From Sand To Silicon - The Fascinating World of Semiconductors
From Sand To Silicon - The Fascinating World of Semiconductors
From Sand To Silicon - The Fascinating World of Semiconductors
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Say, the search for an Ideal System that has the following features:
Silicon Chip ( VLSI – Very Large Scale Integrated Circuit ) meets or at least is nearer to
these criteria and that is what makes VLSI so important. Silicon has a unique property, it
can change the flow of electricity passing through it by a process called DOPING. That
is, depending upon the doping, it may conduct electricity through it or may act as
insulator thereby not allowing the electricity to flow through it. Hence the name
Semiconductor.
It is this unique property of silicon that today every human activity - be it leisure, sports,
entertainment, travel, study, welfare, warfare, science or even art, everything revolves
around this VLSI or so called silicon chip. Ever since the invention of the first chip in the
year 1958, more and more electronics is being integrated into smallest possible size. So
you have world of miniaturized mobile phones, pen cameras, watches, laptop and palm
top computers and what not. And this surely is not the end of miniaturization. There is
and shall ever remain a need for better VLSI techniques to give us better products.
What is after all this VLSI - which has also and rightly been called by someone as the
crude oil of Twenty First Century because VLSI chip is the nerve center for all electronic
system - be it defense, space, telecom or industrial systems.
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Name : Parveen Bangotra
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And, what is the raw material for such a revolutionary product?
SAND.
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Name : Parveen Bangotra
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The process of VLSI Design involves extensive use of EDA (Electronic Design
Automation) software to design circuits from an idea or a concept or an existing
electronic system. While most Chip Designers will never be confronted with the details
of the chip manufacturing process, some insight and understanding of the chip
manufacturing is important.
Interface between Design (Chip Designer) & chip manufacturing (Process Engineer –
the one who is to process the wafer ) is an Optical Mask. These Optical Masks can be
thought of as a stencil. These Masks define the patterns, that when transcribed as
various layers on semiconductor material, would form the electronic devices and
connecting wires. These patterns on the Masks have to strictly adhere to some
constrains like minimum width and distance. These are called Design Rules. If a
Designer adheres to these Rules, he gets a guarantee that his circuit will be
manufacturable.
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Name : Parveen Bangotra
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have written the success stories of the miniaturized electronic world - be it mobile
phone, micro camera, computers, printers, DVDs watches or washing machines.
The process of VLSI Fabrication is a highly complex process carried out under
extremely stringent parameters of temperature, humidity, cleanliness and infrastructure
stability. When you are dealing with 0.6 or 0.8 micron, (One Micron = One Thousandths
of a Millimeter Or App. One hundredth of a Human Hair Diameter) even a speck of dust
or a little vibration can create havoc with the process.
Reducing the size of chip structures leads to faster chips, lower power consumption and
reduced heat dissipation. In smaller circuits, the electrons travel shorter distances
between components on the core resulting in faster processing. Fewer electrons flow
through smaller circuits requiring less current to carry signals. This enables the chip to
operate at a lower voltage resulting in lower power consumption or longer battery life.
However, there are limits to size reduction. The wavelength of ultraviolet light used in
current lithography is 0.248 microns, the same measure as today's 0.25-micron chip
circuits. With some adjustments in the equipment, ultraviolet light can produce circuits
as thin as 0.18-microns. For smaller geometries electron beam and even X-ray
lithography is being used for producing smaller circuits.
Although the complete VLSI fabrication process is a highly complex in nature, one can
attempt to divide this in following basic steps:
1st Step:
Silicon wafer is heated in an oxygen rich furnace so that a
layer of silicon oxide is formed on the top surface of wafer.
2nd Step:
A thin coating of photographic emulsion is applied over the
oxidized surface of the wafer. This is followed by a dry and
bake stage so that the photographic emulsion also known
as photoresist becomes hardened.
3rd Step:
At this stage VLSI Design Input is used to make
Optical Masks. Fundamental building block of a VLSI
Design is a TRANSISTOR. These Optical Masks can
be thought of as a stencil having transparent and
opaque regions that define the doping regions to build
transistors; connecting routes; cross connections etc.
Depending upon circuit design, there could be 10-20
photomasks to be used. Through a chain of process,
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optical reticle is generated which is further processed to generate working photomasks.
These masks are used in Wafer Fabrication for selective etching of silicon wafer.
Photomask is aligned with the wafer and is exposed to light so that photoresist surface
of the wafer gets selectively exposed and developed as per the photomask design.
4th Step:
A highly sophisticated chemical process selectively
etches the surface of the wafer leaving behind the parts
that are masked by the resist material. When the
required etch depth is achieved the wafer is stripped of
the resist and washed clean.
5th Step:
Since the complete Integrated Circuit is made up of the transistors. Now the transistors
have to be formed on the silicon wafer. This is achieved by a process known as Doping.
By doping the conduction / resistance of the silicon wafer is modified so that transistors
can be formed.
6th Step:
In order to produce a functional circuit, the transistors formed by Doping are to be
interconnected. This is achieved by depositing fine wire traces made from aluminum or
copper to connect up the transistors in a correct way.
7th Step:
The processed wafer goes for testing as per the test program where each die on a
Wafer is probed and marked as good or bad die.
8th Step:
The wafer is scribed and broken into dice. Good dice go for packaging.
9th Step:
Good dice are packaged as per the packaging requirement.
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Name : Parveen Bangotra
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Since the fundamental building block of any VLSI Design is a TRANSISTOR. By using
the above steps, transistor is formed that can be diagrammatically depicted as below
By applying the above depicted arrangement, transistor can be switched OFF or ON.
This is the behaviour of a Switch. That is “ON” or “OFF” ; 1 or 0. That is Boolean
algebra.
The semiconductor industry produces many kinds of chips, which go into today's
electronic products. Some of these are Microprocessors which act as brains of
computers; Dynamic Random Access Memory chips (DRAMs)-these are memory chips
and can retain memory only as long as they receive power; Programmable memory
chips (EPROMs, EEPROMs, and Flash) and ASICS i.e Application Specific Integrated
Circuits i.e. Chips made for specific purpose.
References:
www.appliedmaterials.com
http://www.sia-online.org/cs/about_sia
www.iroi.sev.edu.cn
www.columbia.edu
www.ncnanotechnologiey.com
http://www.processpecialties.com/siliconp.htm
www.pcplus.techradar.com
http://pcplus.techradar.com
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