The Effect of the Extrusion Temperature on the

Recrystallization Textures of an Extruded AA6005C

Alloy
Dr. Kentaro IHARA＊1, Takahiro SHIKAMA＊2, Keiji MORITA＊3
＊1
Technology Control Dept. Moka Plant, Aluminum & Copper Business
＊2
Aluminum Extrusion & Fabrication Plant, Chofu Works, Aluminum & Copper Business
＊3
SHINKO FAB TECH, LTD.

A study was conducted to determine the effect of the primarily on round bars 3), and not much has been
extrusion temperature on the recrystallized grain size reported concerning hollow profiles. This study aims
and texture of an AA6005C alloy. Several extrusion tests to clarify the effect of the extrusion conditions on
were conducted at temperatures from 753 to 793K at an the formation process of the recrystallization texture
extrusion speed of 3m/min. A decrease in extrusion in a hollow profile of AA6005C (JIS 6N01)-T5
temperature from 793K to 753K was found to increase aluminum alloy. A study was conducted on the
the average size of recrystallized grains from 170μm to recrystallization textures of the hollow profiles,
230μm and the volume fraction of cube-oriented extruded at various temperatures and T5 treated.
recrystallized grains from 30% to 40%. A high- The following is an outline of the study.
temperature compression test, conducted to elucidate the
process of recrystallized grain formation, revealed that, 1. Experimental method
compared with extrusion at 793K, extrusion at 753K
yields fewer recrystallized grains immediately after the The tested samples were prepared from hollow
deformation, indicating that a larger amount of energy is profiles made of an AA6005C (JIS 6N01)-T5. Their
stored in the un-recrystallized region. The increased chemical composition and the process of producing the
stored energy is considered to have promoted the samples are shown Table 1 and Fig. 1, respectively.
preferential growth of the recrystallized Cube grains. Each billet, having a diameter of φ155mm, was
homogenized at 520℃ for 4h, reheated to a
Introduction temperature of 480℃, 500℃, or 520℃, and hot-
extruded at a rate of 3m/min with an extrusion
The 6000 series Al-Mg-Si alloys are used as ratio of 44. The extrusion exit temperature was
extrusions mainly in the fields of transportation approximately 15℃ higher than the reheating
equipment, building materials and electronic temperature, due to the heat of deformation. The
equipment. The structural materials for transportation extruded profiles were held for 20s after the
equipment, including automobiles, are required to extrusion and then water cooled. They were
have properties such as mechanical strength, subsequently aged at 190℃ for 3h to prepare the T5
corrosion resistance and weldability 1). Generally, treated samples.
these materials are forcibly cooled after extrusion, These samples were subjected to tensile tests,
aged at high temperatures to a T5 condition and used
in the high strength condition with their fibrous
structures extending in the extrusion direction. The ・Billet：φ155mm ・Extrusion ratio：44 Hollow square ST
・Speed：3m/min bar with 2mm LT
mechanical properties of an extruded material thickness L
520℃×4h Tex.：520℃ 20s ・Optical microscope
depend on its recrystallization texture. For example,
Temp.

500℃  observation
40
the texture, highly oriented in the Cube direction, 140 150 480℃
・SEM-EBSD analysis
Water
{100} <001>, of a hollow profile is reported to ℃/h ℃/h 40 190℃×3h
quench
T5
improve impact resistance 2). The report that the Homogenization Extrusion Artificial aging
Time
recrystallization texture of an extruded material Fig. 1 Schematic view of the process for extruded 6005C
depends on the extrusion temperature is based alloys

Table 1 Chemical composition of studied Al-Mg-Si alloy (wt％)

Unspecified other elements

Si Fe Cu Mn Mg Cr Zn Ti Mn+Cr
Each Total

Specimen 0.40 0.20 0.15 − 0.80 − − 0.02 − − −

AA6005C 0.40−0.90 0.35 0.35 0.50 0.40−0.80 0.30 0.25 0.10 ≦0.50 0.05 0.15

69 KOBELCO TECHNOLOGY REVIEW NO. 31 JAN. 2013

optical microscopy observation, texture measurement 2. Experimental results
and transmission electron microscopy (TEM)
observation. Each tensile test was performed on a 2.1 The tensile properties of the samples
JIS13B specimen with its longitudinal direction
parallel to the extrusion direction (L direction); the The tensile properties in the extrusion direction of
specimens each having a gauge length of 50mm. The the sample, shown in Table 2, satisfy the requirements
tensile tests were conducted at a cross head speed of of JIS H4100 with a tensile strength and proof
2mm/min and at an initial strain rate of 7×10−4s−1. strength slightly higher than the standard values.
The crystal grain structures were observed under The tensile strength and proof strength decreased
an optical microscope on the LT-ST cross sections of with decreasing extrusion temperature.
the samples etched by 5% sodium hydroxide. The
texture measurement was conducted according to 2.2 The microstructures of the samples
the electron back scattering pattern (EBSP) method
using a scanning electron microscope (SEM). An LT- 2.2.1 Crystal grain structure
ST cross-section of each sample was electro-polished
and was measured by an orientation imaging Fig. 3 shows the optical micrographs of the
microscope (OIM), manufactured by TSL Solutions, recrystallization structures of the samples. Table 3
that is mounted on an SEM (JEOL6500F), made by summarizes the results of the microstructure
Japan Electro Optical Laboratory. The acceleration measurements performed on the materials extruded
voltage was 15kV, and an area of 2×2mm was at various temperatures. For extrusion temperatures
measured with a step interval of 5μm. The TEM ranging from 480 to 520℃, the recrystallization
observation was conducted to measure the size of occurred throughout the wall thickness. When the
disperse particles and their spacing. In addition to extrusion temperature was lowered from 520℃ to
the extrusion test, elevated temperature compression 480℃, the average size of the recrystallized grain in
tests were conducted on the sample billets to clarify
the initial formation process of the recrystallized Table 2 Tensile properties of extruded 6005C-T5 specimens
structure. Fig. 2 schematically depicts the testing Tex. TS YS El.
conditions. Column shaped specimens, each having (℃) (MPa) (MPa) (％)
a dimension of φ8×12mm, were machined from the 520 278 255 12
500 277 252 12
billet homogenized at 520℃ for 4h. These specimens
480 266 241 12
were subjected to the compression test at a strain 12)
Standard data of 6005C T5 265 225 14
rate of 10s−1 and a compression ratio of 75%. These JIS H4100 T5 ≧245 ≧205 ≧8
high temperature compression tests were performed
at the temperatures of 495℃ and 535℃, 15℃ higher
Table 3 Summary of the measurement results
than the respective extrusion temperatures of 480℃
and 520℃. This was to account for the deformation Tex. (℃) 480 500 520
Mean grain size Surface layer 132 139 136
heat generated during the extrusion. The test
(μm) Center layer 234 178 165
employed the THERMECMASTOR-Z, made by Fuji
Cube 38 30 29
Electronic Industrial Co., Ltd. After completing the Goss 8 8 9
deformation by compression, the samples were held Brass 4 3 5
Area fraction of texture
for 2 and 5 seconds, respectively, before being water (％) S 3 2 6
cooled. Then the microstructure at the center of each (LT-ST cross section) Cu 3 1 2
sample was observed on a section parallel to the ｛112｝＜110＞ 3 2 2

compression axis, using the optical microscope and ｛001｝＜110＞ 3 1 1

Mean dispersoids size (nm) 140 136 140
SEM-EBSD.
Mean dispersoids space (μm) 2.2 2.5 2.2

・＝1.0×10s−1 Tex. 480℃ 500℃ 520℃

ε φ8
Tcomp.：535℃ 2s
520℃×4h 5s ε＝1.3
12
Temp.

495℃ ・OM
140 150 Water ・SEM-EBSD
3

℃/h ℃/h quench

ST
Homogenization Compression tests 500μm
LT
Time
Fig. 2 Schematic view of the process of hot compression tests Fig. 3 Optical microstructure of extruded 6005C-T5 alloys
(Tex.: Extrusion temperature)

KOBELCO TECHNOLOGY REVIEW NO. 31 JAN. 2013 70

 the center layer increased from 165μm to 234μm. layer on the basis of the difference in the crystal
orientation distribution shown in Fig. 4 (A). For each
2.2.2 Crystal orientation distribution of these layers, the recrystallized grain size was
measured from the average spacing of high-angle
Fig. 4 shows the crystal orientation distributions grain boundaries. The result is shown in Fig. 5. When
of the samples. Fig. 4 (A) is an inverse pole figure the extrusion temperature was lowered from 520℃
map showing the crystal orientation in the L- to 480℃, the recrystallized grain size in the center
direction, with the orientations depicted by the color layer increased from 165μm to 234μm. On the other
inside the stereographic triangle in the right hand hand, the recrystallized grain size in the surface
side of the figure. Fig. 4 (B) is a color depiction of the layer remained in the range from 136μm to 132μm,
distribution of the major texture orientations, i.e., the showing little if any change. Fig. 6 shows the
Cube orientation {001} <100>, Goss orientation {001} relationship between the area fractions of the
<100>, Brass orientation {011} <211>, S orientation oriented grains and the extrusion temperature. The
{123} <634>, Cu orientation {112} <111>, {112} <110> area fractions of the oriented grains were measured
orientation and {001} <110> orientation. The black throughout the wall thickness in Fig. 4 (B). The major
solid lines in Fig. 4 (B) indicate boundaries with a oriented grains, whose area fractions are affected by
misorientation of 15°or greater. These boundaries the extrusion temperature, are the Cube-oriented
correspond to high-angle grain boundaries. grains distributed in the center layer. The area
As shown in Fig. 4 (A), the center layer has a crystal fraction of the Cube-oriented grains increased from
orientation distribution that is different from that of 29% to 38% as the extrusion temperature was
the surface layer. The center layer has a structure
300
oriented in the <001> direction, while the surface
Center layer 6005C
layer has an orientation distribution that is relatively 250 LT-ST cross section
random. The center layer is primarily dominated
Mean grain size (μm)

by the distribution of the Cube orientation, and 200

subsequently dominated by the Goss orientation. In
the surface layer, the {112} <110> orientation and 150

{001} <110> orientation are distributed, but these

100 Surface layer
orientations are non-existent in the center layer.
These are the orientations that are the same as the 50
ones3) - 5) formed by the shear strain imposed on the
extrusion surfaces. Also observed in the surface layer 0
460 480 500 520 540
are the distributions of the Goss orientation, Brass Extrusion temperature (℃)
orientation, S orientation and Cu orientation. Fig. 5 Relationship of extrusion temperature and recrystallized
The center layer was separated from the surface grain size

Tex. 480℃ 500℃ 520℃

Surface layer
(A) ST
LT

Center layer
111

001 101
500μm
Surface layer

ST
(B) Surface layer LT

Main textual components

Cube
Goss
Center layer ｛112｝ ＜110＞
｛001｝ ＜110＞
Brass
S
Cu
500μm Surface layer Other
orientation
(tolerance:15゜
)
：Rotation angle of boundaries≧15°

Fig. 4 SEM-EBSD maps of extruded 6005C-T5 alloys (A: Orientation distribution, B: Main textual components)

71 KOBELCO TECHNOLOGY REVIEW NO. 31 JAN. 2013

 60 (a) (b)
6005C Cube
LT-ST cross section Goss
50 Brass
S
Cu
40 ｛112｝ ＜111＞
Area fraction (％)

Cube ｛001｝ ＜110＞

30
1μm

20 Fig. 7 Dispersoids in 6005C alloys extruded at (a)480℃,

(b)520℃
10
Goss
decreasing the extrusion temperature from 520℃ to
0 480℃ decreases the critical bending radius from
460 480 500 520 540
Extrusion temperature (℃) 1.5mm to 0.3mm, indicating that the higher the area
Fig. 6 Relation between area fraction of textual components fraction of the Cube-oriented grains, the better the
and extrusion temperature bendability.

lowered from 520℃ to 480℃. The coarsening of the 2.2.3 Dispersoids

recrystallization grains in the center layer, which
is due to the lowered extrusion temperature, Fig. 7 shows the TEM micrographs of the
corresponds to the increase in the area fraction of the dispersoids in the samples extruded at the different
Cube-oriented grains. It has been reported that, in temperatures. Both samples were homogenized at
the case of extruded round bars of the 6063 alloy, 520℃ for 4h, and almost no difference was found
lowering the extrusion temperature from 520 ℃ to in the particle size and spacing of the Al-Fe-Si
400℃ decreases the ratio of <100> fiber from 53% to dispersoids. Thus, the dispersoids are not the cause
27% in the recrystallization texture at a working ratio of the increasing recrystallized grain size and the
of 92%6). A similar tendency has also been reported increasing area fraction of the Cube-oriented grain
for the case of extruded round bars of pure that are observed with a decreasing extrusion
aluminum, for which the extrusion temperature was temperature. Rather, the change in the recrystallized
lowered from 480℃ to 290℃7). These studies include grain size and texture is attributable to the extrusion
the temperature range in which the materials are not temperature.
fully recrystallized with a significant amount of
<111> fiber structure still remaining. Therefore, these 3. Discussion
results cannot be compared with the results of the
present study, in which a fully recrystallized sample 3.1 Deformation temperature and the amount of
shows a tendency for the area fraction of the Cube- accumulated strain
oriented grains to increase from 30% to 40% as the
extrusion temperature is lowered from 520℃ to In order to clarify the recrystallization process of
480℃. the samples, the microstructure of each sample was
The area fractions of the major oriented grains, observed in the early stage of recrystallization
other than the Cube-oriented grains, remained during the elevated temperature compression test.
almost unchanged regardless of the extrusion Fig. 8 shows the stress-strain curve. It is known that
temperature. As the extrusion temperature increases, the deformation stress during elevated temperature
the area fraction of the Cube-oriented grain 80
decreases. On the other hand, the total area fraction 6005C 60MPa
・＝10s−1
ε
of the other oriented grains, excluding the major
True stressσ(MPa)

60
oriented grains measured, has increased. This
(a)495℃
implies that the higher extrusion temperature 40
facilitates the recrystallization and growth of the 45MPa
(b)535℃
grains having various orientations. It is reported that, 20
in the case of rolled sheets, the bendability improves 1.3
with the increase of the Cube-oriented grains8), 9). To 0
0.0 0.5 1.0 1.5
confirm this, a bending test according to the V-block True strain ε
method (JIS Z2248) was conducted in the LT Fig. 8 Stress-strain curves for 6005C alloys compressed at
direction of the samples. The result shows that (a)495℃, (b)535℃

KOBELCO TECHNOLOGY REVIEW NO. 31 JAN. 2013 72

 deformation is proportional to the 1/2 power of the growth that is larger than that for the sample
dislocation density, as in the case of ambient deformed at 535℃.
temperature deformation10). In the case of the present
compression test, the material deformed at 495℃ 3.3 The crystal orientation distribution in the early
exhibits a deformation stress approximately 30% stage of recrystallization
greater than that of the material deformed at 535℃,
indicating that its dislocation density is approximately In order to confirm the formation of preferential
70% higher. orientation in the early stage of recrystallization,
an SEM-EBSD analysis was conducted at the center
3.2 The crystal grain structure in the early stage of of each of the samples 2 seconds after it had been
recrystallization compressively deformed. The results are shown in
Fig.10. Fig.10 (a) shows the inverse pole figure maps
Fig. 9 shows the optical micrographs in the centers in the compression axis direction with the orientations
of the samples at 2 and 5 seconds have elapsed after
2s 5s
they were compressively deformed for 75% at 535℃ Tcomp.
and 495 ℃. When 2 seconds have elapsed, crystal

Compression axis
grains having diameters of approximately 10 to
535℃
20μm are observed in the deformation structures,
elongating in the transverse direction, for both the
sample deformed at 535℃ and the one deformed at
495℃. These crystal grains are considered to be
recrystallized grains because they are equiaxed. At
the point where 5 seconds have elapsed, both of 495℃
the samples, deformed at 535℃ and 495℃, exhibit
the propagation of recrystallization throughout 100μm
the region observed, with the growth of the
recrystallized grains. The sample deformed at 495℃ Fig. 9 Optical microstructure in center of compressed 6005C
alloys
exhibits a recrystallized grain size after the grain
(a) (b)
Tcomp.
：5 grains
(＜001＞ grains)

：46 grains
535℃ (other grains)

：7 grains
(＜001＞ grains)

：32 grains
495℃ (other grains)

100μm 100μm

Rotation angle of boundaries ≧15° ＜15°

Compression axis Compression axis

111 111

001 101 001 101 (tolerance:15°)

Fig.10 SEM-EBSD maps in center of compressed 6005C alloys

(a) orientation distribution of compression axis, (b) distribution of <001> grain

73 KOBELCO TECHNOLOGY REVIEW NO. 31 JAN. 2013

depicted by the color in the stereographic triangle Immediately after extrusion 5s after extrusion
Tex.
below. The red region in the map is the area where
the compression axis direction is oriented in the High
(520℃)
<001> direction, while the green region is the area
matrix
where the compression axis direction is oriented in High density of recrystallized grains Cube＋non−Cube
the <110> direction. The grains in these areas are Low stored energy
herein referred to as "<001> grains" and "<110>
grains", respectively. In Fig.10 (b), only the <001> Low
grains are shown in red (tolerance: 15° ), in which (480℃)

the black lines correspond to high-angle grain matrix

Lower density of recrystallized grains Preferentiall growth of Cube grain
boundaries and the green lines to low-angle grain high stored energy
boundaries. The equiaxed crystal grains, surrounded ：Cube grain

by high-angle grain boundaries, but not including Fig.11 Schematic view of recrystallization in 6005C alloy
a low-angle grain boundary inside, are regarded
as recrystallized grains. Among these recrystallized to be occurring in the extruded samples. Fig.11
grains, the <001> grains are surrounded by red schematically illustrates the phenomenon. When
circles, while grains other than the <001> grains the extrusion temperature is as low as 480℃, the
are surrounded by blue circles. The number of number of recrystallized grains immediately after
recrystallized grains in the measured field was the deformation is small. However, the occupation
found to be 51 for the sample deformed at 535℃ and rate of the Cube-oriented grains, which can easily
39 for the sample deformed at 495℃. Thus, the sample recover, is considered to be high. In the un-
deformed at 495℃ has fewer recrystallized grains. recrystallized region, where there is a large
The number of <001> grains was found to be 5 for accumulation of strain energy, the Cube-oriented
the sample deformed at 535℃ and 7 for the sample grains, having a high growth rate, grow
deformed at 495℃. Thus the sample deformed at preferentially, increasing the area fraction of the
495℃ has a higher ratio of <001> grains in the Cube-oriented grains in the recrystallization
recrystallized grains. structure after extrusion.

3.4 The mechanism for the preferential growth of Conclusions

Cube orientation grains in the sample
The change in recrystallization texture was
The <110> orientation is considered to have a studied in the T5 treated hollow profiles of a 6005C
large Taylor factor for compressive deformation aluminum alloy, while lowering the extrusion
and a greater accumulated energy, while <100> is temperature from 520℃ to 480℃. Elevated
the orientation with a small Taylor factor for temperature compression tests were also performed
compressive deformation and has a smaller to clarify the recrystallization process. The following
accumulated energy 11). Therefore, the <001> grains conclusions were drawn:
shown in Fig.10 are considered to have an orientation ・ By lowering the extrusion temperature from
that easily recovers and preferentially grows, the 520℃ to 480℃, the average size of recrystallized
orientation which corresponds to the Cube-oriented grains increased from approximately 170μm to
in the center layer of the extruded material. The approximately 230μm, with the occupancy rate
material deformed at 495℃ has fewer recrystallized of the Cube-oriented grains increased from
grains, in the early stage of recrystallization, than the approximately 30% to approximately 40%.
material deformed at 535℃ and has a larger ratio of ・ When the extrusion temperature is as low as
<001> grains. In addition, the material deformed at 480℃, the number of recrystallized grains
495℃ has a greater accumulation of strain energy immediately after the deformation is small.
in the un-recrystallized region, which increases However, the ratio of the Cube-oriented grains,
the growth rate of the <001> grains that can which can easily recover, is considered to be
preferentially grow. This is considered to result in large. This is considered to indicate that, in the
the increased area fraction of the recrystallized un-recrystallized region, where there is a large
grains, such as Cube-oriented grains, that can accumulation of strain energy, the Cube-
preferentially grow. oriented grains, having a higher growth
A phenomenon similar to that observed for the rate, grow preferentially, increasing the area
above described material that is compressively fraction of the Cube-oriented grains in the
deformed at elevated temperatures is considered recrystallization structure after extrusion.

KOBELCO TECHNOLOGY REVIEW NO. 31 JAN. 2013 74

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