4 HS3AB - HS3MB

Taiwan Semiconductor

3A, 50V - 1000V High Efficient Surface Mount Rectifier

FEATURES KEY PARAMETERS
● Low power loss, high efficiency PARAMETER VALUE UNIT
● Low forward voltage drop IF(AV) 3 A
● Low profile package
VRRM 50 - 1000 V
● Fast switching for high efficiency
● Ideal for automated placement IFSM 100 A
● Glass passivated junction chip TJ MAX 150 °C
● Fast switching for high efficiency
Package DO-214AA (SMB)
● Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC Configuration Signal Die
● Halogen-free according to IEC 61249-2-21

APPLICATIONS
● Switching mode power supply (SMPS)
● Adapters
● Monitor
● TV

MECHANICAL DATA
● Case: DO-214AA (SMB)
● Molding compound meets UL 94V-0 flammability rating
● Moisture sensitivity level: level 1, per J-STD-020
● Packing code with suffix "G" means green compound
(halogen-free)
● Part no. with suffix “H” means AEC-Q101 qualified DO-214AA (SMB)
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
● Polarity: As marked
● Weight: 0.093 g (approximately)

ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)

HS HS HS HS HS HS HS HS
PARAMETER SYMBOL UNIT
3AB 3BB 3DB 3FB 3GB 3JB 3KB 3MB
HS HS HS HS HS HS HS HS
Marking code on the device
3AB 3BB 3DB 3FB 3GB 3JB 3KB 3MB
Repetitive peak reverse voltage VRRM 50 100 200 300 400 600 800 1000 V
Reverse voltage, total rms value VR(RMS) 35 70 140 210 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 300 400 600 800 1000 V
Forward current IF(AV) 3 A
Surge peak forward current, 8.3 ms
single half sine-wave superimposed on IFSM 100 A
rated load per diode
Junction temperature TJ - 55 to +150 °C
Storage temperature TSTG - 55 to +150 °C

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THERMAL PERFORMANCE
PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient thermal resistance RӨJA 60 °C/W

ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)

PARAMETER CONDITIONS SYMBOL TYP MAX UNIT
HS3AB V
HS3BB V
- 1.0
HS3DB V
HS3FB V
(1)
Forward voltage per diode IF = 3A,TJ = 25°C VF
HS3GB - 1.3 V
HS3JB V
-
HS3KB 1.7 V
HS3MB V

(2)
TJ=25°C IR - 10 μA
Reverse current @ rated VR per diode
TJ = 100°C IR - 250 μA
HS3AB - pF
HS3BB - pF
HS3DB 80 - pF
HS3FB - pF
Junction capacitance 1 MHz, VR=4V CJ
HS3GB - pF
HS3JB - pF
HS3KB 50 - pF
HS3MB - pF
HS3AB ns
HS3BB ns
HS3DB - 50 ns
HS3FB IF=0.5A , IR=1.0A ns
Reverse recovery time trr
HS3GB IRR=0.25A ns
HS3JB ns
HS3KB - 75 ns
HS3MB ns
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms

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ORDERING INFORMATION
PART NO. PACKING PACKING CODE
PART NO. PACKAGE PACKING
SUFFIX CODE SUFFIX(*)
R5 SMB 850 / 7" Plastic reel
HS3xB R4 SMB 3,000 / 13" Paper reel
H G
(Note 1)
M4 SMB 3,000 / 13" Plastic reel
Note:
1. "x" defines voltage from 50V (HS3AB) to 1000V (HS3MB)
*: Optional available

EXAMPLE P/N
PART NO. PACKING PACKING CODE
EXAMPLE P/N PART NO. DESCRIPTION
SUFFIX CODE SUFFIX
AEC-Q101 qualified
HS3ABHR5G HS3AB H R5 G Green compound

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CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)

Fig1. Forward Current Derating Curve Fig2. Typical Junction Capacitance

3.5 175
AVERAGE FORWARD CURRENT (A)

3 150

2.5 125

CAPACITANCE (pF)
2 100
HS3AB-HS3GB
1.5 75

1 50

HS3JB-HS3MB
0.5 RESISTIVE OR 25
INDUCTIVE LOAD
0 0
0 25 50 75 100 125 150 175 0.1 1 10 100 1000

LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V)

Fig3. Typical Reverse Characteristics Fig4. Typical Forward Characteristics

1000 100 10
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)

TJ=125°
UF1DLW
100 1

10 TJ=125°C
HS3AB-HS3DB TJ=25°C
0.1
10

(A)
TJ=25°C
0.01
1 HS3GB
1
Pulse width
0.001
0.3 0.4 0.5 0.6 0.7 0.8 HS3JB-HS3MB
0.9 1 1.1 1.2
0.1 0.1
0 20 40 60 80 100 120 140 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8

PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FORWARD VOLTAGE (V)

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Fig5. Maximum Non-repetitive Forward Surge Current

150
PEAK FORWARD SURGE URRENT(A)

8.3ms Single Half Sine Wave

100

50

0
1 10 100 1000

NUMBER OF CYCLES AT 60 Hz

Fig6. Reverse Recovery Time Characteristic And Test Circuit Diagram

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PACKAGE OUTLINE DIMENSIONS

DO-214AA (SMB)

Unit (mm) Unit (inch)

DIM.
Min Max Min Max
A 1.95 2.20 0.077 0.087
B 4.05 4.60 0.159 0.181
C 3.30 3.95 0.130 0.156
D 1.95 2.65 0.077 0.104
E 0.75 1.60 0.030 0.063
F 5.10 5.60 0.201 0.220
G 0.05 0.20 0.002 0.008
H 0.15 0.31 0.006 0.012

SUGGESTED PAD LAYOUT

Symbol Unit (mm) Unit (inch)

A 2.3 0.091
B 2.5 0.098
C 4.3 0.169
D 1.8 0.071
E 6.8 0.268

MARKING DIAGRAM

P/N = Marking Code

G = Green Compound
YW = Date Code
F = Factory Code

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Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.

Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.

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