tpl0501 100
tpl0501 100
tpl0501 100
TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016
Simplified Schematic
VDD HA
SCLK
GND LA
Copyright 2016, Texas Instruments Incorporated
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPL0501
SLIS136B SEPTEMBER 2011 REVISED MAY 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes.......................................... 8
2 Applications ........................................................... 1 7.5 Programming .......................................................... 11
3 Description ............................................................. 1 8 Application and Implementation ........................ 18
4 Revision History..................................................... 2 8.1 Application Information............................................ 18
8.2 Typical Application .................................................. 18
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3 9 Power Supply Recommendations...................... 19
9.1 Power Sequence..................................................... 19
6.1 Absolute Maximum Ratings ...................................... 3
9.2 Wiper Position Upon Power Up .............................. 19
6.2 ESD Ratings ............................................................ 3
6.3 Thermal Information .................................................. 4 10 Layout................................................................... 20
6.4 Electrical Characteristics Analog Specifications .... 4 10.1 Layout Guidelines ................................................. 20
6.5 Electrical Characteristics Operating Specifications 5 10.2 Layout Example .................................................... 20
6.6 Timing Requirements ................................................ 5 11 Device and Documentation Support ................. 21
6.7 Typical Characteristics .............................................. 6 11.1 Community Resources.......................................... 21
7 Detailed Description .............................................. 8 11.2 Trademarks ........................................................... 21
7.1 Overview ................................................................... 8 11.3 Electrostatic Discharge Caution ............................ 21
7.2 Functional Block Diagram ......................................... 8 11.4 Glossary ................................................................ 21
7.3 Feature Description................................................... 8 12 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
Changes from Revision B (August 2012) to Revision C Page
Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
RSE Package
8-Pin UQFN DCN Package
Top View 8-Pin SOT-23
Top View
L
W 1 8 H
8
H 1 7 VDD 2
VDD 7 L
DIN 2 6 W GND 3 6 CS
CS 3 5 SCLK SCLK 4 5 DIN
4
GND
Pin Functions
PIN
TYPE (1) DESCRIPTION
NAME SOT-23 UQFN
CS 6 3 I SPI chip select (active low)
DIN 5 2 I SPI input
GND 3 4 G Ground
H 8 1 I/O High terminal
L 7 8 I/O Low terminal
SCLK 4 5 I SPI clock
VDD 2 7 P Positive supply voltage
W 1 6 I/O Wiper terminal
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN MAX UNIT
VDD to GND 0.3 7
Supply voltage V
VH, VL, VW 0.3 VDD + 0.3
Pulse current, IH, IL, IW 20 mA
Continuous current, IH, IL, IW (TPL0501-100) 5 mA
Digital input voltage, VI 0.3 7 V
Operating temperature, Tj 125 C
Storage temperature, Tstg 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
0.15 0.15
+125C +125C
+85C +85C
+25C +25C
0.10 -40C 0.10 -40C
0.05 0.05
0.00 0.00
-0.05 -0.05
-0.10 -0.10
-0.15 -0.15
0 32 64 96 128 160 192 224 0 32 64 96 128 160 192 224
Digital Code Digital Code
Figure 1. INL vs Tap Position (Potentiometer Mode) Figure 2. DNL vs Tap Position (Potentiometer Mode)
0.15 0.15
+125C +125C
+85C +85C
+25C +25C
0.05
RDNL Error (LSB)
0.05
RINL Error (LSB)
0.00 0.00
-0.05 -0.05
-0.10 -0.10
-0.15 -0.15
0 32 64 96 128 160 192 224 0 32 64 96 128 160 192 224
Figure 3. INL vs Tap Position (Rheostat Mode) Figure 4. DNL vs Tap Position (Rheostat Mode)
1.00 0.40
5.5V 5.5V
5.0V 5.0V
2.7V 2.7V
0.50 0.30
Resistance Change (%)
ZS Error (LSB)
0.00 0.20
-0.50 0.10
-1.00 0.00
-40 -15 10 35 60 85 110 -40 -20 0 20 40 60 80 100 120
Figure 5. End-to-End Resistance Change vs Temperature Figure 6. Zero Scale Error vs Temperature
0.00
30.00
FS Error (LSB)
TC (ppm/C)
-0.10 20.00
10.00
-0.20
0.00
-0.30 -10.00
-40 -20 0 20 40 60 80 100 120 16 80 144 208
Temperature (C) Digital Code
Figure 7. Full Scale Error vs Temperature Figure 8. Temperature Coefficient vs Tap Position
(Potentiometer Mode)
100.00 0.00
5.5V
0x80h
5.0V -6.00 0x40h
2.7V
0x20h
80.00 -12.00 0x10h
0x08h
-18.00 0x04h
Magnitude (dB)
0x02h
TC (ppm/C)
-30.00
40.00 -36.00
-42.00
20.00 -48.00
-54.00
0.00 -60.00
16 80 144 208 1.00E+03 1.00E+04 1.00E+05 1.00E+06 1.00E+07
Figure 9. Temperature Coefficient vs Tap Position Figure 10. Bandwidth (Potentiometer Mode)
(Rheostat Mode)
0.00
100k
75k
50k
-6.00
25k
12.5k
Magnitude (dB)
-12.00
-18.00
-24.00
-30.00
1.00E+03 1.00E+04 1.00E+05 1.00E+06 1.00E+07
Frequency (Hz)
7 Detailed Description
7.1 Overview
The TPL0501 has a single linear-taper digital potentiometer with 256 wiper positions and an end-to-end
resistance of 100 k. The potentiometer can be used as a three-terminal potentiometer or as a two-terminal
rheostat. The potentiometer can be used in either voltage divider mode or rheostat mode.
The high (H) and low (L) terminals of the TPL0501 are equivalent to the fixed terminals of a mechanical
potentiometer. The H and L terminals do not have any polarity restrictions (H can be at a higher voltage than L,
or L can be at a higher voltage than H). The position of the wiper (W) terminal is controlled by the value in the
8-bit Wiper Resistance (WR) register. When the WR register contains all zeroes (zero-scale), the wiper terminal
is closest to its L terminal. As the value of the WR register increases from all zeroes to all ones (full-scale), the
wiper moves from the position closest to the L terminal, to the position closest to the H terminal. At the same
time, the resistance between W and L increases, whereas the resistance between W and H decreases.
VDD HA
SCLK
GND LA
Copyright 2016, Texas Instruments Incorporated
VHW
VH - VL W
VWL
For example, connecting terminal H to 5 V and terminal L to ground, the output voltage at terminal W can range
from 0 V to 5 V (see Equation 1).
D
VW = VWL = (VH - VL )
256 (1)
The voltage difference between terminal H and terminal W can also be calculated in Equation 2.
D
VHW = (VH - VL ) 1 -
256
where
D is the decimal value of the wiper code. (2)
RHW RHW
RTOT
W OR RTOT W
L (Floating) L (Connected)
Figure 13. Equivalent Circuit for Rheostat Mode With Terminal H to Terminal W Resistance
The general equation for determining the digitally programmed output resistance between Terminal H and
Terminal W is Equation 3:
H (Floating) H (Connected)
RTOT W OR RTOT W
RWL RWL
L L
Figure 14. Equivalent Circuit for Rheostat Mode With Terminal L to Terminal W Resistance
The general equation for determining the digitally programmed output resistance between terminal L and terminal
W is Equation 4:
D
R WL = RTOT
256
where
RTOT is the end-to-end resistance between terminal H and terminal L
D is the decimal value of the wiper code. (4)
7.5 Programming
7.5.1 SPI Digital Interface
The TPL0501 uses a 3-wire SPI compatible serial data interface. This write-only interface has three inputs: chip-
select (CS), data clock (SCLK), and data input (DIN). Drive CS low to enable the serial interface and clock data
synchronously into the shift register on each SCLK rising edge. After loading data into the shift register, drive CS
high to latch the data into the appropriate potentiometer control register and disable the serial interface. Keep CS
low during the entire serial data stream to avoid corruption of the data.
CS
SCLK
1 2 3 4 5 6 7 8
DIN D7 D6 D5 D4 D3 D2 D1 D0
CS
tCSW
tCS0
tCS1
tCSS tSCL tSCH tSCP tCSH
SCLK
tDS tDH
DIN
RHW
RWL = RTOT x D/256
RTOT W RHW = RTOT x (1 (D/256))
RWL
Where D = Decimal Value of Wiper Code
L
Figure 17. Digital Potentiometer Measurements
Table 2 shows the ideal values for DPOT with end-to-end resistance of 100 k. The absolute values of
resistance can vary significantly but the Ratio (RWL/RHW) is extremely accurate.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
H Vcc
TPL0501
W
OPA320 Vo
L 10 N
4
Output Voltage (V)
0
0 30 60 90 120 150 180 210 240 256
Code (Digital Input) D001
10 Layout
VDD L
TPL0501
0603 Cap
0402
Cap
GND CS
SCLK DIN
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 17-May-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TPL0501-100DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (NF5J ~ NF5T)
& no Sb/Br)
TPL0501-100RSER ACTIVE UQFN RSE 8 5000 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 7M
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 17-May-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Aug-2014
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Aug-2014
Pack Materials-Page 2
PACKAGE OUTLINE
RSE0008A SCALE 7.000
UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
1.55
B A
1.45
C
0.6 MAX
SEATING PLANE
0.05
0.00 0.05 C
0.35
2X
0.25 0.4
6X
0.1 C A B 0.3
(0.12)
0.05 C 0.45 TYP
2X
4 0.35
3
5
2X SYMM
1
0.25
2X
0.15
7
1 0.1 C A B
4X 0.5 0.05 C
8
0.3
SYMM 4X
0.2
0.1 C A B
PIN 1 ID
0.05 C
(45 X 0.1
4220323/A 03/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RSE0008A UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(R0.05) TYP
8 2X (0.6)
6X (0.55)
1 7
4X (0.25)
SYMM
(1.3)
2X
4X (0.5) (0.2)
5
3
4
2X (0.3)
(1.35)
SOLDER MASK
METAL
OPENING
UNDER
SOLDER MASK
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)
4220323/A 03/2016
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RSE0008A UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
6X (0.55)
1 7
4X (0.25)
SYMM
(1.3)
4X (0.5) 2X (0.2)
5
3
4
2X
(0.3)
(1.35)
4220323/A 03/2016
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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