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Simple Conduction Example: 1. Give Example A Title 2. Create Geometry

This tutorial demonstrates a simple conduction example in ANSYS 7.0. The block has sides constrained to temperatures of 100C and the top constrained to 500C. The material has a thermal conductivity of 10 W/m*C. ANSYS is used to preprocess the geometry, apply the material properties, mesh the model, define the steady-state analysis type, apply the temperature constraints, solve the system, and postprocess the results by plotting the temperature contour. The results show the expected linear temperature gradient from 100C on the sides and bottom to 500C on the top, with the top corners affected by the order of applying the boundary conditions.

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0% found this document useful (0 votes)
123 views4 pages

Simple Conduction Example: 1. Give Example A Title 2. Create Geometry

This tutorial demonstrates a simple conduction example in ANSYS 7.0. The block has sides constrained to temperatures of 100C and the top constrained to 500C. The material has a thermal conductivity of 10 W/m*C. ANSYS is used to preprocess the geometry, apply the material properties, mesh the model, define the steady-state analysis type, apply the temperature constraints, solve the system, and postprocess the results by plotting the temperature contour. The results show the expected linear temperature gradient from 100C on the sides and bottom to 500C on the top, with the top corners affected by the order of applying the boundary conditions.

Uploaded by

sandeep
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Simple Conduction Example

Introduction
This tutorial was created using ANSYS 7.0 to solve a simple conduction problem.

The Simple Conduction Example is constrained as shown in the following figure. Thermal conductivity (k) of
the material is 10 W/m*C and the block is assumed to be infinitely long.

Preprocessing: Defining the Problem


1. Give example a Title

2. Create geometry
Preprocessor > Modeling > Create > Areas > Rectangle > By 2 Corners > X=0, Y=0,
Width=1, Height=1
BLC4,0,0,1,1

3. Define the Type of Element


Preprocessor > Element Type > Add/Edit/Delete... > click 'Add' > Select Thermal Solid, Quad
4Node 55
ET,1,PLANE55
For this example, we will use PLANE55 (Thermal Solid, Quad 4node 55). This element has 4 nodes and a
single DOF (temperature) at each node. PLANE55 can only be used for 2 dimensional steady-state or transient
thermal analysis.

4. Element Material Properties


Preprocessor > Material Props > Material Models > Thermal > Conductivity > Isotropic > KXX =
10 (Thermal conductivity)
MP,KXX,1,10

5. Mesh Size
Preprocessor > Meshing > Size Cntrls > ManualSize > Areas > All Areas > 0.05
AESIZE,ALL,0.05

6. Mesh
Preprocessor > Meshing > Mesh > Areas > Free > Pick All
AMESH,ALL

Solution Phase: Assigning Loads and Solving


1. Define Analysis Type
Solution > Analysis Type > New Analysis > Steady-State
ANTYPE,0

2. Apply Constraints

For thermal problems, constraints can be in the form of Temperature, Heat Flow, Convection, Heat Flux,
Heat Generation, or Radiation. In this example, all 4 sides of the block have fixed temperatures.

Solution > Define Loads > Apply


Note that all of the -Structural- options cannot be selected. This is due to the type of element
(PLANE55) selected.

Thermal > Temperature > On Nodes

Click theBoxoption (shown below) and draw a box around the nodes on the top line.
The following window will appear:

Fill the window in as shown to constrain the side to a constant temperature of

500Using the same method, constrain the remaining 3 sides to a constant value of

100

Orange triangles in the graphics window indicate the temperature contraints.

3. Solve the System


Solution > Solve > Current LS
SOLVE
Postprocessing: Viewing the Results
1. Results Using ANSYS

Plot Temperature
General Postproc > Plot Results > Contour Plot > Nodal Solu ... > DOF solution, Temperature
TEMP

Note that due to the manner in which the boundary contitions were applied, the top corners are held at a
temperature of 100. Recall that the nodes on the top of the plate were constrained first, followed by the
side and bottom constraints. The top corner nodes were therefore first constrained at 500C, then
'overwritten' when the side constraints were applied. Decreasing the mesh size can minimize this effect,
however, one must be aware of the limitations in the results at the corners.

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