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TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016

TPL0501 256-Taps Single-Channel Digital Potentiometer With SPI Interface


1 Features 3 Description

1 Single-Channel, 256-Position Resolution The TPL0501 device is a single-channel, linear-taper


digital potentiometer with 256 wiper positions. This
100-k End-to-End Resistance Options device can be used as a three-terminal potentiometer
Low Temperature Coefficient: 35 ppm/C or as a two-terminal rheostat. The TPL0501 device is
SPI-Compatible Serial Interface currently offered with end-to-end resistance of
2.7-V to 5.5-V Single-Supply Operation 100 k. The internal registers of the TPL0501 device
can be accessed using a SPI-compatible interface.
20% Resistance Tolerance The TPL0501 device has a nominal temperature
Operating Temperature: 40C to 125C coefficient of 35 ppm/C.
ESD Performance Tested per JESD 22 The TPL0501 is available in an 8-pin SOT-23 and
2000-V Human-Body Model (A114-B, Class II) 8-pin UQFN package with a specified temperature
range of 40C to 85C.
2 Applications
Device Information(1)
Adjustable Power Supplies
PART NUMBER PACKAGE BODY SIZE (NOM)
Adjustable Gain Amplifiers and Offset Trimming UQFN (8) 1.50 mm 1.50 mm
Precision Calibration of Set Point Thresholds TPL0501
SOT-23 (8) 1.63 mm 2.90 mm
Sensor Trimming and Calibration (1) For all available packages, see the orderable addendum at
Mechanical Potentiometer Replacement the end of the data sheet.

Simplified Schematic
VDD HA

SCLK

DIN SPI INTERFACE WIPER


WA
REGISTER
CS

GND LA
Copyright 2016, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016 www.ti.com

Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes.......................................... 8
2 Applications ........................................................... 1 7.5 Programming .......................................................... 11
3 Description ............................................................. 1 8 Application and Implementation ........................ 18
4 Revision History..................................................... 2 8.1 Application Information............................................ 18
8.2 Typical Application .................................................. 18
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3 9 Power Supply Recommendations...................... 19
9.1 Power Sequence..................................................... 19
6.1 Absolute Maximum Ratings ...................................... 3
9.2 Wiper Position Upon Power Up .............................. 19
6.2 ESD Ratings ............................................................ 3
6.3 Thermal Information .................................................. 4 10 Layout................................................................... 20
6.4 Electrical Characteristics Analog Specifications .... 4 10.1 Layout Guidelines ................................................. 20
6.5 Electrical Characteristics Operating Specifications 5 10.2 Layout Example .................................................... 20
6.6 Timing Requirements ................................................ 5 11 Device and Documentation Support ................. 21
6.7 Typical Characteristics .............................................. 6 11.1 Community Resources.......................................... 21
7 Detailed Description .............................................. 8 11.2 Trademarks ........................................................... 21
7.1 Overview ................................................................... 8 11.3 Electrostatic Discharge Caution ............................ 21
7.2 Functional Block Diagram ......................................... 8 11.4 Glossary ................................................................ 21
7.3 Feature Description................................................... 8 12 Mechanical, Packaging, and Orderable
Information ........................................................... 21

4 Revision History
Changes from Revision B (August 2012) to Revision C Page

Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1

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5 Pin Configuration and Functions

RSE Package
8-Pin UQFN DCN Package
Top View 8-Pin SOT-23
Top View
L
W 1 8 H
8
H 1 7 VDD 2
VDD 7 L
DIN 2 6 W GND 3 6 CS
CS 3 5 SCLK SCLK 4 5 DIN
4

GND

Pin Functions
PIN
TYPE (1) DESCRIPTION
NAME SOT-23 UQFN
CS 6 3 I SPI chip select (active low)
DIN 5 2 I SPI input
GND 3 4 G Ground
H 8 1 I/O High terminal
L 7 8 I/O Low terminal
SCLK 4 5 I SPI clock
VDD 2 7 P Positive supply voltage
W 1 6 I/O Wiper terminal

(1) G = Ground, I = Input, O = Output, P = Power

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN MAX UNIT
VDD to GND 0.3 7
Supply voltage V
VH, VL, VW 0.3 VDD + 0.3
Pulse current, IH, IL, IW 20 mA
Continuous current, IH, IL, IW (TPL0501-100) 5 mA
Digital input voltage, VI 0.3 7 V
Operating temperature, Tj 125 C
Storage temperature, Tstg 65 150 C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.

6.2 ESD Ratings


VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) 1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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6.3 Thermal Information


TPL0501
THERMAL METRIC (1) DCN (SOT-23) RSE (UQFN) UNIT
8 PINS 8 PINS
RJA Junction-to-ambient thermal resistance (2) 205.6 118.8 C/W
RJC(top) Junction-to-case (top) thermal resistance 122.3 62.4 C/W
RJB Junction-to-board thermal resistance 98.9 26.8 C/W
JT Junction-to-top characterization parameter 38.7 2.3 C/W
JB Junction-to-board characterization parameter 97.8 26.8 C/W
RJC(bot) Junction-to-case (bottom) thermal resistance C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Electrical Characteristics Analog Specifications


Typical values are specified at VDD = 5 V and operating temperature is 25C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RTOTAL End-to-end resistance Between Hi and Li terminals 80 100 120 k
VH, VL Terminal voltage 0 VDD V
RH, RL Terminal resistance 50 150
H terminal floating, VL = GND,
RW Wiper resistance 25 100
Force IW = (VDD/2) / RTOTAL, input code = 0x80h
f = 1 MHz, measured to GND,
CH, CL Terminal capacitance 15 pF
input code = 0x80h
f = 1 MHz, measured to GND,
CW Wiper capacitance 12 pF
input code = 0x80h
VH = GND to VDD, VL = floating or
ILKG Terminal leakage current 0.1 1 A
VL = GND to VDD, VH = floating
TCR Resistance temperature coefficient 35 ppm/C
VOLTAGE DIVIDER MODE (1)
INL Integral non-linearity 1 1 LSB
DNL Differential non-linearity 0.5 0.5 LSB
ZSERROR Zero-scale error 0 0.5 2 LSB
FSERROR Full-scale error 2 0.5 0 LSB
TCV Ratiometric temperature coefficient Wiper set at mid-scale 4 ppm/C
Wiper set at mid-scale (TPL0501-100),
BW Bandwidth 265 kHz
CLOAD= 10 pF
TSW Wiper settling time TPL0501-100 3 S
VH = 1 VRMS at 1 kHz, VL = VDD/2,
THD Total harmonic distortion 0.005%
measurement at W
RHEOSTAT MODE (2)
RINL Integral non-linearity 1 1 LSB
RDNL Differential non-linearity 0.5 0.5 LSB
ROFFSET Offset 0 0.5 2 LSB
Code = 0x00h, L floating, input applied to W,
RBW Bandwidth 60 kHz
10 pF on H

(1) VH = VDD, VL = GND, VW = not loaded


(2) Measurements between Wi and Li with Hi not connected, or between Wi and Hi with Li not connected.

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6.5 Electrical Characteristics Operating Specifications


Typical values are specified at VDD = 5 V and operating temperature is 25C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IDD(STBY) VDD standby current 0.3 8 A
IIN-DIG Digital pins leakage current SCLK, DIN, CS inputs 1 1 A
Digital input = 1.8 V, VDD = 2.7 V 5
IDD(SUPPLY) VDD supply current A
Digital input = 1.8 V, VDD = 5 V 500
SERIAL INTERFACE (1)
VIH Input high voltage VDD = 2.7 V to 5.5 V 1.8 5.5 V
VIL Input low voltage SCLK, DIN, CS inputs 0 0.6 V
CIN Pin capacitance SCLK, DIN, CS inputs 7 10 pF

(1) SCLK, DIN, CS Inputs

6.6 Timing Requirements


MIN NOM MAX UNIT
fSCLK SCLK frequency 25 MHz
tSCP SCLK period 40 ns
tSCH SCLK high time 20 ns
tSCL SCLK low time 20 ns
tDS DIN to SCLK set-up time 5 ns
tDH DIN hold after SCLK 5 ns
tCSS CS fall to SCLK rise setup time 15 ns
tCSW CS pulse width high 40 ns

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6.7 Typical Characteristics

0.15 0.15
+125C +125C
+85C +85C
+25C +25C
0.10 -40C 0.10 -40C

0.05 0.05

DNL Error (LSB)


INL Error (LSB)

0.00 0.00

-0.05 -0.05

-0.10 -0.10

-0.15 -0.15
0 32 64 96 128 160 192 224 0 32 64 96 128 160 192 224
Digital Code Digital Code

Figure 1. INL vs Tap Position (Potentiometer Mode) Figure 2. DNL vs Tap Position (Potentiometer Mode)
0.15 0.15
+125C +125C
+85C +85C
+25C +25C

0.10 -40C 0.10 -40C

0.05
RDNL Error (LSB)

0.05
RINL Error (LSB)

0.00 0.00

-0.05 -0.05

-0.10 -0.10

-0.15 -0.15
0 32 64 96 128 160 192 224 0 32 64 96 128 160 192 224

Digital Code Digital Code

Figure 3. INL vs Tap Position (Rheostat Mode) Figure 4. DNL vs Tap Position (Rheostat Mode)
1.00 0.40
5.5V 5.5V
5.0V 5.0V
2.7V 2.7V

0.50 0.30
Resistance Change (%)

ZS Error (LSB)

0.00 0.20

-0.50 0.10

-1.00 0.00
-40 -15 10 35 60 85 110 -40 -20 0 20 40 60 80 100 120

Temperature (C) Temperature (C)

Figure 5. End-to-End Resistance Change vs Temperature Figure 6. Zero Scale Error vs Temperature

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Typical Characteristics (continued)


0.10 50.00
5.5V 5.5V
5.0V 5.0V
2.7V 2.7V
40.00

0.00

30.00
FS Error (LSB)

TC (ppm/C)
-0.10 20.00

10.00

-0.20

0.00

-0.30 -10.00
-40 -20 0 20 40 60 80 100 120 16 80 144 208
Temperature (C) Digital Code

Figure 7. Full Scale Error vs Temperature Figure 8. Temperature Coefficient vs Tap Position
(Potentiometer Mode)
100.00 0.00
5.5V
0x80h
5.0V -6.00 0x40h
2.7V
0x20h
80.00 -12.00 0x10h
0x08h
-18.00 0x04h
Magnitude (dB)

0x02h
TC (ppm/C)

60.00 -24.00 0x01h

-30.00

40.00 -36.00

-42.00

20.00 -48.00

-54.00

0.00 -60.00
16 80 144 208 1.00E+03 1.00E+04 1.00E+05 1.00E+06 1.00E+07

Digital Code Frequency (Hz)

Figure 9. Temperature Coefficient vs Tap Position Figure 10. Bandwidth (Potentiometer Mode)
(Rheostat Mode)
0.00
100k
75k
50k
-6.00
25k
12.5k
Magnitude (dB)

-12.00

-18.00

-24.00

-30.00
1.00E+03 1.00E+04 1.00E+05 1.00E+06 1.00E+07
Frequency (Hz)

Figure 11. Bandwidth (Rheostat Mode)

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7 Detailed Description

7.1 Overview
The TPL0501 has a single linear-taper digital potentiometer with 256 wiper positions and an end-to-end
resistance of 100 k. The potentiometer can be used as a three-terminal potentiometer or as a two-terminal
rheostat. The potentiometer can be used in either voltage divider mode or rheostat mode.
The high (H) and low (L) terminals of the TPL0501 are equivalent to the fixed terminals of a mechanical
potentiometer. The H and L terminals do not have any polarity restrictions (H can be at a higher voltage than L,
or L can be at a higher voltage than H). The position of the wiper (W) terminal is controlled by the value in the
8-bit Wiper Resistance (WR) register. When the WR register contains all zeroes (zero-scale), the wiper terminal
is closest to its L terminal. As the value of the WR register increases from all zeroes to all ones (full-scale), the
wiper moves from the position closest to the L terminal, to the position closest to the H terminal. At the same
time, the resistance between W and L increases, whereas the resistance between W and H decreases.

7.2 Functional Block Diagram

VDD HA

SCLK

DIN SPI INTERFACE WIPER


WA
REGISTER
CS

GND LA
Copyright 2016, Texas Instruments Incorporated

7.3 Feature Description


7.3.1 Single-Channel, 256-Position Resolution
The TPL0501 features a single independent DPOT. The DPOT is capable of being used and controlled
independently.

7.4 Device Functional Modes


7.4.1 Voltage Divider Mode
The digital potentiometer generates a voltage divider when all three terminals are used. The voltage divider at
wiper-to-H and wiper-to-L is proportional to the input voltage at H to L (see Figure 12).

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Device Functional Modes (continued)

VHW

VH - VL W

VWL

Figure 12. Equivalent Circuit for Voltage Divider Mode

For example, connecting terminal H to 5 V and terminal L to ground, the output voltage at terminal W can range
from 0 V to 5 V (see Equation 1).
D
VW = VWL = (VH - VL )
256 (1)
The voltage difference between terminal H and terminal W can also be calculated in Equation 2.
D
VHW = (VH - VL ) 1 -
256

where
D is the decimal value of the wiper code. (2)

7.4.2 Rheostat Mode


The TPL0501 operates in rheostat mode when only two terminals are used as a variable resistor. The variable
resistance can either be between terminal H and terminal W or between terminal L and terminal W. The unused
terminal can be left floating or it can be tied to terminal W. The nominal resistance between terminal H and
terminal L is 10 k and has 256 tap points accessed by the wiper terminal. The 8-bit volatile register value is
used to determine one of the 256 possible wiper positions.
To set the resistance between terminal H and terminal W in rheostat mode, the potentiometer can be configured
in two possible ways (see Figure 13).
H H

RHW RHW

RTOT
W OR RTOT W

L (Floating) L (Connected)

Figure 13. Equivalent Circuit for Rheostat Mode With Terminal H to Terminal W Resistance

The general equation for determining the digitally programmed output resistance between Terminal H and
Terminal W is Equation 3:

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Device Functional Modes (continued)


D
RHW = RTOT 1 -
256
where
RTOT is the end-to-end resistance between terminal H and terminal L.
D is the decimal value of the wiper code (3)
Similarly, to set the resistance between terminal L and terminal W, the potentiometer can be configured in two
possible ways.

H (Floating) H (Connected)

RTOT W OR RTOT W

RWL RWL

L L

Figure 14. Equivalent Circuit for Rheostat Mode With Terminal L to Terminal W Resistance

The general equation for determining the digitally programmed output resistance between terminal L and terminal
W is Equation 4:
D
R WL = RTOT
256
where
RTOT is the end-to-end resistance between terminal H and terminal L
D is the decimal value of the wiper code. (4)

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7.5 Programming
7.5.1 SPI Digital Interface
The TPL0501 uses a 3-wire SPI compatible serial data interface. This write-only interface has three inputs: chip-
select (CS), data clock (SCLK), and data input (DIN). Drive CS low to enable the serial interface and clock data
synchronously into the shift register on each SCLK rising edge. After loading data into the shift register, drive CS
high to latch the data into the appropriate potentiometer control register and disable the serial interface. Keep CS
low during the entire serial data stream to avoid corruption of the data.

Table 1. Default Value 0x80H


BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
MSB LSB
D7 D6 D5 D4 D3 D2 D1 D0

CS

SCLK
1 2 3 4 5 6 7 8

DIN D7 D6 D5 D4 D3 D2 D1 D0

Figure 15. SPI Write Sequence

CS
tCSW
tCS0
tCS1
tCSS tSCL tSCH tSCP tCSH

SCLK

tDS tDH

DIN

Figure 16. Digital Interface Timing Diagram

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7.5.2 Ideal Resistance Values

RHW
RWL = RTOT x D/256
RTOT W RHW = RTOT x (1 (D/256))
RWL
Where D = Decimal Value of Wiper Code

L
Figure 17. Digital Potentiometer Measurements

Table 2 shows the ideal values for DPOT with end-to-end resistance of 100 k. The absolute values of
resistance can vary significantly but the Ratio (RWL/RHW) is extremely accurate.

Table 2. DPOT Ideal Values


100 k
STEP BINARY RWL/RHW
RWL (k) RHW (k)
0 00000000 0.00 100.00 0.00
1 00000001 0.39 99.61 0.00
2 00000010 0.78 99.22 0.01
3 00000011 1.17 98.83 0.01
4 00000100 1.56 98.44 0.02
5 00000101 1.95 98.05 0.02
6 00000110 2.34 97.66 0.02
7 00000111 2.73 97.27 0.03
8 00001000 3.13 96.88 0.03
9 00001001 3.52 96.48 0.04
10 00001010 3.91 96.09 0.04
11 00001011 4.30 95.70 0.04
12 00001100 4.69 95.31 0.05
13 00001101 5.08 94.92 0.05
14 00001110 5.47 94.53 0.06
15 00001111 5.86 94.14 0.06
16 00010000 6.25 93.75 0.07
17 00010001 6.64 93.36 0.07
18 00010010 7.03 92.97 0.08
19 00010011 7.42 92.58 0.08
20 00010100 7.81 92.19 0.08
21 00010101 8.20 91.80 0.09
22 00010110 8.59 91.41 0.09
23 00010111 8.98 91.02 0.10
24 00011000 9.38 90.63 0.10
25 00011001 9.77 90.23 0.11
26 00011010 10.16 89.84 0.11
27 00011011 10.55 89.45 0.12
28 00011100 10.94 89.06 0.12
29 00011101 11.33 88.67 0.13
30 00011110 11.72 88.28 0.13

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Table 2. DPOT Ideal Values (continued)


100 k
STEP BINARY RWL/RHW
RWL (k) RHW (k)
31 00011111 12.11 87.89 0.14
32 00100000 12.50 87.50 0.14
33 00100001 12.89 87.11 0.15
34 00100010 13.28 86.72 0.15
35 00100011 13.67 86.33 0.16
36 00100100 14.06 85.94 0.16
37 00100101 14.45 85.55 0.17
38 00100110 14.84 85.16 0.17
39 00100111 15.23 84.77 0.18
40 00101000 15.63 84.38 0.19
41 00101001 16.02 83.98 0.19
42 00101010 16.41 83.59 0.20
43 00101011 16.80 83.20 0.20
44 00101100 17.19 82.81 0.21
45 00101101 17.58 82.42 0.21
46 00101110 17.97 82.03 0.22
47 00101111 18.36 81.64 0.22
48 00110000 18.75 81.25 0.23
49 00110001 19.14 80.86 0.24
50 00110010 19.53 80.47 0.24
51 00110011 19.92 80.08 0.25
52 00110100 20.31 79.69 0.25
53 00110101 20.70 79.30 0.26
54 00110110 21.09 78.91 0.27
55 00110111 21.48 78.52 0.27
56 00111000 21.88 78.13 0.28
57 00111001 22.27 77.73 0.29
58 00111010 22.66 77.34 0.29
59 00111011 23.05 76.95 0.30
60 00111100 23.44 76.56 0.31
61 00111101 23.83 76.17 0.31
62 00111110 24.22 75.78 0.32
63 00111111 24.61 75.39 0.33
64 01000000 25.00 75.00 0.33
65 01000001 25.39 74.61 0.34
66 01000010 25.78 74.22 0.35
67 01000011 26.17 73.83 0.35
68 01000100 26.56 73.44 0.36
69 01000101 26.95 73.05 0.37
70 01000110 27.34 72.66 0.38
71 01000111 27.73 72.27 0.38
72 01001000 28.13 71.88 0.39
73 01001001 28.52 71.48 0.40
74 01001010 28.91 71.09 0.41
75 01001011 29.30 70.70 0.41
76 01001100 29.69 70.31 0.42

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Table 2. DPOT Ideal Values (continued)


100 k
STEP BINARY RWL/RHW
RWL (k) RHW (k)
77 01001101 30.08 69.92 0.43
78 01001110 30.47 69.53 0.44
79 01001111 30.86 69.14 0.45
80 01010000 31.25 68.75 0.45
81 01010001 31.64 68.36 0.46
82 01010010 32.03 67.97 0.47
83 01010011 32.42 67.58 0.48
84 01010100 32.81 67.19 0.49
85 01010101 33.20 66.80 0.50
86 01010110 33.59 66.41 0.51
87 01010111 33.98 66.02 0.51
88 01011000 34.38 65.63 0.52
89 01011001 34.77 65.23 0.53
90 01011010 35.16 64.84 0.54
91 01011011 35.55 64.45 0.55
92 01011100 35.94 64.06 0.56
93 01011101 36.33 63.67 0.57
94 01011110 36.72 63.28 0.58
95 01011111 37.11 62.89 0.59
96 01100000 37.50 62.50 0.60
97 01100001 37.89 62.11 0.61
98 01100010 38.28 61.72 0.62
99 01100011 38.67 61.33 0.63
100 01100100 39.06 60.94 0.64
101 01100101 39.45 60.55 0.65
102 01100110 39.84 60.16 0.66
103 01100111 40.23 59.77 0.67
104 01101000 40.63 59.38 0.68
105 01101001 41.02 58.98 0.70
106 01101010 41.41 58.59 0.71
107 01101011 41.80 58.20 0.72
108 01101100 42.19 57.81 0.73
109 01101101 42.58 57.42 0.74
110 01101110 42.97 57.03 0.75
111 01101111 43.36 56.64 0.77
112 01110000 43.75 56.25 0.78
113 01110001 44.14 55.86 0.79
114 01110010 44.53 55.47 0.80
115 01110011 44.92 55.08 0.82
116 01110100 45.31 54.69 0.83
117 01110101 45.70 54.30 0.84
118 01110110 46.09 53.91 0.86
119 01110111 46.48 53.52 0.87
120 01111000 46.88 53.13 0.88
121 01111001 47.27 52.73 0.90
122 01111010 47.66 52.34 0.91

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Table 2. DPOT Ideal Values (continued)


100 k
STEP BINARY RWL/RHW
RWL (k) RHW (k)
123 01111011 48.05 51.95 0.92
124 01111100 48.44 51.56 0.94
125 01111101 48.83 51.17 0.95
126 01111110 49.22 50.78 0.97
127 01111111 49.61 50.39 0.98
128 10000000 50.00 50.00 1.00
129 10000001 50.39 49.61 1.02
130 10000010 50.78 49.22 1.03
131 10000011 51.17 48.83 1.05
132 10000100 51.56 48.44 1.06
133 10000101 51.95 48.05 1.08
134 10000110 52.34 47.66 1.10
135 10000111 52.73 47.27 1.12
136 10001000 53.13 46.88 1.13
137 10001001 53.52 46.48 1.15
138 10001010 53.91 46.09 1.17
139 10001011 54.30 45.70 1.19
140 10001100 54.69 45.31 1.21
141 10001101 55.08 44.92 1.23
142 10001110 55.47 44.53 1.25
143 10001111 55.86 44.14 1.27
144 10010000 56.25 43.75 1.29
145 10010001 56.64 43.36 1.31
146 10010010 57.03 42.97 1.33
147 10010011 57.42 42.58 1.35
148 10010100 57.81 42.19 1.37
149 10010101 58.20 41.80 1.39
150 10010110 58.59 41.41 1.42
151 10010111 58.98 41.02 1.44
152 10011000 59.38 40.63 1.46
153 10011001 59.77 40.23 1.49
154 10011010 60.16 39.84 1.51
155 10011011 60.55 39.45 1.53
156 10011100 60.94 39.06 1.56
157 10011101 61.33 38.67 1.59
158 10011110 61.72 38.28 1.61
159 10011111 62.11 37.89 1.64
160 10100000 62.50 37.50 1.67
161 10100001 62.89 37.11 1.69
162 10100010 63.28 36.72 1.72
163 10100011 63.67 36.33 1.75
164 10100100 64.06 35.94 1.78
165 10100101 64.45 35.55 1.81
166 10100110 64.84 35.16 1.84
167 10100111 65.23 34.77 1.88
168 10101000 65.63 34.38 1.91

Copyright 20112016, Texas Instruments Incorporated Submit Documentation Feedback 15


TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016 www.ti.com

Table 2. DPOT Ideal Values (continued)


100 k
STEP BINARY RWL/RHW
RWL (k) RHW (k)
169 10101001 66.02 33.98 1.94
170 10101010 66.41 33.59 1.98
171 10101011 66.80 33.20 2.01
172 10101100 67.19 32.81 2.05
173 10101101 67.58 32.42 2.08
174 10101110 67.97 32.03 2.12
175 10101111 68.36 31.64 2.16
176 10110000 68.75 31.25 2.20
177 10110001 69.14 30.86 2.24
178 10110010 69.53 30.47 2.28
179 10110011 69.92 30.08 2.32
180 10110100 70.31 29.69 2.37
181 10110101 70.70 29.30 2.41
182 10110110 71.09 28.91 2.46
183 10110111 71.48 28.52 2.51
184 10111000 71.88 28.13 2.56
185 10111001 72.27 27.73 2.61
186 10111010 72.66 27.34 2.66
187 10111011 73.05 26.95 2.71
188 10111100 73.44 26.56 2.76
189 10111101 73.83 26.17 2.82
190 10111110 74.22 25.78 2.88
191 10111111 74.61 25.39 2.94
192 11000000 75.00 25.00 3.00
193 11000001 75.39 24.61 3.06
194 11000010 75.78 24.22 3.13
195 11000011 76.17 23.83 3.20
196 11000100 76.56 23.44 3.27
197 11000101 76.95 23.05 3.34
198 11000110 77.34 22.66 3.41
199 11000111 77.73 22.27 3.49
200 11001000 78.13 21.88 3.57
201 11001001 78.52 21.48 3.65
202 11001010 78.91 21.09 3.74
203 11001011 79.30 20.70 3.83
204 11001100 79.69 20.31 3.92
205 11001101 80.08 19.92 4.02
206 11001110 80.47 19.53 4.12
207 11001111 80.86 19.14 4.22
208 11010000 81.25 18.75 4.33
209 11010001 81.64 18.36 4.45
210 11010010 82.03 17.97 4.57
211 11010011 82.42 17.58 4.69
212 11010100 82.81 17.19 4.82
213 11010101 83.20 16.80 4.95
214 11010110 83.59 16.41 5.10

16 Submit Documentation Feedback Copyright 20112016, Texas Instruments Incorporated


TPL0501
www.ti.com SLIS136B SEPTEMBER 2011 REVISED MAY 2016

Table 2. DPOT Ideal Values (continued)


100 k
STEP BINARY RWL/RHW
RWL (k) RHW (k)
215 11010111 83.98 16.02 5.24
216 11011000 84.38 15.63 5.40
217 11011001 84.77 15.23 5.56
218 11011010 85.16 14.84 5.74
219 11011011 85.55 14.45 5.92
220 11011100 85.94 14.06 6.11
221 11011101 86.33 13.67 6.31
222 11011110 86.72 13.28 6.53
223 11011111 87.11 12.89 6.76
224 11100000 87.50 12.50 7.00
225 11100001 87.89 12.11 7.26
226 11100010 88.28 11.72 7.53
227 11100011 88.67 11.33 7.83
228 11100100 89.06 10.94 8.14
229 11100101 89.45 10.55 8.48
230 11100110 89.84 10.16 8.85
231 11100111 90.23 9.77 9.24
232 11101000 90.63 9.38 9.67
233 11101001 91.02 8.98 10.13
234 11101010 91.41 8.59 10.64
235 11101011 91.80 8.20 11.19
236 11101100 92.19 7.81 11.80
237 11101101 92.58 7.42 12.47
238 11101110 92.97 7.03 13.22
239 11101111 93.36 6.64 14.06
240 11110000 93.75 6.25 15.00
241 11110001 94.14 5.86 16.07
242 11110010 94.53 5.47 17.29
243 11110011 94.92 5.08 18.69
244 11110100 95.31 4.69 20.33
245 11110101 95.70 4.30 22.27
246 11110110 96.09 3.91 24.60
247 11110111 96.48 3.52 27.44
248 11111000 96.88 3.13 31.00
249 11111001 97.27 2.73 35.57
250 11111010 97.66 2.34 41.67
251 11111011 98.05 1.95 50.20
252 11111100 98.44 1.56 63.00
253 11111101 98.83 1.17 84.33
254 11111110 99.22 0.78 127.00
255 11111111 99.61 0.39 255.00

Copyright 20112016, Texas Instruments Incorporated Submit Documentation Feedback 17


TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016 www.ti.com

8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information


Many applications require using a digital potentiometer such as the TPL0501 for variable resistance or voltage
division. Typical Application shows one of these examples. In conjunction with various amplifiers, the TPL0501
can effectively be used in rheostat mode to modify the gain of an amplifier in voltage divider mode to create a
digital-to-analog converter (DAC).

8.2 Typical Application


Figure 18 shows a DAC.
Vi

H Vcc
TPL0501
W
OPA320 Vo

L 10 N

Copyright 2016, Texas Instruments Incorporated

Figure 18. DAC Schematic

8.2.1 Design Requirements


Table 3 lists the design parameters for this application.

Table 3. Example Parameters


DESIGN PARAMETER EXAMPLE VALUE
Input voltage 0 V to 5 V
Output voltage 0 V to 5 V

8.2.2 Detailed Design Procedure


The TPL0501 can be used in voltage divider mode with a unity-gain operational amplifier buffer to create an 8-bit
DAC. The analog output voltage of the circuit is determined by the wiper setting programmed through the SPI
Interface.
The operational amplifier is required to buffer the high-impedance output of the TPL0501 or else loading placed
on the output of the voltage divider affects the output voltage.

18 Submit Documentation Feedback Copyright 20112016, Texas Instruments Incorporated


TPL0501
www.ti.com SLIS136B SEPTEMBER 2011 REVISED MAY 2016

8.2.3 Application Curve


The voltage at terminal H determines the maximum analog voltage at the output. As the TPL0501 moves from
zero-scale to full-scale, the voltage divider adjusts with relation to the voltage divider formula (see Figure 12),
resulting in the desired voltage at terminal W. The voltage at terminal W ranges linearly from 0 V to the terminal
H voltage. In this example, VIN at terminal H is 5 V and 2.7 V.
6
5V
2.7 V

4
Output Voltage (V)

0
0 30 60 90 120 150 180 210 240 256
Code (Digital Input) D001

Figure 19. TPL0501 Digital Input vs OPA320 Analog Output (DAC)

9 Power Supply Recommendations

9.1 Power Sequence


Protection diodes limit the voltage compliance at terminal H, terminal L, and terminal W, making it important to
power up VDD first before applying any voltage to terminal H, terminal L, and terminal W. The diodes are forward-
biasing, meaning VDD is not powered first. The ideal power up sequence is VDD, digital inputs, and VH, VL, and
VW. The order of powering digital inputs, VH, VL, and VW does not matter as long as they are powered after VDD.

9.2 Wiper Position Upon Power Up


It is prudent to know that when DPOT is powered off, the impedance of the device is not known. Upon power up,
the device will return to 0x80h code because this device does not contain non-volatile memory.

Copyright 20112016, Texas Instruments Incorporated Submit Documentation Feedback 19


TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016 www.ti.com

10 Layout

10.1 Layout Guidelines


To ensure reliability of the device, follow common printed-circuit board (PCB) layout guidelines.
Leads to the input must be as direct as possible with a minimum conductor length.
The ground path must have low resistance and low inductance.
Use short trace-lengths to avoid excessive loading.
It is common to have a dedicated ground plane on an inner layer of the board.
Terminals that are connected to ground must have a low-impedance path to the ground plane in the form of
wide polygon pours and multiple vias.
Use bypass capacitors on power supplies and placed them as close as possible to the VDD pin.
Apply low equivalent series resistance (0.1-F to 10-F tantalum or electrolytic capacitors) at the supplies to
minimize transient disturbances and to filter low frequency ripple.

10.2 Layout Example

Via to GND Plane


Via to V DD Power Plane
W H

VDD L
TPL0501
0603 Cap

0402
Cap

GND CS

SCLK DIN

Figure 20. Example Layout for DCN Package

20 Submit Documentation Feedback Copyright 20112016, Texas Instruments Incorporated


TPL0501
www.ti.com SLIS136B SEPTEMBER 2011 REVISED MAY 2016

11 Device and Documentation Support

11.1 Community Resources


The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information


The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright 20112016, Texas Instruments Incorporated Submit Documentation Feedback 21


PACKAGE OPTION ADDENDUM

www.ti.com 17-May-2014

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TPL0501-100DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (NF5J ~ NF5T)
& no Sb/Br)
TPL0501-100RSER ACTIVE UQFN RSE 8 5000 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 7M
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
PACKAGE OPTION ADDENDUM

www.ti.com 17-May-2014

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
PACKAGE MATERIALS INFORMATION

www.ti.com 18-Aug-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal


Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPL0501-100DCNR SOT-23 DCN 8 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
TPL0501-100RSER UQFN RSE 8 5000 180.0 8.4 1.7 1.7 0.7 4.0 8.0 Q1

Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 18-Aug-2014

*All dimensions are nominal


Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPL0501-100DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0
TPL0501-100RSER UQFN RSE 8 5000 202.0 201.0 28.0

Pack Materials-Page 2
PACKAGE OUTLINE
RSE0008A SCALE 7.000
UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

1.55
B A
1.45

PIN 1 INDEX AREA


1.55
1.45

C
0.6 MAX

SEATING PLANE
0.05
0.00 0.05 C

0.35
2X
0.25 0.4
6X
0.1 C A B 0.3
(0.12)
0.05 C 0.45 TYP
2X
4 0.35

3
5

2X SYMM
1

0.25
2X
0.15
7
1 0.1 C A B
4X 0.5 0.05 C
8
0.3
SYMM 4X
0.2
0.1 C A B
PIN 1 ID
0.05 C
(45 X 0.1

4220323/A 03/2016

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

www.ti.com
EXAMPLE BOARD LAYOUT
RSE0008A UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

SYMM
(R0.05) TYP
8 2X (0.6)
6X (0.55)

1 7

4X (0.25)
SYMM
(1.3)
2X
4X (0.5) (0.2)

5
3

4
2X (0.3)
(1.35)

LAND PATTERN EXAMPLE


SCALE:30X

0.07 MAX 0.07 MIN


ALL AROUND ALL AROUND
METAL SOLDER MASK
OPENING

SOLDER MASK
METAL
OPENING
UNDER
SOLDER MASK
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS


NOT TO SCALE

4220323/A 03/2016

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com
EXAMPLE STENCIL DESIGN
RSE0008A UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

SYMM

(R0.05) TYP 2X (0.6)


8

6X (0.55)

1 7

4X (0.25)
SYMM
(1.3)

4X (0.5) 2X (0.2)

5
3

4
2X
(0.3)

(1.35)

SOLDER PASTE EXAMPLE


BASED ON 0.1 mm THICKNESS
SCALE: 30X

4220323/A 03/2016

NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

www.ti.com
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