RT9214

5V/12V Synchronous Buck PWM DC/DC Controller

General Description Features
The RT9214 is a high efficiency synchronous buck PWM l Operating with 5V or 12V Supply Voltage
controllers that generate logic-supply voltages in PC based l Drives All Low Cost N-MOSFETs
systems. These high performance , single output devices l Voltage Mode PWM Control
include internal soft-start, frequency compensation l 300kHz Fixed Frequency Oscillator
networks and integrates all of the control, output l Fast Transient Response :
adjustment, monitoring and protection functions into a } High-Speed GM Amplifier

single package. } Full 0 to 100% Duty Ratio

l Internal Soft-Start
The device operating at fixed 300kHz frequency provides
l Adaptive Non-Overlapping Gate Driver
an optimum compromise between efficiency, external
l Over Current Fault Monitor on MOSFET, No
component size, and cost.
Current Sense Resistor Required
Adjustable over-current protection (OCP) monitors the l RoHS Compliant and 100% Lead (Pb)-Free
voltage drop across the RDS(ON) of the lower MOSFET for
synchronous buck PWM DC/DC controller. The over Applications
current function cycles the soft-start in 4-times hiccup l Graphic Card
mode to provide fault protection, and in an always hiccup l Motherboard, Desktop Servers
mode for under-voltage protection. l IA Equipments
l Telecomm Equipments
Ordering Information l High Power DC/DC Regulators
RT9214
Package Type Pin Configurations
S : SOP-8 (TOP VIEW)
SP : SOP-8 (Exposed Pad-Option 1)
Lead Plating System BOOT 8 PHASE
P : Pb Free UGATE 2 7 OPS
G : Green (Halogen Free and Pb Free) GND 3 6 FB
Z : ECO (Ecological Element with LGATE 4 5 VCC
Halogen Free and Pb free)
SOP-8
Note :
Richtek products are : BOOT PHASE
8
} RoHS compliant and compatible with the current require- UGATE 2 7 OPS
NC
ments of IPC/JEDEC J-STD-020. GND 3
9
6 FB
} Suitable for use in SnPb or Pb-free soldering processes. LGATE 4 5 VCC

SOP-8 (Exposed Pad)

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RT9214
Typical Application Circuit
VIN
5V to 12V D1 RBOOT 3.3V/5V/12V
1N4148 2.2
C2
0.1µF C3 C4
1µF 470µF
R1 RUGATE
10 1 2.2 Q1
BOOT 2
UGATE
MU
5 8
VCC PHASE L1 VOUT
C1 3µH
6 RT9214 7 ROCSET
1µF FB OPS

3 4 Q2 R
GND LGATE
ML
C

Disable > Q3 C6 to C8
3904 1000µFx3

R2 R3
32 68

R4 C5 VOUT = VREF × (1 + R3 )
200-1k 0.1-0.33µF R2
VREF : Internal reference voltage
(0.8V ± 2%)
Functional Pin Description VCC (Pin 5)
Connect this pin to a well-decoupled 5V or 12V bias
BOOT (Pin 1)
supply. It is also the positive supply for the lower gate
Bootstrap supply pin for the upper gate driver. Connect
driver, LGATE.
the bootstrap capacitor between BOOT pin and the PHASE
pin. The bootstrap capacitor provides the charge to turn FB (Pin 6)
on the upper MOSFET. Switcher feedback voltage. This pin is the inverting input
of the error amplifier. FB senses the switcher output
UGATE (Pin 2)
through an external resistor divider network.
Upper gate driver output. Connect to the gate of high side
power N-MOSFET. This pin is monitored by the adaptive OPS (OCSET, POR and Shut-Down) (Pin 7)
shoot through protection circuitry to determine when the This pin provides multi-function of the over current setting,
upper MOSFET has turned off. UGATE turn-on POR sensing, and shut down features.
Connecting a resistor (ROCSET) between OPS and
GND (Pin 3)
PHASE pins sets the over current trip point.
Both signal and power ground for the IC. All voltage levels
are measured with respect to this pin. Ties the pin directly Pulling the pin to ground resets the device and all external
to the low side MOSFET source and ground plane with MOSFETs are turned off allowing the output voltage power
the lowest impedance. rails to float.
This pin is also used to detect VIN in power on stage and
LGATE (Pin 4) issues an internal POR signal.
Lower gate drive output. Connect to the gate of low side
power N-MOSFET. This pin is monitored by the adaptive PHASE (Pin 8)
shoot through protection circuitry to determine when the Connect this pin to the source of the upper MOSFET and
lower MOSFET has turned off. the drain of the lower MOSFET.

NC [Exposed Pad (9)]

No Internal Connection.
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 RT9214
Function Block Diagram
VCC

+
EN
-
0.1V

+
PH_M
Bias & Regulators Power On
Reference -
(3V_Logic & 3VDD_Analog) Reset 1.5V
0.8VREF
3V

0.6V
+ Soft-Start 40µA
UV_S
- &
Fault Logic
OC - OPS
0.4V
+
+
-

BOOT

UGATE

+ PHASE
EO Gate
- GM +
FB - Control
Logic VCC

LGATE
Oscillator
(300kHz)

GND

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RT9214
Absolute Maximum Ratings (Note 1)
l Supply Voltage, VCC ------------------------------------------------------------------------------------ 16V
l BOOT, VBOOT − VPHASE --------------------------------------------------------------------------------- 16V
l PHASE to GND

DC ----------------------------------------------------------------------------------------------------------- −5V to 15V

< 200ns ---------------------------------------------------------------------------------------------------- −10V to 30V
l BOOT to PHASE ---------------------------------------------------------------------------------------- 15V

l BOOT to GND

DC ----------------------------------------------------------------------------------------------------------- −0.3V to VCC+15V

< 200ns ---------------------------------------------------------------------------------------------------- −0.3V to 42V
l UGATE ----------------------------------------------------------------------------------------------------- V PHASE - 0.3V to VBOOT + 0.3V

l LGATE ------------------------------------------------------------------------------------------------------ GND - 0.3V to V VCC + 0.3V

l Input, Output or I/O Voltage --------------------------------------------------------------------------- GND-0.3V to 7V

l Power Dissipation, PD @ TA = 25°C (Note 2)

SOP-8 ------------------------------------------------------------------------------------------------------ 0.625W

SOP-8 (Exposed Pad) ---------------------------------------------------------------------------------- 1.33W
l Package Thermal Resistance

SOP-8, θJA ------------------------------------------------------------------------------------------------- 160°C/W

SOP-8 (Exposed Pad), θJA ----------------------------------------------------------------------------- 75°C/W
l Junction Temperature ----------------------------------------------------------------------------------- 150°C

l Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------- 260°C

l Storage Temperature Range --------------------------------------------------------------------------- −65°C to 150°C

l ESD Susceptibility (Note 3)

HBM (Human Body Mode) ----------------------------------------------------------------------------- 2kV

MM (Machine Mode) ------------------------------------------------------------------------------------ 200V

Recommended Operating Conditions (Note 4)

l Supply Voltage, VCC ------------------------------------------------------------------------------------ 5V ± 5%,12V ± 10%
l Junction Temperature Range -------------------------------------------------------------------------- −40°C to 125°C
l Ambient Temperature Range -------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VCC = 5V/12V, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
VCC Supply Current
Nominal Supply Current ICC UGATE and LGATE Open -- 6 15 mA
Power-On Reset
POR Threshold VCCRTH VCC Rising -- 4.1 4.5 V
Hysteresis VCCHYS 0.35 0.5 -- V
Switcher Reference
Reference Voltage VREF VCC = 12V 0.784 0.8 0.816 V

To be continued
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 RT9214
Parameter Symbol Test Conditions Min Typ Max Unit
Oscillator
Free Running Frequency fOSC VCC = 12V 250 300 350 kHz
Ramp Amplitude ∆VOSC V CC = 12V -- 1.5 -- VP−P
Error Amplifier (GM)
E/A Transconductance gm -- 0.2 -- ms
Open Loop DC Gain AO -- 90 -- dB
PWM Controller Gate Drivers (VCC = 12V)
V BOOT − VPHASE = 12V,
Upper Gate Source I UGATE 0.6 1 -- A
V UGATE − V PHASE = 6V
V BOOT − VPHASE = 12V,
Upper Gate Sink RUGATE -- 4 8 Ω
V UGATE − V PHASE = 1V
Lower Gate Source ILGATE V CC = 12V, VLGATE = 6V 0.6 1 -- A
Lower Gate Sink RLGATE V CC = 12V, VLGATE = 1V -- 3 5 Ω
Dead Time TDT -- -- 100 ns
Protection
FB Under-Voltage Trip ∆ FBUVT FB Falling 70 75 80 %
OC Current Source IOC V PHASE = 0V 35 40 45 µA
Soft-Start Interval TSS -- 3.5 -- ms

Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at T A = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

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RT9214
Typical Operating Characteristics
(VOUT = 2.5V, unless otherwise specified )
Efficiency vs. Output Current Efficiency vs. Output Current
1 1

0.95 0.95

0.9 0.9

Efficiency(%)
0.85 0.85
Efficiency(%)

0.8 0.8

0.75 0.75

0.7 0.7

0.65 VCC = 12V 0.65 VCC = 5V

VIN = 5V VIN = 5V
0.6 0.6
0 5 10 15 20 25 0 5 10 15 20 25
Output Current (A) Output Current (A)

Reference Voltage vs. Temperature Frequency vs. Temperature

0.812 350
VCC = 12V
0.810 VIN = 5V
330
Reference Voltage (V)

Frequency (kHz)

0.808

310
0.806

0.804
290

0.802
270
0.800

0.798 250
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -10 20 50 80 110 140
Temperature (°C) Temperature (°C)

POR vs. Temperature VCC Switching

4.75

Rising (100mV/Div)
POR Rising or Falling (V)

4.50
VOUT

4.25 IOUT
(10A/Div)

UGATE
4.00
Falling
V CC (20V/Div)
3.75
VCC = 12Vto 5V
IOUT= 10A (10V/Div)
VIN = 5V
3.50
-40 -10 20 50 80 110 140 Time (10ms/Div)
Temperature (°C)

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VCC Switching Power On

(100mV/Div)

VOUT (500mV/Div)

IOUT VOUT
(10A/Div)

UGATE
IOUT (2A/Div)

V CC (20V/Div)

VCC = 5V to 12V (10V/Div) UGATE

IOUT= 10A, VIN = 5V (10V/Div)

Time (10ms/Div) Time (500μs/Div)

Power Off Dead Time (Rising)

VCC = VIN = 5V
VCC IOUT = 25A
(10V/Div)
VOUT
UGATE

VIN (2V/Div)

(2V/Div) PHASE

(5V/Div)
UGATE LGATE

IOUT = 2A (10V/Div)

Time (5ms/Div) Time (25ns/Div)

Dead Time (Falling) Transient Response (Rising)

VCC = 12V
VIN = 5V
IOUT= 25A
UGATE
UGATE
(10V/Div)

VOUT
(100mV/Div)
PHASE
VCC = VIN = 12V
(5V/Div) IOUT= 0A to 15A
LGATE
IL
L = 2.2μH
(10A/Div) Freq. = 1/20ms, SR = 2.5A/μs C = 2000μF

Time (10ns/Div) Time (5μs/Div)

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Transient Response (Falling)

L = 2.2μH
C = 2000μF
UGATE
(10V/Div)

VOUT
(100mV/Div)

VCC = VIN = 12V

IOUT= 15A to 0A
IL
Freq. = 1/20ms
(10A/Div) SR = 2.5A/μs

Time (25μs/Div)

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 RT9214
Application Information
Inductor Selection According to Figure 1 the ripple current of inductor can be
The selection of output inductor is based on the calculated as follows :
considerations of efficiency, output power and operating ΔIL D V
VIN − VOUT = L ; Δt = ; D = OUT
frequency. Low inductance value has smaller size, but Δt fs VIN
results in low efficiency, large ripple current and high output VOUT
L = (VIN − VOUT ) × (1)
ripple voltage. Generally, an inductor that limits the ripple VIN × fs × ΔIL
current (∆IL) between 20% and 50% of output current is Where :
appropriate. Figure 1 shows the typical topology of
VIN = Maximum input voltage
synchronous step-down converter and its related
waveforms. VOUT = Output Voltage

iS1 IL ∆t = S1 turn on time

L
+ VL - ∆IL = Inductor current ripple
iC IOUT
iS2 +
S1 VOR
f S = Switching frequency
rC +
-
VIN S2 RL VOUT D = Duty Cycle
+

+
VOC COUT - rC = Equivalent series resistor of output capacitor
-

Output Capacitor
TS The selection of output capacitor depends on the output
ripple voltage requirement. Practically, the output ripple
Vg1 TON TOFF voltage is a function of both capacitance value and the
equivalent series resistance (ESR) rC. Figure 2 shows
Vg2
the related waveforms of output capacitor.
VIN - V OUT
diL VIN-VOUT diL VOUT
iL =
VL dt L dt = L

- VOUT IOUT

TS

iL iC
IL = IOUT
ΔIL 1/2ΔIL
0 ΔIL

iS1 VOC

ΔV OC

iS2
VOR

ΔIL x rc
0

Figure 1. The Waveforms of Synchronous Step Down

t1 t2
Converter
Figure 2. The Related Waveforms of Output Capacitor
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RT9214
The AC impedance of output capacitor at operating ZOUT is the shut impedance at the output node to ground
frequency is quite smaller than the load impedance, so (see Figure 3 and Figure 4),
the ripple current (∆IL) of the inductor current flows mainly
through output capacitor. The output ripple voltage is GM VOUT
described as :
C1
ΔVOUT = ΔVOR + ΔVOC (2) C2
1 t2 R1
ΔVOUT = ΔIL × rc + ∫t1 ic dt (3)
CO
1 VOUT 2
ΔVOUT = ΔIL × ΔIL × rc + (1− D)T (4)
8 C OL S
Figure 3. A Type 2 Error-Amplifier with Shut Network to
Ground
where ∆VOR is caused by ESR and ∆VOC by capacitance.
For electrolytic capacitor application, typically 90 to 95% VOUT
of the output voltage ripple is contributed by the ESR of +
RO
+
output capacitor. So Equation (4) could be simplified as : EA+
EA- - GM
∆VOUT = ∆IL x rc (5)

Users could connect capacitors in parallel to get calculated Figure 4. Equivalent Circuit
ESR.
Pole and Zero :
Input Capacitor
1 1
The selection of input capacitor is mainly based on its FP = ; FZ =
2π × R1C 2 2π × R1C1
maximum ripple current capability. The buck converter
draws pulse wise current from the input capacitor during
We can see the open loop gain and the Figure 3 whole
the on time of S1 as shown in Figure 1. The RMS value of
loop gain in Figure 5.
ripple current flowing through the input capacitor is
described as :

Irms = IOUT D(1− D) (A) (6)

Open Loop, Unloaded Gain

The input capacitor must be cable of handling this ripple

A Closed Loop, Unloaded Gain
Gain (dB)

current. Sometime, for higher efficiency the low ESR

capacitor is necessarily.
FZ FP

PWM Loop Stability Gain = GMR1

B
RT9214 is a voltage mode buck converter using the high
gain error amplifier with transconductance (OTA,
100 1000 10k 100k
Operational Transconductance Amplifier).
Frequency (Hz)
The transconductance : Figure 5. Gain with The Figure 2 Circuit
dI
GM = OUT
dVm RT9214 internal compensation loop :
The mid-frequency gain :
GM = 0.2ms, R1=75kΩ, C1 = 2.5nF, C2 = 10pF
dVOUT = dIOUT Z OUT = GMdVINZ OUT
dVOUT
G= = GMZ OUT
dVIN

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 RT9214
OPS (Over Current Setting, VIN_POR and Shutdown)
1.OCP
Sense the low side MOSFET’ s RDS(ON) to set over current trip point.
Connecting a resistor (ROCSET) from this pin to the source of the upper MOSFET and the drain of the lower MOSFET
sets the over current trip point. ROCSET, an internal 40μA current source, and the lower MOSFET on resistance, RDS(ON),
set the converter over current trip point (IOCSET) according to the following equation :

40uA × R OCSET − 0.4V

I OCSET =
R DS(ON) of the lower MOSFET
OPS pin function is similar to RC charging or discharging circuit, so the over current trip point is very sensitive to
parasitic capacitance (ex. shut down MOSFET) and the duty ratio.
Below Figures say those effect. And test conditions are Rocset = 15kΩ (over current trip point = 20.6A), Low side
MOSFET is IR3707.

OCP OCP

UGATE (10V/Div) UGATE

(10V/Div)

IL (10A/Div)
IL (10A/Div)
OPS (200mV/Div)

VIN = 5V, VCC = 12V VIN = 5V, VCC = 12V

VOUT = 1.5V VOUT = 1.5V

Time (5μs/Div) Time (5μs/Div)

OCP OCP
OPS
(200mV/Div)

UGATE (10V/Div)
UGATE
(10V/Div)

IL (10A/Div)

IL (10A/Div)

VIN = 12V, VCC = 12V VIN = 12V, VCC = 12V

VOUT = 1.5V VOUT = 1.5V

Time (2.5μs/Div) Time (2.5μs/Div)

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2. VIN_POR 1) Mode 1 (SS< Vramp_valley)
UGATE will continuously generate a 10kHz clock with Initially the COMP stays in the positive saturation. When
1% duty cycle before VIN is ready. VIN is recognized ready SS< VRAMP_Valley, there is no non-inverting input available
by detecting VOPS crossing 1.5V four times (rising & to produce duty width. So there is no PWM signal and
falling). ROCSET must be kept lower than 37.5kΩ for large VOUT is zero.
ROCSET will keep VOPS always higher than 1.5V. Figure 6 2) Mode 2 (VRAMP_Valley< SS< Cross-over)
shows the detail actions of OCP and POR. It is highly
When SS>VRAMP_Valley, SS takes over the non-inverting
recommend-ed that ROCSET be lower than 30kΩ.
input and produce the PWM signal and the increasing
3V
duty width according to its magnitude above the ramp
signal. The output follows the ramp signal, SS. However
40uA while VOUT increases, the difference between VOUT and
ROCSET
PHASE
SSE (SS − VGS) is reduced and COMP leaves the
-
OC 0.4V OPS
+ 10pF Q2 saturation and declines. The takeover of SS lasts until it
DISABLE
+ Cparasitic meets the COMP. During this interval, since the feedback
-
path is broken, the converter is operated in the open loop.
1st 2nd 3rd 4th OPS
VIN POR_H + waveform 3) Mode3 ( Cross-over< SS < VGS + VREF)
UGATE
PHASE_M -
1.5V (1) Internal Counter will count (VOPS > 1.5V)
four times (rising & falling) to recognize When the Comp takes over the non-inverting input for PWM
VIN is ready.
Amplifier and when SSE (SS − VGS) < VREF, the output of
(2) ROCSET can　be set too large. Or can　
detect VIN is ready (counter = 1, not equal 4) the converter follows the ramp input, SSE (SS − VGS).
Before the crossover, the output follows SS signal. And
Figure 6. OCP and VIN_POR Actions
when Comp takes over SS, the output is expected to follow
3. Shutdown SSE (SS − VGS). Therefore the deviation of VGS is
Pulling low the OPS pin by a small single transistor can represented as the falling of VOUT for a short while. The
shutdown the RT9214 PWM controller as shown in typical COMP is observed to keep its decline when it passes the
application circuit. cross-over, which shortens the duty width and hence the
falling of VOUT happens.
Soft Start Since there is a feedback loop for the error amplifier, the
A built-in soft-start is used to prevent surge current from output’ s response to the ramp input, SSE (SS − VGS) is
power supply input during power on. The soft-start voltage lower than that in Mode 2.
is controlled by an internal digital counter. It clamps the
4) Mode 4 (SS > VGS + VREF)
ramping of reference voltage at the input of error amplifier
and the pulse-width of the output driver slowly. The typical When SS > VGS + VREF, the output of the converter follows
soft-start duration is 3ms. the desired VREF signal and the soft start is completed
now.

COMP
VRAMP_Valley
Cross-over

SS_Internal

VCORE

SSE_Internal

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 RT9214
Under Voltage Protection placement layout and printed circuit design can minimize
The voltage at FB pin is monitored and protected against the voltage spikes induced in the converter. Consider, as
UV (under voltage). The UV threshold is the FB or FBL an example, the turn-off transition of the upper MOSFET
under 80%. UV detection has 15μs triggered delay. When prior to turn-off, the upper MOSFET was carrying the full
OC is trigged, a hiccup restart sequence will be initialized, load current. During turn-off, current stops flowing in the
as shown in Figure 7 Only 4 times of trigger are allowed upper MOSFET and is picked up by the low side MOSFET
to latch off. Hiccup is disabled during soft-start interval, or schottky diode. Any inductance in the switched current
but UV_FB has some difference from OC, it will always path generates a large voltage spike during the switching
trigger VIN power sensing after 4 times hiccup, as shown interval. Careful component selections, layout of the
in Figure 8. critical components, and use shorter and wider PCB traces
help in minimizing the magnitude of voltage spikes.
COUNT = 1 COUNT = 2 COUNT = 3 COUNT = 4
4V There are two sets of critical components in a DC/DC
Internal
SS

2V converter using the RT9214. The switching power

0V components are most critical because they switch large
OVERLOAD
APPLIED
amounts of energy, and as such, they tend to generate
Inductor Current

equally large amounts of noise. The critical small signal

components are those connected to sensitive nodes or
0A those supplying critical bypass current.
T0 T1 T2 T3 T4 The power components and the PWM controller should
TIME
be placed firstly. Place the input capacitors, especially
Figure 7. UV and OC Trigger Hiccup Mode the high-frequency ceramic decoupling capacitors, close
to the power switches. Place the output inductor and
Power Off output capacitors between the MOSFETs and the load.
Also locate the PWM controller near by MOSFETs.
A multi-layer printed circuit board is recommended.
UGATE
(20V/Div)
UV VIN Power Figure 9 shows the connections of the critical components
FB Sensing
(500mV/Div) in the converter. Note that the capacitors CIN and COUT
VOUT each of them represents numerous physical capacitors.
VIN Use a dedicated grounding plane and use vias to ground
(2V/Div) all critical components to this layer. Apply another solid
layer as a power plane and cut this plane into smaller
(2V/Div) islands of common voltage levels. The power plane should
IOUT = 2A
support the input power and output power nodes. Use
Time (10ms/Div) copper filled polygons on the top and bottom circuit layers
for the PHASE node, but it is not necessary to oversize
Figure 8, UV_FB Trigger VIN Power Sensing
this particular island. Since the PHASE node is subjected
to very high dV/dt voltages, the stray capacitance formed
PWM Layout Considerations
between these island and the surrounding circuitry will
MOSFETs switch very fast and efficiently. The speed with
tend to couple switching noise. Use the remaining printed
which the current transitions from one device to another
circuit layers for small signal routing. The PCB traces
causes voltage spikes across the interconnecting
between the PWM controller and the gate of MOSFET
impedances and parasitic circuit elements. The voltage
and also the traces connecting source of MOSFETs should
spikes can degrade efficiency and radiate noise, that results
be sized to carry 2A peak currents.
in over-voltage stress on devices. Careful component

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RT9214

IQ1 IL

5V/12V VOUT
Q1

+
+

+
IQ2 LOAD
Q2
GND

LGATE VCC GND

UGATE RT9214
FB

Figure 9. The Connections of The Critical Components In The Converter

Below PCB gerber files are our test board for your reference :

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 RT9214

According to our test experience, you must still notice two items to avoid noise coupling :
1.The ground plane should not be separated.
2.VCC rail adding the LC filter is recommended.

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RT9214
Outline Dimension

H
A

J B

C
I
D

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 3.988 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.508 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.050 0.254 0.002 0.010
J 5.791 6.200 0.228 0.244
M 0.400 1.270 0.016 0.050

8-Lead SOP Plastic Package

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 RT9214
H
A

EXPOSED THERMAL PAD Y

(Bottom of Package)
J X B

C
I
D

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 4.000 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.510 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.000 0.152 0.000 0.006
J 5.791 6.200 0.228 0.244
M 0.406 1.270 0.016 0.050
X 2.000 2.300 0.079 0.091
Option 1
Y 2.000 2.300 0.079 0.091
X 2.100 2.500 0.083 0.098
Option 2
Y 3.000 3.500 0.118 0.138

8-Lead SOP (Exposed Pad) Plastic Package

Richtek Technology Corporation Richtek Technology Corporation

Headquarter Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

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