JOURNAL OF INFORMATION, KNOWLEDGE AND RESEARCH IN

ELECTRONICS AND COMMUNICATION ENGINEERING

DESIGN AND ANALYSIS OF 1KB 6T SRAM CELL IN DEEP

SUBMICRON CMOS TECHNOLOGIES
1
MR P.J.DALVADI, 2 MR. R .J.ACHARYA, 3 PROF. K.M.PATTANI
1
M.E.[Electronics & communication] Student, Department Of E&C, C.U.Shah College of
Engineering and Technology, Wadhawan,Gujrat
2
M.E.[Electronics & communication] Student, Department Of E&C, C.U.Shah College of
Engineering and Technology, Wadhawan,Gujrat
3
Asst. Professor, Department Of E & C Engineering, C.U.Shah College of Engineering and
Technology, Wadhawan,Gujrat

[email protected],[email protected],[email protected]

ABSTRACT: VLSI industry is mainly concentration minimum power consumption and less area. The goal of
this paper is to reduce power and area of Static Random Access Memory (SRAM). Here 1kb six-transistor (6T)
SRAM cell is designed using deep submicron (65nm, 45nm) CMOS technologies. Then it is simulated using
LTSPICE for checking its functionality, Total power dissipation, read access time and write access time.
Compared to 6T SRAM cell of both deep submicron CMOS technologies, 45nm CMOS technology has 45% less
power consumption and less area required due to reduced channel length of CMOS transistor compared to
65nm CMOS technology.

Keywords--6T SRAM cell, less power, read access time, write access time, 1kb, CMOS technologies

I. INTRODUCTION to VDD are called load transistor (M3-M4), and the

In today technological changes happening, there is a ones connected to ground are called driver
huge demand for finding out devices with low power. transistors (M1-M2).
The demand of low power becomes the key of the This paper review section wise as under as: Section II
VLSI designs rather than high speed, particularly in deals with 1kb SRAM structure, section III deals with
embedded SRAMs and caches [3]. In deep submicron Write/Read Operation of both SRAM cell, simulation
CMOS technology, we scaled down channel length of and results are discussed in section IV. Finally the
CMOS transistor, so that area of CMOS transistor is conclusion is given in section V.
less. If area reduced then automatically power is less II. 1KB 6T SRAM CELL STRUCTURE
consumption. A few critical circuits in a system not Fig 2 Shows 1kb 6T SRAM cell structure.
only affect the design metrics but may fail to operate
in deep submicron technology. Hence the SRAM
arrays are designed, analysed and checked for its
design metrics in deep submicron CMOS
technologies.
Six-transistor (6T) SRAM cell is shown in Fig 1. 6T
SRAM cell consists of two cross-coupled inverters
(M1-M3 and M2-M4) [1-3].

Fig 1.Six-transistor (6T) SRAM cell

Transistors connected to the bitlines are called
access transistors (M5-M6). Transistors pull the cell
values Fig 2.1kb 6T SRAM cell Structure

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1kb SRAM structure has 32 rows and 32 columns of SRAM structure. All the outputs of the array are high
SRAM cell. Row indicates wordline of SRAM cell. by default, with the exception of the selected row,
Column indicates bitline of SRAM cell [4,6-7]. In which is low. Since the interface between decoder
figure has some other circuit like write driver circuit, and memory often includes a buffer, it can be made
precharger circuit, address decoder and sense inverting to enable the WL.
amplifier, which has special function for the SRAM
cell.
A: WRITE DRIVER CIRCUIT
The function of the SRAM write driver is to write
input data to the bitlines when Write Enable (WE)
signal is enabled; otherwise the data is not written
onto the bitlines [1]. Only one write driver is needed
for each SRAM column. The schematic of the write
driver circuit is shown in Fig 3.

Fig .5 2:4 Dynamic NAND Decoder

D: SENSE AMPLIFIER
The function of SRAM cell in Sense amplifiers (SA) is
sensing signal from BLB and BL. Sense amplifier is an
important component in memory design. One of the
Fig 3. Write Driver Circuit major issues in the design of SRAMs is the speed of
B: PRECHARGE CIRCUIT read operation. SA is present in every column of
The function of the precharge circuit in the 6T SRAM SRAM array [1, 6, 11]. Fig. 6 shows SA circuit for the
array is to charge the Bit Line (BL) and Bit Line Bar 6T SRAM array. Using the approximate values, the
(BLB) to VDD [6, 14]. The schematic of the precharge simulations were run and the widths were optimized
circuit for the 6T SRAM array is shown in to get the best output. The read operation begins by
Fig 4. The transistor M1 and M2 will precharge the precharging and equalizing both the bitlines, with
bitlines while the transistor M3 will equalize them to simultaneously biasing the latch-type SA [12] in the
ensure both bit lines within a pair are at the same high-gain meta-stable region by precharging and
Potential before the cell is read. equalizing its inputs. And then to read a particular
word from the SRAM array, the corresponding row is
selected by enabling the WL. Once a sufficient
voltage difference is built between the bitlines, the
SA is enabled by read enable (RE) signal. The SA will
sense which bitline is heading towards high voltage
and which bitline is heading towards ground
potential and then a full voltage swing is obtained at
the output.

Fig 4. Precharge Circuit

C: ADDRESS DECODER
Address decoder is used to decode the given input
address and to enable a particular wordline (WL). In
particular dynamic NAND CMOS decoder is used [9-
12]. For an n-word memory, an m: n dynamic NAND
CMOS decoder is used where m=log2n. The
schematic of 2:4 dynamic NAND CMOS decoder is
shown in Fig 5. 5:32 dynamic NAND CMOS decoder Fig 6. latch-type SA for 6T SRAM cell
made for 1Kb SRAM cell. According to selection of III. Write/Read Operation
input we can enable particular wordline row of

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Firstly the write operation of the cell is described as
follows. Write operation means store data into the
nod of SRAM cell. In order to store logic 1 to the
cell, BL is charged to V DD and BLB is charged to
ground and vise verse for storing logic 0. Then the
wordline voltage is switched to VDD to turn on the
NMOS access transistors. When the access
transistors are turned on, the values of the bitlines
are written into Q and QB [2].
The read operation means data read from the SRAM
cell. To read from the cell the bitlines are charged to
ground instead of VDD and the wordline voltage is set
to VDD to turn on the NMOS access transistors. The
node with logic 1 stored will pull the voltage on the
corresponding bitline up to a high (not Vdd because
of the voltage drop across the NMOS access Fig 7. 1*1Write /read operation of 6T SRAM cell in
transistor) voltage level. The other bitline is pulled to 65nm CMOS technology
ground. The sense amplifier will detect which bitline
is at a high voltage and which bitline is at ground [6].
If the cell was storing logic 0 the voltage level of BL
will be lower than BLB so the sense amplifier will
output logic 0. If the cell was storing logic 1 then
the voltage level of BL will be higher than BLB then
the sense amplifier will output logic 1.
IV. SIMULATION AND RESULTS
The following configuration of SRAM arrays were
designed and analysed using the Standard 6T SRAM
Cell: (a) 1*1 (1 bit) (b) 16*16 (256 bit) (c) 32*32 (1
kb). Various configuration of SRAM structure were
simulated using LTSPICE software in (65nm, 45nm)
CMOS technologies. The functionality Write/read
operation of 1*1 (1 bit) 6T SRAM cell in 65nm, 45n
are shown in Fig 7 and Fig 8. The functionality
Write/read operation of 16*16 (256 bit) 6T SRAM
Fig 8. 1*1Write /read operation of 6T SRAM cell in
cell in 65nm, 45nm are shown in Fig 9 and Fig 10.
45nm CMOS technology
The functionality Write/read operation of 32*32
(1kb) 6T SRAM cell in 65nm, 45nm are shown in Fig
11 and Fig 12.Show all the figures functionality of the
SRAM cell write 1 read 1 write 0 read-0.
Following are the signals used in the simulation
results: pc corresponds to PC signal given to the
Precharge Circuits; wl corresponds to the WL signal
of row in the SRAM array. This is the output of
inverting buffer circuit; we corresponds to the write
enable signal given to the write driver circuits; di
correspond to input data bits; lpc corresponds to
the Precharge signal given to the Local Precharge
circuits; re corresponds to the read enable signal
given to the sense amplifier circuits; q correspond
to storage node Q, q1 correspond to storage node
QB of the SRAM. For the 256bit has first row selected
in getting out result of column 0 and 15. For the 1kb
has first row selected and getting out of column 0,
Fig 9. 16*16 Write/read operation of 6T SRAM cell in
column 15 and column 31.Accoring to CMOS
65nm CMOS technology
parameter file VDD=1.1V (in 65nm CMOS technology)
and VDD=0.9V (in 45nm CMOS technology).

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Access time is the time measured from the point at
which the RE signal reaches 10% of VDD to the point
at which the output signal becomes +/- 10% VDD of
the required logic value Sense amplifier required
some time to sensing output from BLB and BL.
The Write Access time is the time measured from the
point at which the WE reaches 50% of VDD to the
point at which the storage node of the cell reaches
50% of VDD. SRAM required some time to stored
value at node QB and Q. Read access times and write
access time for 6T SRAM cells result show in
table .1
1KB SRAM cell 65nm 45nm
CMOS CMOS
Technology Tech-nology
Fig 10. 16*16 Write/read operation of 6T SRAM cell Read Access Time 304 ps 232.52 ps
in 45nm CMOS technology Write Access Time 97.93 ps 87.42 ps
Table 1. Read Access Time and Write Access Time of
1 kb 6T SRAM cell

Power dissipation is mainly considerable parameter

while designing any memory. Here we have used
65nm and 45nm CMOS Technology.
Power = ID avg * VDD
power dissipation of different configure 6T SRAM
cells in 65nm CMOS technology result show in table
2, 45nm CMOS technology result shown in table 3.
CMOS Technology Configuration TDP

1*1 37.4946 w
16*16 696.4672 w
65 nm 32*32 1412.22 w
Table 2. Power Dissipation of 6T SRAM Cell In 65 nm
Fig 11. 32*32 Write/read operation of 6T SRAM cell
in 65nm CMOS technology
CMOS Technology.
CMOS Configuration TDP
Technology
1*1 20.73 w
16*16 383.44 w
45nm 32*32 768.00 w
Table 3. Power Dissipation of 6T SRAM Cell In 45nm
CMOS Technology
The total number of transistors used for various
configurations of 6T SRAM cells has been tabulated
as shown in Table 4. If we reduce the CMOS
technology then we have scale down channel length
of transistor. so that automatic reduce the area of
CMOS transistor structure. So that 45nm CMOS
technology has required less area compared to other
technology.
Configuration Total number of transistors
Fig 12. 32*32 Write/read operation of 6T SRAM cell 1*1 31T
in 45 nm CMOS technology 16*16 2136 T
Access time is most important parameter for SRAM 32*32 7402 T
operation. Access time is nothing but propagation Table 4. Total Number of Transistors
delay to getting proper SRAM operation. The Read

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V. CONCLUSION Level Filter Scheme, IEEE Transactions on Very Large
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area required. Here 45nm CMOS technology has 45% Technologies, Springer, 2008 .
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