Presentation On 80ghz Antenna Integrated
Presentation On 80ghz Antenna Integrated
Presentation On 80ghz Antenna Integrated
ANTENNA DESIGN:
The low resistivity 12/cm and high permittivity r=11.7, of the
BiCMOS9MW substrate are not suited for the implementation of antenna.
Some techniques such as multilayers topology or packaged antennas can
be explored to compensate for the substrate loss. In this paper, as we aim
to investigate the potentiality of a raw integration of the antenna onto the
silicon, none of these techniques are used.
Two techniques can be used: a completely non-resonant antenna, such
as a Vivaldi antenna; or a resonant antenna, such as a dipole antenna, but
not sized at its resonance length. The two solutions have been
investigated, and the dipole antenna was chosen, for integration purposes.
Ansoft HFSSTM, a 3D full-wave electromagnetic software based on
Finite Elements Method (FEM), has been used to design the antenna. The
accuracy of EM simulation depends on the description of the silicon back
end. To save computation time, the original BEOL of the technology has
been simplified to the profile proposed in Fig. 5. The Si thickness and
properties are kept the same, the 4 first oxides are simplified to an
equivalent layer, namely Dielectric or Diel, and the 2 upper metal levels,
Metal 6 and Alucap, with the inter oxide are independant layers.
Dipole antennas, usually exploited at the resonance frequency, exhibit
a resistive impedance. However, the design of an inductive dipole
antenna is possible if is geometry is different to its resonance size. To
address the specifications imposed by the LNA input impedance, the size
of a resonating dipole antenna has been reduced.The radiating element
implemented with metal 1, features a balun-based ground plane to
prevent the radiation of the antenna to the active part as illustrated in Fig.
6. Power transmission from the LNA to the antenna is made through a /4
open-stub transmission line. However, the open stub may radiate to cause
coupling effect and power losses. Hence, instead of an open stub, a via is
designed between the metal 6 microstrip line and the antenna.