MCP1702

250 mA Low Quiescent Current LDO Regulator

Features Description
2.0 A Quiescent Current (typical) The MCP1702 is a family of CMOS low dropout (LDO)
Input Operating Voltage Range: 2.7V to 13.2V voltage regulators that can deliver up to 250 mA of
250 mA Output Current for Output Voltages 2.5V current while consuming only 2.0 A of quiescent
current (typical). The input operating range is specified
200 mA Output Current for Output Voltages < 2.5V
from 2.7V to 13.2V, making it an ideal choice for two to
Low Dropout (LDO) voltage six primary cell battery-powered applications, 9V alka-
- 625 mV typical @ 250 mA (VOUT = 2.8V) line and one or two cell Li-Ion-powered applications.
0.4% Typical Output Voltage Tolerance The MCP1702 is capable of delivering 250 mA with
Standard Output Voltage Options: only 625 mV (typical) of input to output voltage
- 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, differential (VOUT = 2.8V). The output voltage tolerance
5.0V of the MCP1702 is typically 0.4% at +25C and 3%
Output voltage range 1.2V to 5.5V in 0.1V maximum over the operating junction temperature
Increments (50 mV increments available upon range of -40C to +125C. Line regulation is 0.1%
request) typical at +25C.
Stable with 1.0 F to 22 F Output Capacitor Output voltages available for the MCP1702 range from
Short-Circuit Protection 1.2V to 5.0V. The LDO output is stable when using only
1 F of output capacitance. Ceramic, tantalum or
Overtemperature Protection
aluminum electrolytic capacitors can all be used for
input and output. Overcurrent limit and
Applications overtemperature shutdown provide a robust solution
Battery-powered Devices for any application.
Battery-powered Alarm Circuits Package options include the SOT-23A, SOT89-3, and
Smoke Detectors TO-92.
CO2 Detectors
Pagers and Cellular Phones
Package Types
Smart Battery Packs 3-Pin SOT-23A 3-Pin SOT-89
Low Quiescent Current Voltage Reference VIN VIN
PDAs
3
Digital Cameras
MCP1702
Microcontroller Power MCP1702
Solar-Powered Instruments 1 2 3
1 2
Consumer Products
GND VOUT GND VIN VOUT
Battery Powered Data Loggers

3-Pin TO-92
Related Literature
123
AN765, Using Microchips Micropower LDOs,
DS00765, Microchip Technology Inc., 2002
AN766, Pin-Compatible CMOS Upgrades to Bottom
BiPolar LDOs, DS00766, View
Microchip Technology Inc., 2002
AN792, A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application, GND VIN VOUT
DS00792, Microchip Technology Inc., 2001

2006 Microchip Technology Inc. DS22008A-page 1

MCP1702
Functional Block Diagrams

MCP1702

VIN VOUT

Error Amplifier
+VIN
Voltage
-
Reference
+

Overcurrent
Overtemperature

GND

Typical Application Circuits

MCP1702
VOUT
3.3V
VOUT
VIN IOUT
VIN COUT 50 mA
9V + 1 F Ceramic
CIN GND
Battery 1 F Ceramic

DS22008A-page 2 2006 Microchip Technology Inc.

 MCP1702
1.0 ELECTRICAL Notice: Stresses above those listed under Maximum Rat-
ings may cause permanent damage to the device. This is a
CHARACTERISTICS stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
Absolute Maximum Ratings operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
VDD...............................................................................+14.5V affect device reliability.
All inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V)
Peak Output Current ...................................................500 mA
Storage temperature .....................................-65C to +150C
Maximum Junction Temperature ................................... 150C
Operating Junction Temperature...................-40C to +125C
ESD protection on all pins (HBM;MM)............... 4 kV; 400V

DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C.
Boldface type applies for junction temperatures, TJ of -40C to +125C. (Note 7)
Parameters Sym Min Typ Max Units Conditions
Input / Output Characteristics
Input Operating Voltage VIN 2.7 13.2 V Note 1
Input Quiescent Current Iq 2.0 5 A IL = 0 mA
Maximum Output Current IOUT_mA 250 mA For VR 2.5V
50 100 mA For VR < 2.5V, VIN 2.7V
100 130 mA For VR < 2.5V, VIN 2.95V
150 200 mA For VR < 2.5V, VIN 3.2V
200 250 mA For VR < 2.5V, VIN 3.45V
Output Short Circuit Current IOUT_SC 400 mA VIN = VIN(MIN) (Note 1), VOUT = GND,
Current (average current) measured
10 ms after short is applied.
Output Voltage Regulation VOUT VR-3.0% VR0.4 VR+3.0% V Note 2
VR-2.0% % VR+2.0%
VOUT Temperature Coefficient TCVOUT 50 150 ppm/C Note 3
Line Regulation VOUT/ -0.3 0.1 +0.3 %/V (VOUT(MAX) + VDROPOUT(MAX))
(VOUTXVIN) VIN 13.2V, (Note 1)
Load Regulation VOUT/VOUT -2.5 1.0 +2.5 % IL = 1.0 mA to 250 mA for VR 2.5V
IL = 1.0 mA to 200 mA for VR < 2.5V,
VIN = 3.45V Note 4
Note 1: The minimum VIN must meet two conditions: VIN 2.7V and VIN VOUT(MAX) + VDROPOUT(MAX).
2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 A.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the
temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained
junction temperatures above 150C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.

2006 Microchip Technology Inc. DS22008A-page 3

MCP1702
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C.
Boldface type applies for junction temperatures, TJ of -40C to +125C. (Note 7)
Parameters Sym Min Typ Max Units Conditions
Dropout Voltage VDROPOUT 330 650 mV IL = 250 mA, VR = 5.0V
(Note 1, Note 5) 525 725 mV IL = 250 mA, 3.3V VR < 5.0V
625 975 mV IL = 250 mA, 2.8V VR < 3.3V
750 1100 mV IL = 250 mA, 2.5V VR < 2.8V
mV VR < 2.5V, See Maximum Output
Current Parameter
Output Delay Time TDELAY 1000 s VIN = 0V to 6V, VOUT = 90% VR
RL = 50 resistive
Output Noise eN 8 V/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 F
Power Supply Ripple PSRR 44 dB f = 100 Hz, COUT = 1 F, IL = 50 mA,
Rejection Ratio VINAC = 100 mV pk-pk, CIN = 0 F,
VR = 1.2V
Thermal Shutdown Protection TSD 150 C
Note 1: The minimum VIN must meet two conditions: VIN 2.7V and VIN VOUT(MAX) + VDROPOUT(MAX).
2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 A.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the
temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained
junction temperatures above 150C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.

TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise specified, all limits are established for VIN = VR + 1V or 2.7V, whichever is greater,
ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C.
Boldface type applies for junction temperatures, TJ (Note 1) of -40C to +125C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TJ -40 +125 C
Operating Temperature Range TJ -40 +125 C
Storage Temperature Range TA -65 +150 C
Thermal Package Resistance
Thermal Resistance, SOT-23A EIA/JEDEC JESD51-7
JA 336 C/W
FR-4 0.063 4-Layer Board
Thermal Resistance, SOT89 EIA/JEDEC JESD51-7
JA 52 C/W
FR-4 0.063 4-Layer Board
Thermal Resistance, TO-92 JA 131.9 C/W
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained
junction temperatures above 150C can impact the device reliability.

DS22008A-page 4 2006 Microchip Technology Inc.

 MCP1702
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A,
TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).
Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction
temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.

5.00 120.00
VOUT = 1.2V Temperature = +25C
Quiescent Current (A)

4.00 100.00

GND Current (A)

+130C
VOUT = 1.2V
0C 80.00
3.00 +90C VIN = 2.7V
+25C
60.00
2.00
40.00
1.00 -45C 20.00

0.00 0.00
2 4 6 8 10 12 14 0 40 80 120 160 200
Input Voltage (V) Load Current (mA)

FIGURE 2-1: Quiescent Current vs. Input FIGURE 2-4: Ground Current vs. Load
Voltage. Current.

5.00 120.00
VOUT = 2.8V Temperature = +25C
Quiescent Current (A)

4.00 100.00
VOUT = 5.0V
GND Current (A)

+130C
VIN = 6.0V
80.00
3.00 +90C
+25C
60.00
2.00
0C 40.00 VOUT = 2.8V
VIN = 3.8V
1.00 -45C 20.00

0.00 0.00
3 5 7 9 11 13 0 50 100 150 200 250
Input Voltage (V) Load Current (mA)

FIGURE 2-2: Quiescent Current vs.Input FIGURE 2-5: Ground Current vs. Load
Voltage. Current.

5.00 3.00
VOUT = 5.0V VOUT = 2.8V IOUT = 0 mA
VOUT = 5.0V
Quiescent Current (A)
Quiescent Current (A)

2.50 VIN = 3.8V VIN = 6.0V

4.00 +130C
2.00

3.00 1.50
VOUT = 1.2V
+90C VIN = 2.7V
1.00
2.00 0C
+25C
0.50
-45C
1.00 0.00
6 7 8 9 10 11 12 13 14 -45 -20 5 30 55 80 105 130

Input Voltage (V) Junction Temperature (C)

FIGURE 2-3: Quiescent Current vs.Input FIGURE 2-6: Quiescent Current vs.
Voltage. Junction Temperature.

2006 Microchip Technology Inc. DS22008A-page 5

MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A,
TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).

1.24 1.23
VOUT = 1.2V VOUT = 1.2V
1.23 ILOAD = 0.1 mA 0C
1.22
Output Voltage (V)

Output Voltage (V)

-45C -45C
1.22 0C
1.21
+25C
1.21
1.20 +90C
1.20 +130C +130C
+90C
1.19
+25C 1.19

1.18 1.18
2 4 6 8 10 12 14 0 20 40 60 80 100
Input Voltage (V) Load Current (mA)

FIGURE 2-7: Output Voltage vs. Input FIGURE 2-10: Output Voltage vs. Load
Voltage. Current.

2.85 2.83
VOUT = 2.8V VOUT = 2.8V
2.84 ILOAD = 0.1 mA 2.82 +130C
Output Voltage (V)

Output Voltage (V)

2.83 +130C +90C
+90C 2.81
2.82
2.81 2.80
2.80
2.79
2.79 0C 0C
-45C +25C
+25C 2.78
2.78 -45C

2.77 2.77
3 4 5 6 7 8 9 10 11 12 13 14 0 50 100 150 200 250
Input Voltage (V) Load Current (mA)

FIGURE 2-8: Output Voltage vs. Input FIGURE 2-11: Output Voltage vs. Load
Voltage. Current.

5.04
VOUT = 5.0V VOUT = 5.0V
5.06 5.03
ILOAD = 0.1 mA
+130C
Output Voltage (V)

Output Voltage (V)

5.04 +130C 5.02 +90C

+90C
5.01
5.02
5.00
5.00 4.99 0C
0C -45C
4.98
4.98 +25C +25C
4.97 -45C

4.96 4.96
6 7 8 9 10 11 12 13 14 0 50 100 150 200 250
Input Voltage (V) Load Current (mA)

FIGURE 2-9: Output Voltage vs. Input FIGURE 2-12: Output Voltage vs. Load
Voltage. Current.

DS22008A-page 6 2006 Microchip Technology Inc.

 MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A,
TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).

1.40
VOUT = 1.8V
1.30 +130C
Dropout Voltage (V)

+90C
1.20
+25C
1.10
1.00
0C
0.90
-45C
0.80
0.70
0.60
100 120 140 160 180 200

Load Current (mA)

FIGURE 2-13: Dropout Voltage vs. Load FIGURE 2-16: Dynamic Line Response.
Current.

1.00
VOUT = 2.8V
0.90
0.80
Dropout Voltage (V)

+130C
0.70 +90C
0.60
+25C
0.50
0.40
+0C
0.30
-45C
0.20
0.10
0.00
0 25 50 75 100 125 150 175 200 225 250
Load Current (mA)

FIGURE 2-14: Dropout Voltage vs. Load FIGURE 2-17: Dynamic Line Response.
Current.

0.50 600.00
VOUT = 5.0V VOUT = 2.8V
Short Circuit Current (mA)

0.45 ROUT < 0.1

500.00
0.40
Dropout Voltage (V)

+130C
0.35 +90C 400.00
0.30
+25C 300.00
0.25
0.20
+0C 200.00
0.15
-45C
0.10 100.00
0.05
0.00 0.00
0 25 50 75 100 125 150 175 200 225 250 4 6 8 10 12 14

Load Current (mA) Input Voltage (V)

FIGURE 2-15: Dropout Voltage vs. Load FIGURE 2-18: Short Circuit Current vs.
Current. Input Voltage.

2006 Microchip Technology Inc. DS22008A-page 7

MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A,
TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).

0.20 0.20
VIN = 6V VOUT = 1.2V
0.15
VIN = 2.7V to 13.2V

Line Regulation (%/V)

Load Regulation (%)

0.10 0.16
0.05
0.00 0.12
-0.05 1 mA
VIN = 4V
-0.10 VIN = 10V VIN = 12V 0.08
0 mA
-0.15
-0.20 VIN = 13.2V 0.04 100 mA
VOUT = 1.2V
-0.25 ILOAD = 0.1 mA to 200 mA
-0.30 0.00
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
Temperature (C) Temperature (C)

FIGURE 2-19: Load Regulation vs. FIGURE 2-22: Line Regulation vs.
Temperature. Temperature.

0.40 0.20
VOUT = 2.8V VOUT = 2.8V
0.30
ILOAD = 1 mA to 250 mA VIN = 3.8V to 13.2V

Line Regulation (%/V)

Load Regulation (%)

0.20 0.16
250 mA
0.10
0.00 0.12 200 mA

-0.10
-0.20 VIN = 6V 0.08
0 mA
-0.30 VIN = 10V 100 mA
-0.40 VIN = 13.2V 0.04
VIN = 3.8V
-0.50
-0.60 0.00
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
Temperature (C) Temperature (C)

FIGURE 2-20: Load Regulation vs. FIGURE 2-23: Line Regulation vs.
Temperature. Temperature.

0.40 0.16
VOUT = 5.0V VOUT = 5.0V
ILOAD = 1 mA to 250 mA VIN = 6.0V to 13.2V
Line Regulation (%/V)
Load Regulation (%)

0.30 VIN = 6V 0.14

0.20 0.12 200 mA

250 mA
0 mA
0.10 0.10
VIN = 10V
VIN = 8V
0.00 0.08 100 mA
VIN = 13.2V
-0.10 0.06
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
Temperature (C) Temperature (C)

FIGURE 2-21: Load Regulation vs. FIGURE 2-24: Line Regulation vs.
Temperature. Temperature.

DS22008A-page 8 2006 Microchip Technology Inc.

 MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A,
TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).

0
-10
-20
-30
PSRR (dB)

-40
-50 VR=1.2V
-60 COUT=1.0 F ceramic X7R
VIN=2.7V
-70 CIN=0 F
-80 IOUT=1.0 mA
-90
0.01 0.1 1 10 100 1000
Frequency (kHz)

FIGURE 2-25: Power Supply Ripple FIGURE 2-28: Power Up Timing.

Rejection vs. Frequency.

0
-10
-20
-30
PSRR (dB)

-40
-50 VR=5.0V
-60 COUT=1.0 F ceramic X7R
VIN=6.0V
-70 CIN=0 F
-80 IOUT=1.0 mA
-90
0.01 0.1 1 10 100 1000
Frequency (kHz)

FIGURE 2-26: Power Supply Ripple FIGURE 2-29: Dynamic Load Response.
Rejection vs. Frequency.

100
VR=5.0V, VIN=6.0V IOUT=50 mA

10
Noise (V/Hz)

VR=2,8V, VIN=3.8V
1

0.1 VR=1.2V, VIN=2.7V

0.01

0.001
0.01 0.1 1 10 100 1000
Frequency (kHz)

FIGURE 2-27: Output Noise vs. Frequency. FIGURE 2-30: Dynamic Load Response.

2006 Microchip Technology Inc. DS22008A-page 9

MCP1702
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin No. Pin No. Pin No.
Symbol Function
SOT-23A SOT-89 TO-92
1 1 1 GND Ground Terminal
2 3 3 VOUT Regulated Voltage Output
3 2, Tab 2 VIN Unregulated Supply Voltage
NC No connection

3.1 Ground Terminal (GND) 3.3 Unregulated Input Voltage Pin

Regulator ground. Tie GND to the negative side of the
(VIN)
output and the negative side of the input capacitor. Connect VIN to the input unregulated source voltage.
Only the LDO bias current (2.0 A typical) flows out of Like all LDO linear regulators, low source impedance is
this pin; there is no high current. The LDO output necessary for the stable operation of the LDO. The
regulation is referenced to this pin. Minimize voltage amount of capacitance required to ensure low source
drops between this pin and the negative side of the impedance will depend on the proximity of the input
load. source capacitors or battery type. For most
applications, 1 F of capacitance will ensure stable
3.2 Regulated Output Voltage (VOUT) operation of the LDO circuit. For applications that have
load currents below 100 mA, the input capacitance
Connect VOUT to the positive side of the load and the requirement can be lowered. The type of capacitor
positive terminal of the output capacitor. The positive used can be ceramic, tantalum or aluminum
side of the output capacitor should be physically electrolytic. The low ESR characteristics of the ceramic
located as close to the LDO VOUT pin as is practical. will yield better noise and PSRR performance at high-
The current flowing out of this pin is equal to the DC frequency.
load current.

DS22008A-page 10 2006 Microchip Technology Inc.

 MCP1702
4.0 DETAILED DESCRIPTION

4.1 Output Regulation device for a short period, after which the LDO will
attempt to restart. If the excessive current remains, the
A portion of the LDO output voltage is fed back to the cycle will repeat itself.
internal error amplifier and compared with the precision
internal bandgap reference. The error amplifier output
4.3 Overtemperature
will adjust the amount of current that flows through the
P-Channel pass transistor, thus regulating the output The internal power dissipation within the LDO is a
voltage to the desired value. Any changes in input function of input-to-output voltage differential and load
voltage or output current will cause the error amplifier current. If the power dissipation within the LDO is
to respond and adjust the output voltage to the target excessive, the internal junction temperature will rise
voltage (refer to Figure 4-1). above the typical shutdown threshold of 150C. At that
point, the LDO will shut down and begin to cool to the
4.2 Overcurrent typical turn-on junction temperature of 130C. If the
power dissipation is low enough, the device will
The MCP1702 internal circuitry monitors the amount of continue to cool and operate normally. If the power
current flowing through the P-Channel pass transistor. dissipation remains high, the thermal shutdown
In the event of a short-circuit or excessive output protection circuitry will again turn off the LDO,
current, the MCP1702 will turn off the P-Channel

MCP1702

VIN VOUT

Error Amplifier
+VIN
Voltage
-
Reference
+

Overcurrent
Overtemperature

GND

FIGURE 4-1: Block Diagram.

2006 Microchip Technology Inc. DS22008A-page 11

MCP1702
5.0 FUNCTIONAL DESCRIPTION 5.2 Output
The MCP1702 CMOS LDO linear regulator is intended The maximum rated continuous output current for the
for applications that need the lowest current consump- MCP1702 is 250 mA (VR 2.5V). For applications
tion while maintaining output voltage regulation. The where VR < 2.5V, the maximum output current is
operating continuous load range of the MCP1702 is 200 mA.
from 0 mA to 250 mA (VR 2.5V). The input operating A minimum output capacitance of 1.0 F is required for
voltage range is from 2.7V to 13.2V, making it capable small signal stability in applications that have up to
of operating from two or more alkaline cells or single 250 mA output current capability. The capacitor type
and multiple Li-Ion cell batteries. can be ceramic, tantalum or aluminum electrolytic. The
esr range on the output capacitor can range from 0 to
5.1 Input 2.0.
The input of the MCP1702 is connected to the source
of the P-Channel PMOS pass transistor. As with all 5.3 Output Rise time
LDO circuits, a relatively low source impedance (10) When powering up the internal reference output, the
is needed to prevent the input impedance from causing typical output rise time of 500 s is controlled to
the LDO to become unstable. The size and type of the prevent overshoot of the output voltage. There is also a
capacitor needed depends heavily on the input source startup delay time that ranges from 300 s to 800 s
type (battery, power supply) and the output current based on loading. The startup time is separate from
range of the application. For most applications (up to and precedes the Output Rise Time. The total output
100 mA), a 1 F ceramic capacitor will be sufficient to delay is the Startup Delay plus the Output Rise time.
ensure circuit stability. Larger values can be used to
improve circuit AC performance.

DS22008A-page 12 2006 Microchip Technology Inc.

 MCP1702
6.0 APPLICATION CIRCUITS AND EQUATION 6-2:
ISSUES T J ( MAX ) = P TOTAL R JA + T AMAX
Where:
6.1 Typical Application TJ(MAX) = Maximum continuous junction
The MCP1702 is most commonly used as a voltage temperature
regulator. Its low quiescent current and low dropout PTOTAL = Total device power dissipation
voltage makes it ideal for many battery-powered
RJA Thermal resistance from
applications.
junction to ambient
TAMAX = Maximum ambient temperature
MCP1702
VIN
GND The maximum power dissipation capability for a
VOUT (2.8V to 3.2V)
VIN package can be calculated given the junction-to-
1.8V CIN
VOUT ambient thermal resistance and the maximum ambient
IOUT 1 F Ceramic temperature for the application. The following equation
COUT
150 mA can be used to determine the package maximum
1 F Ceramic
internal power dissipation.

FIGURE 6-1: Typical Application Circuit. EQUATION 6-3:

( T J ( MAX ) T A ( MAX ) )
6.1.1 APPLICATION INPUT CONDITIONS P D ( MAX ) = ---------------------------------------------------
R JA
Package Type = SOT-23A Where:
Input Voltage Range = 2.8V to 3.2V
PD(MAX) = Maximum device power
VIN maximum = 3.2V dissipation
VOUT typical = 1.8V TJ(MAX) = Maximum continuous junction
IOUT = 150 mA maximum temperature
TA(MAX) Maximum ambient temperature
6.2 Power Calculations RJA = Thermal resistance from
junction to ambient
6.2.1 POWER DISSIPATION
The internal power dissipation of the MCP1702 is a
function of input voltage, output voltage and output EQUATION 6-4:
current. The power dissipation, as a result of the T J ( RISE ) = P D ( MAX ) R JA
quiescent current draw, is so low, it is insignificant
(2.0 A x VIN). The following equation can be used to Where:
calculate the internal power dissipation of the LDO.
TJ(RISE) = Rise in device junction
EQUATION 6-1: temperature over the ambient
temperature
P LDO = ( V IN ( MAX ) ) V OUT ( MIN ) ) I OUT ( MAX ) )
PTOTAL = Maximum device power
Where: dissipation
PLDO = LDO Pass device internal RJA Thermal resistance from
power dissipation junction to ambient
VIN(MAX) = Maximum input voltage
VOUT(MIN) = LDO minimum output voltage EQUATION 6-5:
T J = T J ( RISE ) + T A
The maximum continuous operating junction
Where:
temperature specified for the MCP1702 is +125C. To
estimate the internal junction temperature of the TJ = Junction Temperature
MCP1702, the total internal power dissipation is TJ(RISE) = Rise in device junction
multiplied by the thermal resistance from junction to temperature over the ambient
ambient (RJA). The thermal resistance from junction to temperature
ambient for the SOT-23A pin package is estimated at
336 C/W. TA Ambient temperature

2006 Microchip Technology Inc. DS22008A-page 13

MCP1702
6.3 Voltage Regulator Junction Temperature Estimate
Internal power dissipation, junction temperature rise, To estimate the internal junction temperature, the
junction temperature and maximum power dissipation calculated temperature rise is added to the ambient or
are calculated in the following example. The power offset temperature. For this example, the worst-case
dissipation, as a result of ground current, is small junction temperature is estimated below.
enough to be neglected.
TJ = TJRISE + TA(MAX)
6.3.1 POWER DISSIPATION EXAMPLE TJ = 113.3C
Package Maximum Package Power Dissipation at +40C
Package Type = SOT23 Ambient Temperature
Input Voltage SOT23 (336.0C/Watt = RJA)
VIN = 2.8V to 3.2V PD(MAX) = (125C - 40C) / 336C/W
LDO Output Voltages and Currents PD(MAX) = 253 milli-Watts
VOUT = 1.8V SOT89 (52C/Watt = RJA)
IOUT = 150 mA PD(MAX) = (125C - 40C) / 52C/W
Maximum Ambient Temperature PD(MAX) = 1.635 Watts
TA(MAX) = +40C TO92 (131.9C/Watt = RJA)
Internal Power Dissipation PD(MAX) = (125C - 40C) / 131.9C/W
Internal Power dissipation is the product of the LDO PD(MAX) = 644 milli-Watts
output current times the voltage across the LDO
(VIN to VOUT). 6.4 Voltage Reference
PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x
IOUT(MAX) The MCP1702 can be used not only as a regulator, but
also as a low quiescent current voltage reference. In
PLDO = (3.2V - (0.97 x 1.8V)) x 150 mA
many microcontroller applications, the initial accuracy
PLDO = 218.1 milli-Watts of the reference can be calibrated using production test
equipment or by using a ratio measurement. When the
Device Junction Temperature Rise initial accuracy is calibrated, the thermal stability and
line regulation tolerance are the only errors introduced
The internal junction temperature rise is a function of by the MCP1702 LDO. The low-cost, low quiescent
internal power dissipation and the thermal resistance current and small ceramic output capacitor are all
from junction to ambient for the application. The thermal advantages when using the MCP1702 as a voltage
resistance from junction to ambient (RJA) is derived reference.
from an EIA/JEDEC standard for measuring thermal
resistance for small surface mount packages. The EIA/
Ratio Metric Reference
JEDEC specification is JESD51-7, High Effective
Thermal Conductivity Test Board for Leaded Surface 2 A Bias PICmicro
Mount Packages. The standard describes the test MCP1702 Microcontroller
method and board specifications for measuring the VIN
CIN VOUT VREF
thermal resistance from junction to ambient. The actual 1 F COUT
GND 1 F
thermal resistance for a particular application can vary
depending on many factors, such as copper area and ADO
thickness. Refer to AN792, A Method to Determine AD1
How Much Power a SOT23 Can Dissipate in an
Application, (DS00792), for more information regarding Bridge Sensor
this subject.
TJ(RISE) = PTOTAL x RqJA
FIGURE 6-2: Using the MCP1702 as a
TJRISE = 218.1 milli-Watts x 336.0C/Watt
voltage reference.
TJRISE = 73.3C

DS22008A-page 14 2006 Microchip Technology Inc.

 MCP1702
6.5 Pulsed Load Applications
For some applications, there are pulsed load current
events that may exceed the specified 250 mA
maximum specification of the MCP1702. The internal
current limit of the MCP1702 will prevent high peak
load demands from causing non-recoverable damage.
The 250 mA rating is a maximum average continuous
rating. As long as the average current does not exceed
250 mA, pulsed higher load currents can be applied to
the MCP1702. The typical current limit for the
MCP1702 is 500 mA (TA +25C).

2006 Microchip Technology Inc. DS22008A-page 15

MCP1702
7.0 PACKAGING INFORMATION

7.1 Package Marking Information

3-Pin SOT-23A Example:
Standard
Extended Temp
Symbol Voltage * Symbol Voltage *
XXNN HA 1.2 HF 3.0 HANN
HB 1.5 HG 3.3
HC 1.8 HH 4.0
HD 2.5 HJ 5.0
HE 2.8
* Custom output voltages available upon request.
Contact your local Microchip sales office for more
information.

3-Lead SOT-89 Standard Example

Extended Temp

XXXYYWW Symbol Voltage * Symbol Voltage * HA0619

NNN HA 1.2 HF 3.0 256
HB 1.5 HG 3.3
HC 1.8 HH 4.0
HD 2.5 HJ 5.0
HE 2.8
* Custom output voltages available upon request.
Contact your local Microchip sales office for more
information.

3-Lead TO-92 Example

XXXXXX 1702
XXXXXX 1202E
XXXXXX TO^^
e3
YWWNNN 619256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week 01)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS22008A-page 16 2006 Microchip Technology Inc.

 MCP1702
3-Lead Plastic Small Outline Transistor (CB) (SOT-23A)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

E1

B p1
D
n p

c A A2

L A1

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 3 3
Pitch p .037 BSC 0.95 BSC
Outside lead pitch (basic) p1 .075 BSC 1.90 BSC
Overall Height A .035 .055 0.90 1.40
Molded Package Thickness A2 .035 .051 0.90 1.30
Standoff A1 .000 .006 0.00 0.15
Overall Width E .098 .118 2.50 3.00
Molded Package Width E1 .055 .071 1.40 1.80
Overall Length D .106 .122 2.70 3.10
Foot Length L .014 .022 0.35 0.55
Foot Angle 0 10 0 10
Lead Thickness c .004 .014 0.10 0.35
Lead Width B .012 .019 0.30 0.50
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
EIAJ Equivalent: SC-59
Revised 09-14-05
Drawing No. C04-130

2006 Microchip Technology Inc. DS22008A-page 17

MCP1702
3-Lead Plastic Small Outline Transistor Header (MB) (SOT-89)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

H
E

B1

3
B

D D1 p1
2
p
R

1
B1

E1

Units INCHES MILLIMETERS*

Dimension Limits MIN MAX MIN MAX
Pitch p .059 BSC 1.50 BSC
Outside Lead Pitch p1 .118 BSC 3.00 BSC
Overall Height A .055 .063 1.40 1.60
Overall Width H .155 .167 3.94 4.25
Molded Package Width at Base E .090 .102 2.29 2.60
Molded Package Width at Top E1 .084 .090 2.13 2.29
Overall Length D .173 .181 4.40 4.60
Tab Length D1 .064 .072 1.62 1.83
Tab Corner Radii R .010 0.254
Foot Length L .035 .047 0.89 1.20
Lead Thickness c .014 .019 0.35 0.48
Lead 2 Width B .017 .022 0.43 0.56
Leads 1 & 3 Width B1 .014 .019 0.36 0.48

* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEDEC Equivalent: TO-243
Drawing No. C04-029 Revised 09-19-03

DS22008A-page 18 2006 Microchip Technology Inc.

 MCP1702
3-Lead Plastic Transistor Outline (TO) (TO-92)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

E1

1 n

1
2
3

B
p
c

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 3 3
Pitch p .050 1.27
Bottom to Package Flat A .130 .143 .155 3.30 3.62 3.94
Overall Width E1 .175 .186 .195 4.45 4.71 4.95
Overall Length D .170 .183 .195 4.32 4.64 4.95
Molded Package Radius R .085 .090 .095 2.16 2.29 2.41
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
Lead Thickness c .014 .017 .020 0.36 0.43 0.51
Lead Width B .016 .019 .022 0.41 0.48 0.56
Mold Draft Angle Top 4 5 6 4 5 6
Mold Draft Angle Bottom 2 3 4 2 3 4
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101

2006 Microchip Technology Inc. DS22008A-page 19

MCP1702
NOTES:

DS22008A-page 20 2006 Microchip Technology Inc.

 MCP1702
APPENDIX A: REVISION HISTORY

Revision A (September 2006)

Original Release of this Document.

2006 Microchip Technology Inc. DS22008A-page 21

MCP1702
NOTES:

DS22008A-page 22 2006 Microchip Technology Inc.

 MCP1702
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X- XX X X X/ XX Examples:

a) MCP1702T-1202I/CB: 1.2V LDO Positive
Device Tape Output Feature Tolerance Temp. Package Voltage Regulator,
and Reel Voltage Code SOT-23A-3 pkg.
b) MCP1702T-1802I/MB: 1.8V LDO Positive
Voltage Regulator,
Device: MCP1702: 2 A Low Dropout Positive Voltage Regulator
SOT89-3 pkg.
c) MCP1702T-2502I/CB: 2.5V LDO Positive
Tape and Reel: T = Tape and Reel Voltage Regulator,
SOT-23A-3 pkg.
Output Voltage *: 12 = 1.2V Standard d) MCP1702T-3002I/CB: 3.0V LDO Positive
15 = 1.5V Standard Voltage Regulator,
18 = 1.8V Standard SOT-23A-3 pkg.
25 = 2.5V Standard
28 = 2.8V Standard e) MCP1702T-3002I/MB: 3.0V LDO Positive
30 = 3.0V Standard Voltage Regulator,
33 = 3.3V Standard SOT89-3 pkg.
40 = 4.0V Standard
f) MCP1702T-3302I/CB: 3.3V LDO Positive
50 = 5.0V Standard
*Contact factory for other output voltage options. Voltage Regulator,
SOT-23A-3 pkg.
g) MCP1702T-3302I/MB: 3.3V LDO Positive
Extra Feature Code: 0 = Fixed
Voltage Regulator,
SOT89-3 pkg.
Tolerance: 2 = 2.0% (Standard) h) MCP1702T-4002I/CB: 4.0V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
Temperature: E = -40C to +125C
i) MCP1702T-5002I/TO: 5.0V LDO Positive
Voltage Regulator,
Package Type: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) TO-92 pkg.
MB = 3-Pin SOT-89
TO = 3-Pin TO-92 j) MCP1702T-5002I/CB: 5.0V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
k) MCP1702T-5002I/MB: 5.0V LDO Positive
Voltage Regulator,
SOT89-3 pkg.

2006 Microchip Technology Inc. DS22008A-page 23

MCP1702
NOTES:

DS22008A-page 24 2006 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Accuron,
and may be superseded by updates. It is your responsibility to
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
ensure that your application meets with your specifications.
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
MICROCHIP MAKES NO REPRESENTATIONS OR registered trademarks of Microchip Technology Incorporated
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
in the U.S.A. and other countries.
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
INCLUDING BUT NOT LIMITED TO ITS CONDITION, SEEVAL, SmartSensor and The Embedded Control Solutions
QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology
FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A.
arising from this information and its use. Use of Microchip Analog-for-the-Digital Age, Application Maestro, CodeGuard,
devices in life support and/or safety applications is entirely at dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
the buyers risk, and the buyer agrees to defend, indemnify and ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
hold harmless Microchip from any and all damages, claims, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
suits, or expenses resulting from such use. No licenses are Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
conveyed, implicitly or otherwise, under any Microchip PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
intellectual property rights. PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Companys quality system processes and procedures are for its
PICmicro 8-bit MCUs, KEELOQ code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchips quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.

2006 Microchip Technology Inc. DS22008A-page 25

 WORLDWIDE SALES AND SERVICE
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office India - Bangalore Austria - Wels
2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 91-80-4182-8400 Tel: 43-7242-2244-3910
Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 91-80-4182-8422 Fax: 43-7242-2244-393
Tel: 480-792-7200 Habour City, Kowloon India - New Delhi Denmark - Copenhagen
Fax: 480-792-7277 Hong Kong Tel: 45-4450-2828
Tel: 91-11-4160-8631
Technical Support: Tel: 852-2401-1200 Fax: 45-4485-2829
Fax: 91-11-4160-8632
http://support.microchip.com
Fax: 852-2401-3431 France - Paris
Web Address: India - Pune
Australia - Sydney Tel: 91-20-2566-1512 Tel: 33-1-69-53-63-20
www.microchip.com
Tel: 61-2-9868-6733 Fax: 91-20-2566-1513 Fax: 33-1-69-30-90-79
Atlanta Fax: 61-2-9868-6755
Alpharetta, GA Japan - Yokohama Germany - Munich
China - Beijing Tel: 81-45-471- 6166 Tel: 49-89-627-144-0
Tel: 770-640-0034
Tel: 86-10-8528-2100 Fax: 49-89-627-144-44
Fax: 770-640-0307 Fax: 81-45-471-6122
Fax: 86-10-8528-2104 Italy - Milan
Boston Korea - Gumi
China - Chengdu Tel: 39-0331-742611
Westborough, MA Tel: 82-54-473-4301
Tel: 86-28-8665-5511 Fax: 82-54-473-4302 Fax: 39-0331-466781
Tel: 774-760-0087
Fax: 86-28-8665-7889 Netherlands - Drunen
Fax: 774-760-0088 Korea - Seoul
China - Fuzhou Tel: 82-2-554-7200 Tel: 31-416-690399
Chicago
Itasca, IL Tel: 86-591-8750-3506 Fax: 82-2-558-5932 or Fax: 31-416-690340
Tel: 630-285-0071 Fax: 86-591-8750-3521 82-2-558-5934 Spain - Madrid
Fax: 630-285-0075 China - Hong Kong SAR Tel: 34-91-708-08-90
Malaysia - Penang
Tel: 852-2401-1200 Fax: 34-91-708-08-91
Dallas Tel: 60-4-646-8870
Addison, TX Fax: 852-2401-3431 Fax: 60-4-646-5086 UK - Wokingham
Tel: 972-818-7423 China - Qingdao Tel: 44-118-921-5869
Philippines - Manila
Fax: 972-818-2924 Tel: 86-532-8502-7355 Fax: 44-118-921-5820
Tel: 63-2-634-9065
Detroit Fax: 86-532-8502-7205 Fax: 63-2-634-9069
Farmington Hills, MI China - Shanghai Singapore
Tel: 248-538-2250 Tel: 86-21-5407-5533 Tel: 65-6334-8870
Fax: 248-538-2260 Fax: 86-21-5407-5066 Fax: 65-6334-8850
Kokomo China - Shenyang Taiwan - Hsin Chu
Kokomo, IN Tel: 86-24-2334-2829 Tel: 886-3-572-9526
Tel: 765-864-8360 Fax: 86-24-2334-2393 Fax: 886-3-572-6459
Fax: 765-864-8387
China - Shenzhen Taiwan - Kaohsiung
Los Angeles Tel: 86-755-8203-2660 Tel: 886-7-536-4818
Mission Viejo, CA Fax: 86-755-8203-1760 Fax: 886-7-536-4803
Tel: 949-462-9523
China - Shunde Taiwan - Taipei
Fax: 949-462-9608
Tel: 86-757-2839-5507 Tel: 886-2-2500-6610
Santa Clara Fax: 86-757-2839-5571 Fax: 886-2-2508-0102
Santa Clara, CA
China - Wuhan Thailand - Bangkok
Tel: 408-961-6444
Tel: 86-27-5980-5300 Tel: 66-2-694-1351
Fax: 408-961-6445
Fax: 86-27-5980-5118 Fax: 66-2-694-1350
Toronto
China - Xian
Mississauga, Ontario,
Tel: 86-29-8833-7250
Canada
Tel: 905-673-0699 Fax: 86-29-8833-7256
Fax: 905-673-6509

08/29/06

DS22008A-page 26 2006 Microchip Technology Inc.