Biomedical Applications of Mems
Biomedical Applications of Mems
Biomedical Applications of Mems
Jack W. Judy
University of California, Los Angeles
68-121 Engineering IV, Box 159410
Los Angeles, CA 90095-1594
Tel: (310) 206-1371
[email protected]
Abstract – Micromachining and MEMS For a discussion of the early work in MEMS,
technologies can be used to produce complex including many of the seminal papers, the interested
electrical, mechanical, fluidic, thermal, optical, reader is directed to reference [1]. For a
and magnetic structures, devices, and systems comprehensive discussion of micromachining
on a scale ranging from organs to subcellular processes and MEMS devices, the interested reader
organelles. This miniaturization ability has is directed to the texts by Kovacs [2] and Madou [3].
enabled MEMS to be applied in many areas of
biology, medicine, and biomedical engineering – MICROFABRICATION
a field generally referred to as BioMEMS. The
future looks bright for BioMEMS to realize (1) Although many of the microfabrication techniques
microsensor arrays that act as an electronic and materials used to produce MEMS have been
nose or tongue, (2) microfabricated neural borrowed from the IC industry, the field of MEMS has
systems capable of controlling motor or sensory also driven the development and refinement of other
prosthetic devices, (3) painless microsurgical microfabrication processes and non-traditional
tools, and (4) complete microfluidic systems for materials.
total chemical or genetic analyses.
Conventional IC Processes and Materials:
INTRODUCTION - photolithography; thermal oxidation; dopant
diffusion; ion implantation; LPCVD; PECVD;
Microelectromechanical systems (MEMS) is a evaporation; sputtering; wet etching; plasma
technology of miniaturization that has been largely etching; reactive-ion etching; ion milling
adopted from the integrated circuit (IC) industry and
applied to the miniaturization of all systems (i.e., not - silicon; silicon dioxide; silicon nitride; aluminum
only electrical systems but also mechanical, optical,
fluidic, magnetic, etc). Miniaturization is Additional Processes and Materials used in MEMS:
accomplished with microfabrication processes, such - anisotropic wet etching of single-crystal silicon;
as micromachining, that typically use lithography, deep reactive-ion etching or DRIE; x-ray
although other non-lithographic precision lithography; electroplating; low-stress LPCVD
microfabrication techniques exist (FIB, EDM, laser films; thick-film resist (SU-8); spin casting;
machining). Due to the enormous breadth and micromolding; batch microassembly
diversity of the field of MEMS, the acronym is not a
particularly apt one. However, it is used almost - piezoelectric films such as PZT; magnetic films
universally to refer to the entire field (i.e., all devices such as Ni, Fe, Co, and rare earth alloys; high
produced by micromachining). Other names for this temperature materials such as SiC and ceramics;
general field include “microsystems”, popular in mechanically robust aluminum alloys; stainless
Europe, and “micromachines”, popular in Asia. steel; platinum; gold; sheet glass; plastics such as
PVC and PDMS
The methods used to integrate multiple patterned typically the case for surface micromachining).
materials together to fabricate a completed MEMS Exploiting the predictable anisotropic etching
device are just as important as the individual characteristics of single-crystal silicon, many high-
processes and materials themselves. The two most precision complex 3-D shapes, such as V-grooves,
general methods of MEMS integration are described channels, pyramidal pits, membranes, vias, and
in the next two sub-sections: surface micromachining nozzles, can be formed [5]. An illustration of a typical
and bulk micromachining. bulk micromachining process is given in Figure 2.
Surface Micromachining
(100) Silicon Wafer
Simply stated, surface micromachining is a method p+ Silicon
of producing MEMS by depositing, patterning, and
etching a sequence of thin films, typically ~1 µm Silicon Nitride Film
thick. One of the most important processing steps
that is required of dynamic MEMS devices is the
selective removal of an underlying film, referred to as
a sacrificial layer, without attacking an overlaying
film, referred to as the structural layer, used to create
the mechanical parts. Figure 1 illustrates a typical {111 Planes}
surface micromachining process [4]. Surface
micromachining has been used to produce a wide
variety of MEMS devices for many different
applications. In fact, some of them are produced
commercially in large volumes (> million parts per
month). Through Membrane V-Groove
Hole
Anchor Sacrificial Layer
ISFETs