AutoTRAX Design

Express
2013 AutoTRAX Software

Schematic capture, Circuit simulation,

pcb design and 3D modellng.
AutoTRAX Design Express (DEX)
Integrated design of schematics and PCBs.
by AutoTRAX Software

This manual will give you complete and in-depth coverage on

desiging electronic system.
You can create 1 or more schematic diagrams and organize
them hierarchically.
A PCB is automatically associated with your schematics and
provide true project integration of your design.
AutoTRAX Design Express

2013 AutoTRAX Software

All rights reserved. No parts of this work may be reproduced in any form or by any means - graphic, electronic, or
mechanical, including photocopying, recording, taping, or information storage and retrieval systems - without the
written permission of the publisher.

Products that are referred to in this document may be either trademarks and/or registered trademarks of the
respective owners. The publisher and the author make no claim to these trademarks.

While every precaution has been taken in the preparation of this document, the publisher and the author assume no
responsibility for errors or omissions, or for damages resulting from the use of information contained in this
document or from the use of programs and source code that may accompany it. In no event shall the publisher and
the author be liable for any loss of profit or any other commercial damage caused or alleged to have been caused
directly or indirectly by this document.

Printed: February 2013 in (whereever you are located)

Special thanks to:

Publisher
All the people who contributed to this document, in particular, I want
...enter name...
to thank all the users of AutoTRAX over the years who can
Managing Editor contributed ideas and given feedback .

...enter name...

Technical Editors
...enter name...
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Cover Designer
...enter name...

Team Coordinator
...enter name...

Production
...enter name...
 Contents 5

Table of Contents
Foreword 17

Part I Getting Started 20

1 Quick...................................................................................................................................
Start 20
2 Installing
...................................................................................................................................
AutoTRAX 21
Dow nloading ..........................................................................................................................................................
AutoTRX 22
File Associations
......................................................................................................................................................... 29
Where are the..........................................................................................................................................................
DEX files? 29
3 Your Account
...................................................................................................................................
Settings 30
4 Authorizing
...................................................................................................................................
Your Copy 31
5 Firewalls
................................................................................................................................... 32
6 Closing
...................................................................................................................................
AutoTRAX 33
7 Removing
...................................................................................................................................
AutoTRAX 33
8 Manually
...................................................................................................................................
Removing AutoTRAX 36
9 Design
...................................................................................................................................
Modes 38
10 Sample
...................................................................................................................................
Designs 38
Push-pull circuit
.......................................................................................................................................................... 38

Part II Projects 42
1 Creating
...................................................................................................................................
Projects 42
2 Saving
...................................................................................................................................
Projects 42
3 Opening
...................................................................................................................................
Projects 43
4 Automatic
...................................................................................................................................
Backups 44
5 Restoring
...................................................................................................................................
Backups 45
6 Sheets
................................................................................................................................... 47
Schem atic Sheets
.......................................................................................................................................................... 47
Text Sheets .......................................................................................................................................................... 49
Hierarchical Layout
.......................................................................................................................................................... 49
Sub-System s.......................................................................................................................................................... 49
Adding New .........................................................................................................................................................
Sub-Systems 51
Opening Sub-systems
......................................................................................................................................................... 52
Adding Terminals
.........................................................................................................................................................
to a Sub-system Reference 52
Editing Sub-Systems
......................................................................................................................................................... 53
Sub-Systems .........................................................................................................................................................
Names 54
Using Sub-Systems
......................................................................................................................................................... 56
Adding Sub-Systems .........................................................................................................................................
References 57
Graphical Sheets.......................................................................................................................................................... 57
Page Borders......................................................................................................................................................... 59
The Grid Reference
......................................................................................................................................................... 61
The Title Block
......................................................................................................................................................... 64
Sheet Settings
......................................................................................................................................................... 67
7 The PCB
................................................................................................................................... 68
View ing the PCB
..........................................................................................................................................................
in 3D 70

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 6 AutoTRAX Design Express

8 Units ................................................................................................................................... 70
The Origin .......................................................................................................................................................... 70

Part III The User Interface 72

1 Menus
................................................................................................................................... 72
The Ribbon Menu.......................................................................................................................................................... 74
The File Menu
......................................................................................................................................................... 75
The Schematic
.........................................................................................................................................................
Ribbon Menu 75
The PCB Ribbon
.........................................................................................................................................................
Menu 77
The Symbol .........................................................................................................................................................
Ribbon Menu 79
The Footprint
.........................................................................................................................................................
Ribbon Menu 80
The Text Ribbon
.........................................................................................................................................................
Menu 82
The Classic Menu
.......................................................................................................................................................... 82
Menu Shortcuts .......................................................................................................................................................... 84
Efficent Screen..........................................................................................................................................................
Usage 84
2 The File
...................................................................................................................................
Settings 86
3 The Workspace
...................................................................................................................................
Setttings 87
4 The Panels
................................................................................................................................... 87
The Checklist..........................................................................................................................................................
Panel 88
The Part Builder
..........................................................................................................................................................
Panel 89
The Project Panel
.......................................................................................................................................................... 90
The Properties ..........................................................................................................................................................
Panel 93
The Library Panel
.......................................................................................................................................................... 95
The Layers Panel
.......................................................................................................................................................... 96
The Design Rules
..........................................................................................................................................................
Checker Panel 97
The Navigator..........................................................................................................................................................
Panel 98
The Settings Panel
.......................................................................................................................................................... 98
The Source View..........................................................................................................................................................
Panel 99
The Parts Bin..........................................................................................................................................................
Panel 100
The Netlist Panel
.......................................................................................................................................................... 101
The Parts List
..........................................................................................................................................................
Panel 103
The System ..........................................................................................................................................................
Info. Panel 104
5 Viewports
................................................................................................................................... 104
Rulers .......................................................................................................................................................... 105
Tabbed View..........................................................................................................................................................
ports 105
Tiled and Cascaded
..........................................................................................................................................................
View ports 105
Zoom ing In and
..........................................................................................................................................................
Out 105
Sm art Panning
.......................................................................................................................................................... 105
The Navigator
.......................................................................................................................................................... 105
6 Workspaces
................................................................................................................................... 105
7 The ...................................................................................................................................
Status Bar 106
8 The ...................................................................................................................................
Color Bar 106
9 Themes
................................................................................................................................... 106

Part IV Arranging and Editing Objects 110

1 Undoing
...................................................................................................................................
and Redoing Your Changes 110
2 Selecting
...................................................................................................................................
Items 110
3 Locking
...................................................................................................................................
Objects 111

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 Contents 7

4 Deleting
...................................................................................................................................
Objects 111
5 Moving
...................................................................................................................................
Objects to the Clipboard 111
6 Clearing
...................................................................................................................................
Sheets and the PCB 111
7 Copying
...................................................................................................................................
Objects 111
8 Pasting
...................................................................................................................................
Items from the Clipboard 111
9 Rotating
...................................................................................................................................
Objects 111
10 Mirroring
...................................................................................................................................
Objects 111
11 Scaling
...................................................................................................................................
Objects 111
12 Aligning
...................................................................................................................................
Objects 111
13 Grouping
...................................................................................................................................
Objects 112
14 Distributing
...................................................................................................................................
Objects 112
15 Reordering
...................................................................................................................................
Objects 112
16 Creating
...................................................................................................................................
Arrays of Objects 112
Creating Rectangular
..........................................................................................................................................................
Arrays 112
Creating Circular
..........................................................................................................................................................
Arrays 112
17 Selection
...................................................................................................................................
Settings 113

Part V Graphics 116

1 Lines
................................................................................................................................... 116
Adding Lines.......................................................................................................................................................... 118
Context Menu .......................................................................................................................................................... 120
Editing Lines.......................................................................................................................................................... 121
Line Properties
..........................................................................................................................................................
Panel 121
2 Arcs................................................................................................................................... 122
Adding Arcs.......................................................................................................................................................... 122
Editing Arcs .......................................................................................................................................................... 122
3 Polylines
................................................................................................................................... 122
Adding Polylines
.......................................................................................................................................................... 122
Editing Polylines
.......................................................................................................................................................... 122
4 Polygons
................................................................................................................................... 123
Adding Polygons
.......................................................................................................................................................... 123
Editing Polygons
.......................................................................................................................................................... 123
5 Rectangles
................................................................................................................................... 123
Adding Rectangles
.......................................................................................................................................................... 123
Editing Rectangles
.......................................................................................................................................................... 123
6 Curves
................................................................................................................................... 123
Adding Curves
.......................................................................................................................................................... 123
Editing Curves
.......................................................................................................................................................... 123
7 Ellipses
...................................................................................................................................
and Circles 123
Adding Ellipses
..........................................................................................................................................................
and Circles 123
Editing Ellipses
..........................................................................................................................................................
and Circles 123
8 Curved
...................................................................................................................................
Shapes 123
Adding Curved
..........................................................................................................................................................
Shapes 123
Editing Curved
..........................................................................................................................................................
Shapes 124
9 Text................................................................................................................................... 124

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 8 AutoTRAX Design Express

Adding Text .......................................................................................................................................................... 124

Editing Text .......................................................................................................................................................... 124
10 Notes
................................................................................................................................... 124
Adding Notes .......................................................................................................................................................... 124
Editing Notes.......................................................................................................................................................... 124
11 Pictures
................................................................................................................................... 124
Adding Pictures
.......................................................................................................................................................... 124
Editing Pictures
.......................................................................................................................................................... 124
12 Line...................................................................................................................................
Styles 124
13 Fill Styles
................................................................................................................................... 125
Solid Fill .......................................................................................................................................................... 125
Hatch Fill .......................................................................................................................................................... 125
Radial Fill .......................................................................................................................................................... 125
Linear Fill .......................................................................................................................................................... 125
14 Default
...................................................................................................................................
Graphics Settings 126

Part VI Dimensions 130

1 Adding
...................................................................................................................................
Dimensions 130
2 Editing
...................................................................................................................................
Dimensions 130
3 Dimension
...................................................................................................................................
Settings 131

Part VII Drawing Aids 134

1 Coordinates
................................................................................................................................... 134
Adding Coordinates
.......................................................................................................................................................... 134
Editing Coordinates
.......................................................................................................................................................... 134
2 Guides
................................................................................................................................... 134
Vertical Guides
.......................................................................................................................................................... 134
Adding Vertical
.........................................................................................................................................................
Guides 134
Editing Vertical
.........................................................................................................................................................
Guides 134
Horizontal Guides
.......................................................................................................................................................... 134
Adding Horizontal
.........................................................................................................................................................
Guides 134
Editing Horizontal
.........................................................................................................................................................
Guides 134
Point Guides.......................................................................................................................................................... 134
Adding Point
.........................................................................................................................................................
Guides 134
Editing Point
.........................................................................................................................................................
Guides 134
Angled Guides .......................................................................................................................................................... 135
Adding Angled
.........................................................................................................................................................
Guides 135
Editing Angled
.........................................................................................................................................................
Guides 135
3 Snaps
...................................................................................................................................
and the Grid 135
The Grids .......................................................................................................................................................... 135
The Graph.........................................................................................................................................................
Grid 135
The Line Grid
......................................................................................................................................................... 135
The Dot Grid
......................................................................................................................................................... 135
Setting the Snaps
..........................................................................................................................................................
per Grid 135
Rotation Snap.......................................................................................................................................................... 135
Snapping to ..........................................................................................................................................................
Guides 135
Snapping to ..........................................................................................................................................................
Objects 135
Snap Settings.......................................................................................................................................................... 136
4 Measuring
...................................................................................................................................
Distances and Angles 136

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 Contents 9

Part VIII Parts 140

1 Parts
...................................................................................................................................
Overview 140
2 Parametric
...................................................................................................................................
Parts 141
The Manufacturers
..........................................................................................................................................................
Model 141
The Deliverable
.......................................................................................................................................................... 144
The AutoTRAX..........................................................................................................................................................
Model 144
3 Creating
...................................................................................................................................
Parts 146
Creating Parts
..........................................................................................................................................................
on Schem atics 146
Editing Parts..........................................................................................................................................................
on Schem atics 146
Saving Your ..........................................................................................................................................................
Part 146
4 Using
...................................................................................................................................
the Part Wizard 146
5 The ...................................................................................................................................
Part Builder 147
6 Symbols
................................................................................................................................... 147
Sym bol Borders
.......................................................................................................................................................... 147
Sym bol References
.......................................................................................................................................................... 147
Sym bol Values.......................................................................................................................................................... 147
Sym bol Term ..........................................................................................................................................................
inals 147
Adding Terminals
......................................................................................................................................................... 147
EditingTerminals
......................................................................................................................................................... 147
Making a Sym ..........................................................................................................................................................
bol as No Footprint 147
Adding Graphics
..........................................................................................................................................................
to Sym bols 147
Editing Sym bols
..........................................................................................................................................................
in Schem atics 147
Reordering.........................................................................................................................................................
Terminals 147
Adding graphics
.........................................................................................................................................................
to Symbols in Schematics 147
7 Spice
...................................................................................................................................
Models 147
Bipolar Transistors
..........................................................................................................................................................
(BJT) 148
Capacitors .......................................................................................................................................................... 148
Diodes .......................................................................................................................................................... 148
Voltage and ..........................................................................................................................................................
Current Sources 148
Voltage Sources
......................................................................................................................................................... 148
Independent DC .........................................................................................................................................
Voltage Sources 148
Independent Sinusoidal.........................................................................................................................................
Voltage Sources 148
Independent Pulse .........................................................................................................................................
Voltage Sources 148
Independent Single .........................................................................................................................................
Frequency FM Voltage Sources 148
Independent Piece-Wise.........................................................................................................................................
Linear Voltage Sources 148
Independent Exponential
.........................................................................................................................................
Voltage Sources 148
Current Sources
......................................................................................................................................................... 148
Independent DC.........................................................................................................................................
Current Sources 148
Independent Pulse .........................................................................................................................................
Current Sources 148
Independent Sinusoidal.........................................................................................................................................
Current Sources 149
Independent Single .........................................................................................................................................
Frequency FM Current Sources 149
Independent Piece-Wise.........................................................................................................................................
Linear Current Sources 149
Controlled.........................................................................................................................................................
Sources 149
Current Controlled .........................................................................................................................................
Current Sources 149
Current Controlled .........................................................................................................................................
Voltage Sources 149
Voltage Controlled .........................................................................................................................................
Current Sources 149
Voltage Controlled .........................................................................................................................................
Voltage Sources 149
Inductors .......................................................................................................................................................... 149
Junction Field..........................................................................................................................................................
Effect Transistors (JFET) 149
MESFETs .......................................................................................................................................................... 149

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 10 AutoTRAX Design Express

MOSFETs .......................................................................................................................................................... 149

Resistors .......................................................................................................................................................... 149
Sw itches .......................................................................................................................................................... 149
Transform ers.......................................................................................................................................................... 150
Transm ission..........................................................................................................................................................
Lines 150
Lossless .........................................................................................................................................................
Transmission Lines 150
Lossy Transmission
.........................................................................................................................................................
Lines (LTRA) 150
Lossy Transmission
.........................................................................................................................................................
Lines (URC) 150
8 Custom
................................................................................................................................... 150
9 Footprints
................................................................................................................................... 150
The Footprint
..........................................................................................................................................................
Placem ent Point 150
Silkscreen Rectangles
.......................................................................................................................................................... 150
Courtyards .......................................................................................................................................................... 150
Pads .......................................................................................................................................................... 150
The Footprint
..........................................................................................................................................................
Reference 150
Adding 3D objects
.......................................................................................................................................................... 150
Adding Graphics
..........................................................................................................................................................
to Footprint 150
10 3D Packages
................................................................................................................................... 151
11 The ...................................................................................................................................
Parts Library 151
Setting the location
..........................................................................................................................................................
of the parts library 151

Part IX Artworks 154

1 Adding
...................................................................................................................................
Artwork to the Library 155

Part X Schematics 158

1 Adding
...................................................................................................................................
Parts 158
Using the Menu
.......................................................................................................................................................... 158
Using the Library
..........................................................................................................................................................
Panel 158
Requesting a..........................................................................................................................................................
Part 158
2 Hierarchical
...................................................................................................................................
Design 158
Sub-System s .......................................................................................................................................................... 158
Ports ......................................................................................................................................................... 158
Adding Ports ......................................................................................................................................... 158
Editing Ports ......................................................................................................................................... 158
Referencing .........................................................................................................................................................
a Sub-System 158
Adding a .........................................................................................................................................................
Sub-System 158
Editing a Sub-System
......................................................................................................................................................... 158
3 Wiring
...................................................................................................................................
Parts Together 158
Adding Wires .......................................................................................................................................................... 159
Editing Wires.......................................................................................................................................................... 159
Using Busses .......................................................................................................................................................... 159
Adding Busses
......................................................................................................................................................... 160
Editing Busses
......................................................................................................................................................... 160
Beveling Wire ..........................................................................................................................................................
to Buss Connections 160
Inter-Wire Connectors
.......................................................................................................................................................... 160
Adding Inter-Wire
.........................................................................................................................................................
Connectors 160
Editing Inter-Wire
.........................................................................................................................................................
Connectors 160
Making a Term ..........................................................................................................................................................
inal as No Connection Required 160
Nodes and Nets .......................................................................................................................................................... 161
Nodes .......................................................................................................................................................... 163
Wires .......................................................................................................................................................... 163

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 Contents 11

Wire Settings
.......................................................................................................................................................... 163
4 Renumbering
...................................................................................................................................
Parts 164
5 Checking
...................................................................................................................................
Your Schematic 164

Part XI Text Sheets 166

1 Adding
...................................................................................................................................
Text Sheets 166
2 Fonts
................................................................................................................................... 166
3 Paragraphs
................................................................................................................................... 166
4 Find...................................................................................................................................
and Replace 166
5 Adding
...................................................................................................................................
Pictures 166
6 Checking
...................................................................................................................................
Your Spelling 166

Part XII Circuit Simulation 168

1 Always
...................................................................................................................................
Add a Ground 168
2 Instruments
................................................................................................................................... 168
Oscilloscopes.......................................................................................................................................................... 168
Adding Oscilloscopes
......................................................................................................................................................... 168
Editing Oscilloscopes
......................................................................................................................................................... 168
Multim eters.......................................................................................................................................................... 168
Adding Multimeters
......................................................................................................................................................... 168
Editing Multimeters
......................................................................................................................................................... 168
Function Generators
.......................................................................................................................................................... 168
Adding Function
.........................................................................................................................................................
Generators 168
Editing Function
.........................................................................................................................................................
Generators 168
Pow er Supplies
.......................................................................................................................................................... 168
Adding Pow.........................................................................................................................................................
er Supplies 168
Editing Pow
.........................................................................................................................................................
er Supplies 169
3 The ...................................................................................................................................
Analysis Probe 169
4 Adding
...................................................................................................................................
Voltage and Current Sources 169
5 The ...................................................................................................................................
Spice Reference Manual 169
Introduction.......................................................................................................................................................... 169
Introduction......................................................................................................................................................... 169
Types of .........................................................................................................................................................
Analysis 170
Analysis .........................................................................................................................................................
at Different Temperatures 172
Convergence ......................................................................................................................................................... 173
Circuit Description
.......................................................................................................................................................... 173
Circuit Elements
.........................................................................................................................................................
and Models 173
Transistors and.........................................................................................................................................
Diodes 173
Introduction ................................................................................................................................... 174
Bipolar Junction...................................................................................................................................
Transistors (BJTs) 174
BJT Models (NPN/PNP) ................................................................................................................................... 175
Diode Model ................................................................................................................................... 177
JFET Models (NJF/PJF) ................................................................................................................................... 177
Junction Diodes................................................................................................................................... 178
Junction Field-Effect ...................................................................................................................................
Transistors (JFETs) 179
MESFET Models...................................................................................................................................
(NMF/PMF) 179
MESFETs ................................................................................................................................... 180
MOSFET Models ...................................................................................................................................
(NMOS/PMOS) 180
MOSFETs ................................................................................................................................... 186

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12 AutoTRAX Design Express

Transmission Lines ......................................................................................................................................... 187

Lossless Transmission ...................................................................................................................................
Lines 187
Lossy Transmission ...................................................................................................................................
Line Model (LTRA) 188
Lossy Transmission ...................................................................................................................................
Lines 189
Uniform Distributed ...................................................................................................................................
RC Lines (Lossy) 190
Uniform Distributed ...................................................................................................................................
RC Model (URC) 190
Voltage and Current .........................................................................................................................................
Sources 191
Independent Sources ................................................................................................................................... 191
Exponential ................................................................................................................................... 191
Independent Sources ................................................................................................................................... 192
Piece-Wise Linear ................................................................................................................................... 193
Pulse ................................................................................................................................... 193
Single Frequency ...................................................................................................................................
FM 194
Sinusoidal ................................................................................................................................... 194
Linear Dependent ...................................................................................................................................
Sources 195
Introduction ................................................................................................................................... 195
Current-Controlled ...................................................................................................................................
Current Sources 195
Current-Controlled ...................................................................................................................................
Voltage Sources 195
Voltage-Controlled ...................................................................................................................................
Current Sources 196
Voltage-Controlled ...................................................................................................................................
Voltage Sources 196
Non-Linear Dependant ...................................................................................................................................
Sources 196
Capacitors ......................................................................................................................................... 198
Coupled (Mutual) .........................................................................................................................................
Inductors 198
Inductors ......................................................................................................................................... 198
Resistors ......................................................................................................................................... 199
Semiconductor .........................................................................................................................................
Capacitor Model 199
Semiconductor .........................................................................................................................................
Capacitors 199
Semiconductor .........................................................................................................................................
Resistor Model 200
Semiconductor .........................................................................................................................................
Resistors 200
Sw itch Model ......................................................................................................................................... 201
Sw itches ......................................................................................................................................... 202
Combining.........................................................................................................................................................
Files. .include lines 202
Device Models
......................................................................................................................................................... 203
GENERAL.........................................................................................................................................................
STRUCTURE AND CONVENTIONS 204
SubCircuits ......................................................................................................................................................... 205
Title Line,.........................................................................................................................................................
Comment Lines and .end line 206
Analysis and..........................................................................................................................................................
output Control 207
DC or Small-Signal
.........................................................................................................................................................
AC Sensitivity Analysis 207
DC Transfer .........................................................................................................................................................
Function 207
Distortion.........................................................................................................................................................
Analysis 208
Fourier Analysis
......................................................................................................................................................... 209
Initial Conditions
......................................................................................................................................................... 210
Noise Analysis
......................................................................................................................................................... 211
Operating.........................................................................................................................................................
Point Analysis 211
PLOT Lines ......................................................................................................................................................... 211
Pole-Zero.........................................................................................................................................................
Analysis 212
PRINT Lines ......................................................................................................................................................... 213
SAVE Lines ......................................................................................................................................................... 213
Analysis .........................................................................................................................................................
Options 214
Simulator .........................................................................................................................................................
Variables 214
Small-Signal.........................................................................................................................................................
AC Analysis 217
Transfer .........................................................................................................................................................
Function Analysis 217
Transient.........................................................................................................................................................
Analysis 217

2013 AutoTRAX Software

 Contents 13

Part XIII The PCB 220

1 Viewing
...................................................................................................................................
the PCB 220
2 Viewing
...................................................................................................................................
the PCB in 3D 220
3 The ...................................................................................................................................
PCB Border 220
Setting the PCB
..........................................................................................................................................................
Border 220
Editing the PCB
..........................................................................................................................................................
Border 220
4 PCB...................................................................................................................................
Layers 220
Editing the PCB
..........................................................................................................................................................
Layers 220
5 Pads................................................................................................................................... 220
Adding Pads.......................................................................................................................................................... 220
Editing Pads .......................................................................................................................................................... 220
6 Nets................................................................................................................................... 220
Adding Nets .......................................................................................................................................................... 221
Editing Nets .......................................................................................................................................................... 221
7 Tracks
................................................................................................................................... 221
Changing a track
..........................................................................................................................................................
segm ents layer index 221
8 Routing
................................................................................................................................... 222
Manual Routing
.......................................................................................................................................................... 222
Autom atic Routing
.......................................................................................................................................................... 222
The Electra
.........................................................................................................................................................
Autorouter 222
The Internal
.........................................................................................................................................................
Autorouter 223
Keepout Regions
.......................................................................................................................................................... 223
Adding Keepout
.........................................................................................................................................................
Regions 223
Editing Keepout
.........................................................................................................................................................
Regions 223
Router Settings
.......................................................................................................................................................... 224
9 Adding
...................................................................................................................................
Cutouts 227
10 Copper
...................................................................................................................................
Pour Regions 227
Adding Copper
..........................................................................................................................................................
Pour Regions 227
Editing Copper
..........................................................................................................................................................
Pour Regions 227
Copper Pour..........................................................................................................................................................
Settings 228
11 Drill...................................................................................................................................
holes 228
Adding Drill holes
.......................................................................................................................................................... 228
Editing Drill holes
.......................................................................................................................................................... 228
12 Checking
...................................................................................................................................
Your PCB Design 228
13 3D ................................................................................................................................... 228
Adding 3D objects
.......................................................................................................................................................... 228

Part XIV Printing and Plotting 230

1 Printing
................................................................................................................................... 230
2 Plottings
................................................................................................................................... 230

Part XV Manufacturing Your PCB 232

1 Plotting
...................................................................................................................................
Your PCBs 232
2 Previewing
...................................................................................................................................
Your Gerber Files 232
3 Generating
...................................................................................................................................
Gerber Files 232

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 14 AutoTRAX Design Express

4 Generating
...................................................................................................................................
Drill Files 232
5 Your...................................................................................................................................
Bill of Materials 232
6 Putting
...................................................................................................................................
It All Together in a Zip File 232
7 Manufacturing
...................................................................................................................................
Settings 233
DesignRules.......................................................................................................................................................... 235

Part XVI Getting Support 238

1 Tutorial
...................................................................................................................................
Videos 238
YouTube .......................................................................................................................................................... 238
2 Getting
...................................................................................................................................
Daily Tips 238
3 Using
...................................................................................................................................
The Help System 239
4 Getting
...................................................................................................................................
a Printed Manual 239
5 Find...................................................................................................................................
Out About Your Version 239
6 What's
...................................................................................................................................
New 240
7 Getting
...................................................................................................................................
the Latest Version 240
8 Subscribing
...................................................................................................................................
to the NewsLetter 240
9 Reporting
...................................................................................................................................
Problems 240
10 The ...................................................................................................................................
User Group 240
11 Adding
...................................................................................................................................
to Your Wishlist 240
12 Sending
...................................................................................................................................
Feedback 240
13 The ...................................................................................................................................
AutoTRAX Website 241

Part XVII Importing Files 244

1 Importing
...................................................................................................................................
Your AutoTRAX EDA Designs 244
2 Importing
...................................................................................................................................
Your AutoTRAX EDA Library 244
3 Importing
...................................................................................................................................
AutoCAD DXF Files 244
4 Importing
...................................................................................................................................
KiCAD Files 244
5 Importing
...................................................................................................................................
Eagle Files 244

Part XVIII Exporting Data 246

1 Creating
...................................................................................................................................
a CNC File 246
2 Creating
...................................................................................................................................
a PDF File 246
3 Creating
...................................................................................................................................
a IDF File 246
4 Creating
...................................................................................................................................
a SVG File 246
5 Creating
...................................................................................................................................
a Spice Deck File 246
6 Creating
...................................................................................................................................
a Net List File 246

Part XIX Bonus Programs 248

1 The ...................................................................................................................................
Calendar Program 248
2 The ...................................................................................................................................
Text Editor 249

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 Contents 15

Part XX The DEX File Format 252

Part XXI The Software License 254

Part XXII Refund Policy 262

Index 0

2013 AutoTRAX Software

15
 Foreword 17

Foreword

This manual describes in detail

how to use AutoTRAX Design
Express.

2013 AutoTRAX Software

Part

I
 20 AutoTRAX Design Express

1 Getting Started

AutoTRAX Design Express, DEX, is a fully integrated electronic schematic capture program
combined with an easy to use SPICE circuit simulator and PCB Designer.

It has all the features you expect and need to rapidly and easily take your design from conception
through to production. Its in-built hierarchical project manager lets you perform both top-down and
bottom-up design and reuse design components and sub-systems.

Starting with its easy to use Schematic Capture mode, you can drag pre-created parts onto your
design sheets and rapidly and reliably connected the terminals together using wires, buses and off-
page connectors. AutoTRAX ensures that your design remains correct throughout with no dangling
wires or design rule violations.

You can also create your own parts either in-place on your design sheets or using the integrated Part
Creator. Again, design integrity is maintained throughout using the DEXs design rule checker.

Once you have created your design you can rapidly simulate its analog performance using the build
in virtual instruments such as oscilloscopes and signal generators. DEX analyses can be produced
using the industry standard SPICE 3f5 simulator that comes free with DEX.

When you are satisfied with your design and simulation results, you can then quickly proceed to
produce your finished and populated PCB board without leaving the AutoTRAX program. The
AutoTRAX PCB Designer will take your hierarchical design and place the components, with or
without your assistance. Next DEX can either autoroute your board or you can use a combination of
automatic and manual routing to quickly and reliably complete all electrical wiring. The design of
DEXs internal data ensures you main full electrical integrity with your schematic design. No
surprises with lost or missing PCB tracks or wires, or those extra wires.

Now that you have your design finished and routed you can then produce all Computer Aided
Manufacturing files you will need to produce the board, drill the holes, cut its profile, order parts
using the Bill Of Materials, and place your parts using the pick and place files. These files can be
place together and forwarded to your favorite board manufacturers, electronically via email.

In only a short time you will see the fruits of your labor and will be pleased at the time and money
you have saved.

1.1 Quick Start

For those of you that are keen to use DEX here is a quick start guide.

DEX does not have separate schematic, part and PCB editors. There is just one DEX editor that does
all.
DEX integrates schematics with the PCB in a single project file.

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DEX integrates symbols with the footprint in a single part file.

There in a very comprehensive undo/redo facility that will always get you out of trouble and thus allows
you to experiment.

Use a 3 button mouse with a mouse wheel. Use the middle button to pan and the mouse wheel to zoom
in/out.

Right click on any object in a viewport to see a context sensitive menu.

There are comprehensive tooltips that appear when you mouse the mouse over dialog controls and
objects in schematics and on the PCB.

Click here to view video tutorials.

1.2 Installing AutoTRAX

System Requirements:

XP, Vista and Windows 7 are fully supported (32 bit and 64 bit)

Windows XP, Vista or Windows 7

1GB Ram on XP and 2GB on Vista
24 bit graphics card.
100MB Hard Disk space.
3 buttoned Mouse with thumb wheel. DEX will work with a 2 buttoned mouse but your
productivity will be greater with a 3 buttoned mouse with thumb wheel.

DEX will automatically install Microsoft .NET 4

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1.2.1 Downloading AutoTRX

You can download AutoTRAX from the AutoTRAX web site.

When you have downloaded AutoTRAX run the installer program DexSetup.exe
You will first see the select setup language dialog.
Click here see where DEX installs files.

Select your language from the drop down list and click on the OK button to proceed. At any time you
can click on the Cancel button to stop the installation and no files will be added to your machine.
You will see the welcome screen, click on the OK button to proceed.

Now you will see the license agreement. You must accept this to proceed. Click on I accept the
agreement and then click on the Next button to proceed. Click here to see the full license agreement

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Next you will see the Select Components dialog. I recommend you select all and then click the Next
button to continue.

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Now you get to select where to place DEX. You can use the default or add your own. Again click the
Next button to continue.

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Now you get to name the start menu folder. You can use the default or add your own. Again click the
Next button to continue.

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Now you can associate files with DEX. When you click on then in Explorer, DEX will open them. Also
the DEX icon appears alongside then. I recommend you leave Associate files checked.
DEX associated the following file extensions.

.project - used for project files.

.project - used for part files.
.art - used for art files.

Click the Next button to continue.

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Finally you are ready to install. Check the installation options and click the Next button to continue.

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During installation the following progress dialog is shown. Click on the Cancel button if you no longer
wish to install DEX.

When then install is complete, you will see the following dialog box. Click the Finish button to continue.

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1.2.1.1 File Associations

DEX associated the following file extensions.

.project - used for project files.

.project - used for part files.
.art - used for art files.

1.2.2 Where are the DEX files?

DEX is installed in the following directories:

Roaming Data Files

C:\Users\XXXX\AppData\Roaming\AutoTRAX Software\DEX

Machine Specific Files

C:\Users\XXXX\AppData\Local\AutoTRAX Software\DEX

The Parts Library

The default location of the parts library is:

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C:\Users\XXXX\AppData\Roaming\AutoTRAX Software\DEX\Library

You can change the library location.

Where XXXX is your account name.

The Registry
DEX does not use the registry or set entries in the Registry.
Configuration files are in C:\Users\XXXX\AppData\Roaming\AutoTRAX Software\DEX\Settings

1.3 Your Account Settings

To change you account details click the Software License button in the Home/Account menu.
If you have a valid license the account details dialog shown below will be displayed.
If you do not have a valid license you will see the sign on dialog box below. If you have purchased a
software license you will have received a sign in id and password by email. If you do not have it please
check your spam box. If you still cannot find it then please contact us via email using this link. If you

have not purchased a license the click on the purchase button to obtain a license

Change your details and click the OK button to save your changes. Click Cancel to close the dialog box

without saving any changes. If you click on the Sign Out button , the software license will
be removed from the machine. You can easily reauthorize your copy by signing in again.

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1.4 Authorizing Your Copy

When you purchase DEX you will receive a signon id and password. This will allow you to automatically
authorize you copy of DEX on the machine you are using.

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To authorize you copy click the Software License button in the Home/Account menu.

If you do not have a valid license you will see the sign on dialog box below. If you have purchased a
software license you will have received a sign in id and password by email. If you do not have it please
check your spam box. If you still cannot find it then please contact us via email using this link. If you

have not purchased a license the click on the purchase button to obtain a license

If you cannot sign on and you know you have a valid license, your firewall may be block access for DEX
to the internet. Click to find out how to configure your firewall.

Click Here for more details about our account.

1.5 Firewalls
Sometime an internet Firewall will block DEX from accessing the internet.
DEX accesses the internet to:
1. Optionally find out if there is a new version available.
2. Optionally download new versions.
3. Download the latest part libraries.
4. Obtain a software license for your machine.
5. Allow you to view and/or update your account details.

Allow a program to communicate through Windows Firewall

By default, most programs are blocked by Windows Firewall, to help make your computer more secure.
To work properly, some programs might require you to allow them to communicate through the firewall.
Here's how to do that:

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1. Open Windows Firewall by clicking the Start button, clicking Control Panel, clicking Security, and
then clicking Windows Firewall.
2. In the left pane, click Allow a program through Windows Firewall. If you are prompted for an
administrator password or confirmation, type the password or provide confirmation.
3. Select the check box next to the program you want to allow, and then click OK.

Warning
Before allowing any program through the firewall, make sure you understand the risks involved.

Click to view a video and read more about firewalls...

1.6 Closing AutoTRAX

To close AutoTRAX click on the Exit button in the Home menu.

If you have any unsaved changes, you will be prompted to save your work.

1.7 Removing AutoTRAX

To uninstall DEX Select Uninstall AutoTRAX Design Express from the Application menu.

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The following dialog box will appear. Click Yes to remove DEX, Click No to cancel the removal.

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The following progress dialog = box will appear.

When complete the following dialog will appear. Click the OK button to close it.

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1.8 Manually Removing AutoTRAX

To manually remove DEX, you need to remove:

1. The installed files.

2. The desktop icons. Select them and press the delete button.
3. The AutoTRAX DEX entry in the Application Start menu. See below. Right click on the DEX icon and
select Delete.
(Note: DEX does not add any entries to the Registry).

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1.9 Design Modes

DEX handles 3 different types of files.
Projects
Parts
Artwork

Project contain schematics, text documents and a PCB and represent the design for your PCB.

Part files contain schematic symbols, text documents and a footprint (land pattern) that contains all the
information needed to define the abstract schematic representation for a part together with the footprint
required for the PCB and the 3D solid model for the part.
Parts are defined parametrically and this allow a single part to be quickly and easily modified into a
different part type. The parametric models define how to create a complete part fro only a few simple
parameters.

Artwork files contain schematic that do not have any electrical content, such as parts and wires. They
are used for creating library artwork to be used in project and part files. They can also be used for any
other drawing needs as DEX's powerful graphics allows you to graphical design engineering drawings.

1.10 Sample Designs

Dex comes with the following sample designs:

Push-pull circuit

1.10.1 Push-pull circuit

Use when you need current gain and need both positive and negative output.
A modification of the transistor emitter follower that can give both positive and negative outputs. Based
on two transistors one npn the other pnp: one pushes the other pulls.

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Where
Q1 transistor 1 need not be a TIP41C but does need to be NPN
Q2 transistor 2 need not be a TIP42C but does need to be PNP

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2 Projects

2.1 Creating Projects

DEX integrates all the data for for design into a single project file.
A project file is a self contained xml file (with optional compression) that contains all the details of your
design. It does not rely on any external files.
The project file contains:
1. Zero or more schematics.
2. Zero of more text documents.
3. The PCB for the project.

The schematics and text documents can be arranged in a hierarchical fashion or left in a flat
arrangement.

The schematics are firmly attached to the PCB and DEX's internal data structure ensures that the
schematics and the PCB are always in sync. Any changes to a schematic are instantly reflected in the
PCB, likewise, any changes in the PCB are reflected in the schematics.

To create a new project select the New Project button in the Home menu.

2.2 Saving Projects

To save you work click the Save button in the Home menu. If you have never saved your work
then you will be prompted for the file name to save to as show below.

To save your work to a different file click the Save As button in the Home menu. You will be
prompted for the file name to save to.

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2.3 Opening Projects

To open an existing project click on the Open button in the home menu.

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2.4 Automatic Backups

DEX automatically backs up your work in a directory with the name name as your project but with the
'.Backup' extension added.

for example if you project is called 'My Project' backups are saved to 'My Project.Backup' as shown
below.
The backups have the save name with the data appended and a short description of the action that
caused a backup to be made.
It is a good idea to use 3rd party automatic backup software to backup this directory, giving you full
confidence that none of your work will be lost.
DEX will never delete any of these files even if you undo changes you make.

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2.5 Restoring Backups

To restore a backup file open it and then save it.

Opening a backup...

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Saving the backup as your original...

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2.6 Sheets
DEX can contain the following sheets in addition to the PCB.

Schematic Sheets
Text Sheets

2.6.1 Schematic Sheets

A schematic sheet contains a symbolic design of part of your project or a symbol. See the chapter on
schematics for more details.

A typical schem atic for a project

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A typical schem atic sheet for a part. (It's sym bol)

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2.6.2 Text Sheets

You can add text sheets to your design or your parts, These text sheets can be used to add
documentation or anything you like. You have full text formatting features. See the text sheets chapter
for more details.

A Typical Text Sheet (Docum ent).

2.6.3 Hierarchical Layout

Schematic sheets and text sheets are arranged in an hierarchy.

Each schematic sheet or text document can have zero or more child schematic sheets and text
documents.

You can add has many schematics sheets and text documents as you wish. These can be added using
either the Project Panel or the Add Ribbon menu.

2.6.4 Sub-Systems
A sub-system in DEX is a schematic sheet in a project that can be referenced from another schematic
sheet using a sub-system reference symbol. Below is a sub-system placed on a schematic. It is labels
S1 and refers to schematic 'My - sub-system'.

Sub-system can optionally have ports (terminals) on their boundaries which connect to ports in the sub-
system schematic.

This the example on the right, S1 has 2 terminals, In and Out. In the 'My-subsystem' schematic the 2
ports are connected to the input and output of a op-amp. So S1 symbolizes an amplifier what the 'My-
subsystem' schematic implements it. This allow you to break down a design into more logical parts.

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Sub-system reference sym bol w ithout Sub-system reference sym bol w ith term inals that connect to
term inals ports on the 'My sub-system ' schem atic

Contents of the 'My sub-system ' schem atic.

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2.6.4.1 Adding New Sub-Systems

To add a sub-system to a schematic click on the New-System button in the Add Menu.

You will then see the following dialog box.

Enter the name of new sub-system. In this case Amplifier and click the OK button.

Now move the cursor to the first corner for the border of the sub-system and click to define it. As you
move you will see the numeric input cursor shown below. You can enter the precise numeric values for
the corner by typing in the X coordinate (no mouse click required) then pressing the return key followed
by the numbers for the Y coordinate and pressing the return key again to complete.

Now drag the mouse, you will see the border change in size. Click the left mouse button to complete the
addition.

You can enter the precise width and height for the border by typing in the width (no mouse click
required) then pressing the return key followed by the numbers for the height and pressing the return key
again to complete. The sub-system reference is shown below.

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Double clicking on or inside the blue rectangle for the sub-system reference will open the sub-system's
schematic sheet.

2.6.4.2 Opening Sub-systems

To open a sub-system, double click on it's sub-system reference symbol in the schematic or
double click on it in the project panel.

2.6.4.3 Adding Terminals to a Sub-system Reference

There are 2 different ways to add terminals to a sub-system reference.

Add terminals directly to the sub-system reference.

Open the sub-system reference's schematic by doubling clicking on or in the sub-system reference's
border and adding ports.

Adding terminals directly to the sub-system reference

To add terminals directly to the sub-system reference:

1. Select the sub-system reference by clicking on or in it's border. (If there is only 1 sub-system
reference or part in the schematic then you do not need to do this as DEX knows what to add the
terminal to.)
2. Click on one of the symbol terminals in the Symbols group in the Add ribbon menu.

The symbol terminal dialog box will appear.

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3. Enter the Name and click the Add button.

4. Now move the mouse around the sub-system reference. You will see the terminal move around and
try to follow the mouse. Click the left mouse button to finally place the terminal.
Repeat 1-4 to add more terminals.

When you add terminals to a sub-system reference, ports are automatically added to the sub-system
reference's schematic.

For more about symbol terminals click here.

2.6.4.4 Editing Sub-Systems

You can edit sub-subsystems reference by:

1. Dragging the sub-subsystems reference's value or ID.

2. Double click on the sub-subsystems reference's value or ID to edit its value.
3. Drag any of the terminals. As the mouse moves, the terminal will follow the mouse but will always
remain attached to the sub-subsystems reference's border.
4. Resize the sub-subsystems reference's border by selecting it using sub-pick from the menu or
pressing down the Ctrl key while selecting the sub-subsystems reference's border by clicking on it.
You can them resize the border by dragging the border's manipulator points.

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Drag any of the blue rectangles to resize the border.

The terminals will move to remain on the border.

If you delete a terminal from a sub-subsystems reference then all equivalent terminals is all sub-
subsystems references that reference the same schematic will be deleted. The port in the schematic will
also be deleted.

If you add a terminal to a sub-subsystems reference then all sub-subsystems references that reference
the same schematic will have a terminal added. A corresponding port will be added to the sub-
subsystems reference's schematic.

If you delete a port in a schematic then the corresponding terminal will be removed from all sub-
subsystems references that reference that sheet.

2.6.4.5 Sub-Systems Names

The sub-system name is linked to the name of the sub-system schematic and display it's name. If you
change the name of the sub-system schematic then the text displayed by the sub-system name
changes.
The name can be multi-lined.

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A multi-lined sub-system name

To change the name of a $$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$$

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2.6.4.6 Using Sub-Systems

Sub-systems are a great way to break down a complex design into management check. You can use a
top down method, a bottom up method or a mixture of both.

Top Down
To partition a design, on a schematic add 1 or more Sub-Systems.

Bottom Up
Add a new schematic and create your bottom level design.
In another schematic from which you want to reference your new bottom level design, add a sub-system

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from the Add | Add Existing menu.

The Add Sub-System dialog box shown below will appear.

Select the sub-system and click on the button.

2.6.4.6.1 Adding Sub-Systems References

Enter topic text here.

2.6.5 Graphical Sheets

Schematic sheets, symbol sheets and PCB sheets are all graphical sheets.

Graphics sheets can optionally consist of:

A Page Borders
A Grid Reference
A Title Block

A schem atic w ith a page border, grid reference and a title block.

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A PCB sheet w ith a page border, grid reference and a title block.

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2.6.5.1 Page Borders

You can have a page border appear on a schematic or a PCB sheet. Page borders can be optionally
decorated with a Grid Reference and/or a Title Block.

To view/hide a page border either:

Right click and select Show Page from the context menu or

Click on the button in the View/Page menu or

Click on the Show Page checkbox in the Page Properties Panel.

Use the Sheet Settings Popup.

Use the Properties Panel (with nothing selected).

You can edit the size and other attributes of the page using the Sheet Settings Popup or the Properties
Panel.

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A schem atic page border

A Pcb page border ( show ing a rectanglar PCB)

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2.6.5.2 The Grid Reference

The grid reference is a set of reference boxes placed around the edges of the page as shown below.

You can toggle the visibility of the grid reference using the View tab.

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Clicking this displays this help topic.

Horizontal

This group sets the parameters for the horizontal

grid cells.

Vertical

This group sets the parameters for the vertical

grid cells.

Count

This sets the number of cells.

Border

The size of the grid cell from the edge towards the
center of the sheet.

Text

If checked then the cell value is displayed as a

character from 'A' onwards.

Numeric

If checked then the cell value is displayed as a

number from '1' upwards.

Left to Right

If checked then the cell values increases from the

left to the right of the sheet.

Right to Left

If checked then the cell values increases from the

right to the left of the sheet.

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Top To Bottom

If checked then the cell values increases from the

top to the bottom of the sheet.

Bottom to Top

If checked then the cell values increases from the

bottom to the top of the sheet.

Show Grid Reference

This will hide/show the grid reference.

2.6.5.3 The Title Block

The title block is a rectangular region displayed at the bottom right of the sheet as shown below.

The Date is the time of the last save in your local time. If the same sheet is displayed in a different
time zone then the time displayed is adjusted.

You can edit the parameters for the title block by displaying the properties panel. If nothing is
selected on the sheet you will see the Title Block dialog.

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Clicking this
displays this help topic.

Title

This is the title for the

sheet.

Description

This is a more detailed

description of the
contents of the sheet.

Sheet Name

The name of the sheet. It

is also the name
displayed in the projects
panel and in the viewport
tab title.

Checked By

The name of the person

who checked the design.

Approved By

The name of the person

who approved the
design.

Design By

The name of the person

who designed the sheet.

Revision

The revision prefix. This

is displayed along with

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the save count. The

same revision text is
displayed on all sheet.

Doc. Number

The document number.

The same number is
displayed on all sheets.

Show Title Block

Check to display the title

block on the sheet,
otherwise it is hidden.

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2.6.5.4 Sheet Settings

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2.7 The PCB

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2.7.1 Viewing the PCB in 3D

Enter topic text here.

2.8 Units
You can set the units for all Graphical Sheets.

The possible units are:

Mil/Thou.
Inches
Microns
MM
CM
Metres

2.8.1 The Origin

Show/hide.
Move

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3 The User Interface

The DEX workspace has had years to develop into a fine tuned working environment, and with bigger
monitors and faster processors, working with DEX has only become more fun. With all the room that
larger display options give you, you can easily organize the panels, viewports and tools in the workspace
to provide an efficient designing environment.
DEX provides a consistent, single, highly configurable program interface to enable you to create parts,
pcbs and even engineering artwork.
With all its features, DEX can be a bit daunting at first. The purpose of this chapter is to familiarize you
with the DEX workspace, how to navigate around, find tools, customize settings, and set the working
environment so it best suits you.
So, without further ado lets look at the DEX workspace as shown below. AS you can see, its pretty
impressive and looks like fun to work with.

3.1 Menus
DEX comes with two flavors of menu. The classic dropdown menu with toolbars and the Microsoft Ribbon
style menu. Which one you work with is entirely up to you. You can even rapidly change between the
two styles with DEX remembering and restoring each of your workspace layouts.
The two menu style are shown below.
The Microsoft Ribbon Style Menu

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The classic Dropdow n m enu w ith toolbars

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3.1.1 The Ribbon Menu

The Ribbon Menu is displayed at the top of the DEX main window as shown below.

The DEX Ribbon aim to enhance usability; by consolidating the DEX's functions and commands in
an easily recognizable place, you need not look through multiple levels of hierarchical menus,
toolbars or task panes before finding the right command.

The Ribbon consists of a pane that contains controls (such as buttons and icons) organized into a set
of tabs, each one containing a grouping of relevant commands.

Some tabs, called contextual tabs, appear only after the you selects an object or a sheet. Contextual
tabs expose functionality specific only to the object/sheet with focus.

The PCB Ribbon Menu

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3.1.1.1 The File Menu

3.1.1.2 The Schematic Ribbon Menu

The Home Menu

The Panels Menu

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The Schematic Menu

The View/Snap Menu

The Edit Menu

The Add Menu

The Parts Menu

The Layout Menu

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The Tools Menu

The Simulate Menu

3.1.1.3 The PCB Ribbon Menu

The Home Menu

The Panels Menu

The PCB Menu

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The View/Snap Menu

The Edit Menu

The Add Menu

The Layout Menu

The Tools Menu

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3.1.1.4 The Symbol Ribbon Menu

The Home Menu

The Panels Menu

The Symbol Menu

The View/Snap Menu

The Edit Menu

The Add Menu

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The Layout Menu

The Tools Menu

3.1.1.5 The Footprint Ribbon Menu

The Home Menu

The Panels Menu

The Footprint Menu

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The View/Snap Menu

The Edit Menu

The Add Menu

The Layout Menu

The Tools Menu

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3.1.1.6 The Text Ribbon Menu

The Home Ribbon Menu

The Panels Ribbon Menu

The Edit Ribbon Menu

The Insert Ribbon Menu

3.1.2 The Classic Menu

The classic menu consists of a series of drop-down menus.

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3.1.3 Menu Shortcuts

3.1.4 Efficent Screen Usage

DEX can optionally collapse panels and the ribbon menu to give you the maximum view of design. The
choice is your and you can rapidly change your workstation style at the click of a mouse button.
The two menu style are again shown below but with the panels and menu minimized.
The Microsoft Ribbon Style Menu

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The classic Dropdow n m enu w ith toolbars

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3.2 The File Settings

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3.3 The Workspace Setttings

3.4 The Panels

DEX has the following panels which can be docked to the sides of the application of left floating.

The Checklist Panel

The Part Builder Panel
The Project Panel
The Properties Panel
The Library Panel
The Layers Panel
The Design Rules Checker Panel
The Navigator Panel
The Settings Panel
The Source View Panel

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The Parts Bin Panel

The Parts Bin Panel
The Netlist Panel
The Parts List Panel
The System Info. Panel

3.4.1 The Checklist Panel

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3.4.2 The Part Builder Panel

The parts builder panel groups up several common controls and displays then based on the context you
are in. For instance, if you are editing a part's schematic symbol, the symbol wizard will be shown. If
you are editing a part's footprint, the footprint wizard will appear.

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3.4.3 The Project Panel

The Project panel display a tree list of the contents of your projects. It is shown below. To display

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the Project panel click on the Projects button in the Panels ribbon tab or right click on a
viewport and select Project panel from the context menu.

Using the Project Panel you can add sheets and text documents as well as view and edit them.

Double click on a project item schematic, PCB or text document to view it in a viewport. If a
viewport already exists that contains the item to view, then it will be brought to the front.

Adds a new schematic sheet.

Adds a new text document.

Print the project hierarchy. This will display the print preview dialogs similar to the one below.
You can print it or save it to PDF and several other formats.

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If checked then you can edit the name of the sheet or document as well as the
description. Otherwise they are protected and read only.

Show/Hide the description column.

Both the Allow Edit and Descriptions settings are saved from session to session.

Expanded directories are also saved from session to session.

Right click in the Project panel to display the context menu. This will allow you to add sheets and
delete selected sheet.

Displays this help page.

You can drag sheets to reposition them in the project hierarchy.

Right click on the Name or Description column header to display the header context menu as shown
below. This will allow you to sort columns etc.

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Right click over a sheet to see the context menu as shown below.

3.4.4 The Properties Panel

The properties panel lets you edit the properties of selected objects on schematic and PCB sheets.

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3.4.5 The Library Panel

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3.4.6 The Layers Panel

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3.4.7 The Design Rules Checker Panel

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3.4.8 The Navigator Panel

3.4.9 The Settings Panel

The settings panels lets you view and edit the individual settings and preferences for sheets and the
project.

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3.4.10 The Source View Panel

The source panel display the XML file data that describes your project.

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3.4.11 The Parts Bin Panel

The parts bin contains parts that you do not wish to appear on schematic sheets. It acts as a holding
bin for parts not yet needed in a design.

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3.4.12 The Netlist Panel

The nets list panel show you netlist, in different format, that detail the electrical connectivity of your
design.

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3.4.13 The Parts List Panel

The Parts List panel displays the parts in your project.

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3.4.14 The System Info. Panel

3.5 Viewports
Viewports provide a graphical view into your design.

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3.5.1 Rulers
The origin corner

3.5.2 Tabbed Viewports

Enter topic text here.

3.5.3 Tiled and Cascaded Viewports

Enter topic text here.

3.5.4 Zooming In and Out

Zoom Window.
In
Out
Full Page
Page Width
Page Height
All.
Selected
Content

Panning

Using the mousewheel

Page Up

3.5.5 Smart Panning

Enter topic text here.

3.5.6 The Navigator

Enter topic text here.

3.6 Workspaces
The DEX workspace consists of:
A top menu. This can be a Microsoft Office style ribbon menu or the class dropdown menu with
toobars.
A viewport area. This can be either a tabbed collection of viewports or a Multiple Document Interface
(MDI) displaying a collection of one or more viewports displaying schematics, PCBs, 3D views and
text documents.
An optional status bar at the base of the viewport area.
An optional color chooser, again at the base of the viewport area.
One of several optional dockable/floatable control panels that contain controls to help you modify/
control your design.

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3.7 The Status Bar

The status panel gives you timely status messages and details as you continue in your design.

3.8 The Color Bar

The Color Bar is shown below. You can hide/show the color bar from the Panels ribbon menu
group in the main menu.

You can select the fill or pen/line color for selected object by clicking on one of the color buttons in
the Color Bar.

Left click on a button to set the fill color.

Right click to set the pen/line color.

If the selected object can only have a fill color, or a pen/line color, then clicking the left or right
mouse button will set the fill or pen/line color.

3.9 Themes

DEX comes with many attractive themes (Skins) that you can choose to match your mode and add
that bit of variety to your life.

The Skins are selected via the Panels/Skins menu. Select the theme from the Skin gallery.

For an even more interesting way to see some of the Themes available, click on the video below.

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4 Arranging and Editing Objects

Enter topic text here.

4.1 Undoing and Redoing Your Changes

4.2 Selecting Items

Pick
Subpick
window pick
Use alt
select all
Invert selection.
Unselect all.

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4.3 Locking Objects

You can lock objects to prevent them from being edited or deleted.

To lock an object:
1. First select it.
2. Then tick the lock checkbox in its properties dialog in the Properties Panel.

Similarly, to unlock an object:

3. First select it.
4. Then clear the lock checkbox in its properties dialog in the Properties Panel.

4.4 Deleting Objects

Enter topic text here.

4.5 Moving Objects to the Clipboard

Enter topic text here.

4.6 Clearing Sheets and the PCB

Enter topic text here.

4.7 Copying Objects

Enter topic text here.

4.8 Pasting Items from the Clipboard

Enter topic text here.

4.9 Rotating Objects

Enter topic text here.

4.10 Mirroring Objects

Enter topic text here.

4.11 Scaling Objects

Up/down by percentage.
The transform box.

4.12 Aligning Objects

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4.13 Grouping Objects

Enter topic text here.

4.14 Distributing Objects

Enter topic text here.

4.15 Reordering Objects

Enter topic text here.

4.16 Creating Arrays of Objects

Enter topic text here.

4.16.1 Creating Rectangular Arrays

4.16.2 Creating Circular Arrays

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4.17 Selection Settings

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5 Graphics
You can add graphical elements to DEX.
In schematics graphical elements has no electrical significance, they are not wire connections and have
no impact on the PCB and circuit simulation.
On PCBs, if you add graphical items to electrical layers on PCBs, e.g. the top or bottom copper layer,
then copper will be placed there.
You can add the following graphics:

Lines
Arcs
Polylines
Polygons
Rectangles
Curves
Ellipses and Circles
Text
Notes
Pictures

5.1 Lines
In DEX you can add graphical lines. In schematics they have no electrical significance. However, in
PCBs they do if they are placed on electrical layers such as the top or bottom layer; here they will
leave copper traces and will provide an electrical connection to everything that is connected to
them.

Lines have a width that can be zero for an infinitely thin line. However if you add lines to a PCB
you need to make sure their width is at least the size of the manufacturing minimum width.

Lines also have color and can be semi-transparent. It is even possible to define an invisible line. If
you have snap to objects turned on objects will snap to invisible lines.

Lines can also have a line style as shown below.

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Different line thicknesses and styles

In addition you can also set the line cap style for lines to any of the cap styles shown below. Each
end of the line can have a different style.

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Line end caps

If you have snap to objects turned on, then as you add other objects they can snap to either end
of a line or the center of the line.

5.1.1 Adding Lines

In DEX you can add graphical lines to both schematics and PCBs.

1. To add a line click on the line button in the Shapes menu.

2. Now move the mouse to where you want to start the line. As you mouse the mouse you will see the
line start point input as shown below. You can enter the start point by typing in the x coordinate
followed by the space, tab or enter key and the the numbers for the y coordinate finally ended by
pressing the enter key.

Start point cursor and input boxes

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3. As you move the mouse you will see the possible start point of the line displayed. You can click to
start the line or enter it manually as detailed above.
4. Now as you move the mouse you will see the line being drawn and the end point will follow the cursor.
If snap is on the both the start and the end points will snap to the grid. At any point you can turn snap
on and off by pressing the S key. As you move the mouse you will see the length and angle of the
line displayed. You can again enter precise values for the length and angle. As you mouse the end of
the line, if smart pan is turned on, the viewport will automatically pan so the end point is always
visible. If possible, the original view will be restored.

End point cursor and input boxes

5. Pressing the left button again will end the line.

To turn smart-pan on or off, clink on the smart pan button on the status bar.
If you have Auto-repeat commands set, then you will be prompted to enter the start point for another line.
To cancel adding more lines press either the escape key or right click the mouse button and click on
cancel.
To turn auto-repeat on or off, press the right mouse button and click on the Auto-repeat commands
menu item.
When defining the start position and drag the mouse, the line will appear and when you release the left
mouse button the line is then added to your design.

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5.1.2 Context Menu

If you right click on a line a context sensitive menu will be displayed.

Right click context m enu

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5.1.3 Editing Lines

To edit a line first select it.

When a line is selected you will see 2 manipulator points, one at the start of the end and another at the
end of the line.

A selected line show ing the m anipulator points at both ends

You can press down the left mouse key over either point and drag them to set the start or end of the
line.If snap is turned on then the end points of the line will snap the grid as the ends are moved.
To move a line keeping its angle to the horizontal constant, hold down the left mouse button over the line
not covered by any of the end manipulators and drag the line to its new position.If snap is turned on the
the line will move in steps defined by the grid. The end points may not snap to the grid. To snap the end
points to the grid, drag the end point individually.
As you drag the end points they may snap to other objects if snap to objects is on.
If you have any point, horizontal or vertical guides on your schematic or pcb and snap to guides is on
then the end points will snap to them if they are close enough.
You can set the color of the line by either left or right clicking on a color button in the color bar at the
base of the application viewports.

You can also set the lines parameters using its properties panel.

5.1.4 Line Properties Panel

You can also edit the parameters of the line using it's properties panel as shown below. To view the
properties panel first select it.

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Start
This is the start point of the line.

End
This is the start point of the line.

Layer
Use this to set the layer that the line is on. This only applies to PCBs.

Locked
Check this box to prevent its properties being altered or the line being
moved.

Line Style
Here you can set the style of the line.

This includes the:

dash/solid style
The width
The start and end caps
The lines color.

5.2 Arcs
Enter topic text here.

5.2.1 Adding Arcs

Enter topic text here.

5.2.2 Editing Arcs

Enter topic text here.

5.3 Polylines
Enter topic text here.

5.3.1 Adding Polylines

Enter topic text here.

5.3.2 Editing Polylines

Enter topic text here.

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5.4 Polygons
Enter topic text here.

5.4.1 Adding Polygons

Enter topic text here.

5.4.2 Editing Polygons

Enter topic text here.

5.5 Rectangles
Enter topic text here.

5.5.1 Adding Rectangles

Enter topic text here.

5.5.2 Editing Rectangles

Enter topic text here.

5.6 Curves
Enter topic text here.

5.6.1 Adding Curves

Enter topic text here.

5.6.2 Editing Curves

Enter topic text here.

5.7 Ellipses and Circles

Enter topic text here.

5.7.1 Adding Ellipses and Circles

Enter topic text here.

5.7.2 Editing Ellipses and Circles

Enter topic text here.

5.8 Curved Shapes

Enter topic text here.

5.8.1 Adding Curved Shapes

Enter topic text here.

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5.8.2 Editing Curved Shapes

Enter topic text here.

5.9 Text
Enter topic text here.

5.9.1 Adding Text

Enter topic text here.

5.9.2 Editing Text

Enter topic text here.

5.10 Notes
Enter topic text here.

5.10.1 Adding Notes

Enter topic text here.

5.10.2 Editing Notes

Enter topic text here.

5.11 Pictures
Enter topic text here.

5.11.1 Adding Pictures

Enter topic text here.

5.11.2 Editing Pictures

Enter topic text here.

5.12 Line Styles

The video below demonstrates editing the line style for a line ... (you will need to be connected to the
Internet to view it)

Many different objects in DEX have line style, these include:

Lines and polylines.
Polygons, rectangles, curves, ellipses and circles.

Pictures

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The Line style properties dialog is shown on the

left.

Start and End Cap

These control the capping at the start and the end

of lines. Only objects with open ends can have
end caps, e.g.,lines, polylines and open curves.

Dash Styles

The dash style buttons below the cap styles set

the line style as solid or a variety of dash styles.

Width

Here you can set the width of the line.

Color

Here you can set the color of the line.

5.13 Fill Styles

Enter topic text here.

5.13.1 Solid Fill

Enter topic text here.

5.13.2 Hatch Fill

Enter topic text here.

5.13.3 Radial Fill

Enter topic text here.

5.13.4 Linear Fill

Enter topic text here.

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5.14 Default Graphics Settings

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6 Dimensions
Linear dimensions.
Aligned dimensions.

6.1 Adding Dimensions

Enter topic text here.

6.2 Editing Dimensions

Enter topic text here.

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6.3 Dimension Settings

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7 Drawing Aids
Enter topic text here.

7.1 Coordinates
Enter topic text here.

7.1.1 Adding Coordinates

Enter topic text here.

7.1.2 Editing Coordinates

Enter topic text here.

7.2 Guides
Show/Hide guides

7.2.1 Vertical Guides

Enter topic text here.

7.2.1.1 Adding Vertical Guides

Enter topic text here.

7.2.1.2 Editing Vertical Guides

Enter topic text here.

7.2.2 Horizontal Guides

Enter topic text here.

7.2.2.1 Adding Horizontal Guides

Enter topic text here.

7.2.2.2 Editing Horizontal Guides

Enter topic text here.

7.2.3 Point Guides

Enter topic text here.

7.2.3.1 Adding Point Guides

Enter topic text here.

7.2.3.2 Editing Point Guides

Enter topic text here.

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7.2.4 Angled Guides

Enter topic text here.

7.2.4.1 Adding Angled Guides

Enter topic text here.

7.2.4.2 Editing Angled Guides

Enter topic text here.

7.3 Snaps and the Grid

Enter topic text here.

7.3.1 The Grids

Enter topic text here.

7.3.1.1 The Graph Grid

Enter topic text here.

7.3.1.2 The Line Grid

Enter topic text here.

7.3.1.3 The Dot Grid

Enter topic text here.

7.3.2 Setting the Snaps per Grid

Enter topic text here.

7.3.3 Rotation Snap

Enter topic text here.

7.3.4 Snapping to Guides

Enter topic text here.

7.3.5 Snapping to Objects

Enter topic text here.

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7.3.6 Snap Settings

7.4 Measuring Distances and Angles

To measure distances click the Measure distance button in the Tools/Misc. ribbon menu.

1. Move the cursor to the start point you wish to measure from.
2. Press down the left mouse button and drag the cursor. As you do, the distance will be displayed.

3. Releasing the left mouse button will end the measurement.

If you have the repeat command feature set (right click) then you can do repeat measurement by holding
down the left mouse button and dragging. Double click or right click to end the measure distance

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command.

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8 Parts
Part files contain schematic symbols, text documents and a footprint (land pattern) that contains all the
information needed to define the abstract schematic representation for a part together with the footprint
required for the PCB and the 3D solid model for the part.
Parts are defined parametrically and this allow a single part to be quickly and easily modified into a
different part type. The parametric models define how to create a complete part fro only a few simple
parameters.

+ +
Part=

3D
Footp
Schematic Symbol(s) Pack
rint
age

8.1 Parts Overview

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8.2 Parametric Parts

A parametric part is the encapsulation of all the details needed by DEX to generate the schematics
symbols, footprint and 3D solid model for a real part.

To illustrate the concept lets consider a PIC10F200 microcontroller from Micochip.

We will consider the version that comes in a 8-pin PDIP package.

There are 3 parts to consider.

1. The Manufacturers model and specification of the device.
2. What you actually get.
3. The model used by DEX to help you incorporate it into the system you are designing.
4.

8.2.1 The Manufacturers Model

The manufacturer will detail the part they will sell you using a datasheet. The datasheet will descibe
what the device does and the physical package it comes in. There may be more that one package for a
part.
Each package has a set of electrical pins that you must connect to your circuit. The naming, allocation
and description of these pins are in the datasheet.

To use a part in DEX you will need to know it's package, its pinout and it's recommended footprint.

The PIC10F200 microcontroller datasheet is available at http://ww1.microchip.com/downloads/en/

DeviceDoc/41239D.pdf

For the Microchip parts there is also an additional packaging specification available at http://
ww1.microchip.com/downloads/en/PackagingSpec/00049AU.pdf

The datasheet has a pinout of the part as shown below.

The physical package is shown below

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The physical package parameters are defined below.

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8.2.2 The Deliverable

What is delivered to you to construct a electronic system is a physical part. In the case of the 8pin DIP
PC its looks like this:

You need to extract the essential data from the suppliers model and make a computer representation
the can be use to design the system both logically and physically.

8.2.3 The AutoTRAX Model

AutoTRAX models the device define by the above specification as a DIP.

The parameteric model of the PIC10F200 is divided into 3 parts.

The Schematic Symbol

The Footprint

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The 3D Package

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8.3 Creating Parts

Enter topic text here.

8.3.1 Creating Parts on Schematics

Enter topic text here.

8.3.2 Editing Parts on Schematics

Reposition automatic.

8.3.3 Saving Your Part

Enter topic text here.

8.4 Using the Part Wizard

Enter topic text here.

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8.5 The Part Builder

Enter topic text here.

8.6 Symbols
Enter topic text here.

8.6.1 Symbol Borders

Enter topic text here.

8.6.2 Symbol References

Enter topic text here.

8.6.3 Symbol Values

Enter topic text here.

8.6.4 Symbol Terminals

Enter topic text here.

8.6.4.1 Adding Terminals

Enter topic text here.

8.6.4.2 EditingTerminals

Enter topic text here.

8.6.5 Making a Symbol as No Footprint

Enter topic text here.

8.6.6 Adding Graphics to Symbols

Enter topic text here.

8.6.7 Editing Symbols in Schematics

Enter topic text here.

8.6.7.1 Reordering Terminals

Enter topic text here.

8.6.7.2 Adding graphics to Symbols in Schematics

Enter topic text here.

8.7 Spice Models

Enter topic text here.

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8.7.1 Bipolar Transistors (BJT)

Enter topic text here.

8.7.2 Capacitors
Enter topic text here.

8.7.3 Diodes
Enter topic text here.

8.7.4 Voltage and Current Sources

Enter topic text here.

8.7.4.1 Voltage Sources

Enter topic text here.

8.7.4.1.1 Independent DC Voltage Sources

Enter topic text here.

8.7.4.1.2 Independent Sinusoidal Voltage Sources

Enter topic text here.

8.7.4.1.3 Independent Pulse Voltage Sources

Enter topic text here.

8.7.4.1.4 Independent Single Frequency FM Voltage Sources

Enter topic text here.

8.7.4.1.5 Independent Piece-Wise Linear Voltage Sources

Enter topic text here.

8.7.4.1.6 Independent Exponential Voltage Sources

Enter topic text here.

8.7.4.2 Current Sources

Enter topic text here.

8.7.4.2.1 Independent DC Current Sources

Enter topic text here.

8.7.4.2.2 Independent Pulse Current Sources

Enter topic text here.

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8.7.4.2.3 Independent Sinusoidal Current Sources

Enter topic text here.

8.7.4.2.4 Independent Single Frequency FM Current Sources

Enter topic text here.

8.7.4.2.5 Independent Piece-Wise Linear Current Sources

Enter topic text here.

8.7.4.3 Controlled Sources

Enter topic text here.

8.7.4.3.1 Current Controlled Current Sources

Enter topic text here.

8.7.4.3.2 Current Controlled Voltage Sources

Enter topic text here.

8.7.4.3.3 Voltage Controlled Current Sources

Enter topic text here.

8.7.4.3.4 Voltage Controlled Voltage Sources

Enter topic text here.

8.7.5 Inductors
Enter topic text here.

8.7.6 Junction Field Effect Transistors (JFET)

Enter topic text here.

8.7.7 MESFETs
Enter topic text here.

8.7.8 MOSFETs
Enter topic text here.

8.7.9 Resistors
Enter topic text here.

8.7.10 Switches
Enter topic text here.

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8.7.11 Transformers
Enter topic text here.

8.7.12 Transmission Lines

Enter topic text here.

8.7.12.1 Lossless Transmission Lines

Enter topic text here.

8.7.12.2 Lossy Transmission Lines (LTRA)

Enter topic text here.

8.7.12.3 Lossy Transmission Lines (URC)

Enter topic text here.

8.8 Custom
Enter topic text here.

8.9 Footprints
Enter topic text here.

8.9.1 The Footprint Placement Point

Enter topic text here.

8.9.2 Silkscreen Rectangles

Enter topic text here.

8.9.3 Courtyards
Enter topic text here.

8.9.4 Pads
Enter topic text here.

8.9.5 The Footprint Reference

Enter topic text here.

8.9.6 Adding 3D objects

Enter topic text here.

8.9.7 Adding Graphics to Footprint

Enter topic text here.

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8.10 3D Packages
Enter topic text here.

8.11 The Parts Library

Enter topic text here.

8.11.1 Setting the location of the parts library

Enter topic text here.

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9 Artworks
Artwork files contain schematic that do not have any electrical content, such as parts and wires. They
are used for creating library artwork to be used in project and part files. They can also be used for any
other drawing needs as DEX's powerful graphics allows you to graphical design engineering drawings.

Below is an example of artwork for a transformer with a center tap. It consists of a collection of arcs and
lines. There are no symbol terminals.

You would use this when creating a custom transformer part. To do this:

1. Create an new part.

2. Drag the artwork from the library.
3. Add the symbol terminals.
4. Save the part.

Below is a part created using the artwork and with terminals added

You can also add artwork from the library onto another artwork file that you are editing. This allows you

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to build complex art using a bottom up design methodology.

You can also add artwork to the PCB. However as the artwork may be draw with a black pen, it will
appear drawn black on black so you will need to change it's color and layer to make it visible. Artwork
will initially be placed on the top document layer.

9.1 Adding Artwork to the Library

To add artwork to the library:

1. Select the graphics for the artwork in the schematic. Any electrical items such as symbol terminals,
although selected, will not be added to the artwork file.
2. In the library panel, right click and select Add Selected Graphics. The dialog box shown below will
be displayed.
3. Enter the name for the artwork and click the OK button. You can change the target directory by typing

it in or clicking on the browse button.

Once added, you can drag the artwork from the library panel onto any schematic.

You can edit the saved artwork file in the library panel by double clicking on it's name or right clicking
on it's name and select Edit Selected Part.

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10 Schematics
Enter topic text here.

10.1 Adding Parts

Enter topic text here.

10.1.1 Using the Menu

Enter topic text here.

10.1.2 Using the Library Panel

Enter topic text here.

10.1.3 Requesting a Part

Enter topic text here.

10.2 Hierarchical Design

Enter topic text here.

10.2.1 Sub-Systems
Enter topic text here.

10.2.1.1 Ports

Enter topic text here.

10.2.1.1.1 Adding Ports

Enter topic text here.

10.2.1.1.2 Editing Ports

Enter topic text here.

10.2.1.2 Referencing a Sub-System

Add Existing

10.2.1.3 Adding a Sub-System

Enter topic text here.

10.2.1.4 Editing a Sub-System

Enter topic text here.

10.3 Wiring Parts Together

DEX can wire part terminals together.

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Each wire forms part of an electrical node.

Each node can have its own color and line width.

DEX can optionally show node IDs where nodes join to part terminals.

10.3.1 Adding Wires

Enter topic text here.

10.3.2 Editing Wires

Enter topic text here.

10.3.3 Using Busses

A bus represent a collection of electrical wires on a schematic sheet. The collection of wires are related
in functionality, e.g. an address bus contains a collection of bus wires, say A0 to A31 for a 32 bit wide
address bus. You connect several wires to a bus and the bus 'carries' the wires around the schematic
grouped into a virtual single cable conduit.

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Below is bus named Address which carries connections from the device on the left.

10.3.3.1 Adding Busses

Enter topic text here.

10.3.3.2 Editing Busses

Enter topic text here.

10.3.4 Beveling Wire to Buss Connections

Enter topic text here.

10.3.5 Inter-Wire Connectors

Also call off-page connectors.
An off-page connector is a symbol terminal that a wire connected to it will connect to all wires connected
to off-page connectors with the same node name. Like space world tunnels that science fiction
enthusiasts love.

10.3.5.1 Adding Inter-Wire Connectors

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10.3.5.2 Editing Inter-Wire Connectors

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10.3.6 Making a Terminal as No Connection Required

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10.3.7 Nodes and Nets

A node connects 2 or more part electrical pins together on one or more schematics.
A node can consist of 1 or more wire segments. A wire connected a wire( using a wire junction ) or a
terminal to another wire via a wire( using a wire junction ) or a terminal.
Below a node consisting of 3 wire segments connecting R1, R2 and Q1.

A terminal can be a
A Symbol Terminal or
An Inter-wire Connector or
A Port.

Symbols consists of zero or more symbol terminals and possibly some graphics to represent the
symbol. Symbol terminals can be visible or invisible.
A net defines the physical representation of a node on a PCB and defines which part pins (pads on
footprints) are connected together.

Each node has a node index and an optional node name. By default nodes do not have a node name.
Below, the above node is shown with the node index displayed. (Use ribbon menu View/Node Names).

You can set the node name by selecting the click by clicking on any of its wires and setting the nodes
name using the properties panel. (Right click and select Properties Panel). Below shows the node after
the node's name have been set to 'My Node'.

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Instead on connecting terminals together with wires you can connect terminals to an inter-wire connector
and name the inter-wire connector node by selecting it and setting its name using the properties panel.
Below the top terminal of R2 and been connected to an inter-wire connector whose name has been set
to 'My Node'. This connects R1, R2 and Q1 together. You can place as many inter-wire connectors as
you wish on the same schematic or different schematics and all wire connecting to them will be
connected together into one single node. The PCB net will then connect all the package pins together.

You can take this to the extreme and connect all terminals to named inter-wire connectors as shown
below. Again R1, R2 and Q1are connected together.

You use inter-wire connectors on the same sheet to reduce wire clutter. You would use them on different
schematics to connect wires between sheets. Copy and paste inter-wire connectors works fine.

Ports can also be used to connect wires together on different sheets. Ports let you use a schematic as

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a sub-system on other sheets.

10.3.8 Nodes

Node are collections of wires on a schematic that connect 2 or more terminals together.

10.3.9 Wires
Wires are single connections between exactly two of the following:
symbol terminals
wire junctions (where 3 or more wires meet)
off-page connectors
bus terminals. ( terminal points on a bus)

10.3.10 Wire Settings

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10.4 Renumbering Parts

Enter topic text here.

10.5 Checking Your Schematic

DRC Clearing errors

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11 Text Sheets
Enter topic text here.

11.1 Adding Text Sheets

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11.2 Fonts
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11.3 Paragraphs
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11.4 Find and Replace

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11.5 Adding Pictures

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11.6 Checking Your Spelling

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12 Circuit Simulation
Enter topic text here.

12.1 Always Add a Ground

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12.2 Instruments
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12.2.1 Oscilloscopes
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12.2.1.1 Adding Oscilloscopes

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12.2.1.2 Editing Oscilloscopes

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12.2.2 Multimeters
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12.2.2.1 Adding Multimeters

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12.2.2.2 Editing Multimeters

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12.2.3 Function Generators

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12.2.3.1 Adding Function Generators

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12.2.3.2 Editing Function Generators

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12.2.4 Power Supplies

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12.2.4.1 Adding Power Supplies

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12.2.4.2 Editing Power Supplies

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12.3 The Analysis Probe

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12.4 Adding Voltage and Current Sources

Sources
Dependant sources

12.5 The Spice Reference Manual

SPICE (Simulation Program with Integrated Circuit Emphasis) is a general-purpose, open source analog
electronic circuit simulator. It is a powerful program that is used in integrated circuit and board-level
design to check the integrity of circuit designs and to predict circuit behavior.

12.5.1 Introduction
SPICE is a general-purpose circuit simulation program for nonlinear dc, nonlinear transient, and linear ac
analyses.

It was developed at the Electronics Research Laboratory of the University of California, Berkeley by
Laurence Nagel with direction from his research advisor, Prof. Donald Pederson.

The version used in DEX is version 3f5.

12.5.1.1 Introduction

SPICE is a general-purpose circuit simulation program for nonlinear dc, nonlinear transient, and
linear ac analyses. Circuits may contain resistors, capacitors, inductors, mutual inductors,
independent voltage and current sources, four types of dependent sources, lossless and lossy
transmission lines (two separate implementations), switches, uniform distributed RC lines, and the
five most common semiconductor devices: diodes, BJTs, JFETs, MESFETs, and MOSFETs.

The SPICE3 version is based directly on SPICE 2G.6. While SPICE3 is being developed to include
new features, it continues to support those capabilities and models that remain in extensive use in the
SPICE2 program.

SPICE has built-in models for the semiconductor devices, and the user need specify only the
pertinent model parameter values. The model for the BJT is based on the integral-charge model of
Gummel and Poon; however, if the Gummel- Poon parameters are not specified, the model reduces
to the simpler Ebers-Moll model. In either case, charge-storage effects, ohmic resistances, and a
current-dependent output conductance may be included. The diode model can be used for either
junction diodes or Schottky barrier diodes. The JFET model is based on the FET model of
Shichman and Hodges. Six MOSFET models are implemented: MOS1 is described by a square-
law I-V characteristic, MOS2 [1] is an analytical model, while MOS3 [1] is a semi-empirical model;

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MOS6 [2] is a simple analytic model accurate in the short-channel region; MOS4 [3, 4] and MOS5
[5] are the BSIM (Berkeley Short-channel IGFET Model) and BSIM2. MOS2, MOS3, and
MOS4 include second-order effects such as channel-length modulation, sub threshold conduction,
scattering-limited velocity saturation, small-size effects, and charge-controlled capacitances.

12.5.1.2 Types of Analysis

DC Analysis

The dc analysis portion of SPICE determines the dc operating point of the circuit with inductors
shorted and capacitors opened. The dc analysis options are specified on the .DC, .TF, and .OP
control lines. A dc analysis is automatically performed prior to a transient analysis to determine the
transient initial conditions, and prior to an ac small-signal analysis to determine the linearized, small-
signal models for nonlinear devices. If requested, the dc small-signal value of a transfer function
(ratio of output variable to input source), input resistance, and output resistance is also computed as
a part of the dc solution. The dc analysis can also be used to generate dc transfer curves: a specified
independent voltage or current source is stepped over a user-specified range and the dc output
variables are stored for each sequential source value.

AC Small-Signal Analysis

The ac small-signal portion of SPICE computes the ac output variables as a function of frequency.
The program first computes the dc operating point of the circuit and determines linearized, small-
signal models for all of the nonlinear devices in the circuit. The resultant linear circuit is then analyzed
over a user-specified range of frequencies. The desired output of an ac small- signal analysis is
usually a transfer function (voltage gain, transimpedance, etc). If the circuit has only one ac input, it is
convenient to set that input to unity and zero phase, so that output variables have the same value as
the transfer function of the output variable with respect to the input.

Transient Analysis

The transient analysis portion of SPICE computes the transient output variables as a function of time
over a user-specified time interval. The initial conditions are automatically determined by a dc
analysis. All sources that are not time dependent (for example, power supplies) are set to their dc
value. The transient time interval is specified on a .TRAN control line.

Pole-Zero Analysis

The pole-zero analysis portion of SPICE computes the poles and/or zeros in the small-signal ac
transfer function. The program first computes the dc operating point and then determines the
linearized, small-signal models for all the nonlinear devices in the circuit. This circuit is then used to
find the poles and zeros of the transfer function.

Two types of transfer functions are allowed : one of the form (output voltage)/(input voltage) and the
other of the form (output voltage)/(input current). These two types of transfer functions cover all the
cases and one can find the poles/zeros of functions like input/output impedance and voltage gain.

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The input and output ports are specified as two pairs of nodes.

The pole-zero analysis works with resistors, capacitors, inductors, linear-controlled sources,
independent sources, BJTs, MOSFETs, JFETs and diodes. Transmission lines are not supported.

The method used in the analysis is a sub-optimal numerical search. For large circuits it may take a
considerable time or fail to find all poles and zeros. For some circuits, the method becomes "lost"
and finds an excessive number of poles or zeros.

Small-Signal Distortion Analysis

The distortion analysis portion of SPICE computes steady-state harmonic and intermodulation
products for small input signal magnitudes. If signals of a single frequency are specified as the input
to the circuit, the complex values of the second and third harmonics are determined at every point in
the circuit. If there are signals of two frequencies input to the circuit, the analysis finds out the
complex values of the circuit variables at the sum and difference of the input frequencies, and at the
difference of the smaller frequency from the second harmonic of the larger frequency.

Distortion analysis is supported for the following nonlinear devices: diodes (DIO), BJT, JFET,
MOSFETs (levels 1, 2, 3, 4/BSIM1, 5/BSIM2, and 6) and MESFETS. All linear devices are
automatically supported by distortion analysis. If there are switches present in the circuit, the analysis
continues to be accurate provided the switches do not change state under the small excitations used
for distortion calculations.

Sensitivity Analysis

Spice3 will calculate either the DC operating-point sensitivity or the AC small-signal sensitivity of an
output variable with respect to all circuit variables, including model parameters. Spice calculates the
difference in an output variable (either a node voltage or a branch current) by perturbing each
parameter of each device independently. Since the method is a numerical approximation, the results
may demonstrate second order affects in highly sensitive parameters, or may fail to show very low
but non-zero sensitivity. Further, since each variable is perturbed by a small fraction of its value,
zero-valued parameters are not analyized (this has the benefit of reducing what is usually a very large
amount of data).

Noise Analysis

The noise analysis portion of SPICE does analysis device-generated noise for the given circuit.
When provided with an input source and an output port, the analysis calculates the noise
contributions of each device (and each noise generator within the device) to the output port voltage.
It also calculates the input noise to the circuit, equivalent to the output noise referred to the specified
input source. This is done for every frequency point in a specified range - the calculated value of the
noise corresponds to the spectral density of the circuit variable viewed as a stationary gaussian
stochastic process.

After calculating the spectral densities, noise analysis integrates these values over the specified

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frequency range to arrive at the total noise voltage/current (over this frequency range). This
calculated value corresponds to the variance of the circuit variable viewed as a stationary gaussian
process.

12.5.1.3 Analysis at Different Temperatures

All input data for SPICE is assumed to have been measured at a nominal temperature of 27 C,
which can be changed by use of the TNOM parameter on the .OPTION control line. This value can
further be overridden for any device which models temperature effects by specifying the TNOM
parameter on the model itself. The circuit simulation is performed at a temperature of 27 C, unless
overridden by a TEMP parameter on the .OPTION control line. Individual instances may further
override the circuit temperature through the specification of a TEMP parameter on the instance.

Temperature dependent support is provided for resistors, diodes, JFETs, BJTs, and level 1, 2, and
3 MOSFETs. BSIM (levels 4 and 5) MOSFETs have an alternate temperature dependency scheme
which adjusts all of the model parameters before input to SPICE. For details of the BSIM
temperature adjustment, see [6] and [7].

Temperature appears explicitly in the exponential terms of the BJT and diode model equations. In
addition, saturation currents have a built-in temperature dependence. The temperature dependence
of the saturation current in the BJT models is determined by:

where k is Boltzmann's constant, q is the electronic charge, Eg is the energy gap which is a model
parameter, and XTI is the saturation current temperature exponent (also a model parameter, and
usually equal to 3).

The temperature dependence of forward and reverse beta is according to the formula:

where T1 and T0 are in degrees Kelvin, and XTB is a user-supplied model parameter. Temperature
effects on beta are carried out by appropriate adjustment to the values of F, ISE, R, and ISC (spice
model parameters BF, ISE, BR, and ISC, respectively).

Temperature dependence of the saturation current in the junction diode model is determined by:

where N is the emission coefficient, which is a model parameter, and the other symbols have the
same meaning as above. Note that for Schottky barrier diodes, the value of the saturation current
temperature exponent, XTI, is usually 2.

Temperature appears explicitly in the value of junction potential, (in spice PHI), for all the device
models. The temperature dependence is determined by:

where k is Boltzmann's constant, q is the electronic charge, Na is the acceptor impurity density, Nd
is the donor impurity density, Ni is the intrinsic carrier concentration, and Eg is the energy gap.

Temperature appears explicitly in the value of surface mobility, 0 (or UO), for the MOSFET model.
The temperature dependence is determined by:

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The effects of temperature on resistors is modeled by the formula:

where T is the circuit temperature, T0 is the nominal temperature, and TC1 and TC2 are the first-
and second-order temperature coefficients.

12.5.1.4 Convergence

Both dc and transient solutions are obtained by an iterative process which is terminated when both
of the following conditions hold:
1. The nonlinear branch currents converge to within a tolerance of 0.1% or 1 picoamp (1.0e-
12 Amp), whichever is larger.
2. The node voltages converge to within a tolerance of 0.1% or 1 microvolt (1.0e-6Volt),
whichever is larger.

Although the algorithm used in SPICE has been found to be very reliable, in some cases it fails to
converge to a solution. When this failure occurs, the program terminates the job.

Failure to converge in dc analysis is usually due to an error in specifying circuit connections, element
values, or model parameter values. Regenerative switching circuits or circuits with positive feedback
probably will not converge in the dc analysis unless the OFF option is used for some of the devices
in the feedback path, or the .NODESET control line is used to force the circuit to converge to the
desired state.

12.5.2 Circuit Description

The circuit to be analyzed is described to SPICE by a set of element lines, which define the circuit
topology and element values, and a set of control lines, which define the model parameters and the run
controls.

12.5.2.1 Circuit Elements and Models

The circuit element include:

Transistors and Diodes

Transmission Lines
Voltage and Current Sources

12.5.2.1.1 Transistors and Diodes

Spice includes models for transistors:

Bipolar Junction Transistors (BJTs)

BJT Models (NPN/PNP)
JFET Models (NJF/PJF)[****]
Junction Field-Effect Transistors (JFETs)

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MESFET Models (NMF/PMF)

MOSFETs
MOSFET Models (NMOS/PMOS)

And the following diode models:

Diode Model
Junction Diodes

12.5.2.1.1.1 Introduction

The area factor used on the diode, BJT, JFET, and MESFET devices determines the number of
equivalent parallel devices of a specified model. The affected parameters are marked with an
asterisk under the heading 'area' in the model descriptions below. Several geometric factors
associated with the channel and the drain and source diffusions can be specified on the MOSFET
device line.

Two different forms of initial conditions may be specified for some devices. The first form is included
to improve the dc convergence for circuits that contain more than one stable state. If a device is
specified OFF, the dc operating point is determined with the terminal voltages for that device set to
zero. After convergence is obtained, the program continues to iterate to obtain the exact value for
the terminal voltages. If a circuit has more than one dc stable state, the OFF option can be used to
force the solution to correspond to a desired state. If a device is specified OFF when in reality the
device is conducting, the program still obtains the correct solution (assuming the solutions converge)
but more iterations are required since the program must independently converge to two separate
solutions. The .NODESET control line serves a similar purpose as the OFF option. The
.NODESET option is easier to apply and is the preferred means to aid convergence.

The second form of initial conditions are specified for use with the transient analysis. These are true
'initial conditions' as opposed to the convergence aids above. See the description of the .IC control
line and the .TRAN control line for a detailed explanation of initial conditions.
12.5.2.1.1.2 Bipolar Junction Transistors (BJTs)

General form:

QXXXXXXX NC NB NE <NS> MNAME <AREA> <OFF> <IC=VBE, VCE>

<TEMP=T>

Examples:

Q23 10 24 13 QMOD IC=0.6, 5.0 Q50A 11 26 4 20 MOD1

NC, NB, and NE are the collector, base, and emitter nodes, respectively. NS is the (optional)
substrate node. If unspecified, ground is used. MNAME is the model name, AREA is the area

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factor, and OFF indicates an (optional) initial condition on the device for the dc analysis. If the area
factor is omitted, a value of 1.0 is assumed. The (optional) initial condition specification using
IC=VBE, VCE is intended for use with the UIC option on the .TRAN control line, when a transient
analysis is desired starting from other than the quiescent operating point. See the .IC control line
description for a better way to set transient initial conditions. The (optional) TEMP value is the
temperature at which this device is to operate, and overrides the temperature specification on the
.OPTION control line.
12.5.2.1.1.3 BJT Models (NPN/PNP)

The bipolar junction transistor model in SPICE is an adaptation of the integral charge control model
of Gummel and Poon. This modified Gummel-Poon model extends the original model to include
several effects at high bias levels. The model automatically simplifies to the simpler Ebers-Moll
model when certain parameters are not specified. The parameter names used in the modified
Gummel-Poon model have been chosen to be more easily understood by the program user, and to
reflect better both physical and circuit design thinking.

The dc model is defined by the parameters IS, BF, NF, ISE, IKF, and NE which determine the
forward current gain characteristics, IS, BR, NR, ISC, IKR, and NC which determine the reverse
current gain characteristics, and VAF and VAR which determine the output conductance for
forward and reverse regions. Three ohmic resistances RB, RC, and RE are included, where RB can
be high current dependent. Base charge storage is modeled by forward and reverse transit times, TF
and TR, the forward transit time TF being bias dependent if desired, and nonlinear depletion layer
capacitances which are determined by CJE, VJE, and MJE for the B-E junction , CJC, VJC, and
MJC for the B-C junction and CJS, VJS, and MJS for the C-S (Collector-Substrate) junction. The
temperature dependence of the saturation current, IS, is determined by the energy-gap, EG, and the
saturation current temperature exponent, XTI. Additionally base current temperature dependence is
modeled by the beta temperature exponent XTB in the new model. The values specified are
assumed to have been measured at the temperature TNOM, which can be specified on the
.OPTIONS control line or overridden by a specification on the .MODEL line.

The BJT parameters used in the modified Gummel-Poon model are listed below. The parameter
names used in earlier versions of SPICE2 are still accepted.

name parameter units default example area

IS transport saturation current A 1.0e-16 1.0e-15 *

BF ideal maximum forward beta - 100 100

NF forward current emission coefficient - 1.0 1

VAF forward Early voltage V infinite 1

IKF corner for forward beta high current roll-off A infinite 200 *

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ISE B-E leakage saturation current A 0 0.01 *

NE B-E leakage emission coefficient - 1.5 1.0e-13

BR ideal maximum reverse beta - 1 2

NR reverse current emission coefficient - 1 0.11

VAR reverse Early voltage V infinite 1200

IKR corner for reverse beta high current roll-off A infinite 2000.01 *

ISC leakage saturation current A 0 0.01.0e- *

13

NC leakage emission coefficient - 2 1.5

RB zero bias base resistance Ohm 0 100 *

IRB current where base resistance falls halfway to its A infinite 0.1 *
min value

RBM minimum base resistance at high currents Ohm RB 10 *

RE emitter resistance Ohm 0 1 *

RC collector resistance Ohm 0 10 *

CJE B-E zero-bias depletion capacitance F 0 2pF *

VJE B-E built-in potential V 0.75 0.6

MJE B-E junction exponential factor - 0.33 0.33

TF ideal forward transit time sec 0 0.1ns

XTF coefficient for bias dependence of TF - 0

VTF voltage describing VBC dependence of TF V infinite

ITF high-current parameter for effect on TF A 0 *

PTF excess phase at freq=1.0/(TF*2PI) Hz deg 0

CJC B-C zero-bias depletion capacitance F 0 2pF *

VJC B-C built-in potential V 0.75 0.5

MJC B-C junction exponential factor - 0.33 0.5

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XCJC fraction of B-C depletion capacitance connected - 1

to internal base node

TR ideal reverse transit time sec 0 10ns

CJS zero-bias collector-substrate capacitance F 0 2pF *

VJS ubstrate junction built-in potential V 0.75

MJS substrate junction exponential factor - 0 0.5

XTB forward and reverse beta temperature exponent - 0

EG energy gap for temperature eV 1.11

XTI temperature exponent for effect on IS - 3

KF flicker-noise coefficient - 0

AF flicker-noise exponent - 1

FC coefficient for forward-bias depletion capacitance - -.5

formula

TNOM Parameter measurement temperature C 27 50

12.5.2.1.1.4 Diode Model

The dc characteristics of the diode are determined by the parameters IS and N. An ohmic
resistance, RS, is included. Charge storage effects are modeled by a transit time, TT, and a nonlinear
depletion layer capacitance which is determined by the parameters CJO, VJ, and M. The
temperature dependence of the saturation current is defined by the parameters EG, the energy and
XTI, the saturation current temperature exponent. The nominal temperature at which these
parameters were measured is TNOM, which defaults to the circuit-wide value specified on the
.OPTIONS control line. Reverse breakdown is modeled by an exponential increase in the reverse
diode current and is determined by the parameters BV and IBV (both of which are positive
numbers).
12.5.2.1.1.5 JFET Models (NJF/PJF)

The JFET model is derived from the FET model of Shichman and Hodges. The dc characteristics
are defined by the parameters VTO and BETA, which determine the variation of drain current with
gate voltage, LAMBDA, which determines the output conductance, and IS, the saturation current of
the two gate junctions. Two ohmic resistances, RD and RS, are included. Charge storage is
modeled by nonlinear depletion layer capacitances for both gate junctions which vary as the -1/2

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power of junction voltage and are defined by the parameters CGS, CGD, and PB.

Note that in Spice3f and later, a fitting parameter B has been added. For details, see [9].

name parameter units default example area

VTO threshold voltage (VT0) V -2.0 -2.0

BETA transconductance parameter (Beta) A/V2 1.0e-4 1.0e-3 *

LAMBD channel-length modulation parameter ( ) 1/V 0 1.0e-4

A

RD drain ohmic resistance Ohm 0 100 *

RS source ohmic resistance Ohm 0 100 *

CGS zero-bias G-S junction capacitance F 0 5pF *

(Cgs)

CGD zero-bias G-D junction capacitance F 0 1pF *

(Cgs)

PB gate junction potential V 1 0.6

IS gate junction saturation current (IS) A 1.0e-14 1.0E-14 *

B doping tail parameter - 1

KF flicker noise coefficient - 0

AF flicker noise exponent - 1

FC coefficient for forward-bias - 0.5

TNOM parameter measurement temperature C 50

12.5.2.1.1.6 Junction Diodes

General form:

DXXXXXXX N+ N- MNAME <AREA>> <OFF> <IC=VD> <TEMP>

Examples:

DBRIDGE 2 10 DIODE1 DCLMP 3 7 DMOD 3.0 IC=0.2

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N+ and N- are the positive and negative nodes, respectively. MNAME is the model name, AREA
is the area factor, and OFF indicates an (optional) starting condition on the device for dc analysis. If
the area factor is omitted, a value of 1.0 is assumed. The (optional) initial condition specification
using IC=VD is intended for use with the UIC option on the .TRAN control line, when a transient
analysis is desired starting from other than the quiescent operating point. The (optional) TEMP value
is the temperature at which this device is to operate, and overrides the temperature specification on
the .OPTION control line.
12.5.2.1.1.7 Junction Field-Effect Transistors (JFETs)

General form:

JXXXXXXX ND NG NS MNAME <AREA> <OFF> <IC=VDS, VGS> <TEMP>

Examples:

J1 7 2 3 JM1 OFF

ND, NG, and NS are the drain, gate, and source nodes, respectively. MNAME is the model name,
AREA is the area factor, and OFF indicates an (optional) initial condition on the device for dc
analysis. If the area factor is omitted, a value of 1.0 is assumed. The (optional) initial condition
specification, using IC=VDS, VGS is intended for use with the UIC option on the .TRAN control
line, when a transient analysis is desired starting from other than the quiescent operating point. See
the .IC control line for a better way to set initial conditions. The (optional) TEMP value is the
temperature at which this device is to operate, and overrides the temperature specification on the
.OPTION control line.
12.5.2.1.1.8 MESFET Models (NMF/PMF)

The MESFET model is derived from the GaAs FET model of Statz et al. as described in [11]. The
dc characteristics are defined by the parameters VTO, B, and BETA, which determine the variation
of drain current with gate voltage, ALPHA, which determines saturation voltage, and LAMBDA,
which determines the output conductance. The formula are given by:

Two ohmic resistances, RD and RS, are included. Charge storage is modeled by total gate charge
as a function of gate-drain and gate-source voltages and is defined by the parameters CGS, CGD,
and PB.

name parameter units default example area

VTO pinch-off voltage V -2.0 -2.0

BETA transconductance parameter A/V2 1.0e-4 1.0e-3 *

B doping tail extending parameter 1/V 0.3 0.3 *

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ALPHA saturation voltage parameter 1/V 2 2 *

LAMBDA channel-length modulation parameter 1/V 0 1.0e-4

RD drain ohmic resistance Ohms 0 100 *

RS source ohmic resistance Ohms 0 100 *

CGS zero-bias G-S junction capacitance F 0 5pF *

CGD zero-bias G-D junction capacitance F 0 1pF *

PB gate junction potential V 1 0.6

KF flicker noise coefficient - 0

AF flicker noise exponent - 1

FC coefficient for forward-bias depletion - 0.5

capacitance formula

12.5.2.1.1.9 MESFETs

General form:

ZXXXXXXX ND NG NS MNAME <AREA> <OFF> <IC=VDS, VGS>

Examples:

Z1 7 2 3 ZM1 OFF

12.5.2.1.1.10 MOSFET Models (NMOS/PMOS)

SPICE provides four MOSFET device models, which differ in the formulation of the I-V
characteristic. The variable LEVEL specifies the model to be used:

LEVEL=1 -> Shichman-Hodges

LEVEL=2 -> MOS2 (as described in [1])

LEVEL=3 -> MOS3, a semi-empirical model(see [1])

LEVEL=4 -> BSIM (as described in [3])

LEVEL=5 -> new BSIM (BSIM2; as described in [5])

LEVEL=6 -> MOS6 (as described in [2])The dc characteristics of the level 1

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through level 3 MOSFETs are defined by the device parameters VTO, KP, LAMBDA, PHI and
GAMMA. These parameters are computed by SPICE if process parameters (NSUB, TOX, ...) are
given, but user-specified values always override. VTO is positive (negative) for enhancement mode
and negative (positive) for depletion mode N-channel (P-channel) devices. Charge storage is
modeled by three constant capacitors, CGSO, CGDO, and CGBO which represent overlap
capacitances, by the nonlinear thin-oxide capacitance which is distributed among the gate, source,
drain, and bulk regions, and by the nonlinear depletion-layer capacitances for both substrate
junctions divided into bottom and periphery, which vary as the MJ and MJSW power of junction
voltage respectively, and are determined by the parameters CBD, CBS, CJ, CJSW, MJ, MJSW
and PB. Charge storage effects are modeled by the piecewise linear voltages-dependent
capacitance model proposed by Meyer. The thin-oxide charge-storage effects are treated slightly
different for the LEVEL=1 model. These voltage-dependent capacitances are included only if TOX
is specified in the input description and they are represented using Meyer's formulation.

There is some overlap among the parameters describing the junctions, e.g. the reverse current can
be input either as IS (in A) or as JS (in A/m2). Whereas the first is an absolute value the second is
multiplied by AD and AS to give the reverse current of the drain and source junctions respectively.
This methodology has been chosen since there is no sense in relating always junction characteristics
with AD and AS entered on the device line; the areas can be defaulted. The same idea applies also
to the zero-bias junction capacitances CBD and CBS (in F) on one hand, and CJ (in F/m2) on the
other. The parasitic drain and source series resistance can be expressed as either RD and RS (in
ohms) or RSH (in ohms/sq.), the latter being multiplied by the number of squares NRD and NRS
input on the device line.

A discontinuity in the MOS level 3 model with respect to the KAPPA parameter has been detected
(see [10]). The supplied fix has been implemented in Spice3f2 and later. Since this fix may affect
parameter fitting, the option "BADMOS3" may be set to use the old implementation (see the section
on simulation variables and the ".OPTIONS" line).

SPICE level 1, 2, 3 and 6 parameters:

name parameter units default example

LEVEL model - 1

VTO zero-bias threshold voltage (VT0) V 0 1

KP transconductance parameter A/V2 2.0e-5 3.1e-5

GAMM bulk threshold parameter ( ) V1/2 0 0.37

A

PHI surface potential ( ) V 0.6 0.65

LAMBD channel-length modulation (MOS1 and MOS2 1/V 0 0.02

A only) ( )

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RD drain ohmic resistance Ohm 0 1

RS source ohmic resistance Ohm 0 1

CBD zero-bias B-D junction capacitance F 0 20fF

CBS zero-bias B-S junction capacitance F 0 20fF

IS bulk junction saturation current (IS) A 1.oe-14 1.0e-15

PB bulk junction potential V 0.8 0.87

CGSO gate-source overlap capacitance per meter channel F/m 0 4.0e-11

width

CGDO gate-drain overlap capacitance per meter channel F/m 0 4.0e-11

width

CGBO gate-bulk overlap capacitance per meter channel F/m 0 2e-1-

length

RSH drain and source diffusion sheet resistance Ohm/ 0 10

square

CJ zero-bias bulk junction bottom cap. per sq-meter F/m2 0 2.0e-4

of junction area

MJ bulk junction bottom grading coeff. - 0.5 0.5

CJSW zero-bias bulk junction sidewall cap. per meter of F/m 10 1.0e-9
junction perimeter

MJSWE bulk junction sidewall grading coeff. - 0.5

(level1)

0.33(level
2,3)

FS bulk junction saturation current per sq-meter of A/m2 1.0e-8

junction area

TOX oxide thickness meter 1.0e-7 1.0e-7

NSUB substrate doping 1/cm3 0 4.0e15

NSS surface state density 1/cm2 0 1.0e10

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NFS fast surface state density 1/cm2 0 1.0e10

TPG type of gate material: +1 opp. to substrate -1 same - 1.0

as substrate 0 Al gate

XJ metallurgical junction depth meter 0 1 micron

LD lateral diffusion meter 0 0.8 micron

UO surface mobility cm2/Vs 600 700

UCRIT critical field for mobility degradation (MOS2 only V/cm 600 1.0e-4

UEXP critical field exponent in mobility degradation - 1.0e04 0.1

(MOS2 only)

UTRA transverse field coeff. (mobility) (deleted for - 0 0.3

MOS2)

VMAX maximum drift velocity of carriers m/s 0 5.0e40.3

NEFF total channel-charge (fixed and mobile) coefficient - 0 5.0

(MOS2 only

KF flicker noise exponent - 0 1.0e-26

AF flicker noise exponent - 1 1.2

FC coefficient for forward-bias depletion capacitance - 0.5

formula

DELTA width effect on threshold voltage (MOS2 and - 0 1.0

MOS3)

THETA mobility modulation (MOS3 only 1/V 0 0.1

ETA static feedback (MOS3 only) - 0 1.0

KAPPA saturation field factor (MOS3 only) - 0.2 0.5

TNOM parameter measurement temperature C 25 50

The level 4 and level 5 (BSIM1 and BSIM2) parameters are all values obtained from process
characterization, and can be generated automatically. J. Pierret [4] describes a means of generating a
'process' file, and the program Proc2Mod provided with SPICE3 converts this file into a sequence
of BSIM1 ".MODEL" lines suitable for inclusion in a SPICE input file. Parameters marked below
with an * in the l/w column also have corresponding parameters with a length and width
dependency. For example, VFB is the basic parameter with units of Volts, and LVFB and WVFB

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also exist and have units of Volt- meter The formula

is used to evaluate the parameter for the actual device specified with

and

Note that unlike the other models in SPICE, the BSIM model is designed for use with a process
characterization system that provides all the parameters, thus there are no defaults for the
parameters, and leaving one out is considered an error. For an example set of parameters and the
format of a process file, see the SPICE2 implementation notes[3].

For more information on BSIM2, see reference [5].

SPICE BSIM (level 4) parameters:

name parameter units 1/w

VFB flat-band voltage V *

PHI surface inversion potential V *

K1 body effect coefficient V1/2 *

K2 drain/source depletion charge-sharing coefficient - *

ETA zero-bias drain-induced barrier-lowering coefficient - *

MUZ zero-bias mobility cm2/V-s

DL shortening of channel micron

DW narrowing of channel micron

U0 zero-bias transverse-field mobility degradation coefficient V-1 *

U1 zero-bias velocity saturation coefficient micron/V *

X2MZ sens. of mobility to substrate bias at vds=0 cm2/V-s *

X2E sens. of drain-induced barrier lowering effect to substrate bias V-1 *

X3E sens. of drain-induced barrier lowering effect to drain bias at V-1 *

Vds=Vdd

X2U0 sens. of transverse field mobility degradation effect to V-2 *

substrate bias

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X2U1 sens. of velocity saturation effect to substrate bias micron/ *

2
V

MUS mobility at zero substrate bias and at Vds=Vdd cm2/V-s

X2MS sens. of mobility to substrate bias at Vds=Vdd cm2/V-s *

X3MS sens. of mobility to drain bias at Vds=Vdd 2 *

cm /V-s

X3U1 sens. of velocity saturation effect on drain bias at Vds=Vdd cm2/V-s *

TOX TOX &#9;gate oxide thickness micron

TEMP temperature at which parameters were measured C

VDD measurement bias range V

CGD0 gate-drain overlap capacitance per meter channel width F/m

CGSO gate-source overlap capacitance per meter channel width F/m

CGBO gate-bulk overlap capacitance per meter channel length F/m

XPART gate-oxide capacitance-charge model flag - *

NO zero-bias subthreshold slope coefficient - *

NB sens. of subthreshold slope to substrate bias - *

ND sens. of subthreshold slope to drain bias -

RSH drain and source diffusion sheet resistance Ohm/

square

JS source drain junction current density A/m2

PB built in potential of source drain junction V

MJ Grading coefficient of source drain junction -

PBSW built in potential of source, drain junction sidewall V

MJSW grading coefficient of source drain junction sidewall -

CJ Source drain junction capacitance per unit area F/m2

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CJSW source drain junction sidewall capacitance per unit length F/m

WDF source drain junction default width m

DELL Source drain junction length reduction m

XPART = 0 selects a 40/60 drain/source charge partition in saturation, while XPART=1 selects a
0/100 drain/source charge partition.

ND, NG, and NS are the drain, gate, and source nodes, respectively. MNAME is the model name,
AREA is the area factor, and OFF indicates an (optional) initial condition on the device for dc
analysis. If the area factor is omitted, a value of 1.0 is assumed. The (optional) initial condition
specification, using IC=VDS, VGS is intended for use with the UIC option on the .TRAN control
line, when a transient analysis is desired starting from other than the quiescent operating point. See
the .IC control line for a better way to set initial conditions.
12.5.2.1.1.11 MOSFETs

General form:

MXXXXXXX ND NG NS NB MNAME <L=VAL> <W=VAL> <AD=VAL> <AS=VAL>

+ <PD=VAL> <PS=VAL> <NRD=VAL> <NRS=VAL> <OFF>

+ <IC=VDS, VGS, VBS> <TEMP=T>

Examples:

M1 24 2 0 20 TYPE1 M31 2 17 6 10 MODM L=5U W=2U M1 2 9 3 0 MOD1 L=10U W=5U

AD=100P AS=100P PD=40U PS=40U

ND, NG, NS, and NB are the drain, gate, source, and bulk (substrate) nodes, respectively.
MNAME is the model name. L and W are the channel length and width, in meters. AD and AS are
the areas of the drain and source diffusions, in m2. Note that the suffix U specifies microns (1e-6 m)
and P sq-microns (1e-12 m2). If any of L, W, AD, or AS are not specified, default values are used.
The use of defaults simplifies input file preparation, as well as the editing required if device
geometries are to be changed. PD and PS are the perimeters of the drain and source junctions, in
meters. NRD and NRS designate the equivalent number of squares of the drain and source
diffusions; these values multiply the sheet resistance RSH specified on the .MODEL control line for
an accurate representation of the parasitic series drain and source resistance of each transistor. PD
and PS default to 0.0 while NRD and NRS to 1.0. OFF indicates an (optional) initial condition on
the device for dc analysis. The (optional) initial condition specification using IC=VDS, VGS, VBS is
intended for use with the UIC option on the .TRAN control line, when a transient analysis is desired
starting from other than the quiescent operating point. See the .IC control line for a better and more
convenient way to specify transient initial conditions. The (optional) TEMP value is the temperature
at which this device is to operate, and overrides the temperature specification on the .OPTION

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control line. The temperature specification is ONLY valid for level 1, 2, 3, and 6 MOSFETs, not for
level 4 or 5 (BSIM) devices.

12.5.2.1.2 Transmission Lines

There are several different transmission line models:

Lossless Transmission Lines

Lossy Transmission Line Model (LTRA)
Lossy Transmission Lines
Uniform Distributed RC Lines (Lossy)
Uniform Distributed RC Model (URC)

12.5.2.1.2.1 Lossless Transmission Lines

General form:

TXXXXXXX N1 N2 N3 N4 Z0=VALUE <TD=VALUE> <F=FREQ

<NL=NRMLEN>>

+ <IC;=V1, I1, V2, I2>

Examples:

T1 1 0 2 0 Z0=50 TD=10NS

N1 and N2 are the nodes at port 1; N3 and N4 are the nodes at port 2. Z0 is the characteristic
impedance. The length of the line may be expressed in either of two forms. The transmission delay,
TD, may be specified directly (as TD=10ns, for example). Alternatively, a frequency F may be
given, together with NL, the normalized electrical length of the transmission line with respect to the
wavelength in the line at the frequency F. If a frequency is specified but NL is omitted, 0.25 is
assumed (that is, the frequency is assumed to be the quarter-wave frequency). Note that although
both forms for expressing the line length are indicated as optional, one of the two must be specified.

Note that this element models only one propagating mode. If all four nodes are distinct in the actual
circuit, then two modes may be excited. To simulate such a situation, two transmission-line elements
are required. (see the example in \\*(AA for further clarification.)

The (optional) initial condition specification consists of the voltage and current at each of the
transmission line ports. Note that the initial conditions (if any) apply 'only' if the UIC option is
specified on the .TRAN control line.

Note that a lossy transmission line (see below) with zero loss may be more accurate than than the
lossless transmission line due to implementation details.

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12.5.2.1.2.2 Lossy Transmission Line Model (LTRA)

The uniform RLC/RC/LC/RG transmission line model (referred to as the LTRA model henceforth)
models a uniform constant-parameter distributed transmission line. The RC and LC cases may also
be modeled using the URC and TRA models; however, the newer LTRA model is usually faster and
more accurate than the others. The operation of the LTRA model is based on the convolution of the
transmission line's impulse responses with its inputs (see [8]).

The LTRA model takes a number of parameters, some of which must be given and some of which
are optional.

name parameter unirts/type default example

R resistance/length ohm/unit 0 0.2

L nductance/length henrys/unit 0 9.13e-9

G conductance/length mhos/unit 0 0

C capacitance/length farads/unit 0 3.65e-12

LEN lenght of line no default 1

REL breakpoint control arbitary 1 0.5

unit

ABS don't limit timestep to less than line 1 5

delay

NOSTEPLIMIT flag not set set

NOCONTROL use lineiaairinterpolation flag not set set

LININTERP use lineair when quadratic seems bad flag not set set

MIXEDINTERP special reltol for history compaction flag not set set

COMPACTREL special abstol for history compaction flag RELTOL 1.0e-3

COMPACTABS use Newton-Raphson method for ABSTOL 1.0e-9

timestep control

TRUNCNR use Newton-Raphson method for flag not set set

timestep control

TRUNCDONT don't limit timestep to keep impulse- flag not set set
CUT response errors low

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The following types of lines have been implemented so far: RLC (uniform transmission line with
series loss only), RC (uniform RC line), LC (lossless transmission line), and RG (distributed series
resistance and parallel conductance only). Any other combination will yield erroneous results and
should not be tried. The length LEN of the line must be specified.

NOSTEPLIMIT is a flag that will remove the default restriction of limiting time-steps to less than the
line delay in the RLC case. NOCONTROL is a flag that prevents the default limiting of the time-step
based on convolution error criteria in the RLC and RC cases. This speeds up simulation but may in
some cases reduce the accuracy of results. LININTERP is a flag that, when specified, will use linear
interpolation instead of the default quadratic interpolation for calculating delayed signals.
MIXEDINTERP is a flag that, when specified, uses a metric for judging whether quadratic
interpolation is not applicable and if so uses linear interpolation; otherwise it uses the default
quadratic interpolation. TRUNCDONTCUT is a flag that removes the default cutting of the time-
step to limit errors in the actual calculation of impulse-response related quantities. COMPACTREL
and COMPACTABS are quantities that control the compaction of the past history of values stored
for convolution. Larger values of these lower accuracy but usually increase simulation speed. These
are to be used with the TRYTOCOMPACT option, described in the .OPTIONS section.
TRUNCNR is a flag that turns on the use of Newton-Raphson iterations to determine an
appropriate timestep in the timestep control routines. The default is a trial and error procedure by
cutting the previous timestep in half. REL and ABS are quantities that control the setting of
breakpoints.

The option most worth experimenting with for increasing the speed of simulation is REL. The default
value of 1 is usually safe from the point of view of accuracy but occasionally increases computation
time. A value greater than 2 eliminates all breakpoints and may be worth trying depending on the
nature of the rest of the circuit, keeping in mind that it might not be safe from the viewpoint of
accuracy. Breakpoints may usually be entirely eliminated if it is expected the circuit will not display
sharp discontinuities. Values between 0 and 1 are usually not required but may be used for setting
many breakpoints.

COMPACTREL may also be experimented with when the option TRYTOCOMPACT is specified
in a .OPTIONS card. The legal range is between 0 and 1. Larger values usually decrease the
accuracy of the simulation but in some cases improve speed. If TRYTOCOMPACT is not specified
on a .OPTIONS card, history compaction is not attempted and accuracy is high. NOCONTROL,
TRUNCDONTCUT and NOSTEPLIMIT also tend to increase speed at the expense of accuracy.
12.5.2.1.2.3 Lossy Transmission Lines

General form:

OXXXXXXX N1 N2 N3 N4 MNAME

Examples:

O23 1 0 2 0 LOSSYMOD OCONNECT 10 5 20 5 INTERCONNECT

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This is a two-port convolution model for single-conductor lossy transmission lines. N1 and N2 are
the nodes at port 1; N3 and N4 are the nodes at port 2. Note that a lossy transmission line with zero
loss may be more accurate than than the lossless transmission line due to implementation details.
12.5.2.1.2.4 Uniform Distributed RC Lines (Lossy)

General form:

UXXXXXXX N1 N2 N3 MNAME L=LEN <N=LUMPS>

Examples:

U1 1 2 0 URCMOD L=50U URC2 1 12 2 UMODL l=1MIL N=6

N1 and N2 are the two element nodes the RC line connects, while N3 is the node to which the
capacitances are connected. MNAME is the model name, LEN is the length of the RC line in
meters. LUMPS, if specified, is the number of lumped segments to use in modeling the RC line (see
the model description for the action taken if this parameter is omitted).
12.5.2.1.2.5 Uniform Distributed RC Model (URC)

The URC model is derived from a model proposed by L. Gertzberrg in 1974. The model is
accomplished by a subcircuit type expansion of the URC line into a network of lumped RC
segments with internally generated nodes. The RC segments are in a geometric progression,
increasing toward the middle of the URC line, with K as a proportionality constant. The number of
lumped segments used, if not specified for the URC line device, is determined by the following
formula:

The URC line is made up strictly of resistor and capacitor segments unless the ISPERL parameter is
given a non-zero value, in which case the capacitors are replaced with reverse biased diodes with a
zero-bias junction capacitance equivalent to the capacitance replaced, and with a saturation current
of ISPERL amps per meter of transmission line and an optional series resistance equivalent to
RSPERL ohms per meter.

name parameter units default example area

K Propagation Constant - 2 1.2 -

FMAX Maximum Frequency of interest Hz 1.0G 6.5Meg -

RPERL Resistance per unit length ohm/m o1000 10 -

CPERL Capacitance per unit length F/m 1.0e015 1pF -

ISPERL Saturation Current per unit length A/m 0 - -

RSPERL Diode Resistance per unit length ohm/m 0 - -

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12.5.2.1.3 Voltage and Current Sources

Spice has the following voltage and current sources:

Independent Sources
Linear Dependent Sources

12.5.2.1.3.1 Independent Sources

Spice has the following independant sources:

Exponential
Independent Sources
Piece-Wise Linear
Pulse
Single Frequency FM
Sinusoidal

General Form:

EXP(V1 V2 TD1 TAU1 TD2 TAU2)

Examples:

VIN 3 0 EXP(-4 -1 2NS 30NS 60NS 40NS)

parameter default value units

V1 (initial value) - Volts or Amps

V2 (pulsed value) - Volts or Amps

TD1 (rise delay time) 0 seconds

TAU1 (rise time constant) TSTEP seconds

TD2 (fall delay time) TD1+TSTEP seconds

TAU2 (fall time) TSTEP seconds

The shape of the waveform is described by the following table:

time value

0 to TD1 V1

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TD1 to TD2

TD2 to
TSTOP

General form:

VXXXXXXX N+ N- <DC<> DC/TRAN VALUE> <AC <ACMAG <ACPHASE>>>

+ <DISTOF1 <F1MAG <F1PHASE>>> <DISTOF2 <F2MAG <F2PHASE>>>

IYYYYYYY N+ N- <<DC> DC/TRAN VALUE> <AC <ACMAG <ACPHASE>>>

+ <DISTOF1 <F1MAG <F1PHASE>>> <DISTOF2 <F2MAG <F2PHASE>>>

Examples:

VCC 10 0 DC 6 VIN 13 2 0.001 AC 1 SIN(0 1 1MEG) ISRC 23 21 AC 0.333 45.0 SFFM(0 1

10K 5 1K) VMEAS 12 9 VCARRIER 1 0 DISTOF1 0.1 -90.0 VMODULATOR 2 0 DISTOF2
0.01 IIN1 1 5 AC 1 DISTOF1 DISTOF2 0.001

N+ and N- are the positive and negative nodes, respectively. Note that voltage sources need not be
grounded. Positive current is assumed to flow from the positive node, through the source, to the
negative node. A current source of positive value forces current to flow out of the N+ node, through
the source, and into the N- node. Voltage sources, in addition to being used for circuit excitation,
are the 'ammeters' for SPICE, that is, zero valued voltage sources may be inserted into the circuit for
the purpose of measuring current. They of course have no effect on circuit operation since they
represent short-circuits.

DC/TRAN is the dc and transient analysis value of the source. If the source value is zero both for dc
and transient analyses, this value may be omitted. If the source value is time-invariant (e.g., a power
supply), then the value may optionally be preceded by the letters DC.

ACMAG is the ac magnitude and ACPHASE is the ac phase. The source is set to this value in the
ac analysis. If ACMAG is omitted following the keyword AC, a value of unity is assumed. If
ACPHASE is omitted, a value of zero is assumed. If the source is not an ac small-signal input, the
keyword AC and the ac values are omitted.

DISTOF1 and DISTOF2 are the keywords that specify that the independent source has distortion
inputs at the frequencies F1 and F2 respectively (see the description of the .DISTO control line).
The keywords may be followed by an optional magnitude and phase. The default values of the
magnitude and phase are 1.0 and 0.0 respectively.

Any independent source can be assigned a time-dependent value for transient analysis. If a source is
assigned a time-dependent value, the time-zero value is used for dc analysis. There are five

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independent source functions: pulse, exponential, sinusoidal, piece-wise linear, and single-frequency
FM. If parameters other than source values are omitted or set to zero, the default values shown are
assumed. (TSTEP is the printing increment and TSTOP is the final time (see the .TRAN control line
for explanation)).

General Form:

PWL(T1 V1 <T2; V2 T3 V3 T4 V4 ...>)

Examples:

VCLOCK 7 5 PWL(0 -7 10NS -7 11NS -3 17NS -3 18NS -7 50NS -7)

Each pair of values (Ti, Vi) specifies that the value of the source is Vi (in Volts or Amps) at time=Ti.
The value of the source at intermediate values of time is determined by using linear interpolation on
the input values.

General form:

PULSE(V1 V2 TD TR TF PW PER)

Examples:

VIN 3 0 PULSE(-1 1 2NS 2NS 2NS 50NS 100NS)

parameter default value units

V1 (initial value) - Volts orAmps

V2 (pulsed value) - Volts orAmps

V2 (pulsed value) 0 seconds

TR (rise time) TSTEP seconds

TF (fall time) TSTEP seconds

PW (pulse width) TSTOP seconds

PER(period) TSTOP seconds

A single pulse so specified is described by the following table:

time value

0 V1

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TD V1

TD+TR V2

TD+TR+PW V2

TD+TR+PW V2 V1

TSTOP V1

Intermediate points are determined by linear interpolation..

General Form:

SFFM(VO VA FC MDI FS)

Examples:

V1 12 0 SFFM(0 1M 20K 5 1K)

parameter default value units

VO (offset) - Volts or Amps

VA (amplitude) - Volts or Amps

FC (carrier frequency) 1/TSTOP Hz

MDI (modulation index) - -

FS (signal frequency) 1/TSTOP Hz

The shape of the waveform is described by the following equation:

General form:

SIN(VO VA FREQ TD THETA)

Examples:

VIN 3 0 SIN(0 1 100MEG 1NS 1E10)

parameter default value units

VO (offset) - Volts or Amps

VA (amplitude) - Volts or Amps

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FREQ (frequency) 1/TSTOP Hz

TD (delay) 0 seconds

THETA (damping factor) 0 1/seconds

The shape of the waveform is described by the following table:

time value

0 to TD V0

TD to
TSTOP

12.5.2.1.3.2 Linear Dependent Sources

Spice has the following dependant sources:

Current-Controlled Current Sources

Current-Controlled Voltage Sources
Voltage-Controlled Current Sources
Voltage-Controlled Voltage Sources

SPICE allows circuits to contain linear dependent sources characterized by any of the four equations

i= gv v= ev i= fi = hi

where g, e, f, and h are constants representing transconductance, voltage gain, current gain, and
transresistance, respectively.

General form:

FXXXXXXX N+ N- VNAM VALUE

Examples:

F1 13 5 VSENS 5

N+ and N- are the positive and negative nodes, respectively. Current flow is from the positive node,
through the source, to the negative node. VNAM is the name of a voltage source through which the
controlling current flows. The direction of positive controlling current flow is from the positive node,
through the source, to the negative node of VNAM. VALUE is the current gain.

General form:

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HXXXXXXX N+ N- VNAM VALUE

Examples:

HX 5 17 VZ 0.5K

N+ and N- are the positive and negative nodes, respectively. VNAM is the name of a voltage
source through which the controlling current flows. The direction of positive controlling current flow
is from the positive node, through the source, to the negative node of VNAM. VALUE is the
transresistance (in ohms).

General form:

GXXXXXXX N+ N- NC+ NC- VALUE

Examples:

G1 2 0 5 0 0.1MMHO

N+ and N- are the positive and negative nodes, respectively. Current flow is from the positive node,
through the source, to the negative node. NC+ and NC- are the positive and negative controlling
nodes, respectively. VALUE is the transconductance (in mhos).

General form:

EXXXXXXX N+ N- NC+ NC- VALUE

Examples:

E1 2 3 14 1 2.0

N+ is the positive node, and N- is the negative node. NC+ and NC- are the positive and negative
controlling nodes, respectively. VALUE is the voltage gain..

12.5.2.1.3.3 Non-Linear Dependant Sources

General form:

BXXXXXXX N+ N- <I=EXPR> <V=EXPR>

Examples:

B1 0 1 I=cos(v(1))+sin(v(2)) B1 0 1 V=ln(cos(log(v(1,2)^2)))-v(3)^4+v(2)^v(1) B1 3 4 I=17 B1

3 4 V=exp(pi^i(vdd))

N+ is the positive node, and N- is the negative node. The values of the V and I parameters
determine the voltages and currents across and through the device, respectively. If I is given then the

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device is a current source, and if V is given the device is a voltage source. One and only one of these
parameters must be given.

The small-signal AC behavior of the nonlinear source is a linear dependent source (or sources) with
a proportionality constant equal to the derivative (or derivatives) of the source at the DC operating
point.

The expressions given for V and I may be any function of voltages and currents through voltage
sources in the system. The following functions of real variables are defined:

abs asinh cosh sin

acos atan exp sinh

acosh atanh ln sqrt

asin cos log tan

The function "u" is the unit step function, with a value of one for arguments greater than one and a
value of zero for arguments less than zero. The function "uramp" is the integral of the unit step: for an
input x, the value is zero if x is less than zero, or if x is greater than zero the value is x. These two
functions are useful in sythesizing piece-wise non-linear functions, though convergence may be
adversely affected.

The following standard operators are defined:

+ - * / ^ unary -

If the argument of log, ln, or sqrt becomes less than zero, the absolute value of the argument is used.
If a divisor becomes zero or the argument of log or ln becomes zero, an error will result. Other
problems may occur when the argument for a function in a partial derivative enters a region where
that function is undefined.

To get time into the expression you can integrate the current from a constant current source with a
capacitor and use the resulting voltage (don't forget to set the initial voltage across the capacitor).
Non-linear resistors, capacitors, and inductors may be synthesized with the nonlinear dependent
source. Non-linear resistors are obvious. Non-linear capacitors and inductors are implemented with
their linear counterparts by a change of variables implemented with the nonlinear dependent source.
The following subcircuit will implement a nonlinear capacitor:
.Subckt nlcap pos neg
* Bx: calculate f(input voltage)
Bx 1 0 v = f(v(pos,neg))
* Cx: linear capacitance

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Cx 2 0 1

* Vx: Ammeter to measure current into the capacitor

Vx 2 1 DC 0Volts
* Drive the current through Cx back into the circuit
Fx pos neg Vx 1

.ends

Non-linear inductors are similar.

12.5.2.1.4 Capacitors

General form:

CXXXXXXX N+ N- VALUE <IC=INCOND>

Examples:

CBYP 13 0 1UF COSC 17 23 10U IC=3V

N+ and N- are the positive and negative element nodes, respectively. VALUE is the capacitance in
Farads.

The (optional) initial condition is the initial (time-zero) value of capacitor voltage (in Volts). Note that
the initial conditions (if any) apply 'only' if the UIC option is specified on the .TRAN control line.
12.5.2.1.5 Coupled (Mutual) Inductors

General form:

KXXXXXXX LYYYYYYY LZZZZZZZ VALUE

Examples:

K43 LAA LBB 0.999 KXFRMR L1 L2 0.87

LYYYYYYY and LZZZZZZZ are the names of the two coupled inductors, and VALUE is the
coefficient of coupling, K, which must be greater than 0 and less than or equal to 1. Using the 'dot'
convention, place a 'dot' on the first node of each inductor.
12.5.2.1.6 Inductors

General form:

LYYYYYYY N+ N- VALUE <IC=INCOND>

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Examples:

LLINK 42 69 1UH LSHUNT 23 51 10U IC=15.7MA

N+ and N- are the positive and negative element nodes, respectively. VALUE is the inductance in
Henries.

The (optional) initial condition is the initial (time-zero) value of inductor current (in Amps) that flows
from N+, through the inductor, to N-. Note that the initial conditions (if any) apply only if the UIC
option is specified on the .TRAN analysis line.
12.5.2.1.7 Resistors

General form:

RXXXXXXX N1 N2 VALUE

Examples:

R1 1 2 100 RC1 12 17 1K

N1 and N2 are the two element nodes. VALUE is the resistance (in ohms) and may be positive or
negative but not zero.
12.5.2.1.8 Semiconductor Capacitor Model

The capacitor model contains process information that may be used to compute the capacitance
from strictly geometric information.

name parameter units default example

CJ junction bottom capacitance F/meter/meter - 5e-5

CJSW junction sidewall capacitance F/meter - 2e-11

DEFW default device width meters 1e-6 2e-6

NARRO narrowing due to side etching meters 0 1e-7

W

The capacitor has a capacitance computed as

12.5.2.1.9 Semiconductor Capacitors

General form:

CXXXXXXX N1 N2 <VALUE> <MNAME> <L=LENGTH> <W=WIDTH> <IC=VAL>

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Examples:

CLOAD 2 10 10P CMOD 3 7 CMODEL L=10u W=1u

This is the more general form of the Capacitor presented in section 6.2, and allows for the
calculation of the actual capacitance value from strictly geometric information and the specifications
of the process. If VALUE is specified, it defines the capacitance. If MNAME is specified, then the
capacitance is calculated from the process information in the model MNAME and the given
LENGTH and WIDTH. If VALUE is not specified, then MNAME and LENGTH must be
specified. If WIDTH is not specified, then it is taken from the default width given in the model. Either
VALUE or MNAME, LENGTH, and WIDTH may be specified, but not both sets.
12.5.2.1.10 Semiconductor Resistor Model

The resistor model consists of process-related device data that allow the resistance to be calculated
from geometric information and to be corrected for temperature. The parameters available are:

name parameter units default example

TC1 first order temperature coeff. Ohm/C 0 -

TC2 second order temperature coeff. Ohm/C/C 0 -

RSH sheet resistance Ohm/q - 50

DEFW default width meters 1e-6 2e-6

NARRO narrowing due to side etching meters 0 1e-7

W

TNOM parameter measurement temperature C 27 50

The sheet resistance is used with the narrowing parameter and L and W from the resistor device to
determine the nominal resistance by the formula

DEFW is used to supply a default value for W if one is not specified for the device. If either RSH or
L is not specified, then the standard default resistance value of 1k is used. TNOM is used to
override the circuit-wide value given on the .OPTIONS control line where the parameters of this
model have been measured at a different temperature. After the nominal resistance is calculated, it is
adjusted for temperature by the formula:
12.5.2.1.11 Semiconductor Resistors

General form:

RXXXXXXX N1 N2 <VALUE> <MNAME> <L=LENGTH> <W=WIDTH> <TEMP=T>

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Examples:

RLOAD 2 10 10K RMOD 3 7 RMODEL L=10u W=1u

This is the more general form of the resistor presented in section 6.1, and allows the modeling of
temperature effects and for the calculation of the actual resistance value from strictly geometric
information and the specifications of the process. If VALUE is specified, it overrides the geometric
information and defines the resistance. If MNAME is specified, then the resistance may be
calculated from the process information in the model MNAME and the given LENGTH and
WIDTH. If VALUE is not specified, then MNAME and LENGTH must be specified. If WIDTH is
not specified, then it is taken from the default width given in the model. The (optional) TEMP value is
the temperature at which this device is to operate, and overrides the temperature specification on the
.OPTION control line.
12.5.2.1.12 Sw itch Model

The switch model allows an almost ideal switch to be described in SPICE. The switch is not quite
ideal, in that the resistance can not change from 0 to infinity, but must always have a finite positive
value. By proper selection of the on and off resistances, they can be effectively zero and infinity in
comparison to other circuit elements. The parameters available are:

name parameter units default switch

VT threshold voltage Volts 0 S

IT threshold current Amps 0 W

VH hysteresis voltage Volts 0 S

IH hysteresis current Amps 0 W

RON on resistance Ohms 1 both

ROFF off resistance Ohms 1/GMIN* both

*(See the .OPTIONS control line for a description of GMIN, its default value results in an off-
resistance of 1.0e+12 ohms.)

The use of an ideal element that is highly nonlinear such as a switch can cause large discontinuities to
occur in the circuit node voltages. A rapid change such as that associated with a switch changing
state can cause numerical roundoff or tolerance problems leading to erroneous results or timestep
difficulties. The user of switches can improve the situation by taking the following steps:

First, it is wise to set ideal switch impedances just high or low enough to be negligible with respect to
other circuit elements. Using switch impedances that are close to "ideal" in all cases aggravates the
problem of discontinuities mentioned above. Of course, when modeling real devices such as
MOSFETS, the on resistance should be adjusted to a realistic level depending on the size of the

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device being modeled.

If a wide range of ON to OFF resistance must be used in the switches (ROFF/RON >1e;+12), then
the tolerance on errors allowed during transient analysis should be decreased by using the
.OPTIONS control line and specifying TRTOL to be less than the default value of 7.0. When
switches are placed around capacitors, then the option CHGTOL should also be reduced.
Suggested values for these two options are 1.0 and 1e-16 respectively. These changes inform
SPICE3 to be more careful around the switch points so that no errors are made due to the rapid
change in the circuit.
12.5.2.1.13 Sw itches

General form:

SXXXXXXX N+ N- NC+ NC- MODEL <ON><OFF>

WYYYYYYY N+ N- VNAM MODEL <ON><OFF>

Examples:

s1 1 2 3 4 switch1 ONs2 5 6 3 0 sm2 off Switch1 1 2 10 0 smodel1 w1 1 2 vclock switchmod1

W2 3 0 vramp sm1 ON wreset 5 6 vclck lossyswitch OFF

Nodes 1 and 2 are the nodes between which the switch terminals are connected. The model name is
mandatory while the initial conditions are optional. For the voltage controlled switch, nodes 3 and 4
are the positive and negative controlling nodes respectively. For the current controlled switch, the
controlling current is that through the specified voltage source. The direction of positive controlling
current flow is from the positive node, through the source, to the negative node.

12.5.2.2 Combining Files. .include lines

General form:

.INCLUDE filename

Examples:

.INCLUDE /users/spice Simulation Program for Integrated Circuit Emulation./common/

wattmeter.cir

Frequently, portions of circuit descriptions will be reused in several input files, particularly with
common models and subcircuits. In any spice input file, the ".include" line may be used to copy some
other file as if that second file appeared in place of the ".include" line in the original file. There is no
restriction on the file name imposed by spice beyond those imposed by the local operating system.

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12.5.2.3 Device Models

General form:

.MODEL MNAME TYPE(PNAME1=PVAL1 PNAME2=PVAL2 ... )

Examples:

.MODEL MOD1 NPN (BF=50 IS=1E-13 VBF=50)

Most simple circuit elements typically require only a few parameter values. However, some devices
(semiconductor devices in particular) that are included in SPICE Simulation Program for Integrated
Circuit Emulation. require many parameter values. Often, many devices in a circuit are defined by the
same set of device model parameters. For these reasons, a set of device model parameters is
defined on a separate .MODEL line and assigned a unique model name. The device element lines in
SPICE then refer to the model name.

For these more complex device types, each device element line contains the device name, the nodes
to which the device is connected, and the device model name. In addition, other optional parameters
may be specified for some devices: geometric factors and an initial condition (see the following
section on Transistors and Diodes for more details).

MNAME in the above is the model name, and type is one of the following fifteen types:

R Semiconductor resistor model

C Semiconductor capacitor model
SW Voltage controlled switch
CSW Current controlled switch
URC Uniform distributed RC model

LTRA Lossy transmission line model

D Diode model
NPN NPN BJT model
PNP PNP BJT model
NJF N-channel JFET model
PJF P-channel JFET model
NMOSN-channel MOSFET model
PMOS P-channel MOSFET model

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NMF N-channel MESFET model

PMF P-channel MESFET model

Parameter values are defined by appending the parameter name followed by an equal sign and the
parameter value. Model parameters that are not given a value are assigned the default values given
below for each model type. Models, model parameters, and default values are listed in the next
section along with the description of device element lines.

12.5.2.4 GENERAL STRUCTURE AND CONVENTIONS

The circuit to be analyzed is described to SPICE by a set of element lines, which define the circuit
topology and element values, and a set of control lines, which define the model parameters and the
run controls. The first line in the input file must be the title, and the last line must be ".END". The
order of the remaining lines is arbitrary (except, of course, that continuation lines must immediately
follow the line being continued).

Each element in the circuit is specified by an element line that contains the element name, the circuit
nodes to which the element is connected, and the values of the parameters that determine the
electrical characteristics of the element. The first letter of the element name specifies the element
type. The format for the SPICE element types is given in what follows. The strings XXXXXXX,
YYYYYYY, and ZZZZZZZ denote arbitrary alphanumeric strings. For example, a resistor name
must begin with the letter R and can contain one or more characters. Hence, R, R1, RSE, ROUT,
and R3AC2ZY are valid resistor names. Details of each type of device are supplied in a following
section.

Fields on a line are separated by one or more blanks, a comma, an equal ('=') sign, or a left or right
parenthesis; extra spaces are ignored. A line may be continued by entering a '+' (plus) in column 1 of
the following line; SPICE continues reading beginning with column 2.

A name field must begin with a letter (A through Z) and cannot contain any delimiters.

A number field may be an integer field (12, -44), a floating point field (3.14159), either an integer or
floating point number followed by an integer exponent (1e-14, 2.65e3), or either an integer or a
floating point number followed by one of the following scale factors:

T = 1012 G = 109 Meg = 106 K = 103 mil = 25.4 10-6

m = 10-3 u = 10-6 n = 10-9 p = 10-12 f = 10-15

Letters immediately following a number that are not scale factors are ignored, and letters immediately
following a scale factor are ignored. Hence, 10, 10V, 10Volts, and 10Hz all represent the same
number, and M, MA, MSec, and MMhos all represent the same scale factor. Note that 1000,
1000.0, 1000Hz, 1e3, 1.0e3, 1KHz, and 1K all represent the same number.

Nodes names may be arbitrary character strings. The datum (ground) node must be named '0'. Note
the difference in SPICE3 where the nodes are treated as character strings and not evaluated as

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numbers, thus '0' and '00' are distinct nodes in SPICE3 but not in SPICE2. The circuit cannot
contain a loop of voltage sources and/or inductors and cannot contain a cut-set of current sources
and/or capacitors. Each node in the circuit must have a dc path to ground. Every node must have at
least two connections except for transmission line nodes (to permit unterminated transmission lines)
and MOSFET substrate nodes (which have two internal connections anyway).

12.5.2.5 SubCircuits

A subcircuit that consists of SPICE Simulation Program for Integrated Circuit Emulation. elements
can be defined and referenced in a fashion similar to device models. The subcircuit is defined in the
input file by a grouping of element lines; the program then automatically inserts the group of elements
wherever the subcircuit is referenced. There is no limit on the size or complexity of subcircuits, and
subcircuits may contain other subcircuits. An example of subcircuit usage is given in \\*(AA.

.SUBCKT

General form:

.SUBCKT subnam N1 &ltN2; N3 ...>

Examples:

.SUBCKT OPAMP 1 2 3 4

A circuit definition is begun with a .SUBCKT line. SUBNAM is the subcircuit name, and N1, N2,
... are the external nodes, which cannot be zero. The group of element lines which immediately
follow the .SUBCKT line define the subcircuit. The last line in a subcircuit definition is the .ENDS
line (see below). Control lines may not appear within a subcircuit definition; however, subcircuit
definitions may contain anything else, including other subcircuit definitions, device models, and
subcircuit calls (see below). Note that any device models or subcircuit definitions included as part of
a subcircuit definition are strictly local (i.e., such models and definitions are not known outside the
subcircuit definition). Also, any element nodes not included on the .SUBCKT line are strictly local,
with the exception of 0 (ground) which is always global.

.ENDS

General form:

.ENDS &ltSUBNAM;>

Examples:

.ENDS OPAMP

The "Ends" line must be the last one for any subcircuit definition. The subcircuit name, if included,
indicates which subcircuit definition is being terminated; if omitted, all subcircuits being defined are
terminated. The name is needed only when nested subcircuit definitions are being made.

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Subcircuit Calls

General form:

XYYYYYYY N1 &ltN2; N3 ...> SUBNA

Examples:

X1 2 4 17 3 1 MULTI

Subcircuits are used in SPICE by specifying pseudo-elements beginning with the letter X, followed
by the circuit nodes to be used in expanding the subcircuit.

12.5.2.6 Title Line, Comment Lines and .end line

Title Line

Examples:

POWER AMPLIFIER CIRCUIT

TEST OF CAM CELL

The title line must be the first in the input file. Its contents are printed verbatim as the heading for
each section of output.

End line

Examples:

.END

The "End" line must always be the last in the input file. Note that the period is an integral part of the
name.

Comments

General Form:

* &ltany; comment>

Examples:

* RF=1K Gain should be 100 * Check open-loop gain and phase margin

The asterisk in the first column indicates that this line is a comment line. Comment lines may be
placed anywhere in the circuit description. Note that SPICE3 also considers any line with leading
white space to be a comment.

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12.5.3 Analysis and output Control

The following analyses are available:

DC or Small-Signal AC Sensitivity Analysis

DC Transfer Function
Distortion Analysis
Fourier Analysis
Initial Conditions
Noise Analysis
Operating Point Analysis
Pole-Zero Analysis
Small-Signal AC Analysis
Transfer Function Analysis
Transient Analysis

12.5.3.1 DC or Small-Signal AC Sensitivity Analysis

General form:

.SENS OUTVAR

.SENS OUTVAR AC DEC ND FSTART FSTOP

.SENS OUTVAR AC OCT NO FSTART FSTOP

.SENS OUTVAR AC LIN NP FSTART FSTOP

Examples:

.SENS V(1,OUT) .SENS V(OUT) AC DEC 10 100 100k .SENS I(VTEST)

The sensitivity of OUTVAR to all non-zero device parameters is calculated when the SENS analysis
is specified. OUTVAR is a circuit variable (node voltage or voltage-source branch current). The first
form calculates sensitivity of the DC operating-point value of OUTVAR. The second form calculates
sensitivity of the AC values of OUTVAR. The parameters listed for AC sensitivity are the same as in
an AC analysis (see ".AC" above). The output values are in dimensions of change in output per unit
change of input (as opposed to percent change in output or per percent change of input).

12.5.3.2 DC Transfer Function

General form:

.DC SRCNAM VSTART VSTOP VINCR [SRC2 START2 STOP2 INCR2]

Examples:

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.DC VIN 0.25 5.0 0.25 .DC VDS 0 10 .5 VGS 0 5 1 .DC VCE 0 10 .25 IB 0 10U 1U

The DC line defines the dc transfer curve source and sweep limits (again with capacitors open and
inductors shorted). SRCNAM is the name of an independent voltage or current source. VSTART,
VSTOP, and VINCR are the starting, final, and incrementing values respectively. The first example
causes the value of the voltage source VIN to be swept from 0.25 Volts to 5.0 Volts in increments
of 0.25 Volts. A second source (SRC2) may optionally be specified with associated sweep
parameters. In this case, the first source is swept over its range for each value of the second source.
This option can be useful for obtaining semiconductor device output characteristics. See the second
example circuit description in Appendix A.

12.5.3.3 Distortion Analysis

General form:

.DISTO DEC ND FSTART FSTOP &ltF2OVERF1;>

.DISTO OCT NO FSTART FSTOP &ltF2OVERF1;>

.DISTO LIN NP FSTART FSTOP &ltF2OVERF1;>

Examples:

.DISTO DEC 10 1kHz 100Mhz .DISTO DEC 10 1kHz 100Mhz 0.9

The Disto line does a small-signal distortion analysis of the circuit. A multi-dimensional Volterra
series analysis is done using multi-dimensional Taylor series to represent the nonlinearities at the
operating point. Terms of up to third order are used in the series expansions.

If the optional parameter F2OVERF1 is not specified, .DISTO does a harmonic analysis - i.e., it
analyses distortion in the circuit using only a single input frequency F1, which is swept as specified by
arguments of the .DISTO command exactly as in the .AC command. Inputs at this frequency may be
present at more than one input source, and their magnitudes and phases are specified by the
arguments of the DISTOF1 keyword in the input file lines for the input sources (see the description
for independent sources). (The arguments of the DISTOF2 keyword are not relevant in this case).
The analysis produces information about the A.C. values of all node voltages and branch currents at
the harmonic frequencies 2 F1 and 3 F1, vs. the input frequency F1 as it is swept. (A value of 1 (as
a complex distortion output) signifies cos( 2 (2 F1) t) at 2 F1 and cos (2 (3 F1) t ) at 3 F1, using the
convention that 1 at the input fundamental frequency is equivalent to cos( 2 F1 t ).) The distortion
component desired (2 F1 or 3 F1) can be selected using commands in nutmeg, and then printed or
plotted. (Normally, one is interested primarily in the magnitude of the harmonic components, so the
magnitude of the AC distortion value is looked at). It should be noted that these are the A.C. values
of the actual harmonic components, and are not equal to HD2 and HD3. To obtain HD2 and HD3,
one must divide by the corresponding A.C. values at F1, obtained from an .AC line. This division
can be done using nutmeg commands.

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If the optional F2OVERF1 parameter is specified, it should be a real number between (and not
equal to) 0.0 and 1.0; in this case, .DISTO does a spectral analysis. It considers the circuit with
sinusoidal inputs at two different frequencies F1 and F2. F1 is swept according to the .DISTO
control line options exactly as in the .AC control line. F2 is kept fixed at a single frequency as F1
sweeps - the value at which it is kept fixed is equal to F2OVERF1 times FSTART. Each
independent source in the circuit may potentially have two (superimposed) sinusoidal inputs for
distortion, at the frequencies F1 and F2. The magnitude and phase of the F1 component are
specified by the arguments of the DISTOF1 keyword in the source's input line (see the description
of independent sources); the magnitude and phase of the F2 component are specified by the
arguments of the DISTOF2 keyword. The analysis produces plots of all node voltages/branch
currents at the intermodulation product frequencies F1 + F2, F1 - F2, and (2 F1) - F2, vs the swept
frequency F1. The IM product of interest may be selected using the setplot command, and displayed
with the print and plot commands. It is to be noted as in the harmonic analysis case, the results are
the actual AC voltages and currents at the intermodulation frequencies, and need to be normalized
with respect to .AC values to obtain the IM parameters.

If the DISTOF1 or DISTOF2 keywords are missing from the description of an independent source,
then that source is assumed to have no input at the corresponding frequency. The default values of
the magnitude and phase are 1.0 and 0.0 respectively. The phase should be specified in degrees.

It should be carefully noted that the number F2OVERF1 should ideally be an irrational number, and
that since this is not possible in practice, efforts should be made to keep the denominator in its
fractional representation as large as possible, certainly above 3, for accurate results (i.e., if
F2OVERF1 is represented as a fraction A/B, where A and B are integers with no common factors,
B should be as large as possible; note that A < B because F2OVERF1 is constrained to be < 1). To
illustrate why, consider the cases where F2OVERF1 is 49/100 and 1/2. In a spectral analysis, the
outputs produced are at F1 + F2, F1 - F2 and 2 F1 - F2. In the latter case, F1 - F2 = F2, so the
result at the F1-F2 component is erroneous because there is the strong fundamental F2 component
at the same frequency. Also, F1 + F2 = 2 F1 - F2 in the latter case, and each result is erroneous
individually. This problem is not there in the case where F2OVERF1 = 49/100, because F1-F2 =
51/100 F1 < > 49/100 F1 = F2. In this case, there are two very closely spaced frequency
components at F2 and F1 - F2. One of the advantages of the Volterra series technique is that it
computes distortions at mix frequencies expressed symbolically (i.e. n F1 m F2), therefore one is
able to obtain the strengths of distortion components accurately even if the separation between them
is very small, as opposed to transient analysis for example. The disadvantage is of course that if two
of the mix frequencies coincide, the results are not merged together and presented (though this could
presumably be done as a postprocessing step). Currently, the interested user should keep track of
the mix frequencies himself or herself and add the distortions at coinciding mix frequencies together
should it be necessary.

12.5.3.4 Fourier Analysis

General form:

.FOUR FREQ OV1 <OV2 OV3 ...>

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Examples:

.FOUR 100K V(5)

The Four (or Fourier) line controls whether SPICE performs a Fourier analysis as a part of the
transient analysis. FREQ is the fundamental frequency, and OV1, ..., are the output variables for
which the analysis is desired. The Fourier analysis is performed over the interval &ltTSTOP-period;,
TSTOP>, where TSTOP is the final time specified for the transient analysis, and period is one
period of the fundamental frequency. The dc component and the first nine harmonics are determined.
For maximum accuracy, TMAX (see the .TRAN line) should be set to period/100.0 (or less for
very high-Q circuits).

12.5.3.5 Initial Conditions

.NODESET: Specify Initial Node Voltage Guesses

General form:

.NODESET V(NODNUM)=VAL V(NODNUM)=VAL ...

Examples:

.NODESET V(12)=4.5 V(4)=2.23

The Nodeset line helps the program find the dc or initial transient solution by making a preliminary
pass with the specified nodes held to the given voltages. The restriction is then released and the
iteration continues to the true solution. The .NODESET line may be necessary for convergence on
bistable or a-stable circuits. In general, this line should not be necessary.

.IC: Set Initial Conditions

General form: .IC V(NODNUM)=VAL V(NODNUM)=VAL ... Examples: .IC V(11)=5 V(4)=-5
V(2)=2.2

The IC line is for setting transient initial conditions. It has two different interpretations, depending on
whether the UIC parameter is specified on the .TRAN control line. Also, one should not confuse this
line with the .NODESET line. The .NODESET line is only to help dc convergence, and does not
affect final bias solution (except for multi-stable circuits). The two interpretations of this line are as
follows:

1. When the UIC parameter is specified on the .TRAN line, then the node voltages specified on the
.IC control line are used to compute the capacitor, diode, BJT, JFET, and MOSFET initial
conditions. This is equivalent to specifying the IC=... parameter on each device line, but is much
more convenient. The IC=... parameter can still be specified and takes precedence over the .IC
values. Since no dc bias (initial transient) solution is computed before the transient analysis, one
should take care to specify all dc source voltages on the .IC control line if they are to be used to
compute device initial conditions.

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2. When the UIC parameter is not specified on the .TRAN control line, the dc bias (initial transient)
solution is computed before the transient analysis. In this case, the node voltages specified on the .IC
control line is forced to the desired initial values during the bias solution. During transient analysis, the
constraint on these node voltages is removed. This is the preferred method since it allows SPICE to
compute a consistent dc solution.

12.5.3.6 Noise Analysis

General form:

.NOISE V(OUTPUT <,REF>) SRC ( DEC | LIN | OCT ) PTS FSTART FSTOP
<PTS_PER_SUMMARY>

Examples:

.NOISE V(5) VIN DEC 10 1kHZ 100Mhz .NOISE V(5,3) V1 OCT 8 1.0 1.0e6 1

The Noise line does a noise analysis of the circuit. OUTPUT is the node at which the total output
noise is desired; if REF is specified, then the noise voltage V(OUTPUT) - V(REF) is calculated. By
default, REF is assumed to be ground. SRC is the name of an independent source to which input
noise is referred. PTS, FSTART and FSTOP are .AC type parameters that specify the frequency
range over which plots are desired. PTS_PER_SUMMARY is an optional integer; if specified, the
noise contributions of each noise generator is produced every PTS_PER_SUMMARY frequency
points.

The .NOISE control line produces two plots - one for the Noise Spectral Density curves and one
for the total Integrated Noise over the specified frequency range. All noise voltages/currents are in
squared units V2/Hz and A2/Hz for spectral density, V2 and A2 for integrated noise).

12.5.3.7 Operating Point Analysis

General form:

.OP

The inclusion of this line in an input file directs SPICE to determine the dc operating point of the
circuit with inductors shorted and capacitors opened. Note: a DC analysis is automatically
performed prior to a transient analysis to determine the transient initial conditions, and prior to an
AC small-signal, Noise, and Pole-Zero analysis to determine the linearized, small-signal models for
nonlinear devices (see the KEEPOPINFO variable above).

12.5.3.8 PLOT Lines

General form:

.PLOT PLTYPE OV1 <(PLO1, PHI1)> <OV2 <(PLO2, PHI2)> ... OV8>

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Examples:

.PLOT DC V(4) V(5) V(1) .PLOT TRAN V(17, 5) (2, 5) I(VIN) V(17) (1, 9) .PLOT AC VM(5)
VM(31, 24) VDB(5) VP(5) .PLOT DISTO HD2 HD3(R) SIM2 .PLOT TRAN V(5, 3) V(4) (0,
5) V(7) (0, 10)

The Plot line defines the contents of one plot of from one to eight output variables. PLTYPE is the
type of analysis (DC, AC, TRAN, NOISE, or DISTO) for which the specified outputs are desired.
The syntax for the OVI is identical to that for the .PRINT line and for the plot command in the
interactive mode.

The overlap of two or more traces on any plot is indicated by the letter X.

When more than one output variable appears on the same plot, the first variable specified is printed
as well as plotted. If a printout of all variables is desired, then a companion .PRINT line should be
included.

There is no limit on the number of .PLOT lines specified for each type of analysis.

12.5.3.9 Pole-Zero Analysis

General form:

.PZ NODE1 NODE2 NODE3 NODE4 CUR POL

.PZ NODE1 NODE2 NODE3 NODE4 CUR ZER

.PZ NODE1 NODE2 NODE3 NODE4 CUR PZ

.PZ NODE1 NODE2 NODE3 NODE4 VOL POL

.PZ NODE1 NODE2 NODE3 NODE4 VOL ZER

.PZ NODE1 NODE2 NODE3 NODE4 VOL PZ

Examples:

.PZ 1 0 3 0 CUR POL .PZ 2 3 5 0 VOL ZER .PZ 4 1 4 1 CUR PZ

CUR stands for a transfer function of the type (output voltage)/(input current) while VOL stands for
a transfer function of the type (output voltage)/(input voltage). POL stands for pole analysis only,
ZER for zero analysis only and PZ for both. This feature is provided mainly because if there is a
nonconvergence in finding poles or zeros, then, at least the other can be found. Finally, NODE1 and
NODE2 are the two input nodes and NODE3 and NODE4 are the two output nodes. Thus, there is
complete freedom regarding the output and input ports and the type of transfer function.

In interactive mode, the command syntax is the same except that the first field is PZ instead of .PZ.
To print the results, one should use the command 'print all'.

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12.5.3.10 PRINT Lines

General form:

.PRINT PRTYPE OV1 <OV2 ... OV8>

Examples:

.PRINT TRAN V(4) I(VIN) .PRINT DC V(2) I(VSRC) V(23, 17) .PRINT AC VM(4, 2) VR(7)
VP(8, 3)

The Print line defines the contents of a tabular listing of one to eight output variables. PRTYPE is the
type of the analysis (DC, AC, TRAN, NOISE, or DISTO) for which the specified outputs are
desired. The form for voltage or current output variables is the same as given in the previous section
for the print command; Spice2 restricts the output variable to the following forms (though this
restriction is not enforced by Spice3):

V(N1<,N2>)

specifies the voltage difference between nodes N1 and N2. If N2 (and the preceding comma) is
omitted, ground (0) is assumed. See the print command in the previous section for more details. For
compatibility with spice2, the following five additional values can be accessed for the ac analysis by
replacing the "V" in V(N1,N2) with:

VR - real part

VI - imaginary part

VM - magnitude

VP - phase

VDB - 20 log10(magnitude)

I(VXXXXXXX) specifies the current flowing in the independent voltage source named
VXXXXXXX. Positive current flows from the positive node, through the source, to the negative
node. For the ac analysis, the corresponding replacements for the letter I may be made in the same
way as described for voltage outputs.Output variables for the noise and distortion analyses have a
different general form from that of the other analyses.

There is no limit on the number of .PRINT lines for each type of analysis.

12.5.3.11 SAVE Lines

General form:

.SAVE vector vector vector ...

Examples:

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.SAVE i(vin) input output .SAVE @m1[id]

The vectors listed on the .SAVE line are recorded in the rawfile for use later with spice3 or nutmeg
(nutmeg is just the data-analysis half of spice3, without the ability to simulate). The standard vector
names are accepted. If no .SAVE line is given, then the default set of vectors are saved (node
voltages and voltage source branch currents). If .SAVE lines are given, only those vectors specified
are saved. For more discussion on internal device data, see Appendix B. See also the section on the
interactive command interpretor for information on how to use the rawfile.

12.5.3.12 Analysis Options

The Analysis Options dialog box is shown below.

Select the option to change by clicking the left mouse button over the option name.

For full details on the options see Simulator variables.

Reset to default. Click to set the options back to the SPICE defaults.

Use default value. Click to use the default value. Unclick to change the value.

OK. Click to accept your changes.

Cancel. Cancel your changes.

Help. Display this help topic.

12.5.3.13 Simulator Variables

SIMULATOR VARIABLES (.OPTIONS)

Various parameters of the simulations available in Spice3 can be altered to control the accuracy,
speed, or default values for some devices. These parameters may be changed via the "set" command
(described later in the section on the interactive front-end) or via the ".OPTIONS" line:

General form:

.OPTIONS OPT1 OPT2 ... (or OPT=OPTVAL ...)

Examples:

.OPTIONS RELTOL=.005 TRTOL=8

The options line allows the user to reset program control and user options for specific simulation
purposes. Additional options for Nutmeg may be specified as well and take effect when Nutmeg
reads the input file. Options specified to Nutmeg via the 'set' command are also passed on to
SPICE3 as if specified on a .OPTIONS line. See the following section on the interactive command
interpreter for the parameters which may be set with a .OPTIONS line and the format of the 'set'

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'command. Any combination of the following options may be included, in any order. 'x' (below)
represents some positive number.

Option Effect

ABSTOL=x resets the absolute current error tolerance of the program. The default
value is 1 picoamp.

BADMOS3 Use the older version of the MOS3 model with the "kappa"
discontinuity.

CHGTOL=x resets the charge tolerance of the program. The default value is 1.0e-14.

DEFAD=x resets the charge tolerance of the program. The default value is 1.0e-14.

DEFAS=x resets the value for MOS source diffusion area; the default is 0.0.

DEFL=x resets the value for MOS source diffusion area; the default is 0.0.

DEFW=x resets the value for MOS channel width; the default is 100.0 micrometer

GMIN=x resets the value of GMIN, the minimum conductance allowed by the
program. The default value is 1.0e-12.

ITL1=x resets the dc iteration limit. The default is 100.

ITL2=x resets the dc transfer curve iteration limit. The default is 50.

ITL3=x resets the lower transient analysis iteration limit. the default value is 4.
(Note: not implemented in Spice3).

ITL4=x resets the transient analysis timepoint iteration limit. the default is 10.

ITL5=x resets the transient analysis total iteration limit. the default is 5000. Set
ITL5=0 to omit this test. (Note: not implemented in Spice3).

KEEPOPINFO Retain the operating point information when either an AC, Distortion, or
Pole-Zero analysis is run. This is particularly useful if the circuit is large
and you do not want to run a (redundant) ".OP" analysis.

METHOD=name resets the numerical integration method used by SPICE. Possible names
are "Gear" or "trapezoidal" (or just "trap"). The default is trapezoidal.

PIVREL=x resets the relative ratio between the largest column entry and an
acceptable pivot value. The default value is 1.0e-3. In the numerical
pivoting algorithm the allowed minimum pivot value is determined by
EPSREL=AMAX1(PIVREL*MAXVAL, PIVTOL) where MAXVAL
is the maximum element in the column where a pivot is sought (partial

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pivoting).

PIVTOL=x resets the absolute minimum value for a matrix entry to be accepted as a
pivot. The default value is 1.0e-13.

RELTOL=x resets the relative error tolerance of the program. The default value is
0.001 (0.1%).

TEMP=x Resets the operating temperature of the circuit. The default value is 27
deg C (300 deg K). TEMP can be overridden by a temperature
specification on any temperature dependent instance.

TNOM=x resets the nominal temperature at which device parameters are

measured. The default value is 27 deg C (300 deg K). TNOM can be
overridden by a specification on any temperature dependent device
model.

TRTOL=x resets the transient error tolerance. The default value is 7.0. This
parameter is an estimate of the factor by which SPICE overestimates the
actual truncation error.

TRYTOCOMPAC Applicable only to the LTRA model. When specified, the simulator tries
T to condense LTRA transmission lines' past history of input voltages and
currents.

VNTOL=x resets the absolute voltage error tolerance of the program. The default
value is 1 microvolt.

In addition, the following options have the listed effect when operating in spice2 emulation mode:

Option Effect

ACCT causes accounting and run time statistics to

be printed

LIST causes the summary listing of the input data

to be printed

NOM suppresses the printout of the model

OD parameters

NOPA suppresses page ejects

GE

NODE causes the printing of the node table.

OPTS causes the option values to be printed.

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12.5.3.14 Small-Signal AC Analysis

General form:

.AC DEC ND FSTART FSTOP

.AC OCT NO FSTART FSTOP

.AC LIN NP FSTART FSTOP

Examples:

.AC DEC 10 1 10K .AC DEC 10 1K 100MEG .AC LIN 100 1 100HZ

DEC stands for decade variation, and ND is the number of points per decade. OCT stands for
octave variation, and NO is the number of points per octave. LIN stands for linear variation, and
NP is the number of points. FSTART is the starting frequency, and FSTOP is the final frequency. If
this line is included in the input file, SPICE Simulation Program for Integrated Circuit Emulation.
performs an AC analysis of the circuit over the specified frequency range. Note that in order for this
analysis to be meaningful, at least one independent source must have been specified with an ac
value.

12.5.3.15 Transfer Function Analysis

General form:

.TF OUTVAR INSRC

Examples:

.TF V(5, 3) VIN .TF I(VLOAD) VIN

The TF line defines the small-signal output and input for the dc small-signal analysis. OUTVAR is the
small-signal output variable and INSRC is the small-signal input source. If this line is included,
SPICE computes the dc small-signal value of the transfer function (output/input), input resistance,
and output resistance. For the first example, SPICE would compute the ratio of V(5, 3) to VIN, the
small

12.5.3.16 Transient Analysis

General form:

.TRAN TSTEP TSTOP &ltTSTART; &ltTMAX;>>

Examples:

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.TRAN 1NS 100NS .TRAN 1NS 1000NS 500NS .TRAN 10NS 1US

TSTEP is the printing or plotting increment for line-printer output. For use with the post-processor,
TSTEP is the suggested computing increment. TSTOP is the final time, and TSTART is the initial
time. If TSTART is omitted, it is assumed to be zero. The transient analysis always begins at time
zero. In the interval &ltzero;, TSTART>, the circuit is analyzed (to reach a steady state), but no
outputs are stored. In the interval &ltTSTART;, TSTOP>, the circuit is analyzed and outputs are
stored. TMAX is the maximum stepsize that SPICE uses; for default, the program chooses either
TSTEP or (TSTOP-TSTART)/50.0, whichever is smaller. TMAX is useful when one wishes to
guarantee a computing interval which is smaller than the printer increment, TSTEP.

UIC (use initial conditions) is an optional keyword which indicates that the user does not want
SPICE to solve for the quiescent operating point before beginning the transient analysis. If this
keyword is specified, SPICE uses the values specified using IC=... on the various elements as the
initial transient condition and proceeds with the analysis. If the .IC control line has been specified,
then the node voltages on the .IC line are used to compute the initial conditions for the devices.
Look at the description on the .IC control line for its interpretation when UIC is not specified.

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13 The PCB
Enter topic text here.

13.1 Viewing the PCB

Enter topic text here.

13.2 Viewing the PCB in 3D

Enter topic text here.

13.3 The PCB Border

Enter topic text here.

13.3.1 Setting the PCB Border

Enter topic text here.

13.3.2 Editing the PCB Border

Enter topic text here.

13.4 PCB Layers

Enter topic text here.

13.4.1 Editing the PCB Layers

Enter topic text here.

13.5 Pads
Enter topic text here.

13.5.1 Adding Pads

Enter topic text here.

13.5.2 Editing Pads

Enter topic text here.

13.6 Nets
A net connects two or more pads on a pcb. The connections are made using tracks, so a net appears
as one of more tracks.

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13.6.1 Adding Nets

To add a net to a pcb:

1. Click on the Add/Add Net button in the menu.

2. Move the mouse so it is over a pad, via or track and the cursor will turn to a green tick.
3. Click the left mouse button when you see the green tick to start a net.
4. Now move the mouse. As you move it a yellow line will be drawn from the source pad, via or track.
5. When the cursor goes over a valid end point for the net, the cursor will turn into a green tick.
6. Click the left mouse button when you see the cursor turn to green tick. The net will then optimize
itself.

13.6.2 Editing Nets

Enter topic text here.

13.7 Tracks
A track is a section of a net that is on a single layer. It starts and ends on a pad, a via or a track
junction. A track junction is where 3 or more tracks that are all on the same layer meet.
A track consists of one or more straight segments.

13.7.1 Changing a track segments layer index

To change the layer for a track segment first select it by clicking the left mouse button over it and then
either press either the Space key or press a number key.

Obviously it is not possible the change the track segment's layer for single sided pcbs.

Pressing the space key will send the current track segment backwards in the pcb layers. However if the
track segment is on the bottom layer, then it will be cycled round to the top layer. For a 2 sided board
pressing the space key appears to swap a track segment to the other side of the board.

When a layer segment is swapped, vias and/or track junctions will be added and/or removed as required.

Pressing a number key will move the selected track segment to the layer defined by the number
entered or the to bottom layer if the number is greater than the number of electrical layers on the pcb.
e,g, pressing '1' moves the selected track segment to the top layer while pressing '2' moved it to the
second layer, in the case of a 2 layered pcb, to the bottom of the pcb.

Pressing 't' or 'T' moves the track segment to the top layer

Pressing 'b' or ''B' moves the track segment to the top layer.

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13.8 Routing
There are two different methods whereby you can route the tracks on your pcb.

Manual Routing
Automatic Routing

13.8.1 Manual Routing

To manually route your pcb first double click the left mouse button on a pcb track.
Now as you mouse the mouse button

13.8.2 Automatic Routing

DEX has 2 PCB router.

The Internal Autorouter

The Electra Autorouter

13.8.2.1 The Electra Autorouter

ELECTRA is a third party shape based PCB router that works well with DEX.

It is a new generation of Shape-Based Autorouting software for PC boards. ELECTRA uses a multi-pass
cost-based conflict reduction algorithm to find a routing solution adapting to the natural flow of the nets.
Adaptive routing algorithm is the only proven approach to reach high completion rate. ELECTRA gives
immediate feedback on the routing progress and conflict reduction rate.

DEX, by default, does not come with a valid license. You will need to purchase a seperate ELECTRA
license. Find out more...

ELECTRA uses industry standard format by reading design file (DSN). Routing results are saved into
standard route file format (RTE) or session file (SES).

Click to View the DSN Specification

Typical board routed w ith ELECTRA

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13.8.2.2 The Internal Autorouter

Enter topic text here.

13.8.3 Keepout Regions

Keep-out regions regions are areas of a PCB that must remain free of electrical tracks. You define
these by adding keep-pout regions to your board on the layer you wish to restict.

13.8.3.1 Adding Keepout Regions

Enter topic text here.

13.8.3.2 Editing Keepout Regions

Enter topic text here.

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13.8.4 Router Settings

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13.9 Adding Cutouts

Enter topic text here.

13.10 Copper Pour Regions

Enter topic text here.

13.10.1 Adding Copper Pour Regions

Enter topic text here.

13.10.2 Editing Copper Pour Regions

Enter topic text here.

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13.10.3 Copper Pour Settings

13.11 Drill holes

Enter topic text here.

13.11.1 Adding Drill holes

Enter topic text here.

13.11.2 Editing Drill holes

Enter topic text here.

13.12 Checking Your PCB Design

Enter topic text here.

13.13 3D
Enter topic text here.

13.13.1 Adding 3D objects

Enter topic text here.

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14 Printing and Plotting

Enter topic text here.

14.1 Printing
Enter topic text here.

14.2 Plottings
Enter topic text here.

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15 Manufacturing Your PCB

Enter topic text here.

15.1 Plotting Your PCBs

Enter topic text here.

15.2 Previewing Your Gerber Files

Enter topic text here.

15.3 Generating Gerber Files

Enter topic text here.

15.4 Generating Drill Files

Enter topic text here.

15.5 Your Bill of Materials

Enter topic text here.

15.6 Putting It All Together in a Zip File

Enter topic text here.

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15.7 Manufacturing Settings

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 Manufacturing Your PCB 235

15.7.1 DesignRules

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16 Getting Support

There are several ways to get help.

The first obviously place for help is this help file which is available by clicking on from the
Home ribbon page.

Next you can use the Support sites.

You can also send Feeback or use the Wish List site.

16.1 Tutorial Videos

Enter topic text here.

16.1.1 YouTube
Enter topic text here.

16.2 Getting Daily Tips

DEX has a helpful 'Tip of the Day' dialog that you can view on demand or optionally have appear
every time you startup DEX.

To display the 'tip of the day' dialog use the Home ribbom menu.

The dialog is shown below and contains handy tips on using DEX.

Show the next 'tip of the day'.

Show the previous 'tip of the day'.

Display this help topic.

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Close the 'tip of the day' dialog.

If checked, then the 'tip of the day' will be displayed everytime DEX starts
otherwise you will need to use the Home ribbon menu to manually show it.

16.3 Using The Help System

Index

Search

16.4 Getting a Printed Manual

Enter topic text here.

16.5 Find Out About Your Version

The build version is displayed towards the top right of the dialog. In this case DEX was built on the
3rd. February, 2012 at 9.45 GMT.

Below it is the build version.

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View Installation Directory - this displays the file location where DEX has been installed. This
included the program itself and all supporting assemblies together with this help file.

View Data Directory - this is where the local database of parts is stored.

Clicking on OK closes the dialog box and clicking on the Help button shows this help topic.

16.6 What's New

Enter topic text here.

16.7 Getting the Latest Version

Enter topic text here.

16.8 Subscribing to the NewsLetter

Enter topic text here.

16.9 Reporting Problems

Enter topic text here.

16.10 The User Group

In addition DEX has a strong user group of over 2700 users. Here you can discuss topics relating to
DEX. Please go to the Yahoo user group for more information.

16.11 Adding to Your Wishlist

If you have a useful feature you would like to have in DEX then please select WishList from
the Home ribbon menu. This will take you to the AutoTRAX Software WishList web page.

16.12 Sending Feedback

If you wish to send feedback to AutoTRAX Software send please click on in the

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Home ribbon menu.

16.13 The AutoTRAX Website

You can visit the AutoTRAX Software website at http://www.kov.com.

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17 Importing Files
Enter topic text here.

17.1 Importing Your AutoTRAX EDA Designs

Enter topic text here.

17.2 Importing Your AutoTRAX EDA Library

Enter topic text here.

17.3 Importing AutoCAD DXF Files

Enter topic text here.

17.4 Importing KiCAD Files

Enter topic text here.

17.5 Importing Eagle Files

Enter topic text here.

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18 Exporting Data
Enter topic text here.

18.1 Creating a CNC File

Enter topic text here.

18.2 Creating a PDF File

Enter topic text here.

18.3 Creating a IDF File

Enter topic text here.

18.4 Creating a SVG File

Enter topic text here.

18.5 Creating a Spice Deck File

Enter topic text here.

18.6 Creating a Net List File

Enter topic text here.

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19 Bonus Programs
DEX comes with the following free bonus programs.

The Calendar Program

The Text Editor

19.1 The Calendar Program

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19.2 The Text Editor

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20 The DEX File Format

The DEX xml schema is available at http://www.kov.com/XmlSchemas/Dex.xsd.

To see the complete documentation on the DEX xml format please go to http://www.kov.com/xml/

You can view the DEX xml for a design using the Source View panel.

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21 The Software License

Licence Agreement
THIS AUTOTRAX SOFTWARE LICENSE AGREEMENT ("LICENSE AGREEMENT") IS A
LEGAL AGREEMENT BETWEEN YOU AND AUTOTRAX SOFTWARE, FOR THE
SOFTWARE PRODUCT. BY USING THE SOFTWARE PRODUCT, YOU ARE AGREEING
UNCONDITIONALLY TO BE BOUND BY THE TERMS OF THIS LICENSE
AGREEMENT, EVEN IF THIS LICENSE AGREEMENT IS DEEMED A MODIFICATION
OF ANY PREVIOUS ARRANGEMENT OR CONTRACT. IF YOU DO NOT AGREE TO
THE TERMS OF THIS LICENSE AGREEMENT, DO NOT USE THE SOFTWARE
PRODUCT. INSTEAD, YOU MAY RETURN THE SOFTWARE PRODUCT TO THE PLACE
YOU OBTAINED IT FOR A FULL REFUND (IF APPLICABLE).

Software Product License

The Software Product is protected by copyright laws and international copyright treaties, as well as
other intellectual property laws and treaties. The Software Product is licensed, not sold.

For purposes of this License Agreement, "Software Product" refers to the computer software and
associated media, printed materials, and "online" or electronic documentation, including without
limitation any and all executable files, add-ons, stencils, templates, databases, tutorials, help files and
other files, that accompany the AutoTRAX Software product identified above or in the
accompanying documentation; "Use" means storing, loading (whether into temporary memory (i.e.,
RAM) or into permanent memory (e.g., hard disk, CD-ROM or other storage device)), installing,
executing or displaying the Software Product; and "You" means the company, entity or individual
whose funds are used to pay the license fee or who has otherwise acquired the Software Product.

1. Grant of License

Software Product. AutoTRAX Software grants You the non-exclusive, non-sublicensable, limited
license to Use one copy of the Software Product on a single computer, subject to the terms and
conditions of this License Agreement.

Second Copy. The primary user of a computer on which a copy of the Software Product is installed
may make a second copy for his or her exclusive Use on either a home or portable computer, but
not both.

Storage/Network Use. You may also store or install a copy of the Software Product on a storage
device, such as a network server, for the purpose of Using the Software Product on Your
computers only over an internal network; however, You must acquire and dedicate a license for
each separate computer on which the Software Product is Used from the storage device. A license

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for the Software Product may not be shared or Used concurrently on different computers. You shall
inform all users of the Software Product of the terms and conditions of this License Agreement.

License Pack. If You have acquired this License Agreement in a AutoTRAX Software License
Pack, You may make the number of additional copies of the computer software portion of the
Software Product authorized on the printed copy of this License Agreement, and You may Use each
copy only in the manner specified in this License Agreement. You are also entitled to make a
corresponding number of second copies for home or portable computer Use only in the manner
specified in this License Agreement.

2. Ownership

Title, ownership rights and intellectual property rights in and to the Software Product shall remain in
AutoTRAX Software and its suppliers and are protected by US and international copyright laws and
international copyright treaties, as well as other intellectual property laws and treaties. The Software
Product is licensed, not sold. There is no transfer to You of any title to or ownership of the Software
Product and the license granted under this License Agreement should not be construed as a sale of
any right in the Software Product. You must treat the Software Product like any other copyrighted
materials (e.g., a book or musical recording) except that You may make one copy of the Software
Product solely for backup or archival purposes (with the inclusion of all copyright and other
proprietary notices), only as long as You otherwise comply with the terms and conditions of this
License Agreement. You may not make additional copies of the Software Product. You may not
copy the printed materials accompanying the Software Product. All rights not specifically granted
under this License Agreement are reserved by AutoTRAX Software.

3. Description of Other Rights and Limitations

Limitations on Reverse-Engineering, Decompilation and Disassembly; Other Restrictions. You

acknowledge that the Software Product in source code form remains a confidential trade secret of
AutoTRAX Software and therefore You agree not to reverse-engineer, decompile or disassemble
the Software Product, or make any attempt to discover the source code to the Software Product,
except and only to the extent that such activity is expressly permitted by applicable law
notwithstanding this limitation. Except as expressly permitted in this License Agreement, the
Software Product may not be Used, copied, translated, redistributed, retransmitted, published, sold,
rented, leased, marketed, sublicensed, pledged, assigned, disposed of, encumbered, transferred,
altered, modified or enhanced, whether in whole or in part, nor may You create derivative works
from or based on the Software Product. You may not remove any proprietary notices, marks or
labels from the Software Product.

Separation of Components. The Software Product is licensed as a single product and its component
parts may not be separated for Use on more than one computer.

Transfer of Software Product. You may transfer all Your rights under this License Agreement on a
permanent basis only, provided You retain no copies, You transfer the License Agreement, the

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corresponding serial number (if applicable) and all the Software Product (including without limitation
all component parts, media and printed materials, and any upgrades) and the recipient agrees to all
the terms and conditions of this License Agreement. If the Software Product is an upgrade product,
any transfer must include the latest release, all prior versions and any prior products used to obtain
the Software Product.

Termination. This License Agreement is in effect until terminated. You may terminate it at any time
by destroying the Software Product and all copies You have made. Unauthorized copying or
duplication of the Software Product will result in automatic termination of this License Agreement.
Without prejudice to any other rights, AutoTRAX Software may terminate this License Agreement if
You fail to comply with any term or condition of this License Agreement. Upon termination of this
License Agreement, You agree to destroy the Software Product and all copies You have made.

Academic Software Product. If the Software Product is identified as "Academic", You must be a
Qualified Educational User (as defined by AutoTRAX Software) to Use the Software Product. If
You are not a Qualified Educational User, You have no rights under this License Agreement. To
determine whether You are a Qualified Educational User, please contact AutoTRAX Software -
Academic Sales at the applicable address set forth below.

Not For Resale ("NFR") Software Product. If the Software Product is identified as "Not For
Resale" or "NFR", then, notwithstanding any other terms and conditions of this License Agreement,
You may not, for value or other consideration, distribute, resell, dispose of, or transfer the Software
Product.

Support Services. AutoTRAX Software may provide You with customer and technical support
services related to the Software Product ("Support Services"). Use of Support Services is governed
by the AutoTRAX Software policies and programs described in the user manual, in "online" or
electronic documentation, and/or in other AutoTRAX Software-provided materials. Any
supplemental software code provided to You as part of the Support Services shall be considered
part of the Software Product and subject to the terms and conditions of this License Agreement.
With respect to any technical information You provide to AutoTRAX Software as part of the
Support Services, AutoTRAX Software may use such information for its business purposes,
including product support and development. AutoTRAX Software will not utilize such technical
information in a manner that personally identifies You.

4. Upgrades

If the Software Product is identified as an "upgrade", You must be properly licensed to Use a
product, whether from AutoTRAX Software or another supplier, that is specified by AutoTRAX
Software as being eligible for the upgrade in order to Use the Software Product. A Software
Product identified as an upgrade replaces or supplements the product that formed the basis for Your
eligibility for the upgrade. Notwithstanding any other terms and conditions of this License
Agreement, You may transfer the Software Product only in conjunction with the product that formed
the basis for Your eligibility for the upgrade, unless You destroy such product. If the Software

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Product is an upgrade from a component of a package of software programs which You licensed as
a single product, the Software Product may be Used or transferred only as part of that single
product package and may not be separated for Use on more than one computer.

5. Dual-Media Software

You may receive the Software Product in more than one medium; for example, in disk media, on a
CD-ROM or in both media. Regardless of the type or size of medium You receive, You may Use
only one medium that is appropriate for Your computer. You may not Use the other medium on
another computer. You may not distribute, transmit, sell, loan, rent, lease or otherwise transfer the
other medium to another user, except as part of the permanent transfer of the Software Product
pursuant to the terms and conditions of this License Agreement.

6. Reports and Audit Rights

You shall institute reasonable measures to ensure compliance with the terms and conditions of this
License Agreement. Upon AutoTRAX Software's reasonable request, You agree to provide reports
relating to Your Use of the Software Product as necessary to demonstrate Your compliance with the
terms and conditions of this License Agreement. You further agree that AutoTRAX Software has
the right, upon reasonable prior notice, to audit Your records and inspect Your facilities to verify
Your compliance with the terms and conditions of this License Agreement.

7. US Government Restricted Rights

The Software Product and documentation are provided with RESTRICTED RIGHTS. Use,
duplication or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)
(1)(ii) of The Rights in Technical Data and Computer Software clause at DFARS 252.227-7013 or
subparagraphs (c)(1) and (2) of the Commercial Computer Software-Restricted Rights at 48 CFR
52.227-19, as applicable. The contractor/manufacturer is AutoTRAX Software, AutoTRAX
Software. Fair Oak, Skeath Lane, Sandon Bank, Stafford ST18 9TD, England.

8. Export Restrictions

You may not export or reexport the Software Product or any underlying information or technology
except in full compliance with all United States and other applicable laws and regulations. In
particular, but without limitation, none of the Software Product or underlying information or
technology may be exported or reexported (a) into (or to a national or resident of) Cuba, Haiti, Iran,
Iraq, Libya, Serbia, Montenegro, North Korea, Sudan or Syria or (b) to anyone on the US
Treasury Department's list of Specially Designated Nationals or the US Commerce Department's
Table of Deny Orders, as such countries, lists and orders may be amended or modified from time to
time. By Using the Software Product, You are specifically agreeing to the foregoing and You are
representing and warranting that You are not located in, under the control of, or a national or
resident of any such country or on any such list.

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9. Entire Agreement; Governing Law

This License Agreement constitutes the entire agreement between AutoTRAX Software and You
with regard to the subject matter hereof and supersedes any and all prior agreements,
understandings and representations, whether written or oral, concerning the subject matter of this
License Agreement. This License Agreement shall not be modify except by a written agreement
executed by a duly authorized representative of each of AutoTRAX Software and You.

Nothing in this License Agreement is intended to exclude, modify or restrict the operation of any
applicable statute or other law, the provisions of which cannot lawfully be excluded, modified or
restricted. If any court of competent jurisdiction determines that a provision of this License
Agreement is illegal, invalid or unenforceable in any jurisdiction, then such provision shall be deemed
modified to the minimum extent necessary to make it comply with the applicable statute or law of
such jurisdiction, and the remaining provisions of this License Agreement shall continue in full force
and effect. Any such modification shall not effect any provisions of this License Agreement in any
other jurisdiction where this License Agreement governs the Use of the Software Product.

If You acquired the Software Product in Canada, You agree to the following: Each of AutoTRAX
Software and You hereby confirm, desire and agree that this License Agreement has been and shall
be written solely in the English Language.

IF YOU ACQUIRED THE SOFTWARE PRODUCT IN THE UNITED STATES, THIS

LICENSE AGREEMENT IS GOVERNED BY THE LAWS OF THE STATE OF
WASHINGTON, USA, EXCEPT FOR THAT BODY OF LAW DEALING WITH
CONFLICTS OF LAW, WITHOUT REFERENCE TO THE 1980 UNITED NATIONS
CONVENTION ON THE INTERNATIONAL SALE OF GOODS.

IF YOU ACQUIRED THE SOFTWARE PRODUCT OUTSIDE THE UNITED STATES, THIS
LICENSE AGREEMENT IS GOVERNED BY THE LAWS OF THE REPUBLIC OF
IRELAND.

Software Product Limited Warranty

To the original customer only, AutoTRAX Software provides the following warranties:

Limited Warranty. AUTOTRAX SOFTWARE WARRANTS THAT (a) FOR A PERIOD OF

SIXTY (60) DAYS FROM THE DATE OF ORIGINAL PURCHASE ("WARRANTY
PERIOD") AS EVIDENCED BY YOUR RECEIPT OR OTHER PROOF OF PURCHASE (i)
THE SOFTWARE PRODUCT, UNLESS MODIFIED OR OTHERWISE ALTERED BY YOU,
WILL PERFORM SUBSTANTIALLY IN ACCORDANCE WITH THE ACCOMPANYING
WRITTEN MATERIALS, AND (ii) THE MEDIA ON WHICH THE SOFTWARE PRODUCT
IS FURNISHED WILL BE FREE FROM DEFECTS IN MATERIALS AND
WORKMANSHIP UNDER NORMAL USE; AND (b) ANY SUPPORT SERVICES
PROVIDED BY AUTOTRAX SOFTWARE SHALL BE SUBSTANTIALLY AS DESCRIBED

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 The Software License 259

IN APPLICABLE WRITTEN MATERIALS PROVIDED TO YOU BY AUTOTRAX

SOFTWARE. AutoTRAX Software does not warrant that the Software Product will meet Your
requirements or that Use of the Software Product will be uninterrupted or error-free. AutoTRAX
Software is not responsible for problems caused by changes in the operating characteristics of
computer hardware or computer operating systems which are made after the release of the Software
Product, nor for problems in the interaction of the Software Product with non-AutoTRAX Software
software products. Some jurisdictions do not allow limitations on duration of an implied warranty, so
the above limitation may not apply to You. The Limited Warranty gives You specific legal rights.
You may have others, which vary by jurisdiction.

Exclusive Remedy. AutoTRAX Software's entire liability, and Your exclusive remedy, shall be, at
AutoTRAX Software's option, either (a) replacement of the defective media, (b) repair or
replacement of the Software Product that does not meet AutoTRAX Software's Limited Warranty,
or (c) return of the price paid, if any, and termination of this License Agreement. This remedy is
subject to return of the Software Product to AutoTRAX Software with a copy of Your receipt
within the Warranty Period or, solely for Software Product that was obtained electronically via
"electronic software distribution", to delivery to AutoTRAX Software of a AutoTRAX Software-
approved "certification of destruction" together with proof of purchase within the Warranty Period.
This Limited Warranty is void if failure of the Software Product has resulted from accident, abuse or
misapplication. Any replacement Software Product will be warranted for the remainder of the
original warranty period or thirty (30) days, whichever is longer. Outside of the United States,
neither these remedies nor any Support Services are available without proof of purchase from an
authorized source.

No Other Warranties. THE ABOVE WARRANTIES ARE EXCLUSIVE. TO THE MAXIMUM

EXTENT PERMITTED BY APPLICABLE LAW, AUTOTRAX SOFTWARE AND ITS
SUPPLIERS DISCLAIM ALL OTHER WARRANTIES AND CONDITIONS, EITHER
EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND NON-
INFRINGEMENT, AND THOSE ARISING OUT OF USAGE OF TRADE OR COURSE OF
DEALING, CONCERNING THE SOFTWARE PRODUCT, AND THE PROVISION OF OR
FAILURE TO PROVIDE SUPPORT SERVICES. NO ORAL OR WRITTEN INFORMATION
OR ADVICE GIVEN BY AUTOTRAX SOFTWARE, ITS AGENTS, DEALERS,
DISTRIBUTORS OR EMPLOYEES SHALL INCREASE THE SCOPE OF THE ABOVE
WARRANTIES OR CREATE ANY OTHER WARRANTIES.

No Liability for Damages. REGARDLESS OF WHETHER ANY REMEDY SET FORTH

HEREIN FAILS OF ITS ESSENTIAL PURPOSE, TO THE MAXIMUM EXTENT
PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL AUTOTRAX SOFTWARE
OR ITS SUPPLIERS (OR THEIR RESPECTIVE AGENTS, DIRECTORS, EMPLOYEES OR
REPRESENTATIVES) BE LIABLE FOR ANY DAMAGES WHATSOEVER (INCLUDING,
WITHOUT LIMITATION, CONSEQUENTIAL, INCIDENTAL, INDIRECT, SPECIAL,
ECONOMIC, PUNITIVE OR SIMILAR DAMAGES, OR DAMAGES FOR LOSS OF
BUSINESS PROFITS, LOSS OF GOODWILL, BUSINESS INTERRUPTION, COMPUTER

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260 AutoTRAX Design Express

FAILURE OR MALFUNCTION, LOSS OF BUSINESS INFORMATION OR ANY AND

ALL OTHER COMMERCIAL OR PECUNIARY DAMAGES OR LOSSES) ARISING OUT
OF THE USE OF OR INABILITY TO USE THE SOFTWARE PRODUCT OR THE
PROVISION OF OR FAILURE TO PROVIDE SUPPORT SERVICES, HOWEVER CAUSED
AND ON ANY LEGAL THEORY OF LIABILITY (WHETHER IN TORT, CONTRACT OR
OTHERWISE), EVEN IF AUTOTRAX SOFTWARE HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES, OR FOR ANY CLAIM BY ANY OTHER PARTY.
YOU ACKNOWLEDGE THAT THE LICENSE FEE REFLECTS THIS ALLOCATION OF
RISK. In any event, if any statute implies warranties or conditions not stated in this License
Agreement, AutoTRAX Software's entire liability under any provision of this License Agreement
shall be limited to the greater of the amount actually paid by You to license the Software Product
and Five United States Dollars (US$5.00), or, in the case of Support Services, providing such
Support Services again or refunding the cost thereof. Because some jurisdictions do not allow the
exclusion or limitation of liability for consequential or incidental damages, the above limitation may
not apply to You.

Copyright 1999-2011 AutoTRAX Software.

All Rights Reserved.

2633 Lincoln Blvd., #310, Santa Monica, California 90405, USA

2013 AutoTRAX Software

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XXII
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22 Refund Policy

The products available for purchase on our web site are downloadable, fully-functional, and try-
before-you-buy. We provide free trial periods to let you fully evaluate our products before you
make a purchase decision.

Please use the trial period to make sure that the software meets your needs before purchasing a
license. All of our software is fully-functional during the trial period. None of our software requires
registration to enable its primary functionality.

If you purchase one of our products, after your payment has cleared you will receive an email with
the purchase code to activate the software. Once this information is emailed to you, no refunds will
be given. We have this policy since it would be impossible for you to return your registered version
of our software.

During your trial period, our support staff is available to assist in installation and configuration via the
web site kov.com. We strongly recommend that all customers download, install, and test the trial
version of any product prior to making a purchase.

In rare instances and only within 30 days of purchase, if due to technical difficulties or platform
incompatibilities the software will not function, we may, at our discretion, issue a refund. In such
instances, we require that you provide enough information for us to positively identify your purchase
transaction (e.g., order number, your company name, date of transaction, purchase code, number of
licenses purchased, etc.). If we are able to positively identify your order, and if your request is made
within 30 days of purchase, you must submit to us a letter of destruction of software on your
company letterhead before we will process the refund. AutoTRAX Software is not responsible for
lost, delayed, or misdirected mail or email, delays for downloading, or other communication system
delays.

Acceptance of this Refund Policy

It is your responsibility to familiarize yourself with this refund policy. By placing an order for any of
our products, you indicate that you have read this refund policy and that you agree with and fully
accept the terms of this refund policy.

If you do not agree with or fully accept the terms of this refund policy, we ask that you do not place
an order with us.

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Endnotes 2... (after index)

2013 AutoTRAX Software