Seminar Report.1
Seminar Report.1
Seminar Report.1
SEMINAR REPORT
Submitted By
CERTIFICATE
The satisfaction that accompanies the successful completion of the task would be put
incomplete without the mention of the people who made it possible, whose constant guidance
and encouragement crown all the efforts with success.
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ABSTRACT
Engineering ceramics are widely used in many fields for their excellent merits, such as higher
hardness and strength, good abrasive resistance, and lower thermal conductivity and expansion
coefficient. Improving the surface quality and machining precision has increasingly become a
critical task in the precision manufacturing of those engineering ceramics components.
Correspondingly, lots of finishing methods were put forward, among which lapping is a very
important processing method, directly affecting machining quality, precision, and efficiency of
precision components. Due to some drawbacks of free-abrasive lapping such as deep scratches
on the lapped surface, lower lapping efficiency for lower lapping speed, severe waste of
abrasive, high-processing cost, and so on, conventional fixed-abrasive lapping (CFL)
technology was proposed and developed. Meanwhile, considering the unique advantages of the
ultrasonic-assisted machining during the processing of those hard and brittle materials and the
effect of ultrasonic vibration on the self-sharpening characteristic of abrasive pellet, a novel
ultrasonic-assisted fixed-abrasive lapping (UAFL) technology is put forward and
corresponding lapping device for engineering ceramics cylindrical part is developed.
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CONTENTS
List of Tables ⅵ
List of Figures ⅶ
List of Abbreviations ⅷ
Notations ⅸ
Chapter Titles
1. Introduction 1
2. Literature Review
2.1 Lapping 2
2.2 Free Abrasive Lapping 3
2.3 Fixed Abrasive Lapping 4
2.4 Ultrasonic Machining 5
3. Experimentation
3.1 Ultrasonic-Assisted Fixed-Abrasive Lapping Device 6
3.2 Test Conditions 8
Conclusion 13
Reference 14
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LIST OF TABLES
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LIST OF FIGURES
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LIST OF ABBREVIATIONS
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NOTATIONS
k Elastic Coefficient
Ra Surface Roughness
t Vibration Time
T Screw Pitch
δ Depth Of Cut
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CHAPTER 1
INTRODUCTION
Engineering ceramics have been widely used in many fields for their excellent merits, such as
higher hardness, strength, good abrasive resistance, lower thermal conductivity and expansion
coefficient. Improving the surface quality and machining precision has increasingly become
the critical task in the precision manufacturing of those engineering ceramics components.
Correspondingly, lots of finishing methods were put forward, among which lapping is a very
important processing method, directly affecting machining quality, precision, and efficiency of
precision components.
Ultrasonic machining (USM) is a technology-driven process used for machining or finishing
brittle abrasives or materials such as ceramics. Its material-removal mechanism includes
impacting, hammering, and cavitation. This process is also used effectively to machine both
conductive and non-conductive materials. The USM is effective and practical for all brittle
materials, including glass, ceramics, carbide, and graphite.
Considering the unique advantages of the ultrasonic-assisted machining during the processing
of hard and brittle materials and the effect of ultrasonic vibration on the self-sharpening
characteristic of abrasive pellet, a novel Ultrasonic-Assisted Fixed-abrasive Lapping (UAFL)
technology is put forward and corresponding lapping device for engineering ceramics
cylindrical part is developed.
CHAPTER 2
LITERATURE REVIEW
2.1 LAPPING
It is a controlled mechanical sanding or polishing process that involves an abrasive between
two surfaces that are rubbed together to create an accurate finish on a part. Depending on the
material and application for the part, lapping can be one sided or two sided. Lapping can be
used to create a specific surface roughness. Lapping can produce surface finishes in the
nanometre (or 0.001 μm) range. According to abrasive type and adding way, precision lapping
can be divided into free-abrasive lapping and fixed-abrasive lapping.
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2.3 FIXED ABRASIVE LAPPING
In this lapping technology, instead of free-abrasive particles, abrasive pellets, formed through
solidifying free grains with bonding agent, were embedded in or glued on the lapping tool and
perform lapping action. CFL model is shown in Fig.2.3. Just like grinding wheel, the lapping
tool can be dressed and the abrasive particles in each pellet present good equal-height
accordance. So, not only large grains but also small grains can contact the workpiece and take
part in lapping with the same depth of cut δ. As a result, the lapping force per participating
grain is smaller than that in lapping with free abrasive under the same lapping pressure, and
the better lapped surface can be obtained. Furthermore, liquid coolant can be used in this kind
of lapping, so the lapping speed can increase up to 150 m/min, as heightens the lapping
efficiency obviously.
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2.4 ULTRASONIC MACHINING (USM)
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CHAPTER 3
EXPERIMENTATION
3.1 ULTRASONIC-ASSISTED FIXED-ABRASIVE LAPPING DEVICE
Fig.3.1 shows the self-developed UAFL device, which is composed of four systems: ultrasonic
vibration system, lapping tool system, pressure adjustment system, and movement driving
system. The ultrasonic vibration system includes ultrasonic power, transducer, and amplitude
transformer. An ultrasonic vibration frequency of 20 kHz is chosen as the working frequency,
and the whole acoustic system was designed correspondingly. The lapping tool systems with
different grit size are shown in Fig.4.2. Under the exciting of ultrasonic vibration system, the
lapping tool with some inlaid diamond pellets can ultrasonically vibrate in axial direction.
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3.2 TEST CONDITIONS
Lapping tests were conducted by means of self-developed UAFL device shown in Fig. 3.1.
Tables 3.1 and 3.2 list the mechanical properties of experimental engineering ceramics and the
test conditions, respectively. A series of contrast lapping tests were carried out in the research.
In order to make experimental results comparable, all the lapping parameters except for
ultrasonic parameters were kept the same in each group of contrast experiments.
Table 3.1 Material properties
Engineering ceramics Zirconia (ZrO2) Zirconia toughened alumina
(ZTA)
Hardness (HRA) 88 83–88
Density (g/cm3 ) 6.0–6.14 4.6–4.99
Elastic modulus (GPa) 210 285
Bending strength (MPa) 1000–1500 650–900
Fracture toughness(MPam1/2) 9.0–11.0 6–7.6
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CHAPTER 4
RESULTS AND DISCUSSIONS
4.1 Lapping Force Curve Characteristic
During test, a strain gauge type dynamometer was adopted to measure lapping forces. Before
measurement, it is necessary to calibrate the dynamometer. Normal and tangential lapping
force curves obtained from UAFL and CFL are described in Figs 4.1 (a) and (b), respectively,
where the upper red line denotes the zero line of corresponding to normal force and the lower
red line stands for zero line of channel 4 corresponding to tangential force in test. The interval
between two blue lines indicates 50 N of cutting force. From the figures, we can see that both
the value and the waveform of the normal lapping force are much the same because both UAFL
and CFL are conducted under the same conditions. Because of the radial run out of the machine
tool spindle, the normal force fluctuates with the rotation of the workpiece. As for the tangential
force, it presents different characteristic in the two lapping modes. Because of the differences
of material removal mechanism and lapping movement characteristics between UAFL and
CFL, especially the antifriction performance of superimposed parallel vibration to the contact
surface, not only the value of tangential force in UAFL becomes smaller but also the volatility
of waveform changes smoother.
Fig 4.1 Lapping force waveforms (lapping condition: P=100 N, n=250 rpm, f=0.128 mm/r
and grit size 28µm) (a) lapping without ultrasonic assistance and (b) lapping with ultrasonic
assistance
4.2 Material Removal Rate Characteristic.
Figure 4.2 shows the MRR characteristic when lapping ZTA ceramics with and without
ultrasonic assistance. Both coarse abrasive grains with grit size of 28 µm and fine abrasive
grains with grit size of 7 µm were used in the tests. Lapping conditions are listed in the figure.
From Fig. 4.2(a), it can be observed that MRR of ZTA ceramic increases with the lapping speed
except the relationship is not linear. Especially when using coarse grains, the increase trend
gradually becomes slow with the increase of speed. The main reason is because the lapping
temperature will increase directly with lapping speed, accompanying with the changes of
abrasive grains’ mechanical properties and the quick wear of the grains. Meanwhile, we can
find that the superimposed ultrasonic vibration really promotes the increase of MRR, as has
been explained in the above analysis of UAFL mechanism. From Fig. 4.2(b), it can be found
that lapping pressure has remarkable influence of material removal. In general, MRR should
present linear relationship with lapping pressure. However, because the lapping pressure may
suppress the vibration effect and cooling effect, lapping pressure and speed have similar
influencing rule on MRR.
Fig 4.2 Material removal rate (MRR) characteristic: (a) effect of lapping speed on MRR and (b) effect
of lapping pressure on MRR
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4.3 Surface Roughness Characteristic
Surface roughness is one of the crucial factors affecting the usage of the engineering ceramics
parts. Surface roughness characteristics both in UAFL and CFL were researched
experimentally, and the results are displayed in Fig. 4.3. The value of surface roughness Ra
was measured on the middle position of the workpiece after test. The measurement replicated
three times, and then, the average value was calculated. From Fig. 4.3(a), it can be found that
the surface quality of workpiece in UAFL is better than that in CFL. According to the above
analysis of UAFL mechanism, movement locus of abrasive grains in UAFL is different from
that in CFL, the loci may interfere and interlace, resulting in smooth and good surface.
Especially when adopting lower lapping speed, the effect of ultrasonic vibration is more
remarkable. Along with the increase of lapping speed, the surface roughness increases
correspondingly, as can be explained that lapping speed may weaken the action of ultrasonic
vibration to some extent. From Fig. 4.3(b), it can be found that lapping pressure plays an
important part on the surface roughness Ra of ZTA ceramic workpiece, especially when using
coarse grains. Suitable pressure can benefit the improvement of surface roughness. Excessive
pressure may lead to rapid deterioration of surface quality.
Fig 4.3 Surface roughness characteristic: (a) effect of lapping speed on Ra and (b) effect of lapping
pressure on Ra
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5.4 Surface Microgeometrical Structure Characteristic
According to the material properties of experimental engineering ceramics shown in Table 1,
fracture toughness of ZrO2 ceramic is much greater than that of ZTA ceramic, so ductile regime
material removal will occupy the main position when lapping ZrO2 ceramic. In the test, we
choose ZrO2 ceramic as the lapping object in order to study the surface microgeometrical
structure characteristic of UAFL. Figures 4.4(a) and 4.4(b) display the SEM photos of lapped
surface with grit size of 7 µm with and without ultrasonic assistance, respectively. Through
comparing the two figures, it can be found that the surface obtained in CFL is more regular and
many parallel lapping marks can be found. However, the marks present different
characteristics, some scratches are very deep but some are shallow. From the SEM photo
obtained in UAFL, because superimposed vibration affects the movement locus of abrasive
grain, the grain scratches will be interlaced each other and the interlaced lapping marks can be
generated in the lapped surface. As a result, the lapped surface in UAFL is better than that in
CFL.
Fig 4.4 SEM photos of lapped surface of ZrO2 ceramic: (a) with ultrasonic assistance and (b) without
ultrasonic assistance
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CHAPTER 5
CONCLUSION
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