Optical Thin Films User Handbook
Optical Thin Films User Handbook
THIN FILMS
USER HANDBOOK
OPTICAL
THIN FILMS
USER HANDBOOK
James D. Rancourt
Optical Coating Laboratory, Inc.
Santa Rosa, California
Rancourt, James D.
Optical thin films: user handbook / James D. Rancourt.
p. cm.
Includes bibliographical references and index.
ISBN 0-8194-2285-1 (hardcover)
1. Optical coatings. 2. Thin films-Optical properties.
3. Optical films. 4. Light filters. I. Title.
TSS17.2.R36 1996
621. 381S'2-dc20 96-28046
ClP
Published by
SPIE-The International Society for Optical Engineering
PO Box 10
Bellingham, Washington 98227-0010
Phone: 360/676-3290 Fax: 360/647-1445
E-mail: [email protected]
WWW: http://www.spie.org/
PREFACE xi
v
vi CONTENTS
2 DEPOSITION TECHNOLOGY 24
2.1. Coating Processes 24
2.1.1. Vacuum Evaporation 24
2.1.2. Sputtering 26
2.1.3. Flash Evaporation 30
2.1.4. Nonvacuum Processes 30
2.1.4.1. Organometallic Solutions 30
2.1.4.2. Electroless and Electroplating Solutions 31
2.1.5. Process Conditions 31
2.1.6. Coating Time 32
2.2. Coating Parameters 33
2.2.1. Source Characteristics 33
2.2.1.1. Compositional Variations 33
2.2.1.2. Stoichiometry 33
2.2.1.3. Coating Distribution 34
2.2.2. Deposition Environment 34
2.2.3. Nucleation and Growth 35
2.2.4. Rate and Thickness Monitoring 35
2.2.4.1. Crystal Oscillator 35
2.2.4.2. Optical Techniques 36
2.2.4.3. Atomic Emission Techniques 38
2.2.5. Sticking Coefficient 38
2.3. Coating Equipment 39
2.3.1. Size of Coating Chamber 39
2.3.2. Chamber Geometry and Process Considerations 40
2.3.2.1. Surface to Volume Ratio 40
2.3.2.2. Thickness Uniformity and Coating
Efficiency 41
2.3.3. Substrate Rotation for Coating Uniformity 43
2.3.4. Jigging and Substrate Support 43
2.3.5. Temperature Related Substrate Degradation 44
2.4. Stress Effects 45
2.5. Substrate Cleaning 48
2.5.1. Contacting Cleaning 49
2.5.2. Ultrasonic Cleaning 50
2.5.3. High Pressure Sprays 50
CONTENTS vii
2.5.4. Drying 50
2.5.5. In Situ Processes 52
4 DESIGN TYPES 78
4.1. Antireflection Coatings 78
4.1.1. Single-Layer Designs 82
4.1.2. Narrow-Band AR Designs 83
4.1.3. Wide-Band AR Coatings 85
4.1.4. Superwide Infrared AR Coatings 86
4.2. High Reflection Designs 86
4.2.1. Metallic Reflectors 86
4.2.2. All Dielectric Designs 91
4.2.2.1. Nonsymmetric Stacks 91
4.2.2.2. Symmetric Designs 95
4.2.3. Enhanced Metallic Reflectors 96
4.3. Edge Filters 99
4.4. Bandpass Filters 103
4.4.1. Two Edge Filters in Series 103
4.4.2. Fabry-Perot Filter 104
4.4.2.1. Fabry-Perot Filter 105
4.4.2.2. Solid Fabry-Perot Filters 107
4.4.3. Narrow-Band Dielectric Filters 108
4.4.4. Circular and Linear Variable Filters 110
4.4.5. Reflex or Phase Conjugate Filter 112
viii CONTENTS
REFERENCES 281
INDEX 287
Preface
This book is intended for the user of optical thin film products. Its primary aim is
in the area of commercially available products: their preparation techniques and
their characteristics. It is hoped that this will help users to specify filters, and to
be aware of the limitations they might encounter in using them.
The reader interested in a design textbook is directed to a companion volume
in this series written by Alfred Thelen entitled Design of Optical Interference
Coatings.
The vast majority of the discussions in this text are independent of the method
of deposition used-evaporation, sputtering, ion plating, epitaxial growth, or other
scheme of depositing optical films. The emphasis is on pragmatic information that
one needs when using, specifying, or designing into an optical system an optical
interference filter.
In writing this book, the ubiquity of the computer-handheld, desktop, and main-
frame-models, has led to the decision to minimize the number of tables of com-
xi
xii PREFACE
puted values in favor of curves and formulas. The curves hopefully give the reader
a feeling of the phenomenon described by an equation. If precise values are required,
they can be easily obtained from the equations.
ACKNOWLEDGMENTS
Introduction to Optical
Thin Films
The origins of interference lie in the wave nature of light and the superposition of
coherent waves. The incident wave may interfere with one or more of the waves
that are reflected from the interfaces formed by the thin film and the substrate. The
phases and the amplitudes of these waves determine whether the resultant sum of
these waves leads to constructive or destructive interference, and an increase or
decrease in the reflectance or the transmittance of the incident light. The incident
waves may vary in wavelength, and there is, in general, a dependence of the
performance on the wavelength. Coatings with a strong wavelength dependence
give rise to useful designs such as narrow bandpass filters. In other situations, one
desires a wavelength insensitive performance such as may be found in a wide band
antirereflection coating. These different performances are attained by varying the
index of the layers, their thicknesses, the order of the layers, and the total number
of layers in a stack. In addition, the indices of refraction of the incident medium
and of the substrate are important.
Figure 1.1 shows schematically a layered structure of thin films deposited on
a substrate. Each layer typically has an index that is different from the adjacent
ones, although there are some instances in which they may be the same. The optical
thicknesses; i.e., the product of the index of refraction and the physical thickness,
of typical layers used in optical filters is of the order of one-quarter of the wavelength
of light.
Light is reflected from, as well as transmitted through, each of the interfaces.
These transmitted and reflected waves interfere with one another. They can also
undergo multiple reflections, and these are taken into account in analytical treat-
ments. The waves are usually all coherent because they originate from the same
incident wave.
Figure 1.2 shows the effects of two simple cases of interference. In the first,
the two waves add to zero, thus leading to complete destructive interference, whereas
in the second illustration, constructive interference takes place.
The normal incidence amplitude reflectance at an interface between two semi-
infinite, nonabsorbing materials of different indices of refraction (Fig. 1.3) is given
by the Fresnel formula:
(1.1 )
where r is the amplitude reflection coefficient, no is the index of refraction of the
incident medium, and nl is the index of refraction of the second medium.
The transmitted amplitude t is given by 1 - r.
Note that nl is complex when the second medium is absorbing. The incident
medium may not be absorbing because the incident wave is assumed to arrive from
infinity with no intervening surfaces. Any absorption in the incident medium would
attenuate the intensity of the incident wave to zero.
Equation 1.1 is also valid at the interface between two thin films if multiple
reflectances are ignored or accounted for separately. In this case, both media may
be absorbing, and the corresponding indices no and nl are complex, as is the result,
INTRODUCTION TO OPTICAL THIN FILMS 3
n3
••
•
••
•
r. The implication of complex values for no or nl is that there will be some absorption
of the energy in the light beam.
The reflection coefficient generally refers to the ratio of the reflected intensity
to the incident intensity and is given by the complex square of r: R = r . r*. For
nonabsorbing substrates, this is
R == (no - nl)2/(no + nl)2,
4 CHAPTER 1
E2 = -2nk
The imaginary portion of the complex index of refraction (k) given above has a
variety of names including extinction index (Stone, 1963) and extinction coefficient
(Maclet>d, 1969). It also appears in different forms, including the product n K, also
called extinction coefficient or attenuation index (Born and Wolfe, 1970, p. 613).
In this work, only the form N = n - ik is used. Care should be exercised when
using tabulated data to be certain that it is clear which representation of k a particular
author is using.
A value related to k is the absorption coefficient; it is sometimes represented
by a and sometimes by ~. It'is defined as
a = 4 7r klA
where A is the vacuum wavelength.
It has units of reciprocal length, usually inverse centimeters, and is used to
calculate the attenuation of a beam of light in an absorbing material:
1/10 = exp( - ad),
where I is the emergent intensity, 10 is the incident intensity, and d is the thickness
of the material.
The phase of the reflected wave for nonabsorbing substrate is
o if no> nl
<l> =
{7r if no < nl.
A wave reflected at an air/glass interface undergoes a phase shift of 7r (180°), and
a node in the electric field occurs at the interface. On the other side of the glass
plate, at the glass/air interface, no phase shift occurs for the reflected wave.
For absorbing substrates, the situation is more complex; the phase is given by
_ -I 2 nokl
<l> - tan 2
no - nl2 - •.2
Ilf
iL
Time
+
"=f1 Unit
o Units
Destructive Interference
IL
_0--_-->1
1 UNIT
1 UNIT
-
W'UN'TS
Constructive Interference
Figure 1.2. Constructive and destructive interference of light waves. The amplitudes of
two waves with the same frequency (wavelength) add if the two waves are in phase, or
cancel if they have the same amplitude and are exactly out of phase with one another. In
other cases of unequal amplitudes or inexact phasing, the result is a wave with a different
amplitude from the original two interfering waves. More than two waves may interfere.
Incident medium
Substrate or film n1
Figure 1.3. Schematic diagram of an interface. The angle S, of the reflected ray r is equal
to angle Si of the incident ray. The deviation of the refracted ray is dependent on the indices
of refraction of the media on either side of the interface and on the angle of incidence of the
light ray.
5
6 CHAPTER 1
In this case, there is no node at the boundary. In some situations, however, the
indices of refraction can be such as to allow an approximation of a node to exist
at the surface. Silver is one such material where the complex index of refraction
in the infrared portion of the spectrum is approximately (0.05 - 3.0i). The phase
shift for these values is approximately 178 degrees, which is close to the 180
degrees required for a node. Table 1. I contains some complex index values for
this and other materials. This subject is covered in more detail in the section on
electric field standing waves in Chap. 3.
It should be noted that the wavelength does not explicitly enter into the cal-
culation of phase values at an interface, although it does determine which values
of the refractive indices one should use.
It is straightforward to add layers to the initial interface. The Fresnel formula
applies at each interface, and the phases of the individual waves must be included
in the calculation (Fig. 1.4). For a single layer between two semi-infinite regions,
the formula is
where 'i is the amplitude reflectance at the ith interface as given by Eq. 1.1 and
~ is the phase thickness of the film, and is given by
21T
~ ==
T nrdr,
""
'I' = tan '1 (Ii +'2(ri
-1 - 1) sin 2 ~
1) + ,iri + 1) cos 2 ~
When the film thickness goes to zero, Eq. 1.3 reduces to Eq. 1.1, the Fresnel
reflection equation for the interface between the incident medium and the substrate.
Figure 1.5 and 1.6 illustrate the behavior of the reflectance as the thickness
Table 1.1 Typical metal indices and normal incidence phase shifts for
normally incident light in air
Phase shift
Metal n k (degrees) Comments
Figure 1.4. Schematic diagram of the summation of the partial reflectances to get the total
reflectance from two interfaces. If the two interfaces are sufficiently separated so that the
optical path between the surfaces exceeds the coherence length of the wave packets. then
the partial reflected irltensities are added to give the total reflectance. Otherwise. the am-
plitude reflectances add and the phase differences between all of the waves that are intro-
duced by the thickness of the film must be taken into account (Eq. 1.2). The Fresnel reflection
coefficients. rio are indicated at each interface. The indices of the incident medium. the film.
and the substrate are indicated by no. n,. and n•• respectively. The refraction that occurs al
each surface is not shown in this figure.
Imaginary Amplitude
Reflectance
0.4
1.6 0.2
1.0
Real Amplitude
Reflectance
OWOT
0.4 -0.2
-0.4
Figure 1.5. The amplitude reflectance of a film of index 2.35 of increasing thickness plotted
on the complex reflectance plane. The tick marks on the circle are spaced at intervals of
0.1 quarter wave optical thickness. The arrow indicates the direction of increasing film
thickness. The substrate has an index of 1.52. The amplitude of the reflectance is the distance
from the origin to a pOint on the circle, and the angle formed by that vector is the phase
angle of the reflected light. The intensity is the square of the amplitude value. Note that the
spacing of the thickness intervals is not uniform.
where no, nf' and ns are the indices of the incident medium, the film material, and
the nonabsorbing substrate, respectively. Otherwise, the reflectance reaches a max-
imum at the quarter wave point. When the index of the film is the geometric mean
of the incident medium and the substrate, then the minimum is exactly zero:
nf = Vno n ..
If a given material has no dispersion in its index of refraction, then the same peak
value of the reflection is obtained at all odd multiples of the quarter wave optical
thickness.
If the substrate is absorbing, e.g., it consists of a polished metal surface, then
the extremum does not take place at the point where the optical thickness of the
film is exactly a quarter wave, as shown in Fig. 1.7. The nature of the reflectance
for these cases is discussed in detail in in Chap. 3.
As the optical thickness of a nonabsorbing layer approaches twice a quarter
INTRODUCTION TO OPTICAL THIN FILMS 9
wave, i.e., a half wave or a thickness of 180 degrees, the argument of the exponential
tenn in Eq. 1.3 approaches 360 degrees, and the value of the exponential term
becomes unity. The implication of this is that a layer that is one-half wave thick
has no effect on the light passing through it. The complex exponential function is
unity at integral multiples of a half wave, so that the film essentially disappears at
those wavelengths also. At these integral mUltiples of a half wavelength thickness,
the film is described as being absentee, and the reflectance returns to the initial
value of the uncoated substrate.
The above effects are strictly true for homogeneous and non absorbing films.
Films that are either absorbing, inhomogeneous, or both, will not be absentee when
50
Q)
U
C
...
&a
U
-.....
Q)
Q)
a:
tP-
o
o 1 2
Thickness (QWOT)
Figure 1.6. Reflectance (intensity) as a function of thickness for a nonabsorbing film The
film index is approximately 2.35; the index of the substrate is 1.52. The peak reflectance
occurs at the point where the film optical thickness is an odd multiple of a quarter wave. At
even multiples of a quarter wave optical thickness, the film is a multiple of a half wave thick,
and the reflectance returns to that of the substrate. The curve is not a simple sinusoidal
function. Note that if the film index had been less than that of the substrate, the reflectance
would have gone through a minimum at the quarter wave point. The phase content of the
light is not recovered when only the intensity is measured.
10 CHAPTER 1
60~------------------------------------~
CD
U
C
...uca
-...
CD
CD
a:
~
O~--------~~------~--------~---------'
o 2 1
Thickness (QWOT)
Figure 1.7. Reflectance of a dielectric film on a metal substrate. Note the initial drop in
reflectance as the thickness of the thin film increases. The extrema do not occur at the
quarter wave points. The substrate index is 2.0 - 2.Oi and the film index is 2.35. At the half
wave pOints. the reflectance returns to that of the bare substrate.
they are a half wave thick. This information can be useful in evaluating the properties
of an unknown film.
The formulas given previously apply for normal incidence. Nonnormal inci-
dence effects are discussed in section 3.6. A complete treatment of this subject can
be found in Chap. 13 of Born and Wolf (1970).
could do this because the coherence length of most light is several wave lengths
long. For a continuous wave (CW) laser beam, the coherence length is several
meters (a pulsed laser with a pulse length of I psec has a coherence length of 300
!Lm). With laser light sources, interference between waves can take place when the
two waves travel paths that are quite different in length. White light from a thermal
source on the other hand, does not have this coherence. In a typical thin film
configuration, where the total thickness of the stack is usually a small number of
waves thick, all of the waves reflected from the interfaces can be added coherently,
i.e., the amplitudes add, and the phases of the waves have to be taken into account
when adding these amplitudes.
The coherence length of light ~1 is approximately
~1 = '!..2/~'!..,
QWOT = 4 nd/A,
where nd is the optical thickness of the film and A is the wavelength at which the
QWOT condition occurs.
Note that this thickness specification implies a wavelength. Although a design
may be designated as consisting of layers with a certain number of QWOTs, it is
not fully specified until the wavelength at which those QWOTs are defined is given.
This measure is useful because many nonabsorbing thin film filters consist of
layers that are one or more quarter waves thick. A very common design is a stack
made up of layers of alternating indices, the thicknesses of which are all one quarter
wave at some given wavelength. A design specified in these terms is instantly
recognizable. If the coating design were given in terms of the physical thicknesses
of the layers, it is not so readily identified, and its performance characteristics would
be(ome obvious only after some amount of computation.
It is important when looking at the design data of a thin film filter to understand
which type of thickness representation is being used.
1.1.3. Nomenclature
The roots reflect, transmit, and absorb can have a number of suffixes such as
-ance, -ivity, and -tion. The distinctions among the suffixes are not universally
accepted, but the current common usages, and the one followed here, are
-ivity: e.g., transmissivity, reflectivity, absorptivity
The fundamental properties of a material, or theoretical or calculated values based
on first principles.
-ance: e.g., transmittance, reflectance, and absorptance
Measured values.
-tion: e.g., transmission, reflection, and absorption
Generally refers to the phenomena rather than actual values. Frequently used in-
terchangeably with the -ance version.
Because quarter wave layers are frequently used in thin film optics, a notation has
evolved that represents such layers, as well as multiples and submultiples of them.
An uppercase letter is used to designate a quarter wave layer with a particular index
of refraction; e.g., H, represents perhaps, a QWOT of a high index material, and
L represents a QWOT of low index material. A basic two-layer period consisting
of a low and a high material would be designated as HL. If more than one period
exists, an exponent is used: (HL)IO represents 10 periods of the basic stack (20
alternating layers). If a layer is less than a quarter wave thick, it may be designated
INTRODUCTION TO OPTICAL THIN FILMS 13
as a fraction of the quarter wave; e.g., 0.5 H or H/2 is an eighth wave thick layer
of the high index material.
1.1.4. Index of Refraction and Dispersion
The index of refraction discussed previously varies as a function of wavelength for
most real materials. In some restricted wavelength ranges, this change may be
negligible. The index of some materials can change as a function of a number of
variables, such as time or UV (ultraviolet) light exposure. Therefore, the common
nomenclature of optical constants of a material is somewhat of a misnomer.
In this text, the theoretical perfonnance curves have no dispersion included in
the calculation unless specified otherwise, so that the primary features in the per-
formance curve can be seen, unobstructed by dispersion effects.
The change in index of refraction as a function of wavelength is referred to
as dispersion. For most nonmetallic materials used in thin films in the visible portion
of the spectrum, the index is typically higher in the blue end of the spectrum, and
lower in the red end. Similarly, in the infrared, the index of most nonmetallic
materials decreases as the wavelength increases. Near absorption bands, however,
this trend may be reversed and the index can increase as the wavelength increases.
Concurrently, the absorption coefficient, k, is generally nonzero.
20,-------------------------------------~
15
Q)
U
C
CO
~ n=2-2i t=8nm
--
U
Q)
Q)
10
n=1.52 1\
a: R1
"iP-
5
... - ................ R1
- ... _----
..
....
------------
O~----------~------------~----~~ ~
400 500 600 700
Wavelength (nm)
Figure 1.8. Reflectance and reverse reflectance of a metal (n = 2, k = 2) film on a glass
substrate (n = 1.5). The reflectance (and absorptance) depends on the direction of incidence
of light. There is no dependency in the transmission on the direction of arrival of the light.
almost perfect antireflection condition can be obtained when the interface is viewed
from the glass side, yet the reflection is moderately high when the coating is viewed
from the air side. Concurrently, absorption of the light arrivbg from the glass side
is higher than that arriving from the air side since the transmission is the same,
irrespective of the light's direction of arrival.
When a filter is measured in transmission, it is not important which side faces
the light source and which, the detector. If the reflectance is being measured,
however, it is important that the proper face of the sample be oriented toward the
light beam if significant absorption exists in any of the layers in the coating in the
spectral range of interest.
Along with absorption, scatter is another mechanism of energy loss from the
specular beam. Scatter sites are generally microscopic volumes, the refractive in-
dices of which are different from that of the surrounding medium. The light dif-
fracted from these sites is distributed in all directions and is, therefore, lost from
the specular beam. If the scatter sites are large enough, the reflection and refraction
may also playa role and contribute to the overall light lost. Each site removes only
a small percentage of the total energy in the beam, but as there can be many such
sites, the cumulative effect can add up to a serious light loss.
INTRODUCTION TO OPTICAL THIN FILMS 15
By far the most difficult problem in the field of thin film engineering is that of
finding the proper materials for a particular application. It is a rather straightforward
task to design a coating that meets just about any arbitrary specification if one does
not have to worry about building it with the materials supplied to us by Mother
Nature. The limitations imposed by real materials can be very severe.
In addition to optical problems, the designer also has to cope with coating
process, mechanical, environmental, and sometimes chemical problems in con-
verting a design from paper to reality. Some of the mechanical problems that are
frequently encountered are stresses in the films that cause the substrate to warp or
the films to delaminate through adhesive or cohesive failure. The process temper·
ature, which will ensure an environmentally stable coating, may be too high for
the substrates. The substrates may react with the coating materials in some ways
that cause degradation. Some materials cannot survive outside the vacuum chamber
because of oxidation or moisture reactions. Less severe cases of this may leave the
film intact, but make it too fragile to be of any practical use in other than a controlled
environment.
Some materials are useful only in certain narrow wavelength regions, whereas
others have much broader utility. A material does not have to be transparent every-
where to be useful; for example, in the blocking of certain wavelengths, absorption
is the property of interest, though usually, some region of transparency is also
generally desired.
Some materials, such as magnesium fluoride, are transparent over very wide
spectral ranges. Mechanical stresses, on the other hand, can severely limit the
maximum thickness attainable without failure. The maximum quarter wave optical
thickness of a magnesium fluoride film that can be typically obtained with a con-
16 CHAPTER 1
The performance of a filter that uses the absorption properties of materials to obtain
the desired spectral shape does not change markedly as a function of the angle of
incidence. This is readily apparent when a beam of white light is observed through
a colored glass plate: its color does not shift spectrally when the filter is tilted. The
optical density of the filter increases owing to the increase in the path length inside
the absorber. The ratio of the internal transmission at some angle to that at normal
incidence is given by
Ti = exp[ -o.d(sec 82 - I)],
where 0.is the absorption coefficient, d is the thickness of the absorber, and 82 is
the angle the ray makes with the normal inside the absorbing medium.
This equation is Valid for relatively weak absorbers, such as most colored
glasses, which are basically a glass matrix doped with specific ions or atoms. The
complex part of the refractive index of the absorbing filter can be ignored in
evaluating Eq. 1.2. It should be noted that this discussion ignores the effect of the
surface reflectances: at high angles of incidence, these can be substantial.
------r-~~--~------~------------~--------~~ X
angle. At the critical angle, the angle of the refracted beam is 90 degrees; i.e., the
refracted beam is travelling parallel to the interface. The critical angle 6c is given
by
6c = sin-I (ndno)
where no is the index of the incident medium, nl is the index of the second medium,
and nl < no.
Note that there is no critical angle when the incident medium has an index
that is less than that of the second medium.
Any increase in the angle of incidence beyond the critical angle results in total
internal reflection (TIR), and no light energy enters the second medium. In practice,
it is possible to obtain a reflectance value very close to the theoretical one of 100
percent when TIR is utilized. TIR is used in many prisms. The standard laws of
reflection i.e., the angle of reflection is equal to the angle of incidence, apply to
those cases of reflection beyond the critical angle.
Evanescent waves can penetrate the interface when the angle of incidence is
greater than the critical angle. The amplitude of these waves decreases exponentially
in the low index medium; their short attenuation length is on the order of a few
wavelengths (Jackson, 1962, p. 221). With dielectric media, and in the absence of
an absorbing layer at the interface, this attenuation of the amplitude of the wave
does not remove any energy from a light beam, and the reflectance remains at 100
percent.
An absorbing medium can be located such that it interacts with the evanescent
waves; for example, absorbing particles can be located on the reflecting face of a
prism. This interaction is strong, and energy is removed from the beam that was
undergoing TIR. This has been a fertile field for experimenters who are interested
in the measurement of materials with very low absorption coefficients; [see Harrick,
(1967)]. This technique of measuring absorption also is called frustrated internal
reflection or attenuated total internal reflection. Figure 1.10 shows the relationship
between the critical angle and the index of refraction ratio.
1.3.4. Polarization
The polarization of light is sometimes overlooked in specifying optical filters. In
a complex optical system, some degree of polarization may come about inadvert-
ently. For example, the nonnormal reflection coefficient for a dielectric coating or
metallic mirror depends on the plane of polarization. An unpolarized incident beam
may be partially polarized as it progresses through an optical system, and one
polarization may emerge with a higher intensity than the other. This could be
significant if there are many reflectors in a system. If such is the case, then it is
prudent to do a careful analysis of the system to verify the nature and amount of
the polarization introduced into the beam.
Laser light is frequently plane (linearly) polarized and this can make the analysis
of a laser system simpler. It should be noted that coated mirrors can introduce
differential phase shifts that can lead to circular or elliptical polarization (see section
1.3.7.). When a laser with random polarization is used, a system analysis needs
INTRODUCTION TO OPTICAL THIN FILMS 19
.
......
;;. 60
...
S
...u
~
'1:1
T=O"
U
.E
'0
... 30
'at
c Transmission Possible
c I
I
I
I
I
I
I
o , 2 3 4 5
~
Total Internal Reflection "0 1"1 (Log Scale)
!'!Q.!
Possible (nO >n,)
Figure 1.10. Plot of critical angle versus index ratio (n<ln1) for nonabsorbing materials. In
the areas where transmission is possible, its actual value is determined by the reflection
coefficient for the interface. The transmission is 100 percent for those cases where no = n1
(dashed vertical line), and the value of T decreases on either side of it. The transmission is
zero along the vertical axis.
to be done separately for each plane of polarization. A beam of light can have two
states of polarization. For plane polarized light, these states are specified with respect
to the plane of incidence.
Alternative polarization states are sometimes used when the analysis lends
itself more easily to these different fonns. An example is the use of right and left
hand circular polarization. Details on these topics may be found in many references,
such as Shurcliff (1962) and Clarke and Grainger (1971).
The electric field of a plane polarized electromagnetic wave can be decomposed
into two orthogonal components, commonly designated "s" and "p." In the fonner,
the plane of oscillation is perpendicular to the plane of incidence (The "s" designation
derives from the Gennan word for perpendicular, senkrecht.). In the latter, the
plane of oscillation is parallel to the plane of incidence ("p" state).
In a complex system, each needs to be examined as a beam that has an s
polarization at one interface may, because of the system's geometry, be a p state
at another interface.
The quality of a polarizer is frequently given in tenns of its extinction ratio.
This parameter p is defined by
20 CHAPTER 1
where Tmax is the maximum intensity of light which the filter transmits when its
axis is aligned with the polarization of the probe beam and Tmin is the
minimum intensity of light that the filter transmits when its axis is rotated
90 degrees in the polarized beam (Driscoll and Vaughan, 1978, pp. 10-13).
4t---------================~~&::
3
neff
no
1 t-====:::::==-~
10 20 30 40 50 60 70 80 90
Angle of Incidence (in medium no)
Figure 1.11. Effective index as a function of angle of incidence. The effective index is
normalized to the index of the medium in which the angle of incidence is defined (no). The
sand p plane values of the effective index are marked. The intersection of the p plane
curves occurs at Brewster's angle for that pair of indices. At index values below no, the
curves have the shape of the unity curves, except for a scaling factor along the abscissa;
the effective index of the s plane component then goes to zero at the critical angle.
for that pair of indices: since the effective indices are equal, the interface disappears
at that angle and there can be no reflectance from it.
Figure 1.12 shows variation in the reflectance as a function of the angle of
incidence at air interfaces with glass (n = 1.5), a poorly reflecting metal (n = 2.0,
k = 2.0), and a highly reflecting metal (n = 0.5, k = 3.0). The reflectance of
light with p polarization is zero at Brewster's angle. At all angles (except nonnal,
of course), bare interfaces act as polarizers to some extent.
designs with such properties have been caJled birefringent. Strictly speaking, thin
film filters are not birefringent because this term refers to a material property.
Ellipsometric techniques are typically used to measure the differential phase shift.
When the angle of incidence is not 0 degrees, the phase shift for the two planes
of polarization is not equal. In some instances, this is a useful property. By proper
design, a coating can change the relative phase of the two components such that
incident linearly polarized light will be reflected as circularly polarized. In effect,
this type of system functions as a reflective quarter wave plate. These are useful
in spectral regions where transmissive birefringent quarter wave plates are difficult
to obtain. Figure 1.13 shows the performance of a typical design in the infrared
portion of the spectrum. These, and similar designs, are available commercially.
By using more than one surface to achieve the desired phase shift, it is much easier
to fabricate and use these devices, as they are quite wavelength sensitive when the
entire shift is attempted on one reflection. The shifts are additive, so a cascade
system is effective. Several papers have been published on this subject recently
(Apfel, 1982, 1984; Southwell, 1980).
75
G)
U
...r:::uas
G) 50
;:
G)
~
"fP.
25
30 60 90
Angle of Incidence
Figure 1.12. Reflectance at various air/bare substrate interfaces as a function of angle of
incidence. At Brewster's angle for glass, the p component of the light is not reflected. The
reflectances of the p component for metals also have a minima.
INTRODUCTION TO OPTICAL THIN FILMS 23
100 ~--------------------------------------------~
--
en
GI
...
GI
g)
~ 90
en
eI
Q.
e
80 ~----~-------.------~------~------~----~
.925 .950 .975 1.0 1.025 1.050 1.075
Wavelength (pm)
Figure 1.13. Phase difference (<I>p - <1>.) upon reflectance from a mirror as a function of
wavelength. This design has a nominal phase difference of 90 degrees.
Deposition Technology
Thin film optical filters can be prepared using a number of different coating tech-
nologies. A few of these methods have found their way into commercial production
processes. In this section we discuss some of the methods currently used for com-
mercial filter production. Although the subject matter is extensive, this section is
necessarily brief. For more detailed information on this subject, the reader is referred
to the text by Maissel and Giang (1970).
The first thin film interference coatings for optical applications were made by
resistively heated thermal evaporation, and this process is still in use today. A
charge of the material to be evaporated is placed in a crucible of a refractory material.
An electrical resistance heater heats this charge (either by conduction or by radiation)
after the chamber has been evacuated to about 10-6 torr, or one billionth (10-9 ) of
an atmosphere (Table 2.1 contains factors to convert between some common units
used to express pressures and vacuums). As the temperature of the charge rises,
its vapor pressure rises and a significant evaporation rate develops. The vapor
24
DEPOSITION TECHNOLOGY 25
within the operating range of a diffusion pump. This is called the rough vacuum.
Once the chamber has been roughed, the mechanical pump is used to keep the
outlet port of the diffusion pump at a low pressure, called the backing pressure.
Reliable mechanical pumps of the rotary vane type for roughing and backing of
the diffusion pumps, and of rotary (HRootes") blowers for increasing the mechanical
pump throughput set the stage for modem vacuum systems and coating technology.
In time, more efficient means of heating the evaporant charge were developed,
including the electron beam and the laser beam. This latter method of heating a
charge in a vacuum evaporation chamber was first demonstrated by Smith and
Turner (1960) with a pulsed ruby laser. Hass and Ramsey (1969) used a carbon
dioxide laser to evaporate dielectric and semiconductor materials. Sankur and Hall
(1985) used the laser heating method to produce films with little ionization of the
evaporant. In an electron beam heating system, electrons from a high voltage
(typically 5 to 15 kV), high current (up to several amperes) electron gun are focused
on the surface of the charge that is contained in a water-cooled metal, typically
copper, crucible. This heating process is a very efficient way of depositing energy
into a material in a vacuum. As compared to a resistively heated charge, relatively
little radiant heat, except from the surface of the molten charge, is produced by
the evaporation source in an electron beam heated system. A resistively heated
source with a comparable coating rate radiates from a number of surfaces and this
heats the coating chamber much more. Another major advantage of using the
electron beam heating technique is that it makes it practical to evaporate refractory
materials, the melting points of which can exceed that of tungsten metal. These
materials cannot be evaporated using resistively heated boats because they cannot
be heated to sufficiently high temperatures to obtain good coating rates. In particular,
the oxides of zirconium, tantalum, silicon, titanium, and aluminum became practical
coating materials with the advent of the electron beam heating system. Another
drawback of the resistance method of heating a charge is the fact that some materials
may react chemically or alloy with the hot crucible and cause it to fail.
At room temperature, oxides are geneally good electrical insulators. Under
intense bombardment from a sufficiently energetic electron beam, however, all
insulators and other refractory materials can be heated sufficiently to cause them
to evaporate (unless they first decompose).
2.1.2. Sputtering
Sputtering is another vacuum coating process that is used extensively for depositing
optical thin films. This process is most easily characterized as a momentum transfer
process in which argon or other ions and atoms from a plasma bombard a target
made of the material to be coated. The area of a sputtering target may be an order
of magnitude larger than an equivalent evaporation source. The collision of the
argon atoms and ions with the surface atoms and molecules of the target knocks
off (sputters) the target material, which then forms a deposit on the substrate.
Flowing water keeps the target cool, so thermal evaporation of the target material
does not occur. Figure 2.1 shows the relative scale of a sputtering system's geometry
as compared with that typically used in an evaporation system.
DEPOSITION TECHNOLOGY 27
Planetary Motion
To Pumping System
~ubsir.teCs) SUbstratecsjl ~
\ / ,-----.,
\ /
\ \ I , /
\ \: ;' / Evaporation
Chamber
\ \1 / /
\\111 Source
! I To Pumping S~tem
Substrates Substrates
Target Target
Sputtering Chamber
Figure 2.1. Diagram of sputtering and evaporation chambers on approximately the same
scale. The substrate size capability of these chambers is the same. The evaporation source
is approximately a point source, whereas the sputtering targets are a large area source.
Note that the sputtering system can be made much smaller than a comparable evaporation
system.
A heavy, chemically inert gas, such as argon, is frequently used as the major
constituent of a sputtering gas. A heavier gas is more efficient in a momentum
transfer process such as sputtering. Few target materials sputter well when light
gases, such as nitrogen and oxygen, are the major components of the sputtering
gas.
The gas pressure in a sputtering system is relatively high compared with that
in an evaporation system 00-3 mbar vs. 10-6 mbar); therefore, the mean free path
of a sputtered particle is three orders of magnitude less than a particle in an evap-
oration system (Fig. 2.2). The sputtered target atoms and molecules are energetic
as a result of the momentum transferred when they were struck by the argon atoms
and ions. For the target atoms to carry this energy to the substrate and not lose
much of it through collisions, the distance between the target and the substrate must
be as small as possible. This is another reason why the substrate must be placed
closer to the target in a sputtering system than it is in an evaporation system.
Because the target is a large area source, as opposed to the approximate point
1000 r-~~----------------------------------~
- 100
--
E
u
.r:.
CO
Q.
..
Q)
Q)
u.
10
c
CO
Q)
~
1
Evaporation Sputtering
0.1 '-!!5~------~4-------~---~2~--~""
10- 10- 10- 3 10- 10-
1
Pressure (mbar)
Figure 2.2. Mean free path versus pressure. The operating ranges of evaporation and
sputtering processes are indicated.
DEPOSITION TECHNOLOGY 29
collisions between the sputtered atoms and the background gas and plasma as the
sputtered molecule makes its way to the substrate. Magnetron types of systems are
becoming very common today, and are commercially available in AC or DC ver-
sions. Their coating rates are far superior in most cases to what one can achieve
with conventional sputtering.
A recent development in sputtering technology is the ion beam sputtering
technique. In this approach to sputtering, a beam of particles is accelerated in an
ion gun and directed at the target. These particles knock atoms from the surface,
which then coat the substrate. Such a system can operate at the same vacuum levels
as evaporation processes, thus combining the benefits of both evaporation and
sputtering. Unfortunately, this coating process currently has deposition rates that
are far slower than that obtained with standard sputtering techniques. Thus they are
used at present only in research environments and when specialty films are required.
can produce a coating with a graded index that can result in a surface with extremely
low reflectance over a broad wavelength region (Minot, 1976).
*EpnerTechnology, Inc., of Brooklyn, N. Y" 11222, is one plating company that actively supplies
gold electroplated parts to optical industry types of specifications.
32 CHAPTER 2
In practice, temperatures from 50°C to several hundred degrees are used. The
upper limit on the temperature used is limited by a number of factors. In some
coating equipment, the amount of heating that can be done is limited by the available
heat sinking or cooling, as all of the heat that enters into a system must eventually
be removed. In other situations, the substrates, such as plastic materials, may not
be able to tolerate elevated temperatures (see Chap. 6). Finally, the time it takes
to heat and cool a substrate in a vacuum may be economically prohibitive.
It should be noted that radiation is the primary means of heating and cooling
a substrate in a vacuum chamber. In some special applications, conductive types
of heating techniques can be employed, but these are generally complicated. In
radiative environments, the emissivity of the heater and the substrate are the key
elements. If the substrate is highly reflective in the wavelength range in which the
heaters emit their energy, there will be poor coupling between the two and the
substrate temperature will rise only very slowly. Similarly, the coupling between
the substrate on the chamber walls is important when cooling takes place. A hot
substrate with a infrared reflective coating will cool slowly.
section on heating and cooling in a vacuum). Finally, because cooling rates can
have a significant effect on yields (cooling glass is much more likely to cause
breakage, and broken parts cannot be sold as profitably as whole filters), the coating
temperature and substrate type are additional cost considerations. In summary, it
is not possible to judge the amount of time that may be required to coat a substrate
without intimate knowledge of the actual process that is used.
dioxide is generally not a serious problem, because the next lower stable oxide,
SiD, is also rather transparent over a wide wavelength range. On the other hand,
only a very slight oxygen loss from Ti02 results in an absorbing coating. Thus, in
this latter case, it is necessary to pay particular attention to be certain that the titania
is completely oxidized on the substrate.
one common source of outgasing. This type of gas source is often called a virtual
leak. There are standard design techniques that can alleviate these problems, but
there are no definitive texts currently in print on the subject, though O'Hanlon's
(1980) text and Maissel and GIang (1970) do give some guidelines.
If the deposit on the crystal has excessive stress, the calibration factors of the
crystal can change and cause an error in the output value. The deposit can crack
or delaminate as a result of this stress and an abrupt change in crystal frequency
occurs, leading to an indetenninate result. Modem electronics packages that control
the oscillator can detect an abrupt change in oscillator frequency. Several means
have been developed to get around these problems when the deposition process is
underway and cannot be interrupted:
I. A second crystal can be employed; it is positioned adjacent to the first and
shielded from the coating material by a shutter. At the first indication of trouble,
the electronics in the control package activate a shutter that uncovers the second
crystal.
2. A way of extending the life of a crystal is to reduce the rate of buildup of
thick deposits on the crystal by using a shutter or screen in front of the crystal.
Only a known fraction of the full flux is sensed, thus reducing the amount of
material deposited on the crystal. A shutter that is open intennittently can consist
of a rotating slotted wheel or a blade shutter that opens momentarily from time to
time to sample the rate. It is assumed in these sampling schemes that the source is
sufficiently stable that sampling gives an accurate picture of the total amount of
material deposited and the rate at which this takes place.
Crystal oscillator systems are generally used to monitor metal deposition processes.
There are several reasons for this: (1) Metals are highly absorbing and most metal
films are opaque, therefore, standard optical techniques are not useful except for
very thin films. (2) Metal films are typically not as stressy as dielectric films,
therefore, greater total thicknesses can be deposited on the crystal before it fails.
A quartz crystal can be used equally well with a sputtering or an evaporation
system. In fact, a quartz crystal system is ideal for a sputtering system that has a
large target and close spacing of the substrate to the target. Special crystal holders
are available that are optimized for each type of deposition system.
Sputtering is a very well-controlled process, therefore, in a production envi-
ronment, the thickness of a deposit can be detennined or controlled on the basis
of the target power input and the time of deposition. This is fortunate, as it is rather
difficult to monitor optically the growth of a sputtered film owing to the geometrical
constraints of the close proximity of the target and the substrate. If the coating is
done intennittently by moving either the substrate or the target, then it is possible
to monitor the transmission or reflection between the coating passes.
Standard quartz crystal oscillator systems are available commercially from a
number of suppliers.
which the highest reflectance is desired and tenninates the coating of a layer when
the reflectance reaches a peak value, then an error made in one layer will be
automatically compensated in the next layer. This applies to small to moderate
errors, and, of course, is not a substitute for good coating techniques.
Reflection or transmission optical monitoring is possible, and commercial units
are available off the shelf to make these types of measurements. Figure 2.3 shows
the optical layout of such systems. These systems are very useful when one is
coating a stationary part. If the part(s) are in single rotation in the chamber, then
it is still possible to monitor the transmission or the reflection as a given part follows
a relatively simple circular path. This is especially convenient if the part is large
and the geometry is such that a stationary beam is always reflected off the coated
surface as the part(s) rotates. If double rotation or planetary systems are used to
simulate a random motion of the substrate with respect to the sources, then it is
Transmission Detector
Vacuum Window
t:::::::::::1-------f--Monltor Slide
Vacuum Chamber
Evaporation source
Reflectance Detector
Figure 2.3. Optical schematic diagram of reflection and transmission monitors for vacuum
evaporation. A number of variations on this basic arrangement are possible if the coating
machine geometry does not lend itself to this arrangement.
38 CHAPTER 2
difficult to measure the parts directly. In such cases, the optical properties of a
stationary witness part must be employed.
oxides and fluorides, the most common of the coating materials, are quite well
behaved in typical coating temperature ranges.
Vacuum coaters use a variety of coating equipment to manufacture thin film filters.
The common types of equipment are presented here from the filter user's standpoint.
In particular, we describe the implications of the size of the equipment on filter
performance and cost, and the effect of the substrate support structures in the vacuum
chamber on useful filter aperture.
ID
ID
CD
.o
U
D- 72"
III
C $10 Batch Coater
;::
III
o
o
120"
.....
E
o Carousel
Coater
CD
:::I $1
iii Continuous
...':: ..........
>
........... ~%
Coater
!
"a
............
< I
Acre
150 Acres
10 4 10 5
Cumulative Production (square feet)
Figure 2.4. Learning curves for evaporated front surface mirrors. Each piece of equipment
has a slope of about 80 percent, whereas the overall curve has a 70 percent slope. This
means the the costs drops by 20 percent each time the volume doubles. Note that it is
important to use properly sized equipment for a given size lot-both too small or too large
a chamber will increase costs over the optimum machine. (After Seddon, 1977).
40 CHAPTER 2
ameter glass bell jars used in research facilities and teaching laboratories, to be-
hemoth chambers that are connected in tandem with large glass-making machines
and are used to apply architectural coatings continuously to large glass panes. In
between these extremes, one finds that production chambers are typically in the
0.5- to 1.5-m diameter range. These larger evaporation chambers are frequently
made of stainless steel and are customized for specific applications. Their geometry
may be horizontal or vertical cylinders, or boxlike with fiat sides. Sputtering cham-
bers may have two of their dimensions similar to that of a comparable evaporation
unit, but the third dimension corresponding to the target to substrate dimension
may be much smaller.
Generally, one does not build a production coating chamber to handle both
evaporative processes and sputtering at the same time. The reason for this is that
the geometry of the two techniques is not very compatible.
Nonvacuum processes (see section 2.1.4.) use tanks or vats that correspond
to the size of substrate being coated. The capital cost for this equipment is far less
than that of comparably sized vacuum systems.
of time to pump out such a volume. The worst case is a chamber just large enough
to hold a part of a given size. Then, the pumping time to base vacuum is very
short; however, unless the chamber were well baked out prior to the start of dep-
osition, the outgasing from the walls and the substrate as the coating process heats
up the chamber may be quite severe.
The preceding remarks do not apply to continuous coating systems, either
evaporation or sputtering, where the coating chamber is not exposed to atmospheric
pressure over the course of days or longer.
Normalized Coating
Flux Density
Figure 2.5. Polar plots of three normalized distribution patterns of a vapor source. The
exponent of the cosine function is indicated on the plot. As the exponent increases, the
source becomes more directional, and a larger fraction of the material deposits on the
substrate. Conversely, the area at the substrate plane over which the uniformity is at a given
level decreases as the exponent increases.
Sometimes, the only practical way to coat certain geometries is with a sputtering
process, e.g., coating the inside of a glass tube with an infrared reflective coating
(Harding et aI., 1979). Sputtering targets, by virtue of the fact that they are solid,
can be arranged to coat in any direction: up, down, or sideways. This flexibility is
not usually found in evaporative systems as many of these sources contain molten
or granular material and are restricted to coating upward. This is not to say that
evaporation sources cannot be designed to coat in directions other than vertical,
but significant source design trade-offs have to be made to obtain this feature. With
sputtering targets, none of the drawbacks apply; therefore, sputtering in the down-
ward direction is as easy as sputtering in the upward direction. One reason that
downward sputtering is not practiced too commonly in high quality thin film man-
ufacturing is that arcs occasionally develop between the target and the plasma, the
substrate, or some other conductor or source of electrical charge. Though the
electronic power supplies are designed to deal with this and extinguish the arc very
quickly, there still may be a shower of fine particles resulting from the arc. If the
substrates are lying face up, they will then be contaminated and the coating degraded
by these particles.
DEPOSITION TECHNOLOGY 43
The addition of parts to a load usually will not change the cost of producing the
run, therefore, it is an incentive when large quantities have to be coated to spend
more resources on designing tooling that will maximize the load size.
Most part holders in coating systems that coat upward leave a small uncoated
area near the edge of the part. It is here that a small lip in the tooling actually
supports the substrate. The part of the substrate that is hidden does not get coated,
therefore it is desirable to make this zone as small as possible so that it does not
intrude into the active aperture of the optical element. There should be some means
of constraining the substrate from moving laterally in the tooling fixture to prevent
scratching of the front surface by the lip. The tolerance between the side of the
substrate and the holder must include provision for thermal expansion coefficient
differences between the tooling rack material and the substrate.
Substrates with a mass of several hundred kilograms have been coated in double
rotation systems. When the substrates become this large, then the tooling problem
becomes one for mechanical engineers. The vacuum tooling designer is faced with
a number of specialized problems. A major one centers on the tendency for two
similar metals to weld when they come in contact in a good vacuum and some
pressure is applied to them. This makes the design of bearings difficult. Lubricants
have to be selected carefully lest they contaminate the vacuum environment.
It is important to avoid deposits on surfaces that are not intended to be coated.
For example, some coating processes can deposit materials on surfaces that are not
in a line of sight to the source. This happens for a number of reasons, among which
are
1. The gas pressure during the coating process is relatively high and the
coating material is scattered around to the back of the substrate
2. There is decomposition of the source material to gases that diffuse to the
back of the part where they recombine and form a deposit
3. The source material may not stick well on the walls of the chamber, and
thus bounce off and eventually find its way back to the substrate
These unwanted coatings are typically soft, nondurable, and uncontrolled. They
must be avoided, especially if a surface that is susceptible to such coatings has any
value; e.g., it will be subsequently, or has already been, coated in another coating
operation.
systems, can easily cause the substrate temperature to rise. This leads to warpage
or outgasing.
A large number of different kinds of plastics are used as optical devices today.
In addition, many of the compositions of these plastics vary from one manufacturer
to another. Each supplier adds his own proprietary combinations of ingredients,
including volatile components such as plasticizers and fillers. The volatile com-
ponents can interfere with the coating process as they diffuse out of the plastic. It
can be expected that the properties of the plastic will also be different after the
coating process and the plastic has lost its volatile components. This limits the
number of materials that can be coated on plastics and the temperature at which
they are laid down. As a result, it is rare to find coatings that are as hard on plastic
substrates as they are on glass and other materials where the coating temperature
can be elevated to over lOOcC.
Although process heating during coating can have an effect on a substrate's optical
figure, stress is an even more significant parameter when the substrate is thin. This
section considers the sources of stress, and the effects of stress in the coating on
both the coating itself and on the substrate.
Stresses in a thin film can have several components. Intrinsic stresses develop
as the film is being formed. The growing crystal lattice is not perfect and stresses
develop as it relaxes. These stresses can be affected to some extent by the nucleation
sites available to the first few monolayers deposited, but after a few layers of atoms,
the film structure tends to some dominant crystallographic form independent of the
initial conditions. Intrinsic stresses are strong functions of the coating temperature,
coating rate, and other coating conditions. Note that no temperature change is
required to obtain intrinsic stresses. Postcoating annealing steps can sometimes
reduce the intrinsic stress in a coating.
A second major source of stress is due to the differences in the coefficient of
thermal expansion of the film and that of the substrate or adjacent layers. The stress
develops when the temperature changes from the deposition temperature. It is
difficult to avoid this type of stress when films are deposited at temperatures above
ambient. Even when films are deposited nominally at room temperature, some
heating of the substrate can occur during the deposition and condensation process.
Finally, temperature variations during use may lead to changes in the stress level.
The sign of the thermally induced stress can change from tensile to compressive,
or vice versa, as it is a function of the differences in the thermal expansion coef-
ficients of the film and substrate materials. For example, if the substrate expansion
coefficient is greater than that of a film that is compressively stressed at some given
temperature, there exists theoretically a higher temperature at which the stress in
the film becomes tensile.
Stress by itself is not necessarily bad as far as the films themselves are concerned
(warpage of the substrate is another matter altogether, however). For years, mag-
46 CHAPTER 2
nesium fluoride films, which have extremely high stress levels (see Table 2.2),
have been used very successfully in forming visible quarter wave thick antireflection
coatings on glass surfaces. The reason for this success is that the adhesion of the
film to the substrate is excellent and the substrates are strong in compression. As
a result, enough of the tensile stress in the film is transferred to a compressive
stress in the surface of the massive substrate that the cohesive strength of the film
is not exceeded. If a magnesium fluoride film is made thick enough, however, the
stresses in the film become high enough to overcome the film's cohesive strength.
A number of fine cracks forms to relieve the tensile stresses; a film with these fine
cracks is said to be crazed. This happens with magnesium fluoride at quarter wave
optical thicknesses greater than about I.S ~m, thus precluding its use as an infrared
coating material.
In some instances, a film's cohesive strength and its adhesive strength to a
substrate can be strong enough to exceed the cohesive strength of the bulk substrate
material. For example, the stresses in a tantala-silica stack on fused silica can be
made large enough so that as the film fails in tension, it tears off small particles
of the silica surface, leaving behind a rough, pitted surface.
The failure mechanism of films which are under compressive stress is delam-
ination of the film from the substructure. The adhesive strength of the film-substrate
bond is the dominant parameter in preventing failure of a film in compression; the
cohesive strength of the film is not a factor.
To first order, the contribution of a material to the total stress in a coating is
proportional to the product of the total thickness and the stress per unit thickness
of the material. Coatings that consist of stacks of periodically repeating assemblies
of layers (periods) have a total stress level proportional to the number of periods
and also to the net stress in a typical period. The net stress of a period depends on
the sum of the stresses (tensile and compressive) in the individual layers.
In a period with a pair of layers, one of which has tensile stress and the other,
compressive stress, there will be only one thickness ratio that will yield a net stress
of zero. The balancing of stresses is only one of the considerations a thin film
designer must take into account in arriving at a producible final design. Although
optical considerations may dictate a particular thickness ratio, stress considerations
may suggest a different ratio of material thicknesses.
The majority of dielectric materials have tensile stress when deposited as a
thin film in conventional processes (simple evaporation and sputtering). The stress
levels of these films have of late been altered by new techniques such as ion beam
bombardment of an evaporated film or ion beam sputtering (see Chap. 7). Fortu-
nately for the thin film engineer, some materials have compressive stresses also.
These materials can be used to compensate for tensile stresses in an adjacent layer.
A typical material pair that has a good net balance between stresses when both
layers have approximately equal optical thicknesses is ZnS and ThF4 (Ennos, 1966).
Another useful material with compressive stress is silicon dioxide. It is the lowest
index oxide material commonly used for durable coatings, and is used to compensate
for the tensile stresses found in the high index materials that are frequently used
in conjunction with it, such as titanium dioxide and zirconium dioxide. There seems
DEPOSITION TECHNOLOGY 47
to be no relation between the stress type (compressive or tensile) and the index of
refraction.
The cohesive and adhesive strengths of thin film materials are not well known
quantitatively. Apart from the difficulty of measuring these quantities for thin film
specimens, the values of these parameters can vary with time as moisture penetrates
the films and as the internal forces relax. Also, as previously mentioned, the internal
stresses and strengths are strong functions of deposition conditions. What is needed
is a complete study of this problem so that it can be reduced to a more firm
engineering practice.
Ennos (1966) took a first step in this direction by publishing a study he made
of in situ stresses. He observed the deflections of a thin substrate while various
films were being deposited in an evaporator. He was able to deduce the stress levels
in films of various materials from his data, and these are summarized in Table 2.2.
In a few instances, a coating with crazing is acceptable. The majority of these
cases involve optical systems that are only collecting energy and are not image-
forming systems. In an energy-collecting system, for example, the key requirement
is to gather energy, either reflected or transmitted and to deposit it on some receiver.
A coating that is crazed loses a small fraction of the incident energy to scattering,
but this lost energy is sometimes insignificant in the overall system performance,
especially when the benefits of the coating are taken into account. The total surface
area occupied by the cracks is very small in comparison to the total surface area
covered by the coating. Diffraction at the edges of the cracks leads to scattering.
An example of a coating in which the crazing is tolerable is in the energy conserving
coating applied to the fused silica envelopes of tungsten-halogen lamps (Rancourt
and Martin, 1986). The scattered light is still useful in lighting applications, and
the coating performs its task of reflecting the infrared radiation back onto the
filament. Other similar applications exist in solar energy collection systems.
Crazed films cannot be used in some designs at all; for example, they could
not be used in an antireflection (AR) coating. An AR coating is intended to reduce
Single Layers
Zns 675 +1800 +25,600 +1.77 x 106
Cryolite 1170 -250 -3,500 -2.41 x 107
ThOF 2 1090 -1600 -22,800 -1.57 x 106
PbF2 910 +51 +725 +5.00 x 106
MgF2 2500 -4500 -64,000 -4.43 x 106
Mu"ilayers
ZnS/Cryolite +900 + 12,800 +8.83 x 107
ZnSIThOF2 +100 +1,400 +9.66 x 106
PbF2/Cryolite -800 -11,400 -7.86 x 107
Note: Pos~ive values indicate compressive stress. Negative values indicate tensile stress.
From: Ennos, 1966
48 CHAPTER 2
the reflected light from a surface; a scattering coating will tend to do just the opposite
by increasing the amount of light coming from it.
Stress relaxation by deformation of the substrate occurs when the substrate is
thin enough or flexible enough to bend under the net force produced by the coating.
If the substrate is a thin polymer film, for example, this can make the substrate
curl to the point of rendering it useless. If the substrate is a solid, such as a thin
glass or silicon wafer, the warpage may lead to breakage, or if an optical element,
to unacceptable distortions. Assuming that the coating is thin with respect to the
substrate thickness, the deflection of a flat plate substrate with parallel surfaces can
be approximated by the following formula (GIang et al., 1965):
& = 3[(1- v)/E] (tit;) p2 (J"
where & = the deflection at a distance p, p = the distance from the center of a
circular disk, v = Poisson's ratio, E = Young's modulus, tf = thickness
of the film, ts = thickness of the substrate and, (J" = film stress with di-
mensions of force per unit length.
This formula can be used to estimate the stress in a coating by measuring the
deflection of a substrate of a known material, such as silicon or silicon dioxide.
Once the stress in a film is known, the deflection of other substrates can be estimated.
The sense of the curvature of a substrate can be used to determine whether a
coating has tensile or compressive stress as shown in Fig. 2.6. Stress failures are
easily classified as being caused by tensile or compressive stresses with a micro-
scopic examination of the coating (see section 5.4.7).
Cleaning is one of the most difficult problems in the manufacture of low reflectance
coatings, and it is a prime problem with other coating designs as well. One of the
reasons that cleaning is so difficult is that it is dependent on all of the prior history
of the part: at all stages of handling more dirt, grime, and organics get added to
the surface. If cleaning is not considered from the beginning of the fabrication of
Tensile Compressive
convex concave
Substrate
Concave Coating
Convex
Figure 2.6. Curvature induced by compressive and tensile coatings. if the substrate is thin
or flexible enough, the direction of bowing can be determined with the unaided eye. It is not
always easy. however, to determine which side is coated.
DEPOSITION TECHNOLOGY 49
solvent and then dragging the tissue over the surface of the part (Stowers and Patton,
1978).
2.5.4. Drying
In all cleaning processes where solvents or water are used as the cleaning fluid,
the most important step is likely to be the one where the remaining liquid is removed
from the surface after the cleaning process is complete. Unless the liquid is removed
before it can evaporate, stains known as water marks form where a pool of liquid
remained and evaporated. These cleaning-induced stains are most difficult to re-
move, and likely will not be removed by additional cleaning with the same technique
that put them there in the first place. A high pressure jet of a clean gas, such as
oil-free nitrogen or air, blows the fluid off the surface rapidly; this is a commonly
used technique. The use of a contacting method, such as wiping with a paper or
cloth towel, is not recommended in that the wiping process tends to move dirt from
one area to another.
A vapor degreaser is often used to dry parts. Figure 2.7 shows a schematic
diagram of the equipment used for this. The solvent in a closed (but not sealed)
container boils and fills the container with its vapors. The substrate to be dried is
placed in these vapors, which then condense on it as the substrate initially is cooler
than the boiling point of the solvent. The condensate gives the surface a final rinse
with a pure solvent that has just been distilled. Once the substrate has warmed to
the temperature of the vapors, no more condensation can occur, the part dries, and
DEPOSITION TECHNOLOGY 51
HOT PLATE
Figure 2.7. Vapor degreaser schematic. As cool parts are placed in the hot vapors, freshly
vaporized solvent condenses on the parts. This gives the parts a final rinse. The solvent
may be either an organic or a fluorinated hydrocarbon. If a flammable or toxic material is
used, provisions must be made for adequate venting of escaping vapors.
can then be removed. Solvents typically used are trichloroethane, fluorinated hy-
drocarbons, and alcohols. Naturally, some of these solvents are flammable, espe-
cially when hot, and/or toxic. Care must be exercised when using them. Adequate
ventilation is a must to prevent the accumulation of fumes.
of excited atoms and ions in the chamber. The gas frequently used to form the
discharge is oxygen because it will remove organic contaminants on the surface of
the substrate by oxidizing them. When substrates can be damaged by the oxygen
plasma, another gas, such as argon, is used. The argon atoms bombard the surface
and can remove some material in a manner analogous to sputtering, except that in
a glow discharge cleaning step the material removal process is much less efficient
than a sputter etch one. A glow discharge can heat a coating chamber (Maissel and
GIang, 1970, pp. 6-41; Macleod, 1969, p. 229). If extensive cleaning is done with
this technique, cooling periods may need to be included in the process, lest the
substrate overheat. The more heat sensitive are the substrates, the more care that
needs to be exercised in this type of cleaning process, because the heating can be
nonuniform.
The above-mentioned techniques are frequently used in combination with one
another. The choice depends on the initial cleanliness, on the ultimate cleanliness
required, and on the characteristics of the substrate material and finish. The sub-
strates remain clean for only a short while. For example, a glow discharge is typically
repeated if the coating process does not start within a few minutes (Cox and Hass,
1958). Guenther and Enssle (1986) report that a clean surface remains that way for
less than 3 hours, regardless of how well it is stored.
Chapter 3
53
54 CHAPTER 3
50~------------------------------------~
R1
40
Dielectric
CI)
u
C
...
n =2.35
...u
co 30 n =1.5 n =1.5
CI)
;:
CI)
Q: 20 R1 R2
~
10
•
Metal
n=2-2i
O+---------~--~~--~-----=~~
400 500 600 700
Wavelength (nm)
Figure 3.1. Reflectance (R 1) and reverse reflectance (R 2 ) for a metal film with a dielectric
film on it. The dielectric film (n = 2.35) thickness is a quarter wave at 400 nm, whereas the
metal layer (A == 2 - 2i) is 40 nm thick. The incident medium and substrate indices are
both equal to 1.5. The reflectance from the one side can be made much higher than that
from the other. The transmittance for this design is approximately 20 percent.
A filter is said to block when the transmission over a given spectral range is less
than a specified value (Fig. 3.2). Blocking can be obtained from the filter itself,
from the substrate, or from other filters. The transmission characteristics of the
substrate are frequently used to block wavelengths that are far removed from the
spectral zone of interest. It is more common to find materials that will block shorter
wavelengths while passing the longer ones. The electronic band structures of most
materials used in the visible portion of the spectrum have a forbidden energy band
gap that corresponds to a photon energy located in the near ultraviolet (UV) or
violet portion of the spectrum. Short wavelength light with an energy greater than
that of the band gap can cause electronic transitions across the gap. This results in
energy absorption of light with wavelengths shorter than this energy. Most solids
and liquids have this characteristic for some photon energy. Table 3.1 lists the gap
energy for several useful optical materials. Silicon and germanium are two semi-
conductor materials with forbidden gaps in the red or near infrared (IR); they can
block the visible portion of the spectrum while transmitting IR wavelengths (see
section 6.5. on material blocking properties for further details).
PERFORMANCE OF OPTICAL FILTERS 57
-
Q)
ta 10
U
II) (HL)10
C)
--o
Q)
1
-
C
ta
0.1
0.001
Similarly, some protective covers for silicon solar cells used in space have
cerium oxide doping to block wavelengths shorter than 350 nm. This keeps the UV
light from damaging the cement used to affix the cover to the cell. The absorbed
energy is converted into heat. In some cases, such as low-light level situations,
this absorption is not a concern. In other cases, such as the space satellite usage
just mentioned, the absorption increases the heat load on the satellite and can reduce
the efficiency of the cell and the overall spacecraft.
To get long wavelength blocking, the characteristic (restrahl) oscillation of the
crystal lattice can be used. In the mid- to far-infrared, the wavelengths excite
collective oscillations of the lattice atoms. The vibrations absorb energy from the
incident beam and make the substrate opaque to light of that wavelength. Table
3.2 lists representative data for the long wavelength edge of some common optical
materials.
The materials in a coating can also have absorption characteristics that are
useful for blocking purposes. The absorption edges of the various coating materials
are well established. One function of a thin film designer is to make judicious
choices in this regard.
The relatively fixed absorption characteristics of natural materials limits their
use as blocking filters. In some cases, the shape of the transition from transmitting
to blocking as available naturally is inappropriate for a particular application. To
58 CHAPTER 3
400
.
% total width = 400 Arcsin = -Arcsm (3.1)
'IT 'IT
where na and nb are the refractive indices of the two materials used in the quarter
wave stack, nr = nb1na, the vertical bars indicate the absolute value is to
be used, and Arcsin is the principal value in radians of the arcisine function,
i.e., 0 < Arcsin I x I < 'lT/2.
The behavior of this function is shown in Fig. 3.4. This is the maximum width
PERFORMANCE OF OPTICAL FILTERS 59
obtainable with the given index ratio. Table 3.3 lists the approximate values that
can be obtained with several common coating material pairs.
The spectral location of the stop band is a function of the optical thicknesses
of the individual layers that are periodically repeated in the stack. Finally, the level
of the reflectance achieved is detennined by the accuracy of the individual layer
thicknesses and by the number of periods used in the design. With all of the
parameters at hand, it is a relatively straightforward matter to design a filter that
will block over the range specified. The matter of building it may be entirely different
as, for example, the thicknesses may preclude its construction owing to stress and
other effects. It is at this point that the use of materials properties become critically
important. Frequently, it is possible to make a blocking tilter less expensively with
a combination of interference stacks and the use of absorbing materials, rather than
relying on dielectric stacks to do all of the blocking. Another advantage of absorptive
materials is that the eventual disposition of the energy is known precisely, and can
be accommodated accordingly. This is especially important in systems where a
large amount of energy is being blocked, such as sunlight or laser light, and the
light energy may wann the absorber and distort the system. If the energy were
reflected, it is possible that it may be focused on some nearby object that could be
damaged.
An auxiliary filter can block the light; the spectral perfonnance of this filter
overlaps that of the main filter, so that the pair (or more) of them limit the transmitted
60 CHAPTER 3
100
Design:
Stop
SUba (LH)10 AIR
3d Order
80 A.o=1.0)Jm
C»
..
u
C 60
ca
U Missing
C» 2d Order 1st Order
;:
C» 40
a:
?P.
20
O~----~--~~--~----~----~----~----i
0.25 0.75 1.0 1.25 1.50 1.75 2.00
Wavelength (pm)
Figure 3.3. Reflectance on a linear scale of the design in Fig. 3.2. The figure shows the
stop bands associated with the first and third order harmonics of the design. In this design,
the second order high reflectance band is suppressed. Note that the full width at the half
maximum point (FWHM) are not the same for the first and third orders. The ratio of width
to wavelength is constant, however.
light energy. A series of stop bands can be cascaded to provide the necessary
blocking width. In some instances, the energy blocked may extend from the far
ultraviolet to the radio spectrum. Once again, the auxiliary filter may consist of
either absorbing or nonabsorbing materials, or both. The auxiliary filter can be
placed on the second surface of the substrate that holds the primary filter. This is
commonly done, both for economic as well as for stress reasons.
Care must be exercised when two optical filters are placed in series to block light.
The blocking properties of the filters do not necessarily combine linearly. If there
is some reflection as well as transmission through them, the light that gets reflected
by the second filter can be reflected back by the first and contribute to the transmitted
intensity.
The total reflectance (R tot ) from a pair of parallel mirrors is
T:1S
Rtot = R\ + ------"-
l-R\R 2 (3.2)
PERFORMANCE OF OPTICAL FILTERS 61
where RJ is the reflectance of the first mirror, R2 is the reflectance from the second
mirror, and T) is the transmission through the first mirror.
This formula assumes that there is no absorption in the space between the two
mirrors, though the individual mirrors can have some absorption. If the mirrors do
not have any absorption, the total reflection can be expressed in terms of the
reflectances only:
5.0 .....- - - - - - - - - - - - - - - - - - - - - - - - - . ,
4.0
3.5
0
;: 3.0
III
a:
.c
GI
"tJ 2.5
.E
2.0
1.5
1.0i-----,----~--r_-~~-~--~--~--,_-__i
o 10 20 30 40 50 60 70 80 90
Percent Width of Stop Band
Figure 3.4. Plot of stop band width for a stack of layers, all of which have an optical
thickness of a quarter wave. The stack consists of alternating layers with high and low indices
of refraction. The ordinate of the plot is the ratio of the high index of refraction to the low
one.
62 CHAPTER 3
always less than unity, the error introduced by using only the numerator will always
be negative, i.e., the estimated transmission will be smaller than the actual value.
In Eq. 3.1, the location of two mirrors does make a difference. To maximize
the total reflection, the mirror with the higher reflection should be placed nearer to
the light source.
A technique that can be used with filters in series is to tilt each filter so that
no surface is parallel to any other reflecting surface. Light that is reflected from
one surface makes its way out of the cavity between the filters and it does not
contribute to the transmission. The tilt must not be so large as to introduce aberrations
in the optical system or to shift the performance of the interference filter, yet it
should be enough to avoid multiple reflections.
A pass band is the inverse of a stop band. In a bandpass filter, the transmission
is low everywhere except in a relatively narrow region called the pass band. High-
reflectance regions (rejection regions) exist on either side of the pass band. With
metallic reflectors, there may be some absorption. The classical Fabry-Perot type
of filter is one such example. A means of identifying the particular stop band is to
number them, starting with the one that occurs at the longest wavelength. The
number corresponds to the harmonics of the design, and is called the order.
The rejection regions on either side of the pass band are often narrower than
desired, and therefore, additional coatings are required to obtain the desired width.
A pass band can be considered as the region between two stop bands. The width
of the pass bands in the lower orders is rather wide, but as the order number
increases, the relative width decreases. This is the inverse of the situation of the
stop band in a quarter wave stack.
A wavenumber scale is commonly used to show the performance of some
filters over large spectral ranges. This scale is also common in infrared work, and
is frequently used by solid state physicists and others as it is a linear photon energy
scale. A common unit for this scale is reciprocal centimeters. The conversion factor
between micrometers and reciprocal centimeters is lQ4. Because the dimensions of
these two units are the reciprocal of each other, it is a matter of dividing into 10,000
the value one has to get the other. One way of visualizing the unit of reciprocal
centimeter is that it represents the number of vacuum wavelengths of light that can
fit into a distance of 1 cm. Table 3.4 lists some convenient points that relate the
wavelength and the wavenumber scales.
A wavelength scale emphasizes the infrared portion of the spectrum by stretch-
PERFORMANCE OF OPTICAL FILTERS 63
ing it with respect to the blue portion. The wavenumber presentation does the
opposite by squeezing the infrared and expanding the ultraviolet.
Figure 3.5 shows the performance on a wavelength number scale of the same
design as that used for Fig. 3.3. The periodicity of the performance of a quarter
wave stack on this scale is apparent in this illustration.
The blocking level of a filter is frequently shown on a logarithmic (base 10)
plot. The attenuation level of some of these filters can reduce the transmitted intensity
six orders of magnitude or more. A measure of the blocking level of a filter is
optical density or O.D. This unit is defined as
Optical Density = - 10g(T)
where T is the transmission of a filter expressed as a ratio (not %).
Two coherent waves, i.e., having the same frequency or wavelength, traveling in
opposite directions in the same region of space, generate standing waves. In a thin
film stack, the waves reflected at each interface are coherent with the incoming
wave, and therefore, standing waves are set up in the coating. In instances where
high-power lasers are incident on the coating, the existence of these fields can play
a vital role in determining whether the coating will survive the high-power levels
or not.
The absorption of energy in an electromagnetic field is proportional to the time
average of the square of the electric field, represented by (£2), times the product
of the index of refraction (n) and the absorption coefficient (k) at that point:
0.25 40,000
0.40 25,000
0.50 20,000
0.633 15,803
0.70 14,286
1.00 10,000
1.06 9,434
2.00 5,000
2.8 3,571
3.8 2,631
5.0 2,000
10.0 1,000
10.6 943
15.0 667
20.0 500
64 CHAPTER 3
Wavelength (Jim)
0.33 0.5 1.0
100
_ r - 3rd order
80 1 at order -I---
Q)
U
--
C
ca 60
u
-Q)
Q)
a:
?f.
40
20
o
W WwM
40,000 33,000 26,000 19,000 12,000 5,000
Wavenumber (cm- 1 )
Figure 3.5. Reflectance of a quarter wave stack plotted on a wavenumber scale. The
design is the same as that of Fig. 3.2, therefore this figure may be directly compared to Fig.
3.3.
A = C . n . k . (£2) (3.3)
where C is a proportionality constant.
Generally, one considers the value of k constant through the volume of a film,
but recent studies tend to indicate that the absorption is greater at interfaces than
it is in the "bulk" of the film (Donovan et aI., 1980). Consequently, more heat is
deposited at the film interfaces. This is just about the worst place to deposit this
energy as the interfaces are also the weakest part of the coating, thus are the most
likely to fail. It is preferable to reduce the fields at these interfaces. Figure 3.6
shows the standing wave field for light incident from both sides of an interface
with a quarter wave antireflection coating. The fields are sensitive to the direction
from which the light is incident.
The boundary conditions that apply to Maxwell's equations require that a node
or an approximation of one exist at a metallic high reflector/air interface. Figure
3.7 shows the standing wave in front of a silver reflector for both the IR and visible
wavelengths. Relatively little heat is deposited in the metallic mirror as the product
PERFORMANCE OF OPTICAL FILTERS 65
== R = 1.3%
Air n = 1.38 n = 1.52
T= 98.7%
Air
T= 95.7%
.. R =4.3%
Air
n =1.52
T= 95.7%
Air
Distance
Figure 3.6. Standing wave (E2) patterns for light incident from both sides of glass/air
interfaces with and without a quarter wave of magnesium fluoride antireflection coating. The
arrows associated with I, R, and T indicate the incident, reflected, and transmitted energy,
respectively.
of the field strength and nk is virtually zero everywhere. If the surface consists of
a metal, such as nickel, which is a relatively poor reflector in the visible, there is
significantly more penetration of the field into the metal surface, and the absorption
is higher (Fig. 3.7c).
In a high-reflectance dielectric mirror, the electric field within the coating has
maxima and minima, as shown in Fig. 3.8. The thin film structure gives us some
design flexibility to adjust the electric field profile to optimize the overall filter
66 CHAPTER 3
A=1.5%
Ag ClR)
1=100%
R=98.2% A =1.8%
Air Ag (Visible)
A =61.5%
1= 100%
Low
Reflectance
Air
Metal
R=38.5%
Distance
Figure 3.7. Plot of (E2) showing the near-node at silver/air (a,b) and nickel/air (c) interfaces.
The wavelengths in the two spectral regions have been scaled to facilitate the comparison.
Some of the electric field penetrates into the metals in the visible portion of the spectrum,
but in the IR, little of the field penetrates into the silver. The metal indices used were
nAg IR = (0.55,15), nAg Vis = (0.055,3.3), nNi vis = (2.0,2.0)
PERFORMANCE OF OPTICAL FILTERS 67
n:: 1.52
T::2.3'1\
Distance
Figure 3.S. Plot of (E2) for a OW stack. The wavelength of the incident light corresponds
to the stack center. The field peaks at the interfaces between layers. The amplitude of the
field decays rapidly as it penetrates into the stack.
perfonnance. If the absorption in one of the two materials in a quarter wave stack
is higher than the other, it is possible to minimize the field in the higher absorbing
material, though at the expense of raising the field in the other material. The result
of this is a higher reflecting stack (Carniglia and Apfel, 1980). Another use that
has been made of electric field studies is in the design of laser reflectors where
laser damage is of serious concern. The modification of the thickness of a few of
the outer layers of a quarter wave stack to reduce the peak field in the high index
material has been shown to improve the damage threshold (Apfel, 1977).
A classic example of the way the electric field is involved in an absorbing
design is the Fabry-Perot cavity filter that has a metal, such as aluminum or silver
for the reflector layers. At a reflectance resonance, i.e., the wavelength where peak
reflectance occurs, there are near nodes at the metal surfaces, and the absorption
is relatively low. Away from this resonance, there is a significant amount of ab-
sorption, even with silver films, and the electric field is relatively high in the metal
layers (Fig. 3.9).
The electric fields in dark mirrors (selective absorbers), which consist of
metal/dielectric layer combinations, peak in the absorbing metal layers to increase
the absorption of the incident light. This design technique is used in the so-called
trilayer designs of optical data disks to improve the sensitivity of optical data disks
and to control the reflectance (Bell and Spong, 1978). Figure 3.10 shows the standing
wave fields for the trilayer configuration, a thick layer of the absorber layer by
itself and a thick layer of the absorber material over a high reflector. The absorption
values given indicate the effect of the field on the sensitivity. In addition, the
amount of material required to obtain a given amount of absorption is reduced,
thus reducing the amount of material that needs to be heated to write a bit on the
disk.
The fields in antireflection coatings are relatively low by comparison to those
found in a high reflector design. Figure 3.6 shows the fields for a single layer AR
design, whereas Fig. 3.11 shows the fields present in a multilayer AR design of
68 CHAPTER 3
Dlatane'"
Figure 3.9. Plots of (E2) for a Fabry-Perot filter with silver reflectors at two wavelengths.
The transR'lission is at a peak at the first wavelength (}'1), while it is at a minimum at the
second wavelength (A2). The absorption is at a minimum when the reflection peaks because
the field in the metal layers is also at a minimum. The absorption at A1 is approximately 9
percent; at A2, it is 2 percent.
the quarter-half-quarter (QHQ) type. Here also, the minima and the maxima in the
electric field profile can be moved to accommodate specific requirements. In high-
power laser systems, it is desirable to reduce the absorbed energy to an absolute
minimum to maximize the damage threshold. This approach has been demonstrated
experimentally (Apfel, 1977; Demichelis et aI., 1984).
(a)
Te
=
A 28.9%
Ag A =5.1%
Distance
(b)
Te
A= 95%
1=100% (
... R=O%
Air
•
~,
~~ ...
(c)
Figure 3.10. The (E2) in optical data disk recording systems. The reflectance and absorption
is shown. In (a). the field is shown at an air/tellurium interface. In (b). the tellurium layer is
deposited over a silver mirror (bilayer). In (c). the trilayer design is seen to be the most
efficient as the maximum amount of energy is absorbed in the least amount of material.
into the summation of the partial reflected waves. This quantity decreases as the
angle increases. Thus, the perfonnance shifts toward the blue as the angle of
incidence increases because the apparent optical phase difference introduced by
each layer is decreasing.
In a bandpass filter, especially narrow ones, this effect can serve as a fine
tuning mechanism to position the pass band at a precise spectral value, if the filter
70 CHAPTER 3
T=100%
1:100%
Air
R=O% n= n= 1.52
1.65
Distance
Figure 3.11. Profile of (E2) for a QHQ antireflection design. In simple AR designs, the field
within the coating does not rise above that of the incident or exit beams, whichever is greater
(over the wavelength range in which they function as AR coatings).
is originally coated such that the pass band is at a wavelength that is longer than
the desired one. The degree of the shift is detennined by the average index of the
materials used to construct the filter. In a two-material, all dielectric Fabry-Perot
bandpass design, the angle shift is less when the higher index material is the half
wave thick spacer layer between the high-reflecting quarter wave stacks. Figure
3.12 shows the perfonnance of two designs with approximately equal perfonnance
100~----------~~~~~~~---------,
\
I \
75
I
,,
I \
\
\
\
,,
CD I \
U I \
-
C
u
co
CD
;;:
50 ,,,
\
,
\
,,
\
,
CD
a:::
, ,, I
\
~
25
, I
I
I ,
I
,,, I \
I
\
\
I \
o+---~~~~------~----------~----~
0.5 1.0 1.5
Wavelength (}1m)
Figure 3.12. Normal incidence reflectance of {Hl)4{lH)4 (solid line) and {lH)4{Hl)4 (dashed
line) as a function of wavelength (nH = 2.2, nL = 1.45). The difference in the performances
of the two designs is due 10 the effect of the index of the outer layer in each deSign.
PERFORMANCE OF OPTICAL FILTERS 71
at nonnal incidence (save for a proper AR treatment in the center of the pass band).
Figure 3. 13 shows the perfonnance of these same designs at a 50-degree angle of
incidence. The shift in center wavelength of the coating with the higher index in
the spacer layer is significantly less, especially relative to the width of the pass
band, than the one for the low index spacer. In addition, the shape of the pass band
stays more constant with the higher index spacer material.
The shape of the perfonnance curves of a coating at nonnonnal incidence may
look quite unlike that at nonnal incidence. Here, as in other situations in optics,
one must examine the perfonnance in the two planes of polarization separately. If
each plane of polarization is examined individually, then the angle effects become
much clearer. The theoretically calculated perfonnance of a quarter wave stack, as
shown in Fig. 3.14, illustrates this well. The stop band for s plane light is wider
than that at nonnal incidence, whereas that of the p plane ois narrower. This is
explained by the ratios' of the effective indices at nonnonnal angles of incidence
being larger for the s plane, whereas the opposite is true for the p plane.
For some incident angles, it is very difficult to design a coating because the
effective indices are all very similar, so that it is not possible to get a reasonably
large index ratio. The effective index varies less for the high index materials than
it does for the lower index values (see Fig. 1.11). A filter that has to operate over
a range of angles with minimum shift in perfonnance should be constructed with
the highest indices possible. The infrared region of the spectrum has a wider range
of available material indices (both high and low) than does the visible portion.
Thus, it is easier to design angle stable filters in the infrared portion of the spectrum
than it is for the visible portion, all other parameters being equal. At angles of
incidence near 90 degrees, the effective indices of the sand p components of all
materials tend toward zero and infinity, respectively. The reflectance, therefore,
approaches 100 percent at grazing incidence. It is difficult to fonnulate good per-
fonnance, wavelength sensitive high reflecting designs at high angles of incidence.
Antireflection coatings are especially difficult to design at high angles.
The effects of angle shift have been measured and reported in the literature
by Baker and Yen (1967). Figure 3.15 is taken from their paper; it shows a range
of wavelength shifts in percent as a function of the angle of incidence of collimated
radiation. These measured results agree with theory.
Water, temperature, and other environmental conditions can affect the perfonnance
of thin film filters. The sensitivity of a filter's perfonnance to these conditions is
difficult to specify in a general sense. The actual coating processes have a definite
influence on the details of the interaction between the coating perfonnance and the
environment to which the filter is exposed.
/
""..........
" " \ I
,,,"
80· I
I
\ I
I
I \ I
, I
~
I \
U I \ I
-
cCU 60
U
~
;:
I
~
I \
\
\
\
\
\
,
,,
I
I
I
~
a: 40 , ,,'
\
~
, ,,
, I
20
\
\ ,
, I
,,''
o+-------~------~--~~~~----~~----~
.75 .8'0 .8'5 .90 .9'5 1.00
Wavelength (}1m)
1001===========~=-------------====~
80 /
"
",,'
~-- .... ..... ,
",' /
//
"" .... --
I/ , I
/ \ I
I \ I
~ I \ I
-
U \ I
C 60 \ I
CU \ I
U
~
;:
\
,
\
I
I
I
, ,
~ 40 \
a:: \
\
I
~ I
\ I
\ I
20 \ I
\ I
\ I
\
\
\ I
, I
0
.75 .80 .85 .90 .95 1.00
Wavelength (}1m)
Figure 3.13. Reflectance at 50 degrees angle of incidence of the same designs as in Fig.
3.12: upper. Low index half wave spacer; lower. High index half wave spacer. Dashed curves
are for the p plane and solid curves are for the s plane polarization. Note the expanded
scale on the abscissa.
72
PERFORMANCE OF OPTICAL FILTERS 73
used in the filter as well as on the processing conditions. Gee and co-workers (1985)
have measured the change in performance of evaporated titanium dioxide and silicon
dioxide filters as they absorbed moisture from the ambient humidity. The general
nature of this effect is that the performance of many coatings can undergo a pro-
nounced change upon removal from the vacuum chamber and exposure to the
atmosphere. For example, the center wavelength of a design shifts to a longer
wavelength as the coating absorbs moisture. If the filter is subsequently dried either
by heating in a warm oven or by leaving it in a dry box for a longer period of time,
the performance shifts back toward the preexposure values; however, it will never
reach the original performance. Thus, there is an irreversible component in the
moisture shifting effect. Subsequent cycling of the filter between wet and dry
environments shows that there is also a reversible component of the moisture effect.
On the basis of this phenomenon, it is apparent that for the most demanding
applications, the measurement of a filter's performance should be made after the
filter has stabilized in an ambient environment that is similar to that in which it
will be expected to operate.
3.7.2. Temperature
Temperature can affect the performance of interference filters because both the
index of refraction and the thickness vary as a function of temperature. Baker and
Yen (1967) measured the actual temperature shifts in typical infrared filters. Figure
3.16 shows their results.
A temperature-induced shift can be especially significant when one is dealing
with a filter with a critical wavelength dependence. The center of a narrow wave-
length structure may shift by a large fraction of its width owing to changes in the
optical thickness of the layers in the coating. The optical thickness of each layer
varies with temperature as a result of (1) the change in index of refraction with
temperature (dn/dT) and (2) the linear coefficient of expansion (dlldT) that affects
the physical thickness.
The indices of refraction of most materials become smaller as the temperature
increases, i.e., dn/dT is negative. On the other hand, the expansion coefficients
dlldT are typically positive, and these lead to corresponding increases in the path
length. Thus, the change in optical thickness change with temperature is a second-
order effect. The result is that for most materials, the performance of a filter shifts
to longer wavelengths as the temperature is increased.
One solution to the problem of temperature shift is to enclose the filter in a
temperature-controlled oven. With this technique, the filter can be tuned over a
small spectral range. This technique is useful, for example, to select a specific line
from a spectrum. The oven approach, however, does leave something to be desired;
it is an active device and it consumes power. In addition, ovens can have a long
time constant, i. e., it cannot be varied rapidly.
An alternate solution of the temperature shift problem is to design the filter
so that it is temperature invariant. This is possible if a material is available whose
index of refraction varies in a way that is opposite to that of the other materials in
a design. If this shift is large enough, one can compensate for the temperature-
100~--------------------~------~----
I
I
__
I
=75
I
I,
M
9 0
O~----------------------~--------~
100~,~,----------------------------'-------------~
I I
I I
I I
I I
I
9 = 60 0
CI)
U
---
c
as
u
CI)
100,-~--------------------------~~----
CI)
a::
~ 9 = 45 0
100,---------------------------------------~
9 =0 0
O~~~~~~~~~~~~~--~
0.25
0.5 0.75 1.0
Wavelength ()1m)
74
PERFORMANCE OF OPTICAL FILTERS 75
induced changes in the refractive index and the thickness so that the overall design
is temperature stable.
Some infrared filters can be designed to be temperature insensitive. A material
that has appropriate dnlD and dl/D in the infrared portion of the spectrum is lead
telluride. Seeley and co-workers (1980) have developed this material and formulated
designs that put this effect to use. It is now possible to obtain filters commercially
that have an extremely small temperature coefficient. These filters have found use
in pollution measurement devices. The filters transmit a selected spectral line near
4 f.Lm, which is emitted by carbon monoxide. Unfortunately, no material has yet
been found that has the proper characteristics to allow the same technique to be
used in the visible portion of the spectrum.
3.7.3. Corrosion
Corrosion can occur in some coatings. In particular, metallic films, such as silver
and aluminum, are subject to degradation as they are attacked by environmental
agents. The films oxidize and lose their metallic properties. The indices of refraction
of oxides are radically different from those of the metallic precursors.
The behavior of metallic silver films is particularly notorious in this regard.
Some recent studies at the University of Arizona may be showing the way to tame
this very useful metal and make it more durable for thin film applications (Song et
al., 1985). Not so well known is the degradation of metallic aluminum film in high
humidity environments. Over a period of time, these films can convert completely
to their oxide. The presence of ultraviolet light greatly enhances the rate at which
this conversion takes place.
Moisture can also lead to the degradation of oxide films. If the oxide is soluble,
then the thin film can be dissolved by the ambient water, leading to a loss of the
filter. Tests are available that will verify that the filter should not fail in normal
use (see Chap. 5).
In most applications, a filter will not degrade the optical performance of the system
in which it is placed. In critical applications, however, the effect that the filter may
have on the wavefront which is passing through it or being reflected off it could
be significant and needs to be considered by the designer. Cases where such con-
ditions may apply are in diffraction-limited optical systems, such as precision camera
lenses or in laser systems that are used in interferometry.
When collimated light traverses a filter on a plane substrate, no aberration is
introduced into the wavefront. A coating may introduce a uniform phase shift into
the wavefront, however, and this may be significant in an optical system in which
phases are being compared. For example, a quarter wave thick film deposited on
a substrate introduces a 270-degree ( - 90°) phase shift to a transmitted beam at the
quarter wave wavelength relative to a bare substrate. When more complicated
designs are used, the result is correspondingly more complex. These phase shifts
are a function of the angle of incidence and the wavelength. The manufacturer of
a filter can supply a calculation of the phase shifts of a given design for use with
the user's modeling programs to calculate the overall system performance.
Both the previously mentioned angle shift (see section 3.6.) and the phase
shift can affect the performance of diffraction limited or interferometric quality
systems in which the lenses have steeply curved surfaces.
On steep surfaces, the thickness of the manufactured coating may vary from
the center to the edge because of process limitations. Careful masking can be used
to eliminate this run-off, if necessary. On the other hand, it should be noted that
even a uniformly thick coating may introduce wavefront distortions because of angle
6~-----------------------------------------'
--
~
CJ)
C
G)
G)
5
>
~
..'"
-..
CD
0
~
Si/SiO
-.--
0
0
Ge/ZnS
~
0
1
~
0
0° 30°
Angle of Incidence
Figure 3.15. Measured wavelength shift of interference filters as a function of the angle of
incidence (from Baker and Yen, 1967). The incident radiation is collimated. The filters were
infrared types. The upper limit corresponds to an index pair of approximately 3.45 and 1.9,
whereas the lower limit pair is approximately 4.0 and 2.2.
PERFORMANCE OF OPTICAL FILTERS 77
+3
+2
..
.....-
.c
+1
.. 0
U)
.c
m
c -1
->
CD
CD
as -2
~
~ -design temperature· =20° C
-3
liquid nitrogen
helium
-4
-5 ~r----~-------r------~------r----~------~------r----~
-250 -200 -150 -100 -50 o +50 +100 +150
effects. When using off the shelf coated optical elements in interferometry, the user
should pay attention to these details.
In fast and wide angle optical systems, where steep angles of incidence are
commonplace, the operation of a bandpass filter may not be what is anticipated,
based on normal angle of incidence measurements. Specifically, in a system with
a large spread of angles, the performance is the result of an average of all of the
angles incident on the filter. If the filter is especially narrow, this may result in a
significant reduction in the light throughput over what the same filter transmits in
a collimated beam at a normal incidence.
Chapter 4
Design Types
This chapter catalogs a number of common thin film design types. This list is
intended to be generic in nature to give the reader some idea as to the possibilities
that are available. It cannot be overemphasized that these are only generic designs,
and that they can be, and in most cases should be, adjusted and optimized by a
competent thin film designer for a particular problem. An almost infinite variety of
designs can be made by combining simpler design types. The reader who has an
interest in thin film design techniques is referred to a companion volume in this
series: Design of Optical Interference Coatings by A. Thelen.
The order of the following designs has no particular significance. The more
frequently used ones are listed first and the less commonly used ones follow.
Antireflection (AR) coatings were the first coatings to be produced by the thin film
technologist and are the most commonly used coatings today. Undoubtedly the
simplicity and ease of fabrication of a single layer contributed to the early successes
of optical thin films. As discussed in Chap. I, an AR coating for a glass surface
can be made with a single low index layer with an optical thickness of a quarter
wave. A number of materials can be used for this purpose, and they can be deposited
78
DESIGN TYPES 79
2.0r-------------------------------------------------~
Air
CD
=1.38
..
U n
C
II
n =2.10
~ 1.0 n =1.65
;:
CD
a: 77777777/
l/i.
n. =1.52
This data corresponds to the same variations in performance of the design shown in Fig. 4.1.
'A 'C' following the wavelength value indicates the complementary color is given.
DESIGN TYPES 81
low compared with the bare substrate value of 4.3 percent. If an isolated substrate
has some color in reflection, it mayor may not be apparent, depending on how the
gradation from one area to the other occurs. When adjacent panels with different
coating errors (colors) are compared, the differences may be quite noticeable and
unacceptable on the basis of cosmetics.
Generally, AR coatings are fabricated with nonabsorbing materials; as a result,
any reduction in the reflected light results in an increase in the transmitted energy.
It is also possible to reduce the reflectance with the use of absorbing films in the
design. The absorption reduces the transmitted light, but in some applications, the
reduction in the reflected light is more important than keeping the transmitted light
at a high level.
One application of an absorbing AR is the contrast enhancement filter used
on computer terminals with light emitting ("active") displays such as cathode ray
tube, plasma, and electroluminescent displays. (Absorbing AR designs are not useful
with liquid crystal or other "passive" displays because to function, these types of
displays depend on ambient light reaching them.)
Alternative techniques exist that reduce the reflected glare from surfaces, but
there is usually a reduction in optical performance associated with each of these.
For example, the surface of the display may be etched or frosted lightly; this
treatment destroys the specular reflection from the surface by scattering it in non-
specular directions. Although etching and frosting reduce the direct image problem,
it also reduces the sharpness of the screen image, and the dark areas are lighter
than they would otherwise be. In high-contrast, high-visual fidelity systems these
approaches can detract from the other system improvements (see Haisma et al.,
1985).
Given no constraints on indices of refraction, it is possible to design an AR
coating that has zero reflectance at all wavelengths. It is a matter of grading the
refractive index at the interface between the substrate and the other medium. In
other words, the index should vary continuously from that of the substrate to that
of the incident medium so that there is no discontinuity. The actual shape of the
index gradation function is not especially critical, though the thickness of the graded
region should be at least a quarter wave thick, and preferably of the order of a half
wave thick. Such an AR layer has indeed been realized in practice (Minot, 1976;
Yoldas and O'Keefe, 1979). The process begins with a glass, which consists of at
least two separate chemical phases. An etching process dissolves one phase, while
leaving the other untouched. As the etchant attacks a surface, the phase that is
attacked is completely removed near the surface, but as the removal process works
from the surface and proceeds inward, the percentage removed decreases as the
depth increases. The microstructure left behind at the surface is mostly air. Thus
the surface of the layer has an index close to unity, and the index increases with
depth. Because there is almost no discontinuity in the index function at the interface
so treated, the reflection is very close to zero and not a function of wavelength.
Unfortunately, the porous surface consists of many fine capillaries that can retain
liquid contaminants, such as oils from fingerprints, thus making the surface very
difficult to clean.
82 CHAPTER 4
n/ - nofl,]2
R = [ nf2 + noll, '
(4.1)
where nf is the index of the film, no is the index of the incident medium, and n,
is the index of the substrate.
In a film of magnesium fluoride, which has an index of approximately 1.38,
DESIGN TYPES 83
CD
+
• •
..
U
c:
III
U
CD
;:
CD
a:
/ /
\ /
\ / n,<nsub \
\ I/
'-.../ '-'
Wavenumber
Figure 4.2. Reflectance of single layer dielectric coatings with an index n, on a substrate
with an index nsub. The reflectance extrema occur at the points where the films are a multiple
of a quarter wave thick (marked with the respective fraction of a wavelength ),). Note that
the reflectance returns to exactly that of the substrate when the film is an even multiple of
a quarter wave, i.e., a multiple half wave.
deposited on glass with an index of 1.52, the reflectance is reduced from that of
bare glass, 4.26 percent, to 1.26 percent. Equation 3.1 is also applicable when the
index of the film is higher than the index of the substrate.
The minimum reflectance is exactly zero when the index of the film is the
geometric mean of the incident and substrate indices:
(4.2)
In the case of a glass with ns = 1.52, the optimum film index is approximately
1.23. No material exists in nature that satisfies this index requirement and is also
stable in a typical environment. The nearest index material that is durable is mag-
nesium fluoride. Other materials, such as cryolite and chiolite, have lower indices,
but they are to some extent water soluble, and films of these materials will not
survive in humid environments.
Equation 3.1 applies to all odd multiplies of quarter wave thick films.
10.0 . , - - - - - - - - - - - - - - - - - - - - - - - - - _
A: Air B:
t= 126nm n=1.38 t =73nm
7.5 t = 21nm n=2.00 t =116nm
'l7777/ 77777/
ns = 1.5
GI
U
..
c:
III
U 5.0
...
.!
CD
uncoated substrate In = 1.52)
IE:
lP. /
//
2.5 /
//SOlutlon B
/
/
, / /
O.O~---~---_,-~~--~--;'~~,_----_r------~
400 500 600 700
Wavelength (nm)
Figure 4.3. Reflectance of both V-coat solutions. The reflectance is zero at the minimum
for both designs. The shape of the relatively narrow low reflectance band gives this design
its name. The physical thicknesses of the layers in each design are shown in the figure.
for selected indices and a glass substrate are shown in Fig. 4.3, along with the
perfonnances. Occasionally, there will be a single degenerate solution; the thick-
nesses of the layers are both equal to a quarter wave optical thickness. It is not
always possible to come up with a solution for a two-layer design given two films
of arbitrary indices, nor is it always possible to find materials that have the optimum
indices.
The criterion used to select which of the two solutions is to be used is based
on stress considerations, all other things being equal. The difference in the thick-
nesses of the two solutions sometimes causes the stress level in one solution to be
much better balanced than the other solution.
These designs are useful in high-power laser applications. Because they have
few layers, they can have low stress. The materials that are used in the design can
be selected for their low absorption characteristics and high damage thresholds,
rather than their optical index of refraction as index in this type of design is not a
critical parameter.
For many applications, the width of the low reflection region is too narrow
and other types of designs need to be used.
DESIGN TYPES 85
Bare substrate
4
00 aHa
\ Air
n =1.38 n
Air
=1.38
"c
3
\ n= 1.70
;;»»»)
n= 2.40
..
u n=1.70
III
\ "-0= 550nm
;;;;;J;?
Ao
-
u =525nm
\
.!
II 2
II:
1P. \OHO
\
\
0
400
"
'-
500
Wavelength (nm)
600 700
Figure 4.4. The performance of quarter-quarter (00) and quarter-half-quarter (aHa) an-
tireflection coatings. The reflectance of an uncoated substrate is shown for reference. Note
the additional width that these designs have over the V-coat shown in Fig. 4.3.
86 CHAPTER 4
and evaluating these coatings. When one specifies a wide-band antireflection coating
for visual use, the designer should give consideration to the purity and the dominant
wavelength of the reflected light, as well as the reflected brightness.
High reflectance designs fall into three general classes: (1) metallic, (2) all dielectric,
and (3) enhanced metallic. Each of these is covered in tum.
50r---------------------------------------------·------~
40
Bare germanium surface
GI Air
..
Co)
C 30 n :1.46
ca
Co) n= 2.04
GI
;: n= 2.86
GI
£C Germanium
?F. 20 11.0 =3.5J1m
10
o
2 4 6 8 10
Wavelength (JIm)
Figure 4.5. Performance of a wide band infrared AR on the surface of a germanium
substrate. All layers are nominally a Quarter wave oplicalthickness in the center of the band.
Each surface of uncoated germanium has a reflectance of 36 percent, and a substantial
improvement in energy throughput is achieved by adding an AR coating to the surface.
as bleak as it may seem. Figure 4.6 shows the normal incidence standing wave
electric field at the surface of a metallic reflector with a thin overcoat. The node
at the surface limits the amount of energy absorbed in the overcoat. This is illustrated
in Fig. 4.7, which shows the infrared absorption of a free-standing fused silica
layer in air. Figure 4.8 shows the reflection of silver, both bare and overcoated
with a silicon dioxide overcoat, the thickness of which is the same as that in Fig.
4.7. The absorption added by the overcoat is the difference between the two curves
(note the expanded scale). The reflection over most of the spectrum is only slightly
affected by the presence of the coating.
The situation is much different at nonnormal incidence. Figure 4.9 shows the
reflectance at a 60-degree angle of incidence for both planes of polarization. It is
obvious that there is much reduced reflection especially in the 9- to 1O-~m region.
This corresponds to the reststrahlen reflection region of the overcoat material. In
this wavelength region is a resonance frequency: the molecules that make up the
crystal lattice undergo a collective oscillation that is driven by the electromagnetic
field. Thus, the lattice that makes up the film can absorb a significant amount of
the energy in the incident light beam if it is properly coupled into the film. The
electric field plots in Fig. 4.10 show the effect of the angle of incidence on the
standing waves. Although the pattern in the s plane resembles that at normal
incidence; the p plane pattern is rather different. The field in the overcoat is ex-
tremely high, and this leads to a very high absorption level. The vast majority of
the energy is deposited in this layer. That these theoretical plots represent the real
world has been confirmed with measurements made on actual mirrors.
For the overcoat on a metal mirror to be durable, it has to be one or more
Air
•
Distance •
Figure 4.6. E2 plot for overcoated silver in the center of the reststrahlen band (9.3 ....m).
Because there is a node at the surface of the metal, little energy is absorbed in the overcoat.
DESIGN TYPES 89
50 ,-----------------------------------------------.----~
40
•
o 30
Ii
i.
•C~
.a
20
1/1.
10
o ~----~----~----~----~----~~----r_----~----~
8 9 10 11 12
Wavelength (Jim)
Figure 4.7. Absorption of a free-standing silicon dioxide film. The absorption occurs in the
reststrahlen band and is significant when compared to a similar film used as an overcoat on
a high reflecting surface.
visible quarter waves in optical thickness. Thinner overcoats will provide propor-
tionately less protection. Thicker films may have stresses high enough to cause the
entire film system to fail by crazing. It should be noted that metal films do not
have the shear strength of dielectric films, and therefore metal films will fail at
stress levels much less than that which cause the failure of dielectric films. In
addition, the previously mentioned standing wave electric fields have antinodes
inside the protective layer. This enhances the absorption in those regions where
there is some absorption present in the protective overcoat, as discussed previously.
The protective overcoat, which may consist of only one layer, will reduce the
reflectance of the metallic surface if it is nearly a quarter wave thick, as shown in
Fig. 1.7. This problem may be minimized if the thickness is selected to be a quarter
wave at a wavelength remote from the region of interest. An example of this is the
design of Fig. 4.8, where the overcoat has a physical thickness that is only about
I percent of the nominal wavelength of 9 /-Lm. Another solution is to select a film
that is a half wave thick at the wavelength of interest, but once again both stress
and absorption have to be considered. A trade-off needs to be made between several
desiderata to arrive at the best solution.
Aluminum metal mirrors are common because they are relatively inexpensive,
90 CHAPTER 4
100 ,-------------------------------------------------~
Bare allYer
98
Ablorption due to coating
SIlYer with 0.1J1m
5102 oyercoat
II
U 96
..
C
III
U
II
;
II
II:
94
'lP-
92
90~-----.----~----~~----P_----~----_P----~----~
6 9 10 11 12
Wavelength (JIm)
Figure 4.8. Reflectance of a silver substrate with and without a silicon dioxide overcoat at
normal incidence as a function of wavelength. The reflectance scale is expanded. Note the
small amount of absorption as compared to the configuration used in Fig. 4.7.
and can be made with a minimum investment in coating equipment. This may
include a vacuum chamber, a heavy stranded tungsten filament wrapped with alu-
minum wire, and a low voltage AC or DC power source to supply a current to heat
the filament. Aluminum adheres well to glass, therefore, the film does not require
a preparatory adhesion layer as does gold, for instance.
The control of the thickness of aluminum films is important to get the optimum
specular reflectance from them. Overly thick aluminum films, on the order of 100
om or more, begin to scatter light because of surface roughness. This roughness
increases rapidly with thickness beyond this point. On the other hand, films that
are too thin will transmit light, and the reflectance will not be the highest possible.
The optimum reflecting aluminum mirror will just barely transmit light from a
strong incandescent light bulb as viewed with the naked eye.
An aluminum film oxidizes with time, starting immediately upon contact with
air. The oxidation continues, albeit at a reduced rate, for the entire life of the film.
In some situations, this oxidation can proceed at an accelerated rate, as when both
humidity and UV light are present simultaneously. The oxide film does have its
good points. It does slow down the oxidation rate as it gets thicker, and does serve
to protect the remaining metal film. Because aluminum oxide is transparent over a
DESIGN TYPES 91
very wide spectral range, it does not interfere with the metallic reflectance, at least
not in thin thicknesses.
Although aluminum reflectors have less reflectance than silver, they are very
useful because they are good ultraviolet reflectors, whereas silver is quite poor. On
the other hand, there is a dip to 86 percent in the reflectance of aluminum in the
near infrared at about 825 nm. Furthermore, the average reflectance of aluminum
in the visible portion is around 92 percent, as compared with silver's 98 percent.
Thus, when there are many reflecting surfaces in a system, it is obvious that there
are going to be significant light losses if 92 percent reflectance is all that is available:
5 surfaces will reduce the available light by almost 34 to 66 percent. If these 5
surfaces had a fresh silver coating with a 98 percent reflectance each, the combined
reflectance would be about 90 percent.
4.2.2. All Dielectric DeSigns
4.2.2.1. Nonsymmetric Stacks. The alternating high and low index stack of
layers, the optical thicknesses of which are all a quarter wave, is one of the oldest
multilayer designs. The performance of such an arrangement of layers is shown in
100~==============~r=~------~====================~
1"-__ / _-----
I--....... ,~\\ /~"'-----------------::::.-
S Plane----/"
-
I\,-r I
\,\ I"'
I '", ",/ /
75 \\ / I '--'
CI
U
-
C
III
u
CI
;:
CD
a:
50
\\} ,p
\\
,I \
, I
~
I
I
j4AVerag e
,
I
I
II
I
Plane
I ,
?P- I I
I ,
I I
I ,
25 I
I I
,
I ,
I ,
I I
I I
I I
I I
\/
O~------~~-------r--------r-------~--------~
11
7 8 9 10 12
Wavelength ()1m)
Figure 4.9. Reflectances of a silver substrate with a silicon dioxide overcoat on an opaque
silver substrate at a 50-degree angle of incidence. The reflectances for both planes of
polarization are shown along with their average.
92 CHAPTER 4
P plane
1:100%
Air Si02 Ag
S plane
~ ~ 4
1=100% ~
If
Distance
~
Figure 4.10. E2 at 60 degrees for both planes of polarization for a silicon dioxide overcoated
silver mirror. The wavelength and the thickness of the overcoat are the same as that of Fig.
4.6; the two figures can be used to compare the standing wave fields. The penetration of
the s plane field into the overcoat and the substrate is minimal, whereas in the p plane,
there is a great deal of interaction.
Fig. 3.3. There are several parameters that characterize such a design. The index
ratio of the high and low index materials is probably the most important one as its
value determines the width of the high reflection band, and, together with the
number of pair of layers in the design, determines the peak reflectance of the coating.
The width of the high reflectance band is given by Eq. 3.1. This high reflectance
DESIGN TYPES 93
band is sometimes referred to as the stop band. This terminology derives from the
fact that the transmission is blocked (stopped) by the high reflection in this wave-
length band.
The definition of the edges of the stop band is generally given as those wave-
lengths for which the reflectance only increases (theoretically) as the number of
layers in the stack increases. This definition is very practical, in that it specifies
just how wide the design will be in the limit of an infinite number of layers. The
peaks and valleys between stop bands also have an envelope that does not depend
on the number of periods. Macleod (1969, Eq. 5.9) shows that the peak transmittance
at the center wavelength of a quarter wave stack (ns/(LH)p/no) in air is given by
R=
where p is the number of layer pairs, g is the ratio of the high index value to the
low one, and
nH is the index of the higher index material.
A conservative estimate of the number of layers required to attain at a minimum
a given level of transmission can be obtained by dropping the (niI1ns) factor from
this equation. The effect of this term is to increase the reflectance over that calculated
on the basis of the exact equation as the value of this term is greater than unity in
most practical situations. The result of this simplification is
R=
The plot of this function is shown in Fig. 4.11. The importance of the index ratio
is readily apparent by the rapid increase in the reflectance with a relatively small
increase in index ratio.
The reflectance of a quarter wave stack is frequently shown plotted against a
wavenumber or a normalized inverse wavelength abscissa. A typical plot of this
type is shown in Fig. 3.5. The advantage of this type of presentation is readily
apparent: the periodicity of the stop band patterns are very evident and predictable,
therefore, only one order needs to be plotted, and all of the other orders can be
calculated from that one. It should be noted that dispersion in the index and the
absorption coefficient has been ignored in these theoretical calculations. These
parameters can result in significant deviations between the calculated performance
and that obtained in a real coating.
Theoretically, the number of stop bands in a quarter wave design is infinite.
An order number is associated with each stop band. The order of the stop band
that occurs at the longest wavelength, i.e., where all of the layers are a single
quarter wave thick, is 1. Note that there are no stop bands at wavelengths longer
than the wavelength at which the stack layers are a quarter wave.
94 CHAPTER 4
1.0
10- 1
'i
ii
u 10- 2
rn
aI
0
..I
CD 10- 3
..E
U
C
II
III
C 10- 4
II
~
I-
10- 5
10-6i-----------~------------~----------~----------~
1.0 1.5 2.0 2.5 3.0
Index Ratio
Figure 4.11. Approximate maximum transmittance as a function of index ratio at the stack
center wavelength for a stack with quarter wave thick layers. The substrate and incident
medium indices are both 1.0. The numbers next to the curves indicate the number of pairs
of layers in the stack.
A stop band can exist wherever the total optical thickness of a period is equal
to a half wave. Whether it actually exists or not depends on the individual layer
thicknesses in the period. At those wavelengths where the layer thicknesses are all
an integral multiple of a half wave, the entire stack is absentee. At the wavelength
that corresponds to the second order of a quarter wave stack, all of the layers are
a half wave thick. Consequently, no stop band exists at the second order location
for this type of stack. The same is true for all even orders for this type of design;
only the odd orders actually have stop bands. Note that in the plot of the theoretical
performance (Fig. 3.5), only the stop bands with odd order numbers exist.
For a given basic stack period, the width of the stop band is constant on a
wavenumber scale. The width does not depend on the order number. The percent
width decreases as the order increases. On the other hand, on a wavelength scale,
both the width and the percent width decrease as the order increases.
It is straightforward to design stacks that skip any given order, such as skipping
every third one. To do this, one replaces the basic HL period with one that has a
different proportion of one material to another; e.g., a stack with a basic period of
HLH will have the first and second order high reflectance bands present, but every
third stop band will be missing. In practice, because of dispersion that occurs in
most materials, only one order can be made exactly absent by ascertaining that the
DESIGN TYPES 95
optical thicknesses are exactly correct at that one wavelength. At other wavelengths,
the match will not be exactly right, and the order will be more or less evident.
When a basic period other than the simple HL type is used, the peak reflectance
will not be as high as that of the basic HL design, given the same number of periods
and the same kind and amount of coating material.
Thelen (1963, 1973) has published papers indicating how one goes about
designing a filter that has a number of orders suppressed. The reader who is interested
in this type of design is referred to these papers and to the companion volume by
Thelen (1987).
100TA~i\-----r~----------------------------====~
75
L
"0=1.0 ( i H 2L)5 "5=1.0
"-0 = 2.0Jlm
II
..g
U
C
IV
50
;:
II
II:
~
25
O~~~~~~--~~---T------~~~~~----~----~
0.2~ 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Wavelength (Jim)
Figure 4.12. Theoretical reflectance of a (U2 H U2)5 stack on a wavelength scale. There
are no other high reflection bands at wavelengths longer than that of the first order. The
pattern of high reflectance bands repeats as the wavelength decreases.
The dispersion in the indices of refraction of the materials used in a stack can
disrupt the regularity of the stop bands and the high transmission bands. In addition,
a change in the index of refraction can lead to a mismatch in the optical thickness
of some layers. Normally, the thicknesses of the layers of a quarter wave stack are
adjusted so that they are all matched in optical thickness at some wavelength.
Dispersion in the index of refraction can make orders appear where otherwise they
should be suppressed as the layers are not all a quarter optical thickness at wave-
lengths other than the match wavelength.
Orders can be suppressed in symmetric designs in the same way they are in
the previously discussed non symmetric ones. Figure 4.15 shows a design where
the third harmonic has been suppressed, whereas the second harmonic has a high
reflection stop band.
DESIGN TYPES 97
wavelength at which the highest reflectance is desired. Figure 4.16 shows the
performance of a design that enhances the reflectance of aluminum in the visible.
The first layer's optical thickness is slightly less than a quarter wave to account for
the phase shift that occurs at the metallic interface.
A trade-off is necessary in as much as the higher reflectance in this type of
design is obtained at the price of bandwidth. At wavelengths outside the stack's
high reflectance band, the reflectance of the combination of metal and coating is
less than that of the bare metal. The electric field profile in such a design is
interesting. Figure 4. 17 shows such a calculation, and it is seen that the electric
field does not reach down to the metal with any significant amplitude, thus indicating
that the resulting mirror will have little absorption. At wavelengths away from the
dielectric stack center, the situation is rather different. Figure 4.18 shows the electric
field at the minimum of the reflectance curve in Fig. 4.16. It is obvious that at this
wavelength much of the field penetrates down to the metal, and that absorption is
enhanced over that which would take place for the bare metal. Some filters are
Wavelength (}1m)
75
CD
U
..
C
III
U
CD
;: 50
CII
II::
bI?
25
o
40,000
~A 30,000
AI
20,000
lA
10,000
~
o
Wavenumber (cm- 1 )
Figure 4.13. Theoretical reflectance presented on a wavenumber scale of the same (U2
H U2)5 stack shown in Fig. 4.12. Notice that with this representation the stops bands produce
a periodic pattern.
98 CHAPTER 4
Wavelength (JIm)
0.25 0.5 1.0 2.0
100
(~H ~)5
75
nL = 1.35
II
..
U nH= 2.50
C
III
U 50
...
.!!
II
a:
~
25
(~ H~)
o~-L~~~~--~--~~~----~----~~~--~--~~
40,000 35,000 30,000 25,000 20,000 15,000 10,000 5,000
Wavenumber (cm- 1)
Figure 4.14. Reflectance of 1- and 5-period symmetric stacks on a wavenumber scale.
Both the incident medium and the substrate have an index of 1.0. When the number of
periods in a symmetric design is low, the peak reflectance does not occur in the center of
the stop band.
optimized for this feature and are called induced absorbers; they are discussed in
further detail in section 4.6.1.
The advantage of this type of high reflector design is in its economy of layers.
Because a full quarter wave stack does not have to be built up to obtain high
reflectance, the resulting mirror will generally be less costly. As the enhanced metal
design requires fewer layers and total coating material than an equivalently reflecting
design built up only with a stack of quarter-wave thick dielectric layers, the amount
of scatter in the coating can be less. In practice we can, therefore, obtain a higher
absolute level of reflectance from one of these designs. Because most computer
programs that calculate thin film performance do not include scattering in their
mathematical model, this aspect does not show up in theoretical plots.
In addition to the reduced width of the high reflection band, the other consid-
eration that needs to be evaluated is the environmental durability of the coating. In
general, a metallic coating will not be as durable as one with equivalent reflectance
built up of all oxide materials. Thus, if the coating is going to be exposed to a
DESIGN TYPES 99
harsh environment, such as salt fog or high humidity, then perhaps the all dielectric
design would be the preferable choice.
The reduction in the high reflectance zone can be overcome by adding stacks
to the design. The center wavelength of these additional stacks can be located to
optimize the reflection over a broad range of wavelengths.
If absorption and scatter are left out of the computer model, any arbitrarily
high value of reflectance can be obtained. Carniglia and Apfel (1980) have shown
how to maximize the reflectance of a dielectric quarter wave stack when one of the
materials has more absorption than the other.
Edge filters are similar to the symmetric period high reflector designs introduced
in the previous section. The region of interest in this case is the edge of the pass
band, rather than the peak reflection and the width of the stop band. In this type
Wavelength (}1m)
0.25 0.5 1.0 2.0
100
75 -
CD
..
U
C
III
u
.! 50
Missing third order
stop band
....
GI
a:
~
l
25
WJiI
o W//
.
40,000 35,000 30,000 25,000 20,000 15,000 10,000 5,000
Wavenumber (cm- 1)
Figure 4.15. Reflectance of a suppressed third order design. Every third order is sup-
pressed in this design, the basic period of which is (L H L). The multiple reflection peaks
between the highly reflecting stop bands can be effectively reduced to allow good trans-
mission between a pair of stop bands.
100 CHAPTER 4
'OO1:============~~------------------------'
95
Bare AI
II
U 90
c
:!u
.!!
"i
II:
85 AI ~ L' H(LH)2 Air
IF dL.H =450nm OWOT
d~ = 350nm OWOT
"L =1.45
80 nH =2.35
75+-------.-----~------~------~------~----~
400 500 800 700
Wavelength (nm)
Figure 4.16. Theoretical reflectance of bare and enhanced AI reflectors. Note that the
ordinate is an expanded scale. Although a higher reflectance can be obtained in one part
of the spectrum with enhancing layers, other portions of the spectrum have a reduced
reflectance.
AI
Substrate
Distance
•
Figure 4.17. Plot of the time average of the electric field in an enhanced mirror. The field
is very close to zero at the metal interface. The wavelength corresponds to that where the
reflectance reaches a peak in Fig. 4.16. The indices of refraction are nL == 1.45 and n" ==
2.35.
DESIGN TYPES 101
Air H L H L H L AI
Substrate
Figure 4.18. E2 for an enhanced AI reflector at the wavelength corresponding to the first
reflectance minimum point. The scales of this plot are the same as that of Fig. 4.17. Note
the relatively large amplitude of the field in the absorbing substrate, which leads to the
enhanced absorption of almost 25 percent. At this wavelength, the coating tends to act as
an absorption inducing or antireflection design.
of filter, it is generally desired that (1) the transition from reflecting (stop band) to
transmitting (pass band) be as sharp as possible and (2) the transmission zone be
as close to 100 percent as possible. Figure 4.19 shows an expanded view of an
edge filter. The basic design in this filter is the same as in the previously mentioned
symmetric high reflector, except that some additiona11ayers may be added to reduce
the reflection losses in the transmitting region. These additional layers can be
designed using antireflection concepts as the high reflector stack can be represented
by real Herpin equivalent indices and thicknesses in this region.
A nomenclature problem sometimes exists with edge filters. The use of terms,
such as short pass and long pass, are to be avoided as they can mean different
things to different people, depending on their background. On the other hand, the
use of terms, such as short wave pass or long wave pass, leaves no room for
ambiguity.
Another terminology exists with these filters. A hot or heat mirror is one that
102 CHAPTER 4
100~--------------------------------------~==__- - - ,
75
.,
U
...,
C
IV
u
50
.,
;;
a::
~
25
reflects the infrared and transmits visible light well. Conversely, a cold mirror
reflects visible light and transmits infrared heat. In this latter case, the reflected
light is cold, i.e., it contains relatively little infrared energy.
There is one major distinction between short wave and long wave pass edge
filters. The long wave pass filter that has been designed at the edge of the first
order stop band has no stop bands appearing in the pass band (at wavelengths longer
than the edge). There is no limit to how far the pass band extends in this case.
Dispersion in the real coating materials generally limits the range over which the
coating will be useful. On the other hand, the short wave pass filter has a pass band
constrained by a higher order stop band. Some of these can be suppressed to widen
the pass band (see Thelen, 1963, 1973).
Edge filters are generally made from all dielectric materials, and therefore,
exhibit the typical angle shift described in section 3.6. The shift is dependent on
the average index of the materials that make up the design. As a result of the higher
index materials available in the infrared portion of the spectrum, infrared filters
tend to shift less than equivalent filters for the visible portion of the spectrum,
where available indices are much lower.
In addition to the shift in the performance of a filter as a function of the angle
of incidence, another effect on the performance is introduced by polarization.
Because the width of the stop bands are different for each of the two planes of
DESIGN TYPES 103
Bandpass filters allow only a relatively narrow portion of the spectrum to pass
through them, while blocking other portions, either by reflection or by absorption.
Edge filters can be considered bandpass filters of sorts, but generally this terminology
is reserved for filters with transmission bands that are narrower than 5 to 10 percent
of the central pass band wavelength.
The following discussion of these filters is organized along the lines of their
construction, and a given width of pass band may be obtained with more than one
design. Other considerations, therefore, have to be used to determine which filter
is best for a given application. Bandpass filters come in nonabsorbing and absorbing
versions. In either case, it is important for the user to know just how much trans-
mission can be expected from a typical production filter. Even though a filter is
fabricated entirely with dielectric materials, this does not mean that it will have
100 percent transmission. In narrow bandpass filters on the order of 0.25 to 0.5 of
a percent in width, the peak transmission can be well under 50 percent.
surface). If the substrate is thin and stresses are a problem, this approach may result
in a warped substrate, and the prudent approach is to coat the two-edge filters on
opposite sides of the same substrate.
A bandpass filter made of two edge filters has the highest transmission char-
acteristics because the two halves of the filter can be designed independently to
have good transmission. Transmission values of close to 100 percent can be ex-
pected. On the other hand, the width of the filter cannot be made very narrow.
where
The reflectance of the two cavity mirrors, Rf , is assumed to be equal; the trans-
mission through these mirrors is represented by Tf . The peak transmission through
the etalon is
TmaJ<. =
Tf )2
( 1 - R
f
A final parameter that is useful with this type of filter is the finesse, which is the
ratio of the separation between the peaks to the width of the pass band. This is
given by
F=--.
1TW
2
A more complete discussion of Fabry-Perot filters is given in Chap. 16 of Stone
(1963) and Chap. 7 of Born and Wolf (1970).
DESIGN TYPES 105
Substrate: n= 1.52
'The performance is shown in Fig. 4.20.
100~--------------------------------------------------,
f.....-T I
I,
I, I
75 I , I
I , I
I , I
I , I
, I I
II
()
I I I
I I
-
C ,
III I
I ,
()
41 50 I
/
;:
I
41
a: , \\ l I
I
If< I I I
I
I
,
,
/
I
, ,,/
/
25 I
I \
\
, I
I
/
'---'"
I \ /
I
/ '--"'"
"
o~------~-------r------~------~------~--------f
400
500
600
700
Wavelength (nm)
Figure 4.20. Theoretical reflectance and transmission of a metallic Fabry-Perot cavity filter
as a function of wavelength. The peaks do not correspond exactly with the optical thickness
of the spacer layer because of the effect of phase shifts that occur at the spacer/metal
interface.
106 CHAPTER 4
20,-----------------------------------------------~
15
.,
U
...c:
II
0.
~ 10
0
I)
.a
<
iI-
o~------~------~------_,------~~----~~----~
400. 500 600 700
Wavelength (nm)
Figure 4.21. Absorption of a Fabry-Perot filter as a function of wavelength. The design is
the same as that used in Fig. 4.20. The absorption takes place at those wavelengths where
the transmission is high as it is at these wavelengths that the electric fields penetrate into
the coating to the absorbing (metallic) layers.
a mirror in one cavity and a mirror in the other cavity. This can be easily obtained
by introducing a slight tilt between the two etalons. If a pass band of one is chosen
to be at the same wavelength as the other, and they have different cavity spacings,
then many of the other hannonics do not coincide and are blocked by one filter or
the other.
The shape of a Fabry-Perot pass band has a roughly triangular shape; the exact
shape for normal incidence is given by the Airy formula:
Trnax
T = ---"--- 2
+ '" sin E'
where
nd
E=<I>+-
A.o ,
<I> is the phase shift upon reflection from the metal mirror surface, d is the mirror
spacing, n is the index of the spacer medium, and A. o is the wavelength. The use
of thicker gaps only makes the width narrower without changing the overall shape
very much. As the width is narrowed, the peak transmittance decreases also.
Silver is the only practical metal to use to make Fabry-Perot etalons for use
in the visible portion of the spectrum. All other commonly used metallic thin films
DESIGN TYPES 107
have too much absorption. In the infrared, gold and a few other metals can be used.
All of the metals that make good, low loss reflectors are delicate and easily damaged.
This mirror problem, coupled with the alignment sensitivity problem, make air
spaced Fabry-Perot filters with metal mirrors useful in only a few special appli-
cations.
To circumvent the problems that one encounters with metal mirrors, all dielec-
tric mirror coatings have been developed to replace the thin film metal coatings.
Several benefits arise from this: (1) higher reflectivities can be achieved; (2) etalons
can be made that can operate in spectral regions where there are no good metal
film reflectors, such as in the near UV; and (3) the dielectric films are much more
durable than the metal ones and can be cleaned without damage. Of course, the
same limitations that were described in the section on the bandwidth of dielectric
mirrors apply here also. If a wide band of wavelengths is to be covered, then several
stacks are required to get the reflectance to a high value over the entire band.
A problem common to all real etalons, whether they use metal or dielectric
mirrors, is dispersion in the optical constants. Over a small portion of the spectrum
the wavelength is proportional to the space between the reflectors. As the dispersion
in the materials and designs vary, different phase shifts are introduced at different
wavelengths, so that the wavelength that fits exactly in the cavity (resonance) is a
function of the phase shift as well as the mirror spacing. Typically, the only variable
that is considered when one uses a Fabry-Perot filter is the cavity spacing. In many
instances, this is adequate as they are used only over a small wavelength range. If
a large range is to be covered, then calibration of the wavelength versus spacing
function should be undertaken at known wavelengths over the entire spectral range
of interest.
30
25
~ 20
IL
i
UJ
~ 15
10
o 10 20 30 40 50 60 70 80 90
Angle of Incidence
Figure 4.22. Peak transmission wavelength shift (given as a percentage of the peak wave-
length at normal incidence) of a Fabry-Perot filter as a function of angle of incidence. The
shift is illustrated for a number of spacer layer indices. The index of the metal reflector layers
is (0.05. 3.0). The direction of the split of the peak positions for the two planes of polarization
depends on the index of the spacer layer and that of the reflector metal.
rise to unexpected effects. Thus, it is prudent, when one is using very narrow
bandpass filters, !o treat the system as if it were illuminated by a laser, and to use
precautions similar to what would be used to eliminate interference effects in such
a system.
4.4.3. Narrow-Band Dielectric Filters
Narrow-band dielectric filters resemble solid Fabry-Perot filters, however, the shape
of the pass band is much different. These filters have squarer tops to their trans-
mission band, thus allowing more energy in the pass band through the filter. Design
techniques allow the shape to be squarer still if three materials are used in con-
structing the filter. Figure 4.23 shows the performance of an infrared square band-
pass design; a comparable simple thin film Fabry-Perot filter is also included in
the illustration for comparison. This type of design is ideal for an application where
maximum energy in a band is to be transmitted and maximum rejection of energy
in an adjacent band is desired. This contrasts with the Fabry-Perot design that may
be a good choice for isolating an atomic emission line, for example, and where the
emission line shape is the dominant factor in determining the filter's performance.
The design of these square-topped filters generally consist of coupled Fa-
DESIGN TYPES 109
bry-Perot cavities, with 3, 5, or more cavities in a single filter. The cavities are
at least one, and frequently more than one, half wave thick. The remaining layers
are usually all a quarter wave thick at the center wavelength. By incorporating a
third material with an appropriate index into the design, the super square types of
filters can be achieved. The details of the methods used to arrive at these designs
is beyond the scope of this book (see Jacobs (1981) for more information).
Square bandpass filters are sensitive to the angle of incidence similar to all
other dielectric interference filters. The performance shifts to shorter wavelengths
as the angle of incidence increases from normal incidence. To minimize this effect,
the designer usually selects a high index of refraction material for the spacer layer,
as this is the layer that affects the shift the most.
Several parameters are required to describe the performance of narrow bandpass
filters. In addition to the transmission at some wavelength, it is common to specify
the width of the filter at specific transmission levels, such as the width at the 10
percent points, or the full width at half maximum (FWHM). Figure 4.24 shows
some common specifications.
The standing wave electric fields set up in these filters by the incident light
can become quite high. Figure 4.25 shows the standing wave fields for a three-
cavity filter. If there is some absorption in the layers with high electric fields, the
100 ~--------------------~__~__, - - - - - - - - - - - - - - - - - - - . ,
Square Band Paas
75
GI
U Fabry Perot
...
C
III
'E 50
•c
III
f::
,
,,,
~
\
\
25 \
I \
I
,/ " " ' ..........
, .... ",'"
------ "
... ...
-----
o +-----------~~------~~--------~~--------~
900 950 1000 1050 1100
Wavelength (nm)
Figure 4.23. Transmission of a square bandpass and a single cavity Fabry-Perot as a
function of wavelength. The design of the square bandpass filter is (LH)2 F (HL)4 (LH)4 F
(HL)2 and that of the Fabry-Perot is (HL)2 F (LH)2. The indices of the high and low layers
are 3.5 and 2.0, respectively.
110 CHAPTER 4
TpEAK
GI
U
..
C
III
'E
I/)
FWHM
.
c
III
t-
~~----------~'----4----~~----------~~A
Wavelength
Figure 4.24. Common specification points for a bandpass filter. Not all points are usually
specified. TAB is the blocking range on the short wavelength side of the pass band, whereas
Teo is that for the long wavelength side. The center wavelength, AO, can be specified on the
basis of an arithmetic average of points on the slopes of the filter. The result will be different
if the abscissa is a wavelength or a wavenumber scale. The width is typically given as the
full width at half of the maximum value (FWHM). The steepness of the slope can be specified
by the width at the 10 percent point (.1 A10%).
total filter absorption becomes quite large owing to the amplification of the ab-
sorption by the field (Eq. 3.2). This absorption reduces the peak transmission
significantly, as shown in Fig. 4.26, where the peak transmission is plotted against
the value of the absorption coefficient for the previously mentioned three-cavity
filter.
The high fields can be used to determine the absorption coefficient in low
index materials. A Fabry-Perot filter is coated and the material to be evaluated
serves as the spacer layer. By varying the spacer thickness and measuring the height
of the transmission peak, the absorption in the spacer layer can be determined (see
Southwell, 1982).
Because the performance of the filters is a result of thickness-sensitive spacer
layers, small changes to these layers can have a significant effect on the overall
performance. For example, if we assume that there will be a 2 percent error in
thickness in the coated spacer iayer, the pass band of the resulting filter can vary
greatly as shown in Fig. 4.27. If the spacer layer is prone to absorb water, which
in turn changes its optical thickness, then, at wavelengths near the pass band, the
transmission will be a function of the relative humidity (Gee et aI., 1985).
configuration to obtain a pass band that varies as a function of the incident beam's
position on the surface of the filter. Such filters have been fabricated in both linear
and circular geometries. The pass band generally has the shape of the classical
Fabry-Perot filter.
A linear version of this type of filter was outlined in a paper by Wirtenson
and Flint (1976). The structure of such a film is shown in Fig. 4.28. As the distance
from a reference edge increases, the thicknesses of the layers increase as well.
Thus, the center wavelength of the pass band varies with position without changing
its shape.
Another variation on the same theme is the circular variable filter (CVF). In
this geometry, the wavelength transmitted by the filter varies as a function of the
azimuthal angle through which the filter is rotated. Complex rotating fixtures allow
linear thickness variations as a function of filter azimuth angle (Apfel, 1965; lllsley
et al., 1969; Thelen, 1965). By proper gearing, the mask and the substrate rotate
at precise speed ratios with respect to each other. This enables the formation of a
well-defined wedge for the spacer layer. The transmission of such a CVF is shown
in Fig. 4.29. These can be made in visible or infrared versions and find uses as
1=100%
T= 100%
R= 0%
Distance.
Figure 4.25. The time average of the square of the electric field in a 2S-layer, 3-cavity
square bandpass filter at the center wavelength of the pass band. The spacer layers consist
of the low index material. The high fields in the spacer layers make the design very sensitive
to any absorption in these layers. The high index layers are shown hatched.
112 CHAPTER 4
75
II
..
Co)
C
CD
k =10- 2
E
III
50
C
...
CD
~
lJI.
25
Oi-----------~-=~------~--------~~----------~
900 950 1000 1050 1100
Wavelength (nm)
Figure 4.26. Transmission versus wavelength for the 3-cavity filter shown in Fig. 4.25. The
k values were introduced into the low index layers only.
75
"
U
C
11'1
....
~
E
0
50
.....
C
11'1
r.f.
25
o+-----------~~------~--------~~~--------~
900 950 1000 1050 1100
Wavelength (nm)
Figure 4.27. Effect on bandpass shape caused by thickness variations in the three half
wave layers. The design is the same as in Fig. 4.25. The standard deviation of the thickness
variations is 2 percent. The dashed curve shows the nominal performance.
no =1.5
ns =1.5
...
Azimuthal angle or poSition along wedge
Figure 4.28. Cross-section of a circular variable filter (CVF) or a linear variable filter. The
vertical scale is exaggerated for clarity. All layers have some degree of thickness gradation.
These filters are often cemented between two glass plates for durability.
113
114 CHAPTER 4
100
Angular Position
80 120 0
90 0 150 0
80 0 175 0
30 0
G)
..
U 50
C 60
ca
·S
CD
C
...ca
~
40
20
o
o
~
2.5
.
\J \./ \
3.0
.)
3.5
\.
. )
4.0
\)
4.5
\) \.
5.0
Wavelength (JIm)
Figure 4.29. Transmission versus wavelength plots for a CVF. The wavelength position of
the pass band depends on the azimuthal rotation or position along the wedge.
100 ,---------------------------~------------------_,
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600 625 650 675 700
Wavelength (nm)
Figure 4.30. Transmission of a phase conjugate filter as a function of wavelength. The
prescription for this design is given in Table 4.3.
- Standard Fabry-Perot
spr.ad 2.3nm 0.23%
f- Pha •• conjugate • pr •• d
1.4nm 0.14%
Nominal Nominal
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provides for orthogonal reflected and transmitted beams. Other angles can be used
as long as the coating is deSigned properly. Each design type is discussed separately
later.
4.5.1.1. Slab Beam Splitter. Because the surfaces and coatings of these
beam splitters are usually oriented such that the light is incident at nonnormal
angles, polarization parameters of the optical system need to be considered. Figure
4.33 shows the theoretical performance of a 45-degree beam splitter with equal
reflectance and transmittance at about 550 nm for the average of the two planes of
polarization. The coating could consist of a single layer of metal such as silver. At
this wavelength, however, the reflectance does not equal the transmittance for either
plane of polarization. The reflected and the transmitted beams in the p plane are
equal at about 455 nm, whereas the intensity of the reflected s plane beam is almost
2.5 times larger than the transmitted one at that wavelength. At 690 nm, the two
s plane beams are equal, whereas in the p plane, the transmitted component has
DESIGN TYPES 117
about 2.5 times the intensity of the reflected one. These unequal reflectances can
cause difficulties when a laser with a randomly polarized output is directed at such
a device. The beam splitter will convert the fluctuations in the plane of polarization
into intensity noise.
Beam splitters are generally polarizers, and therefore, need to be used with
care in an optical system. Multiple polarizing beam splitters in a system with no
other polarizers can lead to difficulties as the polarizing components are not explicitly
identified.
The coating used in beam splitters can be either a dielectric stack or a metal
layer. Most metal films can be used as beam splitter coatings, though some have
specific properties that are better than others. Figures 4.34 and 4.35 show the
performance of typical metal and dielectric designs, respectively. They both have
approximately the same (relatively low) reflectance at normal incidence at 500 nm.
The metal coating has the flatter curve, indicating that it will function well over a
'LJL--AR COltlng
$emltranlparant
Coating
AR COltinga
Semltranaparant COltlng
AR CoaUng
Cement
Semllranape,ent Coating
AA Coating_
Figure 4.32. Beam splitter configurations. The types shown in illustrations A and B can
produce orthogonal incident, transmitted, and reflected beams. Type C cannot produce
rectilinear beams because of refractive effects at the exit surface of the transmitted beam.
100
75
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Wavelength (pm)
100 r-----------------------------------------------------,
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Wavelength (pm)
Figure 4.33. Performance of a silver film slab beam splitter as a function of wavelength.
The transmittance (a) and reflectance (b) cannot be equal for the two planes of polarization
at the same wavelength. The angle of incidence is 45 degrees.
118
DESIGN TYPES 119
50
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s Plane 60·
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400 500 600 700
Wavelength (nm)
Figure 4.34. Reflectance of a chromium film slab beam splitter film on a glass substrate
as a function of wavelength for 0 and 60 degrees angle of incidence. No dispersion is included
in the calculation. Note that this design makes a very good polarizer.
50r-------------------------------------------------~
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Wavelength (nm)
Figure 4.35. Theoretical performance of a dielectric slab beam splitter as a function of
wavelength. Both layers in the design are a quarter wave thick at 500 nm.Note the substantial
variations in reflectance of the two planes of polarization as the wavelength varies.
is much more absorbing and consequently the value at which the reflected and the
transmitted intensities are equal is much lower than that in the previous design.
The average reflectance of the two planes of polarization is equal to the average
transmittance from normal incidence to about 70 degrees. Figure 4.37c shows the
absorptance of this beam splitter. A substantial amount of the incident energy is
lost in this beam splitter. If the beam splitter is turned around so that the incident
light passes through the substrate before encountering the metal layer, the absorp-
tance increases by 10 percent or more. In addition, the two beams will not have
equal intensities when used reversed. Thus, it is important to use these beam splitters
so that the light is incident on the metallic coating from the air side.
On occasion, the beam splitter coating is deposited on the hypotenuse of a
prism (see Fig. 4.32c). This geometry allows the light to strike the coating at any
arbitrary angle. When the coating is a metal, the reflectance and the transmittance
as a function of angle of incidence can have unexpected characteristics. Figure 4.38
shows the transmittance as a function of the angle of incidence. At the critical
angle, the transmitted intensity is reduced to zero, and no light can leave the prism
at angles greater than this angle. The intensity of the reflected beam is quite different,
as shown in Fig. 4.39. There is a range of angles between 50 and 60 degrees where
there is very high absorption of the p plane light. If the prism had no coating on
DESIGN TYPES 121
the hypotenuse, the reflectance for both planes of polarization would increase to
100 percent at the critical angle, and it would remain at that value for all larger
angles. Such components need to be used carefully.
4.5.1.2. Cube Beam Splitters. By their very nature, these beam splitters
are designed to function at a nominal angle of incidence. Many times, optical
systems require equal path lengths in both beams to minimize aberrations or other
differences between the two beams. This is especially true when the beams are
recombined in a second pass through the beam splitter. In those instances, a cube
beam splitter is the best solution.
The cube beam splitter is inherently rugged as the coating is not exposed to
the environment. The symmetry of the cube ensures that there can be no problem
with orientation of the incident light with respect to the beam splitter. The perfor-
mance of this type of beam splitter is very similar to that of a similar slab design.
Most of the comments that were made about the slab beam splitter also are
pertinent to the cube version. The same effects can be observed at high angles of
incidence as are seen with the slab, and the polarization effects are similar.
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122
DESIGN TYPES 123
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Angle of Incidence (Degrees)
Figure 4.36 (Continued)
100 r-------------------------------------------------~
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124
DESIGN TYPES 125
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to swamp a sensitive detector. Therefore, the coatings need to have very low scatter
in addition to all of the other requirements.
Typical diagnostic separation filters operate with an angle of incidence in the
range of 10 to 40 degrees. Consequently, polarization is a parameter that needs
careful attention. The incident light is often polarized as the conversion efficiency
of crystals is strongly dependent on the orientation of the polarization vector.
In third harmonic generation, diagnostic filters are typically used in pairs. This
makes the experimental setup more flexible and at the same time simplifies the
control of the phase retardance introduced by the mirrors. The phase retardance
must be controlled when ellipsometers and interferometers are a part of the diag-
nostic subsystem. The beam-directing mirrors and wavelength separating filters
should not modify or add a component to the polarization of the beam.
If a laser with a wavelength different than any of the harmonic wavelengths
is used to align the optical system, then there may be some requirements at that
wavelength also. The greatest challenge facing the fabricator of these filters is the
wide range of wavelengths of interest. Because thin film interference filters depend
on the matching of the optical thicknesses of the layers, dispersion in the refractive
index makes it difficult to match the thicknesses at several widely separated wave-
lengths. The lack of a good match reduces the rejection level available at wave-
lengths away from the one at which the optical thicknesses are matched.
126 CHAPTER 4
Critical anele
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with two thin film layers: one layer is an absorber, and the other, a dielectric. The
complex index of refraction of the absorbing layer can be any value. For a dielectric
substrate, the order of the two layers is straightforward: if the index of the dielectric
film is less than the geometric mean of the index of refraction of the incident
medium and that of the substrate, then the absorbing layer is located next to the
incident medium. Otherwise, the absorbing layer is placed next to the substrate.
The latter situation is obviously the more desirable as the metal layer is then protected
to a certain extent from environmental degradation. If the substrate is metallic, the
selection of the dielectric, and the derivation of the design, is more complicated.
These designs are akin to the exact solution one can obtain with the two-layer AR
V-coat. Figure 4.40 shows the reflections from two-layer dark mirrors, one using
a dielectric with an index greater than the square root of the substrate (the incident
medium has an index of unity), and one that is less; the same metal indices are
used for the metal layers in both cases.
Frequently, the need exists that a range of wavelengths be absorbed; this
requires the addition of more layers, usually in the form of added periods of
metal/dielectric pairs.
It is possible to combine designs to obtain certain special effects. For example,
10
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Wavelength (nm)
Figure 4.40. Reflectance as a function of wavelength for two-layer dark mirrors. When the
index of the dielectric layer is greater than the square root of the substrate, the metal is
placed next to the substrate, whereas the reverse is true when the index of the dielectric
layer is less than that of the substrate. The designs are given in the figure.
DESIGN TYPES 129
it is possible to combine a dark mirror with an edge filter; the reflectance is then
high where the edge filter reflects and very low where it transmits. The transition
between the reflecting and the absorbing regions can be very sharp, and can be
controlled quite precisely with the edge filter transition.
A good example of a use for an induced absorber is in optical data disk recording
media. In write once, read many times (nonerasable) disks, a pulse of heat generated
by a focused laser beam forms a hole or other perturbation in the surface of a
rotating disk. Because the light needs to be absorbed to generate heat, the recording
medium requires a metal or other absorber. Metals have the highest absorption
coefficient per unit thickness. This is an advantage in that only a small amount of
material needs to be heated, thus minimizing the input energy required to write a
data bit. Unfortunately, metal films tend to have a fairly high reflectance, and much
of the incident energy is reflected back toward the source, rather than being absorbed
to heat the recording material.
Bell and Spong (1978) described a recording medium that had a coating that
reflected only enough light to allow the focusing system to function. It consisted
of a metallic reflector, a spacer layer approximately one quarter wave thick, and a
thin absorber layer. The effect of this structure is to position the absorber near the
peak of the standing wave electric field so that the recording layer absorbs the
maximum amount of light possible. This is shown in Fig. 3.10. About 95 percent
of the absorbed energy is deposited in the recording layer, whereas the rest goes
into the reflector. This is a very efficient scheme for absorbing the energy and
depositing the heat in precisely the right location. In terms of the energy absorbed
per unit mass of absorber film, it is far superior to an earlier system in which a
single, relatively thick layer of the absorbing material was used as the recording
medium (Rancourt, 1981).
'O°r---~~----------I~F=-=-=--=-==~~~--~------~
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Wavelength 'I'm)
FIgure 4.41. Curve for solar absorptance and reflectance of ideal solar collector (from Hahn
and Seraph in, 1978).
100
80
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20 Single Surface
Reflection
0
400 800 1200 1800 2000 2400
W8velength (nm)
Figure 4.42. Measured reflectance and transmission of an ITO film on a glass substrate
in the visible and the near IR. The physical thickness of the film is approximately 325 nm.
the slope in the wavelength region where the material switches from transmitting
to reflecting, i.e., the 1- to 2-~m range.
The shape of the curve in Fig. 4.42 approaches the ideal one for solar thennal
uses. The conductive coating is used as a reflector to return the infrared radiation
back to a receiver, whereas the sunlight passes through the coating to heat the
receiver. Unfortunately, the position of the edge of this coating material is not quite
correct for the kinds of efficiency needed to make this design viable in solar thennal
energy applications. In addition, the infrared reflectance is not as high as might be
desired.
ITO has a high index of refraction when compared to glass. As a consequence,
the reflectance of a coated area appears quite reflective to an observer, as compared
with the bare glass where the ITO was removed. This is frequently objectionable,
and additional thin film layers are used to reduce the contrast in reflected light
between the two areas. These layers afford additional environmental protection to
the conducting films. Fortunately, the electrical conductivity through these overcoats
can be finite, and devices can function with the overcoat over the conducting films.
These dielectric coatings significantly affect the etching rate.
to a reflective state and the transmission of light through it is blocked. Such a switch
can be used to prevent damage to the optics behind the filter. When the light level
decreases and the filter cools, the filter reverts to its original state and transmits the
light once again. Such a scheme is at times superior to a shutter because there are
no moving parts involved.
Additional thin films can be used with the switching material to increase its
sensitivity, in the same way that the dark mirror structure is used to enhance the
sensitivity of the optical data disk recording mechanism (see section 4.6.1.).
100~--~--~--~~--~~----~--~~~--~~--~----~
0.2 0.3 0.4 0.6 0.8 1 2 3 4 8 8 10 20
Wavelength ()1m)
Figure 4.43. Spectral radiant exitance of a blackbody radiator. Curves are for temperatures
of 300K (near room temperature), 600K, 1000K, 3000K (incandescent lamp filament tem-
perature), and 6000K (approximate solar surface temperature).
by the electronics and other internal packages. Photovoltaic solar arrays are tem-
perature sensitive and need to be kept cool to keep their solar to electrical efficiency
as high as possible. For many years, thin fused silica (SiO z) or glass sheets have
been used to increase the emissivity of the silicon cells. The relatively high emis-
sivity of fused silica, as well as the fact that it does not darken under particle
irradiation, was responsible for its selection early in the space program for use in
solar cell covers.
A thennal control surface for temperature control of the body of a spacecraft
consists of a high reflector to reflect the solar radiation placed on the second (inner)
surface of a fused silica sheet. A dielectric reflectance-enhancing stack over a silver
layer is the choice reflector material because it keeps the solar absorptivity to a
minimum. The uncoated (outer) surface of the fused silica serves as the emitting
surface. This arrangement provides a surface from which the spacecraft thennal
energy may be radiated even when it is in direct sunlight.
The hemispherical emissivity of silica is approximately 0.82 at a temperature
of about 300K (Crabb, 1972; Jet Propulsion Laboratory, 1976). Note that it is
necessary to specify a temperature when specifying an emittance value, since the
nonnal emittance is defined as
DESIGN TYPES 137
100,---------------------____________________________ ~
Angle of incidence
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Wavelength (pm)
Figure 4.44. Reflectance of bare silica in the reststrahlen reflection region as a function
of wavelength. The performance has been plotted for a number of angles of incidence (shown
labeled in degrees). The reflectance increases monotonically with the angle of incidence at
all wavelengths.
138 CHAPTER 4
1001---------------------------------------------------~
75
Angle of incidence
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Wavelength <JIm)
Figure 4.45. Reflectance of silica coated with an emissivity enhancing coating. The per-
formance has been plotted for a number of angles of incidence (shown labeled in degrees).
Most of the curves of the coated substrate lie well below the corresponding curve for the
bare substrate (see Fig. 4.44).
Filter Performance
Measurements
Spectrophotometers are optical instruments that measure the intensity of light trans-
mitted or reflected by objects as a function of wavelength. They are available in a
variety of types and styles. Often, they are optimized for chemical studies, where
the photometric accuracy, i.e., the precision with which the intensity is measured,
is not necessarily critical. In many cases in optical filter work, however, there is
as much interest in the photometric accuracy of a measuring instrument as there is
in the wavelength accuracy.
The wavelength display of some spectrophotometers is calibrated in a scale
the units of which are actually the reciprocal of wavelength. A common unit for
139
140 CHAPTER 5
spectral ranges of interest in optics. In this case, it may be necessary to use ex-
trapolation or rely on the linearity of the gain outside of a range that can be checked.
On the other hand, as the extrapolation is over a small range if a known standard
with a high reflectance is used, the error introduced in the measurement will likely
be small.
The normalization of the performance value to 100 percent can present a
problem because it depends on a number of parameters that cannot be precisely
calibrated in a way similar to those used for wavelengths. In all spectrophotometers,
the output is the result of a ratio: the intensity of the light through the instrument
with the sample in place is divided by that of a calibration measurement. There are
two ways in which this is done by spectrophotometers in current use, and the
instruments can be classified accordingly: (1) single beam and (2) double beam.
introduced by the substrate (the beam can be vignetted by apertures before it reaches
the detector); and (3) in reflectance measurements where a reference reflector is
used, the uncertainty in knowing its precise reflectance value.
The typical commercially available spectrophotometers were designed prin-
cipally to measure transmission through a relatively small sample. To measure
reflection, attachments have to be added by the user. These attachments lengthen
the path in the two beams, so it is important that the original optical path be
sufficiently flexible that this increase in length does not affect the basic performance
of the instrument.
When the transmission of a sample is measured, it should be tilted a few
degrees so that the optical axis of the instrument is not perpendicular to the surface
of the sample. Otherwise, some of the light that reflects off the sample can travel
back toward the source and upset the calibration of the instrument. This happens
in some instruments when the energy reflected off the sample surface travels back-
ward through the optical system and then enters into the reference beam system.
The dispersing element that is used in a given spectrophotometer is not im-
portant, as long as the overall instrument is adequate. Thus, prism, ruled or hol-
ographic gratings, and Fabry-Perot interferometer units are all acceptable from a
fundamental viewpoint for general work. On the other hand, practical considerations
such as stray light, scan time, ease of operation, or signal to noise ratio may sway
the balance in favor of one type over the others.
It also makes the taking of the ratio of the two intensities more accurate as the
divider is working at close to unity ratios. The reflectance of the standard in the
reference beam should be at least as high as that of the sample.
A problem in the measurement of reflectance is that a reference, the reflectance
of which is well characterized, is usually needed. In either a single-beam or a
double-beam instrument, a baseline scan is measured prior to making an actual
measurement. In transmission, this is easily done by leaving the sample out of the
measurement chamber. In measuring the reflectance, a mirror must occupy the
sample position during the baseline scan. This reference mirror is then removed
and the sample inserted in its place for the actual sample measurement. The ratio
of the sample results to the baseline results gives the ratio of the two reflectances
without any contributing factors from the instrument. The result of the ratio is
multiplied by the reflectance of the ref~rence mirror to get the sample reflectance.
Any wavelength variation in the reflectance of the reference mirror must be taken
into account. The problem is thus reduced to that of knowing well the reflectance
of the reference mirror.
In the case of low reflectance values, the reflectance of polished samples can
be used. A polished glass surface can be characterized on the basis of its refractive
index. In addition, such a surface is hard and will not easily scratch. Other reference
reflectors that can be used in the visible and the infrared are the polished surfaces
of silicon and germanium. High reflectance references are more difficult. Typically,
high reflectors can be made from freshly evaporated aluminum and silver for the
visible, and silver and gold for the infrared. These reflectors are all relatively soft
and can be damaged easily. They should be checked frequently. Rhodium metal
films are fairly reflective and quite durable. In any case, the reference mirrors should
be approved by appropriate quality assurance personnel.
Professor John Strong (1938) originated a technique to overcome the previously
mentioned problem of needing a reference for reflectance measurements. His optical
layout is shown in Fig. 5.1. It is sometimes referred to as a V-W configuration as
the optical paths in the two positions look like these two letters. It should be noted
that this arrangement, because it has two reflections off the sample surface, measures
the square of the reflectance, and therefore, it is quite useful for mirrors and beam
splitters with high reflectance. When the reflectance is less than about 30 percent,
the squared value drops below 10 percent, and accuracy can be quickly lost at these
lower values. The fact that one mirror has to be moved from the sample to the
reference positions can pose a problem in the alignment of the optical path. Some
instruments use separate fixed mirrors to redirect the beam, thus avoiding the
alignment problems; the assumption is made that the two mirrors are identical.
Another drawback that is sometimes encountered in this configuration is that the
sample must be large enough to intercept and reflect the two beams that need to
impinge on the sample. In addition, the larger the sample, the greater the need to
ensure that the uniformity of the coating is adequate to ensure good results.
When the reflectance of a sample is low, the problem encountered is frequently
one of low signal levels, combined with possible scattered light from the surface
being measured, or from other sources such as stray light in the monochromator.
Accurate reflectance measurements of samples with very high reflectance levels
144 CHAPTER 5
A.
B.
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Figure 5.1. Diagram of Prof. John Strong's v-w reflectance attachment for the measure-
ment of the reflectance of a sample without having to rely on a standard. Note that the beam
reflects twice off the substrate. This yields R2 as a result of dividing the intensity value from
arrangement B by that from arrangement A. Note that this arrangement may be inaccurate
if the reflectance of the sample is low (R2 is too small).
FILTER PERFORMANCE MEASUREMENTS 145
require the determination of a small difference in intensity between the sample and
the reference reflected intensities, which are large. Sometimes this is a small fraction
of a percent difference between the mirror and 100 percent. In addition, the re-
flectance of the reference needs to be known precisely. For values of reflectance
near unity, it is possible to design a measurement system such that the light is
reflected many times off the sample surface. To first order, this technique increases
the sensitivity of the measurement linearly with the number of reflections the beam
makes on the sample, as can be seen by expanding the difference between unity
and the reflectance losses:
Rn = (I-At = 1 - nA + ...
where R is the value of the high reflectance, A represents the reflectance losses,
and n is the number of reflections the sample beam makes on the sample
surface.
The losses are assumed to be small (the reflectance is high) so that higher
order terms can be neglected. By increasing the number of reflections off the test
surface, we can increase the sensitivity. In such a situation, it is necessary to be
certain that the auxiliary optics that are required to get the multiple bounces from
the sample do not introduce undesirable effects of their own.
exact value of the spurious component is difficult to detennine because the light
reflected from the second surface travels twice the thickness of the substrate, and
will be offset from the nominal beam as well.
There are two frequently used methods to eliminate bothersome second surface
reflectances. A wedge-shaped prism whose index is the same as the substrate can
be placed behind the uncoated surface and an index-matching fluid introduced
between the substrate and a wedge face. The result is to eliminate the optical
interface. The transmitted beam is reflected by a second prism face. The deviation
introduced in the beam, along with the extra path length in the prism, is usually
sufficient to deflect the beam out of the optical train and the collection cone of the
detector. The wedge must not be a right angle prism, as the deviation will be zero
for this configuration and the beam will be returned to the spectrophotometer.
Another technique to reduce the second surface reflection is the use of a
substrate whose second surface has been roughened, either chemically or mechan-
ically. The treatment should reduce the specular reflectance of the surface to a
negligible value.
The thicker the substrate, the less of a problem the second surface reflectance
is as the beam reflected by the second surface will be displaced in proportion to
the thickness of the substrate. The larger the deviation, the less the likelihood of
this offending beam's finding its way to the detector. If the second surface is
nonplanar, then the second surface beam will be defocused before it can get to the
detector, thus further reducing the magnitude of the problem.
When an integrating sphere or other wide acceptance angle detector collects
the light that is reflected by the sample, reduction of the second surface effect can
only be done by absorbing the unwanted light. A paint that has an index equal to
the substrate index and that is completely absorbing at the wavelengths of interest
works nicely. Another similar method of addressing this problem is to attach an
absorbing material, e.g., a piece of black glass, to the back of the substrate with
an index matching oil.
When infrared substrates are used, the second surface reflection may be higher
than that of optical glasses used in the visible. Index matching fluids are not generally
available in this spectral region, therefore, second surfaces have to be treated to
eliminate the specular beam. This has to be done carefully for the following reasons.
1. The substrates are frequently fragile. In the infrared, semiconductor crystals
are frequently used as substrates since they may have very good transparency. In
addition, these substrates are frequently thin, and this contributes to the fragility.
2. Scattering is a strong function of wavelength. The scattered light intensity
can decrease as fast as the fourth power of the wavelength, depending on the type
of scattering mechanism involved. As the wavelength of interest increases, it be-
comes more difficult to attenuate the second surface reflection by roughening it.
Some special purpose instruments have been designed to distinguish between the
first and the second surface reflectances.
In the previous discussion, it is assumed that the light reflected from the second
surface is adding in an incoherent manner to the light from the first surface. This
FILTER PERFORMANCE MEASUREMENTS 147
may not be the case in some infrared, as well as visible, measurements. The two
surfaces of the substrate can serve as the mirrors in a Fabry-Perot cavity with the
result's being a so-called channel spectrum. This appears on a spectrophotometric
scan as an oscillation in the reflectance. On a wavenumber scale, the oscillation
period is constant and related to the thickness of the substrate. The amplitude of
the oscillation in the reflectance depends on the reflectance of the two surfaces: the
closer the reflectances are to being equal, the greater the amplitude of the oscil-
lations. If the j7number (j7#) of the spectrophotometer is similar to that of the
optical system in which the filter will be used, then the oscillations will also be
present in the final system (assuming the filter is not optically bonded to some other
component). If the second surface of the filter has an antireflection treatment, there
should be minimal interference between the beam from the second surface and the
front surface one.
20 ~-------------------------------------------------,
15
GI
U
-
C
1\1 \
u 10 \
GI
;: \
CD \
II: \
--
\
\ "m =1.0
~ \
------
5 '\ \, "
,,'" ... " ......
' ......
\', /
\
\
'"
\ "
,....."... ).(.----
o ~----~-~~~------~~--~----~~--------~------~
400 500 600 700 800 900
Wavelength (nm)
Figure 5.2. Comparison of the reflectance of a single layer (solid lines) and a double layer
(dashed lines) antireflection coating applied to a silicon substrate in incident media of 1.0
and 1.5. Note that after immersion the reflectance of the single layer design increases,
whereas that of the two layer one decreases.
148 CHAPTER 5
the performance of the two-layer design improves. Figure 5.2 shows the individual
performance curves. If the silicon cell is to be encapsulated in a protective organic
material, the reflectance should also be measured immersed in a medium with an
appropriate index of refraction.
To measure accurately the reflectance of the silicon/encapsulant interface, care
has to be taken to consider the first surface reflectance at the air/encapsulant inter-
face, as mentioned in the previous section.
Special purpose instrumentation is required when measuring the reflectance of
an immersed sample at a high angle of incidence because it is difficult to introduce
and extract a beam into the immersing medium at high angles.
5.1.5. Polarization
Unrecognized polarization can cause insidious problems in spectrophotometry. When
a sample is placed in a dual beam spectrophotometer at or near normal incidence,
any intrinsic polarization effects cancel because of the ratioing that takes place
between the two beams.
When the sample is placed at a nonnormal angle with respect to the optical
axis of the spectrophotometer, there will be some polarization effects introduced
into the system since thin film filters behave differently in p as compared with s
plane polarized light. The polarization state of the beams in the typical spectro-
photometer without polarizers is unknown, and it is likely that the intensity of the
two polarization components will be different. The reason for this is that spectro-
photometers have many optical components that cause the light with which they
interact to become partially polarized. Reflection diffraction gratings, for example,
reflect light that is highly polarized. Prisms and mirrors that are used at nonnormal
incidence can also introduce some polarization to the beam. Thus, in a spectro-
photometer that has no specific polarizer, the interaction of the sample beam with
the filter may lead to unpredictable results.
One solution to this problem is to install a polarizer in each beam of the
spectrophotometer when measuring samples at nonnormal angles of incidence. For
angles of incidence less than 30 degrees, however, this may not be necessary.
Sheet polarizers can be used for the visible portion of the spectrum, but these
can introduce problems of their own because for the most part they are not very
good optical elements:
1. They can introduce aberrations into the wavefront unless they are laminated
between glass plates
2. Their spectral range is limited
3. They do not produce complete polarization of the transmitted light
4. They are absorbing, and thus reduce the amount of light available for the
measurement
Their advantages include:
1. They are relatively inexpensive
2. They are compact and simple to use when compared with other techniques
FILTER PERFORMANCE MEASUREMENTS 149
For precision work over broad wavelength ranges, calcite and other crystals are
used to make prism polarizers such as Glan-Taylor and Glan-Thompson. Some of
these crystals are fragile and sensitive to moisture, and the assembled prism can
be large (several centimeters long).
In the infrared portion of the spectrum, wire grids are frequently used as
polarizers in addition to some crystals.
Polarizers are characterized by the amount of light they transmit (how much
less than the theoretical 50 percent) and the attenuation, suppression, or extinction
ratio of the two planes of polarization. The extinction ratio indicates how well the
polarizers discriminate between the two planes of polarization. With this infor-
mation, one can estimate the error that will be introduced in a measurement. This
should be evaluated as a function of the wavelength as the transmission and effi-
ciency of polarizers is not constant. In some portions of the infrared spectrum, the
energy reaching the detector is quite low in the best of situations. Adding a polarizer
that cuts the intensity by at least a factor of 2 makes the situation even worse. The
combination of instrumental polarization and polarizer orientation may reduce the
energy getting to the detector to an extremely low level. In some instances, a
depolarizer or polarization rotator can be of some help.
1 26.6
2 14.0
4 7.1
8 3.6
16 1.8
150 CHAPTER 5
strument, on the other hand, has a maximum cone angle of 7.1 degrees. This could
be the source of some differences between the theoretically evaluated (collimated
light) and the measured spectra. As previously mentioned in this chapter, reflectance
and transmission are almost never measured at exactly 0 degrees angle of incidence.
If a 5-degree tilt of the sample is used for making a transmission measurement,
and this is added to the 7-degree cone angle for an f/4 instrument, then the angle
of incidence on the sample varies over the range from 0 to 14 degrees. This could
be significant for some very narrow band (less than 0.5 %) filters (see Fig. 3. 15).
In addition to the cone angle, the light in a spectrophotometer also has a spread of
wavelengths caused by the finite slit width; this has to be added to the cone angle
to get the total effect of the instrumentation on the measured result.
In narrow bandpass interference filters, the wavelength of the center of the
pass band varies with the angle of incidence caused by the blue shift as discussed
in section 3.6. The measured peak transmittance of a narrow bandpass filter illu·
minated by a cone of light differs from one that is illuminated by collimated light.
The finite cone of light integrates the perfonnance over a range of angles, and the
effect of this is to reduce the total indicated transmitted intensity as compared with
that of a collimated beam. Other types of filters whose measurement may be affected
by this shift of perfonnance with angle are (1) edge filters, where the slope of the
edge may appear to be less steep than it actually is and (2) high perfonnance AR
coatings, e.g., V·coats at the minimum reflectance point, where the low reflection
is not as low as expected based on normal incidence calculations with a O-degree
cone angle.
Reflectance attachments for spectrophotometers are frequently designed for
to·degree angle of incidence or greater. It is rare to find an instrument that can
measure the reflectance at angles much closer than this to the normal. Thus, in
reflection, one can expect that the angles may range from 7 to 13 degrees for an
fl8 instrument.
Some commercially available spectrophotometers have different f/# in the
vertical and the horizontal planes. This complicates an evaluation of the effect of
thef/#.
FILTER PERFORMANCE MEASUREMENTS 151
*Gier Dunkle Instruments, Inc., 1718 21st Street, Santa Monica, Calif. 90404, make such an
attachment, Model SP220, for the Beckman DK-2 spectrophotometer.
152 CHAPTER 5
*Model 1001 Spectrophotometer is available from Zygo Corporation, P.O. Box 448, Laurel Brook
Road, Middlefield, Conn. 06455.
154 CHAPTER 5
Dewar Wall
3--+---t+-- He Refrigerator 4K
-""".~~--
Tilted Windows
Vacuum Sample
Atmospheric Pressure
Figure 5.3. Diagram of a cryogenic sample holder for a spectrophotometer. The windows'
tilts (shown exaggerated) prevent multiple reflections within and between them from contri-
buting to the performance spectrum. Note that the windows must be kept warm or purged
on the outside with a dry gas to prevent condensation of moisture on them. The windows
need to be transparent over the spectral range being measured, and they may require
antireflection coatings.
perature rise in a sample illuminated by a laser beam. The temperature rise is, to
first order, proportional to the power in the incident beam (assuming, of course,
that the power level is not so great as to damage the part being measured). High
sensitivity is achieved by using low thermal mass and low specific heat substrates,
and by designing special fixtures to hold the sample in thermal isolation. With
proper instrumentation, light scatter from the substrate is not a problem. Ultras mall
thermocouples measure the temperature rise of the sample. Mounting the sample
in a vacuum chamber evacuated to a pressure of 133 mbar (100 torr) eliminates
any heat losses from the sample by conduction to the air and by convection. Figure
5.4 shows a schematic diagram of a calorimeter. In addition to the thermal con-
FILTER PERFORMANCE MEASUREMENTS 155
Evacuated Tank
Sample
Support
Tilted windows
with AR coatings
Thermocouple
Thermocouple Output
Figure 5.4. Diagram of a laser calorimeter. The incident laser power can be in the 1- to
10-watt range. The chamber is evacuated at least to a pressure at which the heat loses by
air conduction and convection become insignificant in comparison to other experimental
errors.
siderations, care needs to be exercised to assure that the transmitted beam (for
transparent substrates) is directed properly to a beam dump, lest the reflected beam
return to the sample area, additionally heat the sample, and cause systematic errors.
A stray beam such as this could also heat the measuring thermocouple. The typical
procedure relies on measuring the heating and cooling rate curves of the sample,
and deriving the absorption from these data. Calorimeters can measure absorptances
down to 2 x 10-6 (Allen et aI., 1978).
5.1.11. Colorimetry
The perceived color of the light reflected or transmitted by a filter can be important
in some applications. Colorimetry quantifies the color of a light beam and gives
the results in standard terms. A common means of providing this is based on the
Commission Intemationale de l'Eclairage (C.I.E.) chromaticity diagram, Fig. 5.5.
This chart is based on data gathered in the late 1920s and codified in 1931. Recent
improvements to this chart include the 1976 CIE-UCS system (CIE, 1978), which
displays an improved uniformity of color differences over its predecessor (Keller,
1983). This latter chart is shown in Fig. 5.6.
Two instrumental methods are used to evaluate color. In one system, the
intensity of the light in the visible portion of the spectrum is measured. The color
156 CHAPTER 5
0.8
.51
0.7
0.6 Gr •• n
0.5
Y.llowllh O.e.ge
0.4
0.3
.77
0.2
0.1
.0
L-~----~~----~~~~~----~----~----~~--~~~x
Figure 5.5. CIE color coordinate diagram (1931) (adapted from a Photo Research chart).
This is the X-V coordinate system with the color regions bounded by Kelley (1943). The
solid line with numbered tics is the locus of the coordinates of the color of a blackbody
emitter at the indicated temperatures. The wavelength in micrometers of the pure colors at
the periphery of the diagram are indicated.
x = f <I>(A)X(A)dA
Y = f <I>(A)Y(A)dA
Z = f <I>(A)Z(A)dA
where <I> is the spectral radiant flux and x, y, and Z are the red, green, and blue
spectral tristimulus functions, respectively.
FILTER PERFORMANCE MEASUREMENTS 157
y'
820
0.5 • .--~
0.4
0.3
0.2
0.1
The 1931 eIE chart displays nonnalized fonns x and y of the tristimulus values:
x
x=
X+Y+Z
Y
y
X+Y+Z
In the 1976 fonn of the chart, a different transfonnation is used:
, 4X
u = and
-2X + 12Y + 3
, 9Y
v =
-2X + 12Y + 3'
and the values of u' and v' are plotted on the latter chart.
158 CHAPTER 5
true representation of the actual part. The use of a witness is acceptable if the results
are really what would be obtained if the actual part were measured. This can usually
be achieved by coating the witness(es) in the same chamber and at the same time
as the actual part is being coated. Temperature, angle of deposition, and coating
thickness are some of the coating parameters that must be the same on the witness
and on the part. One must exercise care in the comparison of the actual and the
witness parts to be certain that the coatings on them are indeed similar in perfor-
mance.
treatment will likely damage it. The abrasion test attempts to evaluate and to quantify
the durability of the coating to this type of abuse.
Two tests are in common use for measuring the abrasion resistance of coatings:
the cheesecloth and the eraser tests. The tests are always performed on clean areas
of the coating.
5.2.3.2. Eraser Test. The second abrasion test in common use is the eraser
rub test. In this test, a well-specified pencil eraser (type and hardness of the rubber
and the amount of pumice in it are specified) is pressed against a coated surface
with a force of about 9 to 11 newtons (2 to 2.5 lbs. of force) and rubbed 40 times
over a given coated area. As with the cheesecloth test, the coating is then examined
for damage. This test is much more difficult to pass than the cheesecloth test as
the pumice is a much harder material.
humidity test such the 24- or 48-hour test, then the coating is reasonably durable.
The same can be said of the other tests.
used, possibly because it is not as quantifiable as other tests. Many times, defects
that are not measurable are readily seen by eye.
5.2.6.1. Visual Inspections. One area where visual examination is the typ-
ical method used is in the examination of parts for edge chips, scratches, and cracks.
Of course, this inspection must be done on the actual parts instead of witnesses.
The chips must be less than a specified size, depending on their depth, and their
number is limited as well. Standards for scratches and digs (pits) are available, *
which allow an inspector to compare visually with the standard the size (width,
length, and depth) of a scratch or a sleek he or she has observed. The inspector
who does the visual examination must have a certain talent and lots of experience
in looking at samples to be repeatable, especially when the parts are only marginally
sleeked.
5.2.6.2. Falling Sand Test. This test is useful in situations where the optical
element will be exposed to an abrasive environment, e.g., spectacles and sunglasses
(on a sandy beach), and coated architectural glass. In this test, sand in a hopper at
a fixed height falls on a slanted substrate. The rate at which the sand falls is
controlled, as is the test time. The sample is examined at intervals to see if the
sand has eroded, abraded, or otherwise damaged the coating. This tests both the
hardness and the adhesion of the coating. A similar test is formalized in Mil-C-
14806, para. 3.11.5.
*Procurement and/or calibration of scratch and dig standards can be obtained from: Armament
Research and Development Center, U.S. Army Munitions and Chemical Command, AMSMC-QAF-I,
Dover, N.J. 07801-5001.
164 CHAPTER 5
value of the adhesive forces. It is assumed that in applying the adhesive to the
coating there is no chemical reaction between the adhesive and the coating. For
some epoxies, this may be difficult to determine. This is a relatively new test and
it is not in widespread use to certify production coatings at this time.
Another test that determines the bond strength between a coating and the
substrate is the measurement of the normal force required to pull off a stud securely
cemented with an epoxy adhesive to a coated surface. * A mechanism applies an
increasing force normal to the surface and provides an indication of the force at
which the bond fails. The stated accuracy of this method is within plus or minus
10 percent. The primary cause of the variation is caused by the error in determining
the size of the contact area between the stud and the coating.
Indentation Tests. This test was first described by Heavens (1950) and later
expanded by Benjamin and Weaver (1959). It involves drawing a smooth point
across the coated part. The load on the point when the film is removed is a relative
measure of the adhesion of the film to the substrate. The absolute value of the
shearing forces can be calculated from the load, the radius of the point, and the
indentation hardness of the substrate. This method was used by Benjamin and
Weaver (1961) to determine the adhesive strengths of a number of metal films on
a glass substrate.
5.2.6.4. Combined Adhesion and Abrasion. A test that evaluates the adhe-
sion as well as the abrasion resistance of a coating is the Tabert abraser test. A
rubber wheel loaded with an abrasive rolls in a circular path on the surface to be
tested. The motion is complex as the width of the wheel is such that some dragging
or sliding takes place along with the rolling. This test is not widely used in evaluating
optical thin films at this time.
No satisfactory correlation has been made among the results of the various
abrasion tests.
*An instrument which perfonns this test is called the "Sebastian Adherence Tester," and is available
from Quad Group, 331 Palm Avenue, Santa Barbara, CA 93101.
tModel 503 is made by Teledyne Taber, North Tonawanda, N. Y. 14120.
FILTER PERFORMANCE MEASUREMENTS 165
The adhesion of aluminum films to a glass substrate increases with time (Benjamin
and Weaver, 1961). The conclusion one draws from all of this is that a standard
period of time should pass after removing the parts from the coating chamber before
testing to obtain the maximum amount of test to test repeatability.
Another factor that enters into testing is the cleanliness of the parts being
examined. Abrasive particulate matter on the surface during eraser or cheesecloth
testing may affect the test results. Similarly, particles between the adhesive tape
and a surface could reduce the adhesive forces between the tape and the coating,
thus invalidating the results. It is a standard practice to clean a surface before testing
it. The solvents used for this purpose should be carefully chosen, as some of these
solvents have been known to cause problems of their own. It was discovered some
years ago that when chlorinated hydrocarbon liquids were used to clean parts before
coating, the parts failed humidity testing. Apparently, some hydrogen chloride
residue remained on the surface after the cleaning step, and this subsequently turned
to hydrochloric acid when exposed to moisture. This acid then caused deterioration
of the films.
Filters are sometimes subjected to moderately high temperatures (> 100°C)
during the manufacturing process. This may occur intentionally and be done by the
filter manufacturer to densify the coating or desorb moisture. It can also be done
incidentally, in that it is a part of the manufacturing process after the filter has been
incorporated into another subassembly or component. The filter can shift its per-
formance as a function of wavelength asa result of this heating. Also, the optical
performance can charge because the films in the filter change their oxidation state.
Generally, this means that the coating becomes clearer and less absorbing after
heating. In other cases, however, the coatings become absorbing as oxygen is driven
out from the layers, and then cannot get back in after the heat is removed. In other
situations, the coating materials are simply unstable at elevated temperatures. Wit-
nesses for filters that will be heated in use must also be heated prior to environmental
testing to simulate the life cycle of an actual part. This is especially important if
the filters undergo large temperature excursions during their subsequent processing
or in their use.
5.3. AGING
Optical filters are passive devices, and as such, should have an unlimited lifetime
when properly used. There is nothing to wear out, and nothing in the filter is
consumed. On the other hand, nonoptically related factors can sometimes put a
limit on the shelf life and the working life of a filter. Of course, mechanical shocks
can break some of these filters, whereas too high an energy level, e.g., too powerful
a laser pulse, can damage them. Though most coating materials are inorganic, some
molds and mildews can grow on just about any solid surface, including glass. Thus,
an optical filter, like any other optical component, should be kept in a clean, dry
environment for long-term storage.
in air. Several chemical reactions can occur, including the conversion of the sulfur,
zinc, and magnesium to their respective oxides. Some of the reaction products are
volatile, and this obviously leads to a change in filter performance. Conversion of
a sulfide or a fluoride to an oxide is generally accompanied by a change in refractive
index, and a corresponding change in filter performance. Similarly, oxide formation
can occur with other compounds under appropriate conditions.
Some molecules, for example, titanium dioxide, can lose a portion of their
oxygen complement at elevated temperatures. A chemically stable suboxide may
form that is stable and that does not return to the fully oxidized stoichiometric state
following removal of the heat source. This may occur because the suboxide is
intrinsically stable or because the oxygen that was released diffused out of the
coating, or was driven out of the thin film structure by a pressure gradient. As the
temperature is reduced, the oxygen does not reenter the coating at a sufficient rate
during the cooling off period. Once the system is back at room temperature, the
reaction kinetics are insufficiently rapid to cause further oxidation to take place.
In this section, we discuss features that may be seen on the surface of an interference
filter. Some defects may be apparent only when a part is examined under the proper
lighting conditions. Other features in a coating cannot be detected with standard
instrumentation, such as spectrophotometers, yet they are readily apparent with the
naked eye. In either case, the fact that a surface defect can be observed does not
necessarily mean that the part is unsatisfactory or otherwise inadequate to serve the
intended function. It indicates that the human eye is very sensitive to certain types
of optical patterns and color changes, and these mayor may not be relevant to the
inspection of a given sample. We give examples of some of these situations.
5.4.3.1. High Reflectors with Opaque Metal Layer. An opaque metal layer
often replicates and enhances substrate defects. An improperly cleaned substrate
causes the metal layer to be hazy. If certain areas are dirty, whereas others are
clean, then some areas will have a highly specular reflectance, whereas other areas
will be much more diffusely reflecting. These areas of differing specular and diffuse
reflectance are readily apparent to the naked eye.
ratio of scattered intensity to reflected background intensity can be quite high for
these surfaces.
Scattering from low reflectance transparent substrates may be observed by
viewing a brightly illuminated surface against a dark background. Any scattered
light becomes a bright spot on a dark background, and this is readily discerned.
Any dark, opaque substrate is its own dark background, and it is only necessary
to illuminate the surface with a bright light.
A fundamental axiom in the construction of thin film filters is that a thin film
replicates the contour of the surface being coated. This varies in degree for the
various coating materials. For example, a screen of wire mesh with a spatial period
of approximately 2 mm was coated with 2 to 3 cm of aluminum oxide over a long
period of time. The pattern on the surface of the deposit exactly matched that of
the underside where the screen was located. This was a vivid demonstration of the
extent of replication that is possible. The structural morphology in many growing
thin film layers can explain this kind of behavior. The growth is generally columnar,
with the columns perpendicular to the surface of the substrate if the evaporant is
also arriving normally. If the evaporant is arriving at some nonnormal angle, the
angle of growth follows a rule that states that the tangent of the angle of growth
is one-half the tangent of the angle of material arrival (Dirks and Leamy, 1977;
Pulker, 1984, p. 327)
It is possible that a coating can mask surface scratches and sleeks. A germanium
substrate with polishing sleeks was coated with an antireflection coating containing
zinc sulfide. Microscopic examination of the coated surface showed no signs of the
sleeks, yet they were readily visible on the substrate surface. Similarly, electron
microscopy has revealed that some coating materials can smooth out the roughness
of previously deposited layers.
below the target, the heavy deposits that build up around the target can flake off
and fall on the substrate. This configuration also is subject to contamination of the
substrate from material from any of the walls of the vacuum chamber. As stresses
build up, the materials on the wall may snap off with enough lateral velocity to
reach the substrate.
Typically, pinholes occupy a relatively small area of the total coated surface.
They are frequently apparent because they have a large contrast ratio with the
adjacent coated areas. The significance of pinholes in a filter is highly dependent
on the application. In some, voids are functionally insignificant, whereas in other
instances, they are intolerable. For example, in a coating that will be etched with
a fine pattern, a void could obliterate a part of the pattern, or cause a line to have
a break in it, perhaps causing a portion of a large circuit to fail. Small openings
in a blocking filter, which must have a great deal of attenuation, can allow an
objectionable amount of undesired radiation to pass through the filter.
The observation of pinholes can be a tricky affair, especially when large areas
need to be examined. Visual examination of a small coated area with a microscope
can readily detect a void, either by the difference in intensity or by a difference in
color between the defect area and the normal coating. If the substrate is transparent
and the coating is opaque, the light can be incident from one side of the coating
and the detector can observe from the opposite side. If the coating is an antireflection
coating, then one can search for the pinholes by looking at the reflected light. A
difficult situation is encountered when the coating is semitransparent, as happens
in a single film of indium tin oxide on a glass substrate. Then the contrast between
the coated areas and the pinholes is poor in both reflected and transmitted light.
Thus, the scale-up from scanning a small sample with a microscope to scanning a
large substrate surface area for pinholes is a real challenge.
Inclusions are trapped particulates. They can be caused by particles that are
ejected from the coating material source or from dust or other particles that are
incorporated into the film as it grows. Figure 5.7 shows a scanning electron mi-
croscope photograph of an infrared film with a particle that initiated a conical defect
zone. As the film grew, the disturbed area increased in size, and the amplitude of
the disturbance remained unchanged. The particle continues to make its presence
felt even after it has been buried to a depth many times its diameter. The size of
the disturbance increased in diameter so that the slope error became less, but the
overall volume of the disturbance increased. If the particle detached from the
underlying material, either due to the buildup of stresses in the coating with increased
thickness, or perhaps due to differential expansion from the heating of the film
from the coating source, a void many times the diameter of the particle will form.
Even if the inclusion has the same index of refraction as the adjacent material, a
scattering site is formed because of the displacement it causes to the other layers.
Figure 5.7. Scanning electron microscope (SEM) photo of a conical defect arising from a
point defect. The white bar is 10 ILm long. As more layers are added to the stack, the
disturbance caused by the defect increases in lateral extent, but the defect height remains
constant. (Courtesy of Phil Swab of Research Dept., O.C.L.I.)
difficulty because the metal surface is soft and easily damaged. On the other hand,
a hard coating of magnesium fluoride on a glass lens is nearly as durable as the
bare substrate. One would not attempt to clean a finely polished glass lens with
ordinary techniques such as might be used on a window pane, and a similar caution
is warranted for coated optics.
Loosely attached particles can be removed from a coated surface by blowing
them off with a gas jet. This is described in the section of cleaning soft coatings.
The ultimate soft coatings are probably the metallic coatings with no overcoats,
such as gold, silver, and, to a lesser extent, aluminum. As previously mentioned,
there is no way that these can be cleaned with a contacting method. Particles can
be blown off the surface with a gas jet, either manually supplied as from a rubber
bulb, or from some other source such as a compressedlliquefied gas in a can, a gas
cylinder, or a gas manifold. When using any gas source to blow off a surface, it
is necessary to ensure that the gas itself is clean and does not contaminate the
surface. If a rubber bulb is used, the bulb should be inspected to ensure that it is
clean. For liquefied gases in aerosol cans, it is difficldt to ensure that none of the
liquid itself comes out of the nozzle; if this happens, it will cause spotting on the
surface. Finally, when the gas comes through pipes and hoses, either from a com-
pressed gas cylinder or from a central gas supply, it is essential to have a final filter
near the nozzle to remove particles that may be in the gas lines. Filters are available
that can remove particles as small as 1 ~m in size.
While blowing off a surface, care should be exercised so as not to touch the
surface with the nozzle. This is particularly important with a manually operated
rubber bulb, as motion is required to squeeze the bulb, and this could result in a
movement of the nozzle toward the surface.
A surface charge of static electricity attracts and retains dust. If the relative
humidity is low, the surfaces can acquire and hold significant static charges from
the cleaning process. The neutralization of surface charge reduces the amount of
dust that collects on a surface. The presence of ions in the environment accomplishes
this, as does a moderate to high ambient humidity level. An accessory that is useful
in areas of low humidity is an electrostatic ion generator. It can be installed near
the tip of the nozzle used to direct the gas that blows off a surface. The ion generator
ionizes some of the gas Howing through the nozzle, and these in tum neutralize
the surface charge. In another form, the generator can be part of the room air
filtration system and can flood an entire room with ions.
A tissue with a solvent can be used to clean surfaces. This is a contact method,
and can remove particles that are more adherent than those that are removed with
a simpl~ gas blast. The force of gravity and the liquid forces are the only ones
acting between the tissue and the surface. The forces applied to the surface by the
wet tissue are small, and therefore, this technique will in general suffice for plastic
and other fragile surfaces. The wet tissue is dragged in overlapping paths over the
entire surface without applying a normal force. The solvent should be removed
before it has a chance to dry (Stowers and Patton, 1978).
Perhaps the ultimate challenge for cleaning substrates are the soluble materials
such as sodium and potassium chloride. Because of their nature, they must be
handled in a room in which the humidity is kept at a low value. In addition, these
materials are excellent insulators, and so acquire and hold an electrostatic charge
very easily.
optical filters are generally sensitive to the thicknesses of most of the layers that
comprise it. On flat substrates, this translates to a coating in which the thickness
of all layers is uniform over the useful aperture.
In the simplest situation of a small flat part, the color of the light reflected by
the coating can give a qualitative indication of the variation in the thickness of a
film on a surface. It is fairly easy to measure the reflectance or transmission of flat
parts with a spectrophotometer to determine quantitatively the thickness uniformity
of a coating. On the other hand, if the part has a curved surface, such as a lens or
a dome might have, then a typical spectrophotometer cannot be used to get a good
photometric value.
Good photometry is not necessary in some cases to determine to first order
the uniformity of a coating system. For instance, if the performance of a design
has a feature with a steeply rising slope, the wavelength position of the half max-
imum point can be plotted as a function of position. This technique assumes that
the shape of the curve remains constant as the thickness changes. This might not
be the case if the ratio of the thicknesses of the materials that are used in the coating
changes. This is detectable by comparing the shapes of all of the curves measured
to verify that indeed they are identical except for a wavelength shift.
Some instruments are capable of measuring accurately the reflectance of sur-
faces with optical power (see section 5.1. 8.). They are very useful in measuring
curved surfaces with unknown coatings and for which there are no flat witness
pieces. Of course, special purpose instruments can also be built.
On complex shapes with steep surfaces, such as fast lenses or domes, the
analysis of uniformity is more complicated than that of flats because the angle of
incidence varies as a function of position over the surface. To be more quantitative,
one needs to measure the reflectance (or transmittance) at several points on the
surface at the appropriate angle of incidence. The angle of incidence should not be
neglected on steep parts as this can have a significant effect on the performance
(see section 1.3.). The uniformity is sometimes deliberately adjusted to compensate
for the angle shift on large steep-surfaced optics.
When the parts are small enough to be placed into the sample compartment
of a spectrophotometer, the task of measuring a number of points is limited by the
beam size that gives adequate signal to noise ratio (assuming the focusing problem
is somehow solved).
When the parts are too large to fit in an instrument, the manufacturer has three
choices.
1. Cut the part into pieces small enough to fit on the equipment available
2. Design and build larger measurement equipment that can handle the large
part
3. Install small witness pieces in the coating equipment to stimulate a larger
part, and measure each witness individually after it has been coated .
The assumption is generally made that the witness pieces will fairly represent the
coating that is placed on the actual part.
When many small parts are being coated at one time, the uniformity over an
individual part may be quite good. On the other hand, the thickness may vary from
178 CHAPTER 5
part to part within a single lot, as the various parts sample different portion of the
unifonnity curve.
Figure 5.S. Photo of compressive failure as seen through an optical microscope. The bar
is 100 j.l.m long. The film has delaminated from the substructure and buckled upwards.
(Courtesy of T. Tuttle Hart of Research Dept., O.C.LI.)
figure 5.9. Photo of tensile failure as seen through an optical microscope. The bar is
100 ILfTl long. Note that at the intersection of all lines, the two cracks meet at right angles.
(Courtesy of T. Tuttle Hart of Research Dept., O.C.Li.)
system in which the light can be made to be incident on the substrate through the
objective. Such illumination systems are standard on metallurgical microscopes.
Another useful microscope technique in the investigation of thin films is the
use of dark field illumination. The objective illuminates the sample with a cone of
light at relatively high angles of incidence. The specularly transmitted or reflected
light cannot be collected by the objective as it is outside of its collection cone.
Only the light scattered into the objective is seen. Features that scatter light such
as dust, voids, edges, and other discontinuities are readily seen, whereas smooth
features of the specimen appear dark. The typical dark field work is done in re-
flection, and this requires the use of special objectives as a well as special microscope
optical system.
An interference or phase contrast, also called Nomarski, attachment to a mi-
croscope is a useful technique for investigating the surface contour of thin films.
The method uses the interference of light to magnify the vertical features on the
surface of the film. Features at different heights are seen as different colors or
shades. Although it is difficult to quantify the extent of the roughness, one can get
a good qualitative feeling for the extent of a problem. This technique produces
colorful displays that can be easily evaluated by eye, but as the effects are caused
by a gradation of colors, it is difficult to place an exact value on the height of a
feature.
When the quantity of coated parts is small, it is not a major effort to scan or
otherwise measure every part. When many parts are being produced either in one
or multiple coating runs, it becomes prohibitively expensive to measure all parts.
A typical approach in these cases is to qualify a vendor by measuring a large fraction
of the initial lots of a large order. As the buyer and seller gain confidence in each
other and in the fact that the process is under control, the requirements for testing
can be reduced to a small sample of each coating run.
When 100 percent inspection is required and the quantities are large, it is
important to automate the measurement process to reduce costs.
Chapter 6
The type of substrate upon which a filter is deposited generally determines many
of the characteristics of the filter, such as durability, stability, and cost. There are
three major categories of substrates:
1. Glasses and similar crystalline materials
2. Organics and plastics
3. Metals
Substrates can also be classified as either rigid or flexible. The majority of high-
quality optics are fabricated of rigid materials. A large volume of web-coated
substrate is produced each year for decorative and other uses.
In this chapter, we discuss in more detail the influences the various substrate
materials and fonns can have on thin film coatings.
The primary driving factor in the selection of a specific material as a substrate for
a thin film coating is the wavelength region over which it must function. Trans-
parency may be the major concern, as coatings can modify only the surface-related
182
SUBSTRATES AND MATERIALS 183
characteristics of the material, such as the reflectance; they cannot alter the internal
transmittance or absorptance of a substrate. Table 6.1 lists the ranges over which
some common optical materials are transparent. This table should be used with
care; the limits shown in it are not absolute as the absorption is a function of the
thickness of the material being considered. The absorption frequently increases
gradually as the wavelength approaches the limits. If the sample is thin enough, it
if possible that the transmittance of a substrate outside the spectral range given in
Table 6.1 may be adequate for some applications.
Substrates should be strong enough to survive the handling that they will
undergo during the coating process. In a typical evaporation process, fixtures support
the parts by contacting them on the coated side only at the edges or outside of the
useful aperture. The fixtures are designed so that they will constrain the substrate
from moving laterally. Typical tooling consists of a milled recess in a metal rack
in which the part is situated as shown in Fig. 6.1. The supporting protrusion, the
jig lip, is usually made as small as practicable to minimize the area of the coated
substrate that is shadowed by it and is, therefore, not coated. This results in an
uncoated area around the periphery of the element. If the coating must extend to
all edges of the surface, then the fabrication process must include steps that coat
Substrate
~\\\\\\\\\\\\\\\\\~
r r rrr Motal Flxturo
6.2.1. Glasses
Glasses are the most common substrate materials for thin film filters. One reason
for this is that most optical elements are glass, though plastic lenses are fast becoming
popular in high volume units such as cameras. In both low and high-quality products,
most optical elements are coated to reduce surface reflectance losses, ghost images,
and veiling glare. We also include in the category of glasses some crystal-
line materials, such as silicon, germanium, and calcium fluoride, which, from a
coating standpoint, behave quite similarly to glasses. These crystalline materials
can be heated to typical coating temperatures with no degradation of their optical
properties.
The optical designer has a number of trade-offs to consider when selecting
optical glasses. In addition, some thought needs to be given to how these elements
will be cleaned and coated once fabricated by an optical shop.
The substrate material preferably should not darken under ultraviolet, electron,
or ionized particle irradiation, as a number of coating processes generate such
conditions in the vacuum chamber. In evaporative coating processes, a glow dis-
charge cleaning step is often used, and the glow plasma in which the substrate is
bathed generates ultraviolet light as well as energetic ionized particles and electrons.
A similar plasma may exist during the entire sputtering coating process. If materials
must be used that have poor radiation resistance, the filter manufacturer can tailor
the coating process as necessary.
Polished substrates need to be cleaned at least twice before they are coated.
The optician who polishes the surface must remove the polishing compound im-
mediately after the last polishing step, lest a residue remain on the surface. A similar
cleaning step is required immediately after diamond-turned optics are completed.
Otherwise, a tenacious film of the polishing compound or the diamond turning
lubricant forms, and it cannot be removed at a later time (Buckmelter et al., 1975).
This is true of both conventionally polished and of single point diamond turned
(SPDT) surfaces. The layer that is left behind can then be removed only by additional
polishing. Thus, it is necessary for the optical shop that is preparing the surface to
be certain that they clean off the surface as best they can and as soon after they
are finished with the optical element. Because they are familiar with the properties
of the materials used in fabricating the element, they are in a good position to know
how to remove this surface contaminant. Also, these materials become more ad-
herent as they dry out and age on the surface; thus, time is of the essence in their
removal.
Surface cleanliness is a matter of vital importance. Organic and other residues
from the surface finishing process can leave a layer on the surface. This residue
can act as a release layer for the coating, reducing the adhesive forces between the
substrate and the coating, and possibly causing the coating to separate from the
substrate.
186 CHAPTER 6
A final cleaning of the substrate, done shortly before coating, prevents as much
as possible:
1. Contaminants' reducing the adhesion between the first layer and the sub-
strate; and,
2. Particles' remaining on the surface and leading to scatter and pinholes in
the coating.
Other symptoms of poor cleaning are streaks and wipe marks on the surface.
Unfortunately, these may become visible only after coating, necessitating removal
of the coating, perhaps by repolishing, and then recoating. Thus, it is vitally
important to have good communication between the user and the coating vendor.
The latter must understand the history of the surface so that it may be cleaned
properly.
Some glasses stain more easily than others (see Schott and other glass company
catalogs for these ratings). It is difficult to clean some of these glasses as aggressively
as one would like, lest the cleaning process succeed in cleaning off the contaminants
but stain the glass at the same time. On the other hand, the coating may well
improve the durability of a surface to further degradation from staining by protecting
the glass from the environment. This improvement in resistance to staining cannot
be guaranteed, but it is to be expected that the additional surface material reduces
the substrate's exposure to the active elements in the environment and thereby
protects the surface.
The Schott glass catalog recommends that their glasses not be heated above a
temperature which is 200°C below the glass' transition temperature (Tg - 2(0).
At higher temperatures, the optical figure may deform and the refractive index may
change. Table 6.2 lists some of the glass transition temperatures for selected glass
types. It should be noted from this table that there are some glasses for which even
a 200°C coating temperature may be marginal.
One of the considerations the coating manufacturer has to take to account is
the expansion coefficient of the substrate material. If the coating process involves
heating, enough room must be allowed for the expansion of the substrate in the
supporting fixtures. The thermal expansion of the tooling and the substrates must
be matched through the thermal excursion of the coating process. Table 6.3 gives
the expansion coefficients of some typical substrates and tooling materials.
The fabrication of glass substrates into optical components is an art that has
been developed over many centuries, and we will not go into those details here.
We touch upon the dimensional sizing of substrates, however, as this is frequently
something the coating manufacturer is called upon to do.
Optically flat glass sheets can be made flat in two ways:
1. The most expensive of these is the traditional grinding and polishing as
done in an optical shop but on a larger scale.
2. Flat glass can be produced directly from the liquid phase by floating it out
on a pool of molten tin. The liquid tin/liquid glass interface is very flat, as is the
glass/air interface. The two surfaces have slightly different physical and chemical
properties, and these differences may be important in some applications. The tin
and air sides of a float glass sample can be identified by directing the light from a
lamp that emits in the near-UV on the float glass sample: the tin side fluoresces
while the air side doesn't.
Flat glass can be cut to size by scribing, either manually or with a machine, a line
on it with a carbide or a diamond tool and then breaking the glass along the line.
The accuracy that can be obtained with this technique is on the order of + / - 125
Aluminum 25"
BK7 glass 7.4t
Si02 0.5
PET 65*
Si 4.2
Ge 5.7
AI~3 5.8 (ave.)
CaF2 24
Nate: These values IlRlIor the temperaIuI8 range
normally experienced by optical syslems. 'From Weest,
1974. tFrom Ohara Glass Catalog, 1974. *"9ranof1,
1985
From WoWs, 1965, unless noted.
188 CHAPTER 6
....m (5 mils). This technique works well with most glasses, but it cannot be used
with fused silica or with sapphire substrates as the break line does not necessarily
follow the scribed line for these materials.
Other methods of cutting glass and other hard substrates include (1) loose
abrasive saws that use either carbide or industrial diamonds as the cutting agent
and (2) diamond-tipped saws. Inside diameter diamond saws, which work so well
with semiconductors such as silicon, perform poorly when used to cut fused silica
because of heat buildup as the silica is a poor heat conductor.
6.2.3. Metals
Metal substrates obviously cannot be used for transmitting optics. They can only
serve as mirrors or absorbers. Because metals are generally good thermal conductors
by comparison to dielectrics, they can function in situations where the heat load
on the substrate is high, e.g., high-power laser mirrors. Metal substrates can be
configured with cooling coils or integral channels through which a coolant can flow
to remove heat. Molybdenum and beryllium are two materials that are often used
for mirror substrates. Other metals can also be used to make optical components.
Beryllium is valuable in those instances where lightweight and low thermal
gradients are needed. Molybdenum is useful as it has good thermal characteristics
and can be machined and welded straightforwardly. These substrates are not typ-
ically coated directly. For beryllium substrates, a nickel-based plating (Kanigen)
is applied to the surface prior to figuring. This plating has better polishing char-
acteristics than the bare beryllium metal.
Large molybdenum mirrors can be plated with copper by a number of tech-
niques, including electroplating. The copper coating is then turned on a lathe with
a single-point diamond tool. The copper is much easier to tum than the molybdenum
190 CHAPTER 6
since it is much softer. The highly reflecting coating is subsequently applied to the
figured (turned) surface.
Because a numerically controlled diamond turning machine can produce an
arbitrary surface, it is useful in producing off-axis optics. These find use in instru-
ments such as X-ray telescopes. Such surfaces require coatings with extremely thin
layers to function properly in these wavelength regions. (See Chap. 7 for more
information on these new coatings.)
There are two common ways to control glass as it shatters in order to limit the
damage that can be caused by large shards: lamination and tempering. In lamination,
a layer of plastic bonds two conforming sheets of untempered glass together. When
such a glass panel breaks, the plastic interlayer holds the fragments together. Tem-
pered glass, on the other hand, has a high level of controlled internal stresses.
When tempered glass breaks, the result is that the internal stresses cause the pane
to break into small, relatively harmless pieces.
6.3.1. lamination
The plastic used to bond glass sheets is frequently polyvinyl butyral (PVB), and it
keeps the pieces of broken glass together, thus minimizing the potential for injury
or other damage from glass shards. The plastic bonding layer is fused to the two
glass surfaces by placing the unbonded assembly in an autoclave. High isostatic
pressures force the two glass sheets against the intervening plastic. Heat causes the
plastic to melt slightly and bond to the two glass sheets. The PVB plastic layer
may be colored for functional or cosmetic purposes.
PVB plastic can absorb a relatively large amount of water from the atmosphere.
If a bonded panel is to be coated, the absorbed water can be released in the coating
chamber during the coating process and degrade the coating. It is, therefore, gen-
erally recommended that the coating be applied before the lamination of the sub-
strates, if possible. If a coated surface is laminated, the coating must be able to
survive the autoclave bonding process temperatures, which may reach 125°C.
Placing a coating on the interior surface of a bonded assembly gives it additional
environmental protection; e.g., it cannot be scratched, abraded, or otherwise dam-
aged.
6.3.2. Tempering
A properly performed tempering process increases the breaking strength of glass,
even though the tempered glass has a great deal more internal stresses than annealed
glass. Tempered glass cannot be cut after it has been treated; thus, it must be cut
to size before the tempering treatment is performed. Two types of tempering pro-
cesses are in common use: thermal and chemical.
In the thermal tempering process, a hot piece of glass is rapidly cooled so that
the surface develops a compressive stress, while the interior of the sheet is under
SUBSTRATES AND MATERIALS 191
a tensile stress at room temperature. This process works well on glass sheets that
are over 3 mm (l/8 inch) thick; the necessary thermal gradients cannot be set up
when the glass sheet is much thinner than this. The thermal tempering process may
be done either before or after the coating has been applied to the surface. On the
other hand, it should be verified that the coating can survive the tempering process
before a commitment is made to temper coated parts.
In chemical tempering, an ion exchange process replaces the sodium ions near
the surface of the glass with larger ones, such as potassium. The increase in surface
volume causes compressive stresses at the surface, as does heat tempering. Chemical
tempering can be applied to even very thin sheets of glass. The limitations in this
process revolve around the issue of size, as the entire glass sheet must be immersed
in a vat of molten salt. These parts must consequently be cut to shape and then
tempered.
The coating affects the ion diffusion rate, and in some cases can reduce it
markedly. This change depends on the materials in the coating and their total
thicknesses and crystalline form. It is difficult to generalize a tempering process
with the sort of variables involved, therefore, it is generally agreed that the coating
process is the last step in a manufacturing process involving tempered parts.
Optical glasses are very tough materials as long as there are no local defects that
can cause stress concentrations that exceed the tensile strength of the glass. Glass
fails mechanically from tensile stresses, not compressive ones. In some circum-
stances compressive stresses can give rise to tensile ones. This phenomenon can
be seen in the conical shape of the hole formed in a glass pane where a small hard
object strikes it. The break occurs where the glass is in tension during the impact.
A piece of glass with an edge crack breaks more easily than one that has a
smooth finish on its edges. Stresses, such as may be generated from uneven heating
from heaters in a vacuum chamber or from a coating source, concentrate at the
edge cracks. The stress at the tip of the crack causes it to propagate very quickly
to the interior portion of the part, and perhaps causes catastrophic failure of the
substrate. Thus, the edges of glass parts are generally carefully inspected for cracks
prior to coating them.
The United States Armed Forces have established specifications for the sizes
of chips and scratches in glass optics. (Section 5.4. describes the relevant speci-
fications.) These defects can scatter light, which is undesirable in a high performance
optical system. Bennett (1978) discusses how the digs and scratches influence the
amount of light scattered by the substrate. Scheele (1977) has measured the forward
and the backward scatter at some common laser wavelengths of some typical infrared
substrate materials. Tables 6.5 and 6.6 show some of the data from his publication.
The surface finish of a substrate is at times a problem for the coating manu-
facturer. A surface that is acceptable from an optical perspective may not perform
well as a substrate for thin films. A surface can have nucleation properties that
192 CHAPTER 6
cause films to grow in a manner that causes scatter. These surface conditions are
frequently invisible, and show up only after the thin film has been applied. Coating
manufacturers are in the best position to advise those unfamiliar with these problems.
material has high transmittance to the wavelengths of interest and high absorptance
of light energy at those wavelengths that must be blocked.
Absorption filters have no angle shift such as there is in interference filters.
A shift in the transmission level can take place in an absorption filter since the
angle on incidence increases as the path length within the absorbing substrate
increases in proportion to the secant of the propagation angle within the substrate.
Thus, the attenuation increases (transmission decreases) with increasing angle of
incidence. (In calculating the transmission through an absorbing substrate, the
surface Fresnel losses must also be included to get a precise result.)
The attenuation of a light beam is a negative exponential function of the
thickness, and an appropriately absorbing substrate can be very effective at blocking
unwanted wavelengths. It may be quite difficult to get the same level of attenuation
with a reasonable number of thin film layers. An absorption coefficient of about
l40/cm allows a transmission of less than one part in a million through a substrate
1 mm thick. If this same material is used in a thin film design in a layer 1 !Lm
thick, the transmission is of the order of 99 percent (ignoring any interference
effects).
When absorption is used to block energy, the incident energy level should not
be so high that it excessively heats the substrate. If the substrate could overheat,
a reflective coating could be added to the blocking filter to reduce a portion of the
heat load. Otherwise, active cooling of the absorber is required.
The blocking properties of a substrate may be temperature dependent. For
example, gennanium changes its optical properties when the temperature approaches
77K. In addition, the transmission properties of gennanium and other semicon-
ductors can decrease as the temperature is increased. Care should be taken to be
certain that substrates that are to be used as blockers, or as transmitters, for that
matter, at temperatures other than room temperature are carefully checked for their
blocking or transmitting capabilities at the operating temperature.
The use of absorbing blocking filters is frequently a wise choice from a tech-
nical, as well as from an economic, standpoint. The limit on this type of filter is
that the useful blocking bands are fixed by available materials and are not as
adjustable as are interference filters.
Crystalline materials have spectral regions in which the reflectance increases to high
values. Relatively thin sections of the material are essentially opaque in these
regions. These bands are often found in the infrared portions of the spectrum. When
broadband infrared light is reflected by one of these materials, only light with
wavelengths corresponding to these bands remains after several reflections. Thus
the bands became known as reststrahLen reflection bands, from the Gennan word
for remainder or residuaL ray (Kittel, 1968, p. 154; Jenkins and White, 1957, p.
454).
These bands exist in the spectrum of both crystalline and amorphous phases
of a material, though the structure in the reflection peaks is sharper and more distinct
194 CHAPTER 6
in the former. These bands are a manifestation of lattice or interatomic bond res-
onances. The detailed structure depends on the long and short range order of the
material. A good example of this is silicon dioxide; crystal quartz has a much
different reflectance spectrum than does amorphous fused silica, yet they both have
the same chemical composition.
The index of refraction undergoes rapid changes as a function of wavelength
in a reststrahl region. The reflectance at wavelengths in the reststrahl band can
also vary quite rapidly as the angle of incidence varies. Figure 4.44 shows the
theoretically calculated reflectance for a number of angles of incidence for fused
silica.
The reststrahl reflectance can sometimes be used to advantage in designing a
filter. In other instances, it is a hindrance, as when a highly absorbing coating is
desired. Thus, it is wise to know as much about a material as possible when making
a selection.
In the formation of a thin film, the atoms or the molecules that condense on the
substrate surface may have a finite surface mobility. They may move about on the
surface prior to becoming affixed to a particular site. The range of the particles
dePends on the relative abundance of nucleation sites, the surface mobility of the
condensate, the kinetic energy of the molecule or the atom, and so forth. In the
initial stages of film formation, the substrate surface may have a number of nu-
cleating sites on it. The arriving molecules preferentially attach themselves to these
points. In metals especially, the atoms have good surface mobility and may move
a significant distance to find a low energy site. In the former case, material builds
up at the nucleating site at the expense of adjacent areas where there is relatively
much less material. The succeeding molecules that arrive preferentially attach them-
selves to the molecules that are already condensed and therefore, there is a buildup
of material in localized areas. The result of this process is the formation of islands
of the film material. These microscopic islands are the subject of a great deal of
current study, as their properties are not always what one might expect on the basis
of bulk properties of the material. Effective media theories provide means of treating
discontinuous island films as homogeneous films.
The optical properties of spherical particles immersed in a dielectric (massive)
medium have been studied for many years. J. C. Maxwell-Garnett (1904) wrote
one of the first treatises on the subject. A number of theories have been proposed
that can approximate these films with equivalent refractive indices. Depending on
the exact shape of the metallic particles, the resulting equivalent complex index of
refraction can take on a variety of values. Thus, it is quite difficult to model
accurately the behavior of these films, especially when the index of the surrounding
medium varies.
This phenomenon is the basis of some practical coatings. Optical data disk
designs have been patented that are based on the transformation of one type of
island film into another (LaBudde et al., 1983). The sensitivity of very thin metal
SUBSTRATES AND MATERIALS 195
films to elevated temperatures is used to transform the index of the film. Initially,
the metal islands are very small. The islands in a spot heated with a focused laser
beam coalesce and form much larger spherical particles. The difference in index
of refraction between these two regions allows the data bits to be read optically.
A film composed of noncontiguous metal islands has little thermal conductivity in
the plane of the film. This reduces the amount of power that needs to be deposited
in the film to raise its temperature to the point where an irreversible change in its
optical properties occurs.
The transmittance of visible light through a growing thin metal film is inter-
esting. For example, the transmission of a glass substrate starts at approximately
96 percent and decreases as silver is deposited on it. At the point where the islands
begin to coalesce with one another to form a continuous film, the transmission
begins to increase, until, at the point where most of the film is a single continuous
sheet, the transmission again begins to drop. It is at this point that the index of
refraction of the film begins to become stable. The exact thickness at which this
occurs varies with the nucleation properties of the underlayer. A similar behavior
of the index is observed for noble metals. Metals, such as nickel and molybdenum,
do not show this property quite as distinctly as the noble metals. This may be
caused in part by the fact that the noble metals form more distinct islands.
Germanium, with its high index of refraction in the infrared, is a very useful material
for thin films designs. It is generally not a good material to use in high-power laser
systems. At room temperature, germanium has sufficient absorption that a high-
power laser beam can heat it. Germanium, like all semiconductors, becomes more
absorbing as its temperature increases. This results in more heating from the laser
beam, and more absorption. This vicious cycle is termed thermal runaway. This
avalanche process increases until the laser beam is turned off, the optic is damaged,
or the transmission goes to zero. In some instances, this effect has been used as a
passive switch, but it is generally a drawback in most optical systems. The use of
germanium should be avoided when the temperature is expected to exceed 55°C
(Savage, 1985). Cooled germanium substrates cannot tolerate power densities greater
than 88 w/cm2 • Other semiconductor materials can show this effect also, but it is
most evident with germanium as it has a small band gap. Materials with a wider
gap, such as silicon, do not have this problem as their intrinsic absorption at room
temperature is much smaller.
Although in theory there is no upper limit to the number of materials that may be
used in a thin film design, most manufacturers try to limit designs to as few materials
as possible. A trade-off is sometimes possible between the number of materials and
the number of layers in a design, and the manufacturer will select the optimum one
given the various constraints.
196 CHAPTER 6
Designs with two materials are far easier to control because the thickness ratio
of the two materials is a major parameter in the performance of a filter. Generally,
the number of layers and the number of materials in a design are of little interest
to the user, but of significant interest to the manufacturer.
6.10. TOXICITY
Manufacturers naturally prefer to produce, and users prefer to purchase filters with
materials that are not toxic. At times, it is necessary to use less desirable toxic
materials in a design because they are the only ones that allow the filter to meet
the user's specifications. These materials can frequently be incorporated safely into
a design with no adverse effect on the user or the environment.
A good example of a toxic material that can be safely used and is quite valuable
from an optical point of view is thorium fluoride. This material is radioactive because
it contains thorium, an emitter of soft alpha particles. Optically, it is an excellent
material for thin film coatings as it has an optical transparency from the near
ultraviolet to the far-infrared (350 nm to 12 ,...m). In designing a coating that
incorporates thorium fluoride, some material other than thorium fluoride is generally
used as the outer layer. With a sufficient thickness of material over the thorium
fluoride, the thorium's alpha particles can be stopped before they leave the coating.
Thorium fluoride is perhaps one of the best toxic materials available because it is
easily detected. A Geiger counter with an appropriate window, or one of its more
modem counterparts, can easily detect the presence of the material, whereas most
other commonly used toxic materials require elaborate chemical analyses to deter-
mine their presence. Thus, one can easily check a coating for stray radiation, and
can check the area around a coating machine for residual thorium fluoride without
elaborate equipment.
Although a fairly large data base exists on the effects of various bulk materials
on the human body, there is very little information available on these and other
materials when they are in thin film form. Thus, one has to assume the worst case
situation for the materials one uses in fabricating thin films. This undoubtedly leads
to excessive caution in some instances to be on the safe side. Fortunately, the
quantity of materials involved in a coating is relatively small in terms of total mass
involved in a given filter.
Chapter 7
Future Prospects
The technology of fabricating optical thin films has been very dynamic over the
years, and the prospects for the future are of more exciting advances to be expected.
Many coating problems are being addressed in universities and industrial laboratories
alike. Also, new technological advances, some of which are fallout from the space
program, can be expected. In this section, we review a few of the current areas
that hold some promise of changing the state of the coating art and some of the
implications that these advances have for the users of these coatings.
The conditions under which a coating is deposited determine the quality of the thin
film coating. The surface mobility of the arriving species is usually an important
parameter in the physics of the deposition and nucleation process. At low temper-
atures, the arriving atom or molecule does not move very far from the initial point
of contact with the substrate before it loses its kinetic energy. If the substrate is
hot, the atom or molecule can migrate over a larger area before becoming immobile,
thus increasing its chances of finding a nucleation site with the lowest possible
energy state. Another important parameter in deposition physics is the kinetic energy
197
198 CHAPTER 7
of the arriving species: atoms with higher kinetic energy move about on the substrate
surface more than those that arrive at low speed with less energy. This explanation
accounts for some of the differences observed between sputtered and evaporated
films. Sputtering processes impart much more energy to each atom or molecule
that is knocked out of the target than do conventional evaporation processes in
which the evaporant has the energy associated with the evaporation temperature.
Unfortunately, sputtering processes frequently have a significantly lower deposition
rate than do evaporative ones for many oxide materials, and some materials are not
sputterable at all. Thus, a great deal of development effort is being expended to
understand better the deposition physics to get the best of both worlds: high quality
films formed at high deposition rates at low substrate temperatures.
In evaporative processes, the substrate is frequently heated to enhance the
surface mobility of the evaporant (Lyon, 1946). Higher temperatures in the chamber
can yield better, more durable, denser (higher index) films. Unfortunately, these
higher temperatures are costly in terms of energy consumption, process time to get
the substrate to the coating temperature and to cool it down again (without thermally
fracturing it), and coating chambers and equipment that will handle these temper-
atures. In addition, some substrates degrade at high temperatures. In particular,
most common organic (plastic) materials degrade at temperatures above 70° to
100°C. Some glass and metal precision optics may warp (on a submicrometer scale)
at temperatures that yield durable films.
One would like to have a method whereby the energy that depositing species
need to be able to move freely on the surface prior to becoming immobile is supplied
by a means other than heat. Several schemes have been proposed to accomplish
this. The most successful ones have involved the use of particle beams that flood
the substrate surface with low energy ions « 1000 eV, and frequently < 100 eV)
or neutral atoms. The energy of these atoms should not be so high that they cause
a loss of stoichiometry or other coating degradation. For example, titanium dioxide
films are particularly susceptible to a loss of some oxygen, which in turn makes
them absorbing in the visible and the UV portions of the spectrum. Finally, there
should not be a net electrical charge in the particles arriving at the surface, lest the
surface becomes charged and repels the activating beam.
The ideal beam source has a large flux of activating species with a low (by
ion gun technology standards) energy per atom or ion. The problem with today's
ion sources, such as many of those that have been developed under the auspices
of the NASA space program, is that the particle flux that can be drawn out of them
at low energies is limited. Thus a central theme in contemporary research on ion
sources for thin film deposition use is to find a way to achieve high currents at low
voltages. In particular, as Ohm's law applies, what is needed is a source with a
very low impedance so that a large current can be obtained at low voltages.
Research on sputtering sources is also proceeding apace. It has been recently
reported that magnesium fluoride has been successfully deposited with sputtering
equipment. This is a significant breakthrough as magnesium fluoride is a low index
material that is very useful in making wide band antireflection coatings in the visible
portion of the spectrum. Prior to this announcement, fused silica was the lowest
index material that was sputterable. The goal of sputter research is to enable the
FUTURE PROSPECTS 199
The processes used in the commercial manufacturing of optical thin films are
predominantly based on vacuum technology. The sources of the deposited species
are sputter targets or evaporation sources. Other technologies are now being de-
veloped that may play some role in the fabrication of the optical filters of the future.
One promising new coating technology consists of using organometallic com-
pounds as the source of the metallic ion. After the compound has been applied to
the surface of the substrate, the molecule is oxidized during a bake in an oxidizing
atmosphere. The oxidized hydrocarbon components are all volatile, consisting for
the most part of carbon dioxide and water. The metal ions form an oxide that
remains as a film on the substrate.
There are two basic forms of this process. In the sol-gel technique, the molecule
containing the metal ion is suspended in an organic solvent solution, whereas in
the other technique, the solution consists of the organometallic molecule dissolved
in an organic solvent. Either of these liquid solutions can be sprayed onto a substrate,
but the more common usage involves a dip process, wherein an immersed substrate
is withdrawn from the solution at a controlled rate. The thickness is determined by
a number of parameters, including viscosity, temperature, withdrawal rate, angle
of withdrawal, and surface tension of the solution.
The equipment required for the dip process is relatively simple when compared
with the capital investment required for an equivalent vacuum-coating process. On
the other hand, there is still a great deal of work ahead for the developers of this
technology. A major difficulty at present is the high level of stresses in the film
after baking.
There is a great deal to be gained in pursuing this technology. If the problems
can be overcome, the cost of coatings could decrease significantly, and thus open
new areas where thin film coatings might be used.
200 CHAPTER 7
Inhomogeneous films have been produced since the earliest days of the making of
optical thin films. For the most part, they have not been desirable as their index
profiles were unpredictable. In addition, with the exception of simple antireflection
coatings, there were few workable systems for designing complex filters with in-
homogeneous index layers incorporated into them.
Some recent breakthroughs have given inhomogeneous coatings new impor-
tance:
I. Recent improvements in computer algorithms have enabled the theorist to
calculate the complex inhomogeneous index profiles required for novel filters (Dob-
rowolski, 1986; Southwell, 1985).
2. The rate control of coating sources is far superior today than it was just a
few years ago.
3. Today's computers can evaluate the performance of a growing inhomoge-
neous film in real time. This enables the coating technician or system to monitor
the index profile as the film grows, and make adjustments or corrections as nec-
essary.
Inhomogeneous films have several advantages over discrete layers. The lack of
discrete interfaces between layers eliminates one of the weakest mechanical points
in a thin film stack, the interlayer boundaries. By eliminating these, the durability
of the coating should be improved. In addition, the elimination of the interface may
reduce some of the absorption in the coatings (see section 3.5.). This concept can
be extended to discrete layer designs by grading or blending the interfaces between
layers.
The use of a continuously variable index introduces additional degrees of
freedom for the thin film designer to use in the design process. With inhomogeneous
layer design techniques, it may become possible to design filters whose performances
are far superior than can be achieved with discrete homogeneous layers. These
advances may well be reflected by the emergence of inhomogeneous films in the
commercial marketplace.
7.4. CODEPOSITION
Thin films can be made by codepositing two materials with different refractive
indices. The index of the resulting deposit usually is intermediate between the two
indices of the initial materials, and the specific value depends on the the composition
of the coating. By varying the relative coating rates of the different sources, the
index can be adjusted from one limit to the other. Inhomogeneous films can be
obtained by varying the deposition rates according to a prescribed function of time
FUTURE PROSPECTS 201
or film thickness. This coating technique, being dynamic, requires good stability
of the coating sources and a monitoring system adequate to the task of ensuring
good control of the index profile.
Several problems must be overcome if a uniform index profile is to be obtained
over a substantial substrate area. In evaporation, the two simultaneously operating
sources cannot be located at precisely the same point, and different parts of the
coating plane or surface will get different ratios of the two coating materials. A
common technique to obtain homogeneous coevaporated films is to use two sep-
arated sources and rotate the substrate above them so that the substrate is exposed
alternately to one and then the other source's maximum coating flux. Although the
index profile has a high frequency modulation component, on the average, it closely
approximates the desired shape. If the theoretical profile must be matched even
more closely, then the evaporation rates of the two sources can be slowed to the
point where the substrates get coated with a monoatomic layer or less during each
revolution. Then, the two components will be very well intermixed. This latter
approach is necessary to coat a filter with a carefully controlled index profile over
a large area, if current technology is used. Thus, if coevaporation is to become
commercially viable, new deposition techniques require development.
The geometry of a sputtering system lends itself to different solutions to the
uniformity problem. One means of obtaining a mixed deposit is by sectioning the
target so that some portions are of one composition, whereas others are from the
second component. The ratio of the two areas determines the compositional ratio
of the deposit. A second approach is to move the substrate between two targets in
a manner similar to what is done in evaporation systems. The profile can be varied
by changing the coating rate, and this is easily accomplished in sputtering by simply
adjusting the power. It is not clear that an inhomogeneous film with an arbitrary
index profile can be deposited over large areas in a sputtering process. One exception
to this exists in reactive sputtering of pairs of materials in which there is a common
constituent that comes from the target, and the other component comes from a
variable gas mixture.
Some materials that may not be compatible in bulk form can be made to coexist
in a film form by codeposition. The basic effect is a solid state condensation taking
place at a relatively low temperature so that a chemical or a physical reaction cannot
take place. The two materials may exist in a metastable state for a long time as
energy is not available to overcome the potential barrier that prevents a reaction
between them. The atoms are frozen into place as they condense, and they do not
have the energy to undergo a phase separation. This approach to making new
materials has not yet resulted in many materials being manufactured in this way.
It is possible as technology develops and new requirements arise that materials of
this type may become economically viable. Cermets are one class that may benefit
from this type of technology.
Researchers are pushing the frontiers of optics to ever shorter wavelengths (Un-
derwood, 1986). Current research focuses on wavelengths in the 1 to 300 A range.
202 CHAPTER 7
As in conventional optics, these new spectral regions require high reflectors, an-
tireflection coatings, and bandpass filters. In the past, X-ray imaging involved the
use of mirrors at glancing angles of incidence. This approach limits the available
aperture, results in large aberrations in the image, and limits the resolution of the
system. At present, we are just beginning to understand how to design and construct
multilayers that can function efficiently at these extremely short wavelengths.
There are many problems associated with the making of coatings that function
in the extreme ultraviolet and the X-ray portion of the spectrum. The most severe
problem is that of finding materials that have appropriate optical constants. At these
wavelengths, most solid materials are absorbing, and the real parts of their refractive
indices are close to unity. In addition, the energy of the X-rays is such that the
entire electron cloud around an atom is involved in determining the optical response,
so that changes in the chemical composition have little effect on the refractive index.
Thus, the material choices are reduced to a consideration of the properties of the
elements. Design schemes are being developed that take advantage of these physical
constraints, or that work around them.
Another problem being addressed is that of making these filters. Some layers
may have to be as thin as 3 atomic layers to form a quarter wave thick interference
film. Monitoring such thin layers during the deposition process becomes crucial
and may involve the installation of X-ray sources in the coating chamber (Spiller,
1981). In addition, stability of the films to both diffusion and chemical attack may
be difficult to obtain.
Optical elements need to have surfaces that are smooth to a small fraction of
a wavelength of the light with which they will function. At far-UV and X-ray
wavelengths, the substrate surfaces must be far smoother than that needed for visual
optics. At least two current technologies are available that can produce surface with
the requisite low surface roughness. Semiconductor wafers have surface finishes in
the 3-A rms range, but unfortunately their surface figures are not generally good
enough for imaging work. Laser gyroscope mirror substrates are prepared with good
surface finishes as well as good figure control. The scatter is the coatings needs to
be improved, and this is one area of study that should prove fruitful for all spectral
ranges.
It is just a matter of time before production techniques for X-ray coatings will
no longer be state of the art and become routine and commonplace. The result will
be complex optical systems with multiple reflecting surfaces that yield quality
extreme ultraviolet and X-ray images.
Significant advances in the area of coating equipment has been taking place in the
past few years. Microprocessors have been added to coating chambers, and new
process monitors make interfacing them to the actual deposition process even sim-
pler. As a result, it is now possible to purchase a totally automated vacuum-coating
system.
FUTURE PROSPECTS 203
The state of the art has not yet progressed to the point where it is possible to
buy a turnkey system that is guaranteed to produce a particular coating, but these
will probably be available in a few years. The systems will be set up to manufacture
one specific coating design, and it will be difficult for the novice to alter the process
to coat successfully another type of design. The dedicated coating manufacturers
will continue in business, and their customers will continue to return to them for
most of their coating requests.
The area of thin film technology that will advance the field the most in the next
few years is undoubtedly materials science. Fundamental data in the thin film area
is still lacking at the most basic levels. As an example, Ennos' paper (1966) on
stresses is still the only readily available publication on the subject. The work was
performed 20 years ago!
It is necessary to undertake fundamental studies of the basic physical parameters
of matter in thin film form. Many of the physical properties of materials in thin
film form are unknown: stresses, thermal conductivity in both the film plane and
perpendicular to it, and Young's modulus and other mechanical constants. Even
the refractive index of most compounds is poorly known except in a few wavelength
regions. The advent of lasers, synchrotron light, and other light sources in unex-
plored portions of the spectrum will mean new requirements for coatings and coating
materials in these wavelength regions. It will be necessary to know the optical
constants of materials in these wavelength regions before adequate filters can be
designed and constructed.
The chemistry of thin films is not the same as that of bulk materials. When
the density of a material is 70 to 90 percent of that of the bulk, one can be assured
that there is a large surface area within the film. The effect of this on the chemistry
of the material is poorly known. Silver is a very good example of what can happen
to a material when it is in thin film form. In bulk form, silver is relatively inert,
save for the fonnation of the sulfide. In thin film fonn, it seems to participate in
many different reactions in the presence of moisture. Thus, this seems to be a fertile
field for study, and the results of these studies will be of great benefit to those
working in this field.
Appendix A
How to Specify
Optical Filters
By far the most important thing one must do when one specifies a filter's performance
is to determine one's absolute "needs" and to distinguish them from one's "wants"
or desires. The needs relate to the functional aspects without which the filter and
the rest of the optical system will not function properly. These needs do not nec-
essarily have to be optical in nature: the tolerance on the size of the filter or the
environmental parameters might be very important needs.
The wants, on the other hand, are additional features that add value to the
system but are not critical to its fundamental operation. A bandpass filter may be
adequate with a certain tolerance on its bandwidth, but the system's performance
might be significantly better if it were made narrower: this would be classified as
a want.
There are always gray areas that need to be resolved subjectively on an in-
dividual basis. Hopefully, these guesses are minor when compared with the total
number of decisions required in the system. Usually, more information or a better
understanding of the system in which the filter will be used can help to clear up
ambiguities.
Cost considerations are always of paramount importance in commercial pro-
curements. On the other hand, in high technology and military purchases, the
primary considerations are likely to be optical and environmental performance.
207
208 APPENDIX A
A number of United States Armed Forces specifications are used to qualify optical
coatings. An early specification, Mil-C-675, was specifically designed for single
layer antireflection coatings of magnesium fluoride on glass optical elements. In
fact, it even calls out the range of thicknesses the coatings can have. In addition,
however, it specified that the coated element should pass certain humidity, solubility,
abrasion, and adhesion tests (Table B.t).
These environmental tests have been applied to a much broader class of coatings
than originally intended by the authors of this specification.
Another specification, Mil-M-13508, was written specifically to deal with
aluminum mirror coatings, which are typically less durable than a hard magnesium
fluoride AR coating.
A third specification, Mil-STD-81O, covers material testing in general and is
not specific to optics. Some sections of this rather long document, however, codify
tests that are suitable for performing accelerated degradation tests on optical coat-
ings. Sections 507.2 ("cycled humidity") and 509.2 ("salt fog") are very rigorous
tests that cause degradation in all but the most durable coatings.
Specifications -675 and -13508 are now obsolete. These have been replaced
by three specifications that are more appropriate to the wide variety of modem
coatings. The new documents are
210
SELECTED UNITED STATES MILITARY SPECIFICATIONS 211
Adhesion
(tape) fast slow none none fast fast
Humidity
Method A
Temp (OC) 48.9 48.9 30-60 82-160 48.9 48.9
Temp (OF) 120 120 86-140 27.8-71.1 120 120
% ReI. Hum. 95-100 95-100 85-95 85-95 95-100 95-100
Hours 24 24 24(cycle) 240 24 24
Conditions Constant Constant Variable Variable Constant Constant
Method B
Temp (OC) 48.9
Temp (OF) 120
% ReI. Hum. 95-100
Hours 24
Conditions Constant
Method C
Temp (OC) 82-160
Temp (OF) 27.8-71.1
% Rei. Hum. 85-95
Hours 48
Conditions Variable
Solubility (hr)
Water 24(opt.) 24(opt.)
Saltwater 24 24(opt.) 24(opt.)
Shock
(dTldt) <5 min to <4°F/min <4°F/min
cover range
Room Tto
160, hold 4
hr, to -80,
hold 4 hr, to
160, hold 4
hr ("F)
Dust 28 hr in fine
sand in 2000
ftlmin
airstream
Fungus 28 days in a
mixed spore
suspension
given here were correct as of their release date. Revisions are designated by a suffix
letter, starting with the letter "A." Users should assure themselves that they are
referring to the latest edition of a specification, or know the changes that have been
made to a given edition.
Some of the newer specifications explicitly define the order in which the test
procedure is to be conducted on a coating sample. The change in procedure has
two significant implications: (1) the test is much more severe than that when the
same tests are run in parallel on separate substrates, and (2) the time that it takes
to perform all of the tests is much longer than when tests are run in parallel,
especially if there are some long duration humidity tests to be performed before
abrasion and adhesion tests.
In most tests, the criterion for passing the test is that after the test is complete
no degradation due to testing be observed. Any degradation visible under the
specified examination conditions indicates that the coating has failed the test.
214 APPENDIX B
Hll.-C-14S06A
Incl. Amendment 2
1 May 1974
SliPERSl:DINr.
tIlL-C-14806
27 Hay 1968
HILUARY SPl.CIFlCA1'ION
1. SCOPE
2. APPLlCAIlLE DOCIJI-ll.Nl"S
SPJ::CIFlCATIONS
Hilitary
STANDARDS
Kil1tary
FSC 6650
SELECTED UNITED STATES MILITARY SPECIFICATIONS 215
HIL-C-14806A
3. REQUIREMENTS
0- 1.5" 0.030"
1.5- 2.5" 0.040"
2.5 - 3.5" 0.050"
3.5 - 5.0" 0.060"
5.0 - 7.0" 0.100"
440-460 0.55
460-660 0.45
660-675 0.55
425-460 l.0
460-620 0.7
620-665 l.0
3.5 Light 10ss.- Within the vsvelength range 425 to 700 nanometers,
light loss (absorbance plus (+) diffuae reflectance) in the coating ahall
not exceed the following limits per surface unless otherwiae specified
(see 6.2):
Maximum average loaa 0.5%
Maximum absolute 10.. 2.0%
3.6 Coating gua1ity.- The coating shall be uniform in quality and
condition, clean, smooth, and free from foreiRn materials, and from physical
imperfections .nd optical imperfections sa follaws:
2
216 APPENDIX B
!lIL-C-1480bA
3.6.4 Unlesa otherwise Ipecified, the coating shall meet the followin~
scratch aDd dig requirementa. CoatiDi defects ahall be counted in addition
to those allowed by the aub.trate specification.
3.6.5 Pinholes in the coated surface shall not eKceed tvice the allowable
dig aize. Unles. othervile lpecified, pinhole distribution ahall be ignored.
3.11.) Dust.- A fine aand-laden air with. maximum velocity of 2000 feet
per minute for 28 hOllrB.
3.11.6 Fungus.- A mixed apore auspension for 28 days.
3
SELECTED UNITED STATES MILITARY SPECIFICATIONS 217
HIL-C-14S06A
4
218 APPENDIX B
KIL-C-14806A
Critical: lIone
4.3.2.1 Test samples.- Unleas otherwise specified (aee 6.2), two (2)
test witness pieces of a similar refractive index and aurface finish as the
parts to be coated and coated in the aame evaporation lot (aee 6.4),. as the
parta, ahall be subjected to each individual test of Table III. No two (2)
test witness pieces need be aubjected to more than one test. The test
wienas pieces shall be placed in the coating chamber such tha,t. they repr.sent
the whole evaporation lot.
4.3.2.2 Acceptance arut rejection.- Failure of any test ahall cauae the
evaporation lot to be rejected. Rejected lots ahall be screened for all
defective characteristics. Removal and correction of defective units and
raubmittance of rejected lots ahaU be in accordance with "Acceptance and
Rejection" as apecified in KIL-STD-10S.
TABLE III
Characteristic Reguirement Test Parasraph
201. Humidity ftBIt and 3.8 4.4.6, 4.4.3.1, 4.4.3.2
Abrasion 3.7 4.4.7, 4.4.3.1
202. Reflectance 3.4 4.4.4
203. Salt Fog 3.9 4.4.8, 4.4.3.1
204. Humidity "c" 3.10 4.4.9, 4.4.3.3
4.4 Teat _thuda and procadurea
KIL-C-14806A
4.4.2 Cemented and bonded surfaces.- Coated srea shall be Visually
examined to determine conformance to 3.3.
4.4.3.3 The coatings sball be evaluated as shown in Figure I-c for evidence
of cloudy or hazy appearance. Sucb evidence shall be cause for rejection.
6
220 APPENDIX B
MIL-C-14B06A
6. NOTES
7
SELECTED UNITED STATES MILITARY SPECIFICATIONS 221
MIL-C-14806A
6.5 Shipping lot. - A "shippine lot" shall consist of units manufactured
under essentially the same conditions and at approximately the Bame time.
Army - HU Army - HU
Navy - AS
Air Force - 11
Army - WC, KI
Navy - SII
Air Force - None
8
222 APPENDIX B
IIIL-C-14806A
e
e Tut I ~T.at
e
d _ t ' /Il_t
aurfacI quality for r ...
ltaDdard (1.1 fl.ctiDll.
Tut el_llt
(a" .Di:~ 1) e Surface Quality
Standard
lot. 2)
(a) (b)
r:--n..
IOTES:
2.
Icratch•• 011 the tut
d.ant ahall bl aUIllad paral-
lel to cho.. af che cDllpln1all
.ubc. quality .taDdlrd.
Tut d_llt
and hi...
, ..lilll. b1l1terl.... bum..bee.
el_to ahall 11.
cb.cked .1 chaut chI u•• af
'era tch lad 41& • taDdlrd••
(c)
,
fiGUU 1
SELECTED UNITED STATES MILITARY SPECIFICATIONS 223
MIL-C-48497 A
8 September 1980
SUPERSEDING
MIL-C-48497 (AR)
27 June 1974
MILITARY SPECIFICATION
1. SCOPE
2. APPLICABLE DOCUMENTS
SPECIFICATIONS
Federal
MIL-C-48497A
STANDARDS
Military
DRAWINGS
3. REQUIREMENTS
3.3.2 Cosmetic. When specified the coating shall conform to the cosmetic
requirements (stains, smears, discolorations, streaks, cloudiness, etc.)
stated on the component drawing or other documents.
3.3.3 Environmental and solubility blemishes. The coated surface shall
be free of blemishes such as stains, smears, discolorations, streaks, cloudi-
ness, etc., that would cause non-conformance to the coating's spectral
requirements as stated on the component drawing or other documents.
3.3.4 Spatter and holes. Coating spatter and holes in the coating
shall be considered as a dig and shall not exceed the allowable dig size
and quantity stated on the componet drawing or other documents.
2
SELECTED UNITED STATES MILITARY SPECIFICATIONS 225
MIL-C-48497A
3.3.5 Surface defects (scratch and dlg). Coating scratches and digs
shall not exceed the values specified for the substrate on the component
drawing or other documents. Coating scratches and digs shall be considered
separate from the substrate scratch and dig requirements.
A 5 .00020
B 10 .00039
C 20 .00079
D 40 .00157
E 60 .00236
F 80 .00315
G 120 .00472
3.3.5.2.2 Digs. The dig letter specifies the average diameter of the
dig in accordance with the following table:
A 0.05 .0020
B 0.10 .0039
C 0.20 .0079
0 0.30 .0118
E 0.40 .0158
F 0.50 .0197
G 0.70 .0276
H 1.00 0.394
3
226 APPENDIX B
MIL-C-48497A
The permissible number of maximum size digs shall not exceed one per each
20 millimeters of (.80 inches) diameter or fraction thereof on any single
coated surface. The sum of the diameters of all digs shall not exceed
twice the diameter of the maximum size specified by the dig letter per 20
millimeters of diameter.
3.4.2.1 Temperature.
The coated optical surface shall be exposed to
~emperatures of -80DF and +160 0 F for 2 hours at each temperature.The rate
of temperature change shall not exceed 40 F per minute. Subsequent to these
exposures, the coated optical surface shall meet the requirements of 3.3.1
and 3.4.1.1.
4
SELECTED UNITED STATES MILITARY SPECIFICATIONS 227
MIL-C-48497A
a. The witness piece shall have the same refractive index and absorption
coeffecient as the componets to be coated.
5
228 APPENDIX B
MIL-C-48497A
4.3.1.1 Inspection lot size. The inspection lot size shall consist of
all components or subassemblies (unit of product) coated within one (8 hour
or 10 hour) work shift.
6
SELECTED UNITED STATES MILITARY SPECIFICATIONS 229
MIL-C-48497A
MIL-C-48497A
8
SELECTED UNITED STATES MILITARY SPECIFICATIONS 231
MIL-C-48497A
9
232 APPENDIXB
MIL-C-4849iA
CO~1MERC IAL
FIXTURE CONTAINING
r---- TWO COOL WHITE lS-WATr FLUORESCENT
LAMPS (SEE NOTE l)
~-----l8" foIAX-----=---••
BLACK MATrE
~CKGRO\JND
TEST COMPONENT
FOR REFLECTION
(SEE NOTE 2) ---
NOTES:
1. THE ONLY ILLUMINATION IN THE TEST AREA SHALL
BE FROM THE LIGHT SOURCE USED FOR TEST.
2. TILT AT AN APPROPRIATE ANGLE TO SEE THE
COATED SURFACE.
FIGURE
10
SELECTED UNITED STATES MILITARY SPECIFICATIONS 233
MIL-C-4B497A
4.5.3.3 Moderate abrasion. Within one hour after the humidity test
of 4.5.3.2, the coated component or witness sample shall be subjected to a
moderate abrasion test. It shall consist of rubbing a minimum of SO strokes
across the surface in straight lines. The abrader shall be a 1/4" thick by
3/8" wide pad of clean dry, laundered cheesecloth conforming to CCC-C-440.
The bearing force shall be a minimum of 1 pound and shall be applied approxi-
mately normal to the coated surface. The actual test apparatus shall be the
Eraser Abrasion Coating Tester of Drawing 76B0606 except that the eraser
portion shall be completely covered with cheesecloth and the cheesecloth
shall be secured to the shaft of the tester with an elastic band. Subsequent
to this test, the coating shall be evaluated for conformance to 3.4.1.3.
Following the tests of 4.5.3.1, 4.5.3.2 and 4.5.3.3 the coated component or
witness sample shall be evaluated for conformance to the provisions of 4.5.6.
4.5.4 Thermal and cleaning durability. The witness samples shall with-
stand exposure to the follGwing test conditions:
11
234 APPENDIXB
MIL.C-48497A
MIL-C-48497A
6. NOTES
MIL-C-48497A
Commander
US Army Armament Research &Development Command
Ai"j'I: Dil.DAR-QAF
Deller, NJ 07801
6.4 Definitions.
6.4.1 Evaporation lot. An evaproation lot is defined as the group
of parts which has the coating applied at the same time and in the same
chamber.
6.4.2 Standard measurin e ui ment (5MB). Standard measuring
equipment is e in as the common measuring devices which are usually
stocked by commercial supply houses for ready supply (shelf items) and
which are normally used by an inspector to perform dimensional inspection
of items under procurement. This category also includes commercial testing
equipment such as meters, optical comparators, etc.
14
MIL-F-486l6
SUPPLEMENT 1
29 ·JULY 1977
MILITARY SPECIFICATION
Specification Sheets
Preparing activity:
Artily - MU
FSC-66S0
238 APPENDIX B
MI1-F-48616/100
29 JULy 1977
MILITARY SPECIFICATION SHEET
The complete requirements for procuring the low reflectance coating described
herein shall consist of this document and the latest issue of Specification
MI1-F-48616.
TABLE I
*For 'A2/'Al > 1.0 maximum average reflectance between Ai and 'A2
NOTES ON TABLE I:
1. The wavelengths Ai & 'A2 define the spectral region of interest.
FSC-6650
SELECTED UNITED STATES MILITARY SPECIFICATIONS 239
KIL-F-48616/100
Ordering Information:
Ordering Data:
Preparing activity:
Army - MlJ
2
240 APPENDIX B
MIL-F-48616/101
29 JULY 1977
The complete requirements for procuring the low reflectance coating described
herein shall consist of this document and the latest issue of Specification
MIL-F-48616.
3. The average reflectance shall not be greater than 3.07. per surface
over the 8.0 to 11.5 micrometer region.
4. The maximum reflectance at any point between 8.0 and 11.5 micrometers
shall not be greater than 5.0% per surface.
!!Ql!:
Ordering Data:
Not applicable.
Preparing activity:
Army-MU
Project No. 6650-0091-2
FSC-6650
SELECTED UNITED STATES MILITARY SPECIFICATIONS 241
2. The average reflectance shall not be greater than 0.3% per surface
over the 8.0 to 11.5 micrometer region.
3. The average reflectance shall not be greater than 0.9% surface over
the 7.5 to 8.0 micrometer region and 1.3% per surface over the 11.5 to
12.3 micrometer region.
!QI!:
Ordering Data:
Not applicable.
Preparing activity:
Army - MlJ
Project No. 6650-0091-3
242 APPENDIXB
MIL-F-486l6/200
29 JULy 1977
The complete requirements for procuring the first surface high reflectance
coating described herein shall consist of this document and the latest
issue of Specification MIL-F-486l6.
TABLE I
1 to 1.05 99 1
1.05 to 1.12 98 2
1.12 to 2 97 3
2 96 4
Ordering Data:
The wavelength region of interest (See 6.2m) (AI & A2) and the dash
number (See 6.2b) shall be specified by the procuring activity.
Preparing activity:
Army - MlJ
FSC-6650
SELECTED UNITED STATES MILITARY SPECIFICATIONS 243
MIL-F-486l6/30l
29 JULY 1977
MILITARY SPECIFICATION SHEET
The complete requirements for procuring the wide bandpass filter described
herein shall consist of this document and the latest issue of MIL-F-486l6.
Requirements for the wide bandpass filter (coated substrate) are given
in the follOWing paragraphs:
a. Less than 0.1% average from 1.0 to 7.0 micrometers and from 12.6
to 15.0 micrometers.
b. Less than 1.0% absolute from 1.0 to 7.0 micrometers and from 12.6
to 15.0 micrometers.
c. Less than 5% absolute from 7.0 to 7.5 micrometers and from 12.1 to
12.6 micrometers.
~:
FSC-6650
244 APPENDIX B
MIL-F-48616/301
Ordering Data:
Not applicable.
Preparing activity:
Army-MU
2
SELECTED UNITED STATES MILITARY SPECIFICATIONS 245
MIL-F-486l6/500
29 JULy 1977
MILITARY SPECIFICATION SHEET
The complete requirements for procuring the long wavelength pas~ filters
described herein shall consist of this document and the iatest issue of
MIL-F-486l6.
The follOWing figure illustrates the terms used for describing long
wavelength pass filters.
i ,_, I
-~
-- ~/- - -:- ' - + - ' . \ /_. Average
Transmittance
I j'
5%
AC ~l = 1.07A<;.
Wavelength
NOTES FOR FIGURE:
FSC-6650
246 APPENDIX B
KIL-F-486l6/500
TABLE I
1.18 to 1. 8 um 85% 4
1.1 to 1.8 um 1.8 to 3.0 um 80% 5
3.0 to 5.0 um 75% 6
2
SELECTED UNITED STATES MILITARY SPECIFICATIONS 247
MIL-F-486l6/500
Ordering Data:
At a minimum, the cut-on wavelength (See 6.2m) ( A ) and the longest wave-
length o~ the transmitting region (See 6.2m) (A )c and the dash number
(See 6.2b) shall be specified by the procuring ictivity.
Preparing actitity:
Army - MIJ
3
248 APPENDIX B
MIL-F-48616/600
29 JULY 1977
The complete requirements for procuring the short wavelength pass filters
described herein shall consist of this document and the latest issue of
MIL-F-4861"P.'
The following figure illustrates the terms used for describing short wave-
length pass filters.
%T
-. '--.'-"'~/
Average
Transmi t tance
I
YI
I
I
I
5'7. I
0.6). c 0.93 ~c " c 1. ~c
Wavelength
FSC-6650
MIL-r-48616/600
TABLE I
Ordering Data:
At a minimum the cut off wavelength (See 6.2m) ( AC ) and the dash number
(See 6.2b) shall be specified by the procuring activity.
Preparing activity:
Army - MU
250 APPENDIX B
HIL-F-48616
29 JULy 1977
MILITARY SPECIrlCA1'ION
This specification is approved for use by all Departments and Agencies of the
Department of Defense.
1. SCOPE
2. APPLICABLE DOCUMENTS
SPECIFICATIONS
Federal
Military
STANDARDS
FSC 66S0
SELECTED UNITED STATES MILITARY SPECIFICATIONS 251
KlL-F-48616
DRAWINGS
U. S. ~, Frankford Arlenal
3• REQUIREMENTS
2
252 APPENDIX B
MIL-F-48616
3
SELECTED UNITED STATES MILITARY SPECIFICATIONS 253
MIL-F-486l6
multiplied by the scratch width. These products are to be added and the
sum divided by the average diameter of the element. If a maximum scratch
is present, this resulting value shall not exceed 1/2 the maximum allowed
scratch width. If no maximum scratch is present, this value shall not
exceed the maximum allowed scratch width.
TABLE I
SCRATCH IDENTIFICATION
(See 6.3.1)
Oisre8ard Scratch
Scratch Letter scratch Width Widths less than
Millimeters ~ Mill imeters .ill!!!!.
.005 .00020 .0010 .00004
A .00010
B .010 .00039 .0025
C .020 .00079 .0050 .00020
.040 .00157 .0100 .00039
0
E .060 .00236 .0100 .00039
.080 .00315 .0200 .00079
F
G .120 .00472 .0200 .00079
4
254 APPENDIX B
KIL-F-486l6
tABLE II
DIG IDENtIFICAtION
(See 6.3.1)
Disregard Digs
AveraBe Dig Diameter Su11er than
Dig Letter Millimeters ~ Millimeters Inches
Diameter or Maximum
Diagonal Dimension of Maximum Width of
Optical Element Uncoated Area
Up to 2" 0.040"
Greater than 2" 0.040" pluS additional
width of 0.015" for each
inch in diagonal greater
than 2"
or or
Up to 5CM 1MM
Greater than 5CM lMM plus additional width
increasing at the rate of
0.15MM far uch CM over
5CM
tooling marks are measured perpendicular from the edge of the components.
In those instances where the clear aperture is specified, areas outside the
clear aperture may be coated at the discretion of the contractor.
5
SELECTED UNITED STATES MILITARY SPECIFICATIONS 255
MlL-F-48616
6
256 APPENDIX B
KIL-F-48616
MIL-F-486l6
and procedures as used in regular production. All parts and materials
including packaging shall be obtained from the same source of supply as
used in regular production.
4.3.1.1 Inspection lot size.- The inspection lot size shall consist
of all components or subassemblies (unit of product) coated within one
(8 through 12 hour) work shift.
NOTE: Each evaporation lot (coated components and witness pieces) form-
ing a part of a moving inspection lot shall be identified for sub-
sequent evaluation, if required.
8
258 APPENDIX B
MIL-F-486l6
~: ~L 0.651 DEFECTIVE
NOTE: The inspection for the Characteristics in Tsble III shall be conducted
- - at a temperature between ~Oo and -+90oF (l6 oC and 32 oC).
9
SELECTED UNITED STATES MILITARY SPECIFICATIONS 259
MIL-F-48616
4.3.2.3 Acceptance and rejection.- Rejected lots shall be screen-
ed for all defective characteristics. Removal of defective units and
resubmittal of rejected lota ahall be in accordance with "Acceptance
and Rejection" as specified in MIL-STD-I05.
10
260 APPENDIX B
KlL-F-48616
11
SELECTED UNITED STATES MILITARY SPECIFICATIONS 261
MIL-F-48616
c. Test conditions.
12
262 APPENDIXB
HIL-F-48616
13
SELECTED UNITED STATES MILITARY SPECIFICATIONS 263
MIL-P-48616
14
264 APPENDIX B
MIL-F-48616
coated component, or witness piece, shall be removed from the test chamber,
cleaned (See 4.6.1), dried, and then subjected to the examinations specified
in 4.6.7.1 and 4.6.7.3. The coating shall conform to the requirements of
3.4.2.1.2. The coated component, or witness piece, shall then be subjected
to the test specified in 4.6.8.3.
15
SELECTED UNITED STATES MILITARY SPECIFICATIONS 265
mL-F-486l6
16
266 APPENDIX B
MIL-F-48616
5. PACKAGING
6. NOTES
17
SELECTED UNITED STATES MILITARY SPECIFICATIONS 267
MIL-F-48616
6.3 Definitions.
18
* standards evaluated either in a vacuum or in
268 APPENDIX 8
MIL-F-48616
19
}!IL-F-48616
f. Test conditions:
g. l~rapping tissue:
20
270 APPENDIX B
KIL-F-48616
BLACK KArrE
BACKGROUND
~,-----
SEE JIOTE 2
NOTES
FIGURE 1
21
Appendix C
Since Berning's landmark work and review (1963) on the mathematics of thin film
filter performance calculations, there have been many computer programs written
to carry out the numerical drudgery. Baumeister (1986) has recently published an
overview of currently commercially available software packages that perform these
calculations. DeBell published a review of calculational algorithms in 1978. The
majority of the modern programs use the matrix formulation as their mathematical
basis.
Liddell (1981) published a monograph on computer-aided thin film design
calculations. She includes a listing of a FORTRAN program that evaluates the
performance of a given design.
This Appendix includes a listing of a computer program written in the BASIC
language for calculating the transmission, reflection, and absorption of a thin film
design. It is compatible with both the mM PC and the Apple Macintosh classes of
computers. The comments in the listing explain the functioning of the program.
271
~
~ REM Program name THIN FILMS by S.P. Fisher
REM film coatings at a given wavelength:
REM reflection (R),
REM transmission (T),
REM phase shift upon reflection (rho),
REM and phase shift upon transmission (tau).
REM It uses the matrix computational method outlined by Peter H. Berning
REM in IIPhysics of Thin Films" Vol. 1, p.87-92, Academic Press, 1966.
REM
REM This program is intended to be a starting point for more generalized
REM cases of thin film coatings that would add absorption in each film and
REM oblique angles of incidence.
REM
REM Below is an outline of the THIN FILMS program and the variables used in each step
REM
REM 1. Data entry
REM 1.1 Set constant(s), (pi)
REM 1.2 Enter the index of the incident medium, (No)
REM 1.3 Enter the index and physical thickness of each layer of thin film, (Nx,Hx)
REM 1.4 Enter the complex index of substrate, (index=Ns + jKs)
REM 1.5 Enter the wavelength range and increment, (wv11,wv12,inc)
REM 1.6 Print all the input data to system printer for verification.
REM
REM Repeat steps 2 through 6 for each incremental wavelength throughout
REM the wavelength range of interest.
REM
REM 2. Calculate the characteristic matrix for the thin film stack
REM 2.1 Initialize the characteristic matrix.
REM 2.2 Find the characteristic matrix for each layer, (Y)
Note: Matrix notation and definition is as follows:
REM
REM I Yl+jY2 Y3+jY41 cosO (j INx) sinO 1
REM Y =I 1= I
REM I Y5+ jY6 Y7+jYSI (j*Nx) sinO cosO I
REM
REM where 0 2*pi*Nx*Hxlwavelength
REM
REM 2.3 Multiply the individual layer matrices to
REM obtain the characteristic matrix for the stack, (M)
REM
REM M [Y(layerl)]*[Y(layer2)]* ... * [Y(layer L)]
REM
REM
REM
REM 3. Calculate the reflected and transmitted electric field amplitudes, (Eo and Ho)
REM I Eo I 11 I
REM I I = [M] *1 1
REM I Ho I I Ns I
REM
REM
N
~
Col
N
~ REM 4. Calculate the reflection (R), the transmission (T), the phase shift upon
REM reflection (rho), and the phase shift upon transmission (tau) for the thin film
REM stack
REM I Eo - (HolNo) \**2 4 Ns
REM R = I --------- I T =
REM
I Eo + (HolNo) I No*IEo + (HolNo) 1**2
REM
REM Eo - (HolNo) 1
REM rho = arg , ------------ tau arg
REM Eo + (HolNo) Eo + (HolNo)
REM
REM
REM 5. Determine the correct quadrant for rho and tau.
REM
REM 6. Print out R,T,A,rho, and tau.
REM
IF N(L) =0 THEN GOTO Substrate
PRINT "Enter the physical thickness of layer";L
INPUT "h=?", h (L)
L=L+l
GOTO Layers
Substrate:
L=L-l
IF L=O THEN PRINT "No film entered. The calculation will be for the uncoated
surface. "
INPUT "NS=?", Ns
PRINT "Enter the substrate absorption, e. g. glass=O.O"
INPUT "Ks=?", Ks
PRINT "Enter the beginning wavelength, the ending wavelength, and the wavelength
increment. "
INPUT "wvll =?, wvl2 =?, wvlinc=?", wvll, wvl2, wvlinc
LPRINT "COMMENTS"
LPRINT" ";comments$
LPRINT
LPRINT "INPUT PARAMETERS"
LPRINT USING" Incident index: No=###.###";No
FOR i=l TO L
LPRINT USING" Layer###, index: N =###.### Phys.Thk:h=###.####";i,N(i),
NEXTi
LPRINT USING" Substrate index: Ns=###. ### Ks=###. ####";Ns,Ks
Sl LPRINT
Ks= -Ks
I\)
REM 2. Calculate the characteristic matrix for the thin film stack.
REM Initialize the characteristic matrix.
MI=I
M2=O
M3=O
M4=O
M5=O
M6=O
M7=1
M8=O
FORi=1 TO L
REM X is set equal to M before finding the matrix for each layer, then X is used
REM to find the new product of M times Y for i number of layers.
XI=MI
X2=M2
X3=M3
X4=M4
X5=M5
X6=M6
X7=M7
X8=M8
YI =COS (Phi)
Y7=YI
temp=SIN (Phi)
Y4 = templN ( i )
Y6 = temp*N (i)
REM These are zero because the films are not absorbing.
Y2=O
Y3=O
Ys=o
Y8=O
REM Calculate the product of the characteristic matrices for each layer
MI = Xl *YI- X4*Y6
M2 =X2*YI +X3*Y6
M3 =X3*Y7 -X2*Y4
M4 = Xl *y 4 + X4 *Y7
MS =XS*YI-X8*Y6
M6 =X6*YI + X7*Y6
M7 =X7*Y7 -X6*Y4
M8 = XS *y4 + X8 *Y7
NEXTi
REM 3. Calculate the reflected and transmitted electric field amplitudes, Eo and Ho
N
~ REM crl,cr2,ctl, and ct2 are complex components resulting from complex division
nl =Eo1-HollNo
n2 =Eo2 -Ho2lNo
dl =Eol + Ho1INo
d2 =Eo2 + Ho2INo
dsqr = dl1\2 + d21\2
ctl == dl /dsqr
ct2 = - d2/dsqr
R= (crlI\2+cr21\2) *100
T= (4*Ns/(No*dsqr» *100
quad=l
IF crl<O THEN IF cr2<0 THEN quad=3 ELSE quad=2 ELSE IF cr2<0 THEN quad=4
IF quad=2 OR quad=3 THEN rho=rho+180
quad = 1
IF ct1<O THEN IF ct2<0 THEN quad=3 ELSE quad=2 ELSE IF ct2<0 THEN quad =4
IF wvl =wvll THEN LPRINT" wvl Refl rho Trans tau"
LPRINT USING"#####. ### ###. #### ###. ## ###. #### ###. ##"; wvl, R, rho, T, tau
PRINT
NEXT wvl
LPRINT
LPRINT
LPRINT
PRINT "Program ended. "
END
N
~
REFERENCES
An excellent bibliography on thin film technology is given at the end of the chapter
written by Dobrowalski on optical filters in the Optical Society of America's Optics
Handbook (Driscoll and Vaughan, 1978).
281
282 REFERENCES
Austin, R. (1970). Narrow band interference light filter. United States Patent #3,528,726,
September 15.
Baker, Martin L., and Victor L. Yen (1967). Effects of the variation of angle of incidence
and temperature on infrared filter characteristics. Appl. Opt .. 6(8):1343.
Ballik, E. A. (1971). Area and wavelength sensitivity of a photomultiplier. Appl. Opt.,
10(3):689.
Bartell, F. 0., E. L. Dereniak, and W. L. Wolfe (1980). The theory and measurement of
bidirectional reflectance distribution function (BRDF) and bidirectional transmittance
distribution function (BTDF). In Radiation Scattering in Optical Systems. Proceedings
of the SPIE, vol. 257, SPIE, Bellingham, Wash.
Bartolomei, Leroy A. (1976). Striped dichroic filter with butted stripes and dual lift-off
method for making same. U.S. Patent #3,981,568, September 21.
Baumeister, Philip (1981). Theory of rejection filters with ultranarrow bandwidths. J. Opt.
Soc. Am., 71(5):604.
Baumeister, Philip (1986). Computer software for optical coatings. Photonics Spectra, p.
76, July.
Beauchamp, W. T. (1986). Critical issues for coating on large high power laser components.
In Optical Component Specifications for Laser-Based Systems and Other Modern Op-
tical Systems. Proceedings of the SPIE, vol. 607, SPIE, Bellingham, Wash.
Bell, Alan E., and Fred W. Spong (1978). Antireflection structures for optical recording.
IEEE Journal of Quantum Electronics. QEI4(7):488.
Benjamin, P., and C. Weaver (1959). Adhesion of metal films to glass. Proc. Roy. Soc. A,
254:177.
Benjamin, P., and C. Weaver (1961). The adhesion of evaporated metal films on glass.
Proc. Roy. Soc. A, 261:516.
Bennett, H. E. (1978). Scattering characteristics of optical materials. Opt. Eng. 17(5):480.
Berning, P. H. (1963). Theory and calculations of optical thin films. In Hass, G.,
ed.: Physics of Thin Films. vol. 1. Academic Press, New York and London, pp.
69-121.
Birth, G. S., and D. P. DeWitt (1971). Further comments on the areal sensitivity of end-
on photomultipliers. Appl. Opt .. 10(3):687.
Born, Max, and Emil Wolf (1970). Principles of Optics. 4 ed. Pergamon Press, Oxford.
Buckmelter,1. R., T. T. Saito, R. Esposito, L. P. Mott, and R. Strandlund (1975). Dielectric
coated diamond turned mirrors. In Laser Induced Damage in Optical Materials. Na-
tional Bureau of Standards Special Publication 435.
C. I. E. (1978). Supplement No.2 to C. l. E. Publication No. 15 (1971), Bureau Central
de la C. I. E., Paris.
Camiglia, C. K. (1979). Scalar scattering theory for multilayer optical coatings. Opt. Eng.,
18(2):104.
Camiglia, C. K., and Joseph H. Apfel (1980). Maximum reflectance of multilayer dielectric
mirrors in the presence of slight absorption. J. Opt. Soc. Am., 70(5):523.
Clarke, D., and J. F. Grainger (1971). Polarized Light and Optical Measurement. Pergamon
Press, Oxford.
Cox, J. T., and G. Hass (1958). Anti-reflection coatings for germanium and silicon in the
infrared. J. Opt. Soc. Am .• 48(10):677.
Cox, J. T., J. E. Waylonis, and W. R. Hunter (1959). Optical properties of zinc sulfide in
the vacuum ultraviolet. J. Opt. Soc. Am., 49(8):807.
Crabb, R. L. (1972). Evaluation of cerium stablized micro sheet covers lips for higher solar
cell outputs. Conference Records of the Ninth IEEE Photovoltaic Specialists Confer-
ence.
REFERENCES 283
DeBell, G. W. (1978). Computational methods for optical thin films. In Optical Coatings
Applications and Utilization II. Proceedings of the SPIE, vol. 140, SPIE, Bellingham,
Wash.
Demichelis, F., E. Mezzetti-Minetti, L. Tallone, and E. Tresso (1984). Optimization of
optical parameters and electric field distribution in multilayers. Appl. Opt., 23(1):165.
Dept. of Defense (1962). Mil-HNDBK-141. Defense Supply Agency, Washington, D. C.
Dirks, A. G., and H. J. Leamy (1977). Columnar microstructure in vapor-deposited thin
films. Thin Solid Films, 47:219.
Dobrowolski, J. A. (1986). Comparison of the Fourier transform and flip-flop thin-film
synthesis methods. Appl. Opt., 25(12):1966.
Donovan, T. M., P. A. Temple, Shiu-Chin Wu, and T. A. Tombrello (1980). The relative
importance of interface and volume absorption by water in evaporated films. In Bennett,
H. E., A. J. Glass, A. H. Guenther, and B. E. Newnam, eds.: lAser Induced Damage
in Optical Materials, 1979. National Bureau of Standards Special Publication no. 568,
Washington, D. C.
Driscoll, Walter G., and William Vaughan, eds. (1978). Handbook 0/ Optics. McGraw-
Hill, New York.
Edwards, D. K., J. T. Gier, K. E. Nelson, and R. D. Roddick (1961). Integrating sphere
for imperfectly diffuse samples. J. Opt. Soc. Am., 51(11):1279.
Ennos, Anthony, E. (1966). Stresses developed in optical film coatings. Appl. Opt., 5(1):51.
Epstein, L. Ivan (1952). The design of optical filters. J. Opt. Soc. Am., 42(11):806.
Giang, R., R. A. Holmwood, and R. L. Rosenfeld (1965). Determination of stress in films
on single crystalline silicon substrates. Rev. Sci. Instr. 36, no. I, p. 7 (Jan.).
Gee, John R., Ian J. Hodghinson, and H. Angus Macleod (1985). Moisture-dependent
anisotropic effects in optical coatings. Appl. Opt., 24(19):3188.
Guenther, K. H. (1981). Nodular defects in dielectric mUltilayer and thick single layers.
Appl. Opt., 20(6):1034.
Guenther, K. H., and H. Enssle (1986). Ultrasonic precision cleaning of optical components
prior to and after vacuum coating. In Conference on Thin Film Technologies. Pro-
ceedings of the SPIE, vol. 652, SPIE, Bellingham, Wash.
Hahn, R. E., and B. O. Seraphin (1978). Spectrally selective surfaces for photothermal solar
energy conversion. In Hass, Georg, and Maurice H. Francombe, eds.: Physics o/Thin
Films. Academic Press, New York.
Haisma, Jan, Jan H. T. Pasman, Johan M. M. Pasmans, and Pieter van der Werf (1985).
Wide-spectrum tint-free reflection reduction of viewing screens. Appl. Opt., 24(16):2679.
Harding, G. L., B. Window, D. R. McKenzie, A. R. Collins, and C. M. Horwitz (1979).
Cylindrical magnetron sputtering system for coating solar selective surfaces onto batches
of tubes. J. Vac. Sci. Technol., 16(6):2105.
Harrick, N. J. (1967). Internal Reflection Spectroscopy. Interscience-Wiley, New York.
Hass, G., and J. B. Ramsey (1969). Vacuum deposition of dielectric and semiconductor
films by a CO 2 laser. Appl. Opt .. 8(6): 1115.
Heavens, O. S. (1950). Some factors influencing the adhesion of films produced by vacuum
evaporation. J. Phys. Rad., 11:355.
Heavens, O. S. (1965). Optical Properties o/Thin Solid Films. Dover, New York.
Herpin, Andre (1947). Calcul du pouvoir reflecteur d'un systeme stratifie quelconque. Comptes
Rendus, 225:182.
Hill, Russell J., ed. (1976). Physical Vapor Deposition. Temescal, Berkeley, Calif.
Holland, L. (1956). Vacuum Deposition a/Thin Films. Chapman & Hall, London.
IIIsley, Rolf F., Alfred 1. Thelen, and Joseph H. Apfel (1969). Circular variable filter. United
States Patent #3,442,572, May 6.
284 REFERENCES
Jackson, John David (1962). Classical Electrodynamics. John Wiley & Sons, New York.
Jacobs, Carol (1981). Dielectric square bandpass design. Appl. Opt., 20(6):1039.
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Index
coating temperature, 31, 32, 38, 39, 44, heat mirrors, 121
45 Herpin index, 95, 101
coating time, 32 Herpin layer, 95
codeposition, 200, 201 Herpin thickness, 95
coherence length, 10, 11 high power coatings, 133, 134
cohesion, 46 high reflector, 86-99, 171
cold mirrors, 121 high reflector, metallic, 66
color, 79-81, 134, 171, 178, 180 hot mirrors, 121
color correction, 134 humidity, 167, 168
colorimetry, 155-158 humidity testing, 161, 162
conductive coatings, 129-132
corrosion, 75
incidence direction, 13, 54
cosmetic inspection, 163, 170
critical angle, 17 incident medium index effect, 147
inclusions, 173
cryostat, 153, 154
indentation tests, 164
crystal monitor, 35, 36
index of refraction, 4, 6, 13
cycled testing, 165
index of refraction, variable, 134, 135
induced absorbers, 98, 126-130
dark mirrors, 126-129 inhomogeneous films, 200, 201
decomposition, 33 inspection lot size, 181
diamond turning, 32, 185, 189, 190 integration sphere, 146
dichroic filters, 121 intensity addition, 60
dielectric function, 4 interdiffusion, 168, 169
dielectric reflectors, 91-96 interference, 2, 5, 10
digs, 170 ion beam processes, 197-199
dip coating processes, 199, 200 island films, 194, 195
discoloration, 171 110 coatings, 129, 131, 132, 135
distribution, 41, 42
drying, 50
jigging, 43, 44, 171, 183, 184
edge filters, 99-103
effective index, 20 laser coatings, 133, 134
electric field standing waves, 54, 63-70, learning curve, 39
88, 92, 97, 111
electroless processes, 31 magnetron sputtering, 29
electroplating, 31 materials research, 203
emissivity, 38 mean free path, 28, 33
enhanced metalIic reflectors, 96-99 measurement cone, 149-151
eraser test, 161 metal films, 194, 195
evanescent waves, 18 metal reflectors, 86-91, 171, 176
evaporation, flash, 30 microscope, 178-181
evaporation, vacuum, 24-26, 39-41 microscope objectives, 180
expansion coefficient, 187 microscopy, dark field, 181
extinction coefficient, 4 microscopy, Nomarski, 181
microscopy. phase contrast, 181
Fabry-Perot filter, 67, 68, 70, 104-108, mil specs, 166, 167, 210-270
110, ll2, 168 mildew, 170
filter specifications, 207-209 mold, 170
filters in series, 60 multiple surfaces, 145-147
fungus, 170
nonplanar surfaces, 152, 153
glass lamination, 190 nonvacuum processes, 199, 200
glass tempering, 190, 191 notch filters, 130
INDEX 289