方瑞达(smith):集成電路設計和電路設計軟件 。 Smith (Fangruida) Integrated circuit design and circuit design software. Smith (Fangruida)

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Integrated circuit design and circuit design software.

Smith (Fangruida)
The extreme importance of electronic information technology and computer technology in modern society is self-eviden
t.
VLSI is an integrated circuit that combines a large number of transistors into a single chip, and its degree of integration
is larger than that of a large-scale integrated circuit.

Simulation category: Multisim, Proteus, PSPICE.


Schematic, PCB drawing tools: Protel software.

The development of modern science and technology has led the world's industrial revolution, aerospace revolution, soci
al revolution and reform. Aerospace technology, high-speed heavy-duty non-chemical fuel rocket technology, biochips,
VLSI, biotechnology, computer technology, internet technology, mechatronics technology, e-commerce technology, mar
ine technology, intelligent technology, etc. for all humans The impact is huge, including clothing, food, living and work.
Mechatronics, electronic information, large-scale integrated circuits and ultra-large-scale integrated circuits are particul
arly important technologies and involve various aspects. Intel has always been the world's largest chip maker. Of the CP
Us used in personal computers, Intel has a 80% share.
In 2016, Intel remained the world's largest chip supplier. Its annual chip sales reached 54.09 billion U.S. dollars, an incr
ease of 4.6% from 2015; its market share was 15.7%.
In the mobile phone chip, Qualcomm is another giant. Electronic circuit technology, biochips, and electronic chips are c
utting-edge and cutting-edge technologies in modern science. Electromechanical manufacturing, informatization, comm
unications, etc. are inconceivable without it. The design and manufacture of large-scale integrated circuits and VLSI cir
cuits is an important symbol of national science and technology water products. The United States, Europe, Japan, and o
ther countries are leading the way. China and Russia are lagging behind.

Power consumption and heat dissipation: With the increase in the scale of component integration, the thermal power ge
nerated per unit volume also gradually increases. However, the heat dissipation area of the device does not change and t
he heat dissipation per unit area does not meet the requirements. For example, dynamic voltage and frequency scaling
(DVFS) to reduce the total power dissipated.
Process deviation: Since lithography is limited by optical laws, more precise doping and etching will become more diffi
cult and the possibility of errors will increase. Designers must perform technical simulations before the chip is manufact
ured.
Strict design rules: Due to lithography and etching processes, the design rules for integrated circuit layout must be more
stringent. When designing the layout,
The manufacturing process of a chip is very complicated. A production line involves many industries and thousands of p
rocesses. Wafer processing plant contains two processes before and after, the former process is divided into several maj
or modules - photolithography, thin film, etching, cleaning, injection; the latter process is mainly package - interconnect,
wire, seal. Among them, photolithography is a link between manufacturing and design.
Chip design and manufacturing, including general-purpose integrated circuits and application-specific integrated circuit
s, hybrid circuits, software development and so on. Landing on the Moon, landing on Mars, rocket launching, aircraft ca
rrier electromechanical, large-scale integrated circuits, and ultra-large-scale integrated circuits play an extraordinary rol
e. It must not be taken lightly.
Design Convergence: As the clock frequency of digital electronic applications tends to rise, designers find it more diffic
ult to keep low clock skew across the entire chip.
Cost: As the grain size shrinks, the wafer size increases and the number of grains per unit area of the wafer increases, so
that the complexity of the photomask used in the manufacturing process increases dramatically. Modern high-precision
photomask technology is very expensive.

Chip manufacturing technology, specialization, high-precision technology, advanced equipment and so on. The first is t
he circuit design, and the technical difficulties are very complicated. A large number of highly qualified circuit engineer
s and electronic engineers are required. Basic education and training are essential. The basic sciences of Europe, the Uni
ted States, Japan and other countries are profound, and their technology research and development are strong. They hav
e always maintained a leading position in the world.
Due to the complexity of integrated circuit systems, engineers often rely on electronic design automation tools for comp
uter-aided design. Logic synthesis is the most significant embodiment of electronic design automation in digital integrat
ed circuit design. . Electronic design automation tools enable engineers to move from complex gate-level designs to fun
ctional designs, while the underlying conversions are done by automated tools.

Completing the entire integrated circuit design often involves the use of multiple electronic design automation tools. So
me companies specialize in integrated circuit computer-aided design tool suites such as Synopsys, Cadence, Mentor Gra
phics, Agilent, Altium, Xilinx, and others. Electronic design automation tools itself as a kind of software, behind which
rely on a variety of computer algorithms. Therefore, the development of electronic design automation tools is closer to t
he scope of software design.
Well-known companies · China's free directory of resources ·

The list of the world's major chip makers


For Nvidia, Intel, NXP, IBM, AMD, Google, ARM/Softbank, Apple, Qualcomm, Broadcom (Broadcom), Samsung, Hu
awei, Imagination (UK), Synopsys, and MediaTek

Intel
Samsung Electronics
Texas Instruments
Toshiba
STMicroelectronics
Renesas Technology
Infineon
NEC Electronics

Integrated circuit design (IC design) is based on the scale of integration of current integrated circuits and may also be re
ferred to as VLSI design [refers to integrated circuits or VLSI designs. Design Flow.
References:
CMOS VLSI Design Fourth Edition
Author: (United States) West, (United States) Harris, Zhou Runde
Publication date: 2012
Wikipedia. Digital Design Principles and Practice Fourth Edition (John F. Wakerly

集成電路設計和電路設計軟件 。 Smith(Fangruida)
電子信息技術,計算機技術在現代社會的極端重要性不言而喻。
超大規模集成電路,是一種將大量晶體管組合到單一芯片的集成電路,其集成度大於大規模集成電路。

仿真模擬類:Multisim,Proteus,PSPICE。
原理圖,PCB 繪製工具:Protel 等軟件。

現代科技發展,引領世界工業革命,航天革命,社會革命和變革。航天技術,高速重載非化學燃料火箭技術,
生物芯片,超大規模集成電路,生物技術,電子計算機技術,互聯網技術,機電一體化技術,電子商務技術,
海洋技術,智能化技術等等對於全人類的影響巨大,包括衣食居行,生活工作和學習。機電一體化,電子信
息,大規模集成電路和超大規模集成電路是特殊重要的技術,涉及各種各方面。英特爾一直是世界上最大的芯
片製造商。個人計算機所用的 CPU 處理器中,英特爾就佔據了八成份額。
2016 年英特爾仍是全球最大芯片供應商,全年芯片銷售額達 540.9 億美元,較 2015 年增長 4.6%;市場份額達
15.7%。
而在手機芯片中,高通是另一大巨頭。電子電路技術,生物芯片,電子芯片是現代科技術的尖端和前沿。機電
製造,信息化,通訊等等沒有它,簡直不可想像。大規模集成電路和超大規模集成電路設計和製造是一個國家
科學技術水品的重要標誌。美歐日本等國家獨領風騷,中俄等相對滯後。

功耗、散熱:隨著元件集成規模的提升,單位體積產生的熱功率也逐漸變大,然而器件散熱面積不變,造成單
位面積的熱耗散達不到要求。例如動態電壓/頻率調節(dynamic voltage and frequency scaling (DVFS)),來降
低耗散總功率。
工藝性偏差:由於光刻技術受限於光學規律,更高精確度的摻雜以及刻蝕會變得更加困難,造成誤差的可能性
會變大。設計者必須在芯片製造前進行技術仿真。
嚴格的設計規律規則:由於光刻和刻蝕工藝的問題,集成電路佈局的設計規則必須更加嚴格。在設計佈局時,
一顆芯片的製造工藝非常複雜,一條生產線大約涉及好多多個行業、幾千道工序。晶元加工廠包含前後兩道工
藝,前道工藝分幾大模塊——光刻、薄膜、刻蝕、清洗、注入;後道工藝主要是封裝——互聯、打線、密封。
其中,光刻是製造和設計的紐帶。
芯片設計製造,包括通用集成電路和專用集成電路,混合電路,軟件研發等等。登陸月球,登陸火星,火箭導
彈發射,航母機電,大規模集成電路和超大規模集成電路作用非凡,絕不可等閒視之。
設計收斂:由於數字電子應用的時鐘頻率趨於上升,設計者發現要在整個芯片上保持低時鐘偏移更加困難。
成本:隨著晶粒尺寸的縮小,晶圓尺寸變大,單位晶圓面積上的晶粒數增加,這樣製造工藝所用到的光掩模的
複雜程度就急劇上升。現代高精度的光掩模技術十分昂貴。

芯片製造技術,專業化,高精技術,先進設備等等。首先就是電路設計,技術難點十分複雜。需要大量的高
素質的電路工程師,電子工程師。基礎教育和培訓至關重要。歐美日等基礎科學深厚,技術研發強勁,在世界
一直保持領先地位。
由於集成電路系統的複雜性,工程師往往需要藉助電子設計自動化工具來進行計算機輔助設計。邏輯綜合就是
電子設計自動化在數字集成電路設計中最顯著的體現。 。電子設計自動化工具使得工程師能夠從復雜的門級
設計轉到功能設計,而底層的轉換由自動工具完成,

完成整個集成電路設計常常涉及多個電子設計自動化工具的運用。有些公司專門從事集成電路計算機輔助設計
工具套件的,例如 Synopsys、Cadence、Mentor Graphics、Agilent、Altium、Xilinx 等。電子設計自動化工具的
本身作為一種軟件,背後依靠的是各種計算機算法。因此電子設計自動化工具的開發更加接近軟件設計的範
疇,

知名企業 · 中國免費名錄資源 ·

全球主要芯片廠商排名名單
為輝達(Nvidia)、英特爾(Intel)、恩智浦(NXP)、IBM、超威(AMD)、Google、ARM(安謀)/Softbank(軟銀)、Appl
e(蘋果)、Qualcomm(高通)、Broadcom (博通)、三星、華為、Imagination(英國)、Synopsys(新思)以及聯發科

英特爾
三星電子
德州儀器
東芝
意法半導體
瑞薩科技
英飛凌
NEC 電子

集成電路設計(英語:Integrated circuit design, IC design),根據當前集成電路的集成規模,亦可稱之為超大規


模集成電路設計(VLSI design)[是指以集成電路、超大規模集成電路為目標的設計流程。
參考資料:
CMOS 超大規模集成電路設計 第四版
作 者: (美)韋斯特,(美)哈里斯 著,周潤德 譯
出版時間: 2012
維基百科。數字設計原理與實踐 第四版(john F.Wakerly

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