub PCB inspection-The sub pcb is inspected for
any misplacements or any damaged components.
● RF(radiofrequency)cable is attached and a
waterproof label is stuck on the sub pcb.
● Put the vibrator and assemble it to the lower
antenna bracket.
● Assemble the sub pcb with an antenna support.
● Again the first stage that is the banana peeling

and main pcb inspection is done.
● Loud speaker gasket is placed and waterproof label
is sticked i.e, for the loudspeaker unit.
● Flash gasket and loudspeaker gasket-2 is placed.
● Assemble the front camera and earphone rubber
into the pcb.
● PCB track ID is pasted and camera rubber into the
front case and the pcb is assembled into the unit
and screwed.
● Lock the antenna support screw and the inspection
of the FPC cable on the pcb and the side keys are
inspected.
● Paste a keplon tape on key connector and
assemble RF cable into PCBA.
● Assemble the rear camera and paste the film
conductive cloth and board to board(BTB)
connectors are pressed properly.
● Current test and lcd test is done.
● Assemble the battery and speaker and scan

the barcode.
● A machine is used to press the battery into the
unit called the battery roll press.
● Assemble the speaker FPC and paste the foam
and clean with ethanol on FPC metal contact point.
● Assemble front camera steel and paste the rear
flash lamp cover.
● Paste the camera deco and camera deco
grounding sponge.
● Paste the antenna bracket cooling film.
● Assemble the lens and close the back cover
and screw it up using a machine.
● Visual inspection is done in stages starting from
the screen display test and audio,receiving.
● Software is downloaded into the mobile phone after
the sim slot insertion and then again the
inspections are done.
● Finally the quality test is done the mobile phones
are packed.
(HUAWEI BACKEND PROCESSING)
The HUAWEI backend undergoes the following process
in order to manufacture the whole mobile unit.
● FH(front housing) inspection and proximity sensor

checking the FH for any bumps,scratches,gaps, dirt,
colour,missing pieces like multiplastics.Inspect
screw thread for no damage using magnifier.
● Side key assembly,it is because of this the sound
or the touch pressure is sensed by the finger on
pressing.
● Assemble receiver and vibrator,but before
placing these the liner should be removed and
then these should be placed.
● FH thermal gel application-in this for the
components not to get heated this gel is applied.
● PCBA inspection and barcode scanning.
● Sensor and Pcb is inserted into the FH.

● BTB connector to PCB is connected and
waterproof label is pasted.
● Front camera and rear camera assembly-they are
inserted very carefully by first inserting two lens into
a cupid and then that is inserted into the FH and later
the rear camera is inserted.
● The sub pcb is inspected.
● Usb rubber is assembled and the sub-pcb
is assembled into the FH.
● Fasten the RF heads to the usb sub board side
and sort the coaxial cable from the pcba side to the
usb sub board side.
● The battery is assembled and it is made to be fit in
by roll press machine.
● Speaker box is assembled and the main fpc
is assembled.
● Power test is done.
● BTB pressed by the machine and the battery is

pressed and the fingerprint FPC is assembled.The
machine presses the camera connectors.
● The antenna is assembled and the usb sub
board support is provided.
● The main pcb support is assembled.
● Auto screwing process takes place in two stages
and then their inspection takes manually.
● The FH pouch is removed and checked and
RH inspection and PCB inspection takes place.
● FPS(fingerprint sensor) is inspected.
● RH locking ,press and RH gap inspection is done.
● Sim card is inserted and it is switched
on.The protective back cover is placed.
● Inspection stage starts here which includes the
quality and working of the camera,audio
speaker,torch,receiver,mike.
● Later it is calibrated to check the light calibration.
● Visual inspection takes place.
● Later again automatic testing takes place of

the internal working systems like
camera,torch,audio,receiver etc,.
● Software is upgraded and the sim slot is inserted.
● After the software upgrading ,again the features are
tested manually like the audio,vibration,volume etc,.
● Battery cover film is pasted.
● The next stage again the FVMI(final visual
manual inspection).
● The logo of the company is detected by the
next machine.
● At last the mobile phone is packed into a box along
with other items like the charger,headsets etc,.
● And finally the total box is packed and sent
for delivery.
SEZ UNIT(SPECIAL ECONOMIC ZONE)
(B1B(iphone chargers))
This is the unit in which the iphone chargers are
manufactured,about 1600 chargers in an hour.
These are the following stages of the formation of

the charger.
● Manual inspection-the pcb arrives from the smt unit

and here the components are placed manually one
by one.The components are-
Inductor,Mosfet,Resistor,Capacitor,transformer.
● The resistor before insertion is bend and taped to
one of its sides,also the mosfet is taped to ignore
conduction from other sides.
● Wave soldering-In this step the pcb after fixing with all
the components is allowed to pass through a
chamber which solders at the components,but before
soldering the pcb in the chamber is passed through
higher temperatures as the sudden high temperature
of the solder may damage the components.
● MI components touch up-In this the manual inspection

takes place and the regions where the soldering is not
done completely or proper is again soldered manually.
● Lead cutting-The extra parts of the resistors are
cut down manually.
● Camera visual inspection-The pcb is inspected
again by scanning it with a camera and inspecting it.
● Router -The two primary and the secondary pcb’s
are connected and placed in a router,before placing
the two wires are kept out for them to get soldered.
● Calibration test-the capacitor and resistors capacity
is checked
● In the router the wires are soldered and 777 glue
is applied to the housing(top cap) and the UV glue
is applied to the wires to make them stick properly.
● Later the unit is sent into automachine 2 where the
top is fitted into the unit and the charger body is
formed later the barcode is printed inside the
adaptor point and the logo of the company is printed.
● The chargers are manually inspected and then

they are kept in the burn chamber to check the
charger working efficiency in the outside
temperature by keeping a temperature of about 27
degrees to 30 degrees.
● Then a voltage of about 5 volts is passed through the
charger and the current is checked and if it's up to the
required amount then it is proceed for further process.
● The charger is inspected and packing is started.
● All the packed units are placed into a big carton
box and delivered.Randomly 5 chargers of any box
are taken and tested,if any error occurs then the
whole magazine is again tested from the beginning.
(B400(iphone chargers))
• IC programming
• Apply EP909 glue to PCB
• Curing oven
• EP909 glue visual inspection
• Auto load PCB to W/S pallet.
• Apply RTV glue in between main header and PCB.
• L101 auto performing and insertion
• CY101 auto performing and insertion
• CY 102 auto performing and insertion
• Visual inspection for L101, CY101, CY102
• Apply UV glue to fix L101 with main header
and curing
• Visual inspection for RTV(room temperature
vulcanizing) on L101 and under T101
• T101 auto performing and insertion
• C104 auto performing and insertion
• Visual inspection for V cap, T101, C103, C104
• CMC101 auto performing and insertion
• Visual inspection for T101, C103, C104,
C204, CMC104
• Scan PCBA barcode and W/S top catch
• Flux machine: it adds flux to the PCB
Wave soldering: After the connections of all the

components are done then the PCBs board is kept in
wooden panel board and then flux is added to the PC
boards and the wooden panel board is sent to the wave
soldering machine where the conveyor belt is in an
aligned form and the machine has different temperature
levels from (100c-265c) and at the end of this step the
PCBs are removed from the wooden panel board.
• Loading C103 UV glue top hat
• Apply UV glue between C103 and main leading
and curing
• Remove UV top heat, scan panel 2D and W/S pallet
• Turn over PCBA by fixture
• Touch screen inspection
• Print 2D label and stick on TCB
• Manual load PCBA is carried in 1
• PCBA component board height measurement
• INT test : integrated circuit test
• Router
• Router unloading
• Visual inspection for router
• Visual inspection for RTV glue bottom
• Auto assemble bottom insulator
• Apply UV glue on bottom insulator
• Auto load for height measurement
• Bottom insulator height measurement
• Change fixture dispensing manually
• Apply UV glue to interlock and curing
• Apply RTV to PCBA side
• Apply RTV to HSG side B
• Apply RTV to CMC side
• Apply RTV to HSG sidewall
• Replace reflow cap to USB-C plug transfer 2D

label from PCBA to housing PCBA insertion depth
measurement
• Apply RTV between HSG, C103,C204
• Manual gluing then it is send to go or not
go inspection
• CCD inspection
• Pre-align PCBA position
• Remove the 2D label from PCBA
• CAP assay
• Check and press cap
• USW
• Remove the USB alignment plug and cap film
• Cosmetic inspection: check any defects in the
housie like scratches and marks
• Gap step
• USB-C location depth system measurement
• Wrap protective film to cap
• Manual loading in UTF
• Auto loading
• Pre ATE
• Burn in chamber: chargers kept for 90-120 min
to check the temp levels they can withstand
• Hi-pot
• Final ATE
• Serial number printing and verification
• Auto unloading unit to fixture
• Peel of film for laser
• UV art work marking out loading
• Laser marking check
• Cosmetic check for laser check work
• Peel of protective film
• Cleaning unit
• Visual inspection
• ARJO wrapping
• Cosmetic inspection
• packing in units.
(B402(NEW MODEL IPHONE CHARGERS))
The pcba is brought from the smt unit and then
assembling of components is done by the automachines.
The components that are assembled are

CY101,CMC101(choke coil),T101(step
down transformer),C103,C104,C215,C204.
The assembly and the manufacturing of the unit is done
as follows:
● AUTO CCG3-programs are inserted into the IC by

this automachine.
● Load panel pallet and scan panel,link 2D panel.
● Auto application of 6101 glue to pcba in to stages.
● Insertion of an insulator(bulk cap insulator).
● Visual inspection for the bulk cap insulation.
● Auto performing CY101-the CY101 component is
placed by the automachine in the specified location.
● Visual inspection for CY101.
● Insert CMC101(choke coils).
● RTV(room temperature vulcanization)glue is
applied on the cap insulator.
● Visual inspection for the RTV glue on the
cap insulator.
● Auto performing C103(capacitor)-the capacitor

is placed on the cap insulator.
● Visual inspection.
● C104 is placed on the cap insulator,as the cap
insulator has four holes two of them are used by the
C103 component and the other two holes are used
by the C104 component to get fixed.
● Visual inspection for C104 and C103.
● Later the step down transformer T101 is placed
on the pcba.
● Visual inspection of the placement of T101.
● C215 is inserted by the automachine.
● Insert the isolated fixture and the top catch.
● Fluxer machine-flux is added to the pcba for
easy soldering of the components.
● Wave soldering-in this stage the pcba is passed
through certain temperatures and in the last zone
the mercury metal which is melted is used as the
solder for the components.
● Auto unloading by the automachine and 2D label

is scanned.
● CCD inspection(cosmetic camera device)-using
the camera all the pcba boards are inspected.
● Visual inspection.
● Loading and the integrated circuit test is done.
● Depaneling of the 10 pcba units into single units.
● Visual inspection for any improper cutting.
● Loading the pcbs for the application of 6101 glue.
● The barcode is scanned and the fixture barcode
is linked.
● Auto application of 6101 glue to pcba at the
bottom side.
● Assembling the stiffener to the pcba bottom.
● Glue curing in auto oven,this glue is melt and
the components are stuck properly.
● The pcba is transferred from oven to RTV.
● The UV(ultra violet)glue is applied by the
automachine on C104and between the bulk cap
and CMC header.
● Visual inspection of the proper placement of the glue.

● RTV glue is applied to the stiffener and between
C103 and stiffener.
● Application of RTV glue is done on the pcba
topside and on C215.
● Visual inspection of the proper application of the
glue in proper and designated positions.
● On the pcba the z axis height is measured by
the machine.
● RTV on the pcba is enclosed and the stiffener
is enclosed.
● Visual inspection of the enclosure.
● Auto load of the outer housing by the automachine
on the pcba.
● The 2D label is peeled off.
● Assembly of the outer housing is done properly.
● Visual inspection of the outer housing placement.
● The USB is replaced by USW.
● The protection film is peeled off manually.
● The USB C-depth is measured if it is nearer to

the specified measurement then it is passed.
● The gap at the cable joining point is measure
which should be very less.
● Cosmetic station-1-The unit is inspected for any kind
of scratches or any black dots and they are cleaned.
● A protective film is placed.
● Auto loading hipot-the voltages of 240V is given
and the output voltage is checked.Generally the
output voltage should be 5V.
● Auto pre ate-the programs in the pcba is checked.
● Burn in(35 degrees)-for checking its capacity in
higher temperatures.
● Hipot test- again the voltage is supplied and
the output voltages are checked.
● Final ate-in this again all the programmes
are checked.
● SN program verification.
● B402 autoload out after test.
● Peel off protective film before UV laser.
● Art work is done,that is the company logo is printed.

● Auto load out after laser marking.
● The barcode is scanned and it is printed out.
● The unit is cleaned.
● Cosmetic station-2-in this, the unit is inspected for
any black dots and cleaned by a particular solution.
● A protective film A and B(ARJO) is wrapped to
the two parts of the charger.
● Then the packing is done with a per hour
production of about 1447 as their target.
ACKNOWLEDGEMENT:
THIS IS THE REPORT ON MY OBSERVATIONS OF

THE PROCESSES TAKING PLACE FOR THE
MANUFACTURING OF DIFFERENT TYPES OF
CHARGERS AND DIFFERENT MOBILE PHONE
MODELS.
THE END

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6/6/2019 Untitled document - Google Docs

● Thoughtful, fast, disciplined execution-with proper

( What is ESD and its safety measures)

ESD is a tiny version of lightning. As the current flows

device. However, it's well known that current will travel on

(SMT-SURFACE MOUNT TECHNOLOGY)

The main pcb’s(printed circuit boards) are

manufactured here with proper operating machines.

The detailed process is expressed as follows(same

● First the boards are given a barcode by the laser

Coming to the main smt process where the

● The boards are fitted in the pcb panel using a

Defects may be-excessive/insufficient

changes may affect the less resistant components

2.soaking ~the solder paste is heated in a way

4.freezing~as the paste melts and the components fix

● POST AOI(AUTOMATED OPTICAL INSPECTION)-

● FVMI(FINAL VISUAL MANUAL INSPECTION)-

All the final pcb units are collected and proceeded

○ SOFTWARE DOWNLOADING-Before the

the product serial number(PSN)for each PCB is

checked.A software program called ‘MAGIC BOX’

○ FUNCTIONAL TEST-In this stage all the

The most common failures are SIM Card and

The process is almost same for XIAOMI as

that of JIO.It also has 4 stages:

defined as a frequency or a band of

(Motorola mobile backend processing)

The back surfaces,front glass surfaces,lenes all of

● Banana peeling and LDA inspection, barcode

scanning- in this step the back cover provided by the

customer is inspected for any scratches or no

● Again the first stage that is the banana peeling

● Assemble the battery and speaker and scan

● Finally the quality test is done the mobile phones

(HUAWEI BACKEND PROCESSING)

The HUAWEI backend undergoes the following process

in order to manufacture the whole mobile unit.

● FH(front housing) inspection and proximity sensor

● Sensor and Pcb is inserted into the FH.

● BTB pressed by the machine and the battery is

● Later again automatic testing takes place of

SEZ UNIT(SPECIAL ECONOMIC ZONE)

This is the unit in which the iphone chargers are

manufactured,about 1600 chargers in an hour.

These are the following stages of the formation of

● Manual inspection-the pcb arrives from the smt unit

● MI components touch up-In this the manual inspection

● The chargers are manually inspected and then

• Apply EP909 glue to PCB

• EP909 glue visual inspection

• Auto load PCB to W/S pallet.

• Apply RTV glue in between main header and PCB.

• L101 auto performing and insertion

• CY101 auto performing and insertion

• CY 102 auto performing and insertion

• Visual inspection for L101, CY101, CY102

• Apply UV glue to fix L101 with main header