International Journal of Science and Research (IJSR), India Online ISSN: 2319-7064

Design and Implementation of DDR SDRAM

Controller using Verilog
Priyanka Bibay1, Anil Kumar Sahu2, Vivek Kumar Chandra3

1
Student, M.E. (VLSI Design), CSVTU University, Electronics & Telecommunication Dept., SSCET, Bhilai
Chhattisgarh, India
[email protected]
2
Assistant Professor, Electronics & Telecommunication, SSCET, Bhilai
Chhattisgarh, India
[email protected]
3
Associate Professor, HOD (EEE), CSIT, Durg
Chhattisgarh, India
[email protected]

Abstract: Double Data Rate Synchronous DRAM (DDR SDRAM) has become a mainstream memory of choice in design due to its
speed, burst access and pipeline features. The DDR SDRAM is an enhancement to the conventional SDRAM running at bus speed over
75MHz. The DDR SDRAM (referred to as DDR) doubles the bandwidth of the memory by transferring data twice per cycle on both the
rising and falling edges of the clock signal. The designed DDR Controller supports data width of 64 bits, Burst Length of 4 and CAS
(Column Address Strobe) latency of 2. DDR Controller provides a synchronous command interface to the DDR SDRAM Memory along
with several control signals. In this paper, the implementation has been done in Verilog HDL by using Xilinx ISE 9.2i and Modelsim
6.4b.
Keywords: Double Data Rate, Column Address Strobe (CAS), Synchronous Dynamic RAM.

1. Introduction data, on the other hand, can be accessed in any order. All the
data that the PC uses and works with during operation are
With the rapid development in the processor’s family, stored here. Data are stored on drives, typically the hard
speed and capacity of a memory device is a major concern. drives. However, for the CPU to work with those data, they
The DDR is an enhancement to the traditional synchronous must be read into the working memory storage (RAM).
DRAM. The DDR is able to transfer the data on both the
edges of each clock cycle. Thus doubling the data transfer B. Types of Random Access Memory
rate of the memory device. The DDR is available in a very
low cost that’s why it is widely used in personal computers i. Static Random Access Memory
where they are basically used to provide the functions of
storage and buffers. The DDR SDRAM supports the data Static Random Access Memory uses a completely different
widths of 16, 32 and 64 bits. It automatic refresh during the technology. In static RAM, a form of flip-flop holds each bit
normal and power down modes. The DDR is a complete of memory. A flip-flop for a memory cell takes four or six
synchronous implementation of controller. It increases the transistors along with some wiring, but never has to be
throughput using command pipelining and bank refreshed. This makes static RAM significantly faster than
management. This improvement allows the DDR module to dynamic RAM. However, because it has more parts, a static
transfer data twice as fast as SDRAM. As an example, memory cell takes up a lot more space on a chip than a
instead of a data rate of 133MHz, DDR memory transfers dynamic memory cell. Therefore, you get less memory per
data at 266MHz.DDR modules, like their SDRAM chip. Static Random Access Memory uses multiple
predecessors, arrive in there. Although motherboards transistors, typically four to six, for each memory cell but
designed to implement DDR are similar to those that use doesn't have a capacitor in each cell. It is used primarily for
SDRAM, they are not backward compatible with cache. So static RAM is fast and expensive, and dynamic
motherboards that support SDRAM. You cannot use DDR in RAM is less expensive and slower. So, static RAM is used to
earlier SDRAM based motherboards, nor can you use create the CPU's speed-sensitive cache, while dynamic RAM
SDRAM on motherboards that are designed for DDR. forms the larger system RAM space.
A. Random Access Memory ii. Dynamic Random Access Memory
Random access memory (RAM) is the best known form of Dynamic Random Access Memory has memory cells
computer memory. RAM is considered "random access" with a paired transistor and capacitor requiring constant
because you can access any memory cell directly if you refreshing. DRAM works by sending a charge through the
know the row and column that intersect at that cell. RAM
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 International Journal of Science and Research (IJSR), India Online ISSN: 2319-7064

appropriate column (CAS) to activate the transistor at each up of PC 266 chips. Go for PC2700 DDR. It is about the cost
bit in the column. When writing the row lines contain the of PC2100 memory and will give you better performance.
state the capacitor should take on. When reading the sense DDR memory comes in CAS 2 and CAS 2.5 ratings, with
amplifier determines the level of charge in the capacitor. If it CAS costing more and performing better.
is more than 50 percent, it reads it as a 1 otherwise it reads it
as a 0. This paper is organized as follows. In Section 2, Block
diagram of DDR controller will be described. The
A memory chip rating of 70ns means that it takes 70 architecture of DDR controller will be described in Section
nanoseconds to completely read and recharge each cell. It is 3. In Section 4, different functional blocks will be explained.
one of the most common types of computer memory (RAM). Finally the Result and Conclusion will be given in Section 5
It can only hold data for a short period of time and must be and Section 6 respectively.
refreshed periodically. DRAMs are measured by storage
capability and access time. Storage is rated in megabytes (8 2. DDR controller Block Diagram
MB, 16 MB, etc). Access time is rated in nanoseconds (60ns,
70ns, 80ns, etc) and represents the amount of time to save or Figure 1 shows the different blocks in top level reference
return information. With a 60ns DRAM, it would require 60 design. The user interface module contains the I/O registers
billionths of a second to save or return information. The to latch system signals coming into the FPGA. The DDR
lower the speed, the faster the memory operates. DRAM controller module contains the DDR SDRAM controller,
chips require two CPU wait states for each execution. Can including I / Os to interface with the DDR SDRAM.
only execute either a read or write operation at one time. The
capacitor in a dynamic RAM memory cell is like a leaky
bucket. It needs to be refreshed periodically or it will
discharge to 0. This refresh operation is where dynamic
RAM gets its name.

Memory is made up of bits arranged in a two-dimensional

grid. In which memory cells are fetched onto a silicon wafer
in an array of columns (bit lines) and rows (word lines). The
intersection of a bit line and word line constitutes the address
of the memory cell. Memory cells alone would be worthless
without some way to get information in and out of them. So
the memory cells have a whole support infrastructure of
other specialized circuits. Identifying each row and column Figure 1: Top Level block diagram
(row address select and column address select) Keeping
track of the refresh sequence (counter) Reading and restoring 3. DDR Controller Architecture
the signal from a cell (sense amplifier) Telling a cell whether
it should take a charge or not (write enable) Other functions The DDR Controller mainly consists of four functional
of the memory controller include a series of tasks that blocks:
1. Address Latch
include identifying the type, speed and amount of memory
2. Data Path
an checking for errors. The traditional RAM type is DRAM
3. Controller
(dynamic RAM). The other type is SRAM (static RAM).
4. Counter
SRAM continues to remember its content, while DRAM
must be refreshed every few milliseconds.

iii. Double Data Rate Synchronous Dynamic Random Access

Memory

Double Data Rate Synchronous Dynamic Random Access

Memory is the original form of DDR SDRAM. It is just like
SDRAM except that is has higher bandwidth, meaning
greater speed. Maximum transfer rate to L2 cache is
approximately 1,064 MBps (for DDR SDRAM 133 MHZ).
DDR RAM is clock doubled version of SDRAM, which is
replacing SDRAM during 2001- 2002. It allows transactions
on both the rising and falling edges of the clock cycle. It has
a bus clock speed of 100MHz and will yield an effective data Figure 2: DDR Controller Architecture
transfer rate of 200MHz. DDR come in PC 1600, PC 2100,
PC 2700 and PC 3200 DIMMs. A PC 1600 DIMM is made
up of PC 200 DDR chips, while a PC 2100 DIMM is made
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4. Different Functional Blocks timing requirements and issues the commands to the memory
devices at the shorted time possible. The pin diagram of
4.1 Address Latch controller is shown in figure 5:
The basic function of address latch module is to gets its
control signals from the controller and generates row,
column and bank addresses for the DDR SDRAM. The clk ddr_casb
address latch also generates different control signals like clk2x ddr_rasb
burst_max, cas_lat_max for the burst counter and cas latency lac_clk ddr_web
counter. u_ref_ack
u_cmd [7:1] ddr_dqs_t
ddr_write_en [7:0]
burst_end CONTROLLER ddr_read_en [3:0]
cas_lat_end u_data_valid_en
rcd_end mrs_addr
burst_8 row_addr
ld_burst
burst_2 ld_cas_lat
ld_rcd

Figure 5: Controller Module

The DDR controller consists of a high performance

memory controller for system requiring access to
external devices with lowest latency and highest
Figure 3: Address Latch Module throughput. The controller accepts and decodes user
4.2 Data Path interface commands and generates read, write, refresh
commands. It also generates signals for other modules.
One of the most difficult aspects of DDR SDRAM controller The memory is initialised and powered up using a
design is to transmit and capture data at double data rate. defined process. The controller state machine handles
This module transmits data to the memories. The basic the initialization process upon power up.
function of data path module is storing the write data and
calculates the value for read data path. 4.4 Controller state machine diagram

Initially the controller is in the IDLE state. That means

clk no operation is performing. A PRECHARGE ALL
clk2x ddr_dq [63:0] command is then applied. This command is used to
lac_clk
ddr_dqs [1:0]
deactivate any open row in a bank or the open bank row
u_data_i [127:0] in all banks. Once a bank is pre charged, it is in idle
ddr_dqs_t u_data_o [127:0] state and must be activated prior to any READ and
DATA PATH
WRITE operation. Next a LOAD MODE REGISTER
ddr_write_en[7:0] u_data_valid command should be issued for the extended mode
ddr_read_en[3:0] register to enable the DLL, then another LOAD MODE
u_data_valid_en REGISTER command to the mode register to reset the
DLL and to program the operating parameters. Again a
Figure 4: Data Path Module PRECHARGE command should be applied which place
the device in all banks in IDLE state. In the IDLE state
Data path module handles all the data generation and two AUTO REFRESH cycles must be performed.
sampling task of DDR controller. For Read access, data is
sampled by data path. Data is then synchronized with the
internal clock and transferred to the user interface one-word
per clock cycle as normal data rate. For Write access, data is
received from the user interface at the normal one word per
clock data rate. The DDR controller’s data path then
resynchronized the data and transfers them using the double
data rate.

4.3 Controller
The controller consists of a state machine which performs
DDR SDRAM read and write accesses based on user
interface request. The controller consists of a high
performance timing & control state machine that observes all
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 International Journal of Science and Research (IJSR), India Online ISSN: 2319-7064

Idle
Precharge
read or Load_mr
write
Refresh
rcd_end#
rcd_end#
burst_8#
rcd_end &
ACT Act_wait
read
burst_2
READ rcd_end &
burst_8# read WRITE
cas_lat_end cas_lat_end# burst_2# burst_8#

Read_data Read_wait Write_data

burst_end#
cas_lat_end & & burst_8
burst_end# burst_8
& burst_8
cas lat end#
Figure 6: controller state machine diagram

The controller next state could be PRECHARGE, Figure 8: Simulation waveform for Controller
LOAD_MR, REFRESH or ACT, depending upon the
required command. The ACT command is used to open a
row in a bank before starting any read or write operation.
The controller state machine diagram is shown in figure 6.

4.4 Counter

The task of Burst Count is to count when there are

consecutive READ and WRITE operations. While doing
consecutive READ and WRITE operations, the Burst_count
value determines when the next READ and WRITE
command should be issued.

5. Results
Figure 7 shows the RTL schematic of designed DDR
SDRAM controller.

Figure 9: Simulation waveform for Controller Read Cycle

Figure 7: RTL schematic of DDR Controller

The following figures are the simulation result of controller,

controller Write cycle and controller Read cycle obtained by
using Modelsim 6.4b.
Figure 9: Simulation waveform for Controller Write Cycle

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 International Journal of Science and Research (IJSR), India Online ISSN: 2319-7064

6. Conclusion [6] LatticeSC/M DDR/DDR2 SDRAM Memory interface

User’sGuide, TechnicalNoteTN1099, July2008
In this paper an efficient fully functional DDR SDRAM [7] J.Bhaskar “A verilog HDL primer- 2nd edition”
controller is designed. The controller generates different [8] John Wakerly “Digital system design – 8th edition.”
types of timing and control signals, which synchronises the [9] Burchardt, A., Hekstra-Nowacka, E., and Chauhan, A.,
timing and control the flow of operation. The memory “A Real-time Streaming Memory Controller”, Design,
system operates at double the frequency of processor, [10] Automation and Test in Europe 2005 Proceedings,
without affecting the performance. Thus we can reduce the 2005, vol.3, pp. 20-25
data bus size. The drawback of this controller is complex [11] Heithecker, S and Ernst, R., “Traffic Shaping for An
schematic with large number of buffers in the circuit FPGA Based SDRAM Controller with Complex QoS
increases the amount of delay. Requirements”, Design Automation Conference 2005,
June 2005, pp. 575-578.
References
Author Profile
[1] Micron Technology Inc. Double Data Rate (DDR)
SDRAM, Datasheet, 1999
[2] Synthesizable DDR SDRAM controller, Application Priyanka Bibay has received her B.E. degree in
Electronics & Telecommunication Engineering
note, 2002. (Xilinx Inc., XAPP200)
from Chhattisgarh Swami Vivekananda Technical
[3] Using the vertex select I/O Resource, Application note, University, Bhilai, India, in 2005. She is pursuing
1999. (Xilinx Inc., XAPP133) her M.E. (Specialization in VLSI Design) from
[4] Using Delay Locked Loops in Spartans-II FPGAs. SSCET, Durg, with the same CSVTU University,
(Xilinx Inc., XAPP174) Bhilai, India from 2010-2012.
[5] JEDEC, Solid State Technology Association. DDR2,
SDRAM Specification.

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