MOC3042
MOC3042
MOC3042
+800
OUTPUT PULSE WIDTH 80 s NORMALIZED TO
1.5
ITM , ON-STATE CURRENT (mA)
+600 IF = 30 mA TA = 25C
1.4
+400 f = 60 Hz
TA = 25C 1.3
NORMALIZED IFT
+200 1.2
0 1.1
200 1
0.9
400
0.8
600
0.7
800
4 3 2 1 0 1 2 3 4 5 40 20 0 20 40 60 80
VTM, ONSTATE VOLTAGE (VOLTS) TA, AMBIENT TEMPERATURE (C)
1.4
200 IF = 0 1.3 IF = RATED IFT
IDRM2, NORMALIZED
1.2
100
1.1
50 1
0.9
20 0.8
0.7
10
0.6
5
40 20 0 20 40 60 80 100 40 20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)
Figure 3. IDRM1, Peak Blocking Current Figure 4. IDRM2, Leakage in Inhibit State
versus Temperature versus Temperature
25
IFT, NORMALIZED LED TRIGGER CURRENT
1.5 NORMALIZED TO:
q
NORMALIZED TO 20
1.4 TA = 25C PWin 100 s
IFT, NORMALIZED
1.3 TA = 25C
1.2 15
1.1
1 10
0.9
0.8
5
0.7
0
40 20 0 20 40 60 80 100 1 2 5 10 20 50 100
TA, AMBIENT TEMPERATURE (C) PWin, LED TRIGGER PULSE WIDTH (s)
Figure 5. Trigger Current versus Temperature Figure 6. LED Current Required to Trigger
versus LED Pulse Width
+400
Vdc RTEST 1. The mercury wetted relay provides a high speed repeated
R = 10 k pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
PULSE CTEST 3. The worstcase condition for static dv/dt is established by
INPUT MERCURY triggering the D.U.T. with a normal LED input current, then
X100
WETTED removing the current. The variable RTEST allows the dv/dt to be
SCOPE
RELAY D.U.T. gradually increased until the D.U.T. continues to trigger in
PROBE
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering. tRC is measured at this point and
recorded.
Vmax = 400 V
APPLIED VOLTAGE
WAVEFORM 252 V
240 Vac
R1 D1
Suggested method of firing two, backtoback SCRs,
1 6 with a Motorola triac driver. Diodes can be 1N4001; resis-
VCC
tors, R1 and R2, are optional 330 ohms.
Rin 2 MOC3041/
5 SCR
3042/
SCR
3043
3 4 360
NOTE: This optoisolator should not be used to drive a load directly.
It is intended to be a trigger device only.
D2
R2
LOAD
PACKAGE DIMENSIONS
A
NOTES:
6 4 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
1 3 FORMED PARALLEL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F 4 PL C L A 0.320 0.350 8.13 8.89
N B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
T K G 0.100 BSC 2.54 BSC
SEATING J 0.008 0.012 0.21 0.30
PLANE
G J 6 PL K 0.100 0.150 2.54 3.81
L 0.300 BSC 7.62 BSC
M 0.13 (0.005) M T B M A M
M 0_ 15 _ 0_ 15 _
E 6 PL
N 0.015 0.100 0.38 2.54
D 6 PL
0.13 (0.005) M T A M B M STYLE 6:
PIN 1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
6. MAIN TERMINAL
THRU HOLE
6 4
B S NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1 3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
F 4 PL
H A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
C D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
T F 0.010 0.014 0.25 0.36
G G 0.100 BSC 2.54 BSC
J SEATING
H 0.020 0.025 0.51 0.63
PLANE
E 6 PL K 6 PL J 0.008 0.012 0.20 0.30
K 0.006 0.035 0.16 0.88
D 6 PL 0.13 (0.005) M T B M A M
L 0.320 BSC 8.13 BSC
S 0.332 0.390 8.43 9.90
0.13 (0.005) M T A M B M
A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
6 4 3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
B
1 3 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
L C 0.115 0.200 2.93 5.08
F 4 PL N D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
C G 0.100 BSC 2.54 BSC
J 0.008 0.012 0.21 0.30
T K 0.100 0.150 2.54 3.81
SEATING L 0.400 0.425 10.16 10.80
PLANE G N 0.015 0.040 0.38 1.02
K J
D 6 PL
E 6 PL 0.13 (0.005) M T A M B M