Atitudine LSM9DS0 Sensor
Atitudine LSM9DS0 Sensor
Applications
Indoor navigation
Smart user interfaces
Advanced gesture recognition
Gaming and virtual reality input devices
LGA-24 (4x4x1.0 mm)
Display/map orientation and browsing
Features Description
3 acceleration channels, 3 angular rate The LSM9DS0 is a system-in-package featuring a
channels, 3 magnetic field channels 3D digital linear acceleration sensor, a 3D digital
angular rate sensor, and a 3D digital magnetic
±2/±4/±6/±8/±16 g linear acceleration full scale
sensor.
±2/±4/±8/±12 gauss magnetic full scale
The LSM9DS0 has a linear acceleration full scale
±245/±500/±2000 dps angular rate full scale of ±2g/±4g/±6g/±8g/±16g, a magnetic field full
16-bit data output scale of ±2/±4/±8/±12 gauss and an angular rate
SPI / I2C serial interfaces of ±245/±500/±2000 dps.
Analog supply voltage 2.4 V to 3.6 V The LSM9DS0 includes an I2C serial bus
interface supporting standard and fast mode
Power-down mode / low-power mode
(100 kHz and 400 kHz) and an SPI serial
Programmable interrupt generators standard interface.
Embedded self-test The system can be configured to generate
Embedded temperature sensor interrupt signals on dedicated pins and is capable
Embedded FIFO of motion and magnetic field detection.
Thresholds and timing of interrupt generators are
Position and motion detection functions programmable by the end user.
Click/double-click recognition
Magnetic, accelerometer and gyroscope sensing
Intelligent power saving for handheld devices can be enabled or set in power-down mode
ECOPACK®, RoHS and “Green” compliant separately for smart power management.
The LSM9DS0 is available in a plastic land grid
array package (LGA) and it is guaranteed to
operate over an extended temperature range
from -40 °C to +85 °C.
Contents
2 Module specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4.2 Sensor I2C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1 Set / reset pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2.1 Linear acceleration sensor sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2.2 Magnetic sensor sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2.3 Angular rate sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2.4 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2.5 Zero-gauss level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.2.6 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1.1 Accelerometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1.2 Gyroscope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2 Linear acceleration main digital blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2.1 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2.2 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.2.3 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.2.4 Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.2.5 Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 External capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.3 High current wiring effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.2.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.2.3 SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.1 WHO_AM_I_G (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.2 CTRL_REG1_G (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.3 CTRL_REG2_G (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.4 CTRL_REG3_G (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.5 CTRL_REG4_G (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
8.6 CTRL_REG5_G (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
8.7 REFERENCE/DATACAPTURE_G (25h) . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.8 STATUS_REG_G (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
9 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
List of tables
List of figures
A/D Control
Sensing Block Sensing Interface converter Logic
X+
Y+
CHARGE
AMPLIFIER
Z+
I (a) +
MUX
-
Z-
Y-
X- CS_XM
X+ CS_G
Y+ CHARGE
AMPLIFIER SDA
Z+
I (M) + SDO_XM/SA0_XM
MUX
- SDO_G/SA0_G
I2C/SPI
Z-
Y-
SCL/SPC
X-
INT1_XM
INT2_XM
X+
Y+ CHARGE
AMPLIFIER DEMODULATOR
INT_G
Z+
I (Ω) +
LOW-PASS A/D Control
DRDY_G
Z-
Y-
X- ANALOG
CONDITIONING
Feedback+
Feedback-
AUTOMATIC
Drive- GAIN
CONTROL
VOLTAGE
GAIN
AMPLIFIER
Drive+
TRIMMING
INTERRUPT GEN. REFERENCE CLOCK CONTROL LOGIC
CIRCUITS
BUILT-IN
TEMPERATURE PHASE
FIFO SET/RESET
SENSOR GENERATOR
CIRCUITS
DIRECTION OF
DETECTABLE
ACCELERATIONS
SDO_XM/SA0_XM
X
SDO_G/SA0_G
TOP VIEW
SCL/SPC
CS_XM
CS_G
SDA
+Ω
Z Pin 1 indicator
19 24
1 Vdd_IO 18 1 Res
X Vdd
+Ω DIRECTION OF
Res
Y DETECTABLE
Vdd BOTTOM Res
ANGULAR RATES Vdd VIEW Res
INT2_XM GND
INT1_XM 13 6 GND
12 7
TOP VIEW +Ω
C1_XM
DEN_G
SETP_XM
SETC_XM
X
DRDY_G
INT_G
DIRECTION OF
DETECTABLE
MAGNETIC FIELDS
X
Z
TOP VIEW
2 Module specifications
±2
±4
Linear acceleration
LA_FS ±6 g
measurement range(2)
±8
±16
±2
Magnetic ±4
M_FS gauss
measurement range ±8
±12
±245
Angular rate
G_FS ±500 dps
measurement range
±2000
Linear acceleration FS = ±2 g 0.061
Linear acceleration FS = ±4 g 0.122
LA_So Linear acceleration sensitivity Linear acceleration FS = ±6 g 0.183 mg/LSB
Linear acceleration FS = ±8 g 0.244
Linear acceleration FS = ±16 g 0.732
Magnetic FS = ±2 gauss 0.08
Magnetic FS = ±4 gauss 0.16 mgauss/
M_GN Magnetic sensitivity
Magnetic FS = ±8 gauss 0.32 LSB
a. The product is factory calibrated at 3.0 V. The operational power supply range is from 2.4 V to 3.6 V.
CS () ()
SPC () ()
tsu(SI) th(SI)
Note: Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output
ports.
tsu(SR)
tw(SP:SR) START
SDA
tsu(SDA) th(SDA)
tsu(SP) STOP
SCL
Note: Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
3 Terminology
3.2 Sensitivity
The methods to determine sensitivity and offset are given below in the following paragraphs.
4 Functionality
4.1 Self-test
4.1.1 Accelerometer
The self-test allows the linear acceleration sensor functionality to be tested without moving
it. The self-test function is off when the self-test bit (ST) is programmed to ‘0’. When the self-
test bit is programmed to ‘1’ an actuation force is applied to the sensor, simulating a definite
input acceleration. In this case the sensor outputs exhibit a change in their DC levels which
are related to the selected full scale through the device sensitivity. When the self-test is
activated, the device output level is given by the algebraic sum of the signals produced by
the acceleration acting on the sensor and by the electrostatic test-force. If the output signals
change within the amplitude specified inside Section 2.1: Sensor characteristics, then the
sensor is working properly and the parameters of the interface chip are within the defined
specifications.
4.1.2 Gyroscope
The self-test allows to test the mechanical and electric part of the sensor, allowing the
seismic mass to be moved by means of an electrostatic test-force. When the ST is activated
by the IC, an actuation force is applied to the sensor, emulating a definite Coriolis force. In
this case the sensor output will exhibit an output change.
When the ST is active, the device output is given by the algebraic sum of the signals
produced by the velocity acting on the sensor and by the electrostatic test-force.
For polarity please refer to Table 31: Self-test mode configuration.
4.2.1 FIFO
The LSM9DS0 embeds 32 slots of data FIFO for each of the three output channels: X, Y
and Z. This allows consistent power saving for the system, since the host processor does
not need to continuously poll data from the sensor, but it can wake up only when needed
and burst the significant data out from the FIFO. This buffer can work accordingly in four
different modes: Bypass mode, FIFO mode, Stream mode and Stream-to-FIFO mode. Each
mode is selected by the FIFO_MODE bits in FIFO_SRC_REG (2Fh). Programmable
watermark level, FIFO_Empty or FIFO_Full events can be enabled to generate dedicated
interrupts on the INT1_XM/INT2_XM pin (configured through FIFO_SRC_REG (2Fh)).
Out_Sel
00
01 DataReg
0 FIFO
10 32x16x3
LPF2
11
ADC LPF1 HPF 1 I2C
HPen INT1_Sel SPI
10
11
Interrupt
01 generator
00
SCR REG
CONF REG
INT
GAMS250320131444FSR
4.3.1 FIFO
The LSM9DS0 embeds 32 slots of 16-bit data FIFO for each of the three output channels:
yaw, pitch and roll. This allows consistent power saving for the system, since the host
processor does not need to continuously poll data from the sensor, but can wake up only
when needed and burst the significant data out from the FIFO. This buffer can work
accordingly in five different modes: Bypass mode, FIFO mode, Stream mode, Bypass-to-
Stream mode and Stream-to-FIFO mode. Each mode is selected by the FIFO_MODE bits in
FIFO_CTRL_REG_G (2Eh). A programmable watermark level, FIFO_Empty or FIFO_Full
events can be enabled to generate dedicated interrupts on the DRDY_G pin (configured
through CTRL_REG3_G (22h) and event detection information is available in
FIFO_SRC_REG_G (2Fh). The watermark level can be configured to WTM4:0 in
FIFO_CTRL_REG_G (2Eh).
xi,yi,zi
x0 y0 z0
x1 y1 z1
x2 y2 z2
empty
x 31 y 31 z31
AM07231v1
xi,yi,zi
x0 y0 z0
x1 y1 z1
x2 y2 z2
x 31 y 31 z31
AM07232v1
xi,yi,zi
x0 y0 z0
x1 y1 z1
x2 y2 z2
x 30 y 30 z30
x 31 y 31 z31
AM07234v1
x1 y1 z1
x1 y1 z1
x2 y2 z2
x2 y2 z2
Empty
x 30 y 30 z30
x 31 y 31 z31
x 31 y 31 z31
xi,yi,zi xi,yi,zi
x0 y0 z0
x0 y0 z0
x1 y1 z1
x1 y1 z1
x2 y2 z2
x2 y2 z2
x 30 y 30 z30
x 31 y 31 z31
x 31 y 31 z31
Trigger event
AM07236v1
5 Application hints
SDO_XM/SA0_XM
SDO_G/SA0_G
SCL/SPC
CS_XM
CS_G
SDA
Pin 1 indicator
24 19
Res 1 18 Vdd_IO
TOP
VIEW Vdd
INT2_XM
6 13 INT1_XM
7 12
C4= 100nF C3= 10µF
DRDY_G
INT_G
C1= 4.7µF
GND
6 Digital interfaces
The registers embedded in the LSM9DS0 may be accessed through both the I2C and SPI
serial interfaces. The latter may be SW-configured to operate either in 3-wire or 4-wire
interface mode.
The serial interfaces are mapped to the same pins. To select/exploit the I2C interface, the
CS line must be tied high (i.e connected to Vdd_IO).
There are two signals associated with the I2C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bidirectional line used for sending and receiving the data
to/from the interface. Both lines must be connected to Vdd_IO through external pull-up
resistors. When the bus is free, both lines are high.
The I2C interface is compliant with fast mode (400 kHz) I2C standards as well as with
normal mode.
Table 13. Transfer when master is receiving (reading) one byte of data from slave
Master ST SAD + W SUB SR SAD + R NMAK SP
Slave SAK SAK SAK DATA
Table 14. Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+W SUB SR SAD+R MAK MAK NMAK SP
DAT DAT
Slave SAK SAK SAK DATA
A A
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL LOW to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real-time function) the data line must be left HIGH by
the slave. The master can then abort the transfer. A LOW to HIGH transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In order to read multiple bytes, it is necessary to assert the most significant bit of the sub-
address field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the
address of first register to be read.
In the presented communication format MAK is Master Acknowledge and NMAK is No
Master Acknowledge.
Default address:
The SDO/SA0 pins (SDO_XM/SA0_XM or SDO_G/SA0_G) can be used to modify the least
significant bit of the device address. If the SA0 pin is connected to the voltage supply, LSb is
‘1’ (ex. address 0011101b) else if SA0 pad is connected to ground, the LSb value is ‘0’ (ex.
address 0011110b).
The slave address is completed with a Read/Write bit. If the bit was ‘1’ (Read), a repeated
START (SR) condition will have to be issued after the two sub-address bytes; if the bit is ‘0’
(Write) the master will transmit to the slave with the direction unchanged. Table 15 and
Table 16 explain how the SAD+Read/Write bit pattern is composed, listing all the possible
configurations.
Linear acceleration and magnetic sensor address:
CS
SPC
SDI
RW DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
MS AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
AM10129V1
CS is the Serial Port Enable and is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the Serial Port Clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are respectively the Serial Port Data Input and Output. Those lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the Read Register and Write Register commands are completed in 16 clock pulses or
in multiples of 8 in case of multiple bytes read/write. Bit duration is the time between two
falling edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling
edge of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just
before the rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written to the device. When 1, the data DO(7:0)
from the device is read. In the latter case, the chip will drive SDO at the start of bit 8.
bit 1: MS bit. When 0, the address remains unchanged in multiple read/write commands.
When 1, the address will be auto-incremented in multiple read/write commands.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that will be written to the device (MSb
first).
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
In multiple read/write commands, further blocks of 8 clock periods will be added. When the
MS bit is 0, the address used to read/write data remains the same for every block. When the
MS bit is 1, the address used to read/write data is incremented at every block.
The function and the behavior of SDI and SDO remain unchanged.
CS
SPC
SDI
RW
MS AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
AM10130V1
The SPI read command is performed with 16 clock pulses. The multiple byte read command
is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1: MS bit. When 0, does not increment address; when 1, increments address in multiple
reads.
bit 2-7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb
first).
bit 16-... : data DO(...-8). Further data in multiple byte reads.
CS
SPC
SDI
RW
M S A D5 A D4 AD 3 A D2 A D1 A D0
SD O
DO 7 DO 6 DO 5 DO 4 DO 3 DO 2 DO 1 DO 0 DO 15 DO 14 DO 13 DO 12 DO 11 DO 10 D O9 D O8
AM10131V1
CS
SPC
SDI
RW D I7 D I6 D I5 D I4 DI3 DI2 DI1 DI0
MS AD5 AD 4 AD 3 AD2 AD 1 AD0
AM10132V1
The SPI Write command is performed with 16 clock pulses. The multiple byte write
command is performed by adding blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1: MS bit. When 0, does not increment address; when 1, increments address in multiple
writes.
bit 2 -7: address AD(5:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that will be written to the device (MSb
first).
bit 16-... : data DI(...-8). Further data in multiple byte writes.
CS
SPC
SDI
DI7 D I6 DI5 D I4 DI3 DI2 DI1 DI0 DI15 D I1 4DI13 D I1 2DI11 DI10 DI9 DI8
RW
MS AD5 AD4 AD3 AD2 AD1 AD 0
AM10133V1
CS
SPC
SDI/O
RW D O7 D O6 D O5 DO4 DO3 DO2 DO1 DO0
MS AD5 AD 4 AD 3 AD2 AD1 AD 0
AM10134V1
7 Register mapping
The table given below provides a listing of the 8-bit registers embedded in the device and
their respective addresses.
Registers marked as Reserved must not be changed. Writing to those registers may cause
permanent damage to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory-calibrated values. Their content is automatically restored when the device is
powered up.
8 Register description
The device contains a set of registers which are used to control its behavior and to retrieve
angular rate data. The register address, consisting of 7 bits, is used to identify them and to
write the data through the serial interface.
DR[1:0] is used for ODR selection. BW [1:0] is used for Bandwidth selection.
In Table 21 all frequencies resulting in combinations of DR / BW bits are given.
00 00 95 12.5
00 01 95 25
00 10 95 25
00 11 95 25
01 00 190 12.5
01 01 190 25
01 10 190 50
01 11 190 70
10 00 380 20
10 01 380 25
10 10 380 50
10 11 380 100
11 00 760 30
11 01 760 35
11 10 760 50
11 11 760 100
A combination of PD, Zen, Yen, Xen is used to set device to different modes (power-down /
normal / sleep mode) in accordance with Table 22 below.
Power-down 0 - - -
Sleep 1 0 0 0
Normal 1 - - -
0 0 Normal mode
0 1 Self-test 0 (1)(X positive sign, Y and Z negative sign)
1 0 --
1 1 Self-test 1 (1) (X negative sign, Y and Z positive sign)
1. DST sign (absolute value in Table 3)
00
01 DataReg
0 FIFO
10 32x16x3
LPF2
11
ADC LPF1 HPF 1
AM07949V2
0 0 0 Bypass mode
0 0 1 FIFO mode
0 1 0 Stream mode
0 1 1 Stream-to-FIFO mode
1 0 0 Bypass-to-Stream mode
Reading at this address clears the INT1_SRC IA bit (and eventually the interrupt signal on
the INT_G pin) and allows the refresh of data in the INT1_SRC register if the latched option
was chosen.
The D6 - D0 bits set the minimum duration of the interrupt event to be recognized. Duration
steps and maximum values depend on the ODR chosen.
The WAIT bit has the following definitions:
Wait = ‘0’: the interrupt falls immediately if the signal crosses the selected threshold
Wait = ‘1’: if the signal crosses the selected threshold, the interrupt falls only after the
duration has counted the number of samples at the selected data rate, written into the
duration counter register.
Rate
(dps)
0 Rate
t(n) Threshold
Counter
Duration
Value
t(n)
Interrupt
“Wait”
Disabled
t(n)
Rate
(dps)
0 Rate
t(n) Threshold
Counter
Duration
Value
t(n)
Interrupt “Wait”
Enabled
t(n)
AODR[3:0] is used to set the power mode and ODR selection. The following table indicates
all frequencies resulting from the combination of AODR[3:0].
0 0 0 0 Power-down mode
0 0 0 1 3.125 Hz
0 0 1 0 6.25 Hz
0 0 1 1 12.5 Hz
0 1 0 0 25 Hz
0 1 0 1 50 Hz
0 1 1 0 100 Hz
0 1 1 1 200 Hz
1 0 0 0 400 Hz
1 0 0 1 800 Hz
1 0 1 0 1600 Hz
0 0 773 Hz
0 1 194 Hz
1 0 362 Hz
1 1 50 Hz
0 0 0 ±2 g
0 0 1 ±4 g
0 1 0 ±6 g
0 1 1 ±8 g
1 0 0 ±16 g
0 0 Normal mode
0 1 Positive sign self-test
1 0 Negative sign self-test
1 1 Not allowed
0 0 0 3.125 Hz
0 0 1 6.25 Hz
0 1 0 12.5 Hz
0 1 1 25 Hz
1 0 0 50 Hz
1 0 1 100 Hz(1)
1 1 0 Reserved
1 1 1 Reserved
1. Available only for accelerometer ODR > 50 Hz or accelerometer in power-down mode (refer to Table 72,
AODR setting).
0 0 ± 2 gauss
0 1 ± 4 gauss
1 0 ± 8 gauss
1 1 ± 12 gauss
0 0 Continuous-conversion mode
0 1 Single-conversion mode
1 0 Power-down mode
1 1 Power-down mode
0 0 0 Bypass mode
0 0 1 FIFO mode
0 1 0 Stream mode
0 1 1 Stream-to-FIFO mode
1 0 0 Bypass-to-Stream mode
Reading at this address clears the INT_GEN_1_SRC (31h) IA bit (and the interrupt signal
on the corresponding interrupt pin) and allows the refreshment of data in the
INT_GEN_1_SRC (31h) register if the latched option was chosen.
The D6 - D0 bits set the minimum duration of the Interrupt 1 event to be recognized.
Duration steps and maximum values depend on the ODR chosen.
Reading at this address clears the INT_GEN_2_SRC (35h) IA bit (and the interrupt signal
on the corresponding interrupt pin) and allows the refreshment of data in the
INT_GEN_2_SRC (35h) register if the latched option was chosen.
The D6 - D0 bits set the minimum duration of the Interrupt 2 event to be recognized.
Duration steps and maximum values depend on the ODR chosen.
9 Package information
Table 133. LGA 4x4x1 mm 24-lead mechanical data (see note 1 and 2)
Databook
Δ
Note: 1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters.
3. The “Pin 1 Indicator” is identified on top and/or bottom surfaces of the package.
4. A1 is defined as the distance from the seating plane to the land.
5. “N” is the maximum number of terminal positions for the specified body size.
6. The tolerance of the typical value is specified in table "Tolerance of Form and Position".
7. Dimensions “b” and “L” are specified:
For solder mask defined: at terminal plating surface
For non-solder mask defined: at solder mask opening
8382494_B
10 Revision history
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