Technical note

Distance image sensors

Contents
1. Features............................................................................................................................................ 2
2. Structure ........................................................................................................................................... 2
3. Operating principle ............................................................................................................................. 4
3-1. Phase difference (indirect) TOF (time-of-flight) ............................................................................... 4
3-2. Timing chart................................................................................................................................ 7
3-3. Charge drain function ................................................................................................................... 7
3-4. Non-destructive readout ............................................................................................................... 8
3-5. Subtracting signals caused by ambient light ................................................................................... 9
3-6. Calculating the frame rate .......................................................................................................... 10
4. How to use ...................................................................................................................................... 11
4-1. Configuration example ............................................................................................................... 11
4-2. Light source selection................................................................................................................. 11
5. Distance measurement examples ...................................................................................................... 11
5-1. Distance measurement (S11961-01CR, S12973-01CT) .................................................................. 11
5-2. Short distance measurement (S11961-01CR, S12973-01CT) .......................................................... 13
5-3. Improving the distance accuracy by averaging the measurement data ............................................ 14
5-4. Measuring the distance to a cylinder............................................................................................ 15
5-5. Distance measurement (using S11961-01CR, S12973-01CT) using pulse laser diode ........................ 17
5-6. Distance measurement (S11963-01CR) ........................................................................................ 18
5-7. Short distance measurement (S11963-01CR)................................................................................ 20
6. Calculating the incident light level...................................................................................................... 21
7. Calibration ....................................................................................................................................... 28
7-1. Calculating the sensitivity ratio (SR) ............................................................................................ 30
7-2. Linear range and nonlinear range ................................................................................................ 30
8. Characteristics ................................................................................................................................. 32
8-1. Light incident angle characteristics .............................................................................................. 32
8-2. Distance accuracy vs. incident signal level.................................................................................... 33
8-3. Temperature characteristics of distance accuracy .......................................................................... 34
9. Evaluation kit................................................................................................................................... 34
Distance image sensors are image sensors that measure the distance to the target object using the TOF
(time-of-flight) method. Used in combination with a pulse modulated light source, these sensors output phase
difference information on the timing that the light is emitted and received. The sensor signals are arithmetically
processed by an external signal processing circuit or a PC to obtain distance data.

1. Features

・ High-speed charge transfer

・ Wide dynamic range and low noise by non-destructive readout (S11961/S11963-01CR, S12973-01CT)
・ Built-in column gain amplifier (S11963-01CR)
Gain: × 1, × 2, × 4
・ Fewer detection errors even under fluctuating background light (charge drain function)
・ Real-time distance measurement

[Table 1-1] Product lineup

Type Linear Area
Type no. S11961-01CR S12973-01CT S11962-01CR S11963-01CR
Pixel height 50 m 40 m 30 m
Pixel pitch 20 m 22 m 40 m 30 m
Number of pixels 256 64 64 × 64 160 × 120
Video data rate 5 MHz 10 MHz

2. Structure

Distance image sensors consist of a photosensitive area, shift register, output buffer amplifier, bias generator,
timing generator, and so on. The block diagram is shown in Figure 2-1. Distance image sensors are different from
typical CMOS image sensors in the following manner.

・Pixel structure that allows high-speed charge transfer

・Outputs two phase signals representing distance information from two output terminals

Like a typical CMOS image sensor, the output signal from the photosensitive area is processed by the
sample-and-hold circuit or column gain amplifier circuit, scanned sequentially by the shift register, and read out as
voltage output.

2
[Figure 2-1] Block diagram
(a) S11961-01CR, S12973-01CT

Vdd(A) GND Vr Vsf Vpg

15 14 1 17 16

VTX3 2
VTX2 3 Bias
*
VTX1 4 generator
p_res 5

Vout1
13
phis 6 Sample & hold circuit
Vout2 CLA
12
Buffer amplifier
dclk CLA
mclk 7 9
Horizontal shift register
trig 8
10 11 CLD
Vdd(D) GND
* S11961-01CR: 272 pixels, number of effective pixels 256
S12973-01CT: 80 pixels, number of effective pixels 64

KMPDC0649EA

(b) S11962-01CR

GND Vdd(A) GND GND Vdd(A) VTX1 VTX2 VTX3 GND Vdd(A)
3 2 1 45 44 43 42 41 40 39
36 GND

33 Vdd(A)

32 GND

31 Vpg
Vertica l sh ift reg ister

Photodiode array 30 Vsf

72 × 72 pixels
(number of effective pixels: 29 Vr
64 × 64 pixels)

28 Vref
27 Vout1
ext_res 6
CDS circuit
reset 7 26 Vout2
Timing
vst 8 generator Buffer 25 GND
hst 10 amplifier
Horizontal shift register 23 Vdd(A)
mclk 11
22 GND
9 14 5 12 15 16 20 21
oe dclk dis_read GND GND Vdd(D) GND Vdd(D)
KMPDC0438EC

3
(c) S11963-01CR

CLTX CLTX CLTX

GND Vdd(A) GND Vdd_tx VTX1 VTX2 VTX3 GND GND GND GND Vdd_tx
3 2 1 44 43 42 41 40 39 38 37 36
35 sel2
34 sel1
33 sel0
Vertica l sh ift reg ister

Photodiode array 32 Vdd(A)

168 × 128 pixels 31 GND
(number of effective pixels:
160 × 120 pixels) 30 Vpg
29 Vref2
28 Vr
dis_read 4
27 Vref
ext_res 5
Column gain amplifier circuit 26 Vout1
reset 6
Timing
vst 7 generator 25 Vout2
hst 9 Buffer
Horizontal shift register 24 Vdd(A)
mclk 10 amplifier
23 GND
8 11 12 13 16 17 18 19 20
oe dclk GND Vdd(D) GND GND GND GND Vdd(D)

KMPDC0443ED

3. Operating principle

3-1. Phase difference (indirect) TOF (time-of-flight)

The timing chart of the photosensitive area of the distance image sensor is shown in Figure 3-1. Output voltages
Vout1 and Vout2 obtained by applying charge-to-voltage conversion on accumulated charges Q1 and Q2 based on
their integration capacitances Cfd1 and Cfd2 are expressed by equations (3-1) and (3-2).

Vout1 = Q1/Cfd1 = N × Iph × {(T0 - Td)/Cfd1} … (3-1)

Vout2 = Q2/Cfd2 = N × Iph × (Td/Cfd2) …(3-2)

Cfd1, Cfd2: integration capacitance of each output

N: charge transfer clock count
Iph: photocurrent
T0: pulse width
Td: delay time

Delay time Td when Cfd1=Cfd2 in equations (3-1) and (3-2) is expressed by equation (3-3).

Td = {Vout2/(Vout1 + Vout2)} × T0 … (3-3)

Using the values (Vout1, Vout2) output according to the distance, distance (L) is expressed by equation (3-4).

L = 1/2 × c × Td = 1/2 × c × {Vout2/(Vout1 + Vout2)} × T0 ･･･(3-4)

c: speed of light (3 × 108 m/s)

4
[Figure 3-1] Timing chart of photosensitive area

Pulsed light T0

Reflected light Td

VTX1 Q1

VTX2 Q2

KMPDC0470EA

The structure and surface potential of the photosensitive area of the distance image sensor are shown in Figure
3-2. Typical CMOS image sensors can be driven with a single power supply, but the transfer time needed for the
charge to move from the photosensitive area to the integration area is in the microsecond order. On the other
hand, high-speed charge transfer (nanosecond order) is possible on CCD image sensors, but they require multiple
voltage inputs including high voltage.
To achieve the high-speed charge transfer (several tens of nanoseconds) needed to acquire distance information,
we have developed a pixel structure that enables high-speed charge transfer like the CCDs in the CMOS process.
This has allowed distance image sensors to achieve the high-speed charge transfer needed for distance
measurement.
The number of electrons generated in each pulse emission is several e-. Therefore, the operation shown in Figure
3-2 is repeated several thousand to several tens of thousands of times, and then the accumulated charge is read
out. The number of repetitions varies depending on the incident light level and the required accuracy of distance
measurement.

5
[Figure 3-2] Structure and surface potential of photosensitive area
(a) VTX1: on, VTX2: off (in the case of Figure 3-1①)
VTX1 VTX2

Vpg

Cfd1 Cfd2

PG

Q1 Q2
- - - - - -

KMPDC0471EA

(b) VTX1: off, VTX2: on (in the case of Figure 3-1②)

VTX1 VTX2

Vpg

Cfd1 Cfd2

PG

Q1 Q2
- - - - - -

KMPDC0472EA

6
[Table 3-1] Distance measurement range and VTX1, VTX2, and light-emission pulse widths
Distance measurement range VTX1, VTX2,
max. light-emission pulse widths
(m) (ns)
4.5 30
6 40
9 60
Note: Light travels approximately 30 cm in 1 ns.

3-2. Timing chart

Figure 5-2 shows the timing chart for the S11963-01CR when a signal is read out twice in a frame. The first time,
the signal immediately after a pixel reset is read out, and the second time, the signal after signal integration is
read out. Pulse emission and signal integration are repeated in the period within the frame in Figure 3-3 (the
number of repetitions must be set according to the required distance accuracy). If you want to perform
non-destructive readout, repeat pulse emission, signal integration, and signal readout.

[Figure 3-3] Timing chart (S11963-01CR)

thp(ext_res) t2
ext_res
t1 t3 t17
t16 (reset level readout time) (integration time) t18 (integration signal readout time)

reset
t4 t5t6 t7

vst
t8 t9 t10 t11

hst 2 N 128 129 1 128 129

t12 t13 t14 t15
1 (1H) 2 (1H) N (1H) 128 (1H) 1 (1H) 128 (1H)

mclk
VTX1, 2, 3 t19 VTX enable t20

dis_read

Pulsed light
tpi(VTX)
thp(VTX1) tlp(VTX1)
VTX1
thp(VTX2) tlp(VTX2)
VTX2
thp(VTX3)
VTX3
tlp(VTX3)
VTX enable

KMPDC0444EB

3-3. Charge drain function

A distance image sensor has charge transfer gates (VTX1, VTX2), which transfer the charges that are generated at
the photosensitive area, and a charge drain gate (VTX3), which discharges unneeded charges. When VTX1 and
VTX2 are off and VTX3 is on, the charge drain function is turned on without the accumulation of signal charges.
This makes it possible to drain unneeded charges caused by ambient light during the non-emission period. The
charge drain function enables the following:

7
① Detection of high-speed pulses
Signal charges from pulse laser diodes and other high-speed pulse light sources can be integrated efficiently.
② Shutter operation

[Figure 3-4] Structure of photosensitive area

Charge drain mechanism

Vdd

VTX3

VTX1 VTX2

Vpg

Cfd1 Cfd2

PG

KMPDC0635EA

[Figure 3-5] Timing chart of photosensitive area

Light

tpi(VTX)

thp(VTX1) tlp(VTX1)
VTX1

thp(VTX2) tlp(VTX2)
VTX2

thp(VTX3)
VTX3
tlp(VTX3)

KMPDC0634EA

3-4. Non-destructive readout

If the incident signal is strong (the object is close and has high reflectance) or if the ambient light is strong, the
distance image sensor saturates easily, so the integration time must be reduced. If the incident signal or ambient
light is weak, the integration time must be increased.
These issues can be solved by using non-destructive readout (S11962-01CR: not supported). With
non-destructive readout, signals with different integration times in a frame can be read out. Wide dynamic range
is achieved by selecting the signal with the optimal integration time.
Note that the reset noise that occurs within a pixel can be canceled by computing the difference between two
specific signals obtained by non-destructive readout.
An even wider dynamic range can be achieved in non-destructive readout by setting a threshold voltage (Va)
[Figure 3-6] and selecting a signal that does not exceed the threshold. To do this, however, a signal processing
circuit must be attached externally.

8
[Figure 3-6] Non-destructive readout

p_res
(Pixel reset pulse)
phis
(Signal sampling pulse)
Output (V)

Vout

Vsat

Integration time (s)

If the incident signal or ambient light is weak

If the incident signal or ambient light is strong

KMPDC0636EA

3-5. Subtracting signals caused by ambient light

The charge drain function allows draining of unneeded charges accumulated during the light emission period.
However, unneeded charges caused by ambient light and the like are also accumulated during the non-emission
period (VTX1 and VTX2 are on). The way to eliminate these unneeded charges is to calculate the difference
between the following two signals read out within a single frame and extract only the AC signal component. One
of the signals is that obtained under the combination of light pulse (AC light) and ambient light (DC light), and the
other is that obtained only under ambient light. This enables more accurate distance measurements.

[Figure 3-7] Function for subtracting signals caused by ambient light

1 frame=33 ms (for 30 frames/s)

No light
emission

p_res

phis

Light emission

Vout2
Output (V)

Vout
Vout1(DC)
Vout1 Vout2(DC)
Vsat

Light pulse incident signal (AC light) + ambient light (DC light) Ambient light (DC light)

L∝(1/2) × c × To × {Vout2 – Vout2(DC)}/[{Vout1 – Vout1(DC)} + {Vout2 – Vout2(DC)}]

L: distance to the target object

c: speed of light
To: pulse width
Vout1, Vout 2: output generated from signal light
Vout1(DC), Vout2(DC): output generated from ambient light

KMPDC0640EB

9
3-6. Calculating the frame rate

Frame rate=1/(Time per frame)

=1/(Integration time + Readout time) ･･･(3-5)

Integration time:
It is necessary to be changed by the required distance accuracy and usage environment factors such as
fluctuating background light.

It is possible to read out only the signal level without reading out the reset level signal. However, noise will
increase because the pixel reset noise cannot be removed. Sensitivity variations in the photosensitive area will
also increase because the fixed pattern noise in each pixel cannot be removed either.

When operating in non-destructive readout mode:

Time per frame = Integration time + (Readout time × Non-destructive readout count) ･･･(3-6)

[Linear image sensor]

Readout time = ×Number of horizontal pixels

=Time per clock (Readout time per pixel) × Number of horizontal pixels ･･･(3-7)

Calculation example of readout time (clock pulse frequency=5 MHz, number of horizontal pixels=272)

Readout time = × 272

= 200 [ns] × 272

= 0.0544 [ms] ･･･(3-8)

[Area image sensor]

Readout time = ×Horizontal timing clock ×Number of vertical pixels

= Time per clock (Readout time per pixel) ×Horizontal timing clocks ×Number of vertical pixels
･･･(3-9)

Calculation example of readout time

(clock pulse frequency =5 MHz, horizontal timing clocks =208, number of vertical pixels =128)
Readout time = × 208 × 128

= 200 [ns] × 208 × 128

= 5.324 [ms]

10
4. How to use

4-1. Configuration example

A configuration example of a distance measurement system using the distance image sensor is shown in Figure
4-1. The system consists of the distance image sensor, light source and its driver circuit, light emitting/receiving
optical system, timing generator, and arithmetic circuit for calculating distance. The distance accuracy depends
greatly on the light source emission level and the light emitting/receiving optical system.

[Figure 4-1] Configuration example of distance measurement system

① Distance image sensor Object

③ Optical system

Timing generator
Arithmetic circuit for ② Light source, driver
calculating distance circuit for light source

Measurement distance

KMPDC0473EA

4-2. Light source selection

When the distance image sensor is used to measure distance, a light source (LED or pulse laser diode) suitable for
the pulse width of the distance image sensor’s charge transfer clock must be selected. For example, to measure
up to 4.5 m, the pulse width of the charge transfer clock and the light emission pulse width must be set to 30 ns.
Thus, the response speed of the light source needs to be around 10 ns or less for rise and fall times. Since the light
source must be irradiated in a line in the case of the S11961-01CR and S12973-01CT distance linear image
sensors and over an area in the case of the S11962-01CR and S11963-01CR distance area image sensors, large
output power is required. For this, multiple light sources are sometimes used. When multiple light sources are
used, a driver circuit for driving the multiple light sources at high speeds and high output is also required.

5. Distance measurement examples

5-1. Distance measurement (S11961-01CR, S12973-01CT)

For your reference, the following is an example of distance measurement using the S11961-01CR or S12973-01CT
and an evaluation light source under the following conditions.

11
 [Conditions]
• S11961-01CR or S12973-01CT distance image sensor (measured at the center pixel)
• Non-destructive readout
• Integration time=30 ms
• Charge transfer clock width VTX1, 2=30 ns
• Light receiving lens: F=1.2, light receiving angle=37.5 × 27.7
• Light source (LED): output=10 W, duty ratio=0.3%, light emission pulse width=30 ns, λ=870 nm
• Light projection angle=10 × 10
• Ambient light: room light level
• Ta=25 C

[Figure 5-1] Distance measurement characteristics (S11961-01CR, S12973-01CT, typical example)

Gray object (reflectance: 18%)

White object (reflectance: 90%)
Measured distance (m)

0 1 2 3 4 5

Actual distance (m)

KMPDB0495EA

[Figure 5-2] Distance accuracy vs. actual distance (S11961-01CR, S12973-01CT, typical example)

Gray object (reflectance: 18%)

White object (reflectance: 90%)
Distance accuracy (cm)

0 1 2 3 4 5

Actual distance (m)

KMPDB0496EA

12
 5-2. Short distance measurement (S11961-01CR, S12973-01CT)

Figures 5-3 and 5-4 show a measurement example for short distance (up to 100 cm).

[Conditions]
• Distance image sensor: S11961-01CR or S12973-01CT (measured at the center pixel)
• Integration time=20 ms
• Charge transfer clock width VTX1, 2=30 ns, VTX3=3300 ns
• Light receiving lens: F=1.2, light receiving angle=37.5 × 27.7
• Light source (LED): output=10 W, duty ratio=0.9%, light emission pulse width=30 ns, λ=870 nm
• Light projection angle=10 × 10
• Ambient light: room light level
• Ta=25 C
• When measuring short distance (5 to 20 cm): change the sensor and light source positions

[Figure 5-3] Distance measurement characteristics (short distance, S11961-01CR, S12973-01CT, typical example)

Gray object (reflectance: 18%)

White object (reflectance: 90%)
Measured distance (m)

0 0.2 0.4 0.6 0.8 1.0 1.2

Actual distance (m)

KMPDB0497EA

[Figure 5-4] Distance accuracy (short distance, S11961-01CR, S12973-01CT, typical example)

Gray object (reflectance: 18%)

White object (reflectance: 90%)
Distance accuracy (m)

0 0.2 0.4 0.6 0.8 1.0 1.2

Actual distance (m) KMPDB0498EA

13
 5-3. Improving the distance accuracy by averaging the measurement data

One method to improve the distance accuracy is averaging the measurement data. There are two averaging
methods. One is averaging over time, and the other is averaging over multiple pixels. Figure 5-5 shows an
example of averaging over multiple pixels.

[Figure 5-5] Example of averaging over multiple pixels

White object (reflectance: 90%)

30°

20°

50 cm

· Distance image sensor: S11961-01CR or S12973-01CT

(using pixels with relatively uniform incident light levels)
· Distance between the sensor and target object to be detected: 50 cm
· Diffuser: 30° × 30°
· Light receiving lens: f=12 mm, light receiving angle=20° × 20°
· Light source: LED, light emission pulse width=30 ns, light emission cycle=300 kHz

KMPDC0639EB

Measured distances of N pixels around and including the center pixel are averaged, and the variation in this
parameter over 100 frames is determined.

[Figure 5-6] Example of improving the distance accuracy (by averaging over multiple pixels)

Measured value
Theoretical value
Distance accuracy (m)

0 50 100 150

Number of pixels

KMPDB0499EA

14
 5-4. Measuring the distance to a cylinder

The following are measurement examples when a metal cylinder (about 10 cm) and a white cylinder (diffuser)
are used for target objects. In the case of a metal cylinder with regular reflection, fairly accurate measurement is
possible when the cylinder is in front of the light source but not when it is off aligned.

[Figure 5-7] Example of metal cylinder

[Figure 5-8] Output vs. light incident pixel no.

(a) Metal cylinder

Vout1
Vout2
Output (digit)

60 70 80 90 100 110 120 130 140 150 160 170

Light incident pixel no.

KMPDB0500EA

15
 (b) White cylinder

Vout1
Vout2
Output (digit)

60 70 80 90 100 110 120 130 140 150 160 170

Light incident pixel no.

KMPDB0501EA

[Figure 5-9] Measured distance vs. light incident pixel no.

(a) Metal cylinder
Measured distance (m)

60 70 80 90 100 110 120 130 140 150 160 170

Light incident pixel no.

KMPDB0502EA

16
 (b) White cylinder
Measured distance (m)

60 70 80 90 100 110 120 130 140 150 160 170

Light incident pixel no.

KMPDB0503EA

5-5. Distance measurement (S11961-01CR, S12973-01CT) using pulse laser diode

The following is an example of distance measurement taken under the following conditions.

[Conditions]
• S11961-01CR or S12973-01CT distance linear image sensor
• Light source: pulse laser diode (for evaluation within Hamamatsu)
Peak power=50 W, λ=870 nm, pulse width=50 ns, duty ratio=0.1%, FOV=40×2 (horizontal × vertical)
• Target object: standard diffuser panel, white (reflectance: 90%), black (reflectance: 10%)
• Light receiving lens: SPACECOM L8CSWI (f=8 mm, F=1.2, 1/3 inch CS mount)
• Ambient light: under fluorescent lamp
• The data of a pixel with the highest return light level is extracted.

[Figure 5-10] Distance measurement example [white object (reflectance: 90%)]

Calculated distance
Distance accuracy
Calculated distance (mm)

Distance accuracy (mm)

0 1000 2000 3000 4000 5000 6000

Actual distance (mm)

KMPDB0509EA

17
 [Figure 5-11] Distance measurement example [black object (reflectance: 10%)]

Calculated distance
Distance accuracy
Calculated distance (mm)

0 1000 2000 3000 4000 5000 6000 Distance accuracy (mm)

Actual distance (mm)

KMPDB0510EA

5-6. Distance measurement (S11963-01CR)

The following is an example of distance measurement taken under the following conditions.

[Conditions]
• S11963-01CR distance image sensor (measured at the center pixel)
• Integration time=2 ms
• Charge transfer clock width VTX1, 2=40 ns, VTX3=920 ns
• Light receiving lens F=1.2, light receiving angle=37.5 × 27.7
• Light source (LED 8 × 8): 10 W, λ=870 nm
• Light projection angle=17.2 × 17.2
• Ambient light: room light level
• Ta=25 C

18
[Figure 5-12] Measured distance, distance accuracy vs. actual distance
[white object (reflectance: 90%), S11963-01CR, typical example]

Measured distance
Distance accuracy
Measured distance (mm)

Distance accuracy (mm)

0 500 1000 1500 2000 2500 3000 3500 4000 4500

Actual distance (mm)

KMPDB0513EA

[Figure 5-13] Measured distance, distance accuracy vs. actual distance

[gray object (reflectance: 18%), S11963-01CR, typical example]

Measured distance
Distance accuracy
Measured distance (mm)

Distance accuracy (mm)

0 500 1000 1500 2000 2500 3000 3500 4000 4500

Actual distance (mm)

KMPDB0514EA

19
5-7. Short distance measurement (S11963-01CR)
Figures 5-14 and 5-15 show a measurement example for short distance (up to 100 cm).

[Conditions]
• S11963-01CR distance image sensor (measured at the center pixel)
• Integration time=10 ms
• Charge transfer clock width VTX1, 2=20 ns, VTX3=460 ns
• Light receiving lens F=2.0, f=3 mm, light receiving angle=37.5 × 45
• Light source (LED × 8): 5.6 W, λ=850 nm
• Light projection angle=±45°
• Ambient light: room light level
• Ta=25 C

[Figure 5-14] Measured distance, distance accuracy vs. actual distance

[white object (reflectance: 90%), evaluation kit for S11963-01CR, typical example]

Measured distance
Distance accuracy
Measured distance (mm)

Distance accuracy (mm)

0 200 400 600 800 1000

Actual distance (mm)

KMPDB0515EA

20
[Figure 5-15] Measured distance, distance accuracy vs. actual distance
[gray object (reflectance: 18%), evaluation kit for S11963-01CR, typical example]

Measured distance
Distance accuracy
Measured distance (mm)

Distance accuracy (mm)

0 200 400 600 800 1000

Actual distance (mm)

KMPDB0516EA

6. Calculating the incident light level

If you want to construct a camera module using a distance image sensor, you need to set the parameters
according to the operating conditions to maximize the performance of the sensor. For example, when outdoors
under strong sunlight, various measures need to be taken such as reducing the integration time or suppressing
the incident sunlight using a band-pass filter to avoid pixel saturation.
How much to reduce the integration time or which band-pass filter is most suited in reducing the sunlight to the
appropriate level varies depending on the operating conditions. To make things easier, we created a model of the
camera module configuration and derived an equation that simply calculates the incident light level (signal light,
ambient light) per pixel.

Camera module parameters

The following are main parameters of a camera module that uses a distance image sensor. In addition, Figure 6-1
shows the schematic. We assume that the light from the light source is shaped into a rectangle by the angle of
view (θH, θV) determined by the lens and directed on the sensor.

(1) Target object

• Distance to the target object L [m]
• Reflectance of the target object R [%]

(2) Light projection section

• Light source output P [W/sr]
• Light projection efficiency EP [%]
• Duty ratio “duty”
• Integration time Tacc [s]
• Light emitter’s angle at half maximum θsource [V]
• Light projection angle (horizontal, vertical) θH, θV []

21
(3) Ambient light
• Sunlight intensity Pamb [W/m2]
• Band-pass filter’s transmission wavelength range (short-wavelength side, long-wavelength side) λshort , λ
long [nm]

(4) Photosensitive area

• Light receiving lens efficiency ER [%]
• Band-pass filter’s signal light transmittance EF [%]
• Light receiving lens F value
• Light receiving lens focal distance f [m]

(5) Distance image sensor

• Pixel size (horizontal, vertical) Hpix, Vpix [m] (area Spix)

• Fill factor FF [%]

• Photosensitivity Ssens [A/W]

• Pixel capacitance Cfd [F]
• Maximum voltage amplitude Vmax [V]
• Random noise RN [V]
• Dark output VD [V/s]

[Figure 6-1] Schematic of camera module with built-in distance image sensor

Light projected area at θH, θV from the

light projection section
Range in which the sensor is projected
by the light receiving lens
Pamb
Sunlight Range in which the light reflected from
a small area of the target object enters
Spot area Sspot Reflectance R the light receiving lens at solid angle Ωt
Lambertian reflectance
EF
Ep ER
θH, θV
θsource

P Ωt Photosensitive
area Spix

Projection area S’pix

L L
Light projection section to target object Target object to photosensitive area

KMPDC0641EA

Calculation method

First, we calculate the light spot level Pspot [W/m2] on the target object [equation (6-1)].
A 1
Pspot  P  2
 Ep  …(6-1)
L Sspot

P: Light source output [W/sr]

A: Area of a spherical surface obtained by cutting a sphere with radius L at an angle of θsource

22
 A
: solid angle of the projected light [sr]
L2

EP: light projection efficiency [%]

Sspot: area of the light spot projected on the target object [m2 ]

[Figure 6-2] Area A on the spherical surface

θSource
L L

KMPDC0650EA

Sspot is given by equation (6-2).

Sspot  2L tan H  2L tan  V . . . (6-2)

A is given by equation (6-3).

A = 2 {1 – cos(θsource)} × L2 . . . (6-3)

Next, we calculate angle of the reflected light from a small area of the target object that enters the light receiving
lens. If the diameter of the light receiving lens is D [m], the angle θR formed between a given point on the
target object and the edge of the light receiving lens is given by equation (6-4).

D
R  tan1   . . . (6-4)
 2L 

If we use θR, solid angle Ωt [unit: sr] is given by equation (6-6).

R
t  4  sin2 . . . (6-6)
2

θR varies depending on the position on the target object, but here it is approximated to a fixed value. Of the
reflected light diffused in all directions from the target object, we assume the portion corresponding to Ωt to
enter the lens.

23
The region on the target object that the distance image sensor can receive the reflected light of corresponds to
the projection plane of the pixels displayed on the object through the light receiving lens. The relationship
between pixel area Spix and the pixel projection area S'pix on the target object is given by equation (6-7).
2
L 
Spix    Spix . . . (6-7)
f

We determine the level of signal light and ambient light that hit and reflect off the target object and enter a single
pixel through the lens. To simplify the calculation, we assume the target object to be a perfect diffuser. If the
incident light level is I [W], the reflected light level is I/ [W/sr] for a point light source and I [W/sr] for an
extremely wide surface light source such as sunlight. The signal light level Ppix [W] entering a single pixel is
given by equation (6-8).

1
Ppix  Pspot  R   t  S' pix  E R  E F (sig)  FF . . . (6-8)


The ambient light level Ppix(amb) [W] entering a single pixel is given by equation (6-9).

Ppix (amb)  Pamp  R  1  t  S' pix  E R  E F (amb)  FF . . . (6-9)

EF(sig): band-pass filter transmittance for signal light

EF(amb): band-pass filter transmittance for ambient light

Output voltage Vpix [V] generated from the signal light is given by equation (6-10).

Vpix  Ppix  Tacc  duty  Ssens Cfd . . . (6-10)

Tacc: integration time [s]

duty: duty ratio
Ssens: photosensitivity [A/W]
Cfd: pixel capacitance [F]

Output voltage Vpix(amb) [V] generated from the ambient light is given by equation (6-11).

Vpix (amb)  Ppix (amb)  Tacc  duty  Ssens Cfd . . . (6-11)

Distance accuracy

Using the levels of signal light and ambient light entering a single pixel determined above, we calculate the
distance accuracy of the camera module. Photocurrent Ipix [A] per pixel generated by the signal light is given by
equation (6-12).

Ipix = Ppix × Ssens . . . (6-12)

The number of electrons Qpix [e-] per pixel generated by the signal light is given by equation (6-13).

24
 Qpix = Ipix × Tacc × duty/e . . . (6-13)

= Ppix × Ssens × Tacc × duty/e

e: quantum of electricity=1.602 × 10-19 [C]

The number of electrons Qpix(amb) [e-] per pixel generated by the ambient light is given by equation (6-14).

Qpix(amb) = Ppix(amb) × Ssens × Tacc × duty/e . . . (6-14)

Next, noise components are described. The amplitudes of light shot noise NL, random noise NR, dark current shot

noise ND are given by the following equations [unit: e-].

NL = Qpix  Qpix(amb) . . . (6-15)

NR = RN × Cfd/e . . . (6-16)

RN: random noise [V]

ND = VD  Tacc  Cfd e　 . . . (6-17)

VD: dark output [V]

Total noise N [ e-] is given by equation (6-18).

N= N2L  NR2  ND2 . . . (6-18)

The S/N is the ratio of the number of signal electrons Qpix to N.

Distance accuracy σ [m] is given by equation (6-19).

N cT . . . (6-19)
  0
Qpix 2
c: speed of light
T0: light emission pulse width

Calculation example
Table 6-1 shows an example of camera module parameters. Using these values, we calculate the output voltages
generated from the signal light and ambient light.

A = 2 (1 – cos14) × 12 = 0.18664 [m2]

Sspot  2 tan 45  2 tan 2.5  0.17464[m2 ]

25
  f   2.8  10 3 
R  tan1    tan1    0.066845[]
 2FL   2  1.2 
 
0.066845045
t  4  sin2  4.276  10  6 [sr ]
2
2
 1 
Spix   3
 20[μm]  50[μm]  1.2755  10  4 [m 2 ]
 2.8  10 

0.18664 1
Pspot  100  2
 0.6   64.1[W / m2 ]
1 0.17464

1
Ppix  64.1  0.1   4.276  10  6  1.2755  10  4  0.6  0.88  0.3  176.3[pW]


Ppix (amb)  1000  0.1  1  4.276  10 6  1.2755  10 4  0.6  0.06  0.3  590.4[pW]

 
Vpix  176.3  10 12  15  10 3  0.001  0.3 40  10 15  19.8[mV ] 
 
Vpix (amb)  590.4  10 12  15  10 3  0.001  0.3 40  10 15  66.4[mV ] 
The voltages generated from the signal light and ambient light are 1.24% and 4.15% of the saturation voltage of
a single pixel, respectively. In terms of the number of electrons, they are given by the following equations.


Qpix  176.3  10 12  0.3  15  10 3  0.001 1.602  10 19  4952.2[e  ]

Qpix (amb)  590.4  10 12  0.3  15  10 3  0.001 1.602  10 19  16584.3[e  ] 
Noise components and total noise are given by the following equations.

NL = [e  ]
4952.2  16584.3  146.8 　

 
NR = 500  10 6  40  10 15 1.602  10 19  124 .8[e  ]

ND =  
1  15  10  3  40  10 15 1.602  10 19  61.2 　
[e  ]

N= 146.8 2  124.8 2  61.2 2  202.2[e  ]

The distance accuracy is given by the following equation.

202.2 3  10 8  30  10 9
   0.184 　
[m]
4952.2 2

Figure 6-3 shows the actual measurement of the distance accuracy when a light source is driven with
Hamamatsu’s evaluation kit and the distance is measured and the calculated distance accuracy determined by
entering the evaluation kit parameters in the above equations. The calculated values tend to show poorer results.

26
[Table 6-1] Example of camera module parameters
Group Parameter Symbol Value Unit
Target Distance to the target object L 1 m
object Reflectance R 10 %
Light source output P 100 W/sr
Duty ratio duty 0.001 -
Integration time Tacc 15 ms
Light
LED’s angle at half maximum θsource 7 °
emission
Light projection angle (horizontal: one side) θH 45 °
Light projection angle (vertical: one side) θV 2.5 °
Light projection efficiency EP 60 %
Intensity Pamb 1000 W/m2
Band-pass filter transmission wavelength
λshort 800 nm
Ambient (short-wavelength side)
light Band-pass filter transmittance wavelength
λlong 900 nm
(long-wavelength side)
Band-pass filter transmittance (sunlight) EF(amb) 6 %
Light receiving efficiency ER 60 %
Light Band-pass filter transmittance (signal light) EF(sig) 88 %
reception Light receiving lens F value F 1.2 -
Light receiving lens focal distance f 2.8 mm

S11961-01CR
Group Parameter Symbol S11963-01CR Unit
S12973-01CT
Pixel size (horizontal) Hpix 20 30 m
Pixel size (vertical) Vpix 50 30 m
Fill factor FF 0.3 0.25 -

Photosensitivity (λ=830 nm) Ssens 0.3 0.3 A/W

Sensor
Detection capacitance Cfd 40 15 fF
Voltage amplitude Vmax 1.6 1.6 V
Random noise RN 500 500 V
Dark output VD 1 1 V/s

27
 [Figure 6-3] Calculated and measured distance accuracy
(typical example, calculated value: light projection efficiency=light receiving efficiency=100%)

Calculated value
Measured value
Distance accuracy (m)

0 1 2 3 4

Actual distance (m)

Measurement conditions
· Indoors (200 lx)
· Ambient light cut filter: none
· Distance image sensor: S11963-01CR
Integration time=30 ms
· Hamamatsu evaluation kit
· Light receiving lens: image format=1/3”
Field of view (horizontal ×
vertical)=37.5° × 27.7°
· Light source: LED array module
Emission wavelength=870 nm
Emission intensity=10 W
Light projection angle (horizontal ×
vertical)=±12.2°
Light emission pulse width=30 ns
Duty ratio=0.1%
· Target object: White board (reflectance=90%)

KMPDB0504EA

7. Calibration

Distance image sensors require distance calibration. The reasons why calibration is necessary are shown below.

[Reasons why calibration is necessary]

• Delay in the light emission timing
• Delay in the wiring between the sensor and light source
• Shape of the light emission pulse of light source
• Peripheral circuits

The following shows an example of the calibration method.

Distance L is given by equation (7-1).

Vout2 cT
L  0  Dofs …(7-1)
Vout1  Vout2 2

28
 α: slope
c: speed of light
T0: light emission pulse width
Dofs: Distance offset

You need to set the light emission timing delay (Light_pulse_delay), distance offset (Dofs), and slope (α).

Setting the light emission timing delay and distance offset

The calculated distance is shifted by changing the light emission timing delay and distance offset so that the
calculated distance matches the actual distance.

Setting the slope α

① Set the light pulse peak exactly in the middle of the VTX1 and VTX2 peaks.
② Select two points in the linear range of distance, and calculate α to match the ideal line [Figure 7-1].

[Figure 7-1] Calculated distance vs. actual distance

Ideal line
Linear range
Calculated distance

Actual distance

KMPDC0643EA

Approximate distance measurement becomes possible by performing the above calibration. If we want to further
improve the distance measurement characteristics and bring the calculated distance closer to the actual distance,
we set the sensitivity ratio (SR).

In equation (7-2), SR is added to the distance calculation equation (7-1).

Vout 2 cT
L  0  Dofs …(7-2)
( Vout1  SR )  Vout 2 2

29
7-1. Calculating the sensitivity ratio (SR)

[Figure 7-2] Calculating the sensitivity ratio

KMPDC0644EA

(1) Synchronize the incident light pulse with VTX1 and measure Vout1 (timing ①).
(2) Synchronize the incident light pulse with VTX2 and measure Vout2 (timing ②).
(3) Calculate SR from Vout1 and Vout2 measured in (1) and (2) [equation (7-3)].

Vout2
SR  …(7-3)
Vout1

Perform these measurements in the dark state. We also recommend the light level to about half the saturation
exposure.

7-2. Linear range and nonlinear range

The distance image sensor has a linear range and nonlinear range in distance measurement. The nonlinear range
depends on the pulse waveform of the light source. This phenomenon is described below.

Signal charges shown in Figure 7-3 are accumulated due to the delay in the light pulse incident timing. The linear
range (range in which distance calculation is possible) is between timing ① and ①.

30
[Figure 7-3] Output vs. light pulse delay time (1)

Delay Delay

Range in which distance

calculation is possible
Output

Vout1 Vout2

Light pulse delay time

KMPDC0645EA

Actually, since the linear range of Vout1 and Vout2 is narrower because of the rise time and fall time of the light
pulse, the linear range of distance measurement is also narrower.

[Figure 7-4] Output vs. light output delay time (2)

Delay Delay

Range in which distance calculation

is possible (linear range)
Output

Vout1 Vout2

Light pulse delay time

KMPDC0646EB

31
8. Characteristics

8-1. Light incident angle characteristics

The photosensitivity varies depending on the light incident angle. When we measured using the S11963-01CR
distance area image sensor, the photosensitivity was about one-half at incident angle of ±50.

[Measurement method]
The LED light source is directed so that only mostly collimated light is allowed to enter the distance image sensor
through the aperture. The sensor-equipped circuit board placed on a rotary stage is installed so that its
photosensitive area is aligned along the rotary axis of the rotary stage. The rotary stage is turned, and the incident
angle characteristics of sensitivity are measured.

[Measurement conditions]
Light pulse width=30 ns
VTX1=VTX2=30 ns
VTX3=19940

[Figure 8-1] Measurement method of the light incident angle characteristics of sensitivity

Circuit board with

Aperture distance image sensor

LED light source

(870 nm, 100 kHz max.)

Rotary stage

KMPDC0642EA

32
 [Figure 8-2] Incident angle characteristics of sensitivity
Relative sensitivity

60 40 20 0 20 40 60

Incident angle (°)

KMPDB0506EA

8-2. Distance accuracy vs. incident signal level

Increasing the incident signal level is effective in improving the distance accuracy [Figure 8-3].

[Figure 8-3] Distance accuracy vs. number of incident signal electrons (S11961-01CR, S12973-01CT, typical
example)

(To=30 ns, dark state)

Distance accuracy (m)

103 104 105 106

Number of incident signal electrons [e-]

KMPDB0507EA

33
 2 2
Distance accuracy ∝ (NR + Nsh 2 + ND )/S × (c × To/2) ・・・(8-1)

S: number of incident photons

NR: readout circuit noise
Nsh: light shot noise
ND: dark current shot noise
c: speed of light
To: light emission pulse width

8-3. Temperature characteristics of distance accuracy

If the incident signal level is high, the distance accuracy does not change much even when the temperature
increases. If the incident signal level is low, the distance accuracy degrades when the temperature increases. This
is because dark current shot noise increases as the temperature increases.

[Figure 8-4] Distance accuracy vs. chip temperature (S11961-01CR, S12973-01CT, typical example)

(To=30 ns, 1 frame=16 ms, dark state)

Number of incident signal electrons

2500 e-
125000 e-
Distance accuracy (m)

0 20 40 60 80 100

Chip temperature (°C)

KMPDB0508EA

9. Evaluation kit

Figure 5-3 shows a configuration example using the evaluation kit for the distance image sensor. This evaluation
kit can generate sensor drive timing with an FPGA and sensor bias voltage with a DAC-IC, perform A/D conversion
on the sensor output signal, and transfer data to a PC via Ethernet. This evaluation kit can be driven with only a 5
V power supply.
Hamamatsu provides evaluation kits (with LED array and light receiving lens) for the S12973-01CT, S11961-01CR,
and S11963-01CR.

34
[Figure 9-1] Configuration example of distance measurement using the evaluation kit

Evaluation
kit Irradiation light
Drive pulse

Light source
(LED or LD)

Ethernet

Target
Reflected light
PC Distance (person, object)
image Light receiving
sensor lens

KMPDC0417EB

[Figure 9-2] Example of evaluation kit for linear image sensor

[Figure 9-3] Example of evaluation kit for area image sensor

35
[Figure 9-4] Example of evaluation kit (with case)

Cat. No. KMPD9011E05 Oct. 2018 36