FL1100
FL1100
FL1100
PCI Express to 4-Port USB 3.0 Host Controller
Revision 1.10
August 2012
Revision History
Revision Date Comment
0.20 30 Jun 2011 Preliminary release
0.21 10 Jul 2011 Change signal type to LVTTL of following pins: SMIN, ROMSDA, ROMSCL
Update features
Update support ambient temperature
Add Chapter 5 PCI Express Registers
0.50 31 Oct 2011 Update pins:
NC: B16, B39, A47,
AVCC12: A6, B10, B43, B50
Update Appendix A: reference footprint
Update section 4.6: power consumption data
Update Appendix A: update reference footprint from FL1009
Update Appendix C: add description in "long" and "hot" thermal profile recommendation.
1.00 15 Jan 2012 Update section 2.2: add pull up/down to below signals: PREST#, OVCN0-3, ROMSDA,
ROMSCL, ROMPRES.
Update section 3.6.2: Supplement HW LPM description.
Update section 3.2: description of xHCI controller.
Update Appendix A.1: Update POD from Amkor: exposure pad size change
1.10 15 Aug 2012
Update Appendix A.2: Update exposure pad footprint
Table of Contents
1. Introduction ................................................................................................................................................. 7
1.1 Features ..................................................................................................................................... 8
1.2 Applications ............................................................................................................................... 8
1.3 Ordering Information .................................................................................................................. 8
1.4 Top Marking ............................................................................................................................... 9
2. Signal Description ..................................................................................................................................... 10
2.1 Ballout Definition ....................................................................................................................... 11
2.2 Signal Descriptions .................................................................................................................. 12
2.2.1 PCI Express Interface ..................................................................................................... 12
2.2.2 USB Port 0 Interface ....................................................................................................... 12
2.2.3 USB Port 1 Interface ....................................................................................................... 12
2.2.4 USB Port 2 Interface ....................................................................................................... 13
2.2.5 USB Port 3 Interface ....................................................................................................... 13
2.2.6 Miscellaneous Signals .................................................................................................... 13
2.2.7 Power / Ground ............................................................................................................... 14
2.2.8 NC Pins ........................................................................................................................... 14
3. Function Description ................................................................................................................................. 15
3.1 Block Diagram ......................................................................................................................... 15
3.2 xHCI Controller ........................................................................................................................ 15
3.3 Root Hub and Root Ports ........................................................................................................ 16
3.4 USB Transceiver ...................................................................................................................... 16
3.5 PCI Express Transceiver ......................................................................................................... 16
3.6 Power Management ................................................................................................................ 17
3.6.1 USB Power States .......................................................................................................... 17
3.6.2 USB 2.0 Link Power Management (LPM) ....................................................................... 17
3.6.3 PCIe Power States .......................................................................................................... 17
4. Electrical Characteristics ........................................................................................................................... 19
4.1 Operating Conditions ............................................................................................................... 19
4.2 Absolute Maximum Ratings ..................................................................................................... 19
4.3 Power-up Sequence ................................................................................................................ 20
4.4 Power-down Sequence ........................................................................................................... 21
4.5 DC Electrical Specifications ..................................................................................................... 21
4.6 Power Consumption ................................................................................................................ 22
4.7 AC Characteristics ................................................................................................................... 23
4.8 USB Electrical Characteristics ................................................................................................. 23
List of Figures
Figure 1-1 FL1100 Top Marking ........................................................................................................................... 9
Figure 2-1 FL1100 Ballout Map (Top view / Transparent View).......................................................................... 11
Figure 3-1 FL1100 block diagram ...................................................................................................................... 15
Figure 4-1 Power-up sequence ......................................................................................................................... 20
Figure 4-2 Power-down Sequence .................................................................................................................... 21
List of Tables
Table 1-1 Ordering Information ............................................................................................................................ 8
Table 2-1 Signal description of PCIe Interface .................................................................................................. 12
Table 2-2 Signal description of USB Port 0 Interface ........................................................................................ 12
Table 2-3 Signal description of USB Port 1 Interface ........................................................................................ 12
Table 2-4 Signal description of USB Port 2 Interface ........................................................................................ 13
Table 2-5 Signal description of USB Port 3 Interface ........................................................................................ 13
Table 2-6 Signal description of miscellaneous signals ...................................................................................... 13
Table 2-7 Power / ground signals ...................................................................................................................... 14
Table 2-8 Internal generate power supplies ...................................................................................................... 14
Table 2-9 No connection pin list......................................................................................................................... 14
Table 3-1 USB 3.0 Power State ......................................................................................................................... 17
Table 3-2 USB Link Power Management (Lx) States ........................................................................................ 17
Table 4-1 Operating Conditions ......................................................................................................................... 19
Table 4-2 Absolute Maximum Ratings ............................................................................................................... 19
Table 4-3 Power-up sequence parameters ....................................................................................................... 20
Table 4-4 Power-down sequence parameters ................................................................................................... 21
Table 4-5 LVTTL I/O DC Characteristic ............................................................................................................. 21
Table 4-6 FL1100 power consumption (preliminary typical corner measurement) ............................................ 22
Table 4-7 FL1100 operating current (preliminary typical corner measurement) ................................................ 22
Table 4-8 FL1100 Maximum operating current (preliminary typical corner measurement) ............................... 22
Table 4-9 Reference clock specification ............................................................................................................ 23
Table 4-10 Power noise specification ................................................................................................................ 23
Table 4-11 Electrical characteristic of SuperSpeed transmitter ......................................................................... 23
Table 4-12 Spread Spectrum Clocking (SSC) parameters ................................................................................ 24
Table 4-13 Electrical characteristics of LFPS .................................................................................................... 24
Table 4-14 Electrical characteristics of SuperSpeed receiver ........................................................................... 24
Table 4-15 Electrical characteristic of USB 2.0 High-speed .............................................................................. 25
Table 4-16 Electrical characteristic of USB 2.0 full-speed/low-speed ............................................................... 25
Table 4-17 Electrical characteristic of PCIe ....................................................................................................... 26
Table 5-1 Register Types ................................................................................................................................... 28
Table 5-2 PCIe Configuration Register Map ...................................................................................................... 28
Table 5-3 Host controller capability registers ..................................................................................................... 43
Table 5-4 Host controller operational registers .................................................................................................. 46
Table 5-5 Host controller runtime registers ........................................................................................................ 53
1. Introduction
The FL1100 is Fresco Logic’s single-chip PCI Express to USB 3.0 host controller. It fully integrates an
Extensible Host Controller Interface (xHCI) engine, a 4-port 5Gbps USB 3.0 transceiver, a PCI Express
endpoint controller and a 5Gbps PCI Express transceiver. FL1100 implements the Universal Serial Bus 3.0
Specification Revision 1.0 and the Extensible Host Controller Interface (xHCI) Specification Revision 1.0, and
complies with the PCI Express Rev 2.1 Specification at 5Gbps data rate, and is backward compatible to the
PCI Local Bus Specification Revision 2.2. FL1100 is compatible for operation with USB 2.0 and USB 1.1
devices.
The FL1100 controller features Fresco Logic’s patented GoXtream™ xHCI Accelerator Engine, which maps the
xHCI standard directly into a set of parallel functional units, providing acceleration of all xHCI operations while
maintaining compatibility with existing software driver models.
With its innovative architecture and high level of integration, FL1100 delivers exceptional performance, while
minimizing total system cost and providing the most straightforward usage model in the industry.
1.1 Features
Compliant with USB 3.0 Specification Revision 1.0
Compliant with Extensible Host Controller Interface (xHCI) Specification Revision 1.0
4 downstream USB ports support SS/HS/FS/LS data rates (5Gbps/480Mbps/12Mbps/1.5Mbps)
Supports Battery Charging Specification Revision 1.2 for Charging Downstream Ports (CDP)
Supports USB charging via Chinese Telecom Standard YD/T 1591-2009
Single (x1) PCI Express Lane
Supports PCI Express Specification Revision 2.1 at 5GT/s
Supports PCI Express Card Revision 1.0
Supports PCI Bus Power Management Interface Specification Revision 1.2
3.3V/1.2V/1.05V power supply
Supports 12MHz crystal oscillator
Integrated SuperSpeed USB transceiver
Integrated PCI Express transceiver
WHQL certified driver support for Windows 7, Windows Vista and Windows XP
Linux xHCI support under Linux kernel version 2.6.31 and after
Supports UASP (USB Attached SCSI Protocol)
1.2 Applications
Motherboard
Notebook
Add-in card
Express card
DTV
Embedded PC
Any consumer product with PCIe interface
Figure 1-1 illustrates the top marking of FL1100 samples. The part number is composed of two portions:
“FL1100” is the part name, which tells the product family; the “1Q0” denotes the major stepping and the
package type as major revision 1 and DRQFN package respectively.
2. Signal Description
This chapter provides signal mapping and detailed description of each signal of FL1100. The following
notations are the signal type:
Figure 2-1 shows the ballout map of FL1100 from the top of the package view.
FL1100
FL1100
PCI Express to 4-port USB 3.0 Host Controller
2.2.8 NC Pins
NC Pin Ball#
A2, A16, A17, A18, A28, A35, A40, A47, A49, A50, B11,B16, B31, B39, B45
3. Function Description
3.1 Block Diagram
The performance is enhanced by eliminating the inherent latencies and bottlenecks of hardware/software
hand-offs. The power is reduced by eliminating the overhead of the additional processors, components and
circuitry needed for software-based approaches. Additional benefits of this highly-integrated approach are
lower total system cost and a simpler deployment and usage model.
The FL1100 is fully integrated with PCI Express and USB transceivers and supports both USB 3.0 and USB 2.0
devices. The FL1100 features a Gen 2, x1 PCI Express lane and four USB 3.0 downstream ports.
The FL1100 supports the full capabilities of traversing the Scatter/Gather list to complete the DMA functions
called out by the xHCI Specification. The general interfaces described in the xHCI Specification include a Host
Configuration Space, a Memory- mapped IO space and a Host memory space. Chapter 5 contains the details
of these memory spaces within the FL1100 xHCI controller.
FL1100’s GoXtream™ engine furthers performance with an enhanced scheduler which manages simultaneous
data movement across all ports permitting maximum bandwidth utilization up to the limit of the system interface.
The built-in scheduler also protects the priority of Isochronous and Interrupt transfers over other types of traffic.
The root port provides USB-specified link functionality for SuperSpeed, high-speed, full-speed and low-speed
links. It communicates with the USB transceiver (PHY) to transfer the data onto the link. Each root port has
buffers to support the bandwidth requirements of its link.
Additionally, each port has its own power management and link negotiation capabilities, allowing individual
ports to power down separately. Link management is done in each of the root ports, which can be suspended
or reset by software without affecting overall xHCI controller operation.
FL1100 supports all power modes defined in USB 3.0 Specification. Table 3-1 addresses the USB 3.0 power
modes.
FL1100 is compliant with “USB 2.0 Link Power Management Addendum”, and supports both software and
hardware managed LPM L1 power management. Table 3-2 compares the LPM L1 states and Suspend (L2)
states.
Hardware LPM in FL1100 is a function to provide automatic power management of the USB2 link between the
host root port and the first connected device. It achieves link power savings at latencies at least 2 to 3 orders
of magnitude less than can by achieved by a typical host bus driver. Any bus idle that exceeds a
pre-programmed latency threshold will cause the host to initiate the USB2 L1 state. Hardware LPM is
schedule aware meaning the host will auto wake the device on any new transfer request or at periodic intervals
required for interrupt and/or Isochronous endpoints.
FL1100 supports both PCI Power Management (PCIPM) and PCI Express Active State Power Management
(ASPM). The ASPM may be initiated by FL1100 or by system software. FL1100 supports D0, D1, D3hot and
D3cold states as well as ASPM L0s and L1 states.
4. Electrical Characteristics
4.1 Operating Conditions
1. Assert PERST#
2. All 3.3V including analog and digital supplies are stable
3. AVCC10/AVCC12 stable
4. DVCC10 stable. DVCC10 must NOT be earlier than AVCC10
5. PERST# de-assert after reference clock stable
1. Assert PERST#
2. Remove 3.3V supply after PERST# is asserted.
3. Remove PCIe reference clock after PERST# is asserted
4. Remove 1.05V and 1.2V supply no sooner than 3.3V supply is removed.
Table 4-8 FL1100 Maximum operating current (preliminary typical corner measurement)
4.7 AC Characteristics
The section defines the requirement of reference clock source and the power supplies.
output voltage
VT-D-R The amount of voltage change The total amount of voltage
- - 600 mV
allowed during receiver detection change during TX-Detect-RX
VTX_CM_AC Transmitter AC common-mode AC RMS value
- - 20 mV
voltage
VTX_DEM TX de-emphasis level -3 - -4 dB
FBEACON Frequency of beacon signaling - 2 - 150 MHz
Resistance
RRX Built-in receiver input impedance - 40 50 60 Ω
RTX Built-in driver output impedance - 40 50 60 Ω
Capacitance
CTX AC coupling capacitor - 75 - 200 nF
Register
Description
Attribute
Read-only
RO
Register bits are read-only and cannot be altered by software
Read-write
RW
Register bits are read-write and are permitted to be Set or Cleared by software
Write-1-to-clear status
RW1C Register bits indicate status when read. The status is cleared by writing 1b. Writing 0b
has no effect.
Write-1-toset status
RW1S Register bits indicate status when read. The status is set by writing 1b. Writing 0b has no
effect
Read-only, Sticky
ROS Register bits are read-only and cannot be altered by software. Bits are not be initialized
nor modified by hot reset or functional level reset (FLR)
Read-write, Sticky
RWS Register bits are read-write and are permitted to be Set or Cleared by software. Bits are
not initialized nor modified by hot reset or functional level reset (FLR)
Write-1-to-clear status, Sticky
Register bits indicate status when read. The status is cleared by writing 1b. Writing 0b
RW1CS
has no effect. Bits are not initialized nor modified by hot reset or functional level reset
(FLR)
Registers
Offset
31 0
Device ID Vendor ID 000h
Status Command 004h
Class Code Revision ID 008h
BIST Header type Latency Timer Cache Line Size 00Ch
Base Address Registers (BAR) 010h
014h
018h
01Ch
020h
024h
Reserved 028h
Subsystem ID Subsystem Vendor ID 02Ch
Reserved 030h
Reserved Capabilities Pointer 034h
Reserved 038h
Max_Lat Min_Gnt Interrupt Pin Interrupt Line 03Ch
Power Management Capability Next Capability Pointer PM Cap ID 40h
PM Data PMCSR_BSE Power Management Control/Status 44h
48h
Reserved
4Ch
MSI Message Control Next Capability Pointer MSI Cap ID 50h
MSI Message Address 54h
MSI Upper Message Address 58h
Reserved MSI Message Data 5Ch
Reserved FLADJ SBRN 60h
64h
Reserved 68h
6Ch
PCI Express Capability Register Next Capability Pointer PCI Express Cap ID 70h
Device Capabilities 74h
Device Status Device Control 78h
Link Capabilities 7Ch
Link Status Link Control 80h
84h
Reserved ^
90h
Device Capabilities 2 94h
Device Status 2 Device Control 2 98h
Link Capability 2 9Ch
Link Status 2 Link Control 2 A0h
A4h
Reserved A8h
ACh
MSI-X Message Control Next Item Pointer MSI-X Cap ID B0h
MSI-X Table Offset and BIR B4h
MSI-X PBA Offset and BIR B8h
BCh
Reserved
^
EEPROM Control F0h
Programmability Offset F4h
Programmability Data F8h
Reserved FCh
5.2.1.10 BIST
Address Offset: 0Fh Attribute: RO
Default value: 0h Size: 8 bits
59504 1 (01h)
59520 2 (02h)
^ ^
59984 31 (1Fh)
60000 (125us) 32 (20h)
^ ^
60480 62 (3Eh)
60496 63 (3Fh)
These registers specify the limits and capabilities of the FL1100 USB 3.0 host controller implementation. All
Capability Registers are Read-Only (RO). Please refer to section 5.3 of xHCI Specification Rev 1.0 for detail.
This section defines the xHCI Operational Registers. All registers are multiples of 32 bits in length. Unless
otherwise stated, all registers should be accessed as a 32-bit width on reads using an appropriate software
mask, if needed. A software read/modify/write mechanism should be invoked for partial writes. Please refer to
section 5.4 of xHCI Specification Rev 1.0 for detail.
5.3.2.11 PORTPMSCx(USB2) - Port 0~3 Power Management Status and Control (USB2)
Port 0: 484h
Port 1: 494h
Address Offset: Attribute: RO, RWS, ROS
Port 2: 4A4h
Port 3: 4B4h
Default value: 0000 0000h Size: 32 bits
5.3.2.13 PORTPMSCx(USB3) - Port 0-3 Power Management Status and Control (USB3)
Port 0: 4C4h
Port 1: 4D4h
Address Offset: Attribute: RO, RWS, RW
Port 2: 4E4h
Port 3: 4F4h
Default value: 0000 0000h Size: 32 bits
This section defines the FL1100 xHCI Runtime Register space. All Runtime registers are multiples of 32 bits in
length. Unless otherwise stated, all registers should be accessed with Dword references on reads, using an
appropriate software mask if needed. A software read/modify/write mechanism should be invoked for partial
writes. Software should write registers containing a Qword address field using only Qword references. Please
refer to Section 5.5 of xHCI Specification Rev 1.0 for detail.
ERSTBA_HI5 Event Ring 5 Segment Table Base Address High 20B4 20B7 00000000h
ERDP_LO5 Event Ring 5 Dequeue Pointer Low 20B8 20BB 00000000h
ERDP_HI5 Event Ring 5 Dequeue Pointer High 20BC 20BF 00000000h
IMAN6 Interrupter 6 Management 20C0 20C3 00000000h
IMOD6 Interrupter 6 Moderation 20C4 20C7 00000FA0h
ERSTSZ6 Event Ring 6 Segment Table Size 20C8 20CB 00000000h
ERSTBA_LO6 Event Ring 6 Segment Table Base Address Low 20D0 20D3 00000000h
ERSTBA_HI6 Event Ring 6 Segment Table Base Address High 20D4 20D7 00000000h
ERDP_LO6 Event Ring 6 Dequeue Pointer Low 20D8 20DB 00000000h
ERDP_HI6 Event Ring 6 Dequeue Pointer High 20DC 20DF 00000000h
IMAN7 Interrupter 7 Management 20E0 20E3 00000000h
IMOD7 Interrupter 7 Moderation 20E4 20E7 00000FA0h
ERSTSZ7 Event Ring 7 Segment Table Size 20E8 20EB 00000000h
ERSTBA_LO7 Event Ring 7 Segment Table Base Address Low 20F0 20F3 00000000h
ERSTBA_HI7 Event Ring 7 Segment Table Base Address High 20F4 20F7 00000000h
ERDP_LO7 Event Ring 7 Dequeue Pointer Low 20F8 20FB 00000000h
ERDP_HI7 Event Ring 7 Dequeue Pointer High 20FC 20FF 00000000h
IMAN8 Interrupter 8 Management 2100 2103 00000000h
IMOD8 Interrupter 8 Moderation 2104 2107 00000FA0h
ERSTSZ8 Event Ring 8 Segment Table Size 2108 210B 00000000h
ERSTBA_LO8 Event Ring 8 Segment Table Base Address Low 2110 2113 00000000h
ERSTBA_HI8 Event Ring 8 Segment Table Base Address High 2114 2117 00000000h
ERDP_LO8 Event Ring 8 Dequeue Pointer Low 2118 211B 00000000h
ERDP_HI8 Event Ring 8 Dequeue Pointer High 211C 211F 00000000h
3000, ..., 3003, ...,
DOORBELL1, ... 32 Door Bell 1, ..., 32 00000000h
307C 307F
^
x=32, 307Ch-307Fh
Default value: 0000 0000h Size: 32 bits
Door Bell registers are an array of 64 registers, with 0 to 32 being used by the XHC and the rest being
reserved.
Appendix A Mechanical
A.1 Package Outline
Please refer to the last page of this document.
Figure 3
Refer to Figure 3, according to supplier Amkor’s recommendation; the land width (X) for both inner and outer
rows is needed. Based on history of single row QFN, a lead width (X) of 0.280mm was chosen for 0.500mm
pitch. Outer row land pattern dimension Z1Max is calculated using standard IPC methodology and expressed
in terms of nominal body size dimension:
Z1Max = DMin + 2 J T + C L2 + F 2 + P 2
CL
DMin = BODYSIZE −
2
Z1Max = BODYSIZE + 0.340mm
For G1Min and Z2Max values, a minimum clearance of 0.200 mm between inner and outer leads must be
maintained. For a 0.280 mm lead width and 0.650 mm row pitch, a spacing of 0.130 mm between the inner and
outer row leads must be maintained (i.e. 1/2 (G1Min - Z2Max) ≥ 0.13 mm). The nominal distance between
package leads is 0.250 mm. Thus the extra 0.120 mm space for toe and heel fillets must be partitioned
between the inner and outer leads. Because the toe fillet is more important to solder joint reliability, a design
rule of JT ≥ 2 JH is used (i.e. JT = 0.080 mm, JH = 0.040 mm). This results in the following:
For G2Min dimension, the heel fillet is limited to conserve space for inner row vias between the leads and the
thermal pad. A value similar to the toe fillet is chosen, JH = 0.080 mm. This results in the following:
For some case, we can fine tune pad length for enough CLL value in layout. Here is a PCB pad footprint that
use on Fresco Logic’s ECB for reference as Figure 5.
1.37
1.12
FL1100 is a MOISTURE SENSITIVE DEVICE and should meet LEVEL 3 requirements as following:
1. Calculated shelf life in sealed bag: 12 months at < 40 and < 90% RH.
2. After bag opened, devices that will be subjected to reflow solder or other high temperature process must
be:
a. Mounted within 168 hours of factory conditions ≦ 30 / 60% RH.
b. Stored at < 10% RH.
3. Reflow condition: Please refer to IPC / JEDEC J-STD-020.
4. Devices required baking, before mounting if:
a. Humidity indicator card is > 20% RH when read at 23 +/-5 , or
b. 2.a or 2.b is not met.
5. If baking is required, devices may be baked for 12 hours at 125+/-5 .
Quad Flat No Leads (QFN) package designs got more and more popular in electronic industry nowadays. The
most challenges are in soldering and voiding control besides a number of benefits including (1) small size, such
as a near die-sized footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of
perimeter I/O pads; (3) reduced lead inductance; (4) easy PCB trace routing; and (5) good thermal and
electrical performance due to the adoption of exposed copper die-pad technology. There are some attentions
providing when using QFN package in design and SMT process to improve soldering and reduce voids.
1. QFN IC should by well packing due to it’s a MSL 3 moisture sensitive component as defined by JTD-020
standard. The cleanness and roughness of pad of QFN will impact soldering.
2. Before SMT, bare PCB baking by 120 +/- 5˚C will help.
3. PCB design:
3.1 Signal pad should use NSMD (Non Solder Mask Defined), die paddle should use SMD (Solder Mask
Defined)
3.2 Pad of PCB could be larger than pad of QFN, but limit is equal to.
3.3 Pad of die paddle should match the dimension.
4. Stencil opening:
4.1 Stencil thickness often use 0.1/ 0.12/ 0.13 mm for pitch 0.5 mm.
4.2 Signal pad & die paddle of stencil opening should match the dimensions.
4.3 Die paddle of stencil opening should be web shape to force a similar volume of solder paste to be
deposited on all contacts for the QFN package. This is to prevent a stand-off situation where different
solder paste heights on the Die Paddle and the Signal Pad contacts causes failure of some or all of
the Signal Pad joints to form correctly.
5. Depends on PCB size, trace layout & component numbers and package type to fine tune SMT thermal
profile. And long hot SMT thermal profile will help improving soldering and reducing void issue.
5.1 Long: P2 (Solder Paste Dry area) should around 90 Sec, better > 90 Sec. refer to below
diagram.
5.2 Hot: P3 area should > 220°C around 60 Sec, better > 60 Sec. Peak temp ≥ 243°C
5.3 Use thermal pad to measure temperature on “IC surface” to get temperature profile. If use measure on
“bare PCB”, there are at least 5~10 lower compared with actual product board while with all
components.
5.4 Use Nitrogen process can improve SMT yield if available.
deficiencies or improper wetting of solder pads. To find these types of defect, micro-sectioning of the
solder joints is the usual preferred analytical method.
10.3 During the first few months of introduction of this package type, frequent sampling and destructive
testing are strongly recommended to ensure good solder joints are being formed across normal
variations in the manufacturing process. This is of particular significance for the solder joints at the
corners of the package. Dependent upon facilities available, micro-sectioning along the center-lines of
both Signal Pad contacts is preferred, but a lower-cost solution is to break the package from the PCB
and visually inspect the joints with a microscope. This technique will pick up extreme failures, so
occasional micro-sectioning is still recommended.
Please refer to Fresco Logic’s “DRQFN package application reference” for more information.
Legal Disclaimer
Information in this document is provided in connection with Fresco Logic, Inc. products. No
license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted
by this document. Except as provided in Fresco Logic’s terms and conditions of sale for such
products, Fresco Logic assumes no liability whatsoever, and Fresco Logic disclaims any express or
implied warranty, relating to sale and/or use of Fresco Logic products, including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any
patent, copyright or other intellectual property right.
This document provides technical information for the user. Fresco Logic, Inc. reserves the right to
modify the information in this document as necessary. The customer should make sure that they
have the most recent datasheet version. Fresco Logic, Inc. holds no responsibility for any errors
that may appear in this document. Customers should take appropriate action to ensure their use of
the products does not infringe upon any patents. Fresco Logic, Inc. respects valid patent right of
third parties and does not infringe upon or assist others to infringe upon such rights.