54F/74F14 Hex Inverter Schmitt Trigger: General Description

Download as pdf or txt
Download as pdf or txt
You are on page 1of 8

54F/74F14 Hex Inverter Schmitt Trigger

December 1994

54F/74F14
Hex Inverter Schmitt Trigger
General Description
The ’F14 contains six logic inverters which accept standard effectively speed-up slow input transition, and provide differ-
TTL input signals and provide standard TTL output levels. ent input threshold voltages for positive and negative-going
They are capable of transforming slowly changing input sig- transitions. This hysteresis between the positive-going and
nals into sharply defined, jitter-free output signals. In addi- negative-going input thresholds (typically 800 mV) is deter-
tion, they have a greater noise margin than conventional mined internally by resistor ratios and is essentially insensi-
inverters. tive to temperature and supply voltage variations.
Each circuit contains a Schmitt trigger followed by a Darling-
ton level shifter and a phase splitter driving a TTL totem- Features
pole output. The Schmitt trigger uses positive feed back to Y Guaranteed 4000V minimum ESD protection
Y Standard Military Drawing
Ð 5962-88752

Package
Commercial Military Package Description
Number
74F14PC N14A 14-Lead (0.300× Wide) Molded Dual-In-Line
54F14DM (Note 2) J14A 14-Lead Ceramic Dual-In-Line
74F14SC (Note 1) M14A 14-Lead (0.150× Wide) Molded Small Outline, JEDEC
74F14SJ (Note 1) M14D 14-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F14FM (Note 2) W14B 14-Lead Cerpack
54F14LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13× reel. Use Suffix e SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.

Logic Symbol Connection Diagrams


Pin Assignment Pin Assignment
IEEE/IEC DIP, SOIC and Flatpak for LCC

TL/F/9461 – 1

TL/F/9461 – 2
TL/F/9461–3

TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.

C1995 National Semiconductor Corporation TL/F/9461 RRD-B30M75/Printed in U. S. A.


Unit Loading/Fan Out
54F/74F
Pin Names Description U.L. Input IIH/IIL
HIGH/LOW Output IOH/IOL
In Input 1.0/1.0 20 mA/b0.6 mA
On Output 50/33.3 b 1 mA/20 mA

Function Table

Input Output
A O
L H
H L
H e HIGH Voltage Level
L e LOW Voltage Level

2
Absolute Maximum Ratings (Note 1) Recommended Operating
If Military/Aerospace specified devices are required, Conditions
please contact the National Semiconductor Sales
Free Air Ambient Temperature
Office/Distributors for availability and specifications.
Military b 55§ C to a 125§ C
Storage Temperature b 65§ C to a 150§ C Commercial 0§ C to a 70§ C
Ambient Temperature under Bias b 55§ C to a 125§ C Supply Voltage
Junction Temperature under Bias b 55§ C to a 175§ C Military a 4.5V to a 5.5V
VCC Pin Potential to Commercial a 4.5V to a 5.5V
Ground Pin b 0.5V to a 7.0V
Input Voltage (Note 2) b 0.5V to a 7.0V
Input Current (Note 2) b 30 mA to a 5.0 mA
Voltage Applied to Output
in HIGH State (with VCC e 0V)
Standard Output b 0.5V to VCC
TRI-STATEÉ Output b 0.5V to a 5.5V
Current Applied to Output
in LOW State (Max) twice the rated IOL (mA)
ESD Last Passing Voltage (Min) 4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.

DC Electrical Characteristics
54F/74F
Symbol Parameter Units VCC Conditions
Min Typ Max
VT a Positive-Going Threshold 1.5 1.7 2.0 V 5.0V
VTb Negative-Going Threshold 0.7 0.9 1.1 V 5.0V
DVT Hysteresis (VT a – VTb) 0.4 0.8 V 5.0V
VCD Input Clamp Diode Voltage b 1.2 V Min IIN e b18 mA
VOH Output HIGH 54F 10% VCC 2.5 IOH e b1 mA
Voltage 74F 10% VCC 2.5 V Min IOH e b1 mA
74F 5% VCC 2.7 IOH e b1 mA
VOL Output LOW 54F 10% VCC 0.5 IOL e 20 mA
V Min
Voltage 74F 10% VCC 0.5 IOL e 20 mA
IIH Input HIGH 54F 20.0 VIN e 2.7V
mA Max
Current 74F 5.0
IBVI Input HIGH Current 54F 100 VIN e 7.0V
mA Max
Breakdown Test 74F 7.0
ICEX Output HIGH 54F 250 VOUT e VCC
mA Max
Leakage Current 74F 50
VID Input Leakage IID e 1.9 mA
74F 4.75 V Max
Test All Other Pins Grounded
IOD Output Leakage VIOD e 150 mV
74F 3.75 mA 0.0
Circuit Current All Other Pins Grounded
IIL Input LOW Current b 0.6 mA Max VIN e 0.5V
IOS Output Short-Circuit Current b 60 b 150 mA Max VOUT e 0V
ICCH Power Supply Current 25 mA Max VO e HIGH
ICCL Power Supply Current 25 mA Max VO e LOW

3
AC Electrical Characteristics
74F 54F 74F
TA e a 25§ C
TA, VCC e Mil TA, VCC e Com
Symbol Parameter VCC e a 5.0V Units
CL e 50 pF CL e 50 pF
CL e 50 pF
Min Max Min Max Min Max
tPLH Propagation Delay 4.0 10.5 4.0 13.0 4.0 11.5
ns
tPHL In x On 3.5 8.5 3.5 10.0 3.5 9.0

Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:

74F 14 S C X

Temperature Range Family Special Variations


74F e Commercial QB e Military grade device with
54F e Military environmental and burn-in
processing
Device Type X e Devices shipped in 13× reels
Package Code Temperature Range
P e Plastic DIP C e Commercial (0§ C to a 70§ C)
D e Ceramic DIP M e Military (b55§ C to a 125§ C)
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ

4
Physical Dimensions inches (millimeters)

20-Terminal Ceramic Leadless Chip Carrier (L)


NS Package Number E20A

5
Physical Dimensions inches (millimeters) (Continued)

14-Lead Ceramic Dual-In-Line Package (D)


NS Package Number J14A

14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S)


NS Package Number M14A

6
Physical Dimensions inches (millimeters) (Continued)

14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)


NS Package Number M14D

14-Lead (0.300× Wide) Molded Dual-In-Line Package (P)


NS Package Number N14A

7
54F/74F14 Hex Inverter Schmitt Trigger
Physical Dimensions inches (millimeters) (Continued)

14-Lead Ceramic Flatpak (F)


NS Package Number W14B

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.

National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor
Corporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd.
2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16
P.O. Box 58090 D-82256 F4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park Drive
Santa Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business Park
Tel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, Melbourne
TWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia
Fax: (81-41) 35-1 Ciba Prefecture 261 Fax: (852) 2736-9960 Telex: 391-1131931 NSBR BR Tel: (3) 558-9999
Tel: (043) 299-2300 Fax: (55-11) 212-1181 Fax: (3) 558-9998
Fax: (043) 299-2500

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

You might also like