Mil PRF 19500K

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conversion measures necessary to
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SUPERSEDING
MI L- S-19500J
15 Apri( 1W4
PERFORMANCE SPECI F I CAT 10N
SEM1 CDNDUCTOR DEVICES ,
GENERAL SPECIFICATION FOR
This specification is approved for use by at ( Depart-

ments nrd Agencies of the Department of Defense.
I
1. SCOPE
1.1 ~. This s~cif icntion establishes the genera~ per for!rnnce requirarrents for sernicorductor
devices. Detail requirenmnts ard characteristics are specified in the associated specification. Four
quality IeveLs for encapsulated devices are provided for in this spscif i cation, different iated by the
Prefi XES JAN, JANTX, JANTXV, and JANS. Sewn radiet ion hardness ass.ra”ce (R HA) Ieve(s are provided for the
JANTXV and JAMS quak i ty Ieve[s. These are designated by the letters H, D, L, R, F, G, and H fol[ouing the
qua[ity level portion of the prefix. Two quality leve[s for .nencapsu leted devices are provided for in this
specification, differentiated by the prefixes JANHC ard JANKC.
1.2 This Swcif i cation contains the performance requirement ncd verification methods for
semiconductor devices. The main body specifies the performance requirements and requires che manufacturer
to verify that their devices are capabie of meering those performance requirurents. Appen3ix A contains
definitions of terms used throughout the specification. Awendix B contains ai+reviatio”s and S@e LS.
Appendix C ~onta ins the stat iscica( srnn$d ing and I ife test procedures, Alwrd I x D conca ins the q“a( i ty
SYSt~ ~wJ1r~nts. Akw~ix E contains the standerd verification fiou for encapsulated devices. Alpmdix
F Co”tal”s the Certification requirements for R.sdiatio” Hardness Assured Semiconductor devices. Apperdix G
contains the Stardwd verification fiow for unencapwlate.i devices. Appendix H contains criticnt interface
and materials for semiconductor devices.
I 1.3 The part nw!bering schemes are as fol lows:
I a. The
specification
Part
is
or Identifying
formulated
Nwber
.9s follow:
(PIN) for e“cap$u [ated semicotiuctor devices furnished under this
!LAY!w A XY Y.Y.u L
JAM brard
qua(ity
ard
leve~
RHA designate.r
(see 1.3.3)
L Carpme.t
des i gnat i o“
-!-
Identification
nti r
1 suffix
letters
(see 1.3.1) (see 1.3.6) (see 1.3.5) (see 1.3.6)
Beneficial ccarnents (recannendati.ans, additions, deletions) .rd my pertinent data which may be of use i“
improving
fOD For.
AHSC N/A
this
1507 Uilmingt.m
1426)
docwrent
~.
Pike,
shou(d
Dayton,
be addressed
OH 45 L41. -5765,
at the ecdof ~t
to: Defense
by using
Electronics
the Standardizaticm
or k (etter.
Suppiy Center,
Docunenc
AT TN: DESC-ELD,
lqmovement Propesal
FSC 5961
I
~. WQrO.ed for public releese; distribution is unlimited.
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MI L- PRF-19500K
b. The PIN for unencapsulated semiconductor devices furnished under this specification is fo.n’ulatea
as fo[ lous:
XY Lm -u-
__T___L J_ J__ -!-

JAN brard
quakity
and
twet
(see 1.3.21
RHA designator
[see 1.3.3)
Cc.-panent
desi gnar i o“
(see 1.3.4)
Identification
number
(see 1.3.5)
Suffix
letters
(see 1.3.61
1.3.1 9ua~itv I e ve~ for eam$Wt~devlces. The quality leve(s for encapsulated devices includes the
JAN brand and associated modifiers as applicable (denoted by 8,0008, in 1.3). These quality [evels frmm the
Lowest leek to the highest (eve( are JAN, JkNTX, J&NTXV, and JANS. JANS is intended for space
opp (icat ions.
1.3.2 Uitv Leve( for u~. The qua(ity (eve(s for une”capsui ated devices inc~udes
the JAN brard ad associated mcdifiers as applicable (denoted by ,80C88 in 1.3). J4NKC is inrendea for space
applications arm JANHC is interdea for stardard military applications.
1.3.3 The RHA designator is a letter which identifies the awlicable RHA level as
de finwl in awndix F (denoted by 08A0, in 1.3). The RHA levels frcm lowest to highest are M, D, L, R, F, G,
and H.
1.3.4 Semicorxluctor devices are identi fiti by the prefix ,, XN,,. The 88X88will
usually be a ntmber that is one [ess than the nmber of active element terminations.
1.3.5 ]t is reccometied that each type of semiconductor device intended for

standardization be assigned an identification, seria ((y, by the Joint Ekectron Device Engineering Counc it, a
counci( sp.mwored by the Electronic Industries Association (E IA) ad the National Electrical Manufacturers
Association. The assigmrent .i(( provide the cc.rponent designation and the identification number.
1.3.6 The fo((wing suffix Letters may t.? incorporated in the military type mmker as
.ppl icab Le.
A., B, C,etc --------- Indicates a mc=dif ied versicm mhich is wbstit. table for the basic
(except L, M, R, S, U) n-red (nonsuf fix) device.
M -------------- Indicates retching of specifiec parameters of separate devices.
R -------------- Irdicares reverse polarity P.sckagi”g of the basic nunbered device.
LOr S ------------ !rdic. tes that the terminal leads are longer cm shorter,
respectively, than those of the Lwsic n!mbered device.
u -------------- Indicates unleaded or surface mmmted devices.
UR -------------- Irdicates un(eaded or surface mounted (routi end cap diodes).
us -------------- Indicates unleadec! or surface mounted (square eti cap dicdes).
-1 -------------- Irdicates metallurgical band.
Suffix letter(sl are used ard marked on the device on(y when specific device types are covered by the
applicable ,ssoci.t~ specification. rewirin9 the suffix letters (see 3.10.6).
2. APPLICABLE DOCUMENTS
2.1 ~. The doctnm”ts tisted i“ this section are s~cifiml in sections 3 and G of this
specificati cm. This secti.a” does not inc(ule documents cited in .arher sect icms of this specification . .
recmmcended for additional information or as examples. Uhi(e every effort has been made to emwre the
cw~etene.. of this List, docwnt .sers are cautioned that they must meet ail specified requirements
docunmts cited in sections 3 am+ L of this specification, whether Or “ot they are listed.
2
M! L- PRF-19500K
2.2 ~.
2.2.1 ~. The following specifications, stnrdards, and h.arnibooks

form a Parr of this docum?nt to the extent specified herein. Unless otheruise specified, the issues of
these docunents are those tisted in the issue of the Department of Defense Index of Specifications ati
Stardards (DcOISS) and supplement thereto, cited in the solicitation (see 6.1).
SPECIF1 CATIONS
DEPARTMENT OF DEFENSE
(See swlement 1 for iist of associated specif ications. )
STAMEIAROS
DEPARTMENT OF OEFENSE
MI L-STD-7S0 - Tesr Methcds for Semiconductor Devices.
MI L-STD- 1835 - Microcircuit and Se!nicorductor Case Outlines.
(Unless otheruise indicared, copies of the above specifications, stardards, and handbooks are avaitabte
fr.an rhe Standardization Oocunmts Order Desk, 700 Robbi.s Avenue, Building LD, Philadelphia, Pb 19111-
5096. )
2.2 ~ds and other ~. The fokkouing document(s) form a part of this
docmmnt to the extent specifietl herein. unless otheruise specified, the issues of the documents which are
OCO adopted are those listed in the issue of the DCQISS cited in the.solicitation. Unless otherwise
spec1fie=5, the issues of documnts not IIsted in the Ornl SS are the Issues of the docunents cited in the
solicitation (see 6.1).
ELECTRONIC INDUSTRIES ASSOCIATION (E IA)
EIA-625 Distributor Requireirenrs for Handling E(mtrostatic Discharge Sem. itive

(ESDS) Devices.
JEDEC Publication 109 - Generat Requiremmt for Oistrititors.
(A@icat ion for copies shou(d be addressed to the Electronic ]rdus tries Association, 2001 Pennsylvania
Avenue, Washington, DC 20006. )
(Non- Gov.?rnre”t standerds ard other ~blicat ions are normally w.si( able frar the c.rganizati.ans which
pre~re or distri~te the doc~nt,. These docurents also may be avnilab(e in or through libreries or other
in fomticwai servic es.)
2.6 ~. In the event of a conflict between the text of this docunent and the references
cited herein (except for related assoc iat& specifications or specification sheets), the text of this
docm.?nt takes precedence, Ihathing i“ this docunmt, however, supersedes applicable [aiis and regulations
un(ess a specific exenpt ion hm been obtained.
3. REWIREMENTS
3.1 The individual device rsq. irm”ts shall be as specified herein .rd in
mxordance with the +@ic. b(e associate-d specification. The generet requiremrmts of referenced docummts
shall also IJF@y. Only devices or die listed or approved for Iisti”g on the O“alifi& Products List (IJPL)
uhich meet all the performs.”ce requirements of the .Wlicab(e associated specification for the applicable
quality leve( shall be marked EIrd de(ivered as appropriate. Any D& specification or stw’dard referred to
in this specific, rstian fray be rep(w,ed by a“ equivalent Ccmmerciak standard as determined by the preparing
activity and the qualifying activity.
3
HIL-PRF-19500K
3.2 ~ SEC ificatim. The individual iren requirements shall be as s~cif ied herein and in
accordance with the applicable associard specification. in the event of a conflict betueen the
requirements of this s~cif icat ion and the essocintd specification, the tarter shati govern. (If a
specific requirement specified herein is not requird for an item, it sha([ be so indicn ted on the
associated specification; for example, Shock, WA.).
3.3 It shall be demonstrated that parts delivered to this specification shaii

be cepable of passing the tests at?d inspections specified in awndix F or appendix G, as required, for the
apfiicabte qua(ity (eve(.
3.4 fkference toasso~. For prp.ases of this specification, when the term ,%pecif ied,,
is .s.4 without references to a specific docment, the inrended reference is to the associated
specification.
3.5 The qua(ifyi”g activity shall verify that the n!anufacturer, s qua(ity system and
device verification system met 4.1, 4.2, end 6.3, if applicable, and that the manufacturer is prcducing
devices uhich mer 3.3. Wafer fabrication and assemb(y operations shall be performed in a facility or
facilities certified by the qualifying activity for the applicable technology to the applicable qu. tity
Ieve(. All testing shall be performed at a facility with M! L- STD-730 (aboratory suitability for the
am(icable method (see appendix D). The reaudit frequency is r.. years. Reaudirs are req. id to maintain
qualification and shall be per fornmd within 24 months of the last review. This vs(idar ion period may be
exterded by the qualifying activity if the manufacturer can demonstrate to the qualifying activity adequate
controls of their system through Statistical Process Co”trc.1 [sPC), self-assessment, Technology Review
Boards (TRB, s), etc.
3.6 ~. Devices furnished under this specification shal[ be prcducrs that are authorized by
the qualifying activity for tisting on the ap+ticab(e q.atif ied products (ist before contract award (see
apperdix E).
3.7 ~ of conformance ard acqQsit ion traceabi L i tx. Manufacturers who offer the products as
described i“ this swcif i cation shall provide wri rten certification signed by the ccxnpany or corporate
off icia( uho has rranaoament responsibi lity for the production of the producrs, (1 ) that the product being
S.WI ied has ken manufactured and sha( i be capable of passing the tests in accordance uith this
specif i cat ion nrd con forrrs to al 1 of the requirements as specified herein, (2) that al L products are as
describ@5 on the certificate uhich acccopanies the shiprent. The responsible of ficiat may, by docuwntec
authorization, designate other responsible individuals to sign the certificate, Lwt the responsibi 1 i ty for
c.mfonrence to the fects shal 1 rest with the responsible official. The cert if icarion shal 1 be confirmed by
docunentati on to the Government or ta users ui th Government conYr acts or svbeont racts, regard~ess of whether
the prcducts are acquired direct(y from the rranufacturer or from another source such as a distributor. Uhen
other sources are involved, their acquisition certification shall be in addition ro the certificates of
conformance d acquisition traceabi I ity provided by the manufacturer ard previous distrihtors. In no case
shat( the manufacturers certi f icate be altered or show signs of alteration. The certificate sha L( include
the fo[ (owing information:
a. Manufacturer documentation:
(1) Manufacturer, s name .rd address.
(2) Customer, s or distributor, s name ard address.
(3) Device type, quality level, and associated specificaticm nurb.er.
(4) Lot identification code (inc(uding assembly plant cede).
(5) Inspection dare.
(6) ‘W.a. tiry of devices i“ shipnent fran manufacturer.
(7) Statment certifying prcduct conformance and traceabi 1 ity.
(8) Signature and date of tr.sm.action.
(9) So(derebi ( icy rei.spectio” date, if app( icnble.

MI L-PRF-19500K
b. Distributor documentation for each distributor:
(1) Distri Lumor Os nams am+ address.
(2) Nams ad address of custcmmr.
(3) Ouanrity of devices in shipment.
(4) Certification that this shi nt is a part of the sh!prent covered by the manufacturer,.
docunentati.n, ard an attac r @d copv of the manufacturer, s original certification.
(5) Signature and date of transaction.
(6) Authorized dea(ers and distributors have handled the prc.iucts in accordance with
the requirnTents of JEDEC pbtication 109 and EIA-625.
(7) Solderabi ( ity reinspection date, if awl i cable.
3.8 Ditical ~. Critical interface and mater ia(s for devices furnished under this
sp.sci ficat ion shall be such that the devices meet the performance requi rements of 3.3 (see apperdix H). For
semiconductor case out( ines, see HIL-STD -1835.
3.9 LQsd and t,,~. The (cad and rerminal finish shall be in accordance with appendix H.
3.10 ~.
3.10.1 The f.al lowing marking shal I be placed on each encapsulated semiconductor
device ad sha[[ be Legible. De~ices having inadequate marking area for al( applicable rarkings shall have
as many of the f.allouing as possible in the fo( (ouing order of precedence [with ,,a. ,” being mast important ).
8. Po(arity marking, when p@icabLe (see 3.10.5).
b. PIN (SW 3.10.6).
c. M.mufacturerns “am.?, trodemark, or identification (see 3.10.11) ard Manufacturerns designating

symbol (see 3.10.7).
d. Lot identification code and code for plants (see 3.10.8 ad 3.10.8.1).
e. Seria( .urb.?r, if epplicab(e (see 3.10.9).
f. Cc4mtry of origin (see 3.10.10).
9. swi.~ ~rki.g (see 3.10.3). BerYLli~ oxide identifier (see 3.10.3.2).
h. E1ectrostntic discharge sensitivity (ESDS) identifier (optional see 3.10.3.11.
3.10.2 ~ on init~r (unit ~ All device marking: except for polarity and seria(
nu!bers, sha(( OISO appear on the unit package used a; the initial protection for de Livery.
3.10.3 ~ If a“y special rrerking is used, it sh~kt in ma way interfere with or obscure the
marking required i“ 3.10. i.
3.10.3.1 ~. Uhen a device, s ESDS c(ass is determined by the ESDS classification test (see
WF=Wix E), the devices rePreSe. t~ by the test maY at the opti.n of the marwfacturer be marked as fo((ous:
e. C~ass 1: lC’%9 V and kl.aw - . - sing[e eq. ii.steral triangle outline or solid (stit[ acceptable as
p,. one designator).
b. C(ass 2: 2,000 V to 3,999 V - .. double @equilateral triangle our(ine or solid (still acceptable
as pin one designator).
c. C(ass 3: 6,000 V to 15,%9 V - no designator.
d. Nonsensitive: Above 15,999 V - no designator
3.10.3.2 Rsryttim oxide ~. If a semiconductor package conrai”s beryl I iun oxide

(beryll ia), the device shall he marked with the designation OBeDO.
3.10.4 -a ie.aibility Ma~king shall remain Legible. Marking damage mused by mechm ical handling
shal 1 not be cause for 1.x r~jecrl on. De.ices having damaged markings sha~ 1 be remarked prior to shipne”t
to imure legibility.
5
MI L- PRF-19500K
3.10.5 p.a[aritv ~. The pol~rity shall be indicated by one

., . .. ,— —..,...
3.10.5.1 w,
a. A dicde graphic s-l or arrow with the arrou pointing toward the cathode Terminal for foruard
bias.
I
b. A single contrasting color band or a minimrn of three contrasting color dots spaced arourd the
Peritiery on the cathode end may be used.
c. An ESD identifier may be used to indicate pn(arity for sensitive devices.
3.10.5.2 ~. A gra~ic s@Ol for B thyristor with the arrou pointing touard the cathcde
termi”a( (for stud-mounted thyrlsr.ars only).
3.10.6 m. Each semiconductor device sha(( be marked with the type designation which $ha(( k-s
formulated as show” in 1.3. If rhe dwice size does not eitou the c.mplete PIN to be marked on the device,
the ccaponent designation portion (see 1.3.4) shall be anitted first fo(i.awed by the q.a(ity level.
3.10,6.1 The type nmber of at ( semi cotiucror devices acquired ro arm+ meeting rhe
requimre.ts of this specification and the applicable associated specification shall bear the +plic.ab(e
prefix. !. the c.se of small size mnicorductor devices, the abkire viated prefix .!, JX, W, JV?4, JVD, JVL,
JVR, JVG, JVF, JVH, JS, JSM, JSD, JSL, JSR, JVF, JVG, or JSH may bs used.
3.10.6 .1.1 Jtlf4end [email protected]. The United States Government has adopted, and is exercising (egit imate
control over the certification marks O@ JAN,O ad “J,,, respectively, to indicate thet items so marked or
idenrif ied are manufacture to, and meet al 1 the req. irerrents of the appl i cable spscificflt ion. Accord ing(y,
items acquired to, ati meeting all of the criteria specified herein ard in applicable specifications shall
bear the certif i cat ion mark ,, JAN,, except thot items too sma( [ to bear rhe cert ificati.m marked ,, JANnn shal 1
bear the (etter ,,J,o. The ‘SJANO, or ,,J#, sha L 1 be placed inrnediately before the PIN except that i f such
location would place a hardship on the manufacturer in cotmect ion with such marking, the ,SJANO, or ‘OJ,O may be
Located on the first line ,bo.e or below the PIN. I terns furnished under contrncts or orders which either
Prmit Or r~uire deviat i.. fr~ the cO~it ions or requirements specified herein or in applicable
Specif icat ions shnl [ not bear ,, JAN,( or ,,JL,. 1. the event a“ item fai Is to meet the require’nents of this
specification ard the a#icab(e associated specifications, the manufacturer sh.ali remwve carptetely the
mi [ itary PIN erd the ,, JAN,, or the O,Jn, frun the sanple tested and .1s0 frun =3( I item represented by the
sample. The ‘, JAN,, or C,J,, certif i cat ion mark shal 1 not be used .“ products acquired to c.a”tractor dr.swings
or specifications (see 6.1.1). The united states Goverrrnent has obtained Certificate of Regist rat io” Number
50L, S&l for the certif icari.m mark ‘, JANSs and Registration N!mber 1,5SA,261 for the cert ificet ion mark ‘,J,,.
I
3.10.7 [email protected] The manufacturer,. desig.oting SMI shst( be as listed in
the OPL ard assigned by the qua[ ifyi.g activity. The synixl sha[ [ be used on[y by the manufacturer TO Hhmn
it has been a$sign~ ard only on those devices manufactured at that manuf.scturer, s plant. 1“ the case of
sral 1 devices, the manufacturers designating symbol ray be abbreviated by cmitt ing the first 81C,, in the
series of [etters.
3.10.8 ~. Semiconductor devices shal ( be marked by a code irdic.sting the last ueek
of seating for the i“specti.a” lot accwl ation pericd. The first two mmbers in the code sh.sl( be the last
tuo digits of the nur&er of the year. The third and fourth numbers sha LL be tuo digits indicating the
ca(endar week of the year. Uhen the ntmt.er of the week is a single digit, it shall be preceded by a zero.
Reading fran left to right or top to Imttcm, the cede nimber shal 1 designate the year and week. I/he” more
than one lot of a device type sealed within the swe 6-ueek pericd is submitted for conformance inspection,
a lot identification suffix letter sha[[ be chosen, consisting of a sing(e .apitak Lette~, m-d sha LL appenr
o. each semiconductor device immediately f.al lowing the date CC+, This letter sha( ( be chosen by the
manufacturer so that each inspection lot is uniquely identified by the tot identification cede and by the
lot identification suffix letter, if one is required. The lot identification cede shall not be emitted fran
the marking on DO-35 packages.
3.10.8.1 ~. If the devices are assdled or fabricated at a pl.mt other than the basic
planr, the (or identification cede shall include a single (etter which .“iq.ely identifies the plmt or
country here the plant is toc~ted. This plant designator sh.al 1 a~ar imne-diately preceding ard adjacent
to the dnte cede. The plant designator ui [ 1 be ( isted with the addresses in the OpL.
6
MI L- PRF-19500K
3.10.9 ~. JANS devices and, when sp-?ci f ied, other device (eve(s shal I be marked with a
unique serial number assigned consecutively ui thin the inspection lot. JAW devices shai t be marks-d with
the seria( number prior to the first elect rica( test in screening, and inspection lot records shall be
mai”taineci to provide traceability fran the serial ntir to the specific uafer inswcr ion lot fran uhich
the devices originated. For sma( ( devices uith im+uff icient area for serialization, lead or WY tags may
be used.
3.10.10 .C9msrv of ori. in. The manufacturer shal 1 indicate the country of origin of the device. At the
option of the manufacturer the country of origin marking may be ani tted from the body of the device but
shall be retained on the initial container.
3.10.11 [email protected]’s ~n. Or trad~ark. At the mmufacturer, s opt ion, devices SUPP1 iea
to this sp?cificnt ion may be marked with the device manufacturers nam, atbrewiatiort, or trademark in place
of the designating stit described in 3.10.7, except for a manufacturer with mltip(e facility loc. tions.
The identification of the equipment manufacturer may apwar on the device on(y if the equipnent manufacturer
is also the device manufacturer. The name or trademark of on(y the original manufacturer shal 1 appear on
the device or initial container. Atreratio” of narm or trademark shal L nor be permitted.
3.10.12 ~. Except for serial izat ion, the manufacturer has the opt ion of marking the entire
tot or onty the samp~e devices prior to inspection. 1 f the manufacturer exercises the option to nmrk on(y
the sample devices, the procedure sha( ( be as fol lows:
a. The sanqIke devices shatt be marked prior to per for!rbnce of conformance or quai i f icarion inspection.
b, At the cmpler ion of inspection, the marking of the sanple devices shat( be inspec tea for
conformance with the requirements of 3.10.1 arai 3.10.4.
c. The inspect ion tot represented by n conforming inspect ion sample sha( ( then be marked ad any
svcifi~ visual 0~ ~chanical insPcti On ~rform~.
d. The marking materials and orocess ins erd fed to the inspect ion lot shat t be to the same
specification es those us&l for the in@ct ion snrple.
3,11 All parts shal[ be capable of passing the solderability test in accordance uirh MI L-
STD-750, test method 2026, on del i very.
3.12 Z.$D contro(. Semiconductors shal I be hardled in accordance with EIA-625 or other industry standard
practice, to safeguard against discharge damage, as app[ icab(e.
3.13 AIL devices delivered to thfs specification shall be identified (see 3.7 ard 3.10.1)
such that they shal I be traceable through the lot identification code and ins~ct ion I or records. In
addition, JANS devices sha[ [ have a lot contro L system frmn wafer processing through screening uhich
provides uafer lot identification, operation (machine), date of operation, operator(s) identification,
quantiry, and serial nu@?rs of devices processd.
1,. VER1F1CA11ON
C.1 Oualitv svs~. The manufacturer shall implnmmt and maint~in a qwa(iry system. This system sh.al(
assist the manufacturer in prcducing devices which meet 3.1. See awndix D for rhe qual i ty system
req. i rerenrs.
4.2 Wice verifiu. The manufacturer sha(( imp(emenr and maintain a verification program tihich
deranst rates that devices meet 3.1. Awendix E is the stardard verif icatio” f low for encapsulated devices,
EFW7di X G iS the standard verification f(ou for “Oe”caps”l ated devices.
4.2.1 The inspection req. imare.ts specified herein are classified es

follows:
a. Qua\ificatic.n inspection (see appendix E).
b. Screening (see appendix E).
c. Conformance inspection (c I)(see a~rdix E).
6.3 ~. Manufacturer, s prcduci”g RHA quatif ied devices shall i$rptement and mai”tai” a RHA
program uhich demonstrates device CW( iance uith 3.1. .Vw~i~ F she~ ~ LX US~ in developing This program.
7
MI L- PRF-19500K
6.4 kst Mifi*. reduction. or el~. Tests arm inspections may be mcdif ied, reduced, or
eliminated wi th the approva( of the preparing activity and the qual ifying net ivity. Uhen a manufacturer
modifies, reduces, or eliminates a test or inspection, rhe manufacturer is only relieved of the
respo.sibi I iry of performing that test or inspect ion. The manufacturer is st i 1 ( responsible for pravidi”g
product which meets 3.1.
4.5 ~. ESOS testing sha(( be done in accordance with test methcc 1020 of MI L- STD-750 and the
associated specification. Unless otherwise specified, tests sha LL be performed for initial quaiifi carion
and product redesign as a minim.
5. PACKAGING
5.1 For acquisit ion p.mpmes, the packaging requirements she[ ( be as sp$cif ied in the
contract or order (see 6.1 ). when actual packaging of materi ai is to b.? performed by DCO p?rsonne(, these
personne[ need to contact the responsible packaging activity to ascertain requisite packaging requirements.
Packaging requirements are maintain~ by the Inventory Control Point ,s packaging activity within the
Mi I i tary Departrrent or Defense Agency, or within the Mi I itary Department 0s System connard. Packaging data
retrieval is avai [ab(e fr.an the mmaging Mi ( itary Department 1s or Defense Agency Os a.tmna ted packaging
fiLes, CO-RW products, or by contracting the responsible packaging acrivity.
6. NOTES
(This section contains information of a general or explanatory nature that may be he(pf .(, but is not
rrendatory. )
6.1 .559usi [10. r~ulr_. Acquisition docune”ts should specify the fol lowing:
a. Tit(e, nunber, ad date of this specification.
b. Issue of OCOISS to bs cited i“ the solicitation, a!?d if required, the specific issue of individual
docunents referenced (see 2.2.1).
c. Pnckaging requirnrents (see 5.1).
d. PIN (see 1.3).
e. Nu&.r of the a@ icable asso. iatd specification (see 3.4 and supplement 1 of this document], For
additional information on PINS nor i“cltied in supplement 1, cent.scr the Defense E(ecrronics Supply
Center, DEsc-ELD, Dayton, OH 45444.
f. Lead formation, kength, finish, if other than that spscif ied, cm when a choice is required by the
device rJWl icati o”.
9. Data requi r-m?., when Bppl icabte.
h. S~cify point of shi~nt.
i. PIND scree”img when required.
i. Date cc-de and speci ficat ion revision letter rust not be restricted by the ~cq.isicio” doc!nnents.
6.1.1 E?ALWSS order rea.irm. The JAN brard or the abbreviations mst not be uses on any
semiconductor device acquired under contracts which permit or require any changes to this speci f i cat ion or
the awl icab(e associamd specification, except for:
s. Lead length.
b. Finish.
c. PIND testing. PIND screening to requirnre”ts beyond those specified herein may be
performed .mly when impsed by the nc.qui sition docurenr upon the mxqsonent manufacturer.
A W. PIN wi(( be created in accordance with 1.3 and 3.10.3. Devices uhich pass such
screens may be JAN branded or may retain the JAN brand if already marked. Al 1 devices
fai 1 ing such screens must mat be JAN brarded or, if already marked must have the JAN brand
remaved or the device destroyed.
8
HIL-?RF-19500K
d. Lead forming. The forming of leads must not be performed except for specific customer
purchase orders where the lot is control led throughout processing by spscif ic tot
trovders. The h-d mst not be closer then .050 inch (1 .27 mm) to the glass seal If
lead forming is performed, a hermst icity test mst be performed in accordance with table
IV, screen 7.
6.2 Devices covered by associated specifications are substitutable for the

manufacturers ad user, s PIN, s. This information in no way inplies that manufacturers PINs ere suitable
as a substitute for the mi iitary PIN. The table blow is an exanp(e of the type of cross reference data
that should be avai[ab Le in the nssoci. ted specifications.
Supersess ion and cross reference data.
Mititary Manufacturer, 5 Manufacturer,. arm+ .ser, s

PIN CAGE .&e PIN
6.3 ~. !dith respect to prcducts requiring qualification, awards will a[so be made only for
prcducts which are, at the time of award of a contract, qualified for inclusion in OPL, whether or not such
products have actual lY been so ( isted w that date. The ectent ion of the contractors is ca( (ed r. these
requirements, ard manufacturers are urged to arrange to have the products that they propose to offer to the
Federal Goverrrnent tested for qualification in order that they may be eligible to be auarded contracts or
Prchnse order for the products covered by this specification. The information p.?rraining to qualification
of prcducts may be obtaind from the Defense Electronics Supply Center, DE SC- ELS, Dayton, OH 45444.
6.6 -t term ~:
Doub(e P(W construction

Electrostatic discharge sensitivity (ESD)
Foilure analysis (FA)
Uetat (urgicO( bond
0“=31 ificetion
Qualified prcducts listing (QPL)
Qua( i ty assurnnce (QA)
Ffadiatio” hardness assurance (RHA)
Statist ic.3L process ccmtrol (SPC)
Thern!a( ntstch
Therrrai resp.mse
9
MI L-PRF-19500K
APPENDIX A
DEFINI11ONS
A. 1 sCOPE
A.1.1 -. This appendix contains the de finirio.s of terms used with semiconductor devices. This
appendix is not mardatory.
A.2 APPLICABLE DOCUMENTS. This section is nor applicable to this a~ndi K.
&.3 SEMI CONDUCTOR CCW40N DEF I NIT IDNS
A.3.1 The values specified for ,,ratings,,, ,%!axi, rm ratings,,, or ,,abso lure
maxim ratings,, nre based on the %bsolute system>, and unless otherwise required for B specific test methcd
are not to be exceeded ur.ier any service or test conditions. These ratings are [imiting values beyond which
the serviceabi 1 ity of any individual semiconductor device may be impaired. Unless otherwise specified, the
voltage, current, and power ratings are based on continuous dc power conditions at free air ambient
t~rature of +25-C. For pulsed or other conditions or operat ion of simi Iar nature, the current, voltage,
ard power dissipation ratings are a function of time and duty cycie. In order not to exceed absolute
ratings, the equipnmt designer has the responsibi 1 i ty of determining an average design value, for each
rating, below the absolute value of thet rating by a safery factor, so that the abso Lute values will never
be exceeded urder any usuat conditions of su@y-vo(tage variation, load variation, o. manufacturing
variation in the equipment itseif.
A.3.2 ~ tenmerw. Ambient temperature is rhe air temperature measured below a semicocducror
device, in .n envirommsnt of substantia~~y uni form Wrr@rflture, cooled only by natural air convect ion and
not rester ial IY effected by ref Iective and radiant surfaces.
h.3.3 -. The eLectrcde fmn uhich the forward current f lows ui chin the device.
A.3.4 ~. Since this specification covers the general requirements and tests for
s.xnicotiuctor devices, the detai (s of performance of the semiconductor device nmtst lx spcif ied in the
associated specificati cm. Item listed be(ou shou(d be covered in the associated specification:
8. PIN (see 1.3)
b. Generic design, construction, and rreteria[ (see appwdix H)
c. The marking to be unitted if any (see 3.10). The order of precedence for marking is as listEd in
3.10.1.
d, Classification of inspection.
(1) EKamir,atian and tests to be performed under qualification inspscti o”,
(21 Examination and tests to be per formal under Cl
(3) Exmni”at ion and tests to be performed under screening inspection.
e. Ed-point measurements t. be made for group B, C, D, am+ E inspections (see appendix E).
f. Quality Ieve(s covered.
g. Oevice [eve( and screening procedure i f other than tab(e 11
h. Sequence of test, test methcd, test condition, timit, cyc\es, temperature, or axis; when not
specified, or if other than specified herein.
i. I“tecim (pre- md past-turn-in) electrical pamreters
j. S.r”-i” test condition and Ixm”-in test circuit.
ID
MI L-PRF-19500K
APPEND 1X A
k. De(ta parameter measurements or provisions for PDA including procedures for traceabi ( icy, where
awl icab(e.
1. Fina( electrical measurements.
m. Requirements far data recording ard reporting, uhere apfii. able.
A.3.4. I .Y.LL-sTD -750 detai~. 1“ addition to the itms as specified i“ 4.3. L, the applicable derails
required by MI L- STD-750 should be (isted in the associated specification.
A.3.5 Rb&j.09. A term describing the state of a semi cor?ductor device or j.net ion which eventual (Y
prevents the f(ou of current.
A.3.6 ~n vo[reoe. The breakd.am voltege is the maxir#_m instantaneous voltage, including
repetitive and nonrept it ive transients, which can be appl ied across a iunct ion in the reverse direction
without an externa( mans (ci rcuit ) of I imiting the current. It is also the instantaneous va(”e of reverse
voltage at which a transition cmmrences from a region of high $m!ai l-signal inpedance to a region of
substantia[ty lower small -signa( impedance.
A.3.7 ~. A type of package (outline) uhich provides a method of readi lY attaching one surface
of the semiconductor device to a heat dissipator to achieve therrrel management of the case temperature
(exN@e: To-3, DO-4).
A.3.8 w temc.?r~. Case t~rature is that twrature measured at a specified point on the case
of a semicc+?iuctor device.
A.3.9 ~. The electrode to uhich the foruard current flows within the device.
n.3.lo An inherent and measurable property of a device. Such a property WY b

electrical, mschanica(, thermal, hydrau(ic, e(ectrcma9netic, or nuclenr, ard can be expressed as a value for
stated or recognizd conditions. A characteristic may B(SO be a ser of reiated va(.es usuatty shown in
grap?ica( form.
~.3.~~ ~. A current source sha(( be considered cansta”t if ha Lvinq the generator

impedance does not Produce a change in the parameter king measured that is greater than the required
precision of the measurement.
A.3.12 G9.u5tant voLtaae s-. A voltage source shal I te considered constant i f doubt ing the g.merator
irm=dance does not prcduce a change in the parameter being measured that is grearer thim the required
precision of the measurement.
A.3.13 ~. A type of Wckage (outline) for very high po.er devices which provides two paral Iel
surfaces for mounting into a special ized heat dissipator capable of applying a specified compressive force
to the device.
A.3.14 The bias uhich terds to produce current ft.. in the forward direcrim (p ty~
smicortductor region et a positive potent iat reiative to n typ+ region).
A.3.15 ~r~ical Imd. ~LC. Metal L.rgica( bands as uses in

JAN-brand semiconductor devices wi(( be identified by .me of The fo{lwi”g categories. The listing of the
three types of met~((urgice( bonds is for clarification nrd may not necessarily be (isted i. order of merit.
A.3. 15.1 Doub(e p(.g construction is one where the yermi”a( plugs have equal
ncminal diatm?ters. P(U9 contact .ith the semiconductor die may be achieved ei the, through direct contact
with the die merallimt ion mater ia(s or via brazing . . solder prefmm meta((iz arim. The use of a point
conract whisker or other uire conductors is not at (oued.
A.3.15.2 msh - c~. Dash-one dicdes sha(( be of do.bke ,01.9 construction utilizing high
t-rature wta~ 1.r9ical bondi.9 bet.ee. both sides of the si t icon die and attach preform or terminal pins.
11
f41L-PRF-19500K
APPEND IX A
A.3. 15.3 ~eqorv 1 m~. A cntegory 1 meta((urgica( bond is formsd uhen the bond tetueen
the semiconductor element (such as siLicon or gerrreniwn. ) and the package consists of a phase which metts
during the bonding process ard which inc(udes in the solidified melt both a portion of the semiconductor
elenmt and a portion of the rretaliizat ion tayer which is on the package mounting surface. Category 1 bones
betueen adjacent semiconductor elements (as in stacks) sha(( <ncti.de portions of bath se+nicorductor elements
in the solidified melt. Un(ess ocheruise specified i“ the associated specification, category 1
metallurgical bords are typically required for a(t axial Ieadni diodes, equa( to and greater rhan 1 uarr or
1 allp.
A.3.15.4 C4Leqorv II Wr.icat W. A category 11 metallurgical hod is formed utilizing a brazing

or soldering alloy which melts during the hording process and bomis to a metal lizar ion layer on each of the
surfaces being j’ained. Dissolution of the semiccductor element or any of the wetted surfece Layers is nor
requi red.
A.3.15.5 C41wrV Ill .~. A category 111 metallurgical bond is formed when the surfaces
to be bonded are brought together under conditions of temperature acd pressure such th. r a diffusion kard is
formed betueen the ourerrrost meta(lizat ion layer of the elerents being joined. This bond is characterized
by having species fran both sides of the origina( interface diffused across the interface without any mo[ten
phase having been present.
A.3.15.6 Wo-cavitv do.b Le D[uq w. Do”bie plug construction where the package glass is in inrimate
comact with the semiconductor die isolating the anode md cathcde regions, and insuring inm.mity from
partic(e retated failures. Voids may be present provided isc.l.at ion (to prevent arcing) and partic[e
irnnmity are insured.
A.3.15.7 Diode construction within rhe coefficients of thmna(

expansion of the die, plug, and psckage nmteria(s shall be thermally Mtched such that the dicdes are innune
to intermittent owns by design. Axial-leaded diode critica( interfaces which COMP(Y uirh this definition
nust uti(ize tungsten or mo(ytde.m plugs.
A.3.15.8 matlv matti-noncavitv - dc.ub Le Okuu constr .ctiw. Axinl-(eadec

diodes meeting this definition nust be of double P(U9 construction utilizing tungsten or m?alyMenun plugs.
Both sides of the dicde chip (die) must be bvrmkd to the correspmding plug by a category 1 metallurgical
bond. The package must be thermally marched, non-cavity construction (see A.3.16.1 through A .3.14.7). The
p(ate silver button contact design is not permitted.
A.3.76 h!pise fiuure. At a selected inpt frequency, the noise figure is the ratio of the t.tat noise
pouer per unit bandwidth (at a corresp.mding outwt frequency) delivered to the output termination, to the
portion thereof contributed at the inpn frequency by the inwt termination, whose noise Cemperarure is
standard (293-K) at a(( frequencies.
A.3.17 ~. A circuit shall be considered as open circuited if ha(ving the magnitude of the
terminating inqwdance does not produce a change in the paraneter being measured greater than the spec<f ied
accuracy of the measurem.mt.
A.3.18 ~. A Pck.ge type is a package which has the sow case outline, configuration,
rra%eriats (inctuding hording, wire, or ribbon and die attach) piece parts (exc(uding preforms which differ
only i“ size) and .3ssemldy processes.
12
HIL-PRF-19500K
APPENDIX A
A.3.19 ~. A.paise ~s a !Low of electrical energy of short duration. See figure 1 for illustrations
of the characteristics defined In A.3.19 to A.3.24, inclusive.
c, . PuLse rise time.
rd = P.(se de(ay time.
cp . Pu(se time.
rS = Pulse storage rime.
tf = Pulse fall rime.
tw = Pukse average time.
1 = PuLse anditude.
NOTES:
1. subscript 2 denotes o.twt
2. Subscript 1 de”ores input.
FIGURE 1. p.[se measurements.
A.3.20 E!!&s .V,ra., lim. The average pulse time of a Plse is the time duration frcin a point on the
leading edge which is 50 percent of the maxinain amp(itude to a point on the trailing edge which is 50
percenr of the maxim.m awl itude.
A.3.21 P!&ze detav tire. The delay time of a pulse is the time interva( from a point at uhich the
(eading edge of the in~t pd(se has risen to 10 percent of its maxirmm amplitude r. a point at which the
leading edge of the output Wise has risen to 10 percent of its maxinun enqiitu de.
A.3.22 The fall time of a Wise is that time duration during which the amplitude of its
trailing edge is decreasing frcm 9D to 10 percent of the maxi- amp( ittie.
A.3.23 The rise time of a pulse is that tiim d.rati.m during which the anp(itude of its
leading edge is increasing frcm 10 to 90 percenr of the maxi- anplitude.
A.3.24 U stora,e *. The src.rage rime of a pulse is the time inrerva L from a point 10 percent doim
from the maxim.m arplitude o. the trei(ing edge of the i“pr pulse to a point 10 percent doun frcm the
n!axinun amplitude on the trai Ling edge of the cutput pd(se.
A.3.25 The Plse time of a F.I(se is the rime interval frc.n the point o“ the (e.ading edge
which is 90 prc.enc of the maxim awl itude, to the poim m the Wai (ing edge uhich is 90 percent of the
maxirmm anpiitude.
,4.3.26 A radiation failure is defined at the lowest radieti.an level when either any
device parameter exceeds its specified pest irradiation parameter limits (PIPLJ or the device fails my
f.nctionel test in accordance uith stated test corditi.a”s.
13
APPEND IX A
A.3.27 ~. That FOrt ion of performance verification testing that assures

that parrs meet the radiation response characteristics as specifies in this specification ard the associated
specification.
A.3.28 m. The nuninal vo[ue of any electrical, thermal, mechanical, o. environmental quantity
assigned to define the operating conditions w-de. uhich a c.arpenent, mchine, apparatus, or e(ecrronic
device is expected to give satisfactory service.
A.3.29 The bias uhich tends to produce current flow in the reverse direction (n type
semiconductor region at a p-xi tive wtentinl relative to rhe p type region).
A,3.30 ~. Electronic device in Mhich the charecrer istic distinguishing electronic

cc.rd.ct ion takes place within a sernicocduct or.
A.3.31 ~. A semiconductor device having tuo termina[s and exhibiting a nonlinear

vo(tege- current characteristic.
A.3.32 ~. A vegion of trensi rion between semiconductor regions of di f ferenr

electrical properties (e. g., n-n+, p-n, P-F semiconductors) or betueen a metal and a semicorductc.r.
A.3.33 Short circuit. A circuit shal I be considered short-circuited if doubting the magnitude of the
terminating imedance does nor prcduce a change in the p#ramerer being measured that is greater than the
specified accuracy of the measurement.
A.3.3L S~LL ,iqnti. 4 signak shakl be considered smll if doubiing irs magnitude does not produce a
ch.mge in the parameter being measured that is greater than the specified accuracy of the measurement.
~.3.35 ~. Storage temperature is a ternperar.re at which the device may be stored

uithout any power being applied.
A.3.36 The ratio of the change in a paramter to the change i. t~r.ature.
A.3.37 Ikco3al cmre~. A tacd achieved when pressure and temperature are present regardless of
ho. the temperature rise uas achieved except without ultrasonic assist.
A,3.38 lllbrsun. Thermal equilibrium is reached hen doubling the test tirre interval does not
produce a change, due to thermal effects, in the parameter being measured that is greater than the specified
accuracy of the measurement.
A.3.39 I&d resistam. Thermal resistance is the temperature rise, per unit power dissipation, of a
junction above the temperature of a stated external reference point under conditions of thermal equilibrium
A.3.60 ~. A hi-stable semiconductor device that c.a?prises three or mre junctions and can be
switched from the off st. te or on state to the opposite state.
A.3.41 ~. An active semiconductor device capab[e of providing power amplification and having
three or rare termina [s.
14
MI L- PRF-19500K
APPENDIX A
A.3.62 Expacded metal lizat ion is m?tal Lizat ion that increases in area (example,
metal Ii”e to bend pad area) (see figure 2).
METALLIZATION
I
~< ‘AD “E’

I
I
I
FIWRE 2. E3s@eof ~.
A.3.43 ~. A W!se with a defined virtua( front ad in’Qulse duration for either a wattage
or current anptitude of unidirectional polarity.
A.3.66 ~. The plse time es defined by 1.67 times rime for ..(rage to increase frcm
30 percenr to 90 percent of crest (peak vaiue) or 1.25 times time for currenr to increase frcm 10 Fercent to
90 percent of crest.
A.3.45 The time required for a“ iuqxlse uaveform to decay co 50 Wrcent of the peak
va(ue measured fr.am rhe start of the virtua( front duration of zero crossover.
A.3.46 L@. A collection of similar wafer fabrication flows, or simi(i?r package asserb(y ftous used to
manufacture semiconductors in accordance uith a swcif ied process flow.
A.4 TRANSISTOR DEFINITIONS
A.4. I Jmtlo. tr~.
A.4.1.1 &lss. A region which lies betueen an emitter and collector of a transistor and into which
mi”oriry carriers are injected.
A.4.1.2 ~. A region through which a primary flow of charge corriers leaves the base.
A.4. 1.3 Woff current. The cutoff current is the mees.ren va(ue of d. Current when a rrnnsisror is
reverse biased by a voltage less than the breakdoun voltage.
A.4.1.4 -. A region frcin which charge carriers that are minoriry carriers i“ the base are i“jec tea
into the base.
k.ti.l.5 &ti.an. Collm. A semiconductor junction, “orn!ally biased in the reverse direcc ion, rhe
current through which c.” be c.mtroll~ by the inrrod”ct ion of minority carriers into the base.
A.4.1.6 ~. A semiconductor junction nomlly biased in the foruard direction r. inject

mimarity carriers into the base.
15
141L- PRF-19500K
APPENDIX A
A.4. 1.7 A base current ard a collector current condition resu Lting in a forward- biasec
collector junction.
A.6.2 Wction trans1su2cs.
A. G.2.1 The pint on the emirter current -volrage characteristic corres~nding to the lowest
current at which the change in emitter base vo(tage uich respecc to emitter current equa Ls zero.
A.4.2.2 ~. A three- tenni.a( semiconductor device having one junction ad a stable

negative-resistance characteristic over a wide teK@r acure range.
A.4.2.3 The point on the emitter current-voltage chflracter istic corresponding to the
second lowest current at which the change in emitter base voltage with respsct to emitter current equals
zero.
A.4.3 m.
A.4.3.1 made ~. The operation of a FET such that changing the gate to source voltage
fran zero to a finite value decreases the magniruie of the drain current.
A.4.3.2 A FE1 having appreciable chmnel conductivity for zero gate to source
voltage. The chnmel conductivity may be increased or decreased according r. the polarity of the applied
gate to source voltage.
A.4.3.3 ~. A region into which n!ajoriry carriers f(ow frcrn the channel.
4.4.3.4 [email protected] o~rati. The operation of a FET such that changing the gate to source volrage
frun zero to a finite value increases the magnittie of the drain current.
A.4.3.5 A FE1 having substonc ial Iy zero channel conductivity for zero gate to
source voltage. The channel conductivity may be increased by the e@icW ion of 8 gate to source woLtage of
appropriate @arity.
A.4.3.6 ~. A transistor in which the conduction is due entirely to the flo. of majority carriers
through a cc.rduct ion channel controll@5 by an electric field arising frun a voltage applied betueen the gate
m-d source terminals.
A.4.3.7 W. The eLectrcde associawd with the region in which the electric fieLd due to the control
voltage is effective.
A.4.3.8 A FET having one or nmre gate electrodes which are eleccrica((y insulated
frur the channel.
A.6.3.9 JJi.UUWmW.L&I A FET that uses one or more gate regions to form p-n junction(s) uith the
chame(
A.4.3.1O w. An insulated gare FET i“ which the ins.lecing layer betuee” each gate electrode nrd the
channel is oxide material.
A.4.3 .11 ~. A FET that has an n type conduct ion .hamel
A. I..3.12 ~ F A FE1 that has a p type conduct ion chnnne(.
A.4.3 .13 -. A region frun .hi.h majority carriers flou into the channel.
A.5 DIEIIE AND RECTIFIER DEFINITIONS
$..5.1 ~ rect~fler diodes.
16
MI L- PRF-19500K
APPEND IX A
A.5.1.1 rectlf ler diode. A device having an .mynrretrica( voltage-current characteristic

used for rectification.
A.5. 1.2 ~ctor siona L dicde. A device having an asymmetrical voltage-current characteristic and
used for signa L detection.
A.5.2 ~.
A.5.2.1 A device .hich converts rf energy into d. or video output.
A.5.2.2 A microwave diode chat exhibits negative resistance arising fran the bulk negative
differential conductivity occurring in severat ccnqmurd semicccduct.rs such as gakki’nn arsenide, and that
operates at . frequency determined by the transit time of charge bunches formed by this negative
differential conductivity.
A.5.2.3 IM.?2J1 di~e ~ e~ transit ti~ diti. A semiconductor microuave diode chat,
when its junction is biased into avalanche, exhibits a negative resistance over a frequency range determined
by the tra.si t time of charge carriers through the deplet ion region.
A.5.2.6 M! ditie ~t~-cha,.. acc~. A microwave dicde similar to the Gunn diode
except that it achieves higher output power at frequencies, determined by the microuave cavity, that are
several times greeter than the transit-time frequency by avoiding the formation of charge kunches or
domains.
A.5.2.5 A pair of dicdes identical i“ outline dimensions and with matched electrical
characteristics. The tuo dicdes mGY both be for.ard po(arity, or one forward ad one reverse polarity, or
both reverse polarity.
A.5.2.6 mouave divds. A t.. termi.ai device that is responsive in the microwave region of the
eLectrcmgnetic spect run, .C.rrronly regarded .3s exrerding frcm 1 to 300 GHz.
A.5.2.7 ~. A microuave dicde that chines rf signals at tuo frequencies to generate a“ rf

signal at a third frequency.
A.5.2.8 12BpATT di~e (tr& D1as~ ‘dY&Ic@ transit ti~ di~el. A microwave diode that, when its
junction is biasd into avalanche, exhibits a negative resistance at frequencies beiow the transit time
frequency range of the diode due to 9enerac~on ard dissipation of trapped electron-hole piasma resulting
fran the intimate interact ion ktueen the dlcde and a nult i resonant microuave cavity.
A.5.3
A,5.3.1 A device in which quantuw mechanical tunnel i“g leads to a region of negative
slope in the forward direction of the current-voltage characteristic.
A.5,3.2 R.@ward di~e. A device in uhich quantun-mechanical tunneling (cads to a c.rrenr-v.altage

characteristic with a reverse current greater than the foruard current, for equa( and opposite app( ied
.0( tages.
A.5.4 mltaae-rew~ator i voltaae-reference dicde$.
A.5,4.1 A dicde which is normally biased to operere i“ the breekdoun region of

its voltage-current chwacter istic ard which develops across its termi”a(s a reference voltage of specified
.ccuracy, when biased to operate throughout a specifid current md t~rature range.
A.5.4.2 k!dtaae-re~. A diode Mhich is normal (y biased to operate in the breakdou” region of
its voltage-current characteristic ad which develops ncross its terminals an esse”t ial ly constent voltage
throughout a specified current range.
17
MI L-PRF-19500K
APPEND IX A
A.5.5 .Wm7t-rewM2dMss.
A.5.5.1 Wrr ‘-req~. A dicde which Limits current to an essentially constant value over a
specified voltnge range.
A.5.6
A.5.6.1 Hractor di5@2. A two terminal semiconductor device in which use is made of the property that
its capacitance varies with the SPP( ied voltage.
A.5.6.2 A varactor diode used for rf tuning including functions such as automatic
frequency contro L (AFC) .m?d aut.mntic fine tuning (AFT).
A.5.7
A.5.7.1 ~. A transient voltage suWressor that is a non( i near resistor uith synmterrica(
characterist its.
A.5.7.2 A transient voltage Suwressor that is a semiconductor diode that can

opere.te in either the foruard or reverse direction of its voltage-current characterist i. to 1 imit voltnge
tram i ents.
A.5.7.3 ~. The voltage in a region of low differential resistance that serves to limit
the transient voltage across the device terminals.
A.5.7.6 The ratio of .Lanpi”g voltage to breakdoun voltage.
A.5.7.5 The peak current for a series of essential [y identica[ iqwlses.
A.5.7.6 ~bv curr~. The dc current through a transient voltage suppressor at rated standoff
voltage.
A.5,7.7 The peak power dissipation resulting frcm the peak impulse current
lPP.
A.5.7.8 ~. The time inrer.a( between the point . . the im+lse uaveform at uhich the
ampl itude exceeds the clmrping voltage level ard the peak of rhe voltage overshoot.
A.5.7.9 ~. The excess voltage over the claWing voltage that occurs uhen a current
impulse having short virtual front duration is applied.
A.5.7.113 ~. The peak c“rre”t for a single inqwlse for forward biased dicde.
A.5,7 .11 -a mak voi taqt. The peak voltage, excluding al I transient vo(cage, us.at(y referred to as
stmdoff voltage.
A.6 CLASSES OF THYRISTORS
A.6. I ~. A bi -stable semiconductor device that ccarprises three or more j.net ions and can be
switched betueen conducting ard nonconducting status.
A.6. 1.1 ~1 diode t~. 4 tuo terminal thyristor having substantial (y the same switching
behavior in the first arm third quadrants of the principal voltage-current ch.sracter istic.
A.6. I.2 ~ A“ “-gete or p-gate thyristc.r having substent ial Iy the same
suitching behavior in the first and third quadrants of the princi pai voLtage- current characteristic.
A.6. I.3 ~. A three-terminal thyristor in which the gate terminal is connected to the
“-region adjacent to the region to which the mode terminal is connected ard thar is normal (y’ sui tched to
the on-state by e@ying e negative signal between gate and mode terminals.
18
MI L-PRF-19500K
APPENDIX A
A.6. I.4 E-qate thvristm. A three- termi.a( thyristor i. which the gate termina( is connected to the
p-region adjacent to the region to which the cathode terminai is connected and that is normal lY switched to
the on-state by applying a positive signal betueen gate and cathode termina is.
A.6. I.5 a diode thvrisuzc. A tuo-termina( thyristo. that switches only for positive ancde
to carhcde voltages and exhibits a reverse blocking state for negative anode to cathode vo(tages.
A.6. I.6 tricde An n-gare or p-gate thyristor that switches only for positive
ancde to cathode voltages and exhibits a reverse blocking state for negative anode to c~rhode voltages.
A.6.1.7 -se cond.ct in. d&de thvristm A r!+. terminal thyristor that suirches only for positive
anode to cathode voltages and conducts large currents at negative ancde to cathode .olrages cmiparnb(e in
magnitude to the on-state vo(tage.
A.6. I.8 Werse condulim tri~e ~. An n-gate or p-gate thyristor that suicches only for
witi~e an+ to f~th~e ~01ta9es and COMUCtS large currents at negative anode m cathcde voLtages
cmp.sr able1. magn~tude to the on-st, te voltages.
A.6. I.9 urn off thvrisu?c. A thyristor that can be suitched bet.een conducting md nonconducting states
by aWt Yin9co.trol si9n.91s of aFQropr fate polarities to the gate terminal, uith the ratio of triggering
power to trlggere=i pouer .spprec iably less than one.
A .6.2 ~ucture -.
A.6.2. 1 w. An electrcde connected to one of the semiconductor regions for inrrcducing control
current.
A.6.2.2 ~. The two termina(s through which the principal current flows.
A.6.3 lC and ratinu m.
A.6.3. I A funcri.m, usual [y

represented graph ica((y, re(ating the a!vsde to c.rhode voltage to the princi pai current, iii th gare current
where SJFPI icable, es a parareter.
A.6.3.2 Any point o. the principal voltage-current characteristic for uhich the
differential resistance is zero and where the principal vottage reaches a maximnn value.
.4.6.3.3 Kea.stive differeti( resistance real on. Any portion of the principal voltage-current
characteristic in rhe suirching quadrant ui thin uhich the differential resistance is negat ive.
A.6.3.4 off im!dancs. The differential inpsdance betueen the Cermina(s through uhich the principal
current f(ous uhen the thyri soar is in the off stote.
A.6.3.5 ~. The cordit ion of a thyristor corresponding r. the high resistance low current ,mrtion
of the principal voltage-current characteristic between the origin ard the breakover pint in the ssitching
quadrant.
A.6.3.6 The differenzie( impedance between the terminals through which the principa~
current flows uhen the thyristor is in the on st.ste.
A.6.3.7 ~. The cordit ion of e thyristor corresponding to the 10U resistance, lo. voltage portion
of the princip.sl vo(tage-.urcent characteristic in the snitching quadrant.
A.6.3.8 ~. A generic term for the currenr through the device excluding gate current.
A.6.3.9 ~ vo[taue. The voltage between the rein terminals.
A.6.3.1O Princ ioat voltaqe-curr r charncter~ tic Lminci!al characteristic. A function, usual(y
represented 9rc@<ca(Ly, retating the princi pat voltage to the principe[ current, with gate current where
applicnb(e, .s a parameter.
19
MI L-PRF-19500K
APPENDIX A
A.6.3 .11 %everse b~. The differential inpdance between the two terminals through uhich
the principal current flows when the thyristor is in the reverse blocking state at a stated operating point.
A.6.3 .12 The condition of a reverse blocking thyrisror correspmding to the

portion of the ancde to cathode voltage-current characteristic for which the reverse currents are of lower
nwmitude than the reverse breakdown current.
A.6.3 .13 ~. A quadrant of the principal voltage-current characteristic i“ uhich a

device is intended to swirch between an off state ard en on state.
A.? OP1OELEC1RON1C DEVICE DE FIN1TIONS
A.7.1 c devic%. A device that is responsive to or that emits or modifies electromagnetic

radiaticm in the visib(e, infrared, or u(travio[et spctrat regions; or a dwice that .ti Lizes such
electromagnetic radiar ion for its internal operation.
A.7.1.1 L9mmion effic.i.suw. The ratio of maxirmxn avail ab(e power output res. (ting frm photovo(taic
operation to total incident radiant flux.
A.7. 1.2 The condition attained uhen the electrical parameter under c.msiderat ion
approaches a vaLue uhich cannot be alrered by further irradiation shiei ding.
A.7.1.3 ~. The current that f(ous through a Photosensitive device in the dark condition.
A.7.1.4 ~. The current that flows through a @otosensitive device when it is exposed to
radiant energy.
&.7.l.5 A Fhotcdicde that is intended to be used as a Photoconduc rive tra”sd.cer.
A.7. I.6 ~. The difference in magnitude ktueen tight current and dark current.
A.7. I.7 A diode that is intended to be responsive to radiant energy.
A.7.1. a A photcdicde that is intended to rake advantage of nvalanche

ndtip(ic~t ion of photocur rent.
A.7. 1.9 A device that emits elect runagnetic radiation in the visible, infrared, or
ultra. io[et spectral regions.
A.7.1.1O A device that is responsive to e(ectrc.mgnetic radiation in the visib[e,

infrared, or ultraviolet spectra( regions.
A.7.1 .11 A thyristor thflt is intended to k responsive to radiant energy for controlling
its operation as a thyristor.
A.7. 1.12 A transistor that is intended to be responsive to radiant energy.
A.7.1 .13 A ~.tcdi~e that is i.tetied t. 9enerate a terminal voltage in response to

radiant energy.
A,7.2
A.7.2.1 A light emitting diode that Emits lwninous energy when a contro((ed
reverse current in the breakdown region is app( ied.
A.7.2.2 A diode capable of emitting radiant energy in the in frerec region of

the spectrum resulting fr.am the recmnbi netion of electrons and holes.
20
MI L-PRF-19500K
APPENDIX A
A.7.2.3 Li.aht mlttl~. A diode capable of emitting Iuninous energy resulting frcm the
reccanbi”at ion of etectrons and hokes.
A.7.2.6 ~. The ratio of the tota[ radiant flux emitted to the total inpt Power.
A.7.3 ~.
A.7.3.1 An opto-coup(er in uhich the photo-sensitive element is a dart ingron

connected phototransistor.
A.7.3.2 An opro-coup(er in which the photosensitive element is a Fhotcdicde.
A.7.3.3 An .apto- coupler i. which the @otosensitive element is a photothyrisror.
A.7.3.4 An opto- coupler in which the photosensitive elefcent is a

@atotransistor.
A.8 ELECTRICAL AND ENVIRONMENTAL STRESS SCREENING DEF1N1TIONS
A.8.1 stress Sscsmms.
a. Electrical stressing near rnaxirmrn rating of semiconductor devices is Wrforred to remove devices
uithi” a given lot uhich are subject to early (ife fai(ures due to irr@roper processing.
b. Determine if wear-out mechanisms are present in a given (at uhich ui(L shorten the time to faikure
(Life tests).
A.8.2 A generic term describing a screening test uhich operates the device by internality
dissipating sufficient po.er to significantly heat the device juncticm for a specified time.
A..9.2.1 Wtifvinq ac -r tarn-in. PoMer burn-in uhereby junction heating is acccnptished through the
alternate application every half cyc[e of forward current and reverse voltage.
A.8.2.2 r turn-in. Power turn-in whereby junction heating is accmnp\ish& through

the applicaticm of steady-state forward current, reverse curre”r, or forwnrd power for diodes (inciudi”g
rectifiers), ze”ers, ad tre”sistor respectively.
A.8.3 ~e reverse m. A generic term describing a screening test which applies a blocking
voltage and is norrrally performed at TA = +150-C through the external application of heat.
A.8.3.1 High tempsr, ture reverse bias uhich applies

steady-state dc blocking vo(tage.
A.8.3.2 ~. High terrprature reverse bias which app(ies half -uave

blocking voltage.
A.8.3.3 e hi.ah ~. High tetrpernture reverse bias uhich applies full -uave
blocking wattage; smtiws applicable to synmtr icat thyrist.xs or transient vdtqe w$$.ressors.
A.a. f. A generic term describing a sanp[e test uhich operates and internally heats a
device junction for an extended time to verify lot integrity. This is genera(ly an extension of power
twrn- in.
A.8. L.1 ~yino ac ocers I nu life. OP=r.9tin9 tife uhereby heating is nccunp( ished through the
.Iter”ate .Wlicar ion of forward current and reverse vo(tage.
A.8.6.2 dc ocer~. Operating life hereby heating is accomplished through the

application of steedy-stete forward current, reverse current, or forward power for dicdes (including
rectifiers), zeners, and transistors respectively.
21
MI L-PRF-19500K
APPENDIx A
A.8.4.3 Operating life whereby TJ ard Tc is cyc(ed through a s~cif ied

t.3T@ratUre ra.9e by a heatin9 current or pouer and e cooling Wrioi, when current or pouer is removed.
A.8.6.3.1 Esstifvi.a ac ~q ~ if?. Intermittent opera ring life whereby the device is
subject~ to forward currenr and reverse vottage, during the heating psriod.
A.8.6 .3.2 Intermittent opsrating life whereby the device is subjected co

steady-state foruard current or equivalent half sine forward current, during the heating period. This test
is also known 8s pouer cycling or thermal fatigue.
A.8.5 ~. A generic term describing a sanpte test which applies a blocking vo(tage and is
rmrma L[y performed nt a specified high ambient or case twrarure through the externa~ application of heat.
A.8.5.1 51sab’-state d. ~. Blocking life which awlies steati- state dc blocking voltage.
A.8.5.2 &&f-uave bwna life. Blocking life which .pplies ha(f-uave blocking volrage.
A.8.5.3 &[ {-wave b -Q (ife. Blocking (ife uhich applies full-wave blocking voltage.
A.8.6 a (air to air). TWrature cYClin9 Et devi.e, s case Wrr@rat”re thr.wgh a

specified range by the externat hearing and cooiing of the device in an air to air enviromrent.
A.8.7 d to LiaW. Thermal shock cycling at device, s case tmperar.re through a

specified range by the external heating ad cooling of the device in B liquid to liquid environnenr.
A.8.E ~. Thermnl respxtse for the purpose of this specification is rhe application of an
electrical stress sufficient to pass heat through the inrer face of dissimilar materials, primarily to
derermine the quality of attachmmmt by measuring the electrical characteristics of the Wnperat.re sensitive
parameter.
A.8.9 S-UC$LS. Surge is the application of a high peak curre”r ten times (mininamo rhe device average
current maxiw rating aw(ied for a short pulse width appropriate to determine processing defects (e. g.,
wire bard integrity, micro cracks, Brd t-d voids).
22
MI L-PRF-19500K
APPENDIX B
ABBREVIATIONS AND SYMBOLS
B.1 SCOPE
B.1.1 S.CQQQ. This appendix covers the abbreviations at-d s@Qls for use uith seinicotiuctor devices.
This appendix is not mardatory.
B.2 APPLICABLE DOCUMENTS. This section is not applicable to this ap?erdix.
B.3 GENERAL SEMICONDUCTOR ABBREVIATIONS AND SYMBOLS.
Auccm’atic frequency controt
Autcmatic fine tuning
Backward instability shock test
Con forrrance inspection
Electrostatic discharge
Electrostatic discharge sensitive
Field-effect transistor
Forward instability shock test
Gal(iun arsenide
High t.erperature reverse bias
Insulated gate bipo[ar rrensisror
IPCC, avaianche, and transit time diode
Limited space-charge accwtat ion
Metnl oxide semiconductor fie[d- effect transistors
Original equipnent menu f.cturer
Percent defective a((oued
Pert or identifying nd?er
Particle i~ct noise detector
Post-irradiation parameter limits
Parts per mit Li.an
O.alified products (isc
Radiet ion h’ardness assurance
Radiati.m hardness ass.rrmce parr managers
23
MI L-PRF-19500K
APPENDIX B
RMS- -- - - - - - - - - - - Root means square
w- - - - - - - - -- - - Scanning electron microsco~
SOA- - - - - - - - - - - - safe operating area
SPC- - - - - - - - - - - Statistical process control
1P- - --- - - - - - - True position
TRAPATT - - - - - - - - - - - Traw plasma eva(anche transit time dicde
uHF- - - - - - - - - - - - Uktra high frequency
0.3.2 ~. Qld wm50(
F- - ---- - - - - - - - - - Spot noise figure (NF)
F- - -- - - - - - - - --- Average “Oise figure
Ro -------------- .- Therma( resistance (01
%CA - - - - - . . . . . . Thermal resistance, case to ambient
ROM - - - . . . . . . . Thermal resistance, junction (eJ.A)

to atiienr
ROJC - - - . . . . . . . Therma( resistance, junction (eJ. c)
ROIL . . . . . . . . . . . . . ..tocose Thermal resistance, junction

to (cad
R@JR - - - - - . . . . . . . Thermal resistance, junction
to reference
TA - - . . . . . . . . . . . . . . Ambient or free air Wnperat.re
TC - - - - . . . . . . . - - Case tmqxrature
TEC- - - - - - - - - - - - E& cap r~rature
To -------------- .- Junction t~rature
TO ------------ ---- Lead temperature
operating temperature
TOP” ‘- - - - - - “ - - “
TSTG - - - - . . . . . . . Storage temperature
t~ - - . . . . . . . . . . . . . . De(By time
t’ -- -- . . . . . - - . - Fall rime
toff - - - - - - . . . . . Turn off time
ton- - - - - . . . - . - - Turn on time
tp ------------ ---- Pulse time
tr--..........-.-= Rise time
24
MI L-PRF-19500K
APPENDIX B
to - - . . . . . . . . . . ---- Storage time
t“ ---- . . . . . . . . . . .- Putse averoge tinw
v(~~) . . . . . . . . . . . . . -- Breakdown voltage (BV)
B.4 TRANSISTORS SYMBOLS
B.4.1 Junction t ra~ svmbo~s.
cy~, ci,,o ---------- --- Inpt capacitance, (cmn base, camwn emitrer] col(ector open
circuited for ac
i&, cie*------------ I“pJt capacitance, (ccmmun base, cwnran e+nitte, ) collector

short -circuited r. reference terminal for ac
Coba, coeo- -- - - - - - - - ouc~t capacitance, (cumwn base, ccmtrmn emitter) in~t open
circuited to ac
cobs, Coes- - - - 0.cFut capacitance, (canmn base, ccmmmn emirter) input

short-circuited to reference terminat for ac
‘hfb, ‘hfc. ‘hfe- - “ “ - - - “ Small signal, short-circuit forward current transfer ratio
cutoff frequency (cc.rrron base, comma. collector, comron emitter)
fmx- - - - . - . . . . . . - Maxinun frequency of oscit[atio”
f~ - . . . . . . . . . . . . . -- Extrapolated unity gain frequency
gMB# gHc, gME. - - - . . - static transconductance (ccimwn base, camwn co(iector, canmn
emitter)
gti, gm, gm. - - . - . . small signal transconductance (co?rron base, ccwnmn collector,
CUIMW. emitter)
GPB, GPC, GPE ---””-- ‘--- Large signa( insert {on pauer gain (cm. base, ccmrron
collector, canmn emitter)
Gpb, GpC,GW- - . . . . . small signal insertion power gain (conmon base, cunmn
co~tector, ccmran emitter)
hFB, hFc, hFE -”----”- ‘-” Static foruard current rransfer ratio (ccmmmn base, conrnon
col(ector, cannon emitter)
hfb, hfc, hfe- ------ ‘-.8yc Smal[ signat short circuit forward current transfer ratio
(cannon base, canran co((ecror, cannon emirter)
Ihfel --------------- Magnitude of cmmron emitter small signal short circuit forward
current transfer ratio
h\B, hlc. hlE- - - “ - - “ - Static in~t resistance (ccmnon base, cunnon cottector, cannon
emitter)
hib, hic, hie- ------- --- Small Signal short circuit inpx iqxda”ce (.-. base, canncm
co\tector, c.mmwn emitter)
bob, hoc, hoe- - - - - - - small signal open circuit out~t acbnitta”ce (c-n base, cannon
collector, canmn emitter)
25
MI L-PRF-19500K
APPENDIX B
hrb, hrc, hre -”--””-- “-” Sma(( signal open circ702X

base, cwrnmn coiiecror, cammn emitter)
Base currem (de)
Cotlector current (de)
Emitter currenr (de)
Base current (instantaneous totai .ai.e)- - - - - - -
Collector current (instantmeous total value)
Emitter current (imtantaneo.s total value)
Co\(ector cutoff current [d. ) emitter open
Co((ector cutoff current (d. ) base open
Collector cutoff current (de) with specified resistance betueen

base at-d emitter
ACES ----------- . . . . Col Lector cutoff current (dr, ) base short circui red to emitter
CE”---------------- Collector cutoff current (de) with specified vottage betueen

base and emitter
lCEX
------------- .. Col(ector
base and
cutoff
mitter
current (de) with specified circuit between
IEB(j-------------- . Emitter cutoff current (de) Co[(ector open
IECS - - - - - - . . . . . . Emitter cutoff currenr (de) base shorr. circuited to coilector
1~ . . . . . . . . . . . . . --- Collector efficiency
P~ . . . . . . . . . . . . . . . - Co((ector power dissipati.m
P, . . . . . . . . . . . . . . . . Total power dissipation, .(( terminals
RB . . . . . . . . . . . . . . -. External base resistance
r~ - - - - - - . . . . . - - . Base spreading resistame
rb,cc- -- - - - - - - - -- collector-base time constant
Rc - - . . . . . . . . . . . . . Externa( co((ector resistance
‘CE(sat) - - - - “ - “ - “ Collector to emitrer saturation resistance
RE . . . . . . . . . . . . . . -. EKternal emitter resistmce
riep - -- - - . . . . . Small signal short circuit paralle[ input resistance (cannon

emi rter)
% --------- ------- toFF crossover ti~ (the ti~ interval d.rim .hich the
co{iector voltage decreases frmn 10 percenr of its peak
off-state va(ue end the c.a((ector current decreases to 10
W,Cent of its peak o. state va(ue)
26
MI L- PRF-19500K
APPENDIX B
v~~- - - - - - . . . - - - Base SUWIY voltage
v~~
-.............-- Base to emitter vo(tage (de)
‘BE(s.t) - - - - - “ - - - Base to emitter saturation vo(tage
‘(BR)COO - - - - - “ - - “ Ememkdoun vo(tage CC4iecror to b+se, emitter open
‘(BR)CEO - - “ - - - - “ Breakdown voltage collector to emitter, base open
‘(BR)CER - - - - ‘- - - Breakdown voltage co((ector to emitter, uith specified

resistame berween base and emitter
‘(8R)CES ‘- - “ “ - - “ “ - - Breakdown voltage Co((ector to emitter, uith base

short -circuited to emitter
‘(BR)CEX - - - - - - - - - - Breakdown voltage co((ecror to mitter, uith specified circuit

ht.ee” base and emitter
‘(BR)EBO - - “ - - - - - - Bre8kdo.n vo(tage emitter r. base, co(iector open
vc~- - - - - - . . . - - . Collector to base vottage (de)
‘Jc~F -- - - - - . . . . . DC open circuit voltage (f(oating potential) between the

..al Lect.ar ad base, with the emitter biased i“ the reverse
direction uirh respect to the base
Collector to base voltage (static), emitrer open
Collector wply .o(t.age
Co((ector to emitrer voltage (de)
Collector to emitter volrage (rms)
CO\\ectOr to emitter voitage [instantaneous)
Co((ector to mitter saturation vo(t3ge
Collector to emitter vo(t.sge (static] base oprm
Bre’dkdoun vo(tage, co(tector to emitter, susra ined
Co[(ecror to einitter voltage (de), uith specified resistance

betueen base .rd emitter
‘CES - - - - - . . . . . Coiiector to emitter voltage (de), base short -circuited to

emitter
VE8- - - - - . . . . . . . Emitter to base vo(tage (de)
ve~- . . . . . . . . . . . . . -. Emitter ro base vo(tage (rms)
Veb- - - - - . . . . . - . Emitter to base vo(tage (insta”taneo.s)
VEBF - - - - - . . . . DC open circ. ir voltage (floating potenria[) Ix?tueen the emitter

and base, uith the co((ecror biased i“ the reverse direction
with respect to the base
27
MI L-PRF-19500K
APPENDIx B
‘( BR)CEV ------- ”--” ‘- Breakdoun vo(tage collector to emitter, with sp.?cifiec

voltage between base m-d emitter
‘Al------------- . . Emitter to base voltage (static) cotlecror open
v~~ ---- . . . . . . . . . . . Emitter to co((ector Vo(tage (d. )
VECF
------------- DC open circuit voltage (f(oating porent ial) between the emitrer
and collector, uith the base biased in the reverse direction
with respect to the co[lector
v~~- - - - - . . . . - - Emitter SUFQ(Y vo(tage
VR,- - - - - - . . . . . -
B.4.2 Eui@?Qk.
his- - - - - - - - - - - - Srm((-signa(, cc.nmn- source, short-circuit, input susceptance
bos- - - - - - - - - - ‘- Small -sigmal, cannon-source, short-circuit, out~r susceptmce
‘bu s -------------- . . Small-signal, camwn- source, short-circuit, forward transfer

s.sceptance
br~ - ------------- .- Smell -signa[, ccmvn-so.rce, short-circuit, reverse transfer

susceptance
Cd%- - - - . . . . - . - Small -signa( drain tn SOW.. capacitance
c~u- - - - - . . . . - . - Sma(( -signal drain to substrate capacitance
Ciw - - ‘- - - “ - - “ ‘- - Small-signal, cmrnon- source, short-circuit, in~t capacitance
Coss - “ “ - - “ - “ - - “ Sma((-signa(, cmmnn. -source, short-circuit, our~t capacitance
cm - - - - - “ - “ “ Small -sigml, cmnron-so.rce, short-circuit, reverse rrrmsfer

capacitance
D,d . - . . . . . . . . . . . Drain termimal
EAR- ‘- - - - . . . . . . . Repetitive walanche energy capability
EAS- - - . . . . . . . . Sing(e p.I(se ava(anche energy capability
G,g - - - - - - - - - Gate terminal
gf~- - - - - . . . . . Small-signal, mnno”-so.rce, short-circuit, forward transfer

Conductance
9i~- - . - - . . . . . . . %!all-sigml, cm”-source, short-circuit, inp.K c.mductmce
90.- - - - . . . . - %nll-signel, cunmn- source, short-circuit, output corducrance
Cm-------------- .. Sma(( -signal, cannon-gate im.ertim power gain
Gp~- -- . . . . . .. . Sma L1-sign.31, cunmn- source insertion pimer gain
9r.- -- --- . . -- - Small-signal,

tramfer
canmn-
conduct. mce
source, short-circuit, reverse
28
141L- PRF-19500K
APPENDIX B
Smal(-signa(, cmrr. m-gate, transducer pouer gain
Sn!a\\-5ignal, camwn-source transducer power gain
Drnin current
Rnted avalamhe current (repetitive and nonrep-etitive)
On-state drain current
Drain cutoff current
Zero-gate-voltage drain current
Gate current
Forward gate current
Reverse gate current
Reverse gate current with ait other terminals short-circuited to

source (junction-gate)
lGs~~
---- ......... Forward gate current with all orher terminals short-circuited to
s.mrce (in*”[ at&-gate)
lGs~~
---- ........... Reverse gate current ~ith .(( other termina(s short-circuited to
source (insu Laced-gate)
1~ --- ............. Source current through drain dicde [forward biased VsD)
Is(.ff) ------------ -- source cutoff current
!SDS ------------- . . Zero-gate-voltage source current
1(1s0) - - - - - Source pin to case im(at ion current
Og(th) - - - - - - - - - - Gate charge that nw.t be s.~lied to reach minimxn specified

gate- scurce threshold voitage
Qg[on) - - - - - - . . . . . Gate charge that must be su~[ied to reach the gate-source

voltage specified for the device rDs(on) measurement
Ogre(m)- - - -- - . . . Gate charge that nust be supplied to the device to reach the
maximxn rated gate-source volrage
‘%” -“-- - - - - - - “ - Charge required by CGS to reach a specifies ID
og~- - - - - - . . - - Charge s.pp( ied to the drain from the gate r. change the drain
voltage under wmstant drain current cmditicms
‘ds(.an) - - - - - - - - - - Small-signal, drain to source on-state resistance
‘OS(..)- - - - - - - - - Static drain co source on-state resistance
S, s ---------- ----- Source terminal
‘d(off)- - - - - - - - - Turn-off delay time
‘d(on) - - - - - - - - - - - Turn-on delay rinw
29
MI L-PRF-19500K
APPENDIX B
u, . . . . . . . . . . . . . . . . Substrate (bu(k) (Cerminai, when substrate is externatty

terminated)
‘( BR)GSS ” ---””---- ‘“- Gate to source breakdoun voltage, all other terminals
short-circuited to source (j..ction-9 ate)
‘[ BR)DSS ” --------” ‘“- Drain to source breakdown volrage, a(( other rerminals
short -circuited to source (juncr ion-gate)
Foruard gate to source breakdown vo(t.age
Reverse gate to source breakdown voltage
Drain SUP?(Y Vo(tege
Drain to gate voltage
Drain to source .O(rage
On-state drain to source voltage
Drain t. substrate vottage
Gate supply voltage
Gate plateau vottage
Gate to source vo(tage
Forward gate to source vo(tage
reverse gate to source vo~cage
Gate to source cutoff voltage
Gate to source thresho(d vottage
Gate to substrate voltage
Scurce pin to case isotat ion vottege
Source supp[y vo(tage
source to substrate v0kta9e
Magnitude of snu(l-signa( cmnro. -source short-circuit forward

transfer acknittance
Ye*------------- . . . Magnitude of sma(( -signat ccmmon-source s.horr-circ”ir input

,@mi rrame
Ye,-------------- .- 14agn ittie of sral(. signal ccmw”- source short-circuit reverse

transfer admittance
B.4.3 ~-.an transistor sm.
lB2(mcd) - “ - - “ - - - - “ Interbase mcdul ated current
l~~zo- - - --- . . . . - . Emitter reverse current
1p . . . . . . . . . . . . . . -. Peak point current
l“ --------- ------- Valley point current
30
MI L- PRF-19500K
APPEND!X B
r~~ ---- . . . . . . . . . --- Imeriwse resistance
v~z~,
----........--- Inrerbse voltage
‘EBl(sat) -”-”-”-””” ‘-- Emirter saturation vo(tage
v~~, . . . . . . . . . . . . . .- Sase - 1 peak voltage
Peak point voltage

“P-------- ”------ -
v“ - - - - - -- - - - - - Va((ey paint vo(tage
n ----------- ----- Intrinsic standoff ratio
8.5 OIOOES AND RECTIFIERS SYMBOLS
B.5.1 Ws arid rectlfler S*(S.
CJ . . . . . . . . . . . . . . -. Junction capacitance
‘F(RMs), !f, IF, lF(AVI, ‘F. IFt4- - Forward current
I~~H- - - - - - . . . . - - Forward current, surge peak
lF(OV)- - - - - - - - - - Forward currenc, over(oad
!.- - - - - . . . . . . - - Avernge forward Currem, 180- conduction angle, 60 Hz, half sine
wnve
IR(RMS)$ lPV lR, ‘R(Av), ‘R. IRM- - Reverse current
‘R(REC), lRM(REC) - - - - - - Reverse recovery current
lR~M- - - - - - . . - - Reverse current, repetitive peak
JRs~- - - - - - - . . . . . - Reverse Currem, surge peak
%, ‘F(W), ‘F, ‘FM - - - - - F.arNard p.wer dissipation
‘R. ‘R(AV), PR, PRM - - - - Reverse pouer dissipati.m
as- - - - . . . . . - - . . Stored charge
tfr- - - - - - . . . . . . . - Forward recovery time
C,,- - - - - - - - - - - Reverse recovery ti,m
‘(SRI, ‘(RR)- - - - - - - Breakdown voltage (d., imcemt.meous tata( vaLue)
‘F(RMS), ‘f. vF. ‘F(AV), ‘F, ‘FM- - Forward .o(tage
‘R(RMs), v,, vR, ‘,(Av), ‘R. VRM- Reverse vo(tage
v~w- - - - - - . . . . - - Uc.rki”g peak reverse vo(tage
VRR”- - - - - -. - . . . - . . Repetitive peak reverse voltage
VRS”- - - - . . . . . . Nonrepetitive peak reverse voltage
31
MI L- PRF-19500K
APPENDIX B
B.5.1.1
Tota[ RMS vaLue DC value DC VB[Ue instant an- Maximun

RMS ViJ[Ue of a[ter- no aLter - iiith eous total (peak)
nating nating alter- va ( ue total value
ccmpnent cmponent noting
cgrg3nent
Forward current lF(RMS) lF ‘F lF(AV) ‘F 1 FM
Forward current, 10
average, 181T
conduct i o“
angle 60 Hz,
haLf sinena ve
Forward current, { FRM
Forward current, 1FSM

surae cea k
Forward current, lF(oV)

~ad
?everse current lR(RMS) ‘F lR lR(AV) ‘R 1RM
teverse recovery ‘R(REC) lRMIREC)

_WrISrd
‘orward power ‘F ‘F(A) ‘F PFM
teverse pouer ‘R ‘R(A) ‘R ‘Rf4
:orward vo(tage ‘F(RMS) Vf ‘F ‘F(A) ‘F ‘FM
Ieverse vo(tage ‘R(RMS) v, ‘R ‘R(A) ‘R ‘RM
leverse vo(tage VW?

~Q mak
Zeverse voitage ‘RRM

recetlw rmak
teverse vo(tage ‘RRM

ncmrepet i t ive
oeak
Ireakdoun ‘(BR) V(BR )

J!llla.e
32
MI L- PRF-19500K
APPEND IX B
0.5.2 Mi.uww di~e i!m%.b.
~ Overall average noise figure (of a mixer diode)

—
Stardard overa( 1 average noise figure (of a mixer dicde)
conversion 10ss
Fi9ure of merit (of a detector dicde)
Output mise ratio
Tnngent iat signai sensitivity
Voltage standing wave ratio
lnped.snce, intermediate-frequency
l~a..e, radio-f ,W.e..y
Inpedance, Inalu(ator-frequency load
Video impedance
B.5.3 d dicde ~.
!, . . . . . . . . . . . . . . . - In f(ecr ion point currenr
1p - . . . . . . . . . . . . . -. Peak point current
I“ - . . . . . . . . . . . ..-= Valley point current
rf -------- -------- Dynamic resists”.e at infection point
Vpp ---------- . . . . . . Projected peak point vottage
v, - . . . . . . . . . . . . . .- In ftect ion point voltage
Vp - - - - . . . . . . -- . - Peak point voltage
TV . . . . . . . . . . . . . . -= Valley poinr vo[tage
B.5.4 diccle ~.
Forward current, d.
Reverse current, d.
Re.g. (ator current, reference current (de, dc near breakdom knee,

d. maxinur rated current, dc maxim.m ratea surge current)
Forward voltage, d.
Reverse vo(tage, dc
Regulator vo(tage, reference vottage (de, d. at maxinnm rated

current)
Regulatcm inpedance, refereme impedance [sna( i-signal, at lZ, at

lZK, at 12M)
TeWe~ature coefficient of reg. tator voltage, tenperar.re

coefficient of reference voktage
33
MI L-PRF-19500K
APPENDIX B
B.5.5 mrrent reu~.
Limiting current
Regu(etor current
Knee voltage
Limiting vottage
Regulator current variation
Regulator voltage
Knee impedance
Regulator iwance
temperature coefficient of regul. tor currem
case capacitance
Junction capacitance
Torn( capacitance
capacitance ratio
Cut-off frequency
Series inductance
Figure of merit
as ---------- ‘- Series resistance, small -signa(
~c . . . . . . . . . . . .
TeWerature coefficient of capacitance
~ ------------
Efficiency
B.5.7 ~t vOLtaqe ~r s*Ls.
IF -------------- -- Clanping factor
1~ ----- . . . . . . . . . . - Standt.y current
1~~ -------------- Forward surge current
l~s~ - - - - - -- - . . . . . . Rated forward surge current
Ipp-- - - - . . . . -- - Peak i~kse current
lpp~ -- - -- - - . . - . - Rated peak i~tse current
1$ - . . . . . . . . . . . . . -. Surge peak tramienr current
is”- - - - - . . . - . Rated surge peak transient current

MI L-PRF-19500K
APPENDIX B
Average power dissipation
Rnted average power dissipation
Repetitive peak Ix.I[se power dissipation
Rat& repetitive peak puke power dissipation
overshoot durar ion
Response rime
Breakdown voLtage
cla~ing vo(tage
Uorking peak voltage, also stardoff voLrage
‘t#l(RM S)--””-”--”-- ‘- Uorking rms voltage
v~ . . . . . . . . . . . . . . -- Rated uorking peak voltage
v~~ ----- . . . . . . . . . . . Voltage overshoot
rxV(13R) ---------- . . . . T-rarure coefficient of breakdown vottage
B.6 THYRISTORS SYMBOLS
0.6.1 Ihyristor s-.
dv/dt ------------- -- Criticai rate of rise of off-state voltage
‘@O)# ‘(BO) - - - - - - ‘“ Breakover current
l(BR), ‘(BR) - - - - - - - - “ Reverse breakdoun current (of a reverse- biocking thyristor)
lD(RMS), 10, ‘D(A), ‘D, lDM - - Off-state current
lDRM - - - - . . . . . . . Repetitive peak off-state current
‘G, ‘G(A), ‘G, lGM - - - - - - Gate current
lGD, ‘GO, lGDM ‘ - “ ‘- - - - - Gate nontrigger current
lGQ, ‘GO, lGOM “ - - - - - - “ Gare turn-off current (of a turn-off thyristor)
lGT, ‘GT, lGTM - - - - - - “ ‘- - Gate trigger current
lH, ‘H ‘ - - - - - - - - Holding current
‘L. ‘L - - - - - - - - - - - - Latching current
lR(RSM), lR, lR(A), ‘R. lRM - - Reverse current (of a rever?.e-biocki”g or reverse- conducrimg
thyristor)
lRR” - - - - - . . . . . . Repetitive peak reverse current (of a reverse-blocking thyristor)
lRSM - - - - - . . . . . Nonr:pstitive peak reverse current (of a reverse-blocking

thyr, stor)
1T(RMS)8 lT, lT(A), ‘1, lTM - - On-state current
lTRM - - - . . . . . . Repetitive ~ak co-state currenl
35
MI L-PRF-19500K
APPENDIx B
l,~” ---- . . . . . . . . . . . N.anrepetitive peak on-state current
‘G, ‘G(A), ‘G. PGM- --- - Gate power dissipation
‘R. ‘R(A), pR, pRM - - - - - - - Reverse power dissipation
tad ------------- --- Gate-controlled delay time
GBte-contro([ec turn-off rime (of a turn-off thyristor)

t9q -- ” ----------- “-
tg~- - - - - . - . . . - - . Gare-c.antrol[ed turn-on time
Circuit -cnrnmmoted turn-off tiw

to ””-””””””””-- ““-
‘(Bo)s V(BO) - - - - - - - - Breakover voltage
‘(BR). V(BR) - - - - - - Reverse breakdown voltage (of a reverse- blockin~ rhyristor)
‘D(RMS), %, vD(A), vD, VDM - - off-stare vo~tage
VDRM - - - - - . . . . . . . . Repetitive peak off-state vo(tage
v~~ - - - - - . . . . . - - Mormepetitive peak of f-srate voltage
VDM - - - -- - . . . . . -- U.arking peak off-state vo(tage
‘G, VG(A), ‘G- VGM - - - - - - Gate voltage
‘GD, ‘GD, VGDM - - - - - - - Gate mmtrigger voltage
‘GO, ‘Go, VGQM - - - - - - Gate turn-off vo(tnge (of a turn-off thyrist or)
VGT, ‘GT. VGTM - - - - - - Gate trigger .ottage (of a reverse-blocking thyristor
‘RRM - - - . - . . . . . Repetitive peak reverse voltage (of a rever$e-b(ocking rhyristor)
v~~M - - - - - - . . . . . - Nonrepetitive peak reverse voltage (of a reverse-blocking

thyristor)
v,Q~ - - - - . . . . . . . - - Working peak reverse vo(tage (of a reverse- b(ocki”g thyristor)
‘T(RMs), ‘TV VT(A)r ‘T, VTM - - - On-state voltage
‘T(MIN) - - - - - - - - - - - Mini- on-state voltage
36
MI L-PRF-19500K
APPENDIX B
s.6. 1.1 w sh~ tabie (~.
Totai DC value DC V.(UC Instantaneous naxirmdn

RMS VB(Ue no iii th total (peak)
~(ternating airer.sting V. Lue total
c-em ~ent value
On state current lT(RMS) 11 IT(A) ‘T 1TM
Reptitive peak, 1TRM

on-state CUrr
Surge [nonrepetitive) IT$m
Overload on-state lT(OV)

current
Ereakover current 1(80) i (BO)
Of f-srate current lD(RMS) ‘D lD(A) ‘D 1DM
Re@itive peak, lDRM

off-state current
Reverse current lR(RMS) ‘R lR(A) ‘R 1RM
Repetitive pe.dk, ‘RRM

~se current
Reverse breakdown l(BR)R ‘(OR)R

SF?ent
On-st.3te volrage ‘T( RMS ) ‘T ‘T(A) ‘T ‘TM
Breakover voltage V(BO) ‘(BO)
off-state voltage ‘D( RMS ) ‘D ‘D(A) ‘D ‘DM
Minim on-state ‘TWIN)

-age
Working peak, ‘DUM

off-state v.a 1taqe
Repetitive peak, ‘DRM

off-state @t...
37
MI L-PRF-19500K
APPENDIX B
0.6. 1.1 - Continue-d.
Totet DC value Dc value lnstOntaneOus f4axinm

RMS value m with tot.1 (peak)
.91termri.g a(temati.g va 1ue total
~ent “a [ U,
Nonrepet i t i ve, ‘DSM

of f-s~acle
Reverse .o[tage ‘R(RMS) ‘R ‘R(A) ‘R ‘RM
Uorking peak, ‘RW
Repetitive peak, ‘RRM

~se vOtta.e
Nonrepetitive wak, ‘RSH

reverse VO( taqe
Reverse breakdown ‘(BR)R ‘( BR)R

dta.e
No(ding current ‘H ‘H
Latching current lL ‘L
Gate current lG lGIA) iG [GM
Gate trigger current ‘GT i GT lGTM
Gate mntrigser i GD i GD 1GDM

Curr
Gate turn-off I ml i GQ 1GOM

curr
Gate voltage ‘G ‘G(A) ‘G ‘GM
Gate trigger vo(t.sge ‘GT ‘GT ‘GTM
Gate nontrigger ‘GD ‘GD ‘GDM

current
Gate turn-off ‘GQ ‘GO ‘GOU

At.a,
Gate pouer
38
MI L-PRF-19500K
APPENDIX B
0.7 OPTOELECTRONIC DEVICES SYMBOLS
B.7.1
Q,(Qe) ------------ ‘- Radiant energy
Q, (O,) ----------- --- LLrni nous energy
t~ -------------- . . Delay time
to ----- . . . . . . . . . . F.(( time
of f ------------ . . . Turn-off time
ton- - - - - - . . . - - - Turn-on time
rr . - . . . . . . . . Rise time
t* . . . . . . . . . . . . . . . . Storage time
1 --------- ------- Time c.mst.mt
+ - - . . . . . . . . . . . . . . . Lunincus f(ux, radiant fix
0.7.2 it i.e device WI&?l.s.
h~ . . . . . . . . . . . . . . .- Area, detector
B E ------------- ---- Il(uninance (illumination); irradiance
f~ . . . . . . . . . . . . . . - Modulation frequency
l“ - - . . . . . . . . . . . -=- Detector noise
1~, Is - - - - - . . . . . - Detector signal current (de; rms vaiue of ac c~nenr)
‘n ---”--””-- ‘---”- Noise equivalent pnuer
‘n ‘-- - - “ - “ - “ - - Detector noise voltage
%$vs - “ - - - ‘- - “ - - Detector signet vo(tage (d.; rn!s value of ac component)
#f ----------- ----- Noise equivalent bandwidth
B.7.3
1 ------------- ---- Lwninous intensity; radiant inrensity
L- - - - -- - - - - - - - - Luninance; radiance
tf -- - - . . . - . - - Radiant-pulse fall time
‘r - - “ ‘- - - “ “ “ “ “ Radienr-puise rise time
w- - - - - . . . . . . . . Luninous density; radiant density
J- ------ --------- Spectral barduidth
Peak wavelength
AP “ - - - - “ - - ‘- - “
39
HIL-PRF-19500K
APPENDIx B
B.?.l. stils.
Cio--- - - - - - - - - - - ln~t-to-outp.n internal capacitance; transcnpacira”ce
ha- --------------- . Current tramfer ratio
1,~- - - . . . . . . . . . . . -. DC input-to-o.tput current; iso~aticm current
rr~-- - - - . . . . . . . . Isolation resistance
v,~- - - - - . . . . . . - - DC inpdt-to-auqxt vo(tage; iso(aticm vottage
40
I MI L- PRF-19500K
APPENDIX C
STATISTICAL SAMPLING AND LIFE TEST PROCEDURES
C.1 sCOPE
C.1.l -. This a~rdix contains statistical s.mp(ing, life test, ar-d qualification procedures used
with semiconductor devices. This appendix is not mardatory.
C.2 APPLICABLE DOCUMENT
c.2.l ~. The dofmnts iisted in this section are specified in sections c.3 and c.4 of this
specification. This section does not inc(tie documents cited in other sections of this appendix or
reccmmetied for ddirion9L information or as exemp[ es. While every effort has been made to ensure the
CU@eteneSS of this list, docuumt users are cautioned that they nust meet all sWcif ied req”ireme.ts
docurents cited in sections c.3 and c.4 herein, whether or nor they are listed.
I C.2.2.1
form a part
~.
of this docuw?nt to the exrent specified
The following
herein. unless
specifications,
otherwise
stardards,
specifid,
and hmmbmks
the issues of
these documnts are those (isted in the issue of the Depmtrent of Defeme [tie. of Specifications amd
I Sterd.srds (DCDISS) ad supplem.mt thereto, cited in the so[icit~tim (see 6.1).
I HANDBr13K
I MILITARY
MI L-HDBK-53-1 Guide for Attribute Lot Sen@i”g Impecti.an.
(Unless otheruise irdicated, copies of fsdera( and military specifications, standards, ard handbooks are
avail ab(e fr.an the Defense Printing Service Detachment Office, Building 6D (customer Service), 700 Robbim
Avenue, Philade(p? ia, PA 19111 -5094.)
c.2.3 ~. 1. the event of a conflict between the text of this doctrmmt and the
references cited herein (except for relnted associated specificati.ms or specification sheets), the text of
this docunent t~kes precedence. Nothing in this docurent, however, supersedes aWlicable (.SUS and
regulations unless a specific exemption has been obtained.
C.3 GENERAL
C.3.1 The fo( (owing definitions sha(( app(y for all statistical sampting procedures:
.3. SEX@e pt.” series: The SE@e p(m series is defined as the fo((ouing decreasing series of smrple
plan va(ues - 50, 30, 20, 15, 10, 7, 5, 3, 2, 1.5, 1, 0.7, 0.5, 0.3, 0.2, 0.15, .ard 0.1.
b. Ti9hte.@d inspection: Tightened inspection is defined .s inspection per formal using the next sample
plan value in the sample p(an series (owe. than that specified.
c. Acceptance nurber (c): The acceptance nurber is defined as an imegral ntrrber associated uith the
selected s.mpie size which determines the maxi- nurber of defective. permitted for that sample
size.
d. Rejection .im’ber (r): Rejecr ion nunbsr is defined as one plus the acceptance “unber.
c.3.2 Sklubr&. The fol~.uing S@OIS shall awly for .(( statistical sampling procedures:
a. c Acceptance mnber
b. r - Rejection n!-mber
c. n - smr@e size
APPEND IX C
C.4 STATISTICAL SAMPLING PROCEDURES AND TAELE
c.4.1 ~. Statistical sac@ing shall be corducted using rhe sample p(an merhod herein. The satrpke
p[an method as specified herein is a double saqie plan which provides a high degree of assurance that a Ior
having a propQrt ion defective Equai to or greater rhan the specified samp(e pLan value ui ( ( not be accepted.
The choice of any cme procedure is optiona(. The procedures speci f id herein are sui table for al I
qua\if ication or q.’aiity conformance requirements, tut are not suitable i f the objective of the inspection
is to determine that the proportion defective in the tot represented is greater than the speci f ied sa@e
p(an ve(ue since the assurance for that purpose is normal (y only 10 percent.
C.4.1.1 Wection Of samies San@es shall be randwdy selected frur the inspection lot or insp=cr ion
sublets (For an explanation of ;andcm Sarrpling, see MI L- HDBK- 53-1, section 13).
c.4.1.2 ~. Fai Lure of B unit for one or more tests of a subgroup shall be charged as a single
failure.
Cl information (sample sizes and nunber of observed defective) sha((

be accml ated from a single inspection lot to demonstrate conformance to the irdivid.a L sutgroup criteria.
c.4.2.1 The saup(e size for each subgroup shal I te determined frcro tab(e ! ard sha L 1 meet
the specified SJT@e pie”. The manufacturer may, at his option, select a sample size greater thnn that
required; however, the ntrhber of fai lures permitted shal ( not exceed the acceptance nim!ber associated uirh
the required s.mp(e size in tab(e 1.
C.4.2.2 ~. For the first samp( ing, an acceptance n-r sha( { be chosen and the
associated .u&.er of samp(ing devices for the specified sa@e ptan selected and tested (see C.4.2 .1). If
the observed n~r of defective frmn the first sanple is less than or equa{ to the preselected acceptance
tnmbr, the lot shai \ be accepted. 1 f the observed number of de fecrives exceeds the preselected acceptance
.&r, an additiona( snmp[e maY be chosen such thnt the cota( sampte ccmplies with c.4.2 .3.
c.4.2.3 p@djli ona L 5.-. The manuf~cturer may add an additiona~ quantity to the initiat smnpte, but
this IMY be done only once for any subgroup and the added samptes shal i be subjected to al 1 the tests uithin
che SUbsroup. The total sample size (initial ard added Sanples) shel ( be determines h a new acceptance
ntir selectd frun table !.
C.6.2.4 Multkle .riteril. Except here otherwise specified, uhen a subgroup contains more than one
.cceptance criterion. the ent ire samp(e for a subgroup shal 1 k used for al I criteria uithin the subgroup.
In table 1, the acceptance nurber sha(( be that one associated with the Largest sample size in the
appropriate sewle plan colw which is less than or equal r. the sampie size used.
c.6.2.5 ~. Inspection of 100 percent of the tot shall be alloued, at the

option of the manufacturer for any or al I subgroups other than those which are considered ,,destruct i.e.,,
The maxim-m observed percent de feccive for the inswct ion lot shal ( noc exceed the specified sarple plan
value. Devices that fail any test sha(( be removed frun the lot.
c.4.2.6 --tion of faited M. A lot that fai 1s Cl rrey, at the option of the mmufacrurer, be
screenea for defective or reworked and resubmitted for reinspection ($ee apprdix E)
c.5 LIFE TEST
c.5.1 ~. Life tests shall be c.arduc ted in accordance with the procedures in this section. Life
tests per forrmd on devices at or within theic maxinun r?. ti~s sh,(i be considered mndestr..rive. If a lot
is made up of a collection of sublets, each s.b(ot shall pass all applicable electrical erd-points as
specified.
c.5.2 $skctio. of samwks. samples for life tests shal 1 t-s selected at rardmn f mm the inspect ion lot
(see C.4.1 .1). The san’p(e size for e 1,000-hour test sh. {( b? chose” by the Wnuf,cturer fran teble 1 fran
the colm under the specified (cI,’dda (A). The acceptance ntir shal 1 be the one associated with the
particular sanple size chosen.
MI L- PRF-19500K
APPENDIX C
c.5.3 ~. A semiconductor device which exceeds one or mare of the erd-poinr limits specified for
\ife test at a“y specified or other reading intervai shal L t-e considered a fai (ure ard shall nor be
considered acceptable at any subsequent reading incerva( For the purpose of ccin$uring device hours, rhe
test-time hours credi tea to a failed device sha[l not exceed the test rime associated uith the Cast
measurement tires that the device .$x observed to be within the specified end-point I imits. If the sa~le
size fai (s, the test may be terminated at the discretion of the rrwwfacturer.
C.5.6 Ufe-test Uhen a lart.de (A) is specified, the (i fe-test time she(( be 1,00D
hours initia LLy. Once FJ tot has passed the 1,000-hour tests, life tests with minim of 340 hours and
maxinuns of 2,000 hours my be initiated for new lots provided that 365 days have not elapsed since a
1,000-hour I ife tests on the same device type on the same structural Ly identical group (see appetiix E). 1f
365 days have elapsed, the new lot sha( 1 pass a 1,000-hour ( ife test. The sanp(e size for a life-test time
other than 1,000 hours sha[ ( be chosen according to the re[at ionship of inverse proportional ity between test
time erd sanp(e size, such that the totei unit test hours accumulated (smple si zes nult ipl ied by rest
hours) equa[ the amount that wou(d have keen chosen for the 1,000-hour I ife test, had it been performed.
The acceptance nunber shal 1 also be determined frum the samp(e size associated with the same 1,000-hour
test, had i t hen performed. The lot shal I be accepted if the nidmr of fai lures at the end of the tesr
Peri’=d does not exceed the acceptance ntmber.
C.5.5 1“ the event

that the nurber of fai [ures observed on life test exceeds the acceptance number, the manufacturer shal I
choose one of the f a{ lowing opt i ens: (1) discontinue the Life test, screen or rework, and resuhnit in
accordance with c.4.2 .6, (2) add additional saup(es in accordance with C.5.5 .1, or (3) extend the test time
to 1,000 hour i“ accordance uith c.5.5 .2, if a test time [ess than 1,000 hours ..s originally chosen, O.(Y
one of rhese options shal 1 k used for a given sukroiss ion, ard this option shal 1 be used oniy once.
C.5.5.1 ~. Uhen this option is chosen, a new total sample size (initial Plus added)
shal ( be chosen by the manufacturer fran table I from the CO(UIM under the specified A. A quanrity of
additio.a( units sufficient to increase the sanple to the new[y chosen tota( sanple size sha( I be se Lected
frca! the lot. A neu acceptance nLr@W sha(( be determined and sha(l be the one associated with rhe neu
total sE@e size chose”. The added s.anple shal ( be subjectec to the sa,m 1 ife-test conditions and time
I period
exceed
as the initia(
the acceptance
sanpie.
ntir
If the total
for the tota(
observed
sar’@le,
ntmber of defective
the lot shal I t-e accepted.
(initial plus added)
If the observed
does not
nunber of
defect ives exceeds this acceptarue -r, the (at sh.( t not be accepted but rrey be resutrni t t ed (see
C.4.2 .6).
c.5.5.2 of life-test ~. If n ii fe-test time period less than 1,000 hours is bing used
and the nmber of fai (ures .bservd in the initia( san@e exceeds the acceptance nunber, the menu fncturer
WY in lieu of adding additional sanpl es, choose to exterd the test time of the entire initial sample to
1,000 hours ard determine a neu acceptance nhr fr.am table I The neu acceptance n-r sha( ( be that one
associated with the largest sanp(e size in the specified COIISM which is less than or equal to the sample
size on test. A device uhich is a fai (ure at the initi’d( reading interva{ shai( not be considered
acceptable at the 1,000-hour reading interval, I f the observed nunber of defect ives nt 1,000 hours does not
exceed the new acceptance .&r, the Lot shal 1 be acceptd. I f the observed ntmbs.r of defective exceeds
this acceptance nurber, the tot sha( [ not be accepted, but may be resubmitted (see c.4.2 .6).
C.5.5.3 Failure of ( ife test. If a lot fails to meet life-test requirermnts (inc(uding submission in
accordance uith c.4 .2.6, if elected) such that it is el imimted cm withdrmm fran fwther co. forrwmce
inspect ion c.msiderati.m, then a 1,000-hour ( ifs test sha( { be required for the fai led subgroup .nti ( three
successive lots heve passed. If group B or C (see .Wn.lix E) does “at require 1,000-hour te$ti”g, the” the
specified i ife test, if other then 1,000 hours, shal 1 be req. ird for three successive lots.
I
I
43
1
——
TABLE 1. Wdu2am2. U 2/
Mininun size of sanple to be tested to assure, with a 90 percent cm fidence, that a lot having
percent-defective equal to the specified sanp(e p{an ui [( not be accepted (single saw[e).
)laximm
percent
defect ive 50 30 20 15 10 7 5 3 2 1.5 1 0.7 0.5 0.3 0.2 0.15 0.1
or A
Acceptance Hininum samp(e sizes

nuT&r (c) (For device-hours required for Life test, multiply by 1,0001
(r=c+l)
o 5 8 11 15 22 32 45 76 116 153 231 328 461 767 1152 1534 2303

(1.03) ~ ~ ~ ~ ~ (0.11) w m m 19A?21 J9A22. ml] 10.007) (0.005) [O* ~
2 1 8 13 18 25 38 55 77 129 195 258 390 555 778 1296 1946 2592 3891
(4.4) (2.7) [2.0) (1.4) m (0.65) ~ 18) (0.14) (0,09)
IJ Sanp(e sizes are based .F.Jn the Poisson expmentiat bincmia[ (imit.
D The minim.m qua Lity [approximate AQL required to eccept on the Bverage) 19 of 20 tots is shown in parentheses for information .an[y.
MI L-PRF-19500K
APPENDIx D
OUALI TY SYSTEM
PROGRAM
D.1 SCOPE
D.1.1 ~. This awndia contain$ detai Is of the qua[ ity system program for JAN, JANTX, JANTXV, and
JANS semiconductor devices. The program measures and eva[uates the manufacturers man. featuring process
asaimt a b.asel ine for that process. This base( i ne ca” i nc Iude imwavar i ve and inproved processes that
result in an equivn(ent or higher q.al ity product, provided that the process used to evaluate and docunent
these changes has been revi e.ed and approved by the qua( i fyi .s act 3vi TY. Changes to the process baseline
can be made by the manufacturer after achieving approval with documented ret iebi 1 i ty ard qua( ity’ data. The
approach out! i.ed in ~his app~ix is a.proven base[ine which contains detnils of a quality system including
best ccmerclnl practices. This appendix is not mandatory. Houever numufacturers nust demonstrate to the
qual ifyinQ activity a quality system that achieves at least the SBme (eve( of quality as could b? txhieved
by ccrrplying with this appendix. Certification is provided by the qualifying activity upon awroval by the
preparing activity (for equivalent quality syst~) end qua(ifyi”g activity.
D.2 APPLICABLE DOCUMENTS.
D.2.1 ~ds and The foi iowi”g do.urents form a part of this
documnt to the extent specified herein. U.Less otherwise specified, the issues of the docunents which are
D@ adopted sha( ( be those listed in the issue of the DCCIISS ci ted in the SO( i citation. Un(ess otherwise
s~cifi@ the issues Of doc~nts not I ist~ in the Drnlss are the issues of the doc~nts cit~ in the
AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI )
ANsl/NcsL-z540- l-lwL Cal ibrnt ion Systems Requirerwmts.
(&w[ icatio” for copies shou(d be addressed to the Anmrican National Standards !nstitute, 11 Uest 42nc!
Street, New York, NY 10036. )
ELECTRONIC INDuSTRIES ASSOCIATION (E IA)
EIA-554 Assessment of D.tgoi”g Nonconforming Levels in Part Per Hi ( ( ion (PPM)

(DCO adopted).
EIA-557 Statist ice( Process control systems.
JEDEC Publication 114 - Analysis of Cccponent PIND Test Fai lures.
(Application for copies shou(d be addressed to the Electronic 1,-dustries Assoc i at ion, 2001 Pennsylvania
Avenue, Uashingtan, DC 20006. )
(Non-Government standards and other pubLi cat ions are norma( (y avai tab[e frun the organizations which
prepsre or distribute the docents. These docunents .[s0 may be avei lab(e i“ or through ( ib,-aries or other
in forrrat ional services. )
D.3 Devices fur”ishsd under this specif ic.st ion shal I carp(y with the performance
requirements of 3. herein, ard she( ( be prepam?d for deLi very i“ accordance with 5. herein. The
verification program sha( i assure that the design, processing, asstwbly, inspection, and testing of
semiconductor devices crmp(y with this specification and the nssoci~ ted specification.
D.3.1
0.3. 1.1 Managmnt shek L provide s“f f ici e“c resources, psrsorme{ , ard
authority necessary for performing al 1 .w1 icab(e verification and manuf actwing certif i cat icm requirenmnts
specified herein.
45
MI L-PRF-19500K
APPENDIX D
0.3. 1.2 ~. A functional block organization chart shall b inc(uded in the qua(ity system
program uhich shows the Lines of respnnsibi tity Rrd .uthority for organization, approval, and itrptemtentat ion
of al 1 aspects of the quality program. A mamgeme.r represenretive shal L be identified who has defined
responsibi L i ty and mmhority to ensure that the requirements of this specif i cat ion are met.
D.3.1.3 l(ltv and
For guidance o“ spcific business scenarios, derai Is of OPL

i!qiementat ion. financial cannitnmnt to this program, or interpret .stion of criteria herein, contact the
qualifying activity. The QPL nmnufacturer is the basic plant (see H.3.1)
D.3.1 .3.1.1 The basic plant is where wafer fabrication or device assemtdy is performed.
The basic plnnt has the resp.msibi ( ity for device crirical interfaces, p.?rformance, q.al ity, ad
reiiabi \ity. The trmnufacturer”s designating syibl of the basic plant shal I a~ar on the f inished prcduct.
Total ownership of the basic plant is required for listing on the OPL and JAN Brmxiing. The basic p(ant
shall be certified and qualified by the qualifying activity. A QPL manufacturer WY have Cmtltiple basic
p(ants. Unless otherwise approved by the qualifying activiry, however, on(y one device design per PIN,
psr basic plant Hi 11 be allowed. Contractors sha( ( ensure their subcontractors meet the requirements of
MI L- PRF-195DD.
D.3.1.3.1.2 ~. The basic plant may contract asstily or uafer fabrication provided
control of the contracted plant is dmnst rated to the q.al ifying act ivi ty. A uritten agreerrenr betueen a
basic plant and a contracted pbnt is necessary for al ( contracting scemrios. This agreemnt shel I
estab( ish uho is the basic p[ant. For any device type a basic p(ant may’ nor contract both asserbly and
uafer fabrication. The contracted p(ant shal 1 k cerrif ied by the qualifying activiry. Oua(if i cation of
assemb lea devices or wafers wi 1 I be the respmsibi ( ity of the basic plant. OPL manufacturers may offer
their certified ( ine services to each other. The address of the contracted assembty or wafer fabrication
p(ant ui(( be incltied on the OPL.
I D.3.1 .3.1.3
equivalent
wafer fabrti.
shal 1 be per foru.ed whenever
JANHC die evacuation
a contracted wafer fabrication
in accordance
pianr is
with MI L- PRF-1$’500
ut i 1 ized by the basic
or
assti(y plant. This die evaluation may be performed by either the contracted uafer plant or the basic
assenbly planr IJrd is appl i cable to JAN, JANTX, and JANTXV. (Far JANS devices, JkNKC die evacuation
appli es.)
D.3.1.3.1. & Wafer fabric-. The uafer fabrication plant (ha Sic wafer fabrication p[ant or contracted
wafer fabri cat ion p(.ant) may cmtract eny or 8(( of the fot Louin9 specia L Processes Y. S~ia(tY
i.sboratori es:
a. epitaxi.9L layer
b. ion implantation
c. irredi.st ion (for carrier lifetime suppress io”l
D.3. 1.3.2 ~“bi(it’f of the ~. The manufacturer is responsible for the performance of al 1
inspection requirements as spscifi.d herein, tmd in the associated specification. The manufacturer may use
their mm or other s.irab(e faci 1 it ies Mhich have been approved and grrmtti laboratory s.i tabi 1 ity by the
q..tifYi W a.tivitY fOr the wrfO~nce of the ins~ct ion req. i reme.ts specif ieci herein. The Government or
acquiring activity reserves the right to uit”ess or perform any of these inspectims set forth herein or i“
the associatd specification ard to m.dit the data resu{ting fmn the rmamfacturerss performance of these
specifications.
0.3.1 .3.3 JI@M_@. iwc.ro~y cent rv_l. The manufacturer shal 1 employ procedures
to c.mtrol storage ard handl ing of incaning mater ia(s, uork in-process, worehousec and outgoing prcduct in
order to (a) achieve such factors as age ccmtr. al of 1 imited- ( ife Mater ia{s; and (b) prevent inadvertent
mixing of crmforming m-d nonconforming materials, work i“ process, finished prcduct, res.bnitmd lots, or
customer returm.
t41L-PRF-19500K
APPENO I X D
D.3.1 .3.4 ~. Personnel performing qua(ity functions shat( have sufficient well-defined
responsibi \ity, authority, ard the organizational freedmn to identi fy and evaluate qual ity problems and to
initiate, recunnerd, or provide sotut ions.
D.3. 1.6 ~. The manufacturer shal I identify requirements and provide adequate resources for
managnmnt, performance of uark, verification activities, and internat Bud$ts. For the purpose of this
document, resources shal 1 inc(tie, tut not be limired to, rreterinls, equipment, training, ard personnel.
0.3. 1.5 Mmrmme.t reDre~. The manufett.rer sha( [ qapoinr a -r of his n!anagemsnt uho has the
authority and responsibi ( ity for development and i~lemenrat ion of the program p(an of this appendix. This
individual shal I insure that the qual ity system is meintainti and shel ( periodical (Y report to the
manufacturers management on the performance of the system and o~rtunit ies to improve it. The qual i fying
act ivity sha( ( be informal whenever there is a change in the managment representative.
D.3.1.6 The manufacturers managment shall maintain an ongoing cognizance of the

status of the qua{ ity system to ensure it ,s continuous suitabi 1 i ty end effectiveness in set is fyi.g the
requirerrmts herein through periodic revieus of the q.a( ity system.
D.3.2 ~.
D.3.2.1 A qua! ity system shal I k established by each manufacturer uhich

irplemmts all req. irm.?nts of this a~ndix. The current revision shal 1 serve to demonstrate to the
qua( ifying activity that the Q!anufactureras systwn is adequate to assure .xmpl iance iii th the applicable
Spscif icatio.s erd quat ity standards. Proprietary documents shal 1 be c(ear(y identified by category in the
system.
D.3.2.2 process fti. The Systm includes process f lows for each distinct producr fami IY. As a
mininun, f~ons sha(( inckwle wafer fabrication, asshly, processing nnd Cl, ad shall indicate uhich Cl
option has hen se(ected.
The manufacturer shal I inplement the approved system. The range and
detai ( of the procedures shal I ensure cuqiience uith this system.
D.3.2. L The mmufecturer shal I define ho. the requirements for quality ui 11 be met.
oual ity p(onning sh.sl I be consistent with el 1 other requirements of the manufacturers qual ity system. The
manufacturer shall give consideration to the follo. ing activities, as appropriate, in meeting the specified
requirements for products.
a. The preparation of qua( ity pta.s may be in the form of a reference to the a~ropr i ate procedures
that form cm integral p-art of the manufacturers qua(iry system.
b. The identification and acquisition of any controls, processes, equipwnr (including inspection and
test equipment), fixtures, resources, and ski 11s that mey be needed to achieve the required
quality.
c. Ensuring the ccfrpatibi ( ity of the design, product ion process, insp?cr ion, and test procedures,
d. The u@ti”g, as necessary, of qua( ity contro(, i.specti o”, and testing techniques, including the
development of new instrwntat ion.
e. The idemif i cat ion of any me.ssurarent requiranenr involving capabi I ity chat exceeds the knoun state
of the art, i“ suffici.mt time for the needea capability to be develo~.
f. The idemificatio” of suit~bte verification at appropriate stages in the real izat ion of prcdut.
g. The C(arificatio” of stardards of acceptability for at ( features and m.qui rement?., including those
which contain a subjective elemmt.
47
MI L- PRF-19500K
APPENDIX D
0.3.3 Gmer, ion of ~. The manufacturer shal 1 have a sysrem to

convert associated specification req. ireuents to in-house, procedures, methods, ard specifications. The
system sha( ( inctude revision nnd distriht ion contro (s. The manufa. turer, s system ensures review of
Wrchase requirements received from their custaner. The review shal I insure th.st the Prchase order does
not violate this specification for JAN prcduct of any level ard that any special instructions are accounted
for. The systm sha L 1 provide objective evidence of this revieu. Additionally, any modifications shall
also be revieud
0.3.4 ~ interface Corllc!ll.
D.3.4.1 QS3iqn. mater l.ak and Dr~ ncl doc~. Each prcduct design sha(( be fuL LY specified
such that all asp=cts of design, verification testing, processing, and msteria(s are described. 1.
addit ion, each ranufecturer shal I have a f (o. chart, traveler and a design and construction form for each
certified prcduct line (see qualifying activity).
EI.3.6.2 GluttIE of ~aiifi~. After qva Lif i cat ion, the manufacturer shall notify the qualifying
activity prior r. the release md shipmnt (for JANS prior to line implementation except for evaluation
samles) of product .hich undergoes any chnnge in the prcduct or verification program uhich affects
performance, quality, appearance, rel iabi I icy or interchnngeabi ( icy (see appendix E). The changes sha( ( be
approved by the Qua[ ifying Activity prior to release and shipnent of prcduct. Changes in design, rrateria (s,
or processes for any device mst be processed in accordance with establ i shed change control procedures for
alt affected docunents (see D.3.4.1 ard 0.3.5). Such notification shall inc(ude a thorough description of
the proposed change and a test plan designed to demonstrate that the change wi [ 1 not adversely affect
performance, quat ity, ret iabi lity, or interchangeabi I ity ar?d that the changed product wi i 1 cent inue to meer
the specification requirements. The ccmpteted test resutts shnii be approved by the quali fying act ivi ty.
After amrova( of the design chan9e, ai L prcduct inventory of the old design rust be submitted to Cl wi thin
6 months, unless authorizat ion iS extendeti by the q.al ifying agency. Unless the design change has been
required to correct or et iminate a verified design defect, finished devices manufactured to the previously
approved design which are in inventory or in process of testing (i. e., inspection lot identification code
assignd) ui(( remain qua(if ied on(y unti( that iwentory is depleted.
0.3.5 ~.
D.3.5.1 ~. The manufacturer shall estabtish ard maintnin procedures to contro\ at\
docunents that re(ate co the requi retrents of this specification. This includes, to the extent OPP( i cable,
miLitary ard irdustry specifications and stardards.
D.3.5.2 Documnts shal 1 he reviewed Brd a~roved for adequacy by authorized

personnel prior to issue. A procedure shal I be established to ensure that the pertinent issues of
aWrOpriete dOc~nts Bre avai LabLe at al I r~uir~ ~Ocat ions, That inva L id Or Obsotete dOc~nts are
prcmpt Ly rerraved from a( ( points of issue, and that any obsotete documents which are rerained are suitably
identified.
D.3.5.3 ~t chanues. Unless designated otherui se, changes to docunents sha( I be reviewea ard
approved by the sam functionslorgan izat ions that performed the original review and approval.
D.3.6
0.3.6.1 &g!d.& ition docunenrti. A system for the acquisition of SUPP1 ies and approva L of SUFPI iers
shat t be establ i shed.
D.3.7 S9ntr0t of cust~. The manufacturer shal ( establish and maintain procedures
for the control, verif icati cm, rreinten.mce and storage, as I@@ icebie, of custixner supp( ied nwreria(s and
equipmm. Any material which is lost or becanes unsuitable for use shal 1 be recorded ad reported to the
customer.
0.3.8 Prd..t ~. A(( devices deiivered to this specification shall be

traceable through rhe tot idemif ication code arm inspection tot records, and identified as in 3.7 ard
3.10). In addit ion, JANS devices shal 1 have a Lot control system f ran wafer processing through scree”i”g
uhich provides wafer lot identification; operation (machine); date of operation, opera tor(sl idemific.st ion,
quantity; erW seria( nurbrs (after step 8 of table IV) of devices processed.
MI L-PRF-19500K
APPEND IX D
D.3.9 ~. The Mnuf.ccurer sha( ( assure that al 1 manufacturing operations are carried out
to insure cent i nued process capabi 1 i ty. Operations shal ( be control led as to the manner of production,
requirernmts for monitoring and control, and output product chnracterisrics. Uhere necessary, due to the
CMPleXitY Or 5e.s~ti VitV, Of operation parao’eters, the process shal I consider uorking environment,
workmanship crl rerla, e.qulpnent set-up and the need for special operator certification or cent in . . . .
nwnitoring of critica( parameters.
D.3.9.1 Q.01L911 The relative hunidity, temperature, and particle

count for each appt i cable crit icnl process step (e.9. , uafer fabrication, asseinbtv) shal 1 t-e specif id,
control led, end recorded. The procedures End techniques for measuring rhese enviromnental parameters ad
I imits sha~ 1 be documented. The procedures shal 1 contein corrective actions for out-of-tolerance
envirmnental condit ions. U.se. (ed parts shal 1 be handled in such a May as to minimize the introduct ion of
foreign material into the sealed cavity. The purity of water sha[ 1 be specified, measured, control led, and
recorded in terns of minim resist ivity at +2YC (resist ivity maters and celts sha(( be calibrated),
maxi- totak solids, maxim.m organic i~ri ties, and maxim.tn bacteria count. In .ddit ion, spittle
protect ion is required in aFQl iceb(e critical areas.
D.3.9.2 Process monitor programs shal I h established as referenced below, for

processes per farti by the manufacturer. A fu\Ly i!p[emnted ard approved SPC program (in accordance uith
D.3.20) may rep[ace al 1 or pert ions of the process nmniror programs with rhe approval of the qualifying
act ivity. These progrmm shal I be docmented ard made avai lable to the certification ream for revieu. The
in’@ememing procedures sha( i provide for frequency, smp(e size, reject cri teria, at (ouable rework, acd
disposition of failed productl(ots. Invest igative and corrective actions shal 1 be established which address
noted deficiencies. With the exception of the parricle detection rraniror, a procedure is required for the
traceabi [ ity, recovery, and disFosit ion of al ( units mmnitored since the last successful test. As with al 1
monitors, the part icle detection procedure shnl ( provide for continua L process irrpro.eme”t. Records of
these monitors shal 1 be avai (ob(e to any (Government or mi ( itnry user) audit team for review. AS a mini!m.hn,
the process monitors shali inctude the foil owing, or equivalent as awroveci bv the qua( ifying ectivi ty:
a. Die attachment. The type of die mounting rethod, die material, die rraunti.g n!areria[, package
materiak, and nwunting configuration shal I be docunenterl. The time, twrature, pressure,
scrubbing, cleanliness, ard enviromnent sha Ll aLso be specified. The manufacturer sha(( rrmnitor the
die attach integrity for al I si I icon transistors and case mounted diodes in accordance with test
method 2017 or therma( response methods 3101, 3161, 3131, 3103, ard 3104 of MI L-sTD -750 using the
manuf acturerss docunent.d procedure. This procedure shsl I be ~rformed at each equipment set up m
a mini!m.m for JANTX ard JANTXV and maY, at the manufacturers option, consider other related factors.
This test sha(( be conductd on a minim.zn of tuo devices frc.n each die attach station at the start
and finish of operator change, package type change, die size change and after every two hours of
prcducti.m for JAMS. A different method of process control may be irplenmts-d, with the approval of
the qua( ifying activity, if an appropriate thermal respmse method is performed in 100 percent
s.cree”ing. In the event that the die shear is tess than the vaLue of t.ble I of method 2017, or the
test leaves less than 75 percent si I icon remaining of die-to-header bond surface, the output of the
die attach stat ion shel ( not be used unti 1 tests shorn that satisfactory owr.at ion has been
re-establ ish~. A prOc~ure for the traceabi t iTY, recOverY, a~ dis~sir ion Of al I units bo~~
since the last successful die attach integrity test is required. This procedure sha(( provide for
sample size, reject criteria, ard disposition of fai[ed tots. This test may be conrlucted . . the
same samples used for the wire bond strength test.
49
MI L-PRF-19500K
APPEND IX D
b. wire banding or interconnection. The b-ding techniques, type of bond .i re, and (cad material used
in ccmnecci.g the die to the package leads shall b docmented ad c~ly with this specification
and the aF@ icab(e associated spe. ificat ions. The temperature, pressure, dwe( 1 time, control of
conditicm of capi tinry or eiectrcde, ultrasonic power, cmpsi tion of metals, lead dress, thickness
to uidth ratio of bend, ad envirorwrent sha( ( be specif ie-d. The manufacturer shal k monitor the
uire bord strength in accordance with test method 2037 of MI L- STD-730 using the n!anufact. rer, s
documented procedure. This procedure shal I be per formsd at each eq.ipnent setup as a minimnn for
JANTX and JANTXV and may, ot the manufacturers option consider change of Oper. tors, lot size,
shift start and stop, ard other re(eted factors. As a minirmxn for JANS each op.?ratorluire hording
station shat [ have two device sawles taken at the start and erd of each shift, after each t..
hours of prcducr ion, and after changing operators, spools, shifts, packages, uire size, and
maintenance of equiwnt. Uhen more than one (OC is processed for JANS in a tn.-hour pericd,
SaWles shalt be tested fran e.xh (or. Put ( srre.gth data shal 1 & read and recorded arxl shal I be
control charted and maintained in accordance uith the specified requirements. Data shal I i.etude
the force, in grams, required for fai lure, the physical (ocatfon of the poinr of fai lure, ard the
nar.re of the fai Lure. 1. event that any bard strengrh is less than the pre-sea( vat.. given in
tab[e 1, methcd 2037, of MI L- STO-750, the bonder shal 1 be imct ivated inmwdiately .ard not returned
to production unti I tests show that satisfactory operation has been re-estab( i shed. Uhen the
system at the die surface is bimetallic and the lead uires are tess than 5 mi(s in diamter, the
lead shall be pulled to destruction ad if the chip bond lifts before the wire breaks, rhe Lot
sh.al I be rejected. A Procedure for the traceabi i ity, recovery, and disposition of al I units horded
since the last successful band strength test is required. This procedure sha( ( provide for sample
size, n-r of tends and device to be tested, reject criteria, end disposition of failed lots.
c. Glass-to-teed seals on clear glass dicdes. Visual inspection procedures shal 1 specify inspection
criteria, the use of visual aids, and shnl ( cmn$dy uith the requirnrrsnts of methods 2069, 2070,
2072 or 2073 (die visuai), and 2076 of 141L- STD-750. In addition, the manufacturer shall monitor
the lead-to-glass seal fo( (ouing final plating operat ion for al 1 JANTX, JANTXV, and JANS clear
9(0ss dicdes constructed with torated seal, using the manufacturer,. documented procedure. The
procedures shal[ specify crirer ia ard visual aids .nd sha(( be capable of derecting significant
10SS of g(ess- to- lend seal. (JANS &!rld JANTXV Only).
d. Lid seal. The moisture content of the sea(ins environ%enr shall t-s contro( ted. The internai
nmisture content of device packages wirh an internal cavity greater than .01 cc sha( I not exceed
5,000 PPM uhen tested in accordance with methcd 1018 at +1OWC. At ( manufacturers sha( ( exercise
package internal moisture content uanitors at key (ocat ions in the manufacturing flow. The internal
water-vapor content test may be per forti et the option of the manufacturers. Uhe. the interna(
water-vapor content test is pm form!?d, the samples shal 1 have been subjected to screen 3 of table
11, or equivalent; not required for devices which are inactive for neu design. Al 1 devices not
ut i I i zing a eutec tic die attach shal I have the internal oxygen content of the seal ing environnenr
controlled. The intermsl .axyge” content of the device pnck.sge shal 1 mst exceed 2,000 PPU at +lOO-C.
The inter”a L oxygen content test may be performed at the option of the manufacturers. when the
interna( content test is per forned, the smnpies sha L 1 have ken subjected to screen 3 of t,ble IV or
equivalent; nor required for devices which are inactive for “W design.
e. Pnrtic\e contamination. The manufacturer shall establish a partic[e detection monitoring program
I which nssesses
manufacturing
the source
line basis.
of p+rticle
lhe monitor
contami. ati. a” of sealed
shall use the test set-up
cavity devices
as specified
o“ a“ individ.a(
in method 2052 of
MI L- STD-750. JEDEC Publication 114, ,,Guidelines for Particle Impact Noise Detection (PI ND) Testing,
O~rator Tra~?im, a~ Certification” maY be used as a guidel inc. Unless otheruise exempt herein,
~ rhts monitor IS aWi icable to all metal or ceramic cavity package o.tlims. This monitor shall be
performed at the asserb(y (ocari.m, or locations, to ensure the most effective feedback loop for
corrective acti.m.
f. Application Of finat lead finish: (5ee amrdix H)
D.3.9.3 The methcds ad procedures which are wed to specify sample

size, criterie for control of the wafer thickness, cleanliness, junction and surface preparation, mstai
deposition and thickmess, etching, and .( l.ayim shal 1 be documented.
50
I
MI L- PRF-19500K
APPENDIX O
D.3.1O
D.3.1O.1 The manufacturer is responsible for assuring that al I

SUW1 i es and services procured f ran SUW1 i ers conform t. the iwrchase cant ract. The manufacturer sha[ L hmve
a system which controls inspection, storage, and handling of incuning mater ia(s, and F.sriodic evacuation of
mater iat received. The system may incl!.de verification of chemical, physical, ard f.nct ionat
characteristics required by manufacturer drawings !@ s~cificatio.s. The manufacturer may’ Ut i 1 ize a
certified suppl ier program to reduce or eliminate receiving inspection.
D.3.10 .1.1 urtifi~ sus3z&w DrOqraQ. The capability of supplied material WY be validated through a
supplier certification system. This program seleccs end rmirors SUPPI ie.s in order to guarantee that the
supp Lied material ui(( meet and maintain required capability (eve(s (e. g., Cpk, PPM, etc.).
D.3.1O.2 ~. The manufacturer shal I perform in-process inspections to the extenr

necessary to assure product ccmformsnce to the end item specification. This shall incli-de inspections ard
tests uhich assure that the processes manufacturing are in a state of controt as indicated in section
D.3.9.1 herein.
D.3.10 .2.1 -Cturer i~ Any manufacturer irposed test(s) (e. g., gross and fine leak)
conducted prior to any qualification or ~1, are to be performed on a[( subsequent (ots unti t requalified.
1f any rranufacturer impcsed tests detect a probt em, the manufacturer shal 1 suhnit al 1 devices in rhe lot to
those tests to el iminate rejects and sha[ [ take steps to determine ard el iminate the cause of fai lure (e.9. ,
rough hard~ing which has prcducti gross Leaks).
D.3.1O.3 _ and scr~. Testing and screening operations may only be performed in a
facility which has received (aboratory suitabi 1 ity owroval fran the Qualifying Activiry for each
MI L-sTD -750 test mthod to be E@oyed. The environmental conditions uhere resting arm screening are
performed sha(~ bs maintaind to assure CC@ iance with the requirements of MI L-sTo-750.
D.3.1O.4 ~.
D.3.10 .4.1 ~. Qualification ad conformance inspection shat( be

performed as required by the associated sp?cif icat ion ad herein at a faci 1 i ty which has received laboratory
suitabi ( ity aWro.al from the oua( ifying Activity. Procedures shal [ exisr to m!ainrain product tot
identification .ntit the successfu( ccmp(et ion of Qualification or Cl testing. The results of testing shall
be reviewed .rd approved.
D.3.1O.5 ~“o. am test verification. The man. faccurer shal 1 verify that al 1 inspection and testing
required by this specification ard their Oua(ity plan has been accapl ished as specified. Verification
shal I clearly shou whether the product passed or fai (.4 any requirement and shal( contain suf f iciem detai L
to allow traceability to e specific operator, test date, md program.
D.3.11 Qntrol of i~ test ~.
D.3.11.1 ~. The test programs and setups used to sort, classify, ad tesr for
MI L- PRF-19500 mquirmnts are required to be tr.sceab Le through each docurent control systm to insure the
correct revision uas used he” testing MI L- PRF- 19500 devices.
0.3.11.2 W muiment ~ce and calibration SVStem. Maintenance m-d cal ibrat ion systm and the
frequemy of scheduled act ims, for gauges ard test eq. ipnenr, shal I & established. The system may me
ANS1/NCSL Z540-1-1W4, or equivalent, as a guideline.
D.3. 11.3 -- and methcds of test. The general requir.anmts, condit ions and method. of test sha L 1
be i. eccorda”ce with MI L. STD-750.
D.3.11.4 Els.ctric.l W&+9@mnt verificns-im. The mamfacr.rer shal 1 define acd uti I ize a methcd
[e. g., correlation sarrpies, diagnosis routines, etc. ) to verify the mea.. remenr and operation
characteristics of the test equipnent when in use. In the event of verification of failure, the
manufacturer sha[ 1 ut i 1 ize B procedure which wi 11 determine the req”iremsnts for traceabi I ity, recovery, and
.hm retesting is required of all ““its tested since the [ast successful verificatim.
51
M! L-PRF-19500K
APPEND 1X D
D.3.11.5 Ve test melh5dS. Other test merhods or circ. i ts may be substituted for those specified
in M! L-sTD -750 provided it is demonstrated to and approved by the qualifying activity that such a
substitution in no uay relaxes the requirmrents of this specification. The schematic uirin!j diagram of the
test equipcent shal 1 be made evai (able for checking by the qual ifying activity.
D.3.12
D.3.12.1 A system sh.al I be maintained ro insure that products are identified

by rheir test or inspection sratus, The system’ shal 1 insure the separation of prcducts that have been
tested or inspected from producr that has not.
D.3.13 tmtro~ of non~. The mmufecturer sha( ( maintain a system uhich wi k 1 prevent the
shipnent or use of nonconforming prcduct. The sysrem shall provide for identification, segregation, and
evaluation of prcduct uhich does not conform to specified requirements at any point in the manufacturing and
screening f low
D.3.13.1 ~. Reworked or repaired product shall be re- inspected in accordance with the
.3 Wropr i at e procedures.
0.3.13.2 Work orovisims. Al I rework permitted on devices manufactured under this specif icarion shat I
be acccr@ i shed in accordmce with The estabk i shed procedures. Lots shatt nor exceed two re.orks for any
process.
D.3. 13.2.1 ~r rewr~. For wafers, rework is limited to the fo({ouing: additiona( etch to correct a
nama”farma”ce to a specification Limit; pi!otoresist strip acd recoat; additional processing to continue or
finish incqlete processing; strip and redeposit of non-junction passi vation or backside meta((izat ion.
For JANS no rework or redeposition of any oxide (ayer is al loued.
D.3.13.2.2 No del idding or package cp.?ni ng sha L L k-? permitted except for
disc packages. unless otherwise specified, reuork of sealed packages is limited to recleaning, reboarding
to correct defective marking, and lead straightening, re-p( aring or re-solder dipping of the le.ds. After
any re-plating, .s1 1 JAMS, JANTXV, ard JANTX shal I pass as B 100 percent screen the requirements of group A,
subgroup 2 md the hennet ic seal requir.ar..ents of screen 7 of table IV herein. So(der dip reu.ark sha L L be in
flccordmce wi th appw?dix H.
D.3.13.3 ~. Lors uith an .nscreenable fai lure mode shal ( be rejected. Unless the ent ire
inspection (ot has seen the same screening, devices which have received PIND screening in accordance uith
6.1.1 may not be considered as candidates for this inspection.
D.3.13 .3.1 w re,ubnitt~ for ~. U“Less otherwise sWcif ied, tots may be resuhnittec for burn-in
one time on[y and may’ be resubmitted on(y uhen the observed percentage of defective does not exceed twice
the specified PDA or 20 percent whichever is greater. ResuhnittEd tots shal 1 contain oniy parrs which uere
in the origiml lot. ResWxnit ted lots shall be kept seprate from neu tots end shall be inspected for .s(1
specified chnrocter istics using e tightemd inspection PDA of 3 prcent. 1 f the percent defective for the
resutrnitt~ lot exceeds the tightened inspection PDA, the .mtire res”hi tted lot sh.s( I be .nacceptab(e for
any quatity [eve\.
D.3.14 IOrrective i ore
D.3.1 L.\ Sorrwtiv, action. The system identifies the respnnsibi 1 i ty for de. isicms regarding the
necessity for a corrective ection as a resu Lt of fai Lure, defect analysis, imppropr iace performance of
ins~cti ons/procd.res, product trerds, inappropriate records and audits. Evaluation and approval of the
proposed corrective action shall be rrede part of the record of the lot(s) im-alved. If 3 of 10 consecwive
(ots or if 2 successive tots of a device type or structw.aily idemical types are rejected for the same
fei lure m.sch,mism, corrective ection sha( I h initiated by the mmmf.act”rer. Fait.re co initi are corrective
action may result in rmoval of products frmn the q“a(if ied pmducr list.
52
MI L-PRF-19500K
APPENDIX D
D.3.15 ~.
D.3.15.1 wuritv of c~. Marked devices which have passed .({ screening and qua( ity
conformance requirements shal 1 be retained in a secure area prior to shipmnt del i very. Device inventory
shal 1 be control (ed by device type, 10K identification code, quantity, product assurance (evel, ad
transaction date. This requi rent a~lies to bnrh the rnanufncturer ard the distributor.
D.3.15.2 ~. The Manuf.xturer of ESDS c(ass 1 and 2 devices sha( ( institute an ESDS program
canmmsurate with the prcduct classification. The product ctassifj cation shall be 8s indicated in
appendix E. The requirements of E[A-625 app(y tit may & tai (c.red for establishing an ESDS program.
Justification for the rei(oring shall be made available to the qualifying ectiviry for approva[ upon
request .
0.3.16 ~’tv recordz. A system shall be in place to track the results of a[l q.a(if icati on, screening
(attrikte data], quality conformance tests (attributes or varinble data) ad insp-ecr ions, and any requi red
fniture analysis per (or.
D.3.17 JmsscLMl auatitv wfiu.
D.3.17.1 JnIscml audit mum. The manufacturer shalt establish an it-dependent internal audit program
which shal L be included in the quality system. The i“rernal audit program shel ( assess ccapl ience uith al 1
aFQl i cable qual ity system requirements md shal 1 identify key review areas, their frequency of audit, ad
descrik the corrective action system. The interne( audit program shat L include any subcontractors used.
D.3.17.1,1 Zmmal audit chedliW. The internal at.dit checklist shall assure that the qua( ity system
is adequate and fo( (OUR+ by al 1 personnel in each area.
D.3.17.2 ~ and fr~. The audit frequency shel ( in no case exceea one year for each
area unless authorized by the qual ifying activity. An interna( audit shal 1 be corduc ted and corrective
actions cmleted prior to the initial qualifying activity audit. The qualifying activity WY modify the
frequency of the interna[ audit(s) or require additional ins~ct ion based on the effectiveness of the
manufacturer 8s i nterna( .udi t program, ad assessment of the interr!a~ .&it f i rdi ngs.
0.3.17.3 ~. The designatd auditors shall be independent from the area being audited. If the use
of an independent auditor is not practical a second individual should be assigned to participate in rhe
audit or review the resu(ts. Atiitors shall be rrained in the area to be audited, in the aW(icable
mi 1 i tery specification requir arents and provided with an appropriate checkl ist for .snnorat ing deficiencies.
Prior to the audit, the assignea atiitor (s) shal ( revieu the previous internal Edit resu Lts to assure
corrective actions have been implemented and are effective.
D.3.17.4 &.dit de ficieti. A([ o@it de fir, iencies shall be conveyed to the responsible irdivid.a L for
correct ive action(s). At I corrective actions shal 1 be egreed TO by the managanenr represemat ive. A
procedure shal I be established to fol low up on al 1 audit deficiencies r. assure that the corrective act ions
have been i~kemented in a time(y manner. If recurrent deficiencies are fourd additional corrective action
shal ( be taken to assure correct ion of the prob(ein and the Qualifying Activity sha L ( be notified. The
internal audit team shat i perform a 6-month fo( tow-up verif icarion of corrective actions r. assure that rhey
are adequate.
D.3.18 ~.
D.3. 18,1 Al I personnel performing an operation affecting

qua(ity shall be trainea in L!rd fami(iar with that part of the operation re(ev.snt to their fmcti o”. They
shal 1 have suff icie”t resp.msibi 1 ity md authority to impect and accept or reject prcdut according to the
applicable Specifications.
D.3.18.2 ~. U.ark training practices shall be established and utilized in .wqujri”g

ard maintaining job skills as requird in critical wrk areas.
0.3.19 ~. Not .Wlicable to rhis docurent.
53
MI L-PRF-19500K
APPEND IX D
0.3.20 ~.
D.3.20. 1 SPC m.a.ar~. The manuf,ct.rers Statistical Method Program uhich is uses to achieve continuous
improvement and process control in their manufacturing I inc. The manufacturers SPC program sha[ ( be
included as prt of the qua Lity system. The manufacturer shal I “se SPC techniques in the manufacturing
process for parts covered by this specification.
The SPC program sha( ( be in accordance with at ( the requirements of EIA-557. A minim program sha( t
incltie train ina. definition of critica[ operations. instat tation of statistical control techniques. a
control .gctio” ~~stem ard FMEA. The mmufacr.rer shal 1 perform the fo( towing assessment of rhei’r p;oducts:
a. Identify rhe fei lure modes for the device.
b. List the conrriixning foi(ure mech.misms for each fgi lure mcde.
c. !demify the manner in which the risk of shicming prcduct with the inherent defect is mitigated, for
each fa; Lure mechanism. Examples:
(1) Design.
(2) Material cmtro(.
(3) Process control.
(4) Screening.
(5) cl.
A planned SPC mi Iestone schedu(e Bti progress reporting system shal I be deveioped and made avai i able for
review. The SPC program plan ad mi lesrone shal ( be maintained as part of the over’d LL verification progrem
p(=m as specified herein. The progress reporting system she( 1 be Uwated on a quarrer{y basis and be made
a.ai (ab(e to the Oual ifyin9 Activity upon request.
0.3.20.2 Process ~ts for al I di~es. rectifiers. and ZeDsc.S. If e tar exhibits an out
of controt condition, the entire tot sha(l k removed fran the line arc heid for engineering evaluation and
disposition.
D.3.20 .2.1 Thermal inped.ante me.surament shal 1 be performed i“

accordmce with the apfd icable MI L- STD-730 thermal methods. The screening ( imit sha L ( be derived by each
vendor by means of statistical techniques, once the process has exhibi ted contro( and capabi 1 ity. The
capability data shall be used to establish this screening Limit. The n!axi mm’ 1 imit sha( I not exceed the
group A, subgroup 2 limit of the associated specification. In addition to screening, once e fiKed limit has
be. established, mwniror each die attach prcd.ct ion 10LS using a randan five piece sample (minim) frun
each die att.xh production lot to be plotted cm the applicable X, R chart. Unless otherwise justified by
engineering evaluation, a Cpk of 1.33 mi”irmm, and pass/fail (imits of t3 sigrm are expec red.
D.3.20 .2.2 u c u rre.t mewcmenls. LeakL!ge current Measurements shal ( be performed in accordance
with the applicable MI L- STD-750 leakage curr. mts methods. The screening limit shall be derived by each
vendor by means of statist icol techniques, once the process has exhibited control and c.p.sbi ( ity. The
cspabi 1 ity data sh,a([ be used to estab( ish this scree”i.g [ irnit. The maxinun (imit shatt mat e$,ceed the
group A, s.bsroup 2 I imit of the a.,ociat~ specificeti o.. In addition to Screening, once a fixed limit he.
bee” established, monitor aL 1 wafer Lots using a randun five piece sanp(e (minimum) from each uafer lot to
be p(c.t ted 0. the ‘aw1 icable X, R ch~rt. U“l.?ss otherwise justified by engineering evalmr ion, a Cpk of
1.33 mi”inun arc! Pass/fail of ,3 $igma nre expsc ted. (This requiren’mt is not aW(icab(e for Leakage
currents of 10 W and be[ou. 1
54
MI L-PRF-19500K
APPEND IX D
D.3.20.3 Eorts c.m miLliOn CPPM) verificatia. The manufacturer shal I estab( ish a Systm for CO I Iect ing
and reporting defect (eve(s in PPH. Data CO( lected from the tests of group A, subgroups 2, 3, and 6 sha( (
be used for PPM calculations in accordance with EIA 556. The maxirmrn de(ivered defect (eve( shall be 100
PPM. For the purpose of PPM calculations data frmn devices from structural (y identical groupings may be
cunbined. The contractor is responsible for esrab[ ishing a quality system to verify rhe PPf4 defect (evel of
lots that are subjected to subgroup tests of the group A inspections. The PPM defect (evel shal 1 be based
on a 6-month nmving average. In the event that the contractor (caIpnent manufacture) meets or exceeds 100
PPM for PPM-2 groupings the manufacturer shal 1 identify the problem device type(s) and prob(em s.broup
which caused the grouping to exceed 100 PPM. In the event that a device tw or structural IY identical
device types are of insufficient volume for PPM eve(uat ion, manufacturers may create their own groupings
uith the fo( lowing guidelines:
a. Simil. r package styles.
b. Simi(er ccmstruct ion, materials, and p.ocessi”g.
D.3.20.3.1 PPM a.atitv le els The qunl ity of tots that have ken subjected to acd have passed the 100
percent screening imp?ct ion: of “table IV (or unscreened devices at the option of the manufacturer) sha[ ( be
established ard maintained in accordance with 0.3.20 .2.2 below .ard EIA-554. Individ.nl PPM (evels for PPM-2
shal I be c~ted for tabke V, subgroups 2, 3, and 4. The sur of these equate to the overal ( PPM-5 defect
level.
0.3.20.3.2 Grouo A. s.~ro.o 2. 3. and 4 tests (PPH .ate~. Test resuits frm subgroup 2, 3, and 4
shal 1 be used for subsequent PPM calculations in accordance with EIA-554. PPM caicular ions shal ( be based
on the resu~ts of the f irsr submission ard shal 1 be based on the senicorductor grouping defined as
structura [(y identical (see a~fxli. E), or as defined in D.3.20 .2.3 and PPM calculation, shall not use data
on resutrnit ted tots. Calculation and data exctus ion shall he in accordance uith EIA-554. Larger san’pies
may be inspected by the contractor in order to .B(c. (ate PPM, however reject ion of the lot shal ( be base-d
on(y on subgroup sanple testing.
D.3.20 .3.3 Uvice qr~. Uhen production of any device or struct.ra( (y identical group is
insufficient r. allou accurate calculation of PPM, s, the manufacturer, at his option, my increase the
tested san’ple size, or may create expanded groupings based on simi Ierity of package, process, construct ion,
or specialized materials. If an increased samp(e size is used, rejection of lots uiii be based on the
rqi red su~rmp sanpte testing. Expanded groupings, ard any change ro the expande.i groupings nust be
WPrO.ed by the Oual ifying Activity.
D.3.20 .3.4 100 PPM. Uhen f.si (ure in a lot sample comes a six-mnrh ml 1 ing werage to
exceed 100 PPM, the manufacturer shall determine the cause of the fai lure(s). A corrective action ptnn
shal 1 be developed, and irp(emenred.
D.3.20 .3.5 W.B_custmer .orrelti. The manufacturer shall establish a feedback Imp with 011 custmers
who request participation to correlate the cmtmer, s test resu(t$ with those of the manufacturer.
55
MI L-PRF-19500K
APPENDIX E
STANDARD VERIF1 CATION FLW FOR ENCAPSULATED DEVICES
E.1 SCOPE
E.1.l -. This appe~ix contains the standard test flow which, when wrformd in its entirety,
assures that the product WI(L meet the performance requiretrmts. The QPL program measures ard evatuates the
I manufacturers manufacturing process against a baseline for th. t process. This baseline can incluie
innovative and improved processes that resu(t in an equivalent or higher quality product, provided that the
process used to evaluate ard docunent these changes have been reviewed and approved. Changes to the process
base(ine can be made by the manufacturer after achievinq approval with documented retiabi~ity and quality
I data. The approach outlin’al in this appmdix is a proven baseline which contaim details of the screening
ard Cl proc~~es. C~liance with this apperdix is “m mardatory. However, manufacturers must demonstrate
to the qualtfylng acr, vlty a system that achieves at (east the same level of quality as could be achieved by
I -@yh withthis%-+x.
I E.2 APPLICABLE DOCUMENT
E.2.1 ~. The documents Listed in this section are specified in sections E.3 ard E.4 of this
I sp.xific,ti.m. This section does not incltie docunents cited in other sections of this app=txiix or
rec-rded for additional information or as exanpl es. Uhile every effort has been made to ensure the
.cmplete.ess of ~his (ist, docunent users are cautioned that they rust met all specified requirements
docunents cimd In sections E.3 ald E.4 herein, whether or not they are liswd.
I
E.2.3 ~. The follouing document(s) form a part of this
docunent to the extent specified herein. Unless otherwise specified, the issues of the docunents uhich are
DC.2 adcpted are those iisted in the issue of the DWISS cited in the solicitation. Unless otherwise
s~cif ied, the issues of documents not iisted in the Drnl SS are the issues of the docments cited in the
AMERICAN NATIONAL S1kNDARDS INS1l TUIE (ANSI)

I
I ANsl/NcsL-z540- l-lw4 - Calibration Systems Requiranents.
(Application for copies shou~d be addressed to the American National Standards Institute, 11 Uest 42nd
1 Streer, New York,
ELECTRONIC
NY 10036. )
INDUSTRIES ASSOCIATION (E IA)
~ EIA-557 Stnristica( Process Contro( Systems.
[Application for copies should he addressd to the Electronic Industries Association, 2001 Pennsylvania
Avenue, Uashingtc.n, DC 20006. )
I
I (Men-Goverrirent stardards and other pab(i cations are norma(ly available from the organizations which
prepare or distrihte the docunents. These docunents a(so My be a.ai( able in or through Libraries or other
informational services. )
I
E.2. fJ 9rder of orece&lcs. In the event of a conflict betueen rhe text of this docunem and the
references cited herein (except for re[ated associ ate-d specifications or specification sheets), the text of
this docurent rakes precedence. Nothing in this docmem, however, suprsedes applicable laws and
I regulations un(ess a specific exemption has been obtained.
56
MI L- PRF-19500K
APPENDIX E
E.3 GENERAL TEST AND 1NSPECTION INFORMATION
E.3.1 u~tion or et~. If a manufacturer e[ects to eliminate or reduce

all or my Cl step or 100 percent screen operation by substituting a process monitor or SPC procedure (when
approved by the preparing activity and the qualifying activity), the manufacturer is on(y relieved of the
reswnsibi(ity of performing the Cl or 100 percent screen operation. The manufacturer is sti({ responsible
for providing prcduct which meets all of the performance, qmlity, and reli.bitity mquir.menrs herein. A
manufacturers reliability program may be used in lieu of IJ(l or any screening step or any’ Cl, when
equivalent to or ccopl iant uith E.6. 1.1 acd 0.3.2 herein. The fo((owing are the mininun guidelines for a
manufacturer to eiiminate or reduce testing in eirher Cl or 100 percent screening:
a. The manufacturer shall demonstrate that a Fai(ure Mcde Effects Analysis (FMEA) or equivalent study
has ken performed to identify potent iat device failure modes acrivated by the test which is
intended to k changed or eliminated.
b. The manufacturer shaLl denwnstrate that an SPC program is i“ pLace to ensure that the defect ievel
fr.an each of the identified failure nwdes is controlled at [ess than 500 PPM measured at a W
percent confidence level. (Beta = .05 at 600 Ppn)
c. The manufacturer sh.1~ demonstrate that end of \ife or step stress to failure limits have been
identified for any product intended for a test ft.. change.
d. The mmufact.rer shall demonstrate through a design of experiment or equivalent rrethod that devices
tested u?der the proposed change in the test fiow Bre equivalent in quatity to those produced under
the previous flow. Devices nust be equivalent in erd of (ife capability, not just capabke of
meeting the specification requirements.
E.3.2 The product sha(( b? asser’b(ed into an identifiable inspection (01

or collection of inspection sub(ots. Each inspection lot shall k identified by a unique (or identification
code (see 3.10.8).
E.3.2.1 The total n~r of devices that the manufacturer submits

at my one time for qualification or Cl sha[t constitute an inspection (or. The maximum srna(( inspection
lot size shall k 2,5oo devices. The inspection lot is s.bnittd to determine cup(iance with the
req. irerents of the associated specification. Each inspection (ot shall consist of devices of a Sing(e
device type or consist of 8 co((ect ion of subtots of structurally identica( devices contained on one or more
associatd specification manufactured on the sam productim line(s) within a single plant through final
seak by the same production technique and to the same device design with the sam material mquiranents ard
sealed within the same 6-ueek period. Lot identification shall be maintained frmn the time the lot is
assemb(ed to the time it is accepted or rejected.
E.3.2.2 An inspection sublor sha[[ consist of a single device type comained on a

sing[e associated specification manufactured on the Sam production tine(s) rhro.gh final sea( by the same
fabrication tech”iqw and to the same device design with the same material req”i remems and within the same
b-week period.
E.3.2.3 ~tlon lot.
E.3.2 .3.1 ~. h wafer lot shalt consist of only semiconductor wafers subjected to each md every
process step such as masking, etching, deposition, diff.sim, or meta((iz.stirm as a group. Each wafer (or
shall be assigmd a unique !dentifier which provides traceability to 8[[ uafer processing steps. Uafer lot
records shrill identify .1[ JANS device inspection tots formed frcm the wafer lot.
E.3.2.3.2 ~. Wafer tot accept.mce is req. ird for se(ec ted die designs such as
overlay structure devices and devices with meta((izot ion path to bend pad crossing any j.mti.an covered by
passi vation or glass ivetion where the bonding pad is nor cm the active area of the device. This acceptance
sha(( lx Oerfortned in accordemce uith method 5001 of IAIL- ST D-750 for each of these iots.
57
MI L-PRF-19500K
APPENDIX E
E.3.2 .3.3 The total nurber of devices that the manufacturer s.hnits at any one
time for JANS qualification or Cl shalt constitute a device inspection lot ard shall conform to the
following criteria:
a. Sn’.akk (ots shaii not exceed 500 pieces. Sanpling inspection for large or small \ors shall be in
accordance with table Via.
b. All devices sha[[ be of a single device tvps.
c. All devices shall be fran e single uafer tot.
d. ALL devices shall be asshled on the same production line uirh the same technique from die .ttach
through final seal, within 21 working days not to exceed 31 cnlendar days.
E.3.2. b Structurally identical device types are devices

manufactured on the same production Line(s) through final seal, by the seine fabrication technique within the
same pckage femiiy and t. the same device design with the same material requirerm?nts and differ only
electrically or by dimensional pr.pmt ions. Exemp(es of such structurally identical device types are as
follows,
. . Rectifiers, diodes, or thyristors 9rouped into different voltage rari.gs. Rectifiers ad diodes
with identicai design rules (same passivnt ion and device structure) uhich differ only in die size
and pck.age size are considered structurn(ly identica(. Initia(ly, Group B and C shatl be
performed on each device construction in every associated specification. On subsequent lots, the
die sizes{ package styles uhich receive group B and C inspection sha(( be rotated on every lot thus
assuring that all die/pack8ge stYles receive 9r..ps B and c i.SFeCti o..
b. Transistors grouped for gain limits and v01ta9e ratings. Trnnsiscors ( > 6 watts) with similar die
strucr.res that vary only in die size are considered structurally identicai if the following
criteria are ma.
(1) Die must have the same generic design rules ad vary only in size. Channel stop, voltage
enhancement, and emitter ba((esting techniques, epi -base, diffused base, expanded contacts ard
mern( interconnects over oxide steps nust be simi(ar. The process sequence in the diffusion
and tiototithogrephic areas must be the same. Transistors nust have similar peak frequency
responses and V ratings that do not vary more than two to one (3 MHz to 6 HHz, 60 v dc to 120
V de). Darlington transistors camot be grouped wirh standard transistors.
(2) Overall construction must be the same. The ntmber and size of wires can change as is needec
to hatile the pwer rating, but the die atrach, wire attach and encapsulation methcd nwst be
identica[.
c. Power tlOSFETs grouped for rDs(o”) and voltage ratings. Power MOSFETS of the same vo(tage types
uith identical design rules (field termination and cell density) ard uhich differ only i“ die size
are c.msiderd structural identical. lnitia ((y, 9roups B ard C shall be per forrred 0. the (argest
die size available within each structurally ide”tic~( voltage grouping. The die sizes which
receive groups B and C inspection sha{( k.? rotated on a periodic basis thus assuring th.st a~l die
sizes receive groups B and C inspection.
E.3.3 ~1 of Samks. Devices subjected to destructive tests or which fail any test shall not be
shi@. %II@e devices fran lots uhich have passe-d Cl and which have bee” subjected to mechanica( or
em+irommentn( tests specified in groups B and c inspsctim .4 mt classified as destructive, may be shipped
provided each of the deices subsewe.tly Psses 9r0.p A, s.hroup 2 inspct ion.
58
MI L-PRF-19500K
APPENDIX E
E.3.4 Pestr.ctive tes~. Un(ess otherwise demonstrated, the follouing MI L-STD -750 tesrs are classified
as destructive:
Isst
1017 Neutron irradiation
1019 Steady state tota( dose irradiation
1020 ESDS classification
1021 moisture resisr.nce
1036, 1037 Intermirrent operarion tife
10.$1 Salt arnm@ere
1062 (condition D) B.rn-i Wlife test for power MOSFETS
1046 Salt spray
1056 Thernts L shock (g(sss Str. in)
2017 Die shear tesr
2031 Scddering heat
2036 Termina( strengrh
2037 Post sea L bond srrength
2075 DeCap interna( visuai design verification
2077 SEM
All other mechanical or envirorirental tests (other thnn those listed in E.3.5) shall M considered
destructive initia( (y, but may subsequently & considered nondestructive upon accwl ation of sufficient
evidence to irdicate that the test is nondestructive. The accm[ ation of data fram five repetitions of the
specified test on the same sanple of product, uithout significant evidence of cuwlative degradation in anY
device i“ the sample, is considered sufficient evidence that the test is nondestructive for the device of
that manufacturer. Any test specified os a 100 percent screen shall be considered nondestructive for the
stress level m-d duration or nurber of cycles app (ied as a screen.
E.3.5 Untess otherwise demons tratti, the fot(owing MI L- STD-750 tests are
classified as nondestructive:
I&u
1038, 1039, 1040 Burn-i” screm
1042 Burn- inl(ife rest for pouer f40SFET5

(conditions A, B, ard C)
1051 Thenmt shock (temperature cyckingj

(100 cycles or less]
1001 Bercmetric pressure
1022 Resist.mce to srd.ems
1026, 1027 Steady-state life

MI L- PRF719500K
APPENOIX E
3.S.SI
1031, 1032 High t~rature (ife (nonoperating)
1071 Hermetic seal tests
2006 consr.nt acce(eret ion
2016 Shock
2026 Solderabi(ity (If rhe original lead finish is unchanged and if

the n!axim.rn a((ouabke nunber of reuorks is not exceeded. )
2052 PIND test
2056 Vibration, variable freq.emy
2066 Physica( dimensions
2069, 2070, 2072, Internal visual (precap)

2073, 2074
2071 External visual
2076 Radiographic inspection
2081 Forward instability shock test (FIST)
2082 Backward instability shock test (BIST)
3101 Therma( imance testing of dicdes
3103 Thern!a( irpedance measurements for !GBTs
3104 Therma( inpedance measurements for GaAs
3051, 3052, 3053 safe operating area (SOA) [condition A for method 3053)
(with limited supply
voLt age)
3131 Therma( resistance (emitter to base forward volrage,

emitter-only switching merhcd)
4066 Surge current
4081 Therma( resistance of (cad maunted dicde (forward voktage,

switching method)
Uh.?” the jmctio. temperate exceeds che device maxi- rated junction ten’perature for any operation or
test (inc(uding elect rica( stress test), these tests sha(( be considered destructive except under trams ient
surge or nonrepetitive fault conditions or .Wroved accelerated screening when it may be desirab(e to allow
the junction temperature to exceed the rated junction cer@rature. The feasibility sha(( be determined o“ a
part by part basis and in the case where it is allowed adeq..ste sanp(e testing shall te performed to provide
the prwr re(iebitity safeguards.
60
MI L-PRF-19500K
APPENDIX E
E.3.6
E.3.6.1 tots of JAN2. Resubmitted lots shall be kept seperate fran neu tots and shall h
clearly identified as resu&nir red (ots. Any fai Led lot for group 0, subgroups 1, 2, 3, I., 5, 6, and grcup C
rrey be resubmitted one time only, for rhe failed subgroup, at double the original sampie sized with zero
failures. Lots which fait group B, bond strength, die shear, decap internal visua[ and SEM (when
appl icab(e) shall not be resubmitted. For group A, E.3.6.2 shall w@y. Uith the approval of the
qu. (i fYin9 ectivitY die .he.r faitures (Uhen determ<nti t. be die attach faiiure de) may be considered to
be screenable utilizing the aplicabte thermat impedance methods.
E.3.6.2 Resuhnitt.a lots sha(t be kept separate fr.mn new

lots and shall be clearly identified .s resuhnitted tots. Uhen any’ lot subnit ted for q.atif ication or Cl
fails any applicable subgroup requirement of groups A (for A-2, A-3, and A-4, see footnote 3 of table V), B,
C, or E tests, it may be resubmitted once for that particular subgrO.p at double the original sanple size
with zero failures. A second suhnissi on, using double the origina~ sar@e size with zero fai(ures, fray onky
be PWf.rk if ir iS determined by ana(ysis of a(( ~he fai Led devices, that the failure mechanism is due t.
a defect that C.. be effectively remc.veci by rescreen1n9 the entire lot, and that rescreening has keen
per f.mlied.
E.3.6.3 JANSF.
~. Lots which fait group D tests may be resuhnitted if failure
an~(ysis indicates th8t the defective parts can be effectively removed by screening the entire Lot [100
percent) ard sampie reresting to grouP D requir~nrs.
E.3.7 ~tiS of teti. Conditions .rd methods of test shall be in accordance uirh
M! L-sTD -750. The general requiremmts of MI L- STD-750 apply ?.s specified. & s’ystan for control ard
calibration of test equipment shall be established. ANSI INCSL z540-1-l W& may be used as guidance for the
calibration system.
E.3.7.1 ve test Uelh9&z. Other test methcds or circuics may be substituted for those specified
i“ MI L- STD-750 provided it is d.smnstrat~ to and approved by the qualifyin9 activity that such a
substitution in no uay re(axes the requirements of this specification. The schmtic wiring diagram of the
test equipment shall be made avail abLe for review by the qualifying .ctivity.
E.3.7.2 If it is determined through an

engineering evaluation that a fai Led device is the result of test equipnent failure or human error, a
rep[scemsnt device from the same inspection tot may be added to the sarr@e. The replacement device shail be
subjected to all those tests to which the discarded device uas subjected prior to its fai[ure arm to any
remaining speci fiti tests to which the discarded device uas nor subjecwd prior to its failure. Failures
occurring as a resutt of operator error, prior to the start of testing, may h rep Laced by the manufacturer
tut sha([ be noted on the Lot htstory. Any ESD faj{ures shall be counted as rejects and not be attriburd
to equipnent/Opsraror error for screenin9, group A, md end-point electrical tests of MI L- STD-750.
E.3.7.3 Flrd hoi-. The mamf.scturer of UHF erd microuave mixer diodes shall
estab(ish ard maintain standard mixer diodes ard standard mixer hoLders for use in qualification and qua[ity
conformance testing of UHF and microwave mixer diodes. These standards shall be calibrated at least once in
each successive 12-rranth period or prior to use if over 12 months, at a (eborarory acceptable to the
Goverrmmnt.
E.3.8 Unless otherwise specified in the associated sp-ecific.at ion,

B(I electrical nwswmrenrs performed on devices during screening tests end (or acceptance tesri”g shall be
recorded.
E.3.S.1 ~. A .Lmrnary of the JANS parts fa((o.t d.rimg screening tests shall k
prepared by the rren.facturer in accordance with the requirements of the qualifying activity
E.3.9 ion of 10[ )dentl~. During all screening, inspection, and marking operarioms, each (OC
and sub(ot shall be kept segregated, secure, and traceable.
61
MI L-PRF-19500K
APPENDIX E
E.& WALIF1 CATION
E.4.1 ~. Q.a[ifi carion inspection shell be performed at a facility approved by

the q.e(ifying activity ard shall be conducted in accordance with the procedures descr ited herein ad by the
Qualifying Acti.ity. Qualification of a particu(nr device type ro a given quality (evel may be e$. ter?ded by
the qualifying activity to any other qua[ity (eve( provided a(t the groups A, S, C, O, and E requirements of
the other level have been met Brkl provided that suitable approvea screening facilities are available for the
other tests and stress levels. In addition, the requirements of a~ndix H sha(l be met. Sma([ (or
sampling sh.al( not be used for qualification ins~ct ion.
Group D is required for each inspection lot of RHA types as specified in the associatd specification.
Qualification for RHA shall be for n specific semiconductor die and package type.
An a(ternate qualification procedure for RHA devices for (eve(s M, L, ar?d D oniy, are avaitab(e for devices
with demonstrate RHA. These devices Wst be subnitt~ for qualification inspection and Cl, if process or
design changes affecting RHA are made. OPL-19500 provides a footmate for devices not requiring RHA
qualification or Cl testing.
E.6.2 All Sawles subjected to groups B, C, D, ard E nust have teen chosen from a
lot which he. psssed the requirements for group A except as mcdif ied in E.6.1 .6. The following conditions
app(y:
a. The required sample ptan fran e sublet of each device type sutrnit ted except for series of devices
shall be the sanple plan of the highest and the (ouesc voltage rypes or as the qualifying activity
requires, shell be tested for each group A sut-aroup.
b. A serp(e fran one sublet shall be test+ for each gro.p. B subgroup. A sanple device frcm each
sublet (ench device type) shall be suhnlt ted to the design verification examination.
c. A sample from one sublet sha(( be testd for each group C subgroup. At the option of the
n!+m.facturer, devices frcm table lVb, subgroup 3, may k continued on in group C, subgroup 6, r.
achieve 1,000 hours or 6,000 cycles total, or separate Sanp(es may be used.
d. Uhen group D (RHA) qualification extension is granted, the radiation facility shal[ k approved by
the .qualifyi”g activity. A sample from a sub(ot of each device type shall be rested for each group
D SUb$l,OUp.
e. Oevices which are constructed using braid+ (cads may be processed through tabte IV screening erd
qual~f ication hi9h t~rature testing prior r. the addition of (cads. Walific atim testing
requiring toad current conduction wil L require that leads be attached.
E.4. Z.1 ~ion tO ESOS C-. Initial q.a[ific!ati.an to an ESDS class or requalification after
redesign shall consist of que[ificaticm to the appropriate qua[ity and reliability level p(us ESDS
Classification in accordance with msthcd 1020 of MI L- STD-750.
ESDS classification (eve(s are defined as follows:
ESDS C(CdSS Prior designation E{ecrrosta tic

~
cateaorv v.a I taqe
A . O-1,9WV
: B . . 2,000 - 3,999 v
3 6,000 15,9’W v
No.sensi t i ve > 15,999 v
a. Although lirt(e variation due to case outline is expected, if a device type is available in more
than one package Cm or case outti m?, ESLIS testing and classification shal L be a@ied to at least
that one packege type shown by exprie”ce to be worst case for ESDS. ESDS classification test
resutts shall be submitted to the qmlifyi”g nctivity for et{ associate specificetiorm for listing
on the QPL. Specification using structurally identical die designs may be cl~ssif ied with data
fran previously classified types. Any dissimilar designs wirhin a associate specific~t ion shall
have ESDS classifications for each str”cturnlly identic~( grouping.
62
MI L- PRF-19500K
APPENDIX E
b. A([ power hi-polar transistors and rectifiers except sch.ttkys are considered to b-? at (east c(ass
3 by design. Schottky case mounted rectifiers may be designated class 3, upon successful
.OTp[e:iOfl of a 2 an%mre reverse energy test. Other schottky rectifier package configurations WY
be designated class 3, lf they pass a reverse energy test .hich has been demonstrated to correlate
with c(ass 3 classification.
c. AIL zeners, (voltage reference ard voltage regulators) ard transienr suppressors are considered
non-sensitive by design.
E.4.2 .1.1 ~. ESDS Ctassifi carion testing shal[ hd.ne inaccord.nce with methcd 1020 of MI L- STD-750
ard the applicable associated specification (see 3.10.3.1). Devices shall be handled in accordance uith the
man. facturer, s in-house controt documentation. Devices that are classified c(ass 3 or nonsensitive, are not
required to be hard Led as ESD sensitive, and manufacturer’s in-house controt documentation p(an is not
requir~. Handling shall begin at lead clip or ire bord (e. g., for packages which do not have a lead
shorting bar or do not have ieads shorted together). Guidance for device handling is available in the
E! A-625 docunent.
E.4.2.2 Qualification h e~ O.alif ication of a struct.raliy identical device or series of

devices frcm the same or different as&ci ated specifications my be ex.tended from a previously fully
qual if id device provided the fottouing in fornwtio” and data are su@i@d to the qua[ifyi”g ~ctivity:
a. Previously qua(if ied device type, associated specification nurber, and q.alifi carion reference
mmber.
b. Design acd construction information on devices covered under different associated specifications.
c. SE@es of struct.rn(ly identical devices with certification that these sanples are structurally
identical to the previously qualified device.
d. Group A variab(es data on . sample plan of each structurally identical device type except for
series of devices which shell be the Sampte plan of the highest and the (owest volt.sge types or as
the qualifying activity requires, or as specified in associated specifications covering groups of
devices. Test saup(es of selected devices in E group or portion of a group sha(t be frcm the same
inspection lot.
e. Results .& va~iables dara for each st~ucturalty idenricai device on all group B and C electrical
tests not specified in group A, lncludlna tests at t~rature eKtremes.
I f. All resu(ts end variables date on group B ard C tests as follows:
(1) Data on any tesrs not required by the qualified device.
(2) Data that is the result of tests Ferformed at stress levels greater than chose required for
the qualified device.
(3) Data for any tests requiring more exacting (imits rhan those found for the qualified device.
9. Items E.4.2.3d through E.4.2.3f shall not be required if the qualifying activity can be assured
that the previously fully qualifieti device at least meets aLL of the c.rdit ions and requirements
for the propased structurally identicel device type, except for device type marking.
E.4.3 En& FQint electrical measurements shall be measured ad recorded as applicable

(e. g., if delta’s are required) startin9 and after ccmpier ion of .11 specified tests in the subgroups of
groups B, C, m-d D. Pre-test end point failwes sha(l be rep(aced by’ acceptable devices.
E.4.4 tictionof sfmks All smp(es shail be .andwnLy selectd frmn the q.alificatio” inspection
lot. sample se(ect ion for gr&p D testing shall be in accordance uith table VIII ad sha(l be frcm each
wafer or fran each inspection lot, as appropriate.
E.4,5 ~. The manufacturers nmnagentent representative may, at his option, mark

or authorize the marking of each sample to be subjected to q.alific~t ion testing i“ order to distinguish
these devices fr.mn those not intended for qualification im.pecti.a”.
63
MI L- PRF-19500K
APPENDIX E
E.I..6 ~. The (ot frun which rhe qualification saw[es are selected may be offered for delivery
under contrect after qualification approva( has been granted provided screening and quality con fo.mence
requirements are satisfied.
E.5 SCREENING
E.5.1 All JANS, JANTXV, and JANTX Sefnicorductor devices (100 percent) shall have been
subjected r. wd passed. all the .Wlicab(e screening tests (as specified in tab(e Iv) in the sequence shown
and the applicable percent de fecrive a[ lowed (PDA) for the type of semiconductor and quality level (device
CIIJSS) specified. Devices which fai L any test criteria in the screening f(ow, shall be identified and
controlld .nti[ removal fran the tot. At the Option of the manufacturer, the rejects may continue
processing. The lot records shall identify the point of fai(ure and the actual PDA (as app(icab(el. Any
rejected devices shall be removed frcm the lot prior to shiprent. EKcept for JANS, the conditioning ard
screening tests performed as standard production tests need not be repeated when these are predesignated ard
acceptable to the Governrenr as being equa[ to or more severe than specified herein providd the relative
process conditioning sequence is rreinta ined. All tests, preconditioning and screening operations uhich uere
performed on the devices submitted for qualification inspections specified herein sha(t be performed on al(
devices subsequently suhnitte.a for. cls (see E.6. ). If a manufacturer e(ects to eliminate a(( or any
screening operation substituting either e process monitor or SPC procedures (uhen approved by the preparing
activity and qualifying activity), the rtenufacturer is on(y retieved of the responsibility of Frforming the
screen. The manufacturer still bears full liability for any failure that may result if these tests are
performed at a later tire. A manufacturers reliability program may be used in lieu of etl or any screening
step, when equivalent to or c.mpl iant uith E.6.1.1 end D.3.2 herein.
E.5.2 ~. Select4 e(ectrica( parameters shall be designated in the associated specification as interim
.rd m-d-point measurements for the 100 prcent burn-in of screen 12 of table IV. These parameters may also
be c~red to determine whether the change during tu.mn-in (delta) is indicative of a lor stability problem.
Ai( turn-in pre-conditioni.g failures (on additional turn-in added prior to screen 12) shaLt be counted as
part of the PDA in screen 13. when these Paramters are specified, the quantity in the (or uhich fail these
parameters or associated delta Iimirs shall nor exceed 10 percent. If the percenr defective exceeds 20
percent, the lot sha(l not be acceptable for any (eve( (see D.3.13 .3.1).
E.5.3 ~. The procedure for resting and screening for JANTXV arm JANTX devices
shall be in accordance with tab(es IV, V, V1b, VII, figure 3, and as specifid in the applicable associated
specification.
E.5.3.1 . JAN types may k processed and

marked as JANTX and JANTXV types by the origina( port manufacturer on his own qua[if ied prcduct provided the
following procedures are satisfied:
e. A(( devices ro be proposed for JANTXV processing (excepr clear glass JANTXV dicdes which shall b-?
subjected r. interml visual inspection before printing or marking) nust have been subjected to and
passed JANTXV interna( visual 100 percent screening prior to seat.
b. Groups A, B, srd C inspection shall have met the JANTX and JANTXV level requirements in accordance
with tables V, V1b, VII, figure 6, ard the .Wlicab(e associated specification.
c. Screening sha(l be conducted in accordance with table [v, figure 6, ad the app(icab(e associated
specification. Al! units failing these tests sha(( be removed from the lot and the quantity
removed shall be noted i“ the lot history.
d. A sanp(e of the screened devices shall be suhnitted to and pass the requirements of group A-1 ard
A-2 inspection (see table V) (see tabte Vlb, subgroup 1) wbsequent to the 100 percem screening
(of the lot or separete portions thereof) as specified in E.5.3.lc, as show” on figure 6.
E.5.3.2 Alternate methods to variabtes

recording may be used to determine de(ta end poim requirements of JANIX ard JANTXV bum-in provided the
qualifying activity has granted written awrov.s[. Uhen alternare methods to veriables recording are used to
determine delta end point requimrents, devices shall be separnted imo groups, each of uhich shalt hnve
maxina.m ad mi”inun limits on the variable para~ter( s). The difference i“ parameter Limits for any g?cup
shall not exceed the delta require!rents. for the ..miab{e parapet.? r(s).
64
141L- PRF-19500K
APPENDIX E
E.5.3.3 edures for walif~n i c1 where JAN 1s not covered bv the ~

Uhen the JAN quality leve~ is nor included in the associated specification, or at the option
of the manufn; turer, the alternate flow (see figure 4) WY be used for qualification and Cl. The lot used
shall te marked in ,ccordance with 3.10.1, except the o,JAW designating synb( shat( b+ replaced by rhe
(erter ,,4,,. Untess they are subnitted to the f(o. that the (OC uas sutmitted m, these se@es shait not be
shipped.
E.5.3.5 when (cad forming is specified for JANTX and JANTXV devices,
it sha(l be followed by n = 116, c = O fine and gross S.. ( tests, group A, suhwaup 2, ard excerna~ visua(
examination n = 45, c = O.
E.5.4 ~. The procedure for testing and screening of JANS devices sha(( be in accordance with
tnbles Iv, V, Via, VII, figure 5, end the applicable .ssoci P.t& specification.
E.5.4.1 ~ criteria The PDA for each inspection lot subnit ted to burn-in and interim
(post turn-in) electrica( para~ters s~all be 5 percent (for each turn-in) on all fai(ures in steps 11 acd
13a. Detta limits shatl be defined in the associated specification. Uhen the POA a$@ies to de~ta limits,
the delta parameter values measured after turn-in (100 percent screening tesr) shall be .Wred uith delta
parameter values measure-d prior to thnt hr.-in. Un(ess otherwise specified, lots which exceed the 5
percent PDA may be resubmitted one time only to the Lwn-in operation failed. The PDA sha(l b4 3 percent ..
the resubmitted lot to each faited burn-in (delta endFOint parameter faitures). [f the Ctiin’?d burn-in
PDA, s for the first submission exceeds 20 Frcent or either of the resubmitted burn-in exceed the 3 percent
PDA, the entire tot shall ix unacceptable for any qua(ity level.
65
MI L-PRF-19500K
APPENDIX E
I!4sPECTION LOTS]l
—,
FORMEO AFTER
FINAL ASSEMBLY l—
‘“c’
GRWP A
I
l—. I
Iw’iwwp’l
OPERATION GRWP B I DATA FOR ACCEPT:
(SEALING) I I GRWP C I I OR REJECT I
1!
l—
I
I ALL SPECIFIED TABLE I I I I

I IV 100 PERCENT I LOT PROPOSED I I JAN PREPARAT1ON\
I SCREENS FOR JAMTX i— -1 FOR JANTXOR I I FOR DELIVERY I
IJANTXV AS APPLICABLE I I JANTXV TYPES [
~1
NOTES:
1. All products to k proposed for JANTXV processing Kust have been s.bjectea to ard passea JANTXV
internal visual 100 percent screening ar this step (except for c(ear glass JANTXV dicdes which
sha(( b? subjected to imerna( visua( inspection prior to painting and marking).
2. order of the tests shall be performed as specifieS in table Iv.
3. Group D impsctim may be performed at EI”Y poim follouing the prdlcrion process.
FIGURE 3. Order of Drosd!Jre diauram for JAN. JANTx and JANTXV device tW!!2S.
66
MI L- PRF-19500K
APPENOIX E
I
PRCOUCTION PRDCESS INSPECTION LOTS
1
REVIEW OF GRCUPS
1. RAW NATER IAL FORMED AFTER A, B, AND C DATA
2. FACTORY PROCESS FINAL ASSEMBLY -. FOR ACCEPT OR
3. INTERNAL VISUAL AS J REJECT OF
SPECIFIED IN THE INSPECTION LOT
ASSOCIATED
SPECIFICATION (NOTE 1) I I I
I
I
1 I
7“ I
ALL SPECIFIED TABLE DEvICES PROPOSED JAN STDCKING
IV 100 PERCENT FOR JANTX/TXV — OR JANO
SCREENS FOR JANTX ASSURANCE TYPES (NOTE 4) I
JANTxV AS APPLICABLE MUST MAINTAIN 1 1
(NOTES 2 AND 7) ORIGINAL LOT
I 1DENTIT% AND
DATE CLIIE
—
NOTES:
1. A(( prcduct proposed for JANTXV processing rust have t-se. subjected r. and passed JANTXV
interna( visual 100 percent screening in accordance ~ith table !1 herein at this step (eKcepr
for clear glass JANTXV diodes which shall te subjected to internal visua( prior to body psint
or mark).
2. The order of all screening tests sha(l be performed as specified in table IV.
3. 01 may be performed sirrultcmeou sly Hith A. Steam age is not requires for solderabiliry testing
at this step on(y.
4. JANO prcduct nust be screend and receive the appropriate Cl testing prior to shi~i.g (see
E.5.4 .3).
5. Parallel processing of JANTX/TXV material with the JAN inspection lot is a((oued.
6. If a JAN inspection lot is not processed in Paratlel with the materiaL desisneted for JANTK and
JANTxv, all group A, B, C, nrd D resting nust b per formal on a JANTX or JANTXV infection lot.
7. Groups A, B, C, and D testing for lot acceptance may be initiated immediately prior to screen 1
or between screens 11 nrd 12.
FIGURE 4. order of Dr~!am for JAN. JANTX. device -.
67
MiL-PRF-19SOOK
APPE!4DIX E
PRCOUCTION PROCESS
1. RAW MATERIAL INTERNAL VISUAL
2. FACTORY PROCESSING 1NSPECTION (PRE-CAP)
3. PROCESS CONTROLS 100 PERCENT
4. WAFER LOT ACCEPTANCE
I
I
l–
LOTS PROPOSED FOR LDTS FoRMED AFTER
JANS TYPES FINAL ASSEMSLY
OPERATION (SEALING)
1. 100 PERCENT SCREENING C! TESTS (SEE NOTE)

TESTS AS SPECIFIED IN
TASLE IV GRCUP A
2. LOT REJECTION CRITERIA GRWP S
BASED DN REJECTS GRWP C
FRCU BURN-IN TEST GRWP D
(PDA)
3. OTHER TESTS AS
SPECIFIED IN ASSOCIATEO
SPECIFICAT!ON
k
JANS PREP&RATlON
FDR DELIVERY l– REVIEU OF GRCUP
A, B, C ANO D
DATA FOR LOTS
ACCEPT OR REJECT
NDTEs:
1. Group D testing may be Frformd at any poinr fo([ouing the production process (see
E.6.1.1 O).
2. Groups B, C, and D testing for (ot acceptance may be initi ared immediately prior to
screen 15.
FIGURE 5. !2cder of orocedurediaaram for JANS.
6a
MIL-PRF-19500K
APPENDIX E
E.5.6.2 WJ.11 teSt for JANSde vices. The inspection lot (or sub(ots) shall be submitted to 100 percent
PIND testing a maxinun of five times in accordance uirh methcd 2052 of UIL-STD -750, test condition A. PIND
prescreening shail not t-e per formal. The tot may be accepted on any of the five rum if the percentage of
defective devices is (ess than one percent (zero failures a((owed for lots of less than 50 devices). All
defective devices she[l be removed after each run. Lots which do not meet the one percent PDA on the fifth
run, or exceed 25 percent defective cumulative, shall be rejected ard resubmission is not a((oued. These
parts sh.s(( not be shi@ as any other qua(ity (evet. When calculating ni.rrbers of allowed fai(ures using
percentages, fractiona( values shall be increased to the next whole integer.
JANS PIND FL DNCHART
I I
PERFORM PIND
TESTINL ON
lNSPEC1l DN LD1
I ,
1-
FRO. THE LO1

NO
E.5. G.3 i ma for JAN?+. Uh.m lend forming is specified for JANS devices, it shall b-e followed by
100 pert.mt fine end gross Se, ( tests, group A, s.tgro.p 2, .srd externa( visual examination.
E.5.6.4 Burn-in W.&et verification for JAW The electrical continuity becueen each device and the
socket shell be verified prior to initiating I&-i. (see MI L- STD-750 for details).
E.5.5 failure ~n for JAN-S. Fai(ures that O.CW durimq JANS screening sha(( te evs[ualed to
determine if failure made is the result of n (etent (time dependent) defect, workmanship, or design
weakmss. This in fom!ati. m shall be retaimd and prese”t~ to the q..s(ifyi.g activity, when requested, for
revieu end determination if a fei(ure trend is developing that needs corrective action.
69
MI L- PRF-19500K
APPENDIX E
E.6 CONFORMANCE INSPECTION (Cl)
E.6.1 SL c1 shall be conducted in accordance with the requirements of groups A, B, and C for the
specified quaiity level as uetl as group D to the applicable RHA [evei. If a lot is uithdrawn in a state of
failing to meet conformance requirements and is not resubmitted, it sha(( be considered e fai(ed lot and
reported as such. Each lot sha[l be subjected to group A ard E inspection. Successful cqlet ion of group
C c.mforrence for a g~ven quality level sh~(( satisfy the group C requir.arents for the rested Level or any
quali~y level ana devices represented by the structura ((y identicel group. The grouping of structur.a ((y
Identlce( devices shall be .s agreed between the manufacturer and the qua(ifylng acttvlty. JAW devices
shall not be used to represent the other qua(ity (eve Is. If a manufacturer elects to eliminate .9[( or any
c1 step substituting either a process monitor or SPC procedures (uhe. approved by the preparing activ icy and
qualifYin9 activity), the ~nufacturer is only ~elieved of the responsibility of ~rforming the c1 (see
4.51. The manufacturer Stl([ bears fu[( Liabll, ty for any failure that may result if these tests are
performed at a (rater time. A rrenufacturers re(iabi(ity program may be used in tie. of all or any Cl when
equivalent to or c~liant with E. b.l.l and 0.3.2 herein.
E.6.1.1 ~tvand~bi Litv ~ with the

aWroval of the qualifying activity ard preparing ectivity, this program or an equivelenr program” may b?
used as an alternative to the conformance inspection.
E.6.1.2 s of an o~[ltv oroqram [ c~s i nwrovement Droqraml. A ongoing

reliability program is designed to create o closed (OOP feedback sysrem which wi[t generate continuous
improvement. Existing production lines are constantly sanpled and tested. This proves the critical
incer feces and manufacturing process are stable and repeatable, .s uell as providing a mechanism for
failures to be evaluated ard the process improve-d. The ongoing reliability program shall inc[ude, as a
mininun, the following:
a. Program wil L formalize the routine reliability testing .& tie fni(ures to a specific manufacturing
process.
b. Progrem will integrate FMEA with reliability surveillance.
c. Effort ui[( restructure surveillance program by O,root technology es,,, rather than by individua( part
ntmixrs.
d. All ongoing reliability testing ui(( continue routi.e (y.
e. Large sanptes witi be tested weekly in key envirort’nental test, i.e., HTRB, Solder Dip, and Therma(
Shock.
f. Failures ui(l be review& and tracked to a specific manufacturing process.
9. The ongoing reliability program ui(( record type of failure, manufacturing process, and root causel
corrective action.
E.6.1.3 A reliability progrnm is a qualification of the design

and the rrenufacturing process, more camwn[y referred to as Prcduct Design Qualification (PDQ), and Prcduct
M.mufacturi”g LWa(ifi carion (PMQ). These tests are usual(y per fonmsd as part of the O.a[ity design process
for detenni”imd the bmg term re(iabi(ity of the design and the manufacturing process. once psrforrre-d and
acceptable these tests are nor repeard unless a major design change is rrede which would require a neu PDQ
end PM4 reliability program.
a. 3mart tesring: ?+mid unnecessary or redundant testing. Use variable frequency of tests versus
fixed frequency of performance tesrs.
b. Prcd”ct failwes: Do step stress testing in order to g.mer. ste foi(ures, not prcd”.e the absence of
fai lures.
c. Failwe analysis: Once fei(ure occurs, perform failure analysis (if needed) to ascertain the
mechanisms ad failure rates or time to uearour.
d. Engineering evaluations: Evaluate to constantly inprove rhe final prcducr quality ad reliability.
e. Failure mechanism idemificati.m: Identify and focus on fai(we ntecha”isms typical for the
technology (assd(y, packages, and die-level failwes).
70
MI L- PRF-19500K
APPENDIX E
f. Publish res. (ts: Open UP raw and sumrnry data to custwners engaged in correlation testing with
custaners and provide other custcmers with exchange of data bases.
g. Data base: Bui(d a data base over time and track tong term and short term reiiabi(ity information.
Use data base as a foundation for system.
h. Feedback toop: Results frcm Statistical Process control (SPC) data sha(l be used to chose
particular device tws, sawle sizes, ard frequencies for destructive stress resting, and feiture
analysis resutts sha Ll he used to correct or i~rove semiconductor processes or to redesign in
or&r to design out fai Lure mechanisms.
E.6. 1.3.1
a. Defining a device family: [n order to provide acceptable coverage &ring representative

reliability assessment testing, all devices must first be grouped into their respective device
fami[i es. Oevice fami(ies may bs setected based on characteristics frcin the following three
categories:
(1) Package grouping b.wed on: Therrrel resistance, package pro fi(e, volume, carpler, ity of package
construction, and ntir of pins or wire bonds.
(2) Overal( c.mstruct ion grouping based on: Die attach methcd, interconnect construction
techniques (e.9., sprin9 contact) or category of bond.
(3) Die grouping based on: Overat( dimensions, aspect ratio, thickness, ntmber of bords, voltage,
frequency, or power rating.
Uhen selecting device femi(i es, consideration must also be given to differences due to the use of
different production facilities, variations in fabrication procedures, ad differing design
techniques. Differences or variations which maY in ftuence device reliability imply that a separate
device family should tw established. Ignoring these factors in creating device famikies must ke
justifid to the qualifying activity.
b. Identification of worst case devices: Once device families have teen estab(ishe.d, worst case
device types frun uithin those families must be selecred .hich will provide coverage for the
re~iabikity assessment of all other devices within the fnmily. Uorst case parameters (or
ctiinet ions of parameters) frcan uithin the three categories listed above (i. e., packoging, overall
construction, and die) must be identified in order to estab Lish which devices are worst case.
c. Ratiana(e for device groups and uorst case devices: A \isting of device famiti es, worst case
devices uithin each family, and the rationate for choosing the family groupings and worst case
devices rust be submitted as part of the re(iabi(ity assessrrent program p(an to the qualifying
activity for approva(. QPL-19500 shal( indicate which devices are tested in an ongoing reliability
program.
d. Meteria( nnd process characterization: Mareria(s arc processes shall bs characterized to identify,
optimize, ard contro( the characteristics which lead to tong (ife in harsh mititary enviromnents.
Manufacturers will be npproved based on this awroach.
e. SPC program: An SPC program that contains 8(1 of the crirical elermmts of EIA-557 oust have been
i@eme” ted. The program must include tut is not limited to the fol Lotiing e[ements: Management,
SPC organization, SPC program p(an details, trainin9, self-audits, maintenance, calibration,
incoming rater iaks, services, envirorm-enmd controls, faikwe analysis, test, fabrication,
assemtdy, and test critical node evaluation.
f. Ifei iability assessment progrem: A reliability assessment program she(( be established uhich
considers the following stresses (if they .WLY for the specific device type): High Cmperature
reverse bias, high temperature gate stress, temperature cyc(ing, power cycling, temperature .ti
humidity, altenmting current, high t~rature reverse bias, operating life, ard mechanical shock
or vibration.
9. Experiment: Determine activation energies for all predc.nim”t faiiur-e ntschanisms
71
MI L- PRF-19500K
APPENDIX E
E.6.1.6 2LWOVIJt or.c~ure 4 criteria.
a. The program ptan nust also be tailorec to focus on relevant failure mcdes and mechanisms intrinsic
to the family chosen above.
b. The qualifying activity wi(( perform a quality and reliability review. The qualifying activity may
revieu the manufacturers SPC program to assure that the outgoing defect (evels are low. The
manufacturer rust prove that the devices are rob.ist ard have a capability ue(( beyomd the norma( Cl
testing levels. The ma.ufacture~ shall show that the devices are capable of meering Cl testing
9re~ter that thOse nOrwLtY r~ul@ (e. g., if 100 t~ra~ure cyc(es are normally r~uired, the
devices wsr be capable of surviving 500 cyc(es without fa, lure, etc.). NO reliability problams
sha(t exist for the device famity.
c. The ongoing reliability assurance program plan and its resu(ts shall be avai Lable from the
manufacturer for review by other participating Government agencies and to interested irdustry
users
d. A joint ewit of the rran.facturer shall be performed. Participating industry users and other
Government agencies may attend.
E.6.1. 5 ~. Lots which fai[ subgroup requirnrents of group A, B, or C may be resubmitted in

accordance with the provisions of E.3.6 (E.3.6.3 for group D). However, if the lot is nor resuhn ittea or
fai(s resubmission, the tot shai( not k shipped aml the JAN marking shall be rerraved within 30 day5.
Sanptes fr.an subsequent iots of the device types in the structurally identical device grouping represented
by a fai L~ 9r0uP C i.spect i?. in the case of 9rouP C fai(.res, shal( the. be subjected to all the tests in
the subgroup in which the fal(ure occurred, on a lot-by-lot basis unti[ three successive lots pass the
fei led subgroup. The testing my then return to periodic. testing. A device type which fails a group C
impect ion shall not be accepted until the device type which fai(ed, successfully cm!pieres the fai(ed group
C subgroup(s). Other device types f~c+n the same quaLifiKi group represented by the fa~(ed device type rrey
t-e accepted provided group C inspection requirements have been satisfied for those devtce types. A device
tm which fails a 9r?uP O insW.t iOn MY nOt be certifi~ .S an RHA device at the (eel tested, M may be
used as a .on-RHA devtce or certified at another (lower) Ieve( if the device meets the (ouer Ieve(
requirements.
E.6. 1.7 WOUDB i~. Group B inspection shall b performed on each inspection iot. Group B shall
be in accordance iiith table Vla or Vlb as ap@icable, and the associated specification. Testing of one
device type sub(ot in any subgroup shait be considered as ccmplying with rhe requirements for that subgroup
for all types in the lot. Different device types may be used for e~ch subgroup. All inspect i.ms except for
(ife tests sha(( be appli Ed only to Canp(et.?d and fully marked devices (see E:5.4 .3) frm lots which have
been subjected ro ard passed the group A requirements. Uhe” the final lead finish is sn(der, or any p(ati”g
prone to oxidation at high temperature, the Sarples for life tests (groups B3 and 86 for JX arui JV, and
groups B4 ard B5 for JANS) may be Ful[ed prior to the application of fina( (cad finish. Tests uithin a
subgroup shalt be performed in the order s~cif ied. Uhen the lead finish is tin p(ared the test szmples may
be c(eaned prior to the electrical eti-paint testing. An eva(. ation sha~~ be performed o“ aLl failures to
determine if the failure made is the resu(t of a latent (time dependent) defect, workmanship, or design
weakness. APPrOPr iare corrective action she(l be Performed as a result of the evacuation. Al( tesrs within
a subgroup shall be performed i“ the order Spxifid except tab(e Via, subgroup 2, and table V!b,
subgroup 1.
E.6. 1.7.1 NO tots ?.ha(( be shipped prior to corpletio” of

group B uithout the approval of the qualifying activity.
72
MI L-PRF-19500K
APPENDIX E
E.6. 7.8 Grouo C ~. Group C inspection shall bc in accordance with rable VII ard shall inc(ude
those rests specified which are performed Fricdica\\y at 1 year inrervats on at Least one device t~ frcm
each structurally identical device grouping (frun the same or different associated s~cif icati on) in which
the manufacturer has qualified device types. This inspection shall he applied Onty to cmleted ard ful Ly
marked devices (see E:5.4 .3) fran lots which have been subjected to and passed the group A requirements.
when the final Lead finish is solder, the life test subgroup may be FU((ed prior to the a@icat ion of fina(
lead finish. A(L tests within a subgroup sha(( be per formtzd in the order s~cif ied. Uhen the (cad finish
is tin plated, the test sanples maY be cleaned prior to the electrical end-pint testing. An evaluation
sha(( be per forms-d on a(( feitures to determine if the faiture mcde is the result of a tatent (time
dependent) defect, wo@nnship, or design weakness. Appropriate corrective action shall b performed as a
result of the evn(uatl on. Lots with an unscreenab(e failure tie shall be rejected. Unless 8(( devices
intended for manufacturing during that psriod wilt receive as a mininum the same screening, devices uhich
have received PIND screening in accordance with E.5 may not be used co qmLify the ne,r group C inspection
perids.
E.6. 1.8.1 $rouo c sa~le ~. Sa@eS fOr sub9rouP5 in group C shak [ t-e chosen at random f ran the
first lot suhnit ted for Cl during the specified grc.W c inspection inter’d. Testing of one device type for
each subgroup shal 1 be considered es canp(ying uith the mquirerrents for that subgroup for al ( types
represented (see E.6. 1.8) fran the same 1 inc. A different device type(s) shal 1 be tested at each successive
inspection interval unti ( .s( t structural IY ident icnl device types quai if iefl on the same or different
associated specificati.ms frun the sam qua~ifi e-d line have teen tested, except power MOSFETS grouped by the
same voltage es descr ited in 6.3.2.4. Uhen none of the inspection lots passing group A of the first lor
submitted contain rhe device type which is due to be tested, the wmples for inspection shal 1 be chosen frmn
those types in the inspection (ots being tested which hnve nor been use-d for the Iongesr time for group C
impecti cm. The date code of the tot establishes (begins) the one year group C inrerval. Groups A and B
she( 1 also be canp(eted on the group C inspection (ot date cede prior to the coverage being val id.
E.6.1 .8.2 orior to arouo c QmQLQQO. No lots sha(( be shim prior to cmqILet iOn of
group C without the appr.va( of rhe qual ifying activity.
E.6.1.9 Grouo D )n~. Group o inswct ion sh.al I t-? performed in accordance with table VI 11 and the
requirements of the associatd specification. A device type which fai 1s e group 0 inspection may not be
certified as !3. RHA device at the level rest, tmt may be used as a non RMA device or terrified at another
((we.) (eve{ if the device meets the lower level requirements. Ar the manufacturer, s option, group D
samples need not be subjected to .( ( the screening rests, tin shal 1 be essemb(ed in i ts qua( if ied package or
in any qua[ i f $ed package that the manufacturer has data to correlate the ~rf ormance to the designated
package and as a minir8_mI, pass group A, subgroup 2 prior to irradiation. C! is nor required for a s~cial
group of moderately herd Wmicorducror devices for JANTXV, levels M ard D. These devices are so nored in
OPL-19500. Devices which have received PIND scree”i”g i“ accordance with E.5, may not be considered as
candidates for this inspection m(ess the entire inspection iot has been sub; ect~ to the same screening.
E.6.1.1O LiFOuD E i~. Group E is a workmanship, ruggedness, erd critical interface verification
inspection. Group E testing neea only be performed uhen the tesring requiranents have been added to the
associated specification. The resukts of group E testing shall be submitted to the qualifying activity (bv
e( ( QPL manufacturers prior to the im’plmentation of the associated specification or prior to shipnent of
product, as ew( i cabLe). Product redesigns may’ be subjected to group E testing as required by the
qualifying ectivity.
E.6.1.1O.1 Group E shal 1 E-e per formal in accordance with tab(e IX herein
and the ass.aci atea specification. All tests uithin a subgroup shall be psrfonred in the order s~cif ied.
An e.a(uaticm shal 1 be Frformd o“ al 1 fai lures to determine if the fai (We omde is the resu(t of a Latent
(time dependent) defect, workmanship: or design weakness. Appropriate corrective act ion sha( ( be p,, fomed
and approved by the qua( ifying act iv, ty.
E.6.1.1O.2 Msmuf acturers may use i “ternsak design verification or

ongoing ret iabi I ity assessment programs in ( ieu of group E, subgroups 1 ard 2 on(y, provided this testing is
equivalent r. or more stressful than group E and is performed using the same design ard mnstrucrim on f i [e
at the qml i fying activity. This altermare testing must be ewrc.ved by the preparing activity ard the
qualifying .xcivity.
73
MI L- PRF-19500K
APPEND 1X E
E.6.1 .11 firO.D B. c. D. and E d COti. Post test end points .Pecifi edin the associated specification
sha~~ be measu~~ for each device of ~he sanple after cc@er ion of al 1 speclfid tests in the subgroups.
Except as speclf led or otherulse .eqUJ red, al 1 1 i fe test (such as opsrat ion, storage, blocklng) end point
measurements sha( ( be performed with,. 96 hours after sample units have been subject~ r. nrd remwved frmn
required tests. Al( other erd-point test measurements sha Ll be made within 168 hours, or as specified.
Additional rreasurerents may be rrede at the discretion of the manufacturer.
E.6.1.12 -tfo. of o&a9in9. The SWTP1 ing and inspect ion of the preservat ion, packing, container
.?rd unit package marking sh.al I be in accordance with rhe acqui sit ion docurent.
TABLE !I ~. u
I I
RHA Total ionizing Neutron
Designation dose flue ce
(RAD(S i)) U (N/C 2 ) U
M 3 x 103
D 1 x 1D4
5 x 104
k 1 x 105
F 3 x 105
G 6 x 1D5
H 1 x 106 +
U See 4.3.
~ Test in accordance with MI L- STD-750, methcd 1019.
s Test in accordance with MI L-STD- 750, method 1017. >.
Unless otherwise specified in the associat~ SFCI lcati on,
the mininun neutron ftuence shatt h 2 x 10 2 N/c .
TABLE 111. s to a Oua Llfled orodu ct.1/2/u4/i/wzf
Changes (see .mrdi x D) Tesring, MI L-STD- 750, (4(( Sarples

e(ectr icat par.areters as specified to be submitted
in associated specifications) C. qu?l~fying
Bet, vltv
3. Doping material source GRP A end c-6 deltas c-6 (2 samp( es)
Concentration (variables on(y uhen deltas are
Process technique required)
>. Die struct.relt.a~graphy seine as n c-6 (2 sarples)
:. Mask changes affecting die Variable GRP A, B-2, and c6, B-2 (Z samp( es)
size or active element if neu die area is smaller/larger
in the appl lcab(e package than
previously qualifiea
wafer diameter GRP A acd c-6 c-6 (2 samples)

Finnl die thickness GRP B-2 ard B-6 B-2 (2 sampies)
j. Passivar iOn/glassivat iOn cRP A and C-6 c-6 (2 sa!r@ es)

or die coating
Metal 1 izat ion changes. GRP A, B-2, B.4. and c-6 B-2 (2 samples)
Anything that effects
density for Schottkys
and cco’pait ion of (aye.*
f. Die attach methcd 0-2 and c-3 C-3 (2 samples)
See footnotes at end of table.
74
MI L- PRF-19500K
APPEND 1X E
TABLE III. ~ lfZfl/!t ti6/.Z-co.ri.u~.
Chmges (see appendix 0) Testing, MI L-sTD-7S0, (all SEml@es

electrical parameters as specified to b-s subnitrec
in .wsoci ated specifications) r. qualifying
activitv
]. Bord process B-4 and C-3 C-3 (2 san@es)
7. Bond wire material, doping 0-4 and C-3 c-3 (2 samples)

dimensions
i. Package or \ id structure B-1, B-2, ard C-3 C-3 (2 samples)
Package or 1 id materia( B-1, B-2, ard C-3 C-3 (2 saWles)
Package or t id dimension 0-1, B-2, and c-3 C-3 (2 samfd es)
j. Sea( ing technique B-1, B-2, and C-3 C-3 (2 samples)
<. Sea I i.9 envi romnent B-1, B-2, and C-3 c-3 (2 Wl@es)
1. Irrplementat ion of test Notify qualifying .ctivity (m.3y As required

nmthcds inv.aive test denmst ration)
n. Changes in ft.. chart Sam as i As requirEd
,. Fab move OU.31 ity conformance test report One test sanple
(strnrary data) sroup A (read and each subgroup
record) (B and C)
,. Assembly ~Ve same as L Same as L
>. Test faci 1 ity move Notify q.a(ifying activity As requirWJ
q. Scribe/die separation B-2 and C-3 B-2 (2 samp( es)
.. Qualification/C1 Notify qualifying activity As required

procedures
j/ Acceptable support i“g data my be subnitted to reduce or et irni”ate req”irec

testing.
~ Uhen vnriable data is required for n~(icab~e groups A PA C Cesti”g, darri
histograms providing acceptable paramerer data surmaries may be subnit ted in
place of variab( es.
s If changes involve more than one device type frcm rhe sane certified I ine,
cont,ct the qualifying activity to determine appropriate selection of device
type(s) to be setec ted for testing.
U The qualifying activity may add or reduce testing if warranted by associated
specification requira’nents or unique design or process circwtances after
notification of the manufacturer.
~ Al 1 groups and subgroups reference herein .swly to JANTX and JANTXV o.(Y.
Test Wquirnnenrs for Sanple submittals for design chmges to JANS leve(
qualified prcduct -re to be determined by the qualifying activity.
& Additiomsl testing and evacuation in accordame with group E to esrab( ish
cc.nf idence in the pr.opased change shal 1 be performed as required by the
qualifying activity (see E.6.1.1 O).
u New die design requires f“(l qualification.
75
MI L- QRF-1’?500K
APPENDIX E
TABLE IV.
Screen MI L- STD - Condition JANS JANTXV JANTX

750 requi rements requi rernents re.qui rement:
methcd
la. Die visua( 2073 Die form prior to 100 Uhen MIA
for diodes assnlb~y percent SP=cif ied
U
It., lntern~( visua( 100 100 lilt
(precap) percenr percent
inspect ion
For dicdes 2074
For PWERFETS 2069
For microwave 2070
transistors
For transistors 2D72
?. High temperature 1032 TSTG , +175-C opt i ona ( opt i 0.. I OPf i one [
life t = as specified
Nonoperating ( ife
(stabilization
bake)
!a. Temperature cycling 1051 NO due(( is required 100 100 100

at +25-C. Test p+.rcent percent percent
condition C, 0.
maxirmrn stor. ge
twrature, uhich -
ever is less,
20 CYC ( es,
t(extremes)
> 10 minutes.
Jb. surge (as s~cif ied) 11066 Condition B, as 100 100 100
2/ specified percent percent percent
SC. Th.?ro!a 1 response u As specified 100 100 100

(as specified) percent percent percenr
Transistors,
PWERFEIS 3161
Bipolar 3131
D i odes 3101
IGBT 3103
GaAs FET 31D4
k. Constant 2006 Y1 direction et 100 Opt ional Opt i ona (

accele rat ion 20,000 G mi” except percent
at 10,000 G mi. imm! excepr mt u U
for devices ui th required for
power rating of k ten met.allurgi -
u.stts at Tc = +25-C. Cally bond
The 1 minute ho(d dicdes
t i~ req. i rernent
See footnotes at end of table.
76
MI L- PRF-19500K
APPEND 1X E
TABLE IV. - Cent inued,
screen [L-STD Condition JAMS JANTXV JANTX

750 squi rement: e.qui rement! requi rement:
OQlbQd
5. PIND u ?052 :ondit ion A. 100

percent
se 50.4.2
6. Instabi Lity shock

test (.mial lead
diodes only) U
a. FIST 2081 100

percent
b. BIST 2002 100

percent
7. Hermetic seal u
a. Fine I 071 3nit for double plug ,pt ional 100 Z/ 100 Z/
iiodes. Test cordi - psrcent p-erce”t
tion G or H, ma$. irmm J.21
leak rate
= 5 x 10-8 atm Ccfs
w,cept 5 x IO-7 atm
:./s” for devices with
intermd( cavity
. 0.3 cc. Maxi- leak
rate . 5 x IO-6 atm
:c/s for cavities
5-40 cc.
b. Gross 100 u
mercent
100
8. Seriak.imt ion m 3.10.9. cercent
9. Interim elect rica( is specified. 100 or case w case

parameters percent ounwd Dunt ed
[Read and ectifiers ecrif iers
record) s Sceclfls ? Soe cified
10. High terrp?r~t.re

reverse bias
(HTRB)
.. For transistors I 039 lest credit ion A. 100 100 100

30 percent (mi”i nun) percent Fr.ent Prce.t
>f rated VCB
:bipo(ar), VGS(FET)
>, VOS(FET) , as
applicable.
See footnotes at end of tabte.
F7
MI L- PRF-19500K
APPEND 1X E
TABLE IV. - Cent inued
screen MI L-SID - Condition JANS JANTXV JANTX

750 requi rements mqui rements requi remnts
rethcd
o. Nigh teup?rature
reverse bias
(HTRB)
Cent inued
b. For Pouerfets 1042 Test condition B. 100 100 100

80 percent (mini-) percenr percent percent
of rated VGS.
c. For diodes and 1038 c. Test cordition A. 100 100 100

rectifiers Diodes (not required percent percent percent
for LEDs, C~Se IIGimtd
rectifiers ard zeners)
80 percent mininam
~%~~~di%p
95 - 100 percent of
VRW, Nhen half sine
condition is
soecified.
1. Interim elect rica( As specified but in- 100 percent 100 *rcent 100 percent
and de[ta eluding a[l de(ta (Measure a 1I (Measure al I (Measure al 1
parameters for parameters as e specified specifi~ specified
PDA (see 50.2) minirmm!. Uhen HTRB parmneters parameters parameters
for JJINTX ard is per forred ieakage wirhin 16 uithin 24 within 24
JANTXV and current shal ( be hours after hours after hours after
50.4.1 for JANS measured . . each remva( of mnlova I of rem.. L of
device before a“y .9Wlied applied app( i ed
other specified voltage in voltage in voltage in
parametric test is HTRB HTRB. HIRB.
made Record those Record those Record those
parameters parameters parameters
uhich have a which have a which have a
delta deLta de{ ta
limit .)( See limit .lcsee limit .](see
screen 13. ) screen 13. ) screen 13. )
2. Burn-in As specified. 100 100 100

percent per.enr Prce.x
e. For bipo{ar 1039 e. Test c.mditi. m B. 240 hours 160 hour?. 160 hours
transistors (minim) (mininrm) (mi.inu-rnl
b. For Powerfets 1042 b. Test c.mdirim A. 240 hours 160 hours Q/ 160 hours &f
(mi”inun) (minim-n) (mininam)
See footmtes at erd of table.
78
MI L- PRF-19500K
APPEND 1X E
TABLE IV. ~U r~ui r- - Continued.
Screen MI L- STD - COndit iOn JANS JANTXV JAMTX

730 requirements requi rements requi r.xrents
method
2. Burn-in Continued As specified. 100 100 100

percent percent percenr
c. For diodes, 1038 c. Test condition B. 240 hours v 96 hours 96 hours

zeners, and (mininun) (minimum) (miniirxin)
rectifiers
For case nwunt Cordit ion A, JANTX N/A 48 hours 48 hours

rectifiers and JANTXV only. (miniim.in) (minim-m)
Cordit ion B, for JANS 240 hours MIA N/A

(mini ntrn)
d. For thyristors lobo 240 hours 96 hours 96 hours

J9./ (minim) (minim.m) (mini nmin)
3. Final electrical As specified. 100 100 100

test (see 50. ard Wrcent percent percent
50.5)
a. Interim Interim Interim [mericn

electrical elect rica( electrical electrical
ard delta and delta and delta and delra
paramters parafreters parameters parameters
for PDA (See .3s a as a as a
50.2 or minim. mi”inwo. minimum.
50.4.1) (Read and (Read and (Read at-d
record .1 record. ) record. )
(See (see
E.5.3 .2.) E.5.3.2. )
b. Other electrical G,.w,D A , GrouP A , Gro”P A,

parmceters D subgroups 2 subgroup 2. subgroup 2.
ard 3.
4. Hermetic seal U 1071 (same as 7 above] w 100 opt i 0..31 u opt i ona ( D
a. Fine percenr
b. Gross
See footmtes et erd of teble.

141L- PRF-19500K
APPEND 1X E
TABLE IV. - Continued
screen MI L- STD- Cordit ion JANS JANTXV JANTX

no requirements requi rmmsnts requirements
m?thod
15. Radiogra@Iy 2076 w 100 N/A N/A

aercent
16. External visual 2071 1. be performed after 100 N/h N/A

examination mnp(ete marking and percent
pri Or to ~or
acceptance
1/ Visual insmct ion (method 2074) on c(ear s(ass diodes shai \ b? performed any time prior to screen 8.
% Shal I be P&formed any tinw before screen 13. Surge shal ( precede thermal response when borh tests
are performed. Surge ard thern!a( impedance are applicable only when specified in the screening table
of the associated specification.
U Constanr acceleration sha( 1 k performed on gold bocd devices.
~ PIND is mt applicable to nny device with external and interna( pressure contact5 (die to electrical
contacts) opricat coupled isolators, and doubie plug dicdes. PIND screening may be performed any time
after screen L when iqmsed by contract or pmchase order (see E.5).
v Omit BIST ad FIST rests for double plug or case-mounted dicdes. anit FIST test for temperature
cmpe.satd referenced diodes.
~ Non-t rar,sparent gtass encssed dcub(e P(U9 noncavi CY asi ai lead di cdes c.ni y may use method 2068 i n 1 i eu
of 1071.
u Fine and gross seal teak test for JANTX and JANTXV shal 1 be performed in either screen 7 or screen 14.
& Optiona( accelerated HTRB for PDUERFETS in accordance with m?thod 1042, cocdit ion A, sha(( be 48 hours
mi”irmrr at 1A . +17$-C mi”irnro. Initial use of this option is contingent upon subsequent cwlet ion
of a one tires 1,000 hour qua( if i cation in accordance with method 1042, ard as specified on group E of
the individua( associatd sm?cif icati on. cordit ion A to be sutmitt~ with the initia( .aua(if ication
report.
D For JANS o“lY, zener dicdes shal 1 be subjected to high tefperarure reverse bias at 80 - 85 psrcent of
ncminal V2 for Vz > 10 V. hit test for devices with VZ s 10 V. For JANS case Taunted rectifiers
credit ion k is required.
Jg./ For JANTx and JANTXV levels ful 1 wave-blocking test shal ( rep[ace pouer burn-in for 0[ ( thyristors.
u Tests previously performed 100 percent (i. e., surge, thermal impedance) need not be repeated in
screen 13.
u Hermetic seal screens for JANS may be per form$d in any order foiiowing final electrical test. Glass
dicdes shal 1 not be painted unti t after seal tests. Uhen hermetic seat testing i5 performed in screen
7 it does not have to be psrforred again in screen 14 for double p~ug diode construction.
~ The radiographic screen for JANS rrey be performed in any sequence after screen .S.
an
MI L- PRF-19500K
APPENDIX E
TABLE V Grow A I ns~,
I subgroups kN, JANTX, JANTXV

Samp(e plan ~
15 devices 45 devices
~.o ~.o
Visual and mechnnica( inspection
lUIL-STD-750. w 2071 I
SwL’wL2 (PPM-2) 16 devices

~.o
SJAUJU (PPM-2) 116 devices 2/$/

..0
Dc (static) tests at maxim.xn rated erd minirm.in rated u4f
W@IWrdt (PPM-2)
% 65 devices
45 devices ~.o
safe cperet ins area test (for pnuer transistors only): ~.o
a. Dc
b. CLa’r@d inductive
c. Unc(amped itiuctive
End-peint elect rica( nmasureirmr
22 devi .es
~.o
Surge current (for diodeslrectifiers on(y)
Ed-point elecrricnl measu.emmts
[email protected] Z 22 devices
C,o
selecred static and dymmic tests
U The specific parameters to be inc(uded for rests i“ each subgroup sha[ ( be as specified in the
aw1 icab(e nsso. iated specif icati.an. where no parameters have been specified in a particular subgroup
or test within a subgroup, no group A testing is requirei for that subgroup or test to satisfy group A
requirements. A single sanp(e may be usti for aL 1 subgroup resting. These tests are considered
nondestructive and devices may be shix.
2/ [f a device in the samp(e fails o“e or more test(s) in the subgroup(s) being san’p led, each device in
the (sub) L.at represented by rhe samp(.s may be screemd for the test(s) for which the sanple fai led.
An altermste temperature electrical screen necessary to remove the fcai lure mode may be used after a“
En, i”eer ino eve(u’at ion j. Derfc.rred. A second Saride shall be tested to the fai led Caramerer. ! f the
se&nd sa~~e fai 1s, the ?& wbgroup 100 percent” rescreen of the fai led subgro.p”s~al 1 be perf&ed
or the lot sha(i be rejected.
u For sm.all lot samp(ing p(an, n . 45.
4/ Al I devices required by the specified stunp(. s plan shal I k s.bjecred to subgroups 2, 3, and 4
canbined.
v All devices req. irsxi by the specified sanple plm shall k randanly se(ec ted fr.mn the devices
subjected to sutgroups 2, 3, and 4, am+ sha[t be subjected to subgr.mps 5, 6, arc 7 cmrbi”ed.
81
MI L-PRF-19500K
APPEND IX E
TABLE Via. !ii
Qualification small lot

1nspect ions MI L-STD - MI L-STD-750 ad large lot Cl ./c
750 corditic.n qua( i ty
method ccmformance
i mpect i 0.
-e DLan
uk!?Q!dl/ 22 devices 8 devices, c = O

C,o
hysical dimensions 2066 Dimensions in accordance
with case outline specified
i“ MI L- STD-1S35 ad
associat~ specifications.
Uk9LWL211 Separate sa~les may be used 15 (cads 6 leads, c = O

for each test. C=o
o(derabi 1 ity 2026 The saWLe plan applies to

the @r of (cads
inspected. A mini!mxn of 3
devices shal I be tested.
esistance to solvents 1022 Not required if marking is 15 devi c.. 15 devices, c = D

etched into the device. C,o
22 devices 6 devices, c . 0
..0
enperature cycling 1051 NO dwell is requirti at
[air-to-air) +25-C. Test condition C,
(except for axi at (100 cyc(es) or maxim
lead glass diodes) storage temsrnture uhich -
ever is less.
herrra I shock
(Liquid-to-liquid) 1056 25 cyctes, cordit ion A
(For e.r.ia\ lead
g(ass diodes on(y)
urge 40.$4 As specified.
ermetic seal 2/ 1071
a. Fine Nc.t required for doub(e p(ug

diodes. Tesr condition G or
H, maximum teak
rate = 5 x 10-8 atm ../s,
except 5 x 10-7 atm eels
for devices with interml
cavity > 0.3 cc. Haxim.rn
teak rate = 5 .x 10-6
atm eels for cavities 3-40 cc
b. Gross
(ecrricnl As specified.
measurnrent 5
See footnotes Et ecd of table,
82
MI L-PRF-19500K
APPENDIX E
TABLE Via. $ro.. B ~cti for JANS de vices Continued.
Oua(ifi carion small lot

1nspect i ..s MI L- STD - MIL-sTD-750 amd Large lot c1 .}.
750 cordition quality
methcd conformance
inspecti.m
-e Dta.
@L9.uLI - continu~
ecap- interna( visual 2075 Visual criterin in b devices

[design accordance with qual if id C.o
verification) 3/ design ard internat visual
precap criteria.
ond strength 2037 22 wires or

(wire or c(ip boded 11 devices
devices only) C.11
(whichever
requires the
smal ler number
of devices)
EM (hen specified) 4/ 2on 6 d.?vi ..s

C.o
ie shear (excluding 2017 The same n-r of devices

axial (ended used for bond strength
devices) will BISO be ussd for die
shear (mininun of six
die)
22 devices 8 devices, c . 0
..0
ntermittent operation 2,000 CYC ( es
life 1037 As specified.
10L2 Condition D.
Iectr ical Therma( response and other
mess.r.arents electrical measurements as
specified.
v~rOuD L 22 devices 12 devices, c = O

C.o
ccelerat~ steady- Bias conditions as
state operation 1 ife specified.
Eutectic die 1027 TJ = +275-C minim [for 9b

attached hours mi”irmm)
semiconductors
Soft solder die 1027 TJ = +225. C minim (for

attached pc.uer 168 hours minirm.m!)
semiconductors
(ectricn( As specifiec
measurmnsnrs
See footnotes et erd of table.
83
MI L- PRF - 19500K
APPENOIX E
TABLE V1=3. ons fOr JA ~ - Continued.
Qualification small lot

Impactions MI L- STD- MI L-STD -750 and (E!rsle Lot c1 n!c
730 cordition qua 1 i ty
methcd conformance
ins Wctio”
Salmt e o(an
ti~rOun 5 - cent i nued
$chottky diodes 1038 TJ = reted lJ maximm

(for 240 hours minim)
:iectrica L As specifiai
measurements
4cce[erated sready- 1042 Cordit ion A,

state reverse bias VDS = rated, 1A = +17Yc,
Fouer MOSFETS t = 120 hours end OS
specified
:Iecrr ical As specifid

measurements
\ccelereted steady- 1042 Conditi.m B,

state gate stress Vcs = reted, 1A = +l~C,
power 140SFETS r = 26 hours
:lectr ical As specifi~

m=aas.rnrents
3ond strength 2037 As specif id. Bord strength 20 wires 20 wires. c = O

(AL-Au die- sanples shal 1 have passed ,.0
interconnect c.”LY) accelerated steady-state
ocerat ion (ife.
22 devices 8 devices c = O
,.(J
rherma( resistance As specified.
Diodes 3101
Transistors 3131
(bipoLar)
Transistors 3161
(PWERFETS)
Thyristors 3181 I
1GB1 3103
GaAs FET 31OI,
I
u Electrical reject devices frcm the same inspection lot, may be used for all subgroups, when electrical
end-point rreasurme.ts are not required. Other non-catastrophic rejected devices ( i.e., PI NO, X-ray)
may be uti lized for all subgroups. For subgroups with end-point Ireasu,emn?nts, the devices shall be
screened to tab(e Iv through block 13.
u Non-transparent glass enc.&d double plug nanca.ity axial Lead diodes cmty may use method 206S in I ieu
of 1071.
s Verification of metallurgical bond as defined in appendix A in its entirety sha L[ be docune”ted.
U This test may be performed at my time prior to lot forn!ati.m.
W.
MI L- PRF-19500K
APPEND 1X E
TABLE Vlb. L@.. B i~ns f o r JAN. M.Y.IL ad J4NTX V de. ices,
1nspect i ons MIL-STO -750 Sarple Sm[( tot

plan quality
Hethcd Cm-dir ion conformance
inspecrio.
Illc
~u 15 leads 4 (cads
..0 ~.cl
oldernbi I ity 2026 Separate samples maY be used for each
test. The sample pban ap@ies to the
nunber of leads inspected. A miniiwn
of 3 devices sha( ( be tested.
esistance to solvents 1022 Not required i f marking is etched into

the device
~.o .,0
enperature CYC( ing 1051 No dwell is required at +25-C.
(eir- to-air) Test conditicm Cc or meximnn storage
except for axial lead temperature uhichever is less,
glass diode (45 cycles, incltiing screening)
herma( shock 1056 10 cyctes, c.anditi.m A

(Liquid-to-liquid)
(For axial lead glass
diodes on(y)
urge 4066 As specified.
ermetic seal 2/
. . Fine leak 1071 Not required for double pLug diode.

Test ccnditirm G or H, maxim \eak
rate . 5 x 10-S atm Ccls, except
5 x 10-7atm CCIS for devices with
interml cevity > 0.3 cc. maxi-
leak rate = 5 x 10-6 ntm CCIS for
cavities 3-40 cc
b. Gross teak
(ectr ical As specified.

measurements v
~4.f 65 devices 12 devices

C.o ..0
te.x+y-state-operat ion 1027 Bies conditions as specified, 303 hours
life or intermittent (minim.in)
operation life u 1037 2,000 cycles (mini-)
1042 Cord$ticm D, 2,000 cyc Les [mini-)
lectr ical msos.rmnts As specified.
ond strength (wire or 2037 The samp(e sha(( inc(ude a minirm.in of 11 wires 11 wires
clip k.mded devices 3 devices and shall include 8(1 uire ~.o ~.o
d2mM sizes.
See footnotes at erd of table.
85
MI L-PRF-19500K
APPEND IX E
TARLE Vlb. XV dswi~ - Continued.
Inspections MI L-STD-730 Sarple M([ lot

p(an .aLity
Method Condition on f.armance
nspect i 0.
I /.
UtQrOUD b U 1 device 1 device

..0 C.o
kcap internal visua( visual criteria in accordance uith
(design verification)
iEN (when specified) b devices b devices

. . 0 .=0
=
wb ro.o 5
I C.o .,0
lherma L resistance: As specified.
Thermal resistance may be performed
on group E frequency .henever 100
percent thermal inp?dance is
performed.
Oiodes ;101 or
6081
I
Tram. istors (bipo(er) 3131
Trrmsistors 3161
(PDUERFETS)
Thyristors
lGBT
-@As FET
u 12 de. i ces 12 devices

.,0 C.o
{igh-temperature (ife
(nonoperar i .9) *
I
As sQlcified.
E(ectrica( reject devices frun the same ins~ct ion lot, may be used for at ( subgroups when
electrical end-point measurements are not required. Other non-catastrophic rejected
devices (i. e., P! ND, X-ray) may be utilized for att subgroups. For subgroups with
end-point measurements, the devices sha( 1 be screened to table IV through b(.ck 13.
Non-transparent g(ass encased double plug noncavity axia( (cad dicdes only may use methcd 206S in
( ie. of 1071. This test may be psrf.anmed after electrical nte.suremmts.
Un(ess otherwise s,pecif ied, anit’ delta parameters I imits for low c.rrenr gain (hfe) and leakage
measurements inc(uded i“ eti-pc. int rreasurmnents.
If a given inspection lot undergoing group B inspection has been se(ected to satisfy group C
inspe.ticm requiremmts, the 3&0-ho.r or 2,000 cycie \ ife tests may bs conrinued on test to 1,000
h.xrs or 6,000 cyc(es, as aw1 icable, i“ order to satisfy the group c ( ife test requirements and
bond pul 1 may be performed after group C 1 ife test. End-poim measurements shal 1 be performed or
either group B, sutgro.p 3 (340 hours or 2,000 cycles, as appl icab(e) to satisfy group S tot
acceptance or group C, skgr.a.p 6 (1 ,000 hours or 6,000 cyc(es, as app L icable) to satisfy group S
and C lot acceptance. If group B, subgroup 3, is to be continued to group C, band strength test
my k W, f.,ti after g,OUp C, W&rWP 6.
lmermitte”t operation life sha(l te performed on alt case mounted devices.
Not required for pauer MOSFETS.
a6
UIL-PRF-19500K
kPPEND 1‘K E
TABLE VI 1. ,l”al , t“ levekl
Inspections MI L-STD -750 Sanple Sma(( (or

pLan qua ( i ty
Hethcd condition conf orma.ce
inspection
n/c
vkroun 1 15 devices 6 devices

c,.g C.o
hysical dimensions l/ 2066 D imens i Ons i n accordance with case
(NOt rtqUir& for JANS) o.t(ine specified in MI L-sTD -1835 and
associated specifications.
Vk.ouo 2 22 devices 6 devices

,.0 C.o
herrrsa 1 shock 1056 Test cordit ion A, excepr rest
(gLass strain) condition B for devices uith power
rating of > 10 watts at Tc = +25-C.
erminal strength 2036 As s~cified.
ernmtic seat 2/
a. Fine leak 1071 Not required for doub(e p(ug dicdes.

Test condition G or H, trexirmm, teak
rare = 5 x 10-8 atm eels, except
5 x 10”7 atm CCIS for devices uith
imernal cavity ~ 0.3 cc. Mnxi!mtn
leak rate = 5 K IO-6 atm ccl. for
cavities 3-40 cc.
b. Gross Leak
oisture resistance 1021 Cmit initial cmditi0nim3.
went, As mecified.
Not required for disc packages or 22 devices 6 devices

met~[[urgica [(y horded double ..0 C,o
plug devices, or stud peck.sged devices.
hock 2016 Nonoperating, 1500 g,s, 0.5 ms,

5 b{ows i“ each c.rienrati cm: x.1, 11,
end 21 (Y I O“LY for axial 910ss
diodes).
ibrat ion, variable 2056

f requen.y
instant acceleration s 2006 1 mimte rni”iimm i“ each orientation,

Xl, Yl, and 21 .st 20,000 gOs mi”inmm,
except at 10,000 g,. minim for
devices with power rating of
. 15 watts.
Tc = +2Yc.
lectr ical measur.emenrs As spscif ied.
See footmates at the erd of table.
87
MI L-PRF-19500K
APPEND Ix E
TABLE Vi I firo.o C ~“o.s (al L a.a~itv Le v ebl Continued.
Inspections MIL S10 750 Sanq71 i ng !aL( (or

p(an Jality
>nformance
xspect ion
s
15 devices $ devices
= C.Q C.Q
;a[t atmstiere 1041
(corros i on)
v I
lot F@ icab(e
UhrOuD 6 US/w Not required for disc packages. 22 devices 12 devices

..Q C.o
iteadwstate-ccer. t i on 1026 1,000 hours minim-an at rsxinur
(if& or operating junction temperature
[ntermittem operation 1037 6,000 cycles mi”inun
life or 1042 Corditi.ms D, 6,000 cycles mini-
3\ocking \ife lam
:lectrica( measurenmts As specified.
Electrical reject devices fran the sarre inspection lot, may be used for all subgroups uhen etecrrical
erd-point rneasurmenrs are not required. Other mm-c. stastro@ic rejected devices (i .e., PIND, X-ray)
may be uti(ized for all sutgro.ps. For subgroups uith end-point measurnr.?nts, the devices shal ( be
screened to table Iv through bkock 13.
Non-trmsparent glass encased double plug noncavity axial lead dicdes only may use methcd 2064
in 1 ieu of 1071. This test may be per forms-d after electrical measurements.
Not awl icable to any devices with externa( nrd inrerna( pressure contacts (die to elect rica(
contacts), optional coupled isolators, ard double plug diodes.
If a given inspection lot undergoing group B inspection has been se(ected to satisfy group C
ins~ct ion requirements, the 340-hour or 2,000 cyctes I ife tests may t-? continued on test to 1,000
hours or 6,000 cyc(es, as awl icable, in order to satisfy the group c life test requirements.
End-point measurements shai 1 be per formal on either table Via, group B, subwoup 4, or table VIb
group B, subgroup 3 (340 hours or 2,000 cyctes, as applicable) to satisfy group B (table Iva or table
IVb) tot acceptance or group C, subgroup 6 (1 ,000 hours or 6,OOO cycles, as aml i cable) r. satisfy
group B and C lot acceptance.
Intermittent operat ion ( if. shat t be per forred o“ al 1 case mounted devices.
The sarp(e size may be increased and the test time decreased so long as the devices are
stressed for a tota( of 22,000 device hours minim.in, ard the actual time or test is at least
340 hours.
aa
MI L-PRF-19500K
APPENO 1X E
TABLE vlll. ~. ~
MI L- STD- {50 \ u v
T
Test Want i ty, Quent i tyl
Wthcd Condition accept accepr Notes
number
I
wburo.o 1 2/
I
teutron irradiation 1017 +25-C I
a. Qualification (a) 11(0: !3) 11(0) g
b. Cl (b) 11(0; b) 11(0) U
ird-point electrical 4s specified in accordance

parameters dith associated
SIflcatlon. I
ubwouo 2 u
;teady-st.me totat 1019 +25. C
$
dose irradiation qaximm S.WIY vo[tage.
a. Qualification (al 4(0> a) 11(0) jy

2(o)
l(o)
b. C! (b) 4(0) b) 11(0) Z/
2(o)
l(o)
:nc-point electrical 4s specifid in accordance
parameters dith associated
uburo.o 5 w
I
~ower transistor 5678 +25-C 11(0) ii 11(0) 4/
elect rica( dose rate
test I
ind-peint elect rica( 4s specified in accordance

parameters
parts uses ror one Jbgroup test may not be used for other subgrot bat n be use-d
for higher levels the same subgroup. Untess testing is perform, withi the time
(imits of the test method, tota( exposure shall not be considered cumdl ati Group D
tests may be performed prior to device screening (see E.6.1.1 O).
2/ Uniess by design, naive neutron tests for MOS devices, bipo(ar eiements are an integral part of
the device function.
u 1“ accordance uith wafer lot. If one part fait,, seven additional parts may be added to the tesr
san’ple with no ndditiona( failures allowed, 18 devices, c . I.
u In accordance with inspection tot. If one part fails, seven additional parts may be added to the
test sample uith no additional faitures o[ [owed, 18 devices, c = 1.
V JANTXV dwices shait b+’ inspcted using either the JANTXV qumtity/eccept mrrber crirer ia as
spscif ied, or by using the JANS criteria on each wafer.
6/ For device types with greater chrm or equal to 4,000 die per wafer, selec tea frcan a randmn
location on che uafers.
Z/ 1. accordance uith inspection tot. If one part fails, 16 .additiona( part% may be added to the
test sample with no additional failures .I lowed, 27 devices, c . 1. For devices which require
more than one bias, the sanple size shall be 11(0) for each bias.
II For device types uith (ess than or equai to 4,000 die per wafer, selected frar a random (ocati.m
on the uafer.
w For device types uith [es. than . . equal to 500 die per wafer, se(ec ted fran a rmdcin iocat ion on
the uafers.
E!/ upset testing during qualificaticm on first c1 shalt be conducted when specified i“ purchase
order or contract. Uhen specified, the same devices may be tested in more than one subgroup.
89
MI L- PRF-19500K
APPENDIX E
TABLE Ix. WOWE ~ aua~itv (e@s) fOr .uaiifi~.
1nspect i 0.s tfIL-STD-750 Sarrpl ing

plan
~ Condition
Thermal shock or 1056 100 cycles or .9s specified As

Electrical measurements ;pcif ied
TmTQ.wature Cvc(ing 1051 iOO cyc{es minimum or as specified.
4s smcif ied.
Intermittent operating (ife 1037 As

Life test 1042 specified
Electrical measurements or
Steady-state operating life 1026
E(ectrica( measurements or
Blocking life 1048
As specified 4s specified. As
;pecif ied
Destructive *ysicat analysis 2101
2102
I
{s specified. 22
devices
Therua( resistance ..0
Transistors,
PWERFETS 3161
Bipolar 3131
Oiodes 3101
or 4081
lGBT 3103
_GW.S FET 3104
Wbr..o 5 !s specified. 15
devices
Bercit?etric pressure (reduced) 1001 ..0
(required on(y on all devices with
rated VO( taae > 200 VI
TABLE X. ante for JANS devices.
Uafec hat acceptance (see E.3.2 .3) 1. SEM photographs [when applicable)
Screening (see E.5. ) 2. Elect rica( data
3. Radiogr@Is
4. Screenim data
Oua(ity Co” fom”ce [see E.6. ) 5. Electrical data
6. SEH ~otogrnphs (when appli cab(e)
7. Bond pull [irnits (when .pplicab(e
a. Lot rejection report
9. c1 data (aro.os h. B. c. and o)
90
MI L- PRF-19500K
APPENDIX F
CERTIF1 CATION REQUIREMENTS FOR RADIATION HARDNESS

ASSURED SEMICONDUCTOR DEVICES
F.1 SCOPE
F.1.l -. This amndix presents therequir~nts for tine certification of radiati.m hardness
assured (RHA) semiconductor devices. Ccmpilan.e with this ap+wdix is not matxktory. However,
mmufecturers mst demonstrate to the qual!fylw activity a system rhat achieves at Least the same level of
q..9(itY aS could be achieve-d by c~lying uith this appendix.
F.2 APPLIcABLE DOCUMENT. This section is not applicable to this appendix.
F.Z.1 ~. The docurents iisted i“ rhis section are specified in sections F.3 end F.4 of this
specification. This section does not inc(ude docunents cited in other secrions of this s,cecifi carion or
rec.annmded for additiona( information or as exanp [es. Uhi(e every effort has ken made to ensure the
CCOIpleteneSS Of this list, docunent users are cautioned that they wst meet all specified requirerme”ts
docwnents cited in sections F.3 ord F.4 of this specification, whether or not rhey are listed.
F.z.z ~.
F.2.2.1 ~. The following specifications, st.mdards, and hardt-aoks

form a part of this docunent to the extent Specifid herein. Uniess otherwise specified, the issues of
these docents are those listed in the issue of the Department of Oefense Index of Specifications ard
Standards (DWISS) and su~lcrnent thereto, cite-d in the solicitation (see 6.1).
HANOBmKS
DEPARTMENT OF DEFENSE
MI L- HD8K-279 - Tota( Dose Hardness Assurance Guidelines for Semiconductor Devices.

MI L-HDBK-2S0 - Neutron Radiation Hardness Assurance Guidelines for Semiconductor Devices
ard Mircrcircu its.
(Untess otherwise indicated, copies of the above specifications, standards, end hatibooks are avaiiabie
from the standardization DocIxTent order Desk, 700 Robbins Avenue, Bui(di”g 4D, Philadel~in, PA 19111 -5094.)
F.2.3 9rder of nre~. 1. the event of a conflict between the text of this docimmt ard rhe
references cited herein (except for related associated specifications, specification sheets), the text of
this docent takes precedence. Nothing in this docunmt, however, supersedes .gpplicab[e (BUS and
regulations unless B specific exenpt ion has been obtained.
F.3 RADIATION HARDNESS PROGRAM
F.3,1 ~. The manufacturer shall establish, inp[.sment, and maintain a RHA assurance program.
The program sha(( d.manstrate and assure that des<gn, manufacture, inspection, and testing of semiconductor
devices are adequate to assure c.a-pliance with stm.lard, reference docunents, and the associated
Specification for RHA devices. If radiation testing is conducted outside of the rrmufecturer, s f,ci[ity, it
shall be the respensibiliry of the n!anuf,acturer to assure that radiation testing and the associated
docwms follow the requirnrents specified herein.
The RHA tasks inc[ude but are not (imited to:
a. D.?sigmati.a” of a RHA mamger or a project e.gimeer.
b. Devetopnent of a RHA program plan.
c. Development of the RHA design, processing, asshly, testing, end inspectim requiranents
d. Oevelopnent of RHA records.
F.3.2 ~. The rrsnufacturer shal( identify a person or c.?rsons whose reswmibility is to

icplement, control, arm coordinate all activities associated uirh the manufacturing of RHA semicokuctor
devices.
91
MI L- PRF-19500K
APPENDIX F
F.3.3 ~. The manufacturer she[l deve(op ard docunent a RHA program plan for semiconductor
devices which detaiis the tasks to be performed ard identifies responsibilities for assuring the tasks are
carried out. The program plan sha(( contain, as a minirmrn these items:
a. Definition of the responsibilities of the RHA management.
b. Identification of RHA critica L factors in design, layout, uafer processing, and assembty of the
semiconductor devices.
c. Preparation of manufacturing ftow charts showing e(ectr~ cat and radiation tesri.g, quakity
verification points, and all the docmnts associated ulth RHA.
d. Preparation of detailed radiation test procedures to meet the specified RHA requirements.
e. RHA records to be maimained.
F.3.4 Device design, processing,

assembly, tesring, and equipment related to RHA sha[[ inclt.de the fo((ouing iwnn as awlicabie.
a. Critical (ayo.r rules.
b. Circuit design factors.
c. Critical processes.
d. Assembly, p-sckaging, and handling critical to radiation hardness.
F.3.5 rot. tr~ instructions for RHA. The manufacturer

shall have in effect documented instructions covering as a minim.rr these arens:
a. Procedure for inp(emsntat ion and control of changes in device design, material, and processing
which may effect hardness of the device Brd for n!aki”g the information available to the certifying
activity.
b. RHA quality control ard verification operations relaw-d to procedures, equipment, action criteria,
records, ard frequency of use.
c. Treining and certification of personnel engaged in radiation testing.
d. The ca(ibretim and ntaintena”ce procedures of rediation facilities, dosimetry, ard equipnent used
in radiation testing.
e. Traceability of radiation dosinetric devices to Nationa( Institute of Standards and Technology

(NIST).
F.3.6 ~ test orocsdut.s. The nmnufacrurer shalt docunent a deroi(ed radiation rest procedure
which canp(ies wirh the radiation requirements in accordance with group D of MI L- PRF-19500, and in
accordance with associated specifications. Guidelines on radiation resting are provided in MI L- HDBK-279 arm
MI L-HDBK-280.
F.3.6.1 ~. Ionizing radiation test procedure shall be conducted in

accordame with test merhod 1019 of MI L- STO-750. The procedure sha(( imLude:
a. &smnb[y of the dice using the same procedure of die attach, wire bonding, and packaging method
specified for the certified line. The manufacturer sh.at( have avail ab(e procedures for qualifying
each packege type.
b. Conducting pre- and post-electrical test in accordance with the associated .Pecificeti.m using a
certified test program.
c. The manufacturer shall mainrnin a tab(e or graph shouing a monthly correction for the Cobalt-60
source decay .rd the radiation time required to achieve the specified total dose et the device
(maim. The Ca(ibratio” of the source should h? traceable co the NIsT.
92
MI L- PRF-19500K
APPENDIx F
F.3.6.2 Neutron irradiation rest procedure shall fottou the

requirements in test methcd 1017 of MI L-5 TD-tiO.
F.3.7 ~. The RHA records listed be{ow shall be maintained ard be submitted upon request for
the review by the certification a!dit team. Those records sha(( be retained for a mininun of five years
after performance of The inspection. As a minimum the foliouing records shall t-e maintained:
a. Records of rediat ion testing . . wafer nrd uafer lot for JANS or inspection lot for JANTX and
JANTXV. The records shall include the information on the rest procedure ard rest result5 as
specif<ed in test methods 1017 and 1019 of MI L- STD-750.
b. Records of failed devices shall identify the device type, the wafer and the wafer tot for JAW or
impect ion lot for JANTX and JANTXV, and the disposition of the parts. The failed devices sha[( be
data kogged and this log shail & rrede available to the edit team.
c. The manufacturer sha[l docunent his RHA contro( procedure. As a minirmm, group D for MI L- PRF-19500
past irradiation electrical parameter shall be read ard recorded every six rronths on representative
product fran the certified line.
d. Records shall document the initial design, mater ia(, processing, ard assembly and all changes
affec ring the hardness of the semiconductor device. Letters of approval by the qualifying activity
to the above changes shell be maintained.
e. Records shall cover the scheduled calibration interva( for each equipmsnt item, the dare. of
CC@eti O. Of actual catibrar ion and certification.
f. A traceability system shell be maintained such that RHA semiconductor devices can be traced to a
specific wafer for JANS and inspection lot for JANTX ard JANTXV, as a~li cable.
9. Records of personnel training.
F.3.8 ~. Therranufacturer shall show rhe procedure which .ss.res that only those parts fran the
uafer for JAW, or frun the insFect iOn tot for JANTX and JANTXV which passed the specified radi,t ion \eveL,
are rrerked by the Correspordi”g RHA letter designator.
F.4 RADIATION HARDNESS ASSURANCE PART MANAGER PROGRAM
F.k.l ~ mrt An RHAPM is a certified company (e. g.,

original eq”iprent manufacturer (OEH)I who establishes a relationship uirh a c.mrponent rmufacturer for the
sole pmpse of developing RHA seinicorductors ard has the responsibility to ensure cmpliancy of a[(
manufacturing and testing procedures. The certified cc+m$any sha(t L@ Listed on the QPL as the manufacturer
for the semiconductor device specified. The ,QHAPH is responsible for setting up a control system to ensure
011 requirements of the general md associm?d device specifications are met.
F.4 .1.1 wi(itv of osr~. To be e({gibie to quaiify a RHA part, a spcif icerim for the part
must exist. Associated Specification are controlled and modified by the preparing activity. Participants
shall be certified on the basis of . facilities survey.
F.h.l.l.l ~onof the ~device $cecificatiw. After the parts selection and prior to B
third party agreenent with a device manufacturer, the RHAPM oust notify the preparing acrivity of their
iment and request that an associated device specification nunbsr be assigned. This m“ be acc~l ished in
writing or by submitting a DD Form 2052 Non-srandard Parts Approval Request through the Military Parts
contro~ Advisory Group (MPCAG). In Ihe justific.stio” secri.m of this form the RHAPM ui(( indicate B
wi((ing”ess to prepare the associated specification. After the aW(icab{e parts contro( procedures have
been followed, the preparing activity will assign a JAN associatd specification n~r or revisicm letter.
The RHAPM will prepre the pre(iminsry draft and s.tanit it to the preparing activity. This pre(imimry
draft does nnt hnve to be ccmpiete. It may h.ve blank tab(es, figures, ad it WY’ be group D only, ht it
n?.tst be in the correct JAN associated device specification formst. A copy of this format is available frcun
any of the technology representatives within the preparing activity (see figure 6).
F.4.1 .1.2 ration for certifiw. All participants shall ccxrp(y uich the RHAPM
managmnt pt.. and all applicable requirenn?nts as specified in sections 3 ard 4 of MI L- PRF-19500K, and
F.6.3.1 herein, Oua(if ication of RHA devices shel( canp(y with the provisions in ep$erdix E. c1 sha[(
CWIY uith the Previsions of ar%~ix E ad F. L.3.1.
93
MI L- PRF-19500K
APPENDIX F
n RHAPM
SPECIFICATIDN
DEvELOPMENT
PREPARING
ASSIGNS
FLOU
ACTIVITY
SPEC;;MICE:l 10N
3
RHAPM PERFORHS
CHARACTERIZATION
ANO SUBHITS RHA DATA
RHAPM PREPARES
PRELIMINARY DRAFT
OR REV1S1ON OF
ES TA8LISltED
SPECIFIC&TIDU
i
PREPARING AND OUALIFING
ACTIVITIES REv IEM OATA
AND PRELIMINARY DRAFT
I PREPAR[NG ACTIVITY
PROVIDED
COHI!ENIS
ID RHAPt!
+
FIGURE 6. ~ f~ow..
94
MI L- PRF-19500K
APPEND!X F
F.4.2 WH verific~. The RHAPM verification progr.m shall assure that the design,
processing, assemb[y, inspection and testing of Semicotiuctor devices comp(y with this specification and the
appl~ cable Associated specification. This program shall not require ownership of all manufacturing and
testing facilities and establishes eddltiona( requirements for rhe sole Wrpose of developing a standard RHA
product. As a minim the RHAPM sha(( docwnent the relationship as follows:
a. Individual respmsibi (ities.
b. Product reliabi(iry.
c. Prcduct qualiry.
d. T raceabi 1 i ty.
e. Individual liability.
f. Data support.
9. Part rrerking.
h. Lot integrity of RHA product.
i. Testing (e. g., certified and qualified to MI L-PRF -19500).
h RHAPM must maintain an active working relationship with the device manufacturer, the preparing ad
qua~ifying activities, nrd the Systems Program Office (SPO). These relationships Wi(( constitute a
partnership between the RHAP14, the device manufacturer, and the Governnenr to insure the availability of
high reliab(e stardard RHA product to be use-d in nmre than one Department of Defense (DoD) system.
F. I..2.1 The RHAPM verification program shall t-? reviewni at appropriate intervats by
responsible rrsnagen’ent TO ensure RHA performance, product reliability, ard the effectiveness of the
established program. Records of management review shall be n!ainta inni covering the following minim.m areas:
a. RHA design (when needed).
b. RHA baselines.
c. RHA characterization.
d. Process change control.
e. RHA testing (M IL- STD-750 test methcds).
f. RHA Test laboratory suitability (qualifying activity).
9. Development of associated device specifications (preparing activity).
F.4.2.2 ~. The managm+mt plan sh,(( b established i“ accordance uith apperdix D md

submitted to the qualifying ectiviry prior to a survey. It sha(l serve as a basis to dmnstr ate [. the
qualifying activity that rhe RHAPM has an understanding of a cwlete RHA verification program. The
management plan, es exemplified by its documentation system, is adequate ro assure compliance with the
app~i cable sFcifi @ions .WCJ q.alitY $t.~.rd$. The manasec-s.t p(nn shail contain, as a mininun, these
items and they shall be eveilab(e for review at all sites:
a. Functional block diagrams.
b. Manufacturing f(ou charts by technology.
c. Exemptes of docunmtat ion 8s required by F.4. Z.
95
MI L-PRF-19500K
APPENDIX F
d. Exmples of records 8s required by F.4.2.
e. Ex.aw(es of internal ard device manufacturer audit activities.
f. Examples of ,WWSPC nwniroring.
F.4.3 ~ Only RHAPM certified cmpanies may develop RHA products and be listed
on part II of the 9PL (QPL-W500).
F.4.3.1 KtiAPM certificatia. Before 0. OEM can be considered as a RHAPM, he nusr demonstrate the
capability to contro( erd manage radiation harden’d prcduct. This can be accomplished through a
pre-certif ication review ad certification audit (see fig.re 7).
F.4.3 .1.1 pre-certifi~. The pre-certif ication review of the OEM, S management p(an shal~
eddress the following:
a. The interface between the RHAPM and the third parties.
b. The avai(abi(ity of RHA product to other programs.
c. Methods for acquisition, storage, and detivery.
u~n cmtet ion of this reyieu the OEM sha LL receive an authOrizat iOn tO Wrsue certification as a RHApH.
After receiving authorization the potentia( RHAPM has one year to establish a qualification pt.. and develop
third party relationships with subcontractors.
F.&.3 .l.2 Bt18pM certif~on.~ 1~. After the third party relationships have been
established the qualifying activity mst be notified amd qualification milestones, certifications, and
laboratory suitabilities, must be established. Laboratory suitability shalt be obtained from the qualifying
activity for all facilities designat~ to perform RHA characterization and Cl. A (ist of (atwra tories being
used shall be submitted to the qualifying activity. It ui(( be the responsibility of the RHAPM to insure
each RHA test facility maintains suitability. The RHAPM Mill be responsible for the Cl. Cl shall be part
of the RHA base(ine and shall be performed as specified in the general and associated specifications.
F.&.3 .l.2. l The RHAPM MiSt be responsible for the performance of a(( RHA
characterization. This inc(udes all known and testable radiation effects. As a minimn’n characterization
sha(t inctude the fol Lowing test methcds:
a. Neutron Irradiation (M IL- STD-730, test methcd 1017).
b. Ionizing Radiation (MI L-STD -750, TOTAL DDSE test methcd 1019).
c. Dose Rate Burnout (M IL- STD-750, test ntethti 3478).
d. Single Event Effects - Gate Rupture.
All characterization shall be r. the device capability (not the system cr+abi(ity) under worst case
conditions for rhe device technology ard design. Data will b-e to functional failure or t. . leve( of
irradiation which best represents the product capability. Frc.n this data, endpoint electrical Par flmeter
(imits shall be established. The associated device specification shall represent these limits in the
appropriate test tab Les.
F. f,.3.1 .2.2 ~. The RHAPM shrill establish the RHA base{ine and im.re the device nuamfacturec
maintains the manufacturing C.mtrols in accordance with this baseline. Any changes to the baseline nust be
co.ordinatec through the RHAPM ad reported to the qualifying activity.
96
I
MI L-PRF-19500K
APPENDIX F
NDTE 1
-—————-—————————————
OEH APPLIES FOR NOTE 2
RHAPM CER1lfl CATIDN
AND
5UBHl T5p~NAGCHENT
s=
‘o
70 OUALIFINC AcTIv17y
PRCIDU; ; LINE
JAN AND/OR
DSTEP 1 HIL-S ID-750
CERTIFIED
; OUES1 3
PLAN 1S NO
ACCEPTABLE I NO I YES
QUEST 1
YES
OEM SE LCCIS
SUBCON1RAC1ORS
1 SU8H1TS MILESTONES
1
1 YEAR
{MAX II!UF!I
kE4E!l-
, STEP 11
L——————————-——. ————
STEP 2 CORRECTIVE
AC11ONS OUALIFING AC1l VITY
APPPROVED HY
OU4L1F1NG ACTIVITY Au THOR1ZATION
DE SC-ELD1
AUDITS OEM
IEP lZ
STEP 3
OuALIFING &c TIv ITY

OUEST z
YES
OEM RECEIVES FROH

OuALIFING kcllvllY
RHAPH CERT1F1C4TION
SIEP 4
RH&PH APPLIES FOR

JAN OUALIFlt&ll ONS
SUBl!ll S PROCESS FLOU
AND TEST PLAN RHAPH 1S LISTED
SIEP 5
I I STEP 9
NOTES:
1. The prcduct developmmt f low is as fol lows:
Step 1. OEM applies for certification as a RHAPM. At this point the

qualifying activity ui(( request .s nwnagen’e”t plan (see F.4.2 .2) be
for~l ated and presented to the certifying activity (preparing and
qualifying ~ctivi ties).
FIGURE 7. Prcd.ct de v ~.
97
HIL-PRF-19500K
APPEND IX F
NOTES - Cent i .Ued
auestio” 1. The terrifying activity mi 11 revi:. the nemagement pkan. when all problem areas have
been reso(ved the OEM may be considered es a Porenti ai RHAPM. Upon acceptance of the
rranagerent pt.. the pate.tie( RHAPM wi 1 [ have up to 1 year to acconpl ish step 2
herein.
Step 2. The potential RHAPM estab(i shes, relationships uith subcontractors and Sukmits a
detai[ed our[i.e of these re[atl onships (see F.4.1 .1.2) to rhe certifying activity
for revieu. This o.r(ine oust include qualification Mi(esrones.
Step 3. The certifying activiry revieus pntentia( RHAPMos verification program, management
p[an ard verifies by auditing the patent i at RHAPMOs procedures to Insure cmT@ i ante
r. MI L- PRF-19500 and all of .Wrdlx F.
auest ion 2. After revieuing a([ audit data the certifying activity will issue RHAPM
certification. If there are any unresolved issues step 10 nmt be ccnpleted before
certification can be issued.
step 4. The qua(ifyi.g activity issues RHAPM certification (see F.4.3). The RHAPM*s
managertent pt.. is imp[enmnrni.
Step 5. Prcducr line, RHA character izat~on, Lab ard device nkmufncturer are selected. The
RHAPM is responsible for maintaining CCm@iance co MI L-STD- 750 nrd MIL-PRF- 19500 by
it ,s subcontr.mt.ars. It is also rhe RHAPH, S responsibi I iry to insure that it ,s
subcontractors procedures and docutentar ion meet the basei ine estab( i shed uirhin the
RHAPMOs rranagment plan (see F.4.2 and F.4.3).
Step 6. RHAPM ui it prepare prel iminary dr. ft specif icatiom for s.hniss ion to the preparing
activity. After the associated device specification has bee” awroved ad dated the
RHAPM a@ies for device qualification (see F.4. 1.1.1 ard figure 6). This
appl i cation must inctude a process f (.x at-d test reWrt.
auesc<on 3. Before an authorization (step 7) can be issued ail device fabrication and asstily
nust be JAN or 141L- STD-750 certified and all test facilities rust have received
suirabi I ity fran the qua( ifyi.g activity. If not Step 11 nusr be curpleted.
Step 7. The quai ifying activity issues authorization. The qualification test notification
out(ines the product to be tested, testing to be performed, saiTQle sizes, and test
Locat ions.
Step 8. The qualification data test report is submitted r. the qualifying activity for
evaluation ard review.
Question 4. If all qun(if ication data is in accordance with MI L- PRF-19500, the associated device
specification, md the RHAPtf, s managnrmt plan OPL listing is authorized. If nor
step 12 Ilust be Ccllpleted.
Step 9. The RHAPM is ( isted in the MI L-PRF -19500 OPL 0s the source of SUWIY for the JAN RNA
device.
steps 10 I f questions 2 and L are ‘sNO,,, the q.a( ifying ectivity wi I I ev.a(uate proposed
Wni 12. correction Emtio.s. These corrective actions nust be imp(ementea and Bpproved before
the next step can be ecccmp( i shed.
step 11. A(( subcontractors ~st be certified or have received frcm the q.alifyi”g acri. iry
laboratory sulrabtllty (see F. I..3). I f the ansuer to O.est ion 3 is ,, NO,,, the
quali!vin9 activity .nust perform an .*it of the faci(ity in q.estim. Any
deficiencies requlr, ng correctl.e acr?.m nwst be iWlememec and approved prior to
granting manufactwer certification or Iaborarory suitabi 1 i ty (see quest ion 2 ard
step 10).
2. O.est ion 3 may be answered at my time within the Certificatim process, bur if the answer
is ,,NO,, step 11, question 2 ard step 10 must be ncccmplished before qualification resting
can be authori zeal.
FIGURE 7. Pr&.ct de v ~ - continued.
Q8
MI L- PRF-19500K
APPENDIX F
F.4.3 .1.2.3 U. In order to be listed as a source, on the OPL, the RHAPM nust receive frmo the
qualifying activity the fo((ouing:
a. Certification: uafer fabrication, assemb(y, and test.
b. S.irability: test (laboratories and radiation facilities.
~ F.4.3 .1.3 RsJ@~On f.r RHApM. This listing requires that the RHAPM sha(i n!aimain the fo{ lowing
doctrnentat ion:
a. Annual retention reports.

~
b. Self-audits.
c. Annual recerti ficationlresui tabi(ity (c(ass S).
w
MI L-PRF-19500K
APPEND 1X G
D 1SCRETE SEMICONDUCTOR O [EtCH [P LOT ACCEPTANCE
G .1 SCOPE
G.1.1 5.CQDS. The purpose of this awendix is to establish minimum strmdards for screening,
qualification. and sanqie testing of JAMHC ad JkUKC unence.psule. ted discrete semiconductor devices
(die/chips) for use in semiconductor devices. Except for chips qua Lified under the provisiom of E.6.3 .2,
JANHC ard JANKC qualification is on(y vaLid if the manufacturer maintains QPL status for the package-d
device. The OPL program m&asures and evalu~tes the n!.mufacturer, s rranuf.cturing process agoinst a basel ine
for that process. This basei ine can include innovative and improved processes that result in m equival.mt
or higher qua( i ty prht, provided that the process used to evat. ate ard ductxrent these changes heve bee”
reviewed and .pfro.ecf. Changes to the process baseline can be nmde by the n!afwfa.t.rer after achieving
approvat with documented reliabi 1 ity ard qua( ity data. The approach out I ined in this awr?dix is a proven
base(ine which contains details of the standard die verification. This apperdix is not mandatory. However,
manufacturers nut dermnst rate to the prepsring activity ad qua( ifying activity a process contro[ systac
that achieves at (east the same (evet of quaiity as cc.dd be achieved by ccmpiying with this appendix.
G.2 APPLICABLE DOCUMENTS. This sect ion is not BW( icab(e to this appendix.
G.3 DEFINITIONS
G.3.1 ~.
G.3. 1.1 ~. Seal week of the Cl packaged sarp~es.
G.3.1.2 ~. Unencapsut ated discrete semi corduct ors. The term chip is interchangeable with the
term die.
G.3. 1.3 ~. Original wafer fabricator.
G.3.1.4 ~. See 1.3 for idemificari cm.
G.3.1.5 ~. A uafer lot shal I consist of only semiconductor wafers subjected to each md every
process step such as masking, etching, deposition, diffusion, or meta( [ ization as a group. Each wafer tot
sh.al 1 be assigmd a unique identifier which provides traceabi 1 ity to 81 ( uafer processing steps. I f any
portion of the lot is subjected to rework of masking, etching, deposition, diffusion, or relatea processes,
that portion shakl be re- identified with a different wafer lot nurt.er with identification mainrai”ti back to
the original (OC. wafer lot records sha L 1 identify al I JANNC nrd JANKC device inspect ion lots formed frcm
the wafer lot.
G.3.1 .6 &n impecti.a” lot shall consist of all dice frcm a single uafer lot which are
subnit ted for c1 at one time (see a~ndix E). The im.pect ion lot may consist of a collection of sublets of
different PINs. Only one Cl is required for each inspection lot, but each sub[ot nmst met the requirements
of tabte X1, step 1 for JANHC and table MI 1, step 1 for JANKC.
G.k REQUIREMENTS (for general flou, see figure 8).
G.4. 1 ~. Semiconductor die shal 1 conform to the requi remems contained herein.
G.L.2 semiconductor die shal ( be 100 percent screened in nccorda.ce with G.5.2 prior to
qualification, Cl, and shipmm.
G.4.3 ~. OIIa( ificat ion wst be performed by the origina( wafer manufacturer. JANHC
qualification ui[[ on{y be granted to a manufacturer uho has a MI L- PRF-19500 qualified facility. JANKC
q.. t if ic.ti O.S wi ~ I Ont Y be 9ra.ted t. 8 rren.fecturer who has been MI L- PRF-19500 qualified to mamfacture
JANS products.
G. L.3.1 ~. Manufacturers who are on the OPL for a JANTX or higher levei for .s
PIN ui ( i & granted qua( if icatio” for the JANHC chip of the same PIN upon successful cccplerio” of Cl on the
f ir. t lot of JANHC devices. Manufacturers uho are on the OPL for the JAMS packaged devices, ui ( 1 be gramed
qua~ ificatifJn to the JANKc ad JANHc of the same PIN upon camptetion of c! on the first lot of JANKC
devices.
100
MIL-PRF-19500K
APPENOIX G
G. b.3.2 &h2caa5e aua~ifi~. Manufacturers who nre not on the QPL for the packaged
device, ht are JAW qualified, Ui ( ( be granted quai if icarion of a JANHC or JANKC parr when the requirements
of G.4.3 .2a through G.4.3.2f are met.
a. The manufacturer MiSt have QPL on a device of simi tar function ard cechno(ogy For the twcose of
this specification, exa@es of functions are: signal transistor, zener diode, pouer tr~ns’istor,
dar(ington, trensient suwressor, or their identifiable circuit function. The term technology wi((
include: D!IDS, VMOS, diffused junction, alloy junction, JFET, and all other pertinent
technological descriptions of the device critical interface.
b. oual if icarion testing for JANHC shal ( consisr of c1 tesring in accordance with tab(e X1 ati
periodic testing as required by G.5.3.5 ard tab(e X111.
c. 0.. ( if i cation testing for JANKC shal 1 consist of Cl testing in accordance with rabie X11 and teble
XIII.
d. Sanple devices to be tested for qualification under this option iii 11 be assemb(ed in packages uhich
are thermal Iy equi.a(ent to the device package shown on the .P@ i cable associated specif i cat ion.
e. The die are manufactured on JANS qua( if ied uafer fab ( i.e.
f. Mrmufact.rers seeking qua( if i cation under this opt ion shel 1 sulxnit e design and construction form
to the qualifying activity shouin9 the die/package carbinat ion .hich is PrOPOSed for qUai ificat iOn
ad Cl testing and data substantiating cranpiiance with the require!rents of G.4.3 .28 and G.4.3.2d
above.
G.4.4 Cl shal t be per for!r.zd on each inspection tot sutw.equent to qualif i cat ion.
G.4.4.1 ~. Uhen a portion of a uafer lot intended for JANHC is assenbled, tested,
and accepted through Cl as JANTX or higher devices, the reminder of the uafer Lot sha[ I be qual i f iea for
JANHC uithout further Cl testing. Uhen a Portia” of a wafer lot interded for .IANKC is assembled, tested,
and accepted through Cl es JAW devices, the remainder of the uafer lot shal 1 be qual ified for JANKC uithour
further Cl resting. This applies only if the foLlauing conditions ere met: A([ PDA requirements of tab(e
IV, step 11, end step 13a were met on the first sutxniss ion: the group A sample plan of sutgroups 2, 3, and 4
passed on the first submission; the JANC die is identical to the packagea die in a( I respects; md the
assembled lot contains only dice from the JANHC or JANKC interded uafer lot. Uhi Ie awaiting the results of
the assd~ed Cl lot, the remaining portion of the wafer lot interded for JANHC or JANKC shal 1 b stored in
accordance ui th G.5.4.
G.4.4,2 ~. Uhen no dice frun e JANHC or JANKC impect ion lot ere assembied as JAN brarded
packaged devices, or the JANHC and JANKC dice are configured differently fran the dice in the JAN brandeC
packaged devices (e. g., different metal I izati on), then Cl of the JANHC ard JANKC inspect ion lot in
accordance uith G.5.3 is requir.4.
I
G.4.4.3 Uhen the JANHC die lot is divided into mlriple sub(ots which differ
only in the Mmtalliznt ion schemes, smples frmn all sublets must conform to step 1 of table X1 and G.5.3.2
through G.5.3.4 herein. Conformance to the requirements of G.5.3 herein may be demonstrated with n sample
fr.an a single sublet.
G.4.5 The e(ectricr.1 performance .harocter istics of semicocduccor die shal 1

be as specifid in the associated specification.
G.L.6 ~. rhe critica L interfaces and @ysical dimensions of the semiconductor die
shall be in accordmce with the requirmnts of M1l-PR F-195011 and with G.4.6. I through G.4.6.3 ard sha[l be
identical to the qwslif ied die encept that metal liz. tion may’ be varied co suit vari.ws bonding and die
attech methods. A cmplete-d design and construction form and die topography, including dimensions, psd
locations, ad ntetallizntion descriptions (die mp) shall be made availnble for inspection to the qualifying
activity prior to qualification. A unique criticnl interface identifier ns part of the PIN shall h
assigned based on any of the fc.1 [owing differences:
a. Die size, height, width, and length.
b. Bond pad size.
lD1
MI L-PRF-19500K
APPEND 1X G
c. Bond pad (ocar ion.
d. 130rd pad nietat.
e. Backside metal.
G.4.6.1 ~. The bonding pad size, (ocari.n, and elect rica[ function shall be in accordance with
the eF@ icab[e associated spscif icati on. Un(ess approved by the qualifying nctivity, the mininun bond pad
dimensions shell be 3 roils.
G.4.6 .1.1 The bonding pads shall be merallized and suitable for bonding as
specified in the associated specification and shall meer the requirements of G.5.3 .2.
G.4,6.2 The backing material shall be as described in the associated specification,

and meet the requiramnts of G.5 .3.4.
G.6.6.3 ~. Glass ivarion requirements of appendix H apply.
G.5 VERIFi CATIDN PROVIS1ONS
G.5.1 ~. The screening Bnd Cl (see G.4.2 ard G.4.4) of Semiconductor die shall be performed at a
facility with MI L- STD-?30 laboratory suitability for the applicable test methods.
G.5.1.1 ~ibilitv fOr ~. The SUWI ier shal 1 be responsible for the performance of al 1
inspection requirements as specified herein and in the associated specification.
G.5. 1.2 The .u@ier shakk maintain edequate records of .(( examinations,
ins~ct ions, ard tests accmnp( i shed in accordance wi th the requirements speci f ied herein and in the
associated specification. Records, inc(udi”g variables data, shsl 1 be reteined in accordance with
a~ndix O.
G.5.2 The die/chip screening shall be performed prior to c1 of G.5.3 ard shal~ consist of the
following.
G.5.2.1 Probe tests shal 1 be Frformed on 100 percent of the semiconductor die.
Test t imits and condit ions shat ( be chosen by the SUW.I ier to demonstrate that there is ccmpi iance with at (
the e[ectrica( characteristics specified by the associated specification. This allows the supplier to
assign test vetues or test details which differ from the associated specification requirements.
G.5.2.2 ~. AL1 c1 sarrples shall be visua ((y inspected in die form prior to subnitta[ for
.ssemtdy of the qualiry conformance testing saw~es. The remairder of the impecr ion tot shot t be 100
percent visua ((y inspected at nny time prior to shiprent. AIL visual inspections shall Lx performed in
accordance with the eF@ i cable methcds specified in MI L- STD-750.
G.5.2.3 w wafer lot in~. For JANKC, wafer lot inspect ion requirements of a%rdix E shal 1
apply.
102
MI L- PRF-19500K
APPEND IX G
G.5.3 tmfo,~.ce ~.
TABLE XI. nu for W.
Step Inspection Associated sample

scecwat I on reference Qtan
1. Electrical tests l/ U Group A, subgroups 2, 3, 4, “=l O,C. O

ad 7
2. Burn- in Step 12 of JANTX screeni~

tab[e
3. End-points u Group A, SUb?j,O”p 2 .=l O,C. O
D HIL-PRF -19500, group A table. Group A test conditions end (irnits shall be .s specified in
the associated specification.
2J Datn fran steps 1 ard 3 shall be read ard recorded.
TABLE X11. titrica~ sati~ for WV&
Step Inspect ion Associated Sanpl e

specification reference plan
(JANS)
1. Eleccrica( tests 11 2/ G,ouPA, SU@,OUPS 2, 3, 4, 5, .=l O, C.(I

6, ,d 7
2. NTRB Step 10 of s.re.ming t,ble
3. DC test U v Step 11 of screening tab(e .=l O,. =O
4. Burn- in Step 12 of scr.eeni”g table
5. Eti-pnints and delta ,?/ 3 Step 13 of screening table .=l O,==O

catcu\atlon
u HIL-PR F-19500, group A table. Group A rest conditicms and limits sh.a(( be as
specified in the associated specification.
w Data steps 1, 3, at-d 5 shal I be read and recordd.
II Deltas shal 1 be required when Swcif ied in the screening table of the appl icab(e
associated specification.
103
MrL-PRF-19500K
APPEND IX G
TABLE X111. pericdic tests ~lon of JANKC u.
Step Inspect ion Associated specification Samp(e

reference D[an
1-1 Tenpereture cycling Group S, subgroup 3 (S level)
1-2 Surge Group B, subgroup 3 (S Ieve( )
1-3 Electrical measureirre.ts Group A, sutgroups 2, 3, 4, “=l O,C=O

and 7
2 Therma( resistance Group B, subgroup 6 “=10, ==0
I
3-1 Operating life I/ step 12 of scree”i”g table. “=l O,C=O
[s level) t 1.000 hours
I Electrical measurements at step 13 of scre.ming rab(e. “=l O,C. O
3-2
1,000 hours (S level) u
I
u Devices frcm step 4 of table X1 may k conrinusd to 1,000 hours to fulfill this requirement.
2/ anit ZeJx.
I
TABLE XIV. Storaue (ife verlfi~ .ll
I
I nsosct i on
a. Electrical tests at +250c, group A, subgroup 2, n = 10, c = O
b. Bond wII (see G.5.3 .2) u “=l O,C=O

I
c. Die shear (see G.5.3 .4) ~ .=5, c=13
I
IJ Separate SMT@e S may be used for steps b and c.
If the devices pass the atmve criteria, then the tot has passed the storage life verification tests.
G.5.3.1 ~. A racdun Saup(e shat( b selected frun each inspection lot. The
manufacturer may, at his option, perform evaluation of the wafer tot prior to sukrnitting for Cl. The
evaluation sa~les may not be used for any Cl requirements or test. For JANXC, at least 2 die frcm each
uafer and at least 10 die frmn each uaf.?r tot shall be selected, to build the packaged sanpl es.
G.5.3 .1.1 Pre-cao visual. A Pre-caP visual i.$Wctio. in accordance uith the a$@icable methods
specified in 14[L-sTD -750 she(( b? Wrformd to re!rove assentiy irduced defects.
104
MI L-PRF-19500K
APPENDIX G
G.5.3 .1.2 mqedsa~ie id~. The packaged sanqie shall be marked or Lateled in accordance
uith the fol Lowing priority:
a. Serial nurbers, if required for delta m?asumment unir identification
b. Device PIN.
c. !ns~ct ion lot nhr or date code.
G.5.3.1.3 ~. The specified sanple size shall be processed through the test sequence
specifid in table XI for JANHC ard teb(es XII and XIII for JANXC. If rhe test san@e fai(s the criteria of
the applicable tab[e, the lot sha[[ be rejected. If a failure is attributed to packaging or hardling
defects, ESD, equipnent malfunction, or operator error, these sanples shall be verified by visual inspection
or faiture anaiys is. Upon verification of such defects, the test sample maY be rep(aced in accordance uith
ap$.mdix E. 1. mlditi cm, .1[ con form.mce inspections lots nust cunplete the tests of G.5.3.2 through
G.5.3 .6.
G.5.3.2 ~. Uire bond PI( shall be per formec according to MI L-3 TD-750, methcd 2037, cordit ion A.
Uire bond samples mst have been baked to any of the conditions listed in table XV. Five devices mininnm
with 10 wires shall be tested uith zero rejects allowed. If one reject is found, resuhnitta( is allou~
using 10 devices mininxm and 20 wires uith zero rejects. Failures which nre not related to rhe integriry of
the die do not constitute failure of the lot ard such fai(ures may be replaced with additional packaged
devices and resubmitted for bond Pll after verification. !t is permissible, kc not required, to use
devices frcin tabLes X and X1.
G.5.3.3 T?rature cYcting shall be performed in accordance with MI L-sTD- 750,

methcd 1051, condition C. SenlILe size sha[[ be 10 pieces. Failure criteria shall be group A, subgroup 2,
with zero rejects allowed. If .me reject is found, resubnitta( is a(loued using doubke the sa!rp(e size with
zero rejects. F.si(ures which are not related to the integrity of the die do not constitute failure of the
lot and such fai(ures WY be replaced uith .dditionai packaged devices ard resubmitted for Wmperar.re
cycling after verification. lt is permissible, tut not required, to use devices frcin rable XI or tab(e X11.
G.5.3.6 ~. Die shear shati be per formal in accordance with MI L- STD-750, methcd 2017, condition
A. Unless the test is for table XIV verification testing, five sanples that have .Tleted tab(e Xl or
tab(e X11 and temperature cyciing shall be tested with zero rejecrs. If one reject is found, resulrnittal is
a( lowed using 10 devices uith zero rejects. Asserrbly re(ated fai(ures uhich are not rel. ted to rhe
integrity of the die do not constitute faik.re of the lot and such failures may’ be replaced uirh additional
packaged devices and resubmitted for die shear after verification.
G.5.3.5 ~. chips qualified under the optiona( procedure of G.4.3.2 wst successfully
c-~e~e the wri~ic testin9 yhornn i. table x!ll as required by a~rdix c. For the parpose of this
.w~!x, the [Wulr~.T statln9 that the devices be fully rrarked shell be uaived and the requirements of
G.5.3 .1.2 heretn shall apply.
G.5.3 .5.1 periodic tm. A(( devices tested to tnble X111 requirements shall have passed step 1 of
table XI. Devices which have been subjected r. table X! or table XII testing can b-e used for table XIII
testing.
G.5.3 .5.2 -ate sanul es. Separate sanples may t-? used for test groupings 1-1 through 1-3, 2, and 3-1
through 3-2 in tnb(e X111. Sar!ples for each test group nust be tested sequentially within the group.
G.5.4 ~. Prior to acceptance, dice sha(( &? stored i“ 0 dry nitrogen atmosphere. Aftev lot
acceptance, the inspection lot die may be stored in dry nitrc.ge” or other inert atrms~ere. Uhe” srorage
time exceeds 36 months after CI ccmp(eti on,n samp(e shall be assenb led and tested as specified in rable
XIV. The rrmufact.rer may Wtmit an altenmte procedure for storage of semiconductor die for .wrova( by
the qualifying agency.
G.6 imK6.ww
G.6.1 Al( semiconductor die shall be packaged in icdivid.oily lidded c.anteiners. For ESD
sensitive devices (classes 1 and 11) conductive or ‘mti -static containers sha(( be required with a“ external
conductive fietd shiei ding barrier. Stacking of containers uirhout lids shall not be allowed. The supplier
may subnit . . alternate procedure for packaging of die for approva( by che using activity. Projective
packaging of ESD sha(l be mandatory.
105
MI L-PRF-19500K
APPENDIX G
G.6.2 -“ner ~r-. The fc.1 lowing in fornmt ion shall be marked on each container of semiconductor
die:
0. Type designation.
b. Appl icab(e specification !nm&u?r.
c. Manufacturerns (ego or designation synbl.
d. Lot identification Cede.
e. Oumt i ty.
f. ESD symbol, in accordance uith 3.10.3.1.
9. Date code.
h. verification date cede (see G,6.2 .1).
G.6.2.1 hue ctie for verificti. Lots that had storage life verification tests in accordance uith
table XIV sha( 1 have 8 second date code identifying the date of the veri f i cat ion tests. This date cede ni I I
be fotiowed by the suffix letter V (identifying verification).
G.6.3 w“ficate of conformance. The certificate of conformance sha( ( be in accordance with 3.7 of
MI L- PRF-19500.
TABLE XV. e..e- time ~.
Condir ion Minin!a( time Tenprature D
A 1 hour 300.C
B 2.5 hours 275-C
c 8 hours 25PC
D 25 hours 225-C
E 90 hours 20VC
F 600 hours 175*C
u +1O.C, -5*C.
106
MI L-PRF-19500K
APPEND 1X G
JANIX OPL ON
P THE PACKAGED
OEVICE L. 4,3.1
!=7
F
lDEN1lCAL SAHEDESIGN
DIE G.4.4.1 AND C0N5TRUCT1DN/
DIFFERENT RE1&L G.4.6
JANHC OUAL/OC1
AFTER c.4.4. l
lx Ocl 0;1
5HN;NG
SCREENING
G.5.2
Oc1
SHIP G.5.3
G.6
SHIP
8 G.6
JANKC OR JANHC
I
a JANS OPL ON
lHE PACKAGED
DEVICE G.4.3.1
I
I ?==9 OUAL ac 1
Q1DEN71 CAL
OIE G.4. 4,1 SCREENING
G.5.2
SC:::N;NL
,Ufic, OUAL
G,4.3. Z
Oc 1
G. 5.3
PER1OO1C
TESTING
G.5.3 .5.!
8?2
SCREENING SC::FHN;NG
c1
5CRE5NIN6
G.5,2
G.5.2
OUAL 0[1
~g
SHIP
G.6
SHIP
G.6
G.4.3.1 G.5.3
SHIP SHIP
G.6 G.6
FIGURE 8. UIL-PRF -19500 Q2E?Crdix G flOWhrU1.
107
MI L- PRF-19500K
APPEND 1X H
CRITICAL INTERFACE AND MATERIALS
H. 1 SCOPE
H.1.1 ~. This a~rdix contains critica L interface information which will assist manufacturers in
producing devices uhich meet 3.2. The QPL program measures and evatuates the manufacturers manufacturing
process against a baseline for that process. This base( i ne can include innov.st i ve and i wroved processes
that resu[t in an equivalent or higher qua[ ity product, provided that the process used to evatuate ard
docurent these changes have been reviewed and approved by the qua( ifying act ivity. Changes to the process
baseiine can be made by the manufacturer after achieving approval .ith docmt?nted rel inbi ( ity and quality
data. The aWroach .a”tk ined in this a~rdix is a proven baseline which contains details of critical
interface criteria. This appendix is not mardatory. However manufacturers MiSt demonstrate to the
qua( ifying activity an equivalent system that achieves at least the same leveL of quat ity as coutd be
achieved by ccxtp(ying with this appendix.
H.2 APPLICABLE DOCUMENTS
H.2.1 ~. The docunenrs listed in this section are Specifid in sections H.3 arc H.4 of this
specification. This section does not inc(ude docunenrs cited in other sections of this specification or
recannended for additional information or as examp( es. blhi le every effort has bee” made to ensure the
ccm@etenesS Of ~his 1 ist, dockmmnt users are cautioned that they must msec a(( sWcif ied requirements
docunents cited 1. sections H.3 and H.4 of this specification, whether or not rhey are (isted.
H.2.2 ~.
H.2.2.1 The fo((ouing specificaticos, standards, ard hatibooks

form a part of this document to the extent specified herein. Unless otheruise specified, the issues of
these docunents are those Listed in the issue of the Department of Defense Index of Specifications and
Stardards (DWISS) and supplement therero, cited in the SO( i citation (see 6.1 ).
STkNDARDS
FEDERAL
FED- STD-H28 Screw-Thread Standards for Federal Services.
(Un(ess otherwise indicatti, copies of the at.we spxif icatiom, standards, and handbooks are avai (eble
f run the Standardizat ion Docunent Order Desk, 700 Robbins Avenue, Bui (ding 4D, Phi Iade(@ie, PA 19111 -5094.)
H.2.3 grder of Dre~. 1. the event of a conf [ ict htuem the text of this docurmt and the
references cited herein [except for related associate specifications, specification sheets), the text of
this docuce”t takes precedence. Nothing in this docunent, however, supersedes applicable lrJ.s ard
reg”lation~ un(ess a specific exemption has ken obtained.
H.3 CRITICAL INTERFAcE AND CONSTRUCTION CRITERIA
H.3.1 Mu(tip(e device designs wi(t be qsproved

by the qual ifyi.g activity on a case by cnse basis for JAN, JANH; , JANKC, JANTX and JANTXV per mawfacturer,
provided awropr~ ate identif icatic.n (as a minirmxn) is provided to emswe rraceabi I ity . For JANS devices,
O“(Y one design IS al Iowa pr mmufacturer, and it may differ f ran the design of other verif icati.m (eve(s.
For radiation hardened devices of #(( leve(s, on(y one design is allowed, ard ir may differ frmn the design
of nonradi et i on hardemd devices. Uith the approva[ of the qualifying activity (see D.3.4 .2), design
material and construction altermtives for qualified device tyues may be a( lowed onlv for 8 (imimd time.
An altermte design sutiit ted for opprova( kst be definitive” of al l-pertinent consr~uct ion features.
Particular design features are not imerch.mgeab(e betueen awcrJved designs. A si”gte ins~ctim. (C,I or
sublet, in the case of lots made up of sublets of structural (y identica( devices, shal 1 Contnin on(y one
approved design, material ard construction so that hamgeneity is preserved within n given lot
id.mtification cede ard device type. The q.a Lifyi”g activity sha[l be notifieti of the first tot
inc.arp-arating the change and the Isst lot of the present existing design and effective date codes for each.
If the existing design is to be maintained, the manufacturer sh,(( justify the retention, subject to
a~roval by the qualifying activity. The qualifying activity may period ico([y identify specific eltermte
designs by device type and associated specification ard request justification for contimed retention of
that specific alternate design.
I 108
APPENDIx H
H.3.2 U&kMS. All &mckaged devices supplied under this specification sha(( be hermetically seated. NO
organic or po(ynmric material shel ( be used as a package or package seal.
H.3.3 Externa[ parts of the semiconductor device shal I be inherently

nonnutrient to fungus.
H.3.4 -. Inrernal surfaces shal I be capable of resisting progressive degradation wi thin B

hernketicak Ly sealed wckage. External meral surfaces shal 1 k corrosion resistanr or shal 1 be plated or
tre. ted to resist corrosion. Device package material shal 1 be free of turrs and other potential particle
contaminant ion.
H.3.5 ~. Standard screw threads (isted i“ FED- STD-H28 shall k-s required for a(i
semiconductor devices where screu threads are a mechanical requirement of the device.
H.3.6 ~. !nterm[ conductors uhich are i“ therma[ contact with a substrate along their
entire (engths (such as mta( ( ization strips, contact areas, ard bondima interfaces) shat I be designed so
that no properly fabricatd corduccor shal 1 experience, at device rnaxin?.m! rated current, a current density
in excess of the va(ues shown k(ou for the applicable conducr.r rrateria( inctuding al lowances for worse
case conductor ccnpos ition, cross-sectional aree, normai production tolerances on critical interface
dimensions, end actual thickness at critical areas, such as, steps in the elevation or contacr wirdows:
Maxirrur allowable
cent i .UOUS current dens i ty
lRMS for w~
Aluninun (W. W percent pre or dom) 2 x 105 arrpsfcd

without glass ivation
Aluninun (W. W percent pre or doped) 5 x 105 anpsfcn?

with g~nssivst ion
Go\d 6 . 105 aqn/cm?
All other (unless otherwise specified) 2 x 105 .31Tpslcd
H.3.6.1 ~. Thernwcc.rpress ion wedge bonds shall not be uti(ized when alwni nun uire is used.
H.3.6.2 ~. Pure glass shalt not be used for device die mounting.
H.3.7 ~i iicon transistor metatt W1On Drotect ive c.aati”q. All si (icon transistors with %3xirnm rating,,
of less than 4 uatrs at Tc of +25-C, sha(( have an inorganic transparent protective overlay materia( . . the
active metal (izat ion (exc(uding the bonding pads). For JAW devices, the minirrm deposited glass ivetion
thickness shall be 6,000 A of Si02 or 2,000 k of Si~N6. The g[essi vation sha(( cover B(( e(ectricak
conductors on the chip except the boding pads. For JANS devices, a mininun of 0.050 mm (2 roils) distance
shall be maintained between all uncoated cotiucting paths, except where the funcri.m.sl performance
parameters of the device require c[.aser spacing.
H.3. tl ~ interface restrlc~. Unless it is Parr of the Origiml design, the externa( surface of
package, header, or f(ange shall be finished and not have any depression or cwity. External parts,
etements, or coatings shrill nor blister, crack, (excluding 910ss meniscus), outgas, soften, flow, or exhibit
defects thet adversely affect storage, operati cm, or e“vironrent. al c~p-sbi [ities of semicm. ductor devices.
For JAN, JANTX, and JANTKV the use of si(icone or organic material inside the packages, shatt be approved by
the qualifying activity. Desiccants shall not t-s used. For JANS devices, silicoms or organic mater ia[s may
on(y be used when specified by the associated .Pecifi.ati o”. Polymer irpregnati.ms (wch .s back fi ([) of
the packages shalt not be permitted.
MiW&ltW: packages cOntai. in9 b.=rY1liun oxide (BeD) shrill k marked in accordance with 3.10.3.2
and shall not be grouti, machined, sandblasted, or subjected to any mechanical operation uhich
witl produce dust c.mtaining my bery((iun CVurd. Packages Cent.si”ing any berylliur ccmpo.rd
shall not be subjected to any chemical process (such as etching) which wi(( prcduce fumes
containing beryl Liun or its) c-d%.
109
141L-PRF-19500K
APPENDIX H
H.3.9 cd for~. All JANS diodes (excluding Schortky barrier and point
contact u[tra high frequency (UHF) devices) shall be n’etallurgicak[y bonded et the interface of any
mechanical comect ion wirhin the assembly of the device (see appendix A for axial lead diodes).
H.3.1O ~s for JANS~r structure.
N.3.1O.1 The mininun merallizat ion thickness shall k 8,000 A.
N.3.1O.2 MSLLISL .iresi=. The internal wire diamter shali be .0009 inch (0.023 mm) mini- for
atuni nun and .0007 inch (0.018 mn) minim for gold wire.
N.3.11 P@aqee~~nt [other ~ i’. Exrernal metallic package elements other

than leads erd terminals (e. g., lids, covers, bsses, ard seal rings) shall meet the applicable environmental
requirenmts without additional finishing of the base m@teria(s or e[se they sha(( be finished so they Ireec
those requirements using n finish system conforming to one of the cmbinatio.s listea in table XVIII, and
conforming to the thickness ad Canpos ition requirenmts of table XVII. The finish system shall also
conform to the requirements of H.4. 1.1.1 erd H.4. 1.1.3.
H.& LEAD ANO TERMINAL FINISH
H.4.1 All leads and applicable terminals shall be solderable in accordance

with HIL-STD -750, methcd 2026, and in accordance uirh the fo( (owing proven hse(ine or as otherwise approved
by the qualifying activity.
H.4.1.1 The finish system on a(( externa( leads or termina~s

shall conform to one of the ccrrb inations liSred in tab(e XVI and to rhe thickness and ccqmit ion
requirnrmmts of rable XVII. The finish system shall a(so conform to the require’rents of H.4. 1.1.1 acd
H.6.1 .1.3 where applicable. Lead finish requirements are not aw(icabte to specifications which are
inactive for new design.
H.4.1.1.1 jl!?s sotder diR. The hot solder dip shell be humgeneous and shall be .Pp(ied as fol lous:
a. h(( out(ines uith hot sotder dip over cmpliant coating. The hot sotder dip shaii extend to within
.050 inch (1.27 mm) of the senting plate (mini m_ml. For leadless chip carrier devices, the hot
solder dip shalt cover a minim of 95 prcent of the metai lized side caste (iation or notch arm
metal lizd areas above and below the notch, except the irdex feature if not connected to the
constellation. Terminal erea intended for device mounting shall be ccrrpletely covered as required
by MI L- STD-730 solderability test. For stwd mwnt the solder shall exterd .050 inch (1.27 mm)
mi”irmxo below the terminal hole.
b. All o.r(ines with hot solder dip over base metal, or noncmf pliant coating (which are subject to
corrosion resulting in lead degr.sdat ion). The solder shall extend to the package sea( or ~int of
emsrgence of the metal lizni contact or [cad through the package wal~. If so(der is applied up to
the seal, a herrericiry test (M IL- STD-750, method 1071, samp(e size (116 devices, c = O)) shall
subsequent~y he performed ard passed. An externa( visual examination (H IL- STO-750, method 206S,
samp(e size (116 devices, c = O)) may be performed in lieu of the hermet icity test for
m“-transparent gkass encased doub(e pt.g noncavity axia~ lead diodes. A\ter”.9tel Y, the hor soLder
dip may extent to within .050 inch (1.27 rim) of the seating plane [minim@n), provided a salt
atmosphere test uethcd 1D41 Sanple p~a” 22 devices, c = O subsequemly bs performed and passed.
For Ieadless chip carrier devices, the hot solder dip shall cmplete(y cover the meta( lized side
caste ((ation or notch an metal lizd areas above m-d belo. the notch, except rhe index feature if
not connected to the caste nation.
H.4.1 .1.2 W. The Lead may be so(id si(ver or the lead finish may b si(ver clad or si(ver plated.
The silver sha[l be o mini- of W.7 percent pure. Silver c(atiing thickness shalt be a mi”imrn of 250
microinches (6.35 ~). A matte or semi-bright plated finish is allowed. The silver p(ating thickness she((
& e mini- of 100 micro inches (2.54 w) arc a n!axinmm of 425 micro i”ches (10.80 w). Silver p(ating as a
final finish, she(( not be used directly over co~r.
H.6. 1.1.3 Ji” and t~. Pure tin finish shall not ix used on any internal or external package
or lead surface. Lead finish sha[[ not use pure tin. Tin-lmd ptate shaii comai” three percent lead as a
mininun (see table XVII). Pwe tin finish (incldi”g wre tin w-dercoati”g) sha(( be prohibited. For the
JAN Ieve( ..(Y, Wre tin is acceptable i“ accordame with tab(e XVII. h.?re i”.
110
MIL-PRF-19500K
APPENDIX H
TABLE XVI. N finish ~
I Finish Ra
ii.
I B.se
mLd- ZLaE
electroplated
ntcke[
Hot so~der dip X X

Hor so(der dip 2/
Hot solder dip D x
Hot solder dip u x
Hot solder dip l/ x
Hot solder dip 3./ x x
Hot so(der dip 2/ x x
Hot solder dip l/ x
Hot solder dip l/ x
Hot solder dip 3./ x
Hot solder dip W x
Tin plate x x
Tin plate x
Tin p(ate x
ti .~ate x
Tiw lead plate x x

Tin-teed plate x
Tin-lead p(ate x
Tin-1ead plate x
Tin-(cad plate x
J- x
Gotd plate U x x
Go(d plate x
M Dtate x
Silver p(ate ~ x x
SiLver plate x
~ Otate x
u Underplnte is the coating that the solder ui(( uet and adhere to.
2/ MaY include activation systems such as irnners ion plating of sitver o. tin.
U flat so(der dip sha(( be app(ied in accordance with H. L.l .1.1.
4/ Gold p(.ming shall “Ot be used direct(y over copper.
5./ Silver plating shall not be used dimect(y over copper, however, si(ver cladding direct(y over
copper is acceptable.
111
MI L-PRF-19500K
APPENDIX H
TABLE XVII. ~.
i
I
coat ng Th{ ?ss Coating composition requirc+rents
bmneter)
minimum u Maxinun 2/
Hot so(der dip (for rc+xid 64/1 .52 w The soLder bath shai~ have E ncminal
leads) I/ ccinpasiti.m of sn6D or 5n63. u
Hot solder dip (for .311 200/5 .08 Ns The solder bath shall have a ncminal
shnpes ocher than round ccmos ition of Sr60 or sn63. ~
leads) l/ W
lTi” pate (.s pleted) U 300/7.62 NS shall contain no more thnn 0.12
percent by weight co-deps ited organic
I
material measured as e[ementnl c.srb.m,
D
Tin- 1ead p[are (as plated 200/5 .08 NS Shell consist of 3 to 50 percenr by
U&/ weight (cad (balance nmminal(y tin)
homogeneously co-deposited. Sh.11
contain no nmre than 0.12 percent by
weight co-deposited organic material
msnsured as e(emental carbon. ~
Tin dipping ~ ~ 100/2 .56
Gold p(ate 10/ .254 22515.72 Shall Cent.in a mini- of 99.7

percent gold. On(y cobalt shall be
I used as the hardener.
Silver plate 100/2.54 425/10.8 99.7 percent si(ver mi”imnn.
Nickel plate (e(ectro. 50/1.27 350/8.89 The inrmd.ct ion of organic addition
p(atel agents ro “icke( bath is prohibited.
Up to LO percent by weight cobait is
permitted as B co-deposit.
,.
Nickel plate (elecrro(ess: 50/1 .27 250/6.35 The introduction of organic atiit ion
agents to nickel bath is prohibited.
50/1.27 350/8.89
1/ Package elemsnts havinQ no.ccadi ant coatings are cermit ted Drovided thev are subseauentlv ,. hot
so(de; diw in accor~a~e uikh H. L.1.1.lb~
U NS = not specified.
w See H.d.l.l.l.
u As measured to the center of the fiat.
u See H.4.1 .1.3. For threadti stud packages ..(y, the minirmm coating thickness shall be 100
micro inches/ O.51. o!icr.xneters.
u The maximdn carbon content (and minimn’ lead content in t in- [cad plate) sh.al ( be detennimd by the
manufacturer on at least B quarter(y basis. The determination of carbm ad lead content may be
mnde by any’ accepted an.glyt icel technique (e. g., for carbon: pyrolysis, infrared detection (using
an IR212, IR266 infrared detector or equival em); for lead: x-ray fluorescence, emissicm
spectroscopy) so (cmg .s the essay reftects the actua~ content in the torai depsi ted finish.
D The so(der Sn ccmcentratio. in the pot may rcmge betwe.m 50 percent S. to 70 percent S..
w Maxiimsn nicke( applies O“IY to lead material.
112
MI L-PRF-19500K
APPEND 1X H
TAOLE XVI I r. (other than (cads/WrmjrdQ finish ~.
““’S’~ None
x
x
Gold p(nte x
Gold plate x
Gold p(ate x
Silver plate x
SiLver plate x
Si (ver plate x
Electroplated
nicket u x
E\ectroless
nicke( u x
Nickel cledding u x
D Ccabi nations of electroplated nicke( ad e(ectrokss nicke( and nicke{ cladding are permitted.
113
MI L-PRF-19500K
INDEX
Paragraph Page
ABSOLUTE NAXIMUM RATINGS- - - - - - - - - A.3.1 10

ABBREVIATIONS --------- ------ !3.3 23
ACCEPTANCE PROCEDURE - - - - - - - - C.6.2.2
ACQU1S1TIOM DOCUMENTATIOM - - - - - 0.3.6. \ 68
ACLIU!S!TION REQUIREMENTS - - - - - - 6.1 8
ADD IT IONAL SAMPLE ------- ------ c.4.2.3 42
ADDITIONAL SAMPLES - - - - - - - - C.5.5.1 L3
ALLDUABLE ALTERNATE DESIGN, MATERIALS, AND
CONSTRUCTION ---------- ----- H.3.1 108
AL TERNATE FLAW -------- ‘------ G.4.4.2 101
ALTERNATE GRU.IP E TESTING PROCEDURES- - - - E.6.1.1O.2 73
ALTERNATE PROCEDURE FOR SCREENING OF JANTX
AND JANTXV TYPES -------- ----- E.5.3.1 64
ALTERNATE PROCEDURES FOR OUALIF1 CATION AND
Cl UHERE JAN IS NOT COVERED BY THE
ASSOCIATED SPECIF1 CATION - - - - - - E.5.3.3 65
ALTERNATE QUALIFICATION REQUIREMENTS- - G.6.3.2 101
ALTERNATIVE TEST METHCOS- - - - - - - - - 0.3.11.5, E.3.7.1 52, 61
AMBIENT TEMPERATURE - - - - - - - - - A.3.2 10
ANCFJE ------------- ------ A.3.3 10
ANCCIE TO CAT HCSIE VOLTAGE-CURRENT
CHARACTERISTIC (ANCOE CHARACTERISTIC) - - A.6.3.1 19
APPLICABLE DDCUMENTS- - - - - - - - - 2; A.2, B.2 2, 10, 23
C.2, D.2, E.2, 41, 65, 97
F.2, H.2 91, 108
APPROVAL PROCEDURE AND CRITERIA - - - - E.6.1.4 72
ASSOCIATED CERTIF1 CATIONS - - - - - - - 3.2 3
ASSOCIATED SPECIF1 CATION - - - - - A.3.4 10
AUDIT DEFICIENCIES- - - - - - - - - - - D.3.17.4 53
AUDIT SCHEDULES AND FREWENCIES - - - - - D.3. 17.2 53
AUDI TARS ---------- ‘------ 0.3.17.3 53
AVALANCHE -JUNCTION- - - - - - . . . . . . A.5.7.2
AVALANCHE LUMINESCENT OIME - - - - - - - A.7.2.1 20
BACKING MATERIAL- - - - - - - - - - - - G.4.6.2 102
BACXUARD DIME --------- ------ A.5.3.2 17
BASE- - - - - - -- - - - - - - - - - A.4.1.1 15
BASELINES- - - - - - - - - - - - - - - F.4.3.1.2.2 96
6A51CPLANT -- - . . . . . . . . . . . D.3.1.3.1.1 66
BERYLLIUM OXIDE PACKAGE IDENTIFIER- - - - 3.10.3.2 5
BIDIRECTIONAL DICOE THYRISTOR - - - - - - A.6.1.1 18
BIDIRECTIONAL TRICOE THYRISTOR - - - - - - A.6.1.2 18
BLOCKING- - - - - - - - - --- - - - - A.3.5 11
BLOCKING LIFE- - - - - - - - - - - - - A.8.5 22
BDNDINGPAD - - - - - - - - - - - - - G.4.6.1 102
BDNDPULL - - - - - - - - - - - - - G.5.3.2 105
BREAKDWN VOLTAGE ----- -------- A.3.6 11
RREAXDVERPOINT - - - - - - - - - - - A.6.3.2 19
BURN-IN ACCEPTANCE CRITERIA - - - - - - E.5.4.1 65
BURN-IN SDCXET VERIF1 CATION FOR JANS- - - E.5.4.4 69
CASEMWNT- - - - - - - - - - - - - - A.3.7 11
CASE TEMPERATuRE- - - - - - - - - - - - A.3.8 11
CATEGORY 1 METALLURGICAL BDND - - - - - A.3. 15.3 12
CATEGORY II METALLURGICAL BOND- - - - A.3.15.4 12
CATEGORY 111 METALLURGICAL BOND - - - - A.3.15.5 12
CATHCOE - - - - - - - - - - - - -- A.3.9 11
CERTIFICATE OF CONFORMANCE- - - - - - - G.6.3 106
CERTIFICATION- - - - - - - - - 3.5 4
Certify CATION OF C0NP3SMANCE kND ACQUISITION
TRACEABILITY- - - - - - - - - - - 3.7 4
CERTIFICATIDN .SEWIREMENTS- - - - - - - F.G.3 96
CERTIFIED SUPPLIER PRDGRAM - - - - - - D.3.10 .1.1 51
114
MI L-PRF-19500K
1NDEX
Paregrap+7
CHANGE CONTROL, QUALITY CONTROL, TRAINING,

ANO CALIBRATION INSTRUCTIONS FOR RHA- - F.3.5 92
CHANGE OF QUALIFIED PRCOUCT - - - - - - - D.3.4.2
CHARACTERISTIC- - - - - - - - - - - - - A.3.10 11
CHARACTER 12ATION - - - - - - - - - - - F.4.3 .1.2.1 96
CHIP QUAL1FICATION- - - - - - - - - - - G.5.3.5 105
cl ---------- ---------- E.6.1 70
Cl OR 100 PERCENT SCREEN REOUCTION OR
ELIMINATION- - - - - - - - - - E.3.1 57
CLAMPING FACTOR - - - - - - - - A.5.7.4 18
CLAMPING VOLTAGE- - - - - - - - - - - A.5.7.3 18
CLASSESOF THYRISTORS - - - - - - - - A.6 18
CLASSIFICATION OF INSPECTION - - - - - - 4.2.1 7
CCCIEFDRPLANTS - - - - - - - - - - 3.10.8.1 6
COLLECTOR- - - - - - - - - - - - A.4.1.2 15
CDNPONENT DESIGNATION - - - - - - - - 1.3.4 2
CONDITIONS ANO METHWJS OF TEST- - - - - D.3.11 .3, E.3.7 51, 61
CONFORMANCE INSPECTION- - - - - - - - - - E.6, G.5.3 70, 103
CONSTANT CURRENT SWRCE - - - - - - - - A.3.11 11
CONSTANT VOLTAGE SUJRCE - - - - - - - - - A.3.12 11
CONTAINER BARKING ------ ------- G.6.2 106
CDNTRACTEO PLANT - - - - - - - - - - - D.3. 1.3.1.2 46
CONTRACTED UAFER FABR1 CATION- - - - - - D.3.1 .3.1.3 46
CONTROL DURING MANUFACTURING AND ASSEMBLY - 0.3.9.1 69
CONTRDL DF CUSTWER SUPPLIED MATERIAL - - - D.3.7 4a
CONTROL OF !NSPECTION MEASURING ANO TEST
EQUIPMENT ---------- -- . . D.3.11 51
CDNTROL OF NONCONFORMING PRWUCT . . D.3.13 52
CDNVERS!ON EFFICIENCY - - - - - - . . A.7.1.1 20
CONVERSION OF CONTRACT REOUIREMENTS TD
MANUFACTURER PROCEDURES - - - - . . D.3.3.1
CONVERS1ON OF CUSTWER REOUIREMENTS . . D.3.3 and D.3.3.1 48
CDfiRECT!VE ACTIDN - - - - - - - . . D.3. l&. l 52
CORRECTIVE ANO PREVENTATIVE ACTION . . D.3.14 52
CCSJNTRY OF DRIGIN - - - - - - - 3.10.10 7
CRITICAL INTERFACE AND CONS1RUCTION
CR IBERIA --------- ------- H.3 108
CRITICAL INTERFACE CONTROL - - - - - - D.3.4 48
CRITICAL INTERFACE MATERIALS - - - - 3.8 5
CRITICAL INTERFACE RESTRICTIONS - - - - - H.3.8 109
CRITICAL lNTERF> hCES-- - - - - - - - - G.4.6 102
CURRENT -REGULATE DRDl~E- - - - - - - - A.5.5.1 18
CURRENT-REGULAT1 3R D!CQE SYMBOLS - - - - B.5.5 34
CURRENT-REGULATOR DICOES - - - - - - - - A.5.5 18
CUIDFF CURRENT ------- -------- k.4.l.3 15
DARK CONDITION- - - - - - - - - - - - - A.7.I.2 20
DARK CURRENT- - - - - - - - - - - A.7.I.3 20
DASN-DNE CONSTRUCTION - - - - - - - - - A,3. 15.2 11
DAIECCOE - - - - - - - - - - - - - G.3. 1.1 100
OA.TE C03E FOR VERIFICATION- - - - - - - G.6.2.1 106
DC INTERMITTENT DPERATING LIFE- - - - - - A.8. L.3.2 22
DE F1N1TION OF A OPL MANUFACTURER- - - - D.3. 1.3.1 46
DEFINITIONS - - - - - - - - - - - - - c.3.1, G.3, G.3.1 61, 100
DEPLET1ON-MrnE OPERATION- - - - - - - - - A.4.3.1 16
DEPLETION-lYPE-FET- - - - - - - - - A.4.3.2 16
DESCRIPTION- -- - - - - - - - - - - 1.2 1
DESIGN CONTROL - - - - - - - - - - - - - D.3.4 La
DESIGN, MATERIALS, AND PRDCESSING
DOCUMENTATION - - - - - - - - - - - - - 0.3.4.1 48
DESTRUCTIVE TESTS - - - - - - - - - - E.3.4 59
DETAILED ELEMENTS OF A RELIABILITY PROGRAM- E.6. 1.3.1 71
DETECTORD1O3E- - - - - - - - - - - A.5.2.1 17
115
MI L-PRF-19500K
INDEX
Page
DEVICE GRLWPINGS ----- -------- D.3.20 .3.3 55

DEVICE INSPECTION LOT - - - - - - - - - - - E.3.2.3.3 58
DEVICE VERIFICATION - - - - - - - - - - 4.2 7
DIE/CHIPS--- -- - - - - - - - - - - G.3.1.2 100
DIEMWNTING- - - -- - - - - - - - - - H.3.6.2 109
DIE SHEAR- - - - - -- - - - - - - - - - G.5.3.4 105
DICOES-- - - - - - - - - ----- - - 3.10.5.1 6
DIcDES AND RECTIFIER DEFINITIONS- - - - - - A.5 lb
O!ME AND RECTIFIER SYMBOLS - - - - - - B.5 Ord B.5.1 31
DISC TYPE- - - - - - - - - - - - A.3.13 11
DISPOSAL OF SAMPLES - - - - - - - - - E.3.3 5a
DISPOSITION DF FAILED LOT - - - - - - - C.4.2.6 &2
DDCUMENT APPROVAL AND ISSUE - - - - - D.3.5.2 48
DOCUMENT CHANGES - - - - - - - - - - - 0.3.5.3 48
OOCUMENT CONTROL ------ ------- D.3.5 48
OWBLE PLUG CONSTRUCTION- - - - - - - - - A.3.15.1 11
DRAIN- - - - - - - - - - - - - - - - - - h.4.3.3 16
ELECTRICAL AND ENVIRONMENTAL STRESS
SCREENING- - - - -- - - - - - - - - A.8.1 21
ELECTRICAL AND ENVIRONMENTAL STRESS
SCREENING DEFINITIoNS - - - - - - - - A.8 21
ELECTRICAL CHARACTER ISTIC AND RATING TERHS- A.6.3 19
ELECTRICAL PRDBE TEST - - - - - - - - - - - G.5.2.1 102
ELECTRICAL TEST EQUIPMENT VERIF ICATION- - - 0.3.11.6 51
EL!G181LlTY OF PARTICIPANTS - - - - - - F.&.l.l 93
FMITTER - - - - - -- - - - - - - - -- A.6.1.4 15
ENDPOINTS- - - - - - - - - -- -- - - E.6.3 63
ENHANCEMENT-NmE FET- - - - - - - - - - A.4.3.5 16
ENHANCEMENT-MmE DPERATIOII. . . . . . . A.4.3.4 16
ESDCONTROL - - - - - - - -- - - - 3.12 7
ESDPRDGRA34- - - - - - - - - - - - - D.3.15.2 53
ESD SENSITIVITY ------- ------- 4.5 8
ESOS - - - - - - . . . . . . . . . . . E.4.2 .1.1 63
ESDS IDENTIFIER - . . . . . . . . . . . 3.10.3.1 5
EXPANDED METALL1ZATION- - - - - - - - - - - A.3 .42 15
ExTENSIDN OF LIFE-TEST PERICD - - - - - - - C.5.5.2 43
FAILURE EVALUATION FOR JANS - - - - - - - - E.5.5. 69
FAILURE OF LIFE TEST- - - - - - - - - C.5.5.3 43
FAILURES- - - - - - - - - - - - - - C.4.1 .2. C .5.3 61, 42
FET - - - - - - - - - - -- - - - - A.6.3 .6” 16
FETs- - - - ---- - - - - - - - --- A.4.3 16
FET SYMBOLS- - - - - - - - - - - - - - - B.4.2 28
FINAL lNSPECTIDN AND TESTING - - - - - D.3.10.4 51
FORMATION DF INSPECTION LOTS - - - - - E.3.2 57
FORUAROBIAS- - - - - - - - - - - - A.3.14 11
FDRUARD SURGE CLIRRENT - - - - - - - - - A.5.7.1O 18
FULL-WAVE BLOCKING LIFE - - - - - - A.8.5.3 22
FuLL-uAvE HIGH TEAIPERATLIRE BLOCKING BIAS- - A.8.3.3 21
FUNGUS-RESISTANT MATERIAL - - - - - - - H.3.3 109
GATE- - - - - - - - - -- - - - - - - A.4.3 .7, A6.2. I 16, 19
GENERAL- - - - - - - - - - - ---- 2.1, 30, C.2.1, C.4.1, C.5.1, 2, 41, 62
D.2.1, E.2.1, F.2.1 65, 56, 91
G.4.1, G.5.1, N.2.1 101, 102, 108
GENERAL ELEMENTS OF AN DNGDING RELIABILITY
PRDGRAM (CONTINUWS IMPROVEMENT PRDGRAU)- E.6.1.2 70
GENERAL ELEMENTS OF A RELIABILITY PRDGRAM E.6. 1.3 70
GENERAL REQUIREMENTS- - - - - - - - - 3.1 3
GENERAL SEMI CONOUCTDR A08REVlA.TlONS AND
SYMBOLS- - - - - - - -- - - - - B.3 23
GENERAL TEST AND 1MSPECTION 1NFORMATION - E.3 57
GLASS1VATION- - - - - - - - - - - G.4.6.3 102
116
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INDEX
Page
GOVERNMENT DOCUMENTS- - - - - - - 2.2, C.2.2, 3, 41

F.2.2, H.2.2 91, 108
GRU.IPAINSPECT!ON ------------ 3.6.1.6 72
GRLXJP A, SUBGRWP 2, 3, AND 4 TESTS
(PPM cATEGORIES) - - - - - - - - - - D.3.20.3.2 95
GRWPB INSPECTION ------------ E.6.1.7 72
GRIP B, C. D, AND E END POINTS - - - - - E.6.1 .11 7L
GRWPCINSPECTION ----- -------- 3.6.1.8 73
GRCAIP C SAMPLE SELECTION - - - - - - - 3.6.1 .8.1 73
GRWPD!NSPECTION ----- -------- E.6.1.1O 73
GRIP E TESTING REQUIREMENTS- - - - - - - 3.6.1 .10.1 73
GUNNOIC21E--- - - - - - - - -- - - - - A.5.2.2 17
HALF-uAvE BLOCKING LIFE - - - - - - - - A.8.5.2 22
HAL F-UAVE HIGH TEMPERATURE REVERSE BIAS - A.8.3.2 21
HANDLING, STORAGE, PACKAGING, AND OELIVERY- D.3.15 53
HIGH TEMPERATURE REvERSE BIAS - - - - - - A.8,3 21
HOTSOLDERDIP- - - - - - - - - - - - H.4. 1.1.1 110
1DENT1F1CATION- - - - - - - - - - - - 1.3, G.3. 1.4 1, 100
IDENTIFICATION NUHBER - - - - - - - - 1.3.5 2
lDENTIF1 CATION OF SAMPLES - - - - - - - E.4.5 63
lMPATT OICOE (IMPACT, AVALANCHE, AND
TRANSIT TIHE DICOE) - - - - - - - - - A.5.2.3 17
IMPULSE OURATION- - - - - - - - - - - - A.3.45 15
IHPULSE WAVEFORM- - - - - - - - - - - - A.3.43 15
lNCCMING, IN-PROCESS, AND WTGOING
INVENTORY CONTROL - - - - - - - - - - 0.3.1 .3.3 46
INFRARED EMITTING DICCIE - - . . . . . A.7.2.2 20
IM-pROcEss OUALITY CONTROL - - - - - - D.3.1O.2 51
1NSPECTION AND TEST STATUS - - - - - - 0.3.12, D.3 .12.1 52
INSPECTION AND TEST VERIFICATION - - - - D.3.1O.5 51
INSPECTION AND TESTING - - - - - - - D.3.1O 51
INSPECTION LOT- - - - - - - - - - - - - - G.3.1.6
1NSPECTION OF PACKAGING - - - - - - - - E.6.1.12 74
1NSPECTION OF PURCHASED NATERIALS - - - - 0.3.10.1 51
1NSPECTION RWTINE- - - - - - - - - - - E.4.2 62
INSPECTION SU5L0T - - - - - - - - - - - E.3.2.2 57
lNSULATEO -GATE FET - - - - - - - - - - - - A.4.3.8 16
INTERMITTENT OPERATING LIFE - . . . . . . A.8.4.3 22
INTERNAL AUDIT CHECKLIST - - - - - - - - 0.3.17 .1.1 53
INTERNAL AUQIT PRoGRAM - - - - - - - - - D.3.17. I 53
INTERNAL CONDUCTORS - - - - - - - - - H.3.6 109
INTERNAL OUALITY AUDITS - - - - - - - - D.3.17 53
INTERNAL WIRE SIZE- - - - - - - - - - - H.3.1O.2 110
iONIZING RADIATIDN TEsT PROCEDURE - - - - F.3.6.1 92
JAN BRANOEO pREFIX - - - - - - - - - - - 3.10.6.1 6
JAN AND JM4RK1NG ------- ------ 3.10.6 .1.1 6
JAN, JANTX, MID JAMTXV INSPECTION LDT - - E.3.2.1 57
JANHC ANO JANKC ASSEMBLY- - - - - - - - G.4. f..l 101
JANHC MULTIPLE SUBLOTS- - - - - - - - - G.4.4.3 102
JANKC UAFER LOT INSPECTION- - - - - - G.5.2.3 103
JANS ELECTRICAL TEST DATA RETENTION - - - E.3.8 61
JANS lNSPECT!ON LDT - - - - - - - - - E.3.2.3 57
JANSPRUXICT --------- ------ E.3.5,4 65
JANTx ANO JANTXV PRE AND PDST BuRN-IN
ELECTRICAL MEASUREMENTS - - - - - - - E.5.3.2 64
JANTX AND JANTXV PRCOUCT - - - - - - - - 3.5.3 64
JUNCTION, COLLECTDR . - - - - - - - A.4. I.5 15
JUNCTION, EMITTER - - - - - - - - - - - A.6. I.6 15
JUNCTION -GATE -FET - - - - - - - - - - - - - /1.6.3.9 16
JUNCTION TRANSISTORS, t4uLTl JuNcTi0N TYPES - A.6 15
JUNCTION TRANSISTORS, MuLTIJuNcTlON TYPE
SYMBOLS ------------ ----- B.&. l 25
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INDEX
Pnrag,L!p%l Page
LEAD AND TERMINAL FINISH - - - - - - - 3.9; H.4.1 5, 110

LEAD FINISH AND TERMINAL FINISH BASELINE- - H.4.1.1 110
LEAD FORMING FOR JABS ------ ----- E.5.4.3 69
LEAD FORMING FOR JANTX AND JANTKV - - - - E.5.3.5 65
LEAKAGE CURRENT MEASUREMENTS - - - - - - 0.3.20.2.2 54
LETTER SYMBOL TABLE (DICOES AND
RECTIFIERS) ---------- ----- B.5.1.1 32
LETTER SYMBOL TABLE (THYRISTORS)- - - - - B.6.1.1 37
LIFE TEST ------------ ----- C.5 42
LIFE-TEST TIME AND SAMPLE SIZE- - - - - - C.5.4 42
LIGHT CURRENT - - - - - - - - - - - - - A.7.1.4
LIGHT EMITTING OICOE- - - . - . . . . . . . A.7.2,3 21
LINE- --- - - - - - - - - - - - - A.3.46 15
LOT 10ENT1FICATION CCOE - - - - - - - - 3.10.8
LOT RELEASE- - - - - - - - - - - - - 3.4.6 :
LOTS EXCEEDING 100 PPM - - - - - - - - D.3.20 .3.4 55
LOTS RESUBMITTED FOR BURN-IN - - - - - - D.3,13.3.1 52
LDTS SHIPPED PR1OR TO GRWP B CDF4PLETION- - E.6. 1.7.1 72
LDTS SHIPPED PRIDR TO GRWP C CCMPLETIOM- - E.6.1. L7.2 73
LSA DICOE (L IMITEO SPACE-CHARGE
ACCUMULATION OICOE) - - - - - - - - - - A.5.2.6 17
W.INTERMINALS- - - - - - - - - - - - - A.6.2.2 19
MANAGEMENT PLAN ------ -------- F.4.2.2 95
MANAGEMENT REPRESENTATIVE - - - - - - - D.3. I.5 47
MANAGEMENT RESPONSIBILITY - - - - - - - D.3.1, 0.3.1.1 45
MANAGEMENT REVIEW ----- -------- D.3. I.6, F.40.2.1 47, 95
MANUFACTURER- - - - - - - - - - - - G.3.1.3 100
IUIWFACTURER lMPDSED TESTS - - - - - - D.3.10 .2.1 51
MANUFACTURERS DESIGNATING SYMBOL - - - 3.10.7 6
MANUFACTURERS NAME, ABBREV1 AT ION, OR
TRADEMARK- - - - - - - - --- - - - 3.10.11 7
NARKING-- - - - - - - - - - - - - --- 3.10; F.3.8 5, 93
MARKING LEGIBILITY- - - - - - - - - - 3.10.4 5
MARKING ON EACH OEVICE- - - - - - - - - 3.10.1 5
MARKING ON INITIAL CDNTAINER
(UNIT pACWGEI -------- . . . . . . 3.10.2 5
W.RKINGOPTION- - - - - - - - - - - - - - 3.10.12 7
MATCHED PAIR- - - - - - - - - - - - - A.5.2.5 17
METALLIZ ATION INTEGRITY - - - - - - - G.4.6. 1.1 102
METALL12ATION THICKNESS - - - - - - - - H.3.1O.1 110
METALLURGICAL BOND, DICDE CONSTRUCTION,
AND THERMAL MATCHING- - - - - - - - - - A.3.15 11
METALLURCl CAL BOND FDR JANS AX IALS DICOES - H.3.9 110
METALLURGICALLY BONDED-THERMALLY NATCHED-
NONCAVITY-DWBLE PLUG CONSTRUCTION- - - - A.3.15.8 12
METALS- - - - - - - - - -- - - - - H.3.4 109
MICRWAVEEllrnE - - - - - - - - - - A.5.2.6 17
M1CRC61&VE D1C21E SYMBOLS - - - - - - B.5.2 33
MICRCAAAVE DlrnES ------ ------ A.5.2 17
M!L-STD-750 DETAILS - - - - - - - - A.3.5 11
MIXERDIWIE - - - - - - - - - - - A.5.2.7 17
MDSFET- - - - -- - - - - - - - - A.6.3.10 16
HULT!PLE CRITERIA - - - - - - - - - - - C.6.2.4 62
N-CHANNELFET - - - - - - - - - - A. L.3.11 16
N-GATE THYRIsTOR- - - - - - - - - A.6. I.3 18
NEGATIVE DIFFERENTIAL RESISTANCE REG1ON A.6.3.3 19
NEUTRON [RR~]ATl ON TEST procedure - - - F.3.6.2 93
NOISE FIGURE- - - - - - - - - - A.3.16
NONCONFORMANCE- - - - - - - - - - E.6.1.5 :
NONDESTRUCTIVE TESTS - - - - - - - - E.3.5 59
NON-GOVERNMENT STANDARDS AND OTHER
puBLIcAT!ONS - - - - - - - - - 2.3, D.2.1, E.2.3 3, 65,56
118
I
M[L-PRF-19500K
Paragraph Page
NoTES ------------- ------ 6 a

OFF IMPEDANCE --------- ------ A.6.3.6 19
OF E STATE ---------- ------- A.6.3.5 19
ONE-HUNDRED PERCENT INSPECTION- - - - - - c.4.2.5 L2
ON! MPEDANCE --------- ------- A.6.3.6 19
ONSTATE- - - - - - - - --- - - - A.6.3.7 19
OPEN CIRCUIT- - - - - - - - - - - - - - A.3.17
OPERATING LIFE- - - - - - - - - - - - - k.a.b ;;
OPTO-CWPLERS -------- ------- A.7.3 21
OPTOCWPLER (PHOTOCWPLER AND OPTO-
ISOLATOR) SYMBOLS-- - - - - - - - - - S.7.4
OPTOELECTRONIC DEVICE - - - - - - - - - A.7.1 20
OPTOELECTRONIC DEVICE DEF1N1TIONS - - - - - A.? 20
OPTOELECTRONIC DEVICE SYMBOLS - - - - - - 0.7 and B.7.1
DROER OF PRECEDENCE - - - - - - - - - - 2.4; c.2.3, E.2.4, 3, 41, :
F.2.3. H.2.3 91, 10s
ORGAN1ZATION - - - - - - - - - -- - - - D.3. li2 46
DTHER GOVERNMENT DOCUMENTS, DRAWINGS, AND
PUBLICAT!DNS- - - - - - - - - - - - - 2.2.2 3
P-CHANNELFET - - - - - - - - - - - - A.4.3 .12 16
P-GATE THYRISTOR- - - - - - - - - - - A.6. I.4 19
PACKAGE- - - - - - - - - - - - - - H.3.2 109
PAcsAcE ELEHENT (OTHER THAN LEAD 0s
TERNINAL) FINISH- - - - - - - - - - - H.3.11 110
PACKAGE TYPE- - - - - - - - - - - - - - A.3.18 12
PACKAGED SANPLE IDENTIF1 CATION- - - - - - G.5.3.1.2 105
PACKAGED SAMPLE TESTS - - - - - - - - - - G.5.3.1 1Ob
PACKAGING- - - - - - - - - - - - - - - 5, 5.1; G .6, G.6.1 8, 51, 105
PARTS PER M1LL1ON (PPM) VERIFICATIDN - - - D.3.20.3 95
PARTICIPANTS PREPARATION FOR CERTIFICAT1ON- F. G. 1.1.2 96
PDA- - -- - - - - - - - - - - - - --- E.5.2 64
PEAK IMPULSE CURRENT- - - - - - - - - - A.5.7.5 18
PEAK POINT- - - - - --- - - - - - - - - A.6.2.1 16
PERFORMANCE CHARACTERISTICS - - - - - - - G.4.5 102
PER FDRHANCE REQUIREMENTS - - - - - - - - 3.3 L
PERICOIC TESTING- - - - - - - - - - - G.5.3.5.1 10s
PERSONNEL- - - - - - - - - - - - - - D,3.1.3. k 47
PERSONNEL PERFORMING QUALITY OPERATIONS - D.3.18.1 94
PHOTOCONDUCTIVE D1rnE - - - - - - - - - - A.7.1.5 20
PHOTOCURRENT- - - - - - - - - - - - A.7.1.6 20
PHOTEQARLINGTON CWPLER - - - - - - - - A.7.3. I 21
PHOTCOIIXJE- - -- - - - - - - - - - - - A.7. I.7 20
PHOTCOIrnE, AVALANCHE - - - - - - - - A.7.1.8 20
PHOTCiI1rnE CWPLER- - - - - - - - - - - A.7.3.2 21
PHDTOEMITTER- - - - - - - - - - - - - A.7. I.9 20
PHOTOEMITTING DEVICE SYMBOLS- - - - - - B.7.3 39
PHOTOEMITTING DEVICES - - - - - - - - A.7.2 20
PHOTOSENSITIVE DEVICE - - - - - - - - - A.7.1.1O 20
PHOTOSENSITIVE DEVICES- - - - - - - - - - B.7.2 39
PHOTOTHYRISTOR- - - - - - - - - - - - - - A.7.1 .11 20
PHOTOTHYRISTOR CWPLER- - - - - - - - - A.7.3.3 21
PHOTOTRANSISTOR - - - - - - - - - - - A.7.1 .12 20
PHOTOTRANSISTOR CWPLER - - - - - - - - - A.7.3.4 21
PHOTOVOLTAIC OICOE- - - - - - - - - - A.7.1 .13 20
PHYSIC&L STRUCTURE TERMS- - - - - - - - - A.6.2 19
PIN- - - - - - - - - ---- - - - 3.lD.6 6
PIND TEST FOR JANS DEVICES- - - - - - - E.5.4.2 69
POLARITY HARKING OF UNIDIRECTIONAL
OICOES AND THYRISTORS - - - - - - - - 3.10.5 5
PoJERBURN-IN- - - -- - - - - - - - - A.8.2 21
P* cusTct4ER CORRELATION - - - - - - . 0.3.20 .3.5
119
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Paragra* Page
PPMQU&LITY LEVELS ------ ------ D.3.20 .3.1 95

PRE-CAP VI SEAL --------- ------ G.5.3 .1.1 104
PRE-CERTIF ICATION REVIEU - - - - - - - - F.4.3. I.1 96
PREPARATION OF THE ASSOCIATED DEVICE
SPECIFICAT ION --------- ----- F.4. 1.1.1 94
PRESERVATION OF LOT IDENTITY- - - - - - - E.3.9 61
PRINcIPAL CURRENT - - - - - - - - - - - A.6.3.8 19
PRINCIPAL VOLTAGE - - - - - - - - - A.6.3.9 19
PRIMC IPAL VOLTAGE-CURRENT CHARACTERISTIC
(PRINCIPAL CHARACTERISTIC)- - - - - - - A.6.3.1o 19
PROCEOURE IN CASE OF TEST EQUIPMENT FAILURE
ORNUNANERROR - - - - - - - - - - - E.3.7.2 61
PROCEDURE TO BE USED IF NUMBER OF 08 SEA!VED
FAILURES EXCEEDS THE ACCEPTANCE NuMBER- - C.5.5 42
pROCESS control ------ -------- D.3.9 69
PRDCESSFLU,IS - - - - - - - - - - - - - D.3.2.2 L7
PROCESS CONTROL REQUIREMENTS FOR ALL
DICOES, RECTIFIERS, AND ZENERS- - - - - D.3.20.2 54
PROCESS MONITOR PROGRAMS - - - - - - - - D.3.9.2 49
PRCOUCT lDENTIF ICATION AND TRACEABILITY - D.3.8 49
PULSE --- - - - - - - - - - - - ----- A.3.19 13
PULSE AVERAGE TIME- - - - - - - - - - - - A.3.20 13
PULSE DELAY TIME----- --------- A.3.21 13
PULSE FALL TIME - - - - - - - - - - - - A.3.22 13
puLsER15E TIME ------ -------- A.3.23 13
PULSE STORAGE TIME- - - - - - - - - - - A.3.24 13
PULSE TIME--- - - - - - - - - - - -- A.3.25 13
PURCHASE DRDER REOUIREMENTS - - - - - 6.1.1 8
PURCHASING - - - - - - - - - -- - - - - D.3.6 48
OPL- - - -- - - - - - - - - - - - F.4.3 .1.2.3 99
OuALIFIcATrON - - - - - - - - - - - 3.6, 6.3; E. f., G.4.3 48 9, 62, 101
WALIF1 CATION AND CONFORMANCE
1MSPECTION - -- - - - - - - - - - - D.3.10 .4.1 51
OUALIF ICATION BY EXTENS1 ON- - - - - - - - 3.4.2.2 63
QUALIF1 CATION INSPECTION- - - - - - - - 3.4.1 62
QUALIFICATION REQUIREMENTS- - - - - - - - G.4.3.1
OUALIFICATIDN To ESDS CLASSES - - - - - - E.4.2.1 62
C3UALITY LEVEL FOR EnCapSUlate cIEvIcEs- - - 1.3.1 2
QU&LITY LEVEL FOR UNENCAPSULATED OEVICES- - 1.3.2 2
QUALITY PLANNING ----- -------- D.3.2.6 67
MJALITY RECORDS ------ -------- D.3.16 53
OUALITYSYSTEM - - - - - - - - - - - - 4.1, 0.3.2 7. 67
QUALITY SYSTEM PROCEDURES - - - - - - - D.3.2.3 47
QUALITY SYSTEM PROGRAM - - - - - - - D,3 47
QUALITY SYSTEM REQUIREMENTS - - - - - - - - 0.3.2.1 47
RADIANT EFFICIENCY- - - - - - - - - - - A.7.2.4 21
RADIATIDN FAILURES- - - - - - - - - A.3.26 13
RADIATIDN HARONESS AsSURANCE (RHA) - - - - A.3.27 14
RADIATIDN HARDNESS ASSURANCE PART MANAGER
(RHAPM)- - - - - --- - - - - - - - - F.4.1 93
RAD1ATION HARDNESS ASSURANCE PART MANAGER
PROGRAU - - - - - -- - - - - - - - F.4 93
RADIATION HARDNESS PROGRAM- - - - - - - - F.3 91
RAD1ATION TEST PROCECIURE- - - - - - - - - F.3.6 92
RATING- - - - - - - --- - - - - - - - - . A.3.28 14
RECTIFYING AC INTERMITTENT OPERATING LIFE - A..S.6 .3.1 22
RECTIFYING AC OPERATING LIFE- - - - - A.8.4.1 21
RECTIFYING kc 9cwsR BURN-IN - - - - - - - A.8.2.1 21
REFERENCE TO ASSOCIATED SPECIF1 CATION - - 3.6 4
REJECTED LOTS- - - - - - - - - - - D.3.13.3 52
120
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Paragraph Page
RELIABILITY AND ONGOING RELIABILITY

(cONTINucus lMpROVEMENT PROGRAM) GUIDANCE
CR IBERIA ------------ . . . . E.6.1.1 70
REPETITIVE PEAK PULSE PCfdER - - - - - A.5.7.7 18
REQUIREMENTS ----------- ----- 3; G.4 3, 101
REQUIREMENTS FOR JANS TRANSISTOR STRUCTURE- I(.3.1O 110
RESWRCES ----------- ------ 0.3.1.4 47
RESPONSETIHE - - - - - - - - - - - - - - A.5.7.8 18
RESPONSIBILITY AND AUTHORITY - - - - - - D.3.1.3 Lb
RESPONSIBILITY FOR [NSPECTION - - - - - - G.5. 1.1 102
RESPONSIBILITY OF THE MANUFACTURER - - - 0.3.1 .3.2 4b
RESUBMITTED LOIS - - - - - - - - - - - - E.3. b 61
RESUBMITTED LOTS OF JANS- - - - - - - - - E.3.6.1 bl
RESUBMITTED LoTS OF JANTXV, JANTx, AND JAN- E.3.6.2 61
RESUBFtl TTED LDTS OF JANSM, JAMSO, JANSL,
JANSR, JANSF, JANSG, JANSH, JANTX9U,
JANTXVD, JANTXVL, JANTXVR, JANTXVF,
JANTXVG, AMO JANTXVH- - - - - - - - - - E.3.6.3 61
RETENTION FOR RHAPM - - - - - - - F.4.3. 1.3 99
RETENTIDM OF RECORDS- - - - - - - - - G.5. 1.2 102
REVERSE BIAS- - - - - - - - -- - - - - A.3.29 16
REVERSE BLOCKING DIWE THYRISTOR- - - - - A. b.l.5 19
REVERSE BLDCKING lMPEOANCE - - - - - - A.6.3 .11 20
REVERSE BLOCKING STATE- - - - - - - - - - A.6.3.12 20
REVERSE BLDCKING TRIWE THYRISTOR - - - - - A.6. I.6 19
REVERSE CONDUCTING DICOE THYRISTOR - - - A.6.1.7 19
REVERSE CONDUCTING TRICOE THYRISTOR - - - - A.6. I.8 19
REWRX DF ASSENBLED DEVICES - - - - - - D.3.13 .2.2 52
REWRKPROVISIDNS ---- --------- D.3. 13.2 52
REWRKEDPRrnUCT - - - - - - - - - - D.3.13. I 52
RHA DESIGN, PRDCESSING, ASSEMBLY, lESTING,
AND EQUIPMEN1 INSTRUCTIONS- - - - - - - F.3.4 92
RHADESIGNATDR- - - - - - - - - - - - - - 1.3.3 2
RHAMANAGEMEN1- - - - - - - - - - - - - F.3.2 92
RHAPRDGRAM- - --- - - - - - - - - - - 4.3: F.3.1 7, 91
RHA PROGRAM PLAN ------ -------- F.3:3 92
RHARECDROS - - - - - - - - - - - - - F.3.7 93
RHAPM CERT1F1CATION - - - - - - - - F.4.3.1 128
RHAPM CERTIFICATION AND LABORATORY
SUITABILITY - - - - - - - . . . . . . F.4.3 .1.2 96
RHAPM VERIFICATION REW31REMENTS - - - - F.4.2 95
SANPLE ACCEPTANCE ----- -------- G.5.3 .1.3 105
SAHPLESIZE --- - - - - - - - - - - - c.4.2.1 41
SATURATION- - - - - - - - - - - - - - A.4.1.7 16
SCDPE- -- - - - - - - - - - - --- 1, 1.1: Al, A. 1,1, B.1, B.1. 1, 1, 10, 23
[.1, C.1.l., D.1, D.1.1, El, E.1.l., 41, 45, 97
F.1, F.l. l., G. I., G.l .1, 91. 100
H.1, H. 1.1. 108
SCREENING- - - - - - -- -- - - - - E.5. 3.5.1. G.4.2, G.5.2 64, 101, 102
SCREUTHREADS - - - - - - - - - - - 109
SECURITY OF CCNIPLETED DEVICES - - - - - D.3.15.1 53
SELECTION OF SPSPLES- - - - - - - - - - C.4. I.1, c.5.2, E.4.4 61, 42, 63
SEMI CDNDUCTDR CC+!J40N DE F! NIT IDNs- - - - - A.3 10
SEM!CDNDUCTDR DEVICES - - - - - - - - A.3.30 15
SEMICONDUCTOR DICOE - - - - - - - - - A.3.31 14
SEMICDNOUCTDR JUNCTION- - - - - - - - - A.3.32 14
SEMICONDUCTOR RECTIFIER DICOE - - - - - - A.5. 1.1 17
SEMI CONDUCTOR SIGNAL DICOE- - - - - - - - A.5.1.2 17
SEPARATE SAJIPLES ------ -------- G.5.3.5.2 105
SER1AL1ZATION- - - - - - - - - - - 3.10.9 6
SERVICING- - - - - - - - - - - - - D.3,19 94
SHDRTCIRCUIT - - - - - - - - - - - - - A.3.33 14
121
MI L- PRF-19500K
1 NDEX
Paragrap% Page
SIGNAL DIwES AND RECTIFIER O1mES- - - A.5.1 16

SILICON TRANSISTOR METALL12A11OM PROTECTIVE
COAT ING ------------ ----- H.3.7 109
SILVER ------------- ------ H.6. 1.1.2. 110
SINGLE-LOT SAMPLING HETHCO- - - - - - - - C.6.2 41
WALLS IGNAL ----------- ----- A.3.34 14
SOLDERABILITY - - - - - - - - - - - - - 3.11 7
SWRCE- - - - - - -- - - - - - - - - A.4.3 .13 16
SPCPROGRm - - - - . . . . . . . . . D.3.20.1 94
SPECIAL !!ARKING ------ -------- 3.10.3 5
SPEC!FICATIOMS, STAMOARDS, AND 2.2.1; C.2.2 .1, 3, 41
HANOBmKS - - - - - - - -- - - - - - F.2.2 .1, H.2.2.1 91, 108
STANDARD MIXER DICOES AND HDLDERS - - - - E.3.7.3 61
SIANDSY CURRENT ------ -------- A.5.7.6 18
STATISTICAL SAMPLING PROCEDURES AND TABLE - C.4 41
STATISTICAL TECHNlOUES - - - - - - - D.3.20 94
STEADY-STATE DC BLOCKING LIFE - - - - - - A.8.5.1 22
STEAOY- STATE DC HIGH TEMPERATURE REVERSE
BIAS- - - - - - - - - -- - - - - - - - - A.8.3.1 21
STEADY-STATE DC OPERATING LIFE- - - - - - A. E.4.2 21
STEWY-STAIE DC PWER BuRN-l N - - - - - - A.8.2.2 21
STDRAGE - - - - - - - - - - - - - - - G.5.4 105
STORAGE TEMPERATURE - - - - - - - - - - - A.3.35 14
STRUCTURALLY IDENTICAL DEV!CE TYPES - - - E.3.2.4 58
SUFFIX LETTERS- - - - - - - - - - - - - 1.3.6 2
SUMMARY OF PARTS FALLWT- - - - - - - - E.3.8.1 61
SUPERSESSIDN lNFORltAT1ON- - - - - - - - - 6.2 9
SURGE- - - -- - - - - - -- - -- - - A.8.9 22
SUITCHING OUADRANT- - - - - - - - - - - A.6.3 .13 20
SYMBDLS- - - - - - - - -- -- - - - - - B.3.2, C ,3.2 23, 41
TEMPERATURE COEFFICIENT - - - - - - - - A.3.36 14
TEMPERATURE CYCLING - - - - - - - - - G.5.3.3 105
TEMPERATURE CYCLING (AIR TO AIR]- - - - - A.8.6 22
TEST EQUIPMENT MAINTENANCE AND
CALIERATION SYSTEM - - - - - - - - - D.3.11.2 51
TEST MCDIF1 CATION, REDUCTION, OR
ELIM1N4TION - -- - - - - - - - - 4.4 7
TEST PROGRAM AND SETUPS - - - - - - - - - D.3. 11.1 51
TESTING AND SCREENING OPERAT!DNS - - - - D.3.1O.3 51
THERMAL CC94PRESS1ON BOND- - - - - - - - - - A.3.37 14
THERMAL EOUILIBRIUM - - - - - - - - A.3.3.S 14
THERMAL lMPEOANCE MEASUREMENTS - - - - D.2.20 .2.1 56
THERMAL RESISTANCE- - - - - - - - - - A.3.39 14
THERMAL RESPONSE- - - - - - - - - - - - A.8.8 22
THERNAL SHOCK 1L1OU1D TO LIQUID) - - - A.8.7 22
THERMALLY HATCHEO AXIAL LEADED D1lXIES - - A.3.15.7 12
THYRJSTOR - --- - - - - - - - . . A.3.40 and A.6. I 14, 18
THYRISTDRS- - - - - - - - -- - - - - - - - 3.10.5.2
THYRISTOR SYMBOLS - - - - - - - - - B.6 and B.6.1
TIN AND TIN-LEAD PLATE- - - - - - - - H.4. 1.1.3 110
TRACEABILITY - - - - - - - - - - - 3.13 7
TRAINING - - - - - - - - - --- -- D.3.18 94
TRAINING REQUIREMENTS - - - - - - - - - D.3.18.2 94
TRANSl ENT VDLTAGE SUppreSSOr SYMBDLS - - - - B.5.7 34
TRANSIENT VOLTAGE SUPPRESSORS - - - - - - A.5.7 18
TRANSISTOR- - - - --- - - - - - - - A.3.41 14
TRANSISTOR DEFINITIONS- - - - - - - - A.4 15
TRANSISTDR SYMSDLS- - - - - - - - - - B.4 25
TRAPATT D1C9E (TRAPPED PLASMA AvALANCHE
TRANSIT TIME DlrnE- - - - - - - - - - A.5.2.8 17
TUNINGDICOE- - - - - - - - - - - - - - A.5.6.2 18
TUNNELD1rnES- - - - - - - - - - - A.5.3, A.5.3. I 17
122
MI L-PRF-19500K
INDEX
Parngraph Page
TUNNEL DICOES AND BACS!JARD DICQE SYMBOLS- B.5.3 33

TURN OFF THYRIS1OF------- ------ A.6. 1.9 19
UN IJUNCTION TRANSISTOR- - - - - - - - - - - A.4.2.2 16
uNIJLViCTIDN TRANSISTORS - - - - - - - - - - A.L.2
uN1JUNCTION TRANSISTDR SYMBOLS- - - - - - - B.4.3 :
I
I
VALLEY PO I NT --------- ------- A.4.2.3 16
VARACTORDICOE- - - - - - - - - - - - - A.5.6. I 128
VARACTOR DICOE SYMBOLS- - - - - - - - B.5.6 34
I VARACTOR DICOES ------ -------- A.5.6 18
VARISTOR- - - - - - - - - - - ---- A.5.7.1 18
VER1FICATION - - - - - - - - - - - - - 6. 7
VERIF ICATION PROVIS1ONS - - - - - - - - - - G.4.6. G.5 101, 102
VIRTUAL FRONT OURATION- - - - - - - - - A.3.4i. 15
vISUAL 1NSPECTION - - - - - - - - - - G.5.2.2 102
vOLTAGE OVERSHD3T ---- --------- A.5.7.9 18
vOLTAGE-REFERENCE OICOE - - - - - - - - A.5.4. I 17
VOLTAGE-REGULATOR ANO VDLTAGE- REFERENCE
DfrnESYMBDLS - - - - - - - - - - - - - - B.5.6 33
VOLTAGE-RESULATDR AND VOLTAGE-REFERENCE
DICOES - - - --- - - - - - - - - - - - A.5.4 17
VOLTAGE-REGULATOR DICOE - - - - - - A.5.4.2 17
UAFER FABRICATION ----- -------- D.3. 1.3.1.4 66
UAFERLDT - - - -- - - - - - - - E.3.2 .3.1, G.3. 1.5 57, 100
wAFER LOT ACCEPTANCE- - - - - - - - - - - E.3.2 .3.2 57
U&FER LOT 1NSPEC11ON (JANS ONLY)- - - - - - D.3.9.3 50
UAFERREWRK - - - - - - - - - - - D.3. 13.2.1 52
uIREBoNDS - - - - - - - - - - - H.3.6.1 109
WRKING PEAK VDLTAGE- - - - - - - - - 50.7.11 of appemlix A 18
123
M! L-PRF-19500K
Figure Title Page
1. Pulse me. surerents. 13

2. Exan@e of expandd metal libation. 15
3. Order of procedure diagram for JAN, JANTX, and JANTXV device 64
tWs (see 4.6.3).
AlternBte order of procedure diagram for JAN, JANTX, and 67
JANTXV device types (see 4.6.3.1).
5. Order of procedure diagr~m for JAMS. 6s
6. Specification development f~ow. 94
7. Prcduct deve[oprent ft... 97
8. MI L- PRF-19500 appendix H flowchart. 107
Table
1. Sam@e p(ans. u
11. Verification requirements. 74
[11. Testing guideiims for changes to a cpmlifieo product. 74
Iv. Screening requirarents. 76
v. Group A impect ion. 81
VI.. Group 8 inspection for JANS devices. 81
VIb. Group ,5 inspectim far JAN, JANTX, Brd JANTXV devices. 85
VII. Group C pericdic inspection (all quality Ieve[ s). 87
VIII. Group O (RHA tests). 89
Ix. Group E inspections (all quality (eve(s) for qua(iff cation onLy, 90
x. Data guidance for JANS devices. 90
x1. Electrical sampling for JANHC. 103
X11. Elecrrica( sampling for JANXC. 103
x111. Periodic tests md c.mti”uatio” of JANXC Cl. 104
Xiv. Storage life verification tests. 104
xv. Age-tire and temperature. 106
Xvl Lend finish systems. 111
XVII. C.aati”g thickness and ccopc.s ition req. irm’rems. 112
XVIII. Package element (other than (eadsltermimls) finish systems. 113
126
MI L-PRF-19500K
CONCLUDING MATERIAL
Custcdi.ms: Preparing activity:

Arrrrf- ER DLA Es
Navy - EC
Air Force - 17 (Project 5961-1727)
NASA - NA
Review activities:
Anlrf - AR, MI, SM
NiJvy - AS, CG, UC
Air Force - 13, 19, 85, w
DLA - ES
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The downentat i on end process [INCH-PUJNCI]

PERFORMANCE SPECI F I CAT 10N

SEM1 CDNDUCTOR DEVICES ,

GENERAL SPECIFICATION FOR

This specification is approved for use by at ( Depart-

I 1.3 The part nw!bering schemes are as fol lows:

__T___L J_ J__ -!-

1.3.5 ]t is reccometied that each type of semiconductor device intended for

2.2.1 ~. The following specifications, stnrdards, and h.arnibooks

(See swlement 1 for iist of associated specif ications. )

MI L-STD-7S0 - Tesr Methcds for Semiconductor Devices.

MI L-STD- 1835 - Microcircuit and Se!nicorductor Case Outlines.

ELECTRONIC INDUSTRIES ASSOCIATION (E IA)

EIA-625 Distributor Requireirenrs for Handling E(mtrostatic Discharge Sem. itive

JEDEC Publication 109 - Generat Requiremmt for Oistrititors.

3.3 It shall be demonstrated that parts delivered to this specification shaii

(1) Manufacturer, s name .rd address.

(2) Customer, s or distributor, s name ard address.

(3) Device type, quality level, and associated specificaticm nurb.er.

(4) Lot identification code (inc(uding assembly plant cede).

(5) Inspection dare.

(6) ‘W.a. tiry of devices i“ shipnent fran manufacturer.

(7) Statment certifying prcduct conformance and traceabi 1 ity.

(8) Signature and date of tr.sm.action.

(9) So(derebi ( icy rei.spectio” date, if app( icnble.

b. Distributor documentation for each distributor:

(1) Distri Lumor Os nams am+ address.

(2) Nams ad address of custcmmr.

(3) Ouanrity of devices in shipment.

(5) Signature and date of transaction.

(7) Solderabi ( ity reinspection date, if awl i cable.

8. Po(arity marking, when p@icabLe (see 3.10.5).

b. PIN (SW 3.10.6).

c. M.mufacturerns “am.?, trodemark, or identification (see 3.10.11) ard Manufacturerns designating

e. Seria( .urb.?r, if epplicab(e (see 3.10.9).

f. Cc4mtry of origin (see 3.10.10).

9. swi.~ ~rki.g (see 3.10.3). BerYLli~ oxide identifier (see 3.10.3.2).

h. E1ectrostntic discharge sensitivity (ESDS) identifier (optional see 3.10.3.11.

c. C(ass 3: 6,000 V to 15,%9 V - no designator.

d. Nonsensitive: Above 15,999 V - no designator

3.10.3.2 Rsryttim oxide ~. If a semiconductor package conrai”s beryl I iun oxide

3.10.5 p.a[aritv ~. The pol~rity shall be indicated by one

c. An ESD identifier may be used to indicate pn(arity for sensitive devices.

4.2.1 The inspection req. imare.ts specified herein are classified es

a. Qua\ificatic.n inspection (see appendix E).

b. Screening (see appendix E).

c. Conformance inspection (c I)(see a~rdix E).

a. Tit(e, nunber, ad date of this specification.

c. Pnckaging requirnrents (see 5.1).

d. PIN (see 1.3).

9. Data requi r-m?., when Bppl icabte.

h. S~cify point of shi~nt.

i. PIND scree”img when required.

6.2 Devices covered by associated specifications are substitutable for the

Supersess ion and cross reference data.

Mititary Manufacturer, 5 Manufacturer,. arm+ .ser, s

Doub(e P(W construction

T_L J_ J__ -!-