MAX9668ETP+

RELIABILITY REPORT

FOR

MAX9668ETP+

PLASTIC ENCAPSULATED DEVICES

February 5, 2009

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Approved by

Ken Wendel

Quality Assurance

Director, Reliability Engineering

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 MAX9668ETP+

Conclusion

The MAX9668ETP+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous
reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.

Table of Contents

I. ........Device Description V. ........Quality Assurance Information

II. ........Manufacturing Information VI. .......Reliability Evaluation

III. .......Packaging Information IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX9668 outputs eight voltage references for gamma correction in TFT LCDs and one voltage reference for VCOM. Each gamma reference
voltage has its own 10-bit digital-to-analog converter (DAC) and buffer to ensure a stable voltage. The VCOM reference voltage has its own 10-bit
DAC and an amplifier to ensure a stable voltage when critical levels and patterns are displayed. The MAX9668 features integrated multiple-time
programmable (MTP) memory to store gamma and VCOM values on the chip, eliminating the need for external EEPROM. The MAX9668 supports
up to 100 write operations to the on-chip nonvolatile memory.

The gamma outputs can drive 250mA peak transient current and settle within 1μs. The VCOM output can provide 400mA peak transient current
and also settles within 1µs. The analog supply voltage range extends from 9V to 20V, and the digital supply voltage range extends from 2.7V to
3.6V.
2
Gamma values and the VCOM value are programmed into registers through the I C interface.

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II. Manufacturing Information

A. Description/Function: 10-Bit Programmable Gamma Reference System with MTP for TFT LCDs
B. Process: S45S
C. Number of Device Transistors: 4548
D. Fabrication Location: Texas
E. Assembly Location: UTL Thailand
F. Date of Initial Production: January 19, 2009

III. Packaging Information

A. Package Type: 20-pin TQFN 5x5

B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Au (1.0 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: #
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity per Level 1
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja: 47°C/W
K. Single Layer Theta Jc: 1.7°C/W
L. Multi Layer Theta Ja: 29°C/W
M. Multi Layer Theta Jc: 1.7°C/W

IV. Die Information

A. Dimensions: 99 X 101 mils

B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect: Aluminum/Si (Si = 1%)
D. Backside Metallization: None
E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectric: SiO2
I. Die Separation Method: Wafer Saw

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 MAX9668ETP+

V. Quality Assurance Information

A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering)

Bryan Preeshl (Managing Director of QA)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:

= 1 = 1.83 (Chi square value for MTTF upper limit)

MTTF 91784 x 4340 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV
And 54780 are number of device hours, 77*192 + 77*1000)
-9
= 2.8 x 10
= 2.8 F.I.T. (60% confidence level @ 25°C)

The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the S45 Process results in a FIT Rate of 0.9 @ 25C and 13.84 @ 55C (0.8 eV, 60% UCL)

B. Moisture Resistance Tests

The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.

C. E.S.D. and Latch-Up Testing

The DV19-1 die type has been found to have all pins able to withstand a transient pulse of

HBM ESD: +/-2500 V per JEDEC JESD22-A114.

HBM CDM: +/-750 V per JEDEC JESD22-C101
HBM MM: +/-250 V per JEDEC JESD22-A115

Latch-Up testing has shown that this device withstands a current of +/-100 mA, 1.5x VCCMax Overvoltage per JESD78.

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Table 1
Reliability Evaluation Test Results

MAX9668ETP+

TEST ITEM TEST CONDITION FAILURE SAMPLE SIZE NUMBER OF

IDENTIFICATION FAILURES

Static Life Test (Note 1)

Ta = 135°C DC Parameters 154 0
Biased & functionality
Time = 1000 hrs.
mixed

Moisture Testing (Note 2)

85/85 Ta = 85°C DC Parameters 77 0
RH = 85% & functionality
Biased
Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature -65°C/150°C DC Parameters 77 0
Cycle 1000 Cycles & functionality
Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data

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