43LJ5000
43LJ5000
43LJ5000
LED TV
SERVICE MANUAL
CHASSIS : MS3553.PB765
MODEL : 43LJ5000-UB
43LJ500M-UB
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS .............................................................................................. 2
SPECIFICATION ...................................................................................... 6
DISASSEMBLE....................................................................................... 13
Copyright ©2017 LG Electronics. Inc. All rights reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright ©2017 LG Electronics. Inc. All rights reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 2. After removing an electrical assembly equipped with ES
manual and its supplements and addenda, read and follow the devices, place the assembly on a conductive surface such as
SAFETY PRECAUTIONS on page 3 of this publication. aluminum foil, to prevent electrostatic charge buildup or expo-
NOTE: If unforeseen circumstances create conflict between the sure of the assembly.
following servicing precautions and any of the safety precautions 3. Use only a grounded-tip soldering iron to solder or unsolder
on page 3 of this publication, always follow the safety precau- ES devices.
tions. Remember: Safety First. 4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classified as “anti-static” can generate
General Servicing Precautions electrical charges sufficient to damage ES devices.
1. Always unplug the receiver AC power cord from the AC power 5. Do not use freon-propelled chemicals. These can generate
source before; electrical charges sufficient to damage ES devices.
a. Removing or reinstalling any component, circuit board 6. Do not remove a replacement ES device from its protective
module or any other receiver assembly. package until immediately before you are ready to install it.
b. Disconnecting or reconnecting any receiver electrical plug (Most replacement ES devices are packaged with leads elec-
or other electrical connection. trically shorted together by conductive foam, aluminum foil or
c. Connecting a test substitute in parallel with an electrolytic comparable conductive material).
capacitor in the receiver. 7. Immediately before removing the protective material from the
CAUTION: A wrong part substitution or incorrect polarity leads of a replacement ES device, touch the protective mate-
installation of electrolytic capacitors may result in an explo- rial to the chassis or circuit assembly into which the device will
sion hazard. be installed.
2. Test high voltage only by measuring it with an appropriate CAUTION: Be sure no power is applied to the chassis or cir-
high voltage meter or other voltage measuring device (DVM, cuit, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged replace-
Do not test high voltage by "drawing an arc". ment ES devices. (Otherwise harmless motion such as the
3. Do not spray chemicals on or near this receiver or any of its brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity suf-
4. Unless specified otherwise in this service manual, clean ficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10 % (by volume) Acetone and 90 % 1. Use a grounded-tip, low-wattage soldering iron and appropri-
(by volume) isopropyl alcohol (90 % - 99 % strength) ate tip size and shape that will maintain tip temperature within
CAUTION: This is a flammable mixture. the range or 500 °F to 600 °F.
Unless specified otherwise in this service manual, lubrication 2. Use an appropriate gauge of RMA resin-core solder composed
of contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks Do not use freon-propelled spray-on cleaners.
are correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500 °F to 600 °F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500 °F to 600 °F)
Some semiconductor (solid-state) devices can be damaged eas- b. First, hold the soldering iron tip and solder the strand
ily by static electricity. Such components commonly are called against the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors component lead and the printed circuit foil, and hold it there
and semiconductor “chip” components. The following techniques only until the solder flows onto and around both the compo-
should be used to help reduce the incidence of component dam- nent lead and the foil.
age caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. Alter- splashed solder with a small wire-bristle brush.
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
Copyright ©2017 LG Electronics. Inc. All rights reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement 3. Solder the connections.
Some chassis circuit boards have slotted holes (oblong) through CAUTION: Maintain original spacing between the replaced
which the IC leads are inserted and then bent flat against the cir- component and adjacent components and the circuit board to
cuit foil. When holes are the slotted type, the following technique prevent excessive component temperatures.
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique Circuit Board Foil Repair
as outlined in paragraphs 5 and 6 above. Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
Removal board causing the foil to separate from or "lift-off" the board. The
1. Desolder and straighten each IC lead in one operation by following guidelines and procedures should be followed when-
gently prying up on the lead with the soldering iron tip as the ever this condition is encountered.
solder melts.
2. Draw away the melted solder with an anti-static suction-type At IC Connections
solder removal device (or with solder braid) before removing To repair a defective copper pattern at IC connections use the
the IC. following procedure to install a jumper wire on the copper pattern
Replacement side of the circuit board. (Use this technique only on IC connec-
1. Carefully insert the replacement IC in the circuit board. tions).
2. Carefully bend each IC lead against the circuit foil pad and
solder it. 1. Carefully remove the damaged copper pattern with a sharp
3. Clean the soldered areas with a small wire-bristle brush. knife. (Remove only as much copper as absolutely necessary).
(It is not necessary to reapply acrylic coating to the areas). 2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
"Small-Signal" Discrete Transistor 3. Bend a small "U" in one end of a small gauge jumper wire and
Removal/Replacement carefully crimp it around the IC pin. Solder the IC connection.
1. Remove the defective transistor by clipping its leads as close 4. Route the jumper wire along the path of the out-away copper
as possible to the component body. pattern and let it overlap the previously scraped end of the
2. Bend into a "U" shape the end of each of three leads remain- good copper pattern. Solder the overlapped area and clip off
ing on the circuit board. any excess jumper wire.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding At Other Connections
leads extending from the circuit board and crimp the "U" with Use the following technique to repair the defective copper pattern
long nose pliers to insure metal to metal contact then solder at connections other than IC Pins. This technique involves the
each connection. installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement 1. Remove the defective copper pattern with a sharp knife.
1. Heat and remove all solder from around the transistor leads. Remove at least 1/4 inch of copper, to ensure that a hazardous
2. Remove the heat sink mounting screw (if so equipped). condition will not exist if the jumper wire opens.
3. Carefully remove the transistor from the heat sink of the circuit 2. Trace along the copper pattern from both sides of the pattern
board. break and locate the nearest component that is directly con-
4. Insert new transistor in the circuit board. nected to the affected copper pattern.
5. Solder each transistor lead, and clip off excess lead. 3. Connect insulated 20-gauge jumper wire from the lead of the
6. Replace heat sink. nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Diode Removal/Replacement Carefully crimp and solder the connections.
1. Remove defective diode by clipping its leads as close as pos- CAUTION: Be sure the insulated jumper wire is dressed so the
sible to diode body. it does not touch components or sharp edges.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Copyright ©2017 LG Electronics. Inc. All rights reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
Copyright ©2017 LG Electronics. Inc. All rights reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Component Video Input (Y, Cb/Pb, Cr/Pr)
No. Resolution H-freq(kHz) V-freq.(kHz)
1 720*480i 15.73 60.00
2 720*480p 31.50 60.00
3 1440*576i 16.63 50.00
4 720*576p 31.50 50.00
5 1280*720p 37.50 50.00
6 1280*720p 45.00 60.00
7 1920*1080i 28.13 50.00
8 1920*1080i 33.75 60.00
9 1920*1080p 56.25 50.00
10 1920*1080p 67.50 60.00
6. HDMI Input :
No. Resolution H-freq(kHz) V-freq.(kHz)
PC(DVI)
1 720*400 31.469 70
2 640*480 31.469 59.940
3 800*600 37.879 60.310
4 1024*768 48.363 60.000
5 1360*768 47.712 60.015
6 1920*1080 67.5 60
DTV
1 640*480p 31.47 59.94
2 640*480p 31.5 60.00
3 720*480p 31.47 59.94
4 720*480p 31.5 60.00
5 1280*720p 44.96 59.94
6 1280*720p 45.00 60.00
7 720(1440)*480i 15.73 59.94
8 720(1440)*480i 15.75 60.00
9 720*576p 31.25 50.00
10 1280*720p 37.5 50.00
11 720(1440)*576i 15.63 50.00
12 1920*1080i 28.125 50.00
13 1920*1080i 33.72 59.94
14 1920*1080i 33.75 60.00
15 1920*1080p 26.97 23.976
16 1920*1080p 27.00 24.00
17 1920*1080p 33.716 29.976
18 1920*1080p 33.75 30.00
19 1920*1080p 56.25. 50.00
20 1920*1080p 67.432 59.94
21 1920*1080p 67.50 60.00
Copyright ©2017 LG Electronics. Inc. All rights reserved. -7- LGE Internal Use Only
Only for training and service purposes
SOFTWARE UPDATE PROCEDURE
1. USB Upgrade
1. Place the higher version software in LG_DTV folder in USB root folder, like this.
2. Plug in USB disk, then a notify OSD will be displayed if the software in LG_DTV higher than current software of TV set.
3. Select “YES” button and press “OK” key if you want to update TV software, the update OSD will be displayed.
Copyright ©2017 LG Electronics. Inc. All rights reserved. -8- LGE Internal Use Only
Only for training and service purposes
About the LED flash during software upgrade:
Upgrading:
Red 1000ms Green 1000ms alternates,the TV set will turn to Upgrade succeed or Upgrade Failed status after the upgrading
process.
Upgrade succeed:
Red 250ms Green 250ms alternates, flashing before power off.
Upgrade Failed:
Red 1750ms Green 250ms alternates,flashing before power off.
2. AC ON
In order to avoid the software which is on the mainboard can not work normal for current panel,you can upgrade the
correct software through AC ON:
1. Copy the Software Bin to the U-Disk root;
2. Insert the U-Disk to the mainboard USB Port;
3. The AC on,
4. Then the TV will upgrade, and need to reboot after upgrade success.
Upgrading:
Red 1000ms Green 1000ms alternates,the TV set will turn to Upgrade succeed or Upgrade Failed status after the
upgrading process.
Upgrade succeed:
The TV will prompt to restart immediately.After restart, The TV will prompt From what version of the TV will be
prompted to upgrade to what version.
Copyright ©2017 LG Electronics. Inc. All rights reserved. -9- LGE Internal Use Only
Only for training and service purposes
%/2&.',$*5$0
0$,1
SPI
FLASH
LVDS/miniLVDS
MSD3553
I2C&AGC
VIF
NTSC/ATSC
Optical
HDMI2
IR & KEY
/*(,QWHUQDO8VH2QO\
2017 0
3V3_STB
RT1 RT2
PIN52 M_SCL
M_I2C
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Si2159 TAS5733 LVDS
MSD3553 Add_R
Add_W 0xC0
0xC1 Addr 0x56 Add_R
Add_W
MainBoardPowerTree
PSU
12V 1800mA + Panel Current
800mA(eff=90%)
230mA
5V_STB
800mA 5V_STB 5V_M VCC_DDR MSD3553
1730mA 1230mA
120mAavg
DC-DC D-LDO 230mApeaU k
UL1
MP9495 UD1 1
POW_EN
2000mA 500mA
270mA
3V3_M 270mA
150mA(eff=85%)
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MSD3553 Tuner TAS5733
DC-DC 700mA 200mA 68mA
LC2127 UD1 U1
UT2 U1
1000mA 1000mA
TAS5733L 8ohm 5W USB2.0
200mA
TBD VCC-PANEL
POW_EN
/*(,QWHUQDO8VH2QO\
2017 11
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in
the Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
LV1
ARC1
901
AR1
902
400
800
120
500
521
522
540
200
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4
2017
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2017
5
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2017
6
5. tape disassembly
7
2017
6. Remove speaker&versamount bracket &screw
2017
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7. Remove IR COVER&tape
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Un-repairable Cases
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Appendix : ADJUSTMENT INSTRUCTION
2. LG SYSTEM INFO
LG SYSTEM INFO
Display some system parameters, no adjustable items
3 LG EZ
. ADJUST
Area Option: Select Area USA/Mexico/Canada