INTEGRATED CIRCUITS

DATA SHEET

TDA1579
TDA1579T
Decoder for traffic warning (VWF)
radio transmissions
Product specification May 1992
File under Integrated Circuits, IC01
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

GENERAL DESCRIPTION Features

The TDA1579 decoder is for radio transmissions having Selective subcarrier amplifier (57 kHz) with gain control
57 kHz amplitude-modulated subcarriers as used in the Transmitter identification signal (SK) decoder
German 'Verkehrs Warnfunk' (VWF) traffic warning
Area identification signal (BK) and announcement
system.
identification signal (DK) active filtering
BK and DK decoders (Schmitt trigger with switched
hysteresis)
BK and DK switch-on/switch-off delay circuits
Driver output for SK indicator (LED)
SK and BK control outputs.

QUICK REFERENCE DATA

Measured in Fig.1 at ViSK = 8 mV; f = 57 kHz amplitude modulated with fm = 34.95 Hz and m = 60% for
BK-traffic area C signal; or with fm = 125 Hz and m = 30% for DK signal.

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage VP 7.5 8.5 12 V
Supply current IP 6 mA
Nominal input voltage at f = 57 kHz ViSK 8 mV
Input impedance at f 57 kHz Zi 100 k
Control level 3 dB ViSK 2.4 mV
Input voltage peak-to-peak value Vi(p-p) 2 V
SK switch-on
threshold level mBKon 42 %
SK switch hysteresis mBK 3.5 dB
SK switch-on delay tdSKon 150 ms
SK switch-off delay tdSKoff 750 ms
DK switch-on
threshold level mDKon 13 %
DK switch hysteresis mDK 3.6 dB
DK switch-on delay tdDKon 750 ms
DK switch-off delay tdDKoff 750 ms
Ambient operating
temperature range Tamb 30 + 80 C

PACKAGE OUTLINES
TDA1579: 18-lead DIL; plastic (SOT102); SOT102-1; 1996 August 12.
TDA1579T: 20-lead mini-pack; plastic (SO20; SOT163A); SOT163-1; 1996 August 12.

May 1992 2
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134). All pin numbers in this table apply to
TDA1579; for TDA1579T refer to Fig.1.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage pin 7 VP = V7-18 15 V
Switch output voltage pin 1 V1-18 23 V
pins 2 or 3 V2; 3-18 15 V
pins 1, 2 or 3 V1; 2; 3-18 0.5 V
Switch output current pin 1 I1 50 mA
pins 2 or 3 I2; 3 5 mA
pins 1, 2 or 3 I1; 2; 3 10 mA
Signal input voltage pin 13 V13-18 VP
pin 13 V13-18 0.5 V
Signal input current pin 13 I13 10 mA
Total power dissipation Ptot 800 mW
Storage temperature
range Tstg 55 +150 C
Operating ambient
temperature range Tamb 30 + 80 C

CHARACTERISTICS
VP = 8.5 V; Tamb = 25 C; measured at nominal input signal: ViSK = 8 mV, f = 57 kHz amplitude modulated with
fm = 34.95 Hz and m = 60% for BK-traffic area C signal; or with fm = 125 Hz and m = 30% for DK signal.
All pin numbers in this table apply to TDA1579, for TDA1579T refer to Fig.1.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage pin 7 VP 7.5 12 V
Supply current pin 7 IP 6 10 mA
SK amplifier/decoder
Input impedance f 57 kHz |Zi| 100 k
Input voltage (peak-to-
peak value) Vi(p-p) 2 V
Input voltage at start of
gain control Vo9BK = 3 dB ViSK 2.4* mV
Voltage gain V9BK/V13SK Gv9-13 44* dB
Gain spread Gv9-13 2 dB
Gain control range Gv 40 dB
Controlled output voltage Vo9BK 440 mV
Vo9DK 220 mV

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Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

BK circuit
Switch-on threshold level pin 3 high-Z Vo5BKon 600 670 750 mV
Switch hysteresis V o5BKon 3 3.5 4 dB
----------------------
V o5BKoff

BK switch threshold level

for BK-off (SK-off) pin 3
conducting V4-18off 0.8 0.88 0.97 V
(typ. value = 0.21V8-18)
SK output (pin 3)
allowable load current I3 1.5 mA
saturation voltage I3 = 1.5 mA V3-18sat 0.35 V
rejection voltage I3 < 5 A V3-18 18 V
Indicator driver (pin 1)
allowable load current I1 40 mA
saturation voltage I1 = 20 mA V1-18sat 0.8 V
rejection voltage I1 < 10 A V1-18 23 V
DK circuit
Switch-on threshold level pin 2 high-Z V15DKon 600 670 750 mV
Switch hysteresis V 15DKon 3.1 3.6 4.1 dB
----------------------
V 15DKoff

DK switch threshold level

for DK-off (Schmitt pin 2
trigger output) conducting V16-18off 0.6 V
(typ. value 1 VBE)
DK output (pin 2)
allowable load current I2 1.5 mA
saturation voltage I2 = 1.5 mA V2-18sat 0.35 V
rejection voltage I2 < 5 A V2-18 18 V
BK and DK filter amplifiers
Open loop gain f = 100 Hz Go 84 dB
Current gain Gi 120 dB
Input bias current Ii 50 nA
Output offset voltage R5-6 = R14-15
= 680 k Vo5-8
50 mV
V15-8
Available output current Io 1 mA
Output resistance Ro 2 3.5 k
Allowable load
capacitance CL 50 pF

May 1992 4
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Internal reference voltage
Output voltage V8-18 4.0 4.25 4.5 V
(typ. value = 0.5 VP)
Internal resistance of
voltage source R8 5
Available output current I8 2 mA
+I8 0.6 mA
Output short-circuit current I8sc 8 mA
(typ. value = VP/1 k)
Reference current source
Reference voltage V17-18 3.6 V
(typ. value = V8-18VBE)
Internal biasing resistor Ri17 5 k
Allowable range of external
reference resistor R17-18 180 270 k

* Selectable by R12-8 or Z10-8.

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Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

APPLICATION INFORMATION (Fig.1)

PARAMETER SYMBOL APPLICATION UNIT

SK switch-on threshold
level at mBK = 60% ViSKon typ. 1.8 mV
SK switch-on threshold
level at ViSK = 8 mV mBKon typ. 32 %
> 3.0 dB
SK switch hysteresis m BKon typ. 3.5 dB
----------------- < 4.0 dB
m BKoff

SK switch-on delay typ. 95 ms

(note 1) tdSKon < 130 ms
SK switch-off delay > 380 ms
(note 2) tdSKoff typ. 500 ms
< 620 ms
DK switch-on threshold
level at mDK = 30% ViDKon typ. 1.5 mV
DK switch-on threshold
level at ViDK = 8 mV mDKon typ. 13 %
> 3.1 dB
DK switch hysteresis m DKon typ. 3.6 dB
----------------- < 4.1 dB
m Dkoff

DK switch-on delay typ. 750 ms

(note 1) tdDKon < 1000 ms
DK switch-off delay > 600 ms
(note 2) tdDKoff typ. 750 ms
< 1000 ms
Notes
1. Sequence for measuring switch-on delay times (tdon)
a) Nominal BK or DK input signal at pin 13: Vi(p-p) = 8 mV; f = 57 kHz; modulation-on.
b) Pin 4 of the BK detector (pin 16 of the DK detector) is switched to ground to cause a low signal at the SK output
at pin 3 (DK output at pin 2).
c) tdon commences when the ground connection is removed from pin 4 (pin 16) as the positive-going VoBK signal at
pin 5 (VoDK signal at pin 15) crosses zero.
tdon ends when the positive-going edge of the SK output arrives at pin 13 (DK at pin 2).
2. Sequence for measuring switch-off delay times (tdoff)
a) Nominal operating conditions as in note 1.
b) tdoff commences when the input is switched off as the negative-going VoBK signal at pin 5 (VoDK signal at pin 15)
crosses zero.
tdoff ends when the negative-going edge of the SK output arrives at pin 3 (DK at pin 2).

May 1992 6
May 1992
transmissions
Philips Semiconductors

7
Decoder for traffic warning (VWF) radio

(1) fo = 55 Hz; Q = 1.9 L = 2.36 mH; QL = 70; C = 3.3 nF; fo = 57 kHz.

(2) fo = 24 Hz; Q = 1.9 Pin numbers in parentheses are for TDA1579T,
(3) fo = 125 Hz other pin numbers are for TDA1579.

Fig.1 Application diagram.

TDA1579T
TDA1579
Product specification
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

Fig.2 BK signal voltage at pin 5 as a function of Fig.3 DK signal voltage at pin 15 as a function of
frequency. frequency: fo = 125 Hz; Q 18.

Fig.4 Control characteristic of the SK amplifier at VP = 8.5 V, mBK = 60% and QL = 70.

May 1992 8
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

FILTER INFORMATION
Gain

Amplifier conditions: Go >> Gv and Go >> 2 Q2

p
-------------------- Vo
R1 C1
G v = ------------------------------------------------------------------------------------------------------------------- , in which p = j and Gv = ------ .
2 C1 + C2 R1 + R2 Vi
p + p --------------------------------- + ----------------------------------------------------------
R3 C1 C2 R1 R2 R3 C1 C2

C1 = C2 = C
GENERAL EQUATION C1 = C2 = C
R2 < < R1
Resonance frequency 1 1 1
r = ----------------------------------------------------------------
R1 R2
- -------------------------------------------- -----------------------------
---------------------- R3 C1 C2 R1 R2 C R2 R3
R1 + R2 C ---------------------- R3
R1 + R2

Gain at = r C2 R3
- --------
Gvr = --------------------- 1 R3 1 R3
C1 + C2 R1 --- -------- --- --------
2 R1 2 R1

Quality
C1 C2 R3 ( R1 + R2 )-
Q= ------------------------ -------------------------------------
R1 R2 1 R3 ( R1 + R2 ) 1 R3
C1 + C2 --- -------------------------------------- --- --------
2 R1 R2 2 R2

Recommended components
C1, C2 metallized polycarbonate film (MKC) capacitors; 5%
and
R1, R2, R3 metal film (MR) resistors; 2%
or
C1, C2 metallized polyester film (MKT) capacitors; 5%
and
R1, R2, R3 carbon film (CR) resistors; 2%

May 1992 9
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

PACKAGE OUTLINES

DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1

D ME
seating plane

A2 A

A1
L

c
Z e w M
b1
(e 1)
b b2
18 10 MH

pin 1 index
E

1 9

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 1.40 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 0.85
1.14 0.38 1.14 0.23 21.4 6.20 3.4 7.80 8.3

inches 0.055 0.021 0.055 0.013 0.86 0.26 0.15 0.32 0.37
0.19 0.020 0.15 0.10 0.30 0.01 0.033
0.044 0.015 0.044 0.009 0.84 0.24 0.13 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

93-10-14
SOT102-1
95-01-23

May 1992 10
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

D E A
X

c
y HE v M A

20 11

Q
A2 A
A1 (A 3)

pin 1 index

Lp
L

1 10 detail X
e w M
bp

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z
(1)

0.30 2.45 0.49 0.32 13.0 7.6 10.65 1.1 1.1 0.9
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1 o
0.10 2.25 0.36 0.23 12.6 7.4 10.00 0.4 1.0 0.4 8
0.012 0.096 0.019 0.013 0.51 0.30 0.42 0.043 0.043 0.035 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.49 0.29 0.39 0.016 0.039 0.016

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT163-1 075E04 MS-013AC
95-01-24

May 1992 11
Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

SOLDERING Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary
Introduction between 50 and 300 seconds depending on heating
There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from
packages. Wave soldering is often preferred when 215 to 250 C.
through-hole and surface mounted components are mixed Preheating is necessary to dry the paste and evaporate
on one printed-circuit board. However, wave soldering is the binding agent. Preheating duration: 45 minutes at
not always suitable for surface mounted ICs, or for 45 C.
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
Wave soldering techniques can be used for all SO
A more in-depth account of soldering ICs can be found in
packages if the following conditions are observed:
our IC Package Databook (order code 9398 652 90011).
A double-wave (a turbulent wave with high upward
DIP pressure followed by a smooth laminar wave) soldering
technique should be used.
SOLDERING BY DIPPING OR BY WAVE
The longitudinal axis of the package footprint must be
The maximum permissible temperature of the solder is parallel to the solder flow.
260 C; solder at this temperature must not be in contact The package footprint must incorporate solder thieves at
with the joint for more than 5 seconds. The total contact the downstream end.
time of successive solder waves must not exceed
5 seconds. During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
The device may be mounted up to the seating plane, but applied by screen printing, pin transfer or syringe
the temperature of the plastic body must not exceed the dispensing. The package can be soldered after the
specified maximum storage temperature (Tstg max). If the adhesive is cured.
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the Maximum permissible solder temperature is 260 C, and
temperature within the permissible limit. maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 C within
REPAIRING SOLDERED JOINTS 6 seconds. Typical dwell time is 4 seconds at 250 C.

Apply a low voltage soldering iron (less than 24 V) to the A mildly-activated flux will eliminate the need for removal
lead(s) of the package, below the seating plane or not of corrosive residues in most applications.
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in REPAIRING SOLDERED JOINTS
contact for up to 10 seconds. If the bit temperature is Fix the component by first soldering two diagonally-
between 300 and 400 C, contact may be up to 5 seconds. opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
SO time must be limited to 10 seconds at up to 300 C. When
REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO 270 and 320 C.
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

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Philips Semiconductors Product specification

Decoder for traffic warning (VWF) radio TDA1579

transmissions TDA1579T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

May 1992 13