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Copperset - Through-Hole Plating System
Copperset - Through-hole Plating System
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Copperset - Through-Hole Plating System
Copperset - Through-hole Plating System
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gblackwe
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OPPERSET THROUGH-HOLE PLATING SYSTEM © Converts plain holes in PCBs to plated through-holes © Selective system - no need to process whole board @ No tooling charges, no waiting © Dramatically reduces cost compared with alternative systems @ Invaluable for prototyping and repairs @ Portable kit for fast, on-the-spot hole conversion COPPERSET * SYSTEM CSSO01 Coppersetis a simple manual system which allows plain holes in PCBs to be through plated instanty, at a fraction of the cost of alternative methods. it can be used whenever a plated throughhole is required - particularly under components such as header blocks or displays, where top soldering is impossible The kit contains the tools and materials necessary to form plated through-holes in standard PCBs with a thickness of 1.6mm (0.062in). The only addtional equipment required isa soldering iron and a pump or vacuum desoldering toolFR gee) ‘plain hole in a PCB is converted to a plated throughthole by inserting a thin copper sleeve which is mounted on a solder core to assist insertion. The solderiled sleeves, called bails are supplied as a length of baitbar which is scored at infervas so that each bail can easily be separated Solder cqro Bail-bar (Scale x15) ‘The bailbar is manufactured by plating a length of solder vare wth 25-30 microns of tihpurty copper followed by a protective coat of tin. The length of the ball is slightly greater than the thickness of the PCB. In use, the bai-bar is Inserted in an accurately sized hole and a bail is broken off Pad Pos. Bail after insertion in reamed hole Using an automatic punch and a small anvil the bail is then expanded to ft the hole tightly. Nose-piece ‘ot punch Expanding the bail ‘After expansion After expansion ofthe bail the top and bottom sides of the hole are first soldered and then the solder core is removed with normal desoldering equipment to leave a copper lined and tinned through-hole. ‘After soldering ifthe hole is to be used only as a via, desoldering is not necessary. It ‘After desoldering. AMOK 1200 fetes, Qube HIS SOMES Se dass Mere MULTICORE SOLDERS Extensive testing has shown that the system is fast and feliable n use. the copper ining remains securely attached to the bore, and when the board is soldered, solder wil travel up the plated hole and produce a satisfactory top joint provided that a correctly sized component is present in the hole. Plated hole after component insertion and soldering HOW TO USE COPPERSET Note: To be suitable for plating, holes inthe PCB must not be larger than the intended finished hole size. 1. Depending on the required hole size, the appropriate colour coded reamer is used to size the hole. i the reamer is loose in the hole the next size up must be selected. . The hole is placed over the anvil, a bail-bar of the correct size is inserted using 2 feeder tube and a bail is broken off by gentle rocking, . The automatic punch is used to expand the bal nto the ole. x » - Both sides of the hole are soldered to ensure a good electrical connection between the pads and the Bail. 3. To complete the process the hole is desoldered. eee ac ales Multicore Copperset should be used in accordance with 00d soldering practice, ensuring cleanness, adequate Component solderabilty and the use of appropriate solder and fux ue LEAL) The Copperset kitis supplied in a lightweight case containing sufficient bail bars and other materials to convert 500 holes in each of three sizes - 0.8mm (0.031in), 1.0mm (0.039in), and 1.2mm (0.047in) ‘The kit includes an automatic punch with alternative nosepieces to match the three hole sizes, three sets of Feamers and feeder tubes, an anvil base and two sizes of anvil mm and 8mm). The smaller anvil is for use where access is restricted. Feeder tubes and reamers are made ‘rom antrstatic materials. ‘The kitis completed with a pack of 38swg connecti wire, dispensers of solder wire and desoldering wick an full instructions. Copperset is produced under licence from Telco International Limited. European Patent 0363074. US Patent 5,025,553 and worldwide patents pending. Seale) toi dos tox tease. SEO Tatas ia a Tues Re Te SRP Me eae oa MUA Ret 168.198
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