First: (Intro) (Lalai) : "Removal and Replacement of Discrete Components" #Script For The Video !!! Lezz Do Thisss
First: (Intro) (Lalai) : "Removal and Replacement of Discrete Components" #Script For The Video !!! Lezz Do Thisss
First: (Intro) (Lalai) : "Removal and Replacement of Discrete Components" #Script For The Video !!! Lezz Do Thisss
First: (Intro)
(LALAI)
Several problems in a PCB may be repaired by removing a specific
defective discrete component and replacing it with a new one. These
components include resistors, capacitors, transistors, diodes and inductors
which are connected in traces through which electric current can flow.
In this video we will show you first on how to properly remove such
discrete components then to be followed with its replacements. A person
who conducts the said process must be knowledgeable enough and
carefully handle those components to eliminate damages.
Without further ado so LETS GET STARTED!!!
Second: (PPE)
Before anything else, we should wear proper attire to free ourselves
from hazards.
We have here a lab gown or laboratory gown for body protection,
disposable mask to avoid respiratory ailments from smokes coming out from
soldering process (a cloth mask will do), safety goggles to secure the eyes.
Lastly, safety gloves so that our hands
In the removal and replacement of these components, you should not
wear accessories like rings, bracelets, watches or any other things that
could contribute to destruction.
Third: (Materials and Equipment)
So heres the sample of a PCB to be used. It is a printed circuit of a
_____.
To remove its components we should have proper tools and
equipment to make our work easier and faster:
We have here a toolbox which consists of wire stripper/cutter , tester,
pliers (please mention other tools inside the box )o
A soldering iron together with its stand and de soldering gun.
We also have the following parts (name them ) for the replacement.
Fourth: (Conformal coating) first stepppppp
Prior to the removal and replacement of discrete components, we
should primarily take the consideration to get rid of the coat in its topmost
layer.
Did you know that most circuit boards are actually coated with a
transparent substance/material on its top layer? The proper term for that is
Conformal coating.
Conformal coating material is applied to electronic circuitry to act as
protection against moisture, dust, chemicals, and temperature extremes
that, if uncoated (non-protected), could result in damage or failure of the
electronics to function. Most circuit board assembly houses coat them with a
layer of transparent conformal coating. Because of the characteristics that
conformal coatings exhibit, they must be removed before any work can be
done on printed circuit boards.
As we go along into our research, there are several types of coating
based on the material being used. The following coatings are Silicone
coatings, Acrylic coatings, and Urethane coatings.
Let us assume that our circuit board is manufactured with Silicone
coating. Other companies produce very popular conformal coatings based
on silicones. They offer great protection while being light, durable and easy
to rework. Almost without exception, silicone coatings may be removed by
the No-Clean Flux Remover VeriClean. This product is based on
siloxane technologies, so it is chemically very similar to most silicone
conformal coatings. In one test with a large Texas computer manufacturer,
No-Clean Flux Remover VeriClean removed in two minutes a coating
which had been taking 45 minutes to remove with more traditional solvents.
If youre fussing with silicone coatings, get yourself the No-Clean Flux
Remover VeriClean for the rework area. Youll be amazed at the time you
save.
In the case of having your PCB coated with Acrylics and Urethanes,
your best choice is the Heavy-Duty Flux Remover SuperClean and
Uncured ExPoxy Remover respectively to eliminate the coating.
So apply some of the silicone coating remover into the PCB then
afterwards remove or peel it. And There you have it!! Proper remover must
be used for easy removal and for better results.
Fifth: (Removal part)
Since we are done with the riddance of conformal coating, we can start
now the removal of discrete components like this one (POINT OUT) which is
the resistor, this one which is the capacitor and also this one which is the
inductor.
To remove components for repair or replacement, the technician
must first determine the type of joint that is used to connect the
component to the board. The technician may then determine the
most effective method for desoldering these connections.
Next thing to do is preheat the soldering iron. Once it heated,
apply it onto the leads of your desired component to be removed
so that solder will be melted.
To extract the solder, the method we will going to use is by
MANUALLY CONTROLLED VACUUM PLUNGER. This technique
involves melting the solder joint and inserting the solder-extractor
tip into the molten solder over the soldering iron tip. This method
will not remove 100 percent of the solder so you can repeat until
solder is totally removed.
Sixth: (Replacing part)
The technician should restore the electronic assembly at least to the
original manufacturer's standards. Parts should always be remounted or
reassembled in the same position and with termination methods used by
the original manufacturer. This approach ensures a continuation of the
original reliability of the system.
First thing we should do is to prepare the termination areas. The
termination areas on the board and the component leads are
thoroughly cleaned to remove oxide, old solder, and other
contaminants. Old or excess solder is removed by one of the
desoldering techniques explained earlier. All areas to be soldered
are cleaned with a solvent and then dried with a lint-free tissue to
remove cleaning residue.
Next step is the component Lead preparation. In this case we
used hand-forming methods to form leads. To control the lead-
forming operation and ensure conformity and quality of
replacement, the technician should ensure that the component is
centered between the holes, and component leads are formed
with proper bend-radii and body seal-to-bend distance. Also,
Leads are measured and formed for both horizontal and vertical
component mounting
Then component leads are formed and inserted into the board
The proper lead length and termination are made before the lead
is soldered.
This is now the time that soldering process comes in to replace
the components. This process is crucial for the reliability of the
connection in the PCB.
Before solder is applied to the joint, the surface temperature of
the parts being soldered is increased above the solder melting
point.
In general, the soldering iron is applied to the point of greatest
mass at the connection. This increases the heat in the parts to be
soldered. Solder is then applied to a clean, fluxed, and properly
heated surface. When properly applied, the solder melts and flows
without direct contact with the heat source and
provides a smooth thin edge.
Molten solder forms between the tip and the joint, creating a heat
bridge or thermal linkage.
This heat bridge causes the tip to become part of the joint and
allows rapid heat transfer. A solder (heat) bridge is formed by
melting a small amount of solder at the junction of the tip and the
mass being soldered as the iron is applied.
After the tip makes contact with the lead and the pad and after
the heat bridge is established, the solder is applied with a wiping
motion to form the solder bond.
The completed solder joint should be bright and shiny in
appearance. It should have no cracks or pits, and the solder
should cover the pad.