AN27701 Hall Effect IC Application Guide PDF
AN27701 Hall Effect IC Application Guide PDF
AN27701 Hall Effect IC Application Guide PDF
Allegro™ MicroSystems uses the latest integrated circuit Sensitive Circuits for Rugged Service
technology in combination with the century-old Hall The Hall-effect sensor IC is virtually immune to environ-
effect to produce Hall-effect ICs. These are contactless, mental contaminants and is suitable for use under severe
magnetically activated switches and sensor ICs with the service conditions. The circuit is very sensitive and provides
potential to simplify and improve electrical and mechanical reliable, repetitive operation in close-tolerance applications.
systems.
Applications
Low-Cost Simplified Switching Applications for Hall-effect ICs include use in ignition sys-
Simplified switching is a Hall sensor IC strong point. Hall- tems, speed controls, security systems, alignment controls,
effect IC switches combine Hall voltage generators, signal micrometers, mechanical limit switches, computers, print-
amplifiers, Schmitt trigger circuits, and transistor output cir- ers, disk drives, keyboards, machine tools, key switches,
cuits on a single integrated circuit chip. The output is clean, and pushbutton switches. They are also used as tachometer
fast, and switched without bounce (an inherent problem with pickups, current limit switches, position detectors, selec-
mechanical switches). A Hall-effect switch typically oper- tor switches, current sensors, linear potentiometers, rotary
ates at up to a 100 kHz repetition rate, and costs less than encoders, and brushless DC motor commutators.
many common electromechanical switches.
The Hall Effect: How Does It Work?
Efficient, Effective, Low-Cost Linear Sensor ICs The basic Hall element is a small sheet of semiconductor
The linear Hall-effect sensor IC detects the motion, position, material, referred to as the Hall element, or active area,
or change in field strength of an electromagnet, a perma- represented in figure 1.
nent magnet, or a ferromagnetic material with an applied A constant voltage source, as shown in figure 2, forces a
magnetic bias. Energy consumption is very low. The output
is linear and temperature-stable. The sensor IC frequency
response is flat up to approximately 25 kHz.
A Hall-effect sensor IC is more efficient and effective than
inductive or optoelectronic sensors, and at a lower cost. +VCC
+VHALL
–VHALL
Abbreviated Contents
Low-Cost Simplified Switching 1
Getting Started 6
Ring Magnets Detailed Discussion 16
Ferrous Vane Rotary Activators 20
Enhancement Considerations 26
Advanced Applications 40 Figure 1. Schematic representation of the active area of a Hall-effect
device, with the Hall element represented by the component marked
Glossary 44
with an X.
IBIAS IBIAS
0 0
– + VHALL ≈ 0 V – + VHALL → V+
Figure 2. VHALL in the absence of a significant magnetic field Figure 3. Hall effect, induced VHALL, resulting from significant magnetic
flux (green arrows) perpendicular to the bias current flow.
Operation
All Hall-effect devices are activated by a magnetic field. A mount
for the devices and electrical connections must be provided. Reg.
VCC
Parameters such as load current, environmental conditions, and
supply voltage must fall within the specific limits shown in the Output
datasheet.
Magnetic fields have two important characteristics: magnetic
flux density, B (essentially, field strength), and magnetic field
polarity (north or south). For Hall devices, orientation of the field
relative to the device active area also is important. The active Ground
area (Hall element) of Hall devices is embedded on a silicon chip Figure 7. Common circuit elements for Hall switches
Active area
S
N
n S S
tio N
Mo N
n n
tio tio
Mo Mo Sensitive Edge:
Left Side – Not Shown
3D Hall Device
N
S
N
S N
S
S
S N
N
S
N
Operate Operate
Point, BOP Point, BOP
6 6
Release
Point, BRP
3 3
On On
0 0
0 100 200 300 400 500 600 0 100 200 300 400 500 600
Magnetic Flux Density, B (G) Magnetic Flux Density, B (G)
Figure 9. Transfer characteristics of a Hall switch being activated Figure 10. Transfer characteristics of a Hall switch being deactivated
(switched on) by the increase in magnetic flux density from an (switched off) by the decrease in magnetic flux density from an receding
approaching south pole south pole
VCC
RPU
Reg.
Output
V
VOUT ≈ 0 V
Ground
1000 S S
N N
Magnetic Flux Density, B (G)
n n
tio tio
800 Mo Mo
Ø5.4 mm Ø5.4 mm
4.8 mm TEAG 4.8 mm TEAG
600
400
N S N S
200
G G
TEA TEA
S S
N N
1000
Mo Mo
D tio D tio
Magnetic Flux Density, B (G)
n n
800
Ø5.4 mm Ø5.4 mm
4.8 mm TEAG 4.8 mm TEAG
600
400
N S N S
200
G G
TEA TEA
S S
N N
1000
Mo Mo
D tio D tio
Magnetic Flux Density, B (G)
n n
800
Ø5.4 mm Ø5.4 mm
4.8 mm TEAG 4.8 mm TEAG
600
(A)TEAG = 1.3 mm
400
N S N S
200
(B)TEAG = 2.5 mm
VCC Output
Common
10 kΩ 47 kΩ
TTL CMOS
Output
Output
Common
Common
Figure 18A. TTL logic interface Figure 18B. CMOS logic interface
560 Ω 56 Ω
1 kΩ Q2
Q1
Output Output
Common Common
Figure 19. Example of small (≤20 mA) sinking current load being driven Figure 20. Example of driving a moderate (>20 mA) sinking current load
directly
VCC = +12 V
115 VAC
4.7 kΩ
1.2 kΩ
Load
Output
40 mA
Common
Figure 21. Example of a relay-driving application, sourcing current in the Hall device off-state
Motion
Motion
Magnets
Magnet
Figure 22. Typical configurations for rotors: (A) magnetic, and (B) ferrous vane
Alnico is a name given to a number of aluminum-nickel-cobalt The rubber and plastic barium-ferrite ring magnets are roughly
alloys that have a fairly wide range of magnetic properties. In comparable to Ceramic 1 in cost, flux density, and temperature
general, Alnico ring magnets have the highest flux densities, the coefficient, but are soft enough to shape using conventional
smallest changes in field strength with changes in temperature, methods. It is also possible to mold or press them onto a shaft for
Physical
Models
A B
N Schematic
N
Views S
S
S
S
N
Figure 23. Common ring magnet types: (A) radial, and (B) axial; the
schematic views are used in alignment diagrams later in this text
1000
Magnetic Flux Density, B (G)
800 N
S S
600
400 180° 0°
N
200 S S
0 N
-200
TEAG =
-400 1.7 mm
-600
-800 25.4 mm
-1000
0 90 180 270 360
Magnet Rotation (degrees) Ceramic, 4 Pole-Pairs
Axial Poles
Figure 24. Magnetic flux characteristic of a ring magnet
400
N S NS N S N
NS
Magnetic Flux Density, B (G)
S
S N
N
SN S S
N S NS
300
Package
S S
SN
N
contribution
SN
N
N
200 N
S
SN
SN S N S
5.1 mm TEAG
100
3.2 mm
0 25.4 mm
0 1.3 2.5 3.8
Total Effective Air Gap, TEAG (mm) Plastic 1, 20 Pole-Pairs
Radial Poles
Figure 25. Demonstration of the effect of narrow pole pitch on magnetic signal strength
7.5 BOP
B BHYS(min) Minimum ∆B
–7.5 BRP
VOUT Minimum ∆B
Magnetic Flux Density, B (G)
45 BOP(max)
BHYS(min) Unipolar mode unit
30 BRP(max)
7.5 BOP
BHYS(min) Latch mode unit
–7.5 BRP
–25 BOP(min)
BHYS(min) Negative unipolar mode unit
–40 BRP(min)
Figure 26A. Demonstration of possible switchpoint ranges for a bipolar switch, for use with low magnetic flux amplitude, narrow pitch
alternating pole targets
150 BOP(max)
–150 BRP(min)
VOUT
Figure 27. Demonstration of rubber magnet stock layout for inexpensive Figure 28. Demonstration of nylon bushing for inexpensive ring magnet
ring magnet
Figure 29. Demonstration of assembled inexpensive ring magnet Figure 30. Demonstration of adjustment of ring magnet to 180° on and
180° off
400
S N S N
Magnetic Flux Density, B (G)
S
S N
N
300
S
N
N
S
S
200 N N
S N S
5.1 mm TEAG
100
3.2 mm
0 25.4 mm
0 1.3 2.5 3.8
Total Effective Air Gap, TEAG (mm) Plastic 1, 10 Pole-Pairs
Radial Poles
Figure 31. Example of magnetic flux density versus air gap for Plastic 1 ring magnet
400
Magnetic Flux Density, B (G)
300
N
200
TEAG
100
5.1 mm
3.2 mm
0 19.1 mm
0 1.3 2.5 3.8
Total Effective Air Gap, TEAG (mm) Alinco 8, 1 Pole-Pair
Axial Poles
Figure 32. Example of magnetic flux density versus air gap for Alinco 8 ring magnet
S N
400
Magnetic Flux Density, B (G)
300
S
200
S N
100 6.4 mm TEAG
0 19.1 mm
0 1.3 2.5 3.8 44.5 mm
Total Effective Air Gap, TEAG (mm) Ceramic 1, 3 Pole-Pairs
Radial Poles
Figure 33. Example of magnetic flux density versus air gap for Ceramic 1 ring magnet
400
Magnetic Flux Density, B (G)
S
N
N
300
With flux
S
concentrator
N
200 S
Without flux
concentrator 6.4 mm TEAG
100
Concentrator
6.4 mm Ø3.2 mm
0 19.1 mm L = 6.4 mm
0 1.3 2.5 3.8
Total Effective Air Gap, TEAG (mm) Ceramic 1, 4 Pole-Pairs
Radial Poles
Figure 34. Example of magnetic flux density versus air gap for Ceramic 1 ring magnet, showing comparative results with a cylindrical ferrous flux
concentrator attached to back side of a Hall device case
Cup target
Magnet N Device
S Vane
Vane Magnet
TEAG
(22.5°)
Hall
Device Element
Case
Top View
Side View
1000
Magnetic Flux Density, B (G)
800
600
Effective Vane
Width (24°)
400 Operate
Release Point, BOP
200 Point, BRP
Actual Vane
Width (22.5°)
0
60 40 20 0 20 40 60
Vane Travel (degrees)
Figure 35. Rotary single-vane assembly and characteristic magnetic profile, using a samarium-cobalt
magnet and Ø65 mm ferrous cup target (150 G/deg.)
Table 2. Magnetic Flux Density, B, at Various Vane and Window Positions and Relative Dimensions
Vane and Window Width Factor Relative to Magnet Pole Face
Position Relative to Magent Centerline
1× 1.5 × 2×
Window centered 630 G 713 G 726 G
Vane centered 180 G 100 G 80 G
Window centered - Vane centered 450 G 613 G 646 G
1000
Magnetic Flux Density, B (G)
600
Magnetic slope =
98 G/mm
400
200 1.0 mm
0.5 mm
0
-7.6 -5.1 -2.5 0 2.5 5.1 7.6
Vane Position (mm)
Figure 37. Comparison of two applications, for flux density versus vane travel, showing linearity in the transition regions, despite varying rates
900 5
6
800 7
600
500 Concentrator
Device
Vane
Magnet
400
CL
300 Concentrator
(if used)
Device
Branded
Face
200 Air Gap
D
Vane S
100 N Magnet
0
-5.1 -3.8 -2.5 -1.3 0 1.3
Figure 38. Relative strength of magnetic field using two sample samarium-cobalt magnets, versus
variances in air gap and flux concentrator usage (see key table)
5 2.5 307 No
6 3.0 248 No
7 3.0 220 Yes
8 3.0 177 No
Note: Samples using two samarium-cobalt cubic magnets, Allegro U package
*Concentrator cylindrical, composed of mild steel, Ø3.2 mm, length 6.4 mm, attached to non-branded
face of the Allegro U package case
600
Magnetic Flux Density, B (G)
500
25°C maximum
Magnetic slope = Operate Point
223 G/mm
400 125 G/distributor degree
25°C minimum
300 Operate Point
25°C minimum
200 Release Point
100
0
–5.1 –3.8 –2.5 –1.3 0 1.3 2.5 3.8 5.1
Distance Between Vane Leading (–) or Trailing (+) Edge
and Centerline of Magnet / Hall Element (mm)
Figure 39. Design example of magnetic characteristic of a single-vane cup target (showing only magnetic flux transition regions)
700
600
Magnetic Flux Density, B (G)
500 1.9 mm
(C) 125°C Operate
Magnetic slope = 1.5 mm 1.5 mm Point (445 G)
223 G/mm
400 125 G/distributor degree
1 mm (A) 25°C Operate
(D)125°C Release
300 Point (360 G) Point (375 G)
100
0
–5.1 –3.8 –2.5 –1.3 0 1.3 2.5 3.8 5.1
Distance Between Vane Leading (–) or Trailing (+) Edge
and Centerline of Magnet / Hall Element (mm)
Figure 40. Design example of magnetic characteristic of a single-vane cup target (showing only magnetic flux transition regions), showing effects of
temperature change on switchpoints
ship between the Hall switch and the magnet was absolutely S N S N S
stable. In practice, it is necessary to design the mountings with
some care if this is to be true. It has been found that supporting +B Ring
the magnet or Hall switch with formed brackets of aluminum or Magnet
Target
brass will often contribute a significant temperature-related error
to the system. Use of molded plastic housings has proven to be -B Target
Magnetic
one of the better mounting techniques. Element Pitch Profile
+ VCC
Relative Magnetic Flux Density, B
TEAG TEAG
AAD AAD
N S N S
0 VOQ
Planar Hall Sensor Vertical Hall Sensor
0 2.5 5.1 7.6 10.2 12.7
(Sensitive Side: Top – Shown)
Total Effective Air Gap, TEAG (mm)
+ VCC
Relative Magnetic Flux Density, B
TEAG TEAG
5.3 mm 5.3 mm
TEAG = 1.3 mm
Relative Output Voltage
TEAG = 1.9 mm N S N S
D D
TEAG = 2.4 mm
0 VOQ
0 1.3 2.5 3.8 5.1 6.4
Planar Hall Sensor Vertical Hall Sensor
Distance Between Centerlines of Magnet
(Sensitive Side: Top – Shown)
and Hall Element, D (mm)
Figure 44. Example of effect of lateral displacement on the magnetic flux characteristic in slide-by configuration
n
tio
Mo
Mo
tio
n
n
tio
Mo
Mo
tio
n
Figure 45. Examples of compound magnet configurations (either the Hall device or the magnet assembly can be stationary), with a south pole toward the
branded face and a north pole toward the back side: (left) push-pull head-on and (right) push-pull slide-by
1200
Magnetic Slope = NS NS
–315 G / mm
800 D
400
Back face
0
0 1.3 2.5 3.8 5.1 6.4 Branded face
Distance Between Centerlines of Magnet
and Hall Element, D (mm)
Figure 46. Example of magnetic flux characteristic in push-pull slide-by magnet configuration
n n
tio tio
Mo Mo
Figure 47. Example of a push-push head-on compound magnet configuration (either the Hall device or the magnet assembly can be stationary), with
south poles toward both the branded face and the back side
500 Ø5.4 mm
Magnetic Flux Density, B (G)
100
0 N S S N
-300
Alinco 8 Magnets
-500
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Magnet Assembly Travel (mm)
Figure 48. Example of push-push head-on mode magnet configuration, in which the fields cancel in the middle of the travel range
Branded
Branded face
face S
N
Back-biasing
S Mo magnet
N N tio N
n
S S
n
tio Back-biasing
Mo magnet
Figure 49. Examples of back-biasing magnet configuration, (left) slide-by and (right) head-on
5.3 mm
+ VCC
4.8 mm
Relative Magnetic Flux Density, B
0 VOQ SN SN
Single
Relative Output Voltage
N S
magnets
– GND
S N
+ VCC NS NS
D
Compound VOQ
0
magnets
– GND
-2.5 -2.0 -1.5 -1.0 0 1.0 1.5 2.0 2.5
Distance Between Centerline of Magnet
and Hall Element, D (mm) Compound Single
magnets magnets
Figure 50. Examples of slide-by motion, magnets on both sides; compound and single magnets
4.8 mm 4.8 mm
N N
0 VOQ
D D
– GND
-10.0 -7.5 -5.0 -2.5 0 2.5 5.0 7.5 10.0
Distance Between Centerline of Magnet
and Hall Element, D (mm) Planar Hall Sensor Vertical Hall Sensor
(Sensitive Side: Top – Shown)
Figure 51. Example of slide-by motion, magnet on one side, single magnet
Ø6 mm Ø6 mm
4.8 mm 4.8 mm
500
S N S N
0 N S N S
Magnetic Slope =
D D
–394 G / mm S N S N
–500
TEAG = 1 mm TEAG = 1 mm
–1000
-3 -2 -1 0 1 2 3
Distance Between Centerline of Magnet Planar Hall Sensor Vertical Hall Sensor
and Hall Element, D (mm) (Sensitive Side: Top – Shown)
Figure 52. Example of slide-by motion, magnets on one side, compound magnets
Flux paths
Flux paths
Mild steel
NS
NS
Hall device
Magnet Magnet Hall device
Figure 53. Typical magnetic field generated as magnetic flux passes Figure 54. Demonstration of use of mild steel to provide a low-reluctance
through free air, with only a small portion passing through the Hall device path for magnetic flux, with a preponderance passing through the Hall device
Magnet Magnet
samarium cobalt samarium cobalt
□6.4 mm □6.4 mm
Concentrator
Ø3.2 mm
SN SN
B = 187 G B = 291 G
A B
Figure 55. Effect of back-side flux concentrator on magnetic flux intensity: (A) without concentrator and (B) with concentrator
SN SN SN
3.2 mm
Mounting the Magnet to a Ferrous Plate
B = 357 G
Mounting the magnet to a ferrous plate gives an additional
increase in flux density at the Hall element. Using the same
configuration as in figure 56C, which produced 291 G, note the
available flux attained in figures 58A and 58B with the addition Figure 58A. Effect of 12.7 mm2 additional flux concentrator, attached to
of the ferrous plate. magnet
200
S
N
N
S
S
N
0
N
S
0 12.7 25.4
Concentrator Length (mm)
Dimple
Figure 57. Effect of back-side flux concentrator length, using a samarium Figure 59. Demonstration of mesa-type bracket and flux concentrator
cobalt magnet of Ø3.2 mm and AG = 6.4 mm
Magnet
Samarium Cobalt
□3.2 mm
400
Magnetic Flux Density, B (G)
300 L
(A) With flux
concentrator
N S
200
0.8 mm
100
(B) Without flux
concentrator Flux
concentrator
Feed-through
0 conductor
0 3.2 6.4 9.5 12.7 15.9 Ø3.2 mm
Feed-Through Conductor Length, L (mm)
Figure 61. Example of feed-through conductor length effect on magnetic flux, with and without a flux concentrator on the device
Branded face
Branded face
Figure 66. Examples of application of Hall devices for monitoring mechanical events: (left) north pole adjacent to sense the absence of ferrous material,
(right) south pole adjacent to sense the presence of ferrous material
In this application, a Hall-effect linear sensor IC is back-biased The calibrated linear sensor IC is an accurate, easy-to-use tool for
with a magnet. The north pole is affixed to the back side of the measuring magnetic flux densities. Each device is individually
package. A flux concentrator is affixed to the branded face. calibrated and furnished with a calibration curve and sensitiv-
Although it does not provide a flux return path, the concentrator ity coefficient. Although calibration is performed in a north and
will focus the magnetic field through the switch. south 800 G field, the sensor IC is useful for measuring fields in
both polarities.
The concentrator, shown in figure 72, is aligned with the drum
lobe at an air gap distance of 0.254 mm. The output change is A closely regulated (±10 mV) power supply is necessary to
amplified to develop a 3 V output from the operational amplifier, preserve accuracy in calibrated flux measurements. An ambient
driving the transistor on, as illustrated in figure 73. temperature range of 21°C to 25°C must also be maintained.
0.381 mm MAX
0.254 mm
Concentrator
Magnet
S N
Branded face
+15 V
Ø0.8 mm S
1 MΩ
N 270 Ω
3.3 kΩ
3.2 mm +5 V
VCC
1 kΩ
Output
Ø1.6 mm
Ground 10 kΩ
Figure 72. Printer drum sensing application flux concentrator Figure 73. Printer drum typical application circuit