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Copper Reactivity - Etching

Copper can be etched with solutions like ferric chloride, revealing the grain structure of the metal. [1] This process was used to etch names into copper petals for the 2012 Olympics cauldron. [2] The etching reactions involve copper being oxidized to copper(I) chloride and copper(II) chloride by ferric chloride. [3] While etching can etch small prototype circuit boards, mass production uses electroplating which deposits copper onto circuit boards in a reverse process.

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119 views3 pages

Copper Reactivity - Etching

Copper can be etched with solutions like ferric chloride, revealing the grain structure of the metal. [1] This process was used to etch names into copper petals for the 2012 Olympics cauldron. [2] The etching reactions involve copper being oxidized to copper(I) chloride and copper(II) chloride by ferric chloride. [3] While etching can etch small prototype circuit boards, mass production uses electroplating which deposits copper onto circuit boards in a reverse process.

Uploaded by

Trinetra m
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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CHEMISTRY

Copper Reactivity: 16 - 18 YEARS

Etching

Copper is one of the least reactive metals. However, it does react


with a solution of ferric chloride and also copper chloride. This
has been known for a long time and is a common way of
etching copper.

Etching is a basic tool to reveal the grain structure of copper.


The etchant attacks the polished  copper surface selectively
The letters on this copper petal were
revealing the size and shape of the grains. etched with ferric chloride solution.
(Courtesy of Heatherwick Studio.)
For the 2012 London Olympics, Thomas Heatherwick Studio
designed the now world famous cauldron made from copper
petals. Each one had the name of the competing country etched
into the copper with ferric chloride solution.

A masking tape protects the copper from


the ferric chloride solution except where
the letters are.
(Courtesy of Heatherwick Studio.)

The petal for Bosnia and Herzegovina


The grain structure of a metal determines the properties such as before polishing... (Courtesy of
Heatherwick Studio.)
strength and ductility. The image above is magnified 200 times and
shows the grain structure of etched copper.

...and after. (Courtesy of Heatherwick


Studio.)

1
The chemistry of copper etching

The process has three reactions:

Equation 1 

FeCl3 + Cu → FeCl2 + CuCl


Equation 1 will do the etching by itself because the metallic
copper atom has been oxidised and becomes a copper ion within
the copper chloride in solution, but a second reaction happens, The flower patterns on these jewellery
making this a two-step redox reaction. discs were painted with a lacquer that
resists ferric chloride. The exposed
areas have been partly dissolved by the
Equation 2    ferric chloride, leaving a raised pattern.
(Courtesy of Copperheart.)

FeCl3 + CuCl → FeCl2 + CuCl2


The copper(I) chloride is further oxidised to copper(II) chloride

Just to complicate matters, the copper(II) chloride that builds up in


the etching solution because of Equation 2 also reacts with copper.
So now we have two etchants working although we started with
just one.

Equation 3   

CuCl2 + Cu → 2CuCl

Mass producing circuit boards

Etching can only be used for prototype boards and for school or
hobby electronics. It is difficult to control the process and very
hard to make narrow tracks.

Commercial boards use copper
electroplating. A circuit board, with only a very thin copper
layer, is connected to become the cathode (negative) plate in an
electroplating tank. Copper is then deposited on the tracks and
builds up until they are thick enough. This process is the reverse of
etching. To find out more, try searching for ‘semi-additive process’.

2
Circuit boards in an electroplating machine. Cu2+ ions are attracted Ferric chloride was used to etch away the
to the board and deposited as copper metal. The blue areas do not copper on this board, leaving only the
get plated as they are coated in a film called a resist. (Wikimedia/ circuit tracks remaining. The tracks were
Innoquick.) covered with a protective resist layer to
protect the copper. Areas with no resist
have lost all the copper, leaving the

Questions
fibreglass board exposed. Mass produced
boards are not made this way. They are
made by electroplating copper onto the
board to make the tracks.
(Courtesy of QSL.)
1. Copper atoms in a metal have no charge, but
copper ions in solution as copper chloride
have a positive charge. Write half equations
for the formation of copper(I) and
copper (II) ions.

2. In the electroplating process copper ions in


solution are deposited on the tracks, which
are connected to an electrical negative
terminal to make them the cathode. Write a
half equation with state symbols to describe
the process at the cathode.

Click here for answers

Copper Development Association is a non-profit organisation that provides information on copper’s properties and applications, its essentiality
for health, quality of life and its role in technology. It supports education through a collection of resources spanning biology, chemistry and
physics. These materials have been developed in conjunction with the Association for Science Education, and reviewed by teachers.

For more resources, visit www.copperalliance.org.uk/education.

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