The document discusses key topics in microelectronics and electronic packaging. It begins by covering the invention of the transistor and integrated circuit. It then discusses microelectronics systems, Moore's Law, and the functions and hierarchy of electronic packaging. Common materials used in electronic packaging include silicon, solder, wires, and encapsulants. Methods for assembling integrated circuits include wire bonding, tape automated bonding, and flip chip bonding.
The document discusses key topics in microelectronics and electronic packaging. It begins by covering the invention of the transistor and integrated circuit. It then discusses microelectronics systems, Moore's Law, and the functions and hierarchy of electronic packaging. Common materials used in electronic packaging include silicon, solder, wires, and encapsulants. Methods for assembling integrated circuits include wire bonding, tape automated bonding, and flip chip bonding.
The document discusses key topics in microelectronics and electronic packaging. It begins by covering the invention of the transistor and integrated circuit. It then discusses microelectronics systems, Moore's Law, and the functions and hierarchy of electronic packaging. Common materials used in electronic packaging include silicon, solder, wires, and encapsulants. Methods for assembling integrated circuits include wire bonding, tape automated bonding, and flip chip bonding.
The document discusses key topics in microelectronics and electronic packaging. It begins by covering the invention of the transistor and integrated circuit. It then discusses microelectronics systems, Moore's Law, and the functions and hierarchy of electronic packaging. Common materials used in electronic packaging include silicon, solder, wires, and encapsulants. Methods for assembling integrated circuits include wire bonding, tape automated bonding, and flip chip bonding.
Microelectronics started with the invention of the transistor in 1949
by Brattain, Bardeen and Shockley at Bell Labs
The first IC was developed by Jack Kilby in 1959
What is Microelectronics Systems
Microelectronics refers to those micro devices, such as IC, which are fabricated in sub-micron dimensions and which form the basis of all electronic products
Systems refers to all electronic products
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Integrated Circuit Trend
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Moore’s Law
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Electronic Packaging
Packaging is defined as the bridge that interconnects the IC’s and other components into a system level board to form electronic products Electronic product is like a human body
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Electronic Packaging Hierarchy
Package Hierarchy
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Functions of Electronic Packaging The main functions of electronic packaging are:
Signal passage To provide a path for the electrical current that powers the circuits on the chip Power distribution To distribute the signals onto and off the chip Heat dissipation To remove the heat generated by the circuit Chip protection To support the chip and protect it from hostile environment
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
What are Semiconductors?
Metals conduct electricity (conductors) , polymers do not
(insulators)
Most materials fall into one of these two categories
However, there is a group of materials that fall in between.
They are known as “semiconductors” (e.g: Si, Ge, Sn)
Thus, Materials are classified into three categories:
Conductors, Insulators and Semiconductors
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Insulators Insulators have a maximum 8 electrons in their valence band A very large amount of energy is required to remove them from this orbit
Conductors The valence electrons of a conductor require no energy to be removed
Semiconductors Semiconductors have 4 electrons, which require a moderate amount of energy in order to remove them
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Conduction band
Conduction band Energy gap Energy gap Conduction band Valence band Valence band Valence band
Insulator Semiconductor Conductor
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Integrated Circuit (IC)
An IC or “chip” is an electrical circuit with large number of transistors,
wires, and other electrical devices all built into a single square of Si
Most chips are made of single crystal silicon (Si)
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS How is Si chip made?
1. Ingot production Si is melted in a high temperature furnace and shaped into cylindrical ingots 2. Wafer slicing After cooling, Ingot is sliced into thin circular wafers using a diamond- bladed saw 3. Wafer fabrication Devices or integrated circuits are formed on the wafer surface (at the same time) 4. Packaging The IC is packaged (assembled) and then tested
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Czochralski (CZ) method
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Single Crystal Si Ingot
Si wafer
Wafer slicing Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004 MATERIALS IN ELECTRONICS Materials in Electronic Packaging
1. Substrate Organic (polymer) and Inorganic (ceramic)
2. Die (Si chip)
3. Interconnects Solder (eutectic Sn-Pb and Pb-free), wire (Au, Al and Cu), flux
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS IC Packaging or Assembly
IC assembly is the first processing step after wafer fabrication and
singulation that enables IC’s to be packaged for systems use lC assembly is the process of electrically connecting I/ O bond pads on the IC to the corresponding bond pads on the package Assembly process involves 3 interfaces:
1. Metallurgical bond pad interface on the IC
2. Metallurgical bond pad interface on the package (substrate) 3. Electrical interconnection between these two interfaces
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS IC Packaging Technologies IC to package assembly can be accomplished using 3 main interconnection technologies 1. Wire Bonding 2. Tape Automated Bonding 3. Flip Chip Bonding
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Wire Bonding
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Flip Chip Bonding
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Tape Automated Bonding
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
process Less electrical performance High yield interconnection (low defect rate) Potential for wire sweep during encapsulation overmoulding High reliability interconnection structure
Very large industry infrastructure
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS TAB
Advantages Limitations
Small bond pads and finer pitches Provide only peripheral
interconnection Better heat transfer for thermal management Package size increases with large I / O counts High I/ O counts Process inflexibility Reduced weight Little production infrastructure
Large capital investment required
Difficulty in assembly rework
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Flip Chip Bonding
Advantages Limitations
High density of I/O High cost assembly process
interconnection per area array packaging
Superior electrical performance
due to small bump for the joint
Multiple chip can be attached by
single reflow of solder bump
Good reliability
Light weight package
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Flip Chip Bonding
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Flip Chip Bonding
Interconnection between the IC input/ output and substrate is
achieved using a bump structure on the chip and a bonding material on the substrate to form an electrical interconnection
Flip chip bonding involves solder interconnections that make the
electrical and mechanical connection between the Si die (IC) and substrate
Thus, the basic structure of a flip chip consists of:
1. IC or chip (die)
2. Interconnection system (typically, solder alloy)
3. Substrate
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
UBM (Underbump Metallization)
Or BLM (Ball-Limiting Metallurgy) TSM (Top-Surface Metallurgy)
Solder bump structure in a flip chip comprises:
1. Under Bump Metallurgy (UBM)
2. Solder Bump (solder ball)
The UBM serves as a compatible layer between the bump metallisation
and final chip metallisation (Al or Cu)
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Requirements of UBM
Good adhesion to bonding pad
metallisation (Cu or Al) and wafer passivation: Ni, Ti, Pd Under Bump Metallurgy (UBM) Good diffusion barrier: Ni, Pd, Ti
Solder wettable surface: Ni, Pd
Oxidation barrier: Au
UBM and Solder Bump
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Solder Bump Deposition by
Electroplating
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS Intermetallic bond is created by a diffusion process 3 basic elements: base metal, flux and solder material
Soldering is an interaction between heat delivery, flux chemistry, and
solder chemistry.
Flux
Solder Heat
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Essential for strong and reliable
solder joint Key factors: 1. Solder material 2. Wetting action 3. Reflow temperature
COLD SOLDER JOINT OPTIMUM EMBRITTLEMENT
INCREASING THICKNESS
Cu-Sn INTERMETALLIC
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
MATERIALS IN ELECTRONICS
Cu6Sn5 Ag3Sn
Faculty of Mechanical Engineering Ali Ourdjini, UTM - 2004
