LG 24mn42 Ch. lm93b 125
LG 24mn42 Ch. lm93b 125
LG 24mn42 Ch. lm93b 125
LED LCD TV
SERVICE MANUAL
CHASSIS : LM93B
CONTENTS . ............................................................................................. 2
SPECIFICATION ....................................................................................... 6
Copyright © LG Electronics. Inc. All rights reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright © LG Electronics. Inc. All rights reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 2. After removing an electrical assembly equipped with ES
manual and its supplements and addenda, read and follow the devices, place the assembly on a conductive surface such as
SAFETY PRECAUTIONS on page 3 of this publication. aluminum foil, to prevent electrostatic charge buildup or expo-
NOTE: If unforeseen circumstances create conflict between the sure of the assembly.
following servicing precautions and any of the safety precautions 3. Use only a grounded-tip soldering iron to solder or unsolder ES
on page 3 of this publication, always follow the safety precautions. devices.
Remember: Safety First. 4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as “anti-static” can generate
General Servicing Precautions electrical charges sufficient to damage ES devices.
1. Always unplug the receiver AC power cord from the AC power 5. Do not use freon-propelled chemicals. These can generate
source before; electrical charges sufficient to damage ES devices.
a. Removing or reinstalling any component, circuit board mod- 6. Do not remove a replacement ES device from its protective
ule or any other receiver assembly. package until immediately before you are ready to install it.
b. Disconnecting or reconnecting any receiver electrical plug or (Most replacement ES devices are packaged with leads electri-
other electrical connection. cally shorted together by conductive foam, aluminum foil or
c. Connecting a test substitute in parallel with an electrolytic comparable conductive material).
capacitor in the receiver. 7. Immediately before removing the protective material from the
CAUTION: A wrong part substitution or incorrect polarity leads of a replacement ES device, touch the protective material
installation of electrolytic capacitors may result in an explo- to the chassis or circuit assembly into which the device will be
sion hazard. installed.
2. Test high voltage only by measuring it with an appropriate CAUTION: Be sure no power is applied to the chassis or circuit,
high voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged replace-
Do not test high voltage by "drawing an arc". ment ES devices. (Otherwise harmless motion such as the
3. Do not spray chemicals on or near this receiver or any of its brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity suf-
4. Unless specified otherwise in this service manual, clean ficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10 % (by volume) Acetone and 90 % 1. Use a grounded-tip, low-wattage soldering iron and appropriate
(by volume) isopropyl alcohol (90 % - 99 % strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500 °F to 600 °F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500 °F to 600 °F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500 °F to 600 °F)
Some semiconductor (solid-state) devices can be damaged eas- b. First, hold the soldering iron tip and solder the strand against
ily by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors component lead and the printed circuit foil, and hold it there
and semiconductor “chip” components. The following techniques only until the solder flows onto and around both the compo-
should be used to help reduce the incidence of component dam- nent lead and the foil.
age caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. Alter- splashed solder with a small wire-bristle brush.
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
Copyright © LG Electronics. Inc. All rights reserved. -4- LGE Internal Use Only
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IC Remove/Replacement 3. Solder the connections.
Some chassis circuit boards have slotted holes (oblong) through CAUTION: Maintain original spacing between the replaced
which the IC leads are inserted and then bent flat against the cir- component and adjacent components and the circuit board to
cuit foil. When holes are the slotted type, the following technique prevent excessive component temperatures.
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique Circuit Board Foil Repair
as outlined in paragraphs 5 and 6 above. Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
Removal board causing the foil to separate from or "lift-off" the board. The
1. Desolder and straighten each IC lead in one operation by following guidelines and procedures should be followed whenever
gently prying up on the lead with the soldering iron tip as the this condition is encountered.
solder melts.
2. Draw away the melted solder with an anti-static suction-type At IC Connections
solder removal device (or with solder braid) before removing To repair a defective copper pattern at IC connections use the
the IC. following procedure to install a jumper wire on the copper pattern
Replacement side of the circuit board. (Use this technique only on IC connec-
1. Carefully insert the replacement IC in the circuit board. tions).
2. Carefully bend each IC lead against the circuit foil pad and
solder it. 1. Carefully remove the damaged copper pattern with a sharp
3. Clean the soldered areas with a small wire-bristle brush. knife. (Remove only as much copper as absolutely necessary).
(It is not necessary to reapply acrylic coating to the areas). 2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
"Small-Signal" Discrete Transistor 3. Bend a small "U" in one end of a small gauge jumper wire and
Removal/Replacement carefully crimp it around the IC pin. Solder the IC connection.
1. Remove the defective transistor by clipping its leads as close 4. Route the jumper wire along the path of the out-away copper
as possible to the component body. pattern and let it overlap the previously scraped end of the
2. Bend into a "U" shape the end of each of three leads remaining good copper pattern. Solder the overlapped area and clip off
on the circuit board. any excess jumper wire.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding At Other Connections
leads extending from the circuit board and crimp the "U" with Use the following technique to repair the defective copper pattern
long nose pliers to insure metal to metal contact then solder at connections other than IC Pins. This technique involves the
each connection. installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement 1. Remove the defective copper pattern with a sharp knife.
1. Heat and remove all solder from around the transistor leads. Remove at least 1/4 inch of copper, to ensure that a hazardous
2. Remove the heat sink mounting screw (if so equipped). condition will not exist if the jumper wire opens.
3. Carefully remove the transistor from the heat sink of the circuit 2. Trace along the copper pattern from both sides of the pattern
board. break and locate the nearest component that is directly con-
4. Insert new transistor in the circuit board. nected to the affected copper pattern.
5. Solder each transistor lead, and clip off excess lead. 3. Connect insulated 20-gauge jumper wire from the lead of the
6. Replace heat sink. nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Diode Removal/Replacement Carefully crimp and solder the connections.
1. Remove defective diode by clipping its leads as close as pos- CAUTION: Be sure the insulated jumper wire is dressed so the
sible to diode body. it does not touch components or sharp edges.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Copyright © LG Electronics. Inc. All rights reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification
4.1. RGB-PC
No. Item Specification Remarks
1 Supported Sync. Type Separate Sync.(RGB), SOG
Horizontal 30 ~ 69 kHz
2 Operating Frequency Analog
Vertical 56 ~ 61 Hz
Max 1366×768 @ 60Hz
3 Operating Frequency Analog
Recommend 1366×768 @ 60Hz
4 Input Voltage Voltage :100 – 240 Vac, 50 or 60 Hz
5 Inrush Current Cold Start : 50 A, Hot : 120 A
Operating Condition Sync (H/V) Video LED Wattage
On/On Active 50(Max)
On mode Off
On/On Active 30(Typ.)
Power S/W On
6 Off/On
Sleep mode Off Blanking 1W RGB
On/Off
Just operate power key and remote
Power S/W Off Off mode - Off Red 0.5W
controller power button.
7 MTBF 30,000 HRS with 90 % Confidence level Lamp Life : 30,000 Hours(min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
Temp : 10 °C ~ 35 °C
9 Operating Environment
Humidity : 20 % ~ 80 %
Temp : -10 °C ~ 60 °C non condensing
10 Storage Environment
Humidity : 5 % ~ 90 % non condensing
Copyright © LG Electronics. Inc. All rights reserved. -6- LGE Internal Use Only
Only for training and service purposes
4.2. TV
No. Item Specification Remarks
1. Market Central and South America
2. Broadcasting system NTSC, PAL-M/N
BAND NTSC China(DK)
Available Channel VHF 2~13 VHF/UHF C1~C62
3.
(Revision 21: 10.12.08) UHF 14~69 VHF/UHF C1~C62
CATV 1~125 CATV S1~S41
4. Receiving system Upper Heterodyne
3 System(Rear) : NTSC, PAL-M,
5. CVBS Input (1EA) NTSC, PAL-M, PAL-N
PAL-N
6. RGB Input RGB-PC Analog(D-SUB 15Pin)
7. HDMI Input (1EA) HDMI-DTV HDMI version 1.3 ,Support HDCP
8. Audio Input (1EA) CVBS L/R Input
5. RGB Input ( PC )
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640*480 31.469 59.94 25.175
2 800*600 37.879 60.317 40.0
3 1024*768 48.363 60.0 65.0
4 1280*720 47.77 59.85 74.5
5 1152*864 54.34 60.05 80
6 1280*1024 63.981 60.02 108.0
7 1366*768 47.71 59.79 85.5
Copyright © LG Electronics. Inc. All rights reserved. -7- LGE Internal Use Only
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ADJUSTMENT INSTRUCTION
1. Application Range ■ Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction
This document is applied to LM93B chassis TV which is
manufactured in TV Factory or is produced on the basis of this (2) Confirmation
data. ■ W e confirm to address “0xF1” in page “0xBC” of
EEPROM the value is “0xAA” or not.
■ If the value is not “0xAA,” we adjust once more
■ W e can write the ADC values from “0x00~0x05”
2. Designation addresses in a page “0x0E”
(1) The adjustment is according to the order which is designated * Manual ADC process using Service Remocon. After enter
and which must be followed, according to the plan which Service Mode by pushing “ADJ” key, Execute “Auto-RGB”
can be changed only on agreeing. by pushing “►” key at “Auto-RGB.”
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run) 4. Adjustment items
Temperature : at 25 °C ± 5 °C 4.1. PCB assembly adjustment items
Relative humidity : 65 ± 10 % 4.1.1. Input Tool-Option, Area Option
Input voltage : 220 V, 60 Hz - Option adjustment following BOM (Tool Option, Area Option)
(6) A djustment equipments: Color Analyzer (CA-210 or (1) Required Equipments
CA-110), Pattern Generator (MSPG-925L or Equivalent), : Remote control for adjustment
DDC Adjustment Jig equipment, SVC remote control (2) Profile: Must be changed the option value because being
different with some setting value Depend on module
Case1 : Software version up maker, inch and market.
1. After downloading S/W by USB , TV set will reboot (3) Adjustment method
automatically. The input methods are same as other chassis. (Use
2. Push “In-stop” key. IN-START key on the Adjust Remote control.)
3. Push “Power on” key.
4. Function inspection OG<6K# # # OJG# # # P5575D#
Pdlq# # # Y4133# # # XWW# # # # [#
5. After function inspection, Push “In-stop” key. DGF0QJ# # # HGLG0QJ/#QJ# # # # # # #
Case2 : Function check at the assembly line #
Wrro#Rswlrq# # # # # # # # # # # # 54;7#
1. When TV set is entering on the assembly line, Push #
“In-stop” key at first.
Duhd#Rswlrq#
# # # # # # # # # # # # # # # # 4#
2. Push “Power on” key for turning it on. =
→ If you push “Power on” key, TV set will recover 1) Push the IN-START key in the Adjust R/C.
channel information by itself. 2) Input the Option Number that was specified in the BOM,
3. After function inspection, Push “In-stop” key. into the Shipping area.
3) Select “Tool Option/ Area Option” by using ▲/▼(CH+/-)
key, and press the number key(0~9) consecutively
Ex) if the value of Tool Option1 is 7, input the data using
3. ADC calibration number key “7” (If not changed the option, the input
menu can differ from the model spec.)
RGB * Refer to Job Expression of each main chassis ass'y
MSPG-925 series
Model : 60 (1024 X 768@ 60 Hz) (EBTxxxxxxxx) for Option value
Copyright © LG Electronics. Inc. All rights reserved. -8- LGE Internal Use Only
Only for training and service purposes
4.2. S/W program download 4.3.2. Download steps
(1) P rofile : This is for downloading the s/w to the flash (1) Execute ‘ISP Tool’ program in PC, then a main window will
memory of IC603. be opened
(2) Equipment
1) PC
2) MTK_tool program
3) Download jig
4) USB
(3) Connection structure
Download jig
Main kG
PC
B/D
4pin harness
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(5).Click “Upgrade” tab and set as below (1) RGB EDID Data
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6. Check of White Balance 7. Function Check
RGB_Gains are fixed data for each model. 7.1. Check display and sound
Insert D-sub jack (I2C) which is connected with PC ■ Check input and Signal items. (cf. work instructions)
for White Balance or equivalent device. 1. TV
→ Total Assembly line should be check whether the 2. AV (CVBS)
3. RGB (PC : 1920 x 1080 @ 60hz)(Display only)
color coordinate(x, y) data Refer to below table
4. HDMI
were meet or not.
* W/B condition
- Ambient Humidity : 20 % ~ 80 %
- Ambient Temperature : 25 ± 5 °C
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TROUBLE SHOOTING
1. NO POWER-Main PCBA
NO POWER
1 Is Adapter
NO check open or short at Line.
Output VOLTAGE 19.4V
or change Adapter.
through of JK700?
YES
YES
3
NO check the Lines of IC704,IC706
Is 5V at C716? If there is any problem at Line,
is 1.1V at C737? Change IC704,IC706.
YES
4
Check Line short or open between
NO
Check wavef orm of X600 IC600 and X600,
Change IC600 or change X600
YES
5
is 3.3V at 1pin of P200?
NO Change control
when push power key,
Or check Line short or open of P200
Is 0v at 4pin of P200?
YES
6
is there any waver at 3pin of P200, NO change IR board
when use remote controller? Or check Line short or open of P200
Insert F/W 4
X600
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2. No raster (Power LED blue, black screen)
NO RASTER
(Screen is not displayed)
YES
Check Line short or open between
2 Is 1.1V at L701? NO IV701/IC704 and IC600,
Is 3.3V at L712? If there is any problem at Line,
Change IC701/IC704 or change IC600
YES
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3. Abnormal/No screen (All input)-Main PCBA
Abnormal/No screen
(all input)
YES
If is not under 1.5V at R744,
change Q702 or check open and short
2 NO of Line among Q703 and Q702.
Is 5V at 1pin of P201? If is under 4.8V at L710,
Check open and short
Of line between L710 and P201.
YES
YES
Change module
WAVEFORMS
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4. Abnormal screen (TV)-Main PCBA
YES
If 4.9V is not at plus pin of L705, check
2 NO It is over 3V at 2pin of IC706,
Is 5V at 5pin of TU401? if it is not, Check Line between IC706
and IC600 is open or short.
Another is change IC706
WAVEFORMS
3 4
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5. Abnormal screen (AV)-Main PCBA
1 NO
Put into AV cable completely? Insult AV cable tight
YES
YES
YES
Change IC600
WAVEFORMS
3
R651 (CVBS)
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6. Abnormal screen (RGB PC)-Main PCBA
YES
YES
YES
Change IC600
WAVEFORMS
3
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7. Abnormal screen (HDMI)-Main PCBA
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8. No sound (all source )-Main PCBA
1
NO
Does wire connect P501 with speaker? Connect wire between P501 and speaker.
YES
If 8V is not plus at L703, check
2 of JK700 is open.
Is 19.4V at 2,34,40,44pin NO
If is not Check Line between L703
of IC502 ? and IC502 is open or short.
.Another is change IC502
YES
If 3V is not plus 13,27pin of IC502,
3 check It is over 3V at L501,L504,
NO
Is 3.3V at 13,27pin of IC502? if it is not, Check Line between L712
and IC502 is open or short.
Another is change IC701,IC502
YES
4
Check Line between IC502 and IC600
Is I2C wavef orm at NO
is open or short, Another is change
23,24pin of IC502?
IC502 or IC600.
YES
5 Check Line between IC501 and IC600
Is I2S wavef orm at NO
is open or short, Another is change
R510,R511,R512,R513? IC502 or IC600.
4 5
5 6
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9. Abnormal sound (TV)-Main PCBA
YES
If 4.9V is not at plus pin of L706, check
2 NO It is over 3V at 2pin of IC706,
Is 5V at 5pin of TU401? if it is not, Check Line between IC706
and IC600 is open or short.
Another is change IC706
WAVEFORMS
3 4
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10. Abnormal sound (AV)-Main PCBA
1 NO
Put into AV cable completely? Insult AV cable tight
YES
YES
Change IC600
WAVEFORMS
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11. Abnormal sound (HDMI)-Main PCBA
YES
YES
3 Can read EDID and Check Line between JK300 and IC600
HDCP key though is open or short, Another is
16,15pin of JK300 Change IC602 or HDMI cable
YES
YES
YES
Check Line between JK301 and IC600
6 Is wavef orm at R321,R322, NO
is open or short, Another is
R323,R324,R325,R326 Change HDMI cable
YES
Change IC600
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BLOCK DIAGRAM
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EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
910
400
535
LV1
A2
401
540
541
200
900
120
510
300
301
511
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Only for training and service purposes