Datasheet

Voltage Detector IC Series

Standard CMOS
Voltage Detector IC
BD48xxx series BD49xxx series

●General Description ●Key Specifications

ROHM’s BD48xxx and BD49xxx series are highly Detection voltage: 2.3V to 6.0V (Typ.),
accurate, low-current Voltage Detector IC series. The 0.1V steps
family includes BD48xxx devices with N-channel open High accuracy detection voltage: ±1.0%
drain output and BD49xxx devices with CMOS output. Ultra-low current consumption: 0.9µA (Typ.)
The devices are available for specific detection voltages
Operating temperature range: -40°C to +105°C
ranging from 2.3V to 6.0V in increments of 0.1V.
●Package
SSOP5: 2.90mm x 2.80mm x 1.25mm
●Features
High accuracy detection
SSOP3: 2.92mm x 2.80mm x 1.25mm
Ultra-low current consumption
Two output types (Nch open drain and CMOS output)
VSOF5: 1.60 mm x 1.60mm x 0.60mm
Wide Operating temperature range
Very small and low height package ●Applications
Package SSOP5 is similar to SOT-23-5 (JEDEC) Circuits using microcontrollers or logic circuits that
Package SSOP3 is similar to SOT-23-3 (JEDEC) require a reset.

●Typical Application Circuit

VDD1 VDD2 VDD1

RL
Micro
BD49xxx RST
Micro controller
BD48xxx RST controller

CL CL
( Capacitor for ( Capacitor for
noise filtering ） noise filtering）
GND GND

(Open Drain Output type） (CMOS Output type）

BD48xxx series BD49xxx series

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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BD48xxx series BD49xxx series Datasheet

●Connection Diagram
SSOP5 N.C. N.C. VSOF5
VDD GND
5 4

Lot. No Marking Lot. No

Marking 1 2 3
VOUT SUB N.C
VOUT VDD GND
TOP VIEW TOP VIEW
●Pin Descriptions
SSOP5 VSOF5
PIN No. Symbol Function PIN No. Symbol Function
1 VOUT Reset Output 1 VOUT Reset Output
2 VDD Power Supply Voltage 2 SUB Substrate*
3 GND GND 3 N.C. Unconnected Terminal
4 N.C. Unconnected Terminal 4 GND GND
5 N.C. Unconnected Terminal 5 VDD Power Supply Voltage
*Connect the substrate to GND.

SSOP3(1pin GND) SSOP3(3pin GND)

VDD GND
3 3
2

Marking Lot. No Marking Lot. No

1 2 1 2
GND VOUT VOUT VDD
TOP VIEW TOP VIEW
●Pin Descriptions
SSOP3-1 SSOP3-2
PIN No. Symbol Function PIN No. Symbol Function
1 GND GND 1 VOUT Reset Output
2 VOUT Reset Output 2 VDD Power Supply Voltage
3 VDD Power Supply Voltage 3 GND GND

Ordering Information

B D x x x x x x - T R

Part Output Type Package1 Reset Voltage Value Package2 Packaging and
Number 48 : Open Drain 23 : 2.3V forming specification
49 : CMOS 0.1V step Embossed tape and reel
60 : 6.0V TR :The pin number 1is
the upper right
:SSOP5
:VSOF5
TL :The pin number 1is
Package1 Package2 Package name the upper left
E G SSOP5 :SSOP3-1
K G SSOP3(1pin GND) :SSOP3-2
L G SSOP3(3pin GND)
Blank FVE VSOF5
Blank G SSOP5

Note: When ordering new SSOP5, select “E” for Package 1 and “G” for Package 2.

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BD48xxx series BD49xxx series Datasheet

SSOP5
<Tape and Reel information>
2.9±0.2 +6 °
4° −4° Tape Embossed carrier tape
5 4
Quantity 3000pcs

+0.2
1.6 −0.1
TR
2.8±0.2

Direction
The direction is the 1pin of product is at the upper right when you hold
of feed ( reel on the left hand and you pull out the tape on the right hand )

0.2Min.
1 2 3

+0.05 1pin
0.13 −0.03
1.25Max.

+0.05
0.42 −0.04
1.1±0.05

0.05±0.05

0.95
0.1
Direction of feed
(Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity.

VSOF5
1.6±0.05
1.0±0.05
0.2MAX

5 4
(MAX 1.28 include BURR)
1.6 ± 0.05
1.2 ± 0.05

1 2 3
0.13±0.05
0.6MAX

0.5 0.22±0.05

(Unit : mm)

SSOP3

2.92±0.1 4°±4°

L
2.8±0.15
1.6±0.1

0.45±0.15

1 2
0.15±0.05
1.1±0.05
1.25MAX

ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ

ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ ＸＸＸ
0.95 0.4±0.1
1.9±0.1

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BD48xxx series BD49xxx series Datasheet

●Lineup

Table 1. Lineup for VSOF5 and SSOP5 Package

Package Type VSOF5 or SSOP5 SSOP5

Output Type Open Drain CMOS Open Drain CMOS

Detection Part Number Part Number Part Number Part Number
Voltage Marking Marking Marking Marking
6.0V EW BD4860 GW BD4960 Cm BD48E60 Ff BD49E60
5.9V EV BD4859 GV BD4959 Ck BD48E59 Fe BD49E59
5.8V EU BD4858 GU BD4958 Ch BD48E58 Fd BD49E58
5.7V ET BD4857 GT BD4957 Cg BD48E57 Fc BD49E57
5.6V ES BD4856 GS BD4956 Cf BD48E56 Fb BD49E56
5.5V ER BD4855 GR BD4955 Ce BD48E55 Fa BD49E55
5.4V EQ BD4854 GQ BD4954 Cd BD48E54 Ey BD49E54
5.3V EP BD4853 GP BD4953 Cc BD48E53 Er BD49E53
5.2V EN BD4852 GN BD4952 Cb BD48E52 Ep BD49E52
5.1V EM BD4851 GM BD4951 Ca BD48E51 En BD49E51
5.0V EL BD4850 GL BD4950 By BD48E50 Em BD49E50
4.9V EK BD4849 GK BD4949 Br BD48E49 Ek BD49E49
4.8V EJ BD4848 GJ BD4948 Bp BD48E48 Eh BD49E48
4.7V EH BD4847 GH BD4947 Bn BD48E47 Eg BD49E47
4.6V EG BD4846 GG BD4946 Bm BD48E46 Ef BD49E46
4.5V EF BD4845 GF BD4945 Bk BD48E45 Ee BD49E45
4.4V EE BD4844 GE BD4944 Bh BD48E44 Ed BD49E44
4.3V ED BD4843 GD BD4943 Bg BD48E43 Ec BD49E43
4.2V EC BD4842 GC BD4942 Bf BD48E42 Eb BD49E42
4.1V EB BD4841 GB BD4941 Be BD48E41 Ea BD49E41
4.0V EA BD4840 GA BD4940 Bd BD48E40 Dy BD49E40
3.9V DV BD4839 FV BD4939 Bc BD48E39 Dr BD49E39
3.8V DU BD4838 FU BD4938 Bb BD48E38 Dp BD49E38
3.7V DT BD4837 FT BD4937 Ba BD48E37 Dn BD49E37
3.6V DS BD4836 FS BD4936 Ay BD48E36 Dm BD49E36
3.5V DR BD4835 FR BD4935 Ar BD48E35 Dk BD49E35
3.4V DQ BD4834 FQ BD4934 Ap BD48E34 Dh BD49E34
3.3V DP BD4833 FP BD4933 An BD48E33 Dg BD49E33
3.2V DN BD4832 FN BD4932 Am BD48E32 Df BD49E32
3.1V DM BD4831 FM BD4931 Ak BD48E31 De BD49E31
3.0V DL BD4830 FL BD4930 Ah BD48E30 Dd BD49E30
2.9V DK BD4829 FK BD4929 Ag BD48E29 Dc BD49E29
2.8V DJ BD4828 FJ BD4928 Af BD48E28 Db BD49E28
2.7V DH BD4827 FH BD4927 Ae BD48E27 Da BD49E27
2.6V DG BD4826 FG BD4926 Ad BD48E26 Cy BD49E26
2.5V DF BD4825 FF BD4925 Ac BD48E25 Cr BD49E25
2.4V DE BD4824 FE BD4924 Ab BD48E24 Cp BD49E24
2.3V DD BD4823 FD BD4923 Aa BD48E23 Cn BD49E23

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●Lineup - continued

Table 2. Lineup for SSOF3(1pin GND) and SSOP3(3pin GND) Package

Package Type SSOP3(1pin GND) SSOP3(3pin GND)

Output Type Open Drain CMOS Open Drain CMOS

Detection Part Number Part Number Part Number Part Number
Voltage Marking Marking Marking Marking
6.0V Cm BD48K60 Ff BD49K60 Kb BD48L60 Np BD49L60
5.9V Ck BD48K59 Fe BD49K59 Ka BD48L59 Nn BD49L59
5.8V Ch BD48K58 Fd BD49K58 Hy BD48L58 Nm BD49L58
5.7V Cg BD48K57 Fc BD49K57 Hr BD48L57 Nk BD49L57
5.6V Cf BD48K56 Fb BD49K56 Hp BD48L56 Nh BD49L56
5.5V Ce BD48K55 Fa BD49K55 Hn BD48L55 Ng BD49L55
5.4V Cd BD48K54 Ey BD49K54 Hm BD48L54 Nf BD49L54
5.3V Cc BD48K53 Er BD49K53 Hk BD48L53 Ne BD49L53
5.2V Cb BD48K52 Ep BD49K52 Hh BD48L52 Nd BD49L52
5.1V Ca BD48K51 En BD49K51 Hg BD48L51 Nc BD49L51
5.0V By BD48K50 Em BD49K50 Hf BD48L50 Nb BD49L50
4.9V Br BD48K49 Ek BD49K49 He BD48L49 Na BD49L49
4.8V Bp BD48K48 Eh BD49K48 Hd BD48L48 My BD49L48
4.7V Bn BD48K47 Eg BD49K47 Hc BD48L47 Mr BD49L47
4.6V Bm BD48K46 Ef BD49K46 Hb BD48L46 Mp BD49L46
4.5V Bk BD48K45 Ee BD49K45 Ha BD48L45 Mn BD49L45
4.4V Bh BD48K44 Ed BD49K44 Gy BD48L44 Mm BD49L44
4.3V Bg BD48K43 Ec BD49K43 Gr BD48L43 Mk BD49L43
4.2V Bf BD48K42 Eb BD49K42 Gp BD48L42 Mh BD49L42
4.1V Be BD48K41 Ea BD49K41 Gn BD48L41 Mg BD49L41
4.0V Bd BD48K40 Dy BD49K40 Gm BD48L40 Mf BD49L40
3.9V Bc BD48K39 Dr BD49K39 Gk BD48L39 Me BD49L39
3.8V Bb BD48K38 Dp BD49K38 Gh BD48L38 Md BD49L38
3.7V Ba BD48K37 Dn BD49K37 Gg BD48L37 Mc BD49L37
3.6V Ay BD48K36 Dm BD49K36 Gf BD48L36 Mb BD49L36
3.5V Ar BD48K35 Dk BD49K35 Ge BD48L35 Ma BD49L35
3.4V Ap BD48K34 Dh BD49K34 Gd BD48L34 Ky BD49L34
3.3V An BD48K33 Dg BD49K33 Gc BD48L33 Kr BD49L33
3.2V Am BD48K32 Df BD49K32 Gb BD48L32 Kp BD49L32
3.1V Ak BD48K31 De BD49K31 Ga BD48L31 Kn BD49L31
3.0V Ah BD48K30 Dd BD49K30 Fy BD48L30 Km BD49L30
2.9V Ag BD48K29 Dc BD49K29 Fr BD48L29 Kk BD49L29
2.8V Af BD48K28 Db BD49K28 Fp BD48L28 Kh BD49L28
2.7V Ae BD48K27 Da BD49K27 Fn BD48L27 Kg BD49L27
2.6V Ad BD48K26 Cy BD49K26 Fm BD48L26 Kf BD49L26
2.5V Ac BD48K25 Cr BD49K25 Fk BD48L25 Ke BD49L25
2.4V Ab BD48K24 Cp BD49K24 Fh BD48L24 Kd BD49L24
2.3V Aa BD48K23 Cn BD49K23 Fg BD48L23 Kc BD49L23

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BD48xxx series BD49xxx series Datasheet

●Absolute Maximum Ratings

Parameter Symbol Limits Unit
Power Supply Voltage VDD-GND -0.3 to +10 V
Nch Open Drain Output GND-0.3 to +10
Output Voltage VOUT V
CMOS Output GND-0.3 to VDD+0.3
Output Current Io 70 mA
*1*4
SSOP5 540
Power *2*4
SSOP3 Pd 700 mW
Dissipation *3*4
VSOF5 210
Operating Temperature Topr -40 to +105 °C
Ambient Storage Temperature Tstg -55 to +125 °C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 Reduced by 7.0mW/°C when used over 25°C.
*3 Reduced by 2.1mW/°C when used over 25°C.
*4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C)

Limit
Parameter Symbol Condition Unit
Min. Typ. Max.
*1 VDET(T) VDET(T)
RL=470kΩ, VDD=H L VDET(T)
×0.99 ×1.01
Ta=+25°C 2.475 2.5 2.525
VDET=2.5V Ta=-40°C to 85°C 2.418 - 2.584
Ta=85°C to 105°C 2.404 - 2.597
Ta=+25°C 2.970 3.0 3.030
VDET=3.0V Ta=-40°C to 85°C 2.901 - 3.100
Ta=85°C to 105°C 2.885 - 3.117
Detection Voltage VDET Ta=+25°C 3.267 3.3 3.333 V
VDET=3.3V Ta=-40°C to 85°C 3.191 - 3.410
Ta=85°C to 105°C 3.173 - 3.428
Ta=+25°C 4.158 4.2 4.242
VDET=4.2V Ta=-40°C to 85°C 4.061 - 4.341
Ta=85°C to 105°C 4.039 - 4.364
Ta=+25°C 4.752 4.8 4.848
VDET=4.8V Ta=-40°C to 85°C 4.641 - 4.961
Ta=85°C to 105°C 4.616 - 4.987
*2
CL=100pF RＬ=100kΩ
Output Delay Time “L H” tPLH - - 100 µs
Vout=GND 50%
VDET=2.3-3.1V - 0.51 1.53
*1 VDET=3.2-4.2V - 0.56 1.68
Circuit Current when ON ICC1 VDD=VDET-0.2V µA
VDET=4.3-5.2V - 0.60 1.80
VDET=5.3-6.0V - 0.66 1.98
VDET=2.3-3.1V - 0.75 2.25
*1 VDET=3.2-4.2V - 0.80 2.40
Circuit Current when OFF ICC2 VDD=VDET+2.0V µA
VDET=4.3-5.2V - 0.85 2.55
VDET=5.3-6.0V - 0.90 2.70
VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ 0.95 - -
Operating Voltage Range VOPL V
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ 1.20 - -
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.
*2 tPLH:VDD=(VDET typ.-0.5V) (VDET typ.+0.5V)

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●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C) - continued

Limit
Parameter Symbol Condition Unit
Min. Typ. Max.
VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V - - 0.5
‘Low’Output Voltage (Nch) VOL V
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V - - 0.5
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5 - -
‘High’Output Voltage (Pch)
VOH VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V) VDD-0.5 - - V
(BD49Exxx Series)
VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V) VDD-0.5 - -
Leak Current when OFF *1
Ileak VDD=VDS=10V - - 0.1 µA
(BD48xxx Series)
Detection Voltage Ta=-40°C to 105°C
VDET/∆T - ±100 ±360 ppm/°C
Temperature coefficient (Designed Guarantee)
Hysteresis Voltage ∆VDET VDD=L H L, RL=470kΩ VDET×0.03 VDET×0.05 VDET×0.08 V
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.

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BD48xxx series BD49xxx series Datasheet

●Block Diagrams

VDD

VOUT

Vref

GND

Fig.1 BD48xxx series

VDD

VOUT
Vref

GND

Fig.2 BD49xxx series

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BD48xxx series BD49xxx series Datasheet

●Typical Performance Curves

2.0 20

"LOW" OUTPUT CURRENT ： IOL [mA]

【BD48x42】 】
【BD4842G/FVE BD4842G/FVE
BD48x42】 】
CIRCUIT CURRENT ： IDD[µA]

【【
【BD49x42】 【BD49x42】
1.5 15

1.0 10
VDD =2.4V

0.5 5

VDD =1.2V
0.0 0
0 1 2 3 4 5 6 7 8 9 10 0.0 0.5 1.0 1.5 2.0 2.5

VDD SUPPLY VOLTAGE ：VDD[V] DRAIN-SOURCE VOLTAGE ： VDS[V]

Fig.3 Circuit Current Fig.4 “Low” Output Current

45 9
"HIGH" OUTPUT CURRENT ： IOH[mA]

40 BD4942G/FVE
【【 BD49x42】 】 8 BD4842G/FVE
【【 BD48x42】 】
OUTPUT VOLTAGE： VOUT [V]

35 7 【BD49x42】
30 6
25 5
20 4
VDD=8.0V
15 3
10 VDD=6.0V Ta=25℃
2
5 1
VDD=4.8V
Ta=25℃
0 0
0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD [V]

Fig.5 “High” Output Current Fig.6 I/O Characteristics

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●Typical Performance Curves – continued

1.0
: VOUT [V]

5.4 【
【【BD4842G/FVE
BD48x42
BD48x42x】】 】
【BD48x42
BD48x42x
【BD4842G/FVE
【 】 】】

DETECTION VOLTAGE: VDET[V]

【BD49x42】
0.8 【BD49x42】 5.0
OUTPUT VOLTAGE

Low to High(VDET+∆VDET）
0.6 4.6

4.2
0.4

3.8 High to Low(VDET）

0.2
3.4
0.0
～
～
0 0.5 1 1.5 2 2.5 3.0
-40 0 40 80
SUPPLY VOLTAGE : [V] TEMPERATURE : Ta[℃]
Fig.7 Operating Limit Voltage Fig.8 Detection Voltage
Release Voltage

1.5 1.5
CIRCUIT CURRENT WHEN OFF ： I DD2[μA]
CIRCUIT CURRENT WHEN ON ： IDD1[μA]

【BD4842G/FVE
【【 BD48x42x
BD48x42】】 】 BD48x42x
BD4842G/FVE
【【【 BD48x42】】 】

【BD49x42】 【BD49x42】
1.0 1.0

0.5 0.5

0.0 0.0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃]

Fig.9 Circuit Current when ON Fig.10 Circuit Current when OFF

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BD48xxx series BD49xxx series Datasheet

●Typical Performance Curves – continued

1.5
MINIMUM OPERATION VOLTAGE ： VOPL[V]

【 BD48x42x 】 】
【BD4842G/FVE
【BD48x42】

【BD49x42】
1.0

0.5

0.0
-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

Fig.11 Operating Limit Voltage

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BD48xxx series BD49xxx series Datasheet

●Application Information
Explanation of Operation
For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the appropriate threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical
Characteristics for information on hysteresis.
Because the BD48xxx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another
power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power
supply].

VDD
VDD

R1 RL R1

Vref Vref
Q2
VOUT
VOUT
R2 R2
Q1
Q1

R3 R3

GND GND

Fig.12 (BD48xxx series Internal Block Diagram) Fig.13 (BD49xxx series Internal Block Diagram)

Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
Part Number tPLH (µs) tPHL (µs)
BD48x45 39.5 87.8
BD49x45 32.4 52.4
VDD=4.3V 5.1V VDD=5.1V 4.3V
*These data are for reference only.
The figures will vary with the application, so please check actual operating conditions before use.

Timing Waveform
Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the
input power supply voltage VDD swept up and down (the circuits are those in Fig.12 and 13).

1 When the power supply is turned on, the output is unstable

VDD from after over the operating limit voltage (VOPL) until tPHL.
VDET+ΔVDET Therefore it is possible that the reset signal is not outputted when
⑤
VDET the rise time of VDD is faster than tPHL.
2 When V
VOPL DD is greater than VOPL but less than the reset release
0V voltage (VDET + ∆VDET), the output voltages will switch to Low.
3 If V
DD exceeds the reset release voltage (VDET + ∆VDET), then
VOUT
VOUT switches from L to H.
VOH
4 If V
DD drops below the detection voltage (VDET) when the power
tPHL tPLH tPLH
supply is powered down or when there is a power supply
tPHL fluctuation, VOUT switches to L (with a delay of tPHL).
VOL
5 The potential difference between the detection voltage and the
① ② ③ ④ release voltage is known as the hysteresis width (∆VDET). The
Fig.14 Timing Waveform system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.

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BD48xxx series BD49xxx series Datasheet

●Circuit Applications
1) Examples of a common power supply detection reset circuit.

VDD1 VDD2
Application examples of BD48xxx series (Open Drain
output type) and BD49xxx series (CMOS output type)
are shown on the left.
RL

Micro CASE1: Power supply of the microcontroller (VDD2)

BD48xxx RST controller
differs from the power supply of the reset detection IC
(VDD1).
CL
Use an open drain output type (BD48xxx) device with a
( capacitor is for
noise filtering ）
load resistance RL attached as shown in figure 15.
GND

CASE2: Power supply of the microcontroller (VDD1) is

Fig.15 Open Drain Output Type same as the power supply of the reset detection IC
(VDD1).
Use a CMOS output type (BD49xxx) device or an open
drain device with a pull up resistor between output and
VDD1
VDD1.

Micro When a capacitance CL for noise filtering is connected to

BD49xxx RST controller
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the rise and
fall waveform of the output voltage (VOUT).
CL
( capacitor is for
filtering）
GND The Electrical characteristics were measured using
RL= 470kΩ and CL = 100pF.

Fig.16 CMOS Output Type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.

VDD1 VDD2 VDD3

RL

Microcontroller
BD48xxx BD48xxx RST

GND

Fig.17

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD48xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.

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BD48xxx series BD49xxx series Datasheet

3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow
may cause malfunction in the systems operation such as output oscillations, etc.

V1

R2
I1
VDD

R1 BD48xxx
VOUT
CIN BD49xxx

CL
GND

Fig.18

When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the
VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at
“Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will
switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will
result to oscillation.
IDD

Through Current

VDD
0 VDET

Fig.19 Current Consumption vs. Power Supply Voltage

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BD48xxx series BD49xxx series Datasheet

●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The VDD line impedance might cause oscillation because of the detection current.

8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.

10) External parameters

The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.

11) Power on reset operation

Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.

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 Datasheet

Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE Rev.002
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 Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice - GE Rev.002
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 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
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