Specification for Approval

(Tentative 3.0)

Part No. : LYG1006

Comments

LUXPIA Co., Ltd.

Designed by Checked by Approved by Approved by Approved by Approved by

5/14 5/14 5/14 / / /

Date : . . . Date : . . .
LUXPIA CO.,LTD.
948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea Tel Tel 82-70-8671-2400 Fax 82-70-8620-8080
 - CONTENTS -

1. Features

2. Package Outline Dimensions and Materials

3. Absolute Maximum Ratings

4. Electro-Optical Characteristics

5. Materials

6. Taping

7. Packing

8. Reliability

9. Cautions

10. Warranty

11. Others

12. Characteristic Diagrams

(Tentative 3.0) 1/13

1. Features
Package : SMD type (1 Chip in 1 PKG )

1.6 0.8 0.6 [mm] (LWH) size surface mount type

Viewing angle : extremely wide(160)

Soldering methods : IR reflow soldering

2. Package Outline Dimensions and Recommended Solder Patterns

(Tentative 3.0) 2/13

3. Absolute Maximum Ratings
(Ta=25)

item symbol value unit

forward current IF 20 mA
1)
pulse forward current IFP 100 mA

reverse voltage VR 5 V

power dissipation PD 70 mW

operating temperature Topr -30 to+85

storage temperature Tstg -40 to +100

1)
IFP conditions : pulse width 10msec & duty ratio 1/10

*Absolute Maximum ratings is not normal operating condition.

4. Electro-Optical Characteristics
(Ta=25)

item rank symbol condition min typ max unit

V18 1.8 - 2.0
forward
2) V20 VF IF= 5mA 2.0 - 2.2 V
voltage
V22 2.2 - 2.4
YG0 568 - 570
Dominant
YG1 D IF= 5mA 570 - 572 nm
Wavelength3)
YG2 572 - 574
C 6 - 10

luminous intensity4) D IV IF= 5mA 10 - 14 mcd

E 14 - 20
reverse
- IR VR=5V - - 50
current
2)
Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within 0.1V.
3)
The allowance of Dominant Wavelength measurement is within 1nm%.
4)
The allowance of luminous intensity measurement is within 11%.
* To avoid optical difference, please do not mix differently ranked product
* All measurements were made under the standardized environment of LUXPIA.

(Tentative 3.0) 3/13

5. Materials
item material

LED chip AlGaInP

Wire gold

PCB C3965 (Cu/Ni/Au plating)

encapsulation Epoxy + Silicone resin

6. Taping
6.1. tape (material : PS, conductive: >106)

(units : mm)

(Tentative 3.0) 4/13

6.2. wheel (color : black)
(units : mm)

- quantity per reel LYG1006 : 4,000pcs

6.3. label
part no.

size (L X W) : 85mm 50mm

LYG1006
YG0 - C- V20

4,000ea

color rank IV rank VF rank

(Tentative 3.0) 5/13

7. Packing

The LEDs are packed in cardboard boxes after taping. The label shows part number, lot number, rank,
and quantity.
In order to protect the LEDs from mechanical shock, they are packed with cardboard boxes
for transportation.
The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so cautions must be taken to prevent any possible damage.
The boxes are not water-resistant and, therefore, must be kept away from water and moisture.
When the LEDs are transported, it is recommended that the same packing method as Luxpia's is used.
If noticeable damage on a box appears upon arrival at the users warehouse, the user should submit a
claim to Luxpia within one week after arrival of the products.

(Tentative 3.0) 6/13

8. Reliability
8.1. test items and results
number of
no. test item Test Conditions Note damaged
sample
o
resistance to soldering Tsld=260 C, 10sec
1 heat (pre treatment 2 times 0/45
o
(reflow) 30 C,70%,168hrs)
solderability 1 time
2 Tsld=2155oC, 3sec 0/45
(reflow) over 95%
-40oC through +25oC to
3 temperature cycle +85 100 cycles 0/45
(30min/5min/30min)

4 high temperature storage Ta=85 1000 hrs 0/45

high humidity and

5 Ta=60, RH=90% 1000 hrs 0/45
temperature storage

6 low temperature storage Ta=-30 1000 hrs 0/45

steady-state operating
7 Ta=25, IF=10mA 500 hrs 0/45
lifetime test
steady-state operating
8 lifetime of high humidity Ta=60, RH=90%, IF=5mA 500 hrs 0/45
and temperature
steady-state operating
9 lifetime of low Ta=-30, IF=10mA 500 hrs 0/45
temperature
* Reliability is measure on the thermal emission PCB for LED Reliability test.

8.2. criteria for judging the damage

criteria for judgement
item symbol test condition
min max

forward voltage VF IF = 5mA - U.S.L.4) 1.2

luminous intensity IV IF = 5mA L.S.L.5) 0.5 -

4)
U.S.L. : upper standard level
5)
L.S.L. : lower standard level

(Tentative 3.0) 7/13

9. Cautions
White LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of White LEDs is subject to change a little by an operating current. Care should be
taken after due consideration when using LEDs.
(1) Moisture-Proof Package
When moisture is absorbed into the SMT package it may vaporize and expand products during soldering.
There is a possibility that this may cause exfoliation of the contacts and damage to the optical characteristics
of the LEDs. For this reason, the moisture-proof package is used to keep moisture to a minimum in the
package.
A package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. The silica gel
changes its color from yellow to green as it absorbs moisture.
(2) Storage
Storage Conditions
- After opening the package :
The LEDs should be kept at 5~40 or less and 30%RH or less. The LEDs should be used within a year.
When storing the LEDs, moisture-proof packaging with moisture-absorbent material (silica gel) is
recommended. If unused LEDs remain, they should be stored in moisture-proof packages, such as sealed
containers with packages of moisture-absorbent material (silica gel). It is also recommended to return the
LEDs to the original moisture-proof bag and to reseal the moisture-proof bag again.
If the moisture-absorbent material (silica gel) has faded away or the LEDs have exceeded the recommended
storage time, baking treatment should be performed using the following conditions.
- Baking treatment : LED bulk: more than 12 hours at 1255
LED Reel: more than 24 hours at 605
Please avoid condition which may cause difficulty during soldering operations. It is recommended that the
User use the LEDs as soon as possible.
Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
Thermal design of the end product is of paramount importance. Please consider the heat generation of the
LED when the system is designed. The coefficient of temperature increase per input electric power is
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as
other components. It is necessary to avoid intense heat generation and operate within the maximum ratings
given in the specification.
The operating current should be decided after considering the ambient maximum temperature of LEDs.

(Tentative 3.0) 8/13

(4) Soldering Conditions
The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any
guarantee on the LEDs after they have been assembled using the dip soldering method.
Recommended soldering conditions
Reflow Soldering Hand Soldering
Lead Solder Lead-free Solder
pre-heat 120~150 200~220 temperature 350 max
pre-heat time 120sec max 120sec max soldering time 3sec max
peak temperature 240 max 260 max (one time only)
soldering time 10sec max 5sec max
condition refer to profile refer to profile
* After reflow soldering, rapid cooling should be avoided.

[temperature-profile (surface of circuit board)]

Use the conditions shown to the following figures.
< : Lead Solder>

2~3/sec
240 Max
T
Pre-heating 10sec Max
e
2~5/sec 120~150
m
p

[
60sec
120sec Max Max
]
Room Temp

Time [sec]

< : Lead-free Solder>

3~5/ sec
260 Max
Pre-heating 5sec Max
T 200~220
e 1~5/ sec 45sec
m
Max
p

[
120sec Max
] Room Temp

Time [sec]
(Tentative 3.0) 9/13
 Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during
air reflow. It is recommended that the User use the nitrogen reflow method.
Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-
head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the
LEDs will or will not be damaged by repairing.
Reflow soldering should not be done more than two times.
When soldering, do not put stress on the LEDs during heating.
After soldering, do not warp the circuit board.
(5) Cleaning
It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other
solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or
not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean
the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should
be done to confirm whether any damage to the LEDs will occur.
(6) Static Electricity
Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-
electrostatic glove be used when handling the LEDs.
All devices, equipment and machinery must be properly grounded. It is recommended that measurements
be taken against surge voltage to the equipment that mounts the LEDs.
When inspecting the final products in which LEDs were assembled, it is recommended to check whether the
assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on
test or a VF test at a lower current (below 1mA is recommended).
Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the
forward voltage becomes lower, or the LEDs do not light at the low current.
- criteria : VF > 1.0V at IF=0.5
(7) Others
Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when
using the LEDs with matrix drive.
The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking
directly at the LEDs with unaided eyes for more than a few seconds.
Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions
during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it.

10. Warranty
(1) Luxpia warrants that its LEDs conform to the foregoing specifications and that Luxpia will convey good title
to all LEDs sold.
(2) LUXPIA disclaims all other warranties including the implied warranties of merchantability and fitness for a
particular purpose.
(3) In the event any LED supplied by Luxpia is found not to conform to the foregoing specifications within
ninety days of receipt, Luxpia will repair or replace the LED, at Luxpias discretion, provided that the User (a)
promptly notifies Luxpia in writing of the details of the defect (b) ships the LEDs at the Users expense to
Luxpia for examination, and (c) the defect is due to the negligence of Luxpia and not mishandling or misuse
by the User.
(4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at conditions exceeding
our specifications.
(5) These specifications are applied only when a LED stands alone and it is strongly recommended that the

(Tentative 3.0) 10/13

User of the LEDs confirms the properties upon assembly. Luxpia is not responsible for failures caused during
and after assembling. It will be excepted from the rule if the failure would caused undoubtedly by Luxpia.
(6) A claim report stating details about the defect shall be made when returning defective LEDs. Luxpia will
investigate the report immediately and inform the user of the results.
(7) The LEDs described in the specification are intended to be used for ordinary electronic equipment (such as
office equipment, communications equipment, on the applications in which exceptional quality and reliability
are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health
(such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic
control equipment, life support systems and safety devices)
(8) LUXPIAs liability for defective lamps shall be limited to replacement and in no event shall LUXPIA be liable
for consequential damage or lost profits.

11. Others
(1) The warranties of quality set forth herein are exclusive. All previous negotiations and agreements not
specifically incorporated herein are superseded and rendered null and void.
(2) Both parties shall sincerely try to find a solution when any disagreement occurs regarding these
specifications.
(3) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia directly before
disassembling or analysis.
(4) These specifications can be revised upon mutual agreement.
(5) Luxpia understands that the User accepts the content of these specifications, if the User does not return
these specifications with signatures within 3 weeks after receipt.

(Tentative 3.0) 11/13

 12. Characteristic Diagrams
*All characteristics shown are for reference only are not guarantee.

(1) forward voltage vs. forward current (2) forward current vs. relative luminosity

(Ta=25) (Ta=25)
60

50
forward current IF [mA]

relative luminosity [a.u.]

40

30

20

10

1
1.0 1.5 2.0 2.5 3.0 3.5

forward voltage VF[V] forward current IF[mA]

(3) ambient temperature vs. allowable (4) ambient temperature vs. relative luminosity
forward current
(IF=5mA)
60 10
allowable forward current IAF[mA]

50
relative luminosity[a.u.]

40

30

1
20

10

0.1
-20 0 20 40 60 80 100
-40 -20 0 20 40 60 80 100

ambient temperature Ta[] ambient temperature Ta[]

(5) relative spectral emission

(Tentative 3.0) 12/13

 (Ta=25, IF=5mA)
1 .2

1 .0

0 .8
[a.u]

0 .6
Intensity

0 .4

0 .2

0
350 450 550 650 750
Wavelength [nm]

(6) radiation characteristics

(Ta=25, IF=5mA)

100 50 0 50 100
Relative Luminous Intensity Iv[%]

(Tentative 3.0) 13/13