ABB Semiconductors. Power Semiconductors Product Brochure 2016 PDF

Power semiconductors
Product brochure 2016

Contents
Introduction
4 IGBT and diode dies

5 1. IGBT and diode dies
8 Medium-power IGBT modules

9 2. 62Pak IGBT modules
10 High-power IGBT modules

11 3. LinPak IGBT modules
13 4. HiPak IGBT modules
16 5. StakPak press-pack IGBT modules
18 Diode press-packs
20 6. Fast recovery diodes
22 7. Rectifier diodes
23 8. Welding diodes
24 Thyristors press-packs
26 9. Phase control and bi-directionally controlled thyristors (PCT, BCT)
28 10. Fast thyristors
30 IGCT and GTO press-packs

31 11. Integrated gate-commutated thyristors (IGCT)
33 12. Gate turn-off thyristors (GTO)
34 Test systems
36 Further documentation
2 Power semiconductors | Product broschure 2016

Introduction
ABB is a leading supplier of power semiconductors with production facilities in

Lenzburg, Switzerland, and Prague, Czech Republic, as well as a new research
laboratory for wide bandgap semiconductors in Baden-Dttwil, Switzerland.
ABBs success story in power electronics began more than 100 years ago with
the production of mercury-arc rectifiers in Switzerland. Over the past 60 years,
ABB has played a pivotal part in the development of power semiconductors and
their applications.
This product brochure compiles broad background information on ABBs full range
of thyristor and IGBT power semiconductors, which until recently has been
provided by various product flyers.
For information thats more technical please contact us or see our

Product catalog
Application notes
Data sheets
SEMIS ABBs semiconductor online simulation tool
All of the above mentioned is available for download on our website

www.abb.com/semiconductors.
Product broschure 2016 | Power semiconductors 3

IGBT and diode dies
ABB Semiconductors range of SPT+ and SPT++ (soft punch through) IGBT
and diode chips is available at 1,200 and 1,700 V with currents ranging from
50 to 300 A.
Their main applications include power converters for industrial drives, solar energy,
battery backup systems (UPS) and electrical vehicles for 1,200 V and industrial
power conversion & drives, wind turbines and traction converters for 1,700 V.
Power map
SPT++/FSA diode
SPT ++ IGBT
1700 V
SPT+ diode
SPT+ IGBT
SPT+ diode
1200 V
SPT + IGBT Inom (A)
0 50 100 150 200 250 300 350
IGBT and diode dies

1. IGBT and diode dies
The newly introduced 1,700 V SPT++ chipset is the worlds

first 1,700 V chipset that offers an operational junction
temperature of up to 175 C. This allows the module designer
to increase the power density of power modules significantly.
The broad number of different current ratings and sizes
supports the various requirements in package design and
output power. All chipsets are for solder mount-down and
wire bonding in modules.
The IGBT
ABB offers its IGBTs in the advanced SPT + technology which
means customers benefit from a conduction loss reduction of
20..30% compared to the previous SPT technology.
Figure 1 shows the basic difference between SPT+ and SPT++.

The development target was to reduce the on-state losses by
introducing an N-enhancement layer surrounding the channel-
P-well. This improves the plasma concentration on the emitter
side and therefore, lowers the on-state losses. With the intro-
duction of the SPT++, the profile of the said N-enhancement
When looking for chipsets, featuring highest switching layer was further optimized with the main goal to make another
performance, ruggedness and reliability, ABBs IGBT and step in conduction loss improvement. Together with thinner
diode chips with state of the art soft punch through (SPT) silicon, a reduction in VCE SAT of half a volt was possible.
planar technology are the preferred choice.
ABB Semiconductors has a well-established reputation in the

field of high power semiconductors for switching devices.
This is reflected in the most complete product portfolio of any
supplier of high power semiconductors.
ABBs power semiconductor BiMOS chipsets, ie IGBTs and

their accompanying free-wheeling diodes, are best in class in
terms of switching performance, ruggedness and reliability.
Thanks to a moderate chip shrinkage and thus larger die area,
we are able to offer the highest output power per rated
ampere in the industry.
Fig. 1 SPT+ planar IGBT enhanced carrier profile

Figure 2 shows the on-state curves of the newest SPT++ IGBT
chip with 150 A rating at different temperatures. The SPT + IGBT turn-off
VCC = 900V, IC = 150A, RG = 8.2, L = 200nH, Tvj = 175C
IGBT shows a positive temperature coefficient of VCE on,
1200 180 18
already at low currents, which enables a good current sharing
15
capability between the individual chips in the module. 1000 150 12
9
800 120 6
VGE in V
3
IC in A
VCE in V
600 90 0
300 -3
400 60 -6
-9
200 30 -12
250 -15
25 C 0 0 -18
0 1 2 3
time (s)
175 C
200
Fig. 3 IGBT turn-off of a SPT++ 150 A 1,700 V IGBT
IC in A
150 The diode

125 C
The diode of the new SPT++ chipset is based on an advanced
pin-diode design using the FSA (field-shielded anode).
100 A schematic cross-section is shown in figure 4. In contrast to
more conventional design, the FSA diode has a double anode
with a deep diffused P-well that shields the field from the
anode and the irradiation. Thus a significant leakage reduction
50
can be achieved without sacrificing the excellent robustness
and low losses of the ABB diodes.
VGE = 15 V
0
0 1 2 3 4 5
VCE in V
Fig. 2 On-state curves of the 150 A 1,700 V SPT+ IGBT

(module level measurements)
Figure 3 shows the turn-off of a 150 A 1700 V SPT ++ IGBT

under nominal conditions at 175 C. The IGBT exhibits
controlled switching characteristics as well as short current
tails. This behavior is enabled by the combination of SPT Fig. 4 Schematic cross-section of the diode
buffer design and silicon resistivity used in SPT++ technology,
which provides fast switching with low losses and low
overshoot.

The typical forward characteristics is shown in figure 5. Reliability
Figure 6 shows the reverse recovery characteristics of a The reliability of the chipsets is confirmed using a combination
150 A 1,700 V diode under nominal conditions at 150 C. of standard tests including HTRB (high temperature reverse
The current transients during switching are very smooth bias), HTGB (high temperature gate bias), THB (temperature
and soft. humidity bias), cosmic ray test and a newly developed test,
which combines high temperature, high humidity and high
voltage.
300
To extend the reliability of the chipsets for extreme environ-
mental applications, the chipset designs additionally feature
250 a state of the art double-layer passivation of silicon nitride
and polyimide. The polyimide layer has the advantage of
25 C mechanically protecting the first passivation layer, acting
on the termination as a delay-barrier against humidity
200
and ion-penetration from outside and preventing sparking
175 C
across the termination during high-voltage operation.
IF in A
150 Detailed technical information

More detailed product information is available in our latest
125 C
Product Catalog, the data sheets or directly on the ABB
100 Semiconductors website (www.abb.com/semiconductors).
For further very valuable information, including data sheet
user guide, testing, shipment, storage, handling and assembly
recommendations please refer to our Application Note 5SYA
50
2059 Applying IGBT and diode dies which is also available
on our website.
0
0.0 0.5 1.0 1.5 2.0 2.5
VF in V
Fig. 5 VF curve of a 150 A 1,700 V FSA diode
Diode turn-off
VDC = 900V, IF = 150A, RG(aux) = 8.2, L = 200nH, Tvj = 175C
1000 200
800 120
600 40
IF in A
VDC in V
400 -40
200 -120
0 -200
0 1 2 3
time (s)
Fig. 6 Reverse recovery of a 1,700 V 150 A diode

Medium-power IGBT modules
ABB launched its medium-power IGBT module offering with three 1,700 V
62Pak phase leg modules, rated 150, 200 and 300 A. The portfolio will soon
be expanded with the 1,700 V LoPak1 dual and LoPak3 six-pack IGBT
modules.
Variable speed drives, power supplies, power quality, uninterruptible power

supplies (UPS) and renewable energies are their main field of applications.
Power map
62Pak
1700 V
Inom (A)
0 50 100 150 200 250 300 350
Medium-power IGBT modules

2. 62Pak IGBT modules
Applications
The modules feature industry standard housings and
are designed for very low losses and highest operating
temperatures.
Typical applications include:

Variable speed drives
Power supplies
Power quality
UPS
Renewable energies
IGBT module technology
Feature Customer value

Proven concepts from reliable traction rated HiPak modules are used
Spacers for substrate solder
homogeneous solder thickness, higher lifetime under cyclic loads
less delamination (e.g. thermal cycles)
Pre-bowed and stamped baseplate

reduced gap and lower interface higher themal utilization
Coming from high-power semiconductors, ABB is
resistance to sink, less grease more power, higher lifetime
regarded as one of the worlds leading suppliers setting pump-out
standards in quality and performance. ABBs unique
knowledge in high-power semiconductors now expands Spacers for main terminal solder
homogeneous and thus stronger higher lifetime under cyclic load
to industry standard medium-power IGBT modules. and more robust against vibrations
solder layer
Medium power module lines

ABB launched in a first wave its 62Pak, 1,700 V, 150, 200
and 300 A, phase leg IGBT modules in standard 62 mm
packages. The next medium-power IGBT modules to follow
are the LoPak1: 1,700 V, 225 A and 450A dual IGBT modules,
and the LoPak3: 1770V, 225 A and 450A six-pack IGBT
modules. Key benefits are
ultra low-loss and rugged SPT++ chipset
smooth switching SPT++ chipset for good EMC
Cu baseplate for low thermal resistance
industry standard package
Two switches in one package (phase leg)

High-power IGBT modules
ABB offers the three high-power IGBT and diode module families LinPak, HiPak
and StakPak. They are available in various configurations including singles
and duals, choppers and phase legs, covering voltage and current ranges from
1,700 to 6,500 V and 150 to 3,600 A, respectively.
The LinPak is an enabler for more reliable, efficient and compact inverter designs
in traction applications such as regional trains and metros but as well locomotives
and high-speed trains and also serves markets such as OHV (off-highway-vehicle)
and industrial converters for drives and wind-power. HiPaks are the perfect
match for demanding high-power applications such traction, renewable energy
(wind, solar), industrial drives and T&D. The StakPak is ideally suited for use in
multiple-device stacks as for instances in high-voltage DC transmission (HVDC)
applications.
Power map
HiPak single
6500 V
HiPak diode
StakPak single
HiPak single
4500 V
HiPak diode
HiPak phase-leg
HiPak single
HiPak chopper
3300 V HiPak diode
HiPak phase-leg/dual
LinPak phase-leg
StakPak single
2500 V
HiPak single
HiPak single
HiPak dual
1700 V
HiPak chopper
LinPak phase-leg Inom (A)
0 500 1000 1500 2000 2500 3000 3500 4000
HiPak, StakPak and LinPak

3. LinPak IGBT modules
The 3,300 V / 2 x 450 A LinPak offers a fast and low swit-

ching loss SPT+ chipset that ideally fits to the LinPak module.
The LinPak is the first 3,300 V module with an integrated
temperature sensor and offers unrivaled reliability thanks to
well-matched materials such as AlN insulation and AlSiC
baseplate, as well as advanced wire bonding techniques and
particle free ultrasonic welded main connections.
The 3,300 V LinPak is an enabler for more reliable, efficient

and compact inverter designs in traction applications such
as regional trains and metros but as well locomotives
and high-speed trains. It also serves markets such as OHV
(off-highway- vehicle) and industrial converters for drives
and wind-power.
Developments
Based on the shown concept, ABB develops highly reliable
traction rated modules, starting with 1,700 V / 2 x 1,000 A
followed by a 3,300 V / 2 x 450 A module. Also Cu-based
industrial versions at 1,700 V and later 1,200 V are targeted.
ABB presents a new open standard phase leg module, High-voltage traction versions with the same footprint, but
the LinPak. The innovative LinPak concept answers the rearranged electrical connections in order to cope with the
markets request for a new package that offers exceptio- higher clearance and creepage requirements will be presented
nally low stray inductance and, due to separated phase- soon.
and DC-connections, allows for simpler inverter designs.
The low-inductive phase leg IGBT module LinPak is
LinPaks Voltage (V) Current (A)
available at 1,700 and 3,300 V.
AlSiC1 / (Cu*) 1,700 2 x 1,000
Features
The very low-inductive internal module design and the massive AlSiC 2 3,300 2 x 450
DC-connection enables both, a very low-inductive busbar
design and a high current carrying capability. Both are despera- 1
Samples available on request
2
Samples scheduled Q2 2016
tely needed for state of the art silicon chipsets and even more
*Copper and 1,200 V versions will follow
for future SiC solutions. The LinPak module design results
in excellent internal and external current sharing, making it
ideally suited for paralleling. It thus renders possible a large Exemplary nominal switching waveforms
range of current ratings with just one article. Derating-free The exemplary switching waveforms at nominal current show
paralleling is possible up to at least four modules. Moreover, the benefit of the low overall stray inductance. Despite the fast
the LinPak features an integrated temperature sensor and switching and the very low switching losses of the 1,700 V
has a dedicated mounting area for a gate drive adapter board. SPT++ IGBT chipset, the overvoltage remains at a very low
For harsh environments in traction or off-highway vehicle level and the current as well as voltage waveforms are free of
applications, the adapter board can be additionally fixed with oscillations. In the present setup, we achieved a total stray
four screws in the module corners. This new open standard inductance including capacitors, busbar and module of less
external module design can be freely used from all module than 25 nH per 1,000 A phase leg.
manufacturers, as long as the outline and terminal positions
are kept identical. So far at least two major suppliers are
committed to this new high-power IGBT package.

Outline drawing
ABB will offer both the 3,300 V and 1,700 V LinPak optionally
with main emitter sense terminals. These additional auxiliary
emitter contacts are connected to the DC Minus power ter-
minal for the bottom-switch and to the phase power terminal
for the top-switch.
1,700 V LinPak turn-on switching curves
LinPak with basic configuration
With the help of these additional terminals the internal

inductive voltage drop between main-emitter contacts and
the auxiliary emitter potential can be measured and used
for instance to detect fault currents for a faster short-circuit
1,700 V LinPak turn-off switching curves protection.
LinPak with additional auxiliary emitter

4. HiPak IGBT modules
SPT technology
SPT is a well-established planar IGBT technology covering
the voltage range of 1,200 V to 6,500 V. It is characterized
by smooth switching waveforms and exceptional robustness
which is of particular importance at higher voltages and
currents where stray inductances are not easily minimized.
SPT+ technology
SPT+ retains all the features of the SPT technology but
reduces VCE SAT by up to 30 % according to the curve in
figure 1 an achievement previously believed to be possible
only with trench technology.
ABB Semiconductors HiPak modules are a family of

high-power IGBTs in industry standard housings using
the popular 190x140 mm, 130x140 mm and 140x70 mm
footprints. HiPak modules are the perfect match for
demanding high-power applications such as traction,
T&D, renewable energy (wind, solar) and industrial drives.
ABBs HiPak modules are available in three standard isolation

voltages (4, 6 and 10.2 kVRMS) and a variety of circuit confi-
gurations. These modules exclusively use aluminum silicon
carbide (AlSiC) baseplate material and aluminum nitride (AlN)
isolation with low thermal resistance. This specific material
combination offers an excellent power cycling performance
thanks to its matched thermal expansion coefficients (CTE). Fig. 1 Vce sat for different IGBT cell technologies on SPT silicon at 125 C.
All HiPak modules feature ABBs advanced SPT and SPT+ (current density of SPT range, same E off )
(soft punch through) chip technology, which combines low

losses with soft switching performance and record breaking
Safe Operating Area (SOA). In keeping with ABBs reputation High ruggedness at 6,500 V
for offering high-power semiconductors of exceptionally In the case of the new 6,500 V SPT+ IGBT the on-state losses
high reliability, the HiPak SPT chips have been optimized for exhibit a reduction of approximately 30 % when compared
reliable operation under harsh conditions. This has been to the standard SPT device. This, in combination with the
achieved through smooth switching characteristics and improved ruggedness of the SPT+ IGBT has enabled an
through rugged operation (high SOA) as this translates into increase in the current rating from 600 A for the standard
operational safety margins for the equipment. Furthermore, 6,500 V HiPak up to 750 A for the new SPT+ version.
the SPT + chipsets (IGBT and diode) at 1,700 V and 3,300 V
blocking voltages have been improved to operate at higher
junction temperatures up to 150 C in the HiPak modules.

Figure 3 shows the reverse blocking SOA (RBSOA) test on the
1,700 V 3,600 A HiPak2 module where a current of 10,500 A
is turned off at a DC-link voltage of 1,300 V, proving the
ruggedness of the SPT+ IGBT design when paralleled in the
HiPak2 module.
Fig. 2 6,500 V SPT+ IGBT turn-off under SOA conditions measured at module
level, Pp off = 11.7 MW
Figure 2 shows the extremely high turn-off ruggedness of the

6,500 V SPT+ IGBT, setting a new benchmark for this voltage
class. A current of 2,400 A which corresponds to more than Fig. 3 1,700 V / 3,600 A HiPak RBSOA measured at Tj = 150 C
three times the nominal current was switched-off against a with active clamp
DC-link voltage of 4,500 V at a junction temperature of 125 C.

The stray inductance in this case was 750 nH, which is more
than double the value that can be expected in the targeted The buffer and anode designs used in the SPT+ IGBT have
application environment and shows that the specified SOA been optimized in order to obtain a high short-circuit SOA
can be fulfilled with margin. capability, even at gate voltages exceeding the guaranteed
gate drive voltage of 15 V.
150 C operation
ABB recently upgraded the 1,700 V and 3,300 V SPT+ chipsets Increased reliability with improved HiPak
to be operational in HiPak modules at junction temperatures The improved HiPak modules will be a direct 1:1 replacement
up to 150 C. For the IGBT, this is achieved by improved device with identical electrical and thermal characteristics. The
structures combined with new termination designs. This has principal electro-mechanical layout remains unchanged. The
resulted in excellent blocking characteristics and low reverse improvements are realized by the following design features:
currents, which guarantee stable operation at 1,700 V and
3,300 V up to temperatures above 150 C. New housing construction:
For low-voltage (LV) HiPak modules we were able to remove
On the diode side, the plasma has been shaped for low the epoxy casting. This allows to increase the case tempera-
forward voltage drop and soft reverse recovery by using both ture rating to TC max = 150 C. The new package now complies
local and uniform lifetime control. The local lifetime control with the latest fire and smoke requirements for traction
is obtained by proton (H+) irradiation. The use of hydrogen applications. This for both the low-voltage and high-voltage
particles has reduced the 150 C leakage current by a factor version:
of three when compared with the previous SPT diode platform. NFF 16-101/102 I3 F2,
EN 45545-2 R23: >HL1, R24: >HL2

New internal auxiliary connections: Wire bonding:
The internal solder connections between the gate-print and The emitter side wire bonding parameters have been impro-
the substrate will be substituted by standard aluminum wire ved and so called stich-bonds (figure 5) are used. This
bonding. This well-established technology allows for higher results in an improvement of factor 4 in intermittent operating
reliability and offers a redundant double wire connection life (IOL) (target 2 Mcycles T = 60 K, Tvj max = 150 C).
(figure 4).
Fig. 4 New redundant aluminum wire bond connection of gate Fig. 5 Stich-bond layout and improved bonding parameters boost the power
and auxiliary emitter cycling capability
Terminal foot: The new design has been qualified with all the relevant tests:
The main terminals offer an improved solder foot with speci- shock and vibration, temperature cycling, IOL and Tempera-
fically designed spacers in order to achieve a homogenous ture Humidity Biased (THB). During 2016, the improvements
solder layer thickness. This allows for an improved tempera- will be made available for the high-voltage housings (G, J
ture cycling performance. and P).
Summary
As illustrated above, ABBs HiPak family of IGBT modules
continues to set new standards of robustness for high
reliability applications. Robustness translates to higher ope-
rating safety margins and allows low gate drive resistance at
turn-off which, in turn, allows lower turn-off losses. SPT chip
technology with its smooth switching behavior, allows users
the greatest freedom of design by not imposing dv/dt or
peak-voltage restrictions at turn-off. The new SPT+ technology
allows further loss reductions without compromising any of
the existing features of SPT. Further improvements on the cell
design allow chipsets to operate at junction temperatures up
to 150 C.

5. StakPak press-pack IGBT modules
connections with redundancy; in such applications, additional

devices are inserted in the series string so that a devices
failure will not interrupt converter operation. The failed device
will continue to conduct current for a time period greater than
the planned service interval of the equipment. This period of
time, during which load current must flow in the failed device
without external degradation of the housing or internal
degradation of the electrical contact, is a function of the load
current time-dependence. ABB offers SCFM ratings for users
requiring this feature and who are able to specify the load
current waveforms and profiles. For applications not requiring
a stable short over a longer period, ABB can provide non-
SCFM rated modules. Still also, non-SCFM rated StakPak
modules fail into a short but a stable short can only be
guaranteed up to one minute. This is still sufficient time to
engage an external bypass or take other measures.
StakPak is a family of high-power IGBT press-pack

modules in an advanced modular housing that
guarantees uniform chip pressure in multiple-device
stacks. Fig. 1 Submodules in a 6-pocket StakPak module
Although the insulated module is the most common package

for IGBTs, for applications requiring series connection, press- Press-pack technologies
pack modules are preferred because of the ease with which Two basic multichip press-pack technologies exist: chips
they can be connected electrically and mechanically in series contacted by common pole-pieces (figure 2: conventional
and because of their inherent ability to conduct in the shorted technology) and chips contacted by individual springs
state an essential feature where redundancy is required. (figure 3: ABB StakPak technology).
Since IGBT modules feature multiple parallel chips, there is

a challenge with conventional press-packs in assuring
uniform pressure on all chips. ABB has solved this problem
with an advantageous spring technology.
The StakPak, optimized for series connection, features a

modular concept based on submodules fitted in a fiberglass
reinforced frame (figure 1), which allows a flexible realization
of a range of products for different current ratings and IGBT /
diode ratios.
Fig. 2 Sectional view of conventional multi-chip press-pack with common
StakPak product range pole-pieces: each chip bears the device force divided by the number of chips.
Unlike standard IGBT modules, StakPak modules fail into

a stable short-circuit failure mode (SCFM). SCFM capable
StakPaks are ideally suited for applications with series

Applications
Press-pack modules are favored in applications where devices
are series-connected mechanically and/or electrically and
where redundancy is required. A classic example of a long
stack requiring SCFM can be seen in the HVDC valve of
figure 5. Other press-packs applications include:
HVDC & FACTS (Flexible AC Transmission Systems)
Topologies in which open circuits are not possible
(eg current-source systems)
Multi-level inverters with 6 or more devices mechanically
in series
Frequency converters operated directly from the 15 or
25 kV AC traction catenary
Fig. 3 Sectional view of ABB multichip press-pack with individual spring Pulse-power applications, such as thyratron replacement
contacts: the chip bears the force determined by the spring; excess force is
borne by the housing walls. The drawing illustrates one multichip submodule
in one press-pack housing.
Fig. 4 Principle of individual emitter pressure contacts. F is the force, c the

spring constant and x the travel distance.
Fig. 5 Standard IGBT valve for VSC, HVDC and STATCOM
The individual spring contacts reduce the heat sink flatness

tolerance and the pressure uniformity requirement within the Summary
stack that would otherwise be needed. This, in turn, reduces StakPak technology is a well proven concept in IGBT press-
the mechanical construction costs of the stack and greatly pack technology, conceived to reduce cost and enhance
increases field reliability. Thanks to this independent suspen- reliability in systems requiring several press-packs in one
sion, only the correct force is applied to each chip allowing stack. The modularity of StakPak allows the product range to
excess force to be transferred to the StakPaks housing wall be configured from a number of standard parts allowing rapid
(figure 4). The force needed for a long stack may indeed response to market needs. The newly introduced 4,500 V
be far higher than that tolerated by the silicon chips being rated modules feature the state of the art SPT+ chipset for
contacted via their sensitive surface microstructures. The lowest system losses and highest ruggedness and reliability.
rigidity and stability of a stack subjected to shock or vibration
in service or during transportation depends on a mounting
force that may not always coincide with that required by the
encapsulated chips. It is therefore important to decouple the
two forces, allowing the optimal force on the chips to be lower
than the optimal force on the stack: the individual springs of
ABBs StakPak allow this.

Diode press-packs
ABBs range of press-pack diodes covers

Fast recovery diodes from 2,500 to 6,000 V and 175 to 2,620 A
(GTO free-wheeling, snubber, IGBT and IGCT diodes)
Standard rectifier and avalanche diodes from 1,700 to 6,000 V and
662 to 7,030 A
Welding diodes for medium and high frequencies at 200 and 400 V
and from 6.2 to 13.5 kA.
Power Maps
Snubber
6000 V
GTO free-wheeling
5500 V IGCT
IGCT
IGBT
4500 V
Snubber
GTO free-wheeling
Snubber
2500 V
GTO free-wheeling I nom (A)
0 500 1000 1500 2000 2500 3000
Fast recovery diodes

6000 V Standard recovery
Avalanche
5000 V
Standard recovery
3800 V Avalanche
Avalanche
3200 V
Standard recovery
2600 V Avalanche
2300 V Avalanche
Avalanche
2000 V
Standard recovery
1700 V Avalanche
High-frequency welding
400 V
Medium-frequency welding
200 V Medium-frequency welding I nom (A)

0 2000 4000 6000 8000 10000 12000 14000 16000
Rectifier and welding diodes

6. Fast recovery diodes
Typical diode turn-off in IGCT circuit.
ABB Semiconductors offers a wide range of fast recovery, Features:

low loss diodes such as snubber, clamping and free- Free-wheeling diodes
wheeling diodes in various configurations to enable full Clamp and snubber diodes
performance of the IGCTs, IGBTs and GTOs in demanding Snubbered types
applications. Unsnubbered types
Soft recovery
Fast recovery diodes, though an integral part of inverter High SOA
design, have seldom received the same attention as turn-off Cosmic ray resistance capability
devices such as IGBTs, IGCTs or GTOs. As a result, snubber,
clamp, neutral-point clamping (NPC) and free-wheeling diodes Benefits:
(FWDs) have too often limited optimal equipment design. high operating temperature range up to 140 C
Recognizing this and the growing trend to eliminate voltage optimized forward and reverse recovery characteristics
snubbers on semiconductors, ABB has developed a full range excellent softness and enhanced SOA
of fast diodes offering enhanced safe operating areas (SOA) cosmic radiation withstand rating
and controlled (soft) recovery at very high di/dt and dv/dt press-pack devices
levels. The growing demand for switching capability (ratings)
and not just recovery charge or losses (characteristics) Applications
imposes new constraints on diode design and production Fast diodes of a given blocking voltage and silicon wafer
test equipment to ensure cost-effective delivery of robust diameter are designed using five basic variables: resistivity,
and reliable components. In contrast to turn-off devices, thickness, uniform lifetime control, profiled lifetime control
thyristors and diodes have traditionally been tested for their and emitter efficiency. Combining these variables allows
characteristics only and classified accordingly. New genera- diodes to meet the requirements of five different commutation
tions of high-performance fast diodes, as 5SDF 11H4505, modes encountered in voltage source and current source
...20L4520 / 21 and 28L4520 / 21, are now tested for inverters (VSIs and CSIs). These are defined in table 1. One of
their dynamic characteristics and ratings on production test the basic principles influencing the nature of a commutation
equipment that accurately reproduces the main commutation is the origin of the di/dt. There are two types of commutation:
modes required of todays fast diodes. The fast diodes 5SDF
20L4521 and 28L4521 have been developed to operate safely
in power electronic circuits employing IGBT and IEGT press-
packs, where di/dts up to 5 kA/s are especially required.

inductive commutation resistive commutationn
whereby the active switch is considered perfect whereby the active switch is considered as a time-dependent
(eg a thyristor) and an inductance determines di/dt resistor (eg a transistor) and this controls di/dt.
t1
L L
S1
t1 R,
VR IF VR
IF
DUT
DUT
Category Application Snubber type Commutation characteristics Required diode characteristics
l FWD and NPC diodes for GTOs RCD inductive uniform lifetime
and IGCTs in low frequency VSIs unclamped high cosmic ray resistance
snubbered capability
low dv/dt low V FM
ll Snubber diode in RCD circuits R inductive profiled lifetime

unclamped soft recovery at low lF
snubbered
lll Snubber diodes in Undeland, none resistive profiled lifetime

Marquardt and McMurray VSIs unclamped soft recovery at low lF
Clamp diodes unsnubbered
lV Commutation diodes in CSIs RC inductive profiled lifetime

High frequency series-connected unclamped medium cosmic ray resistance
IGCTs snubbered capability

V FWD and NPC diodes in none inductive profiled lifetime
snubberless high frequency VSIs clamped high cosmic ray withstand
high dv/dt capability
high SOA
soft recovery at low lF
Cosmic ray resistance capability The snubber and clamp diodes, however, due to their infre-
An important parameter for the rating of any semiconductor quent exposure to the DC link (duty cycle of approximately
in a converter is the voltage to which it is exposed. This 5 %), would be better served with diodes of lower DC rating
has two reasons: the stability of the leakage current at rated (thinner silicon), thus endowing them with superior dynamic
temperature and the potential failures provoked by ionizing properties (fast forward and reverse recovery, low losses,
cosmic particles events whose probability of occurrence no snap-off). For further information see application note
increases exponentially with field strength but only linearly 5SYA2061 Failure Rates of Fast Recovery Diodes due to
with voltage duty cycle. The various functions within power Cosmic Rays.
conversion equipment may be exposed to different voltages
and duty cycles even though the peak voltages might be the
same. Thus, an inverter containing 4.5 kV GTOs, free-whee-
ling diodes, snubber diodes and clamp diodes operating from
a 2.8 kV DC link, would require that the GTOs and snubber
diodes have a 2.8 kV DC rating.

7. Rectifier diodes
ABB Semiconductors reliable high-power rectifier

diodes are first choice in many demanding applications
in industry and traction.
ABB offers two families of high-power rectifier diodes,

standard rectifier diodes and avalanche diodes, both with
the following features:
Reverse repetitive voltage from 1,700 V to 6,000 V
High average forward current rating from 700 A to 7,400 A
Excellent surge current capabilities up to 87 kA
Operating temperature from -40 C to 190 C
High current handling capabilities
Diodes for parallel or series connection available
Hermetically sealed press-pack devices
Standard rectifier diodes

Optimized for line frequency and low forward losses.
Applications:
Input rectifiers for large AC-drives
Aluminum smelting and other metal refining
Rectifier traction substations
Avalanche diodes
Self-protected against transient over-voltages, offering
reduced snubber requirements and maximum avalanche
power dissipation.
Applications:
Input rectifiers in traction converters
High voltage power rectifiers

8. Welding diodes
has been developed. They offer the following features:

high operating frequency up to 10 kHz
high operating temperature up to 190 C
high current capability combined with excellent
verse recovery characteristics
available in standard or housing-less versions
ABB Semiconductors has accumulated impressive exper- excellent surge current ratings
tise in the design and manufacturing of rectifier diodes very low thermal resistance
for high-current-resistance welding machines. The diodes press-pack devices
operate at frequencies beyond 1 kHz with welding currents
over 10 kA. Despite these severe conditions, a load cycle Load cycling capability and welding current
capability of millions of cycles, corresponding to years of The load cycling capability of the welding diodes is crucial for
device operation, is achieved. the choice of application components. Each welding cycle
represents a load cycle for the diode used in the application.
ABB has been cooperating with most of the major welding The load cycling capability is determined by the temperature
equipment manufacturers for years. Through this cooperation, swing the diode undergoes during the cycle. To keep
ABB has gathered great experience in the utilization of the temperature swing as low as possible during the welding
diodes to reach optimal reliability and electrical performance. cycle, the diodes must be designed for lowest possible
The product range of ABB welding diodes (WD) includes losses and thermal impedance.
encapsulated, hermetically sealed WDs as well as housing-
less welding diodes (HLWD) in different sizes and ratings. Usually, the standard diode specifications do not provide
manufacturers with specific information on rectifier diodes
Encapsulated and hermetically sealed useful for a correct rating of a welding machine operating
The semiconductor diode chips are alloyed to a molybdenum at a given duty cycle and cooling conditions. The diode
disk. Due to the low voltage rating of 200 or 400 V only, it is lifetime dependence on the junction to heat sink temperature
possible to use thin silicon to reduce the conduction losses excursion, Tjh, is an example of this data deficiency. Figure 1
of the devices. The silicon-molybdenum disk is placed inside
the hermetic housing between two copper electrodes. Since
the requirements for air strike and creepage distance are
low, thin housings with low thermal resistance are used. An
added advantage is the small size and low weight of WDs,
a welcome feature, eg for welding equipment mounted on a
robot arm in the automotive industry.
Housing-less
The housing-less welding diodes are constructed with a
reduced number of layers to improve their thermal perfor-
mance. In HLWDs, the silicon chips are covered by a
copper electrode on the cathode side, which works as a
mechanical buffer, the anode side is the hard molybdenum
disk, which serves as a HLWD case. Although HLWDs Fig.1 Achievable load cycling capability of welding diodes produced in ABB
are more susceptible to environmental conditions, their Ltd. Semiconductors, as a function of diodes junction to heat sink temperature
excursion, Tjh
advantages are higher current densities, lower weights and
geometric sizes compared to WDs.
demonstrates the number of load cycles as a function of T jh
Medium- and high-frequency welding diodes obtained experimentally in collaboration with welding equip-
The medium-frequency welding diodes can operate at ment manufacturers. The dependence is valid for the whole
frequencies up to 7 kHz. However, their optimal and reliable welding diode product range. The lifetime curve indicates how
frequency range is up to 2 kHz. To meet the demands many cycles it is possible to reach in case of right mounting
of higher frequencies up to 10 kHz, a new group of high and proper cooling of diodes under test. Since the experiment
frequency welding diodes with high current capabilities is time consuming, the number of tested devices is limited.
combined with excellent reverse recovery characteristics This fact could slightly affect the accuracy of the lifetime trend.

Thyristor press-packs
ABB offers a full range thyristors including

Phase control thyristors (PCTs), from 1,600 to 8,500 V and 350 to 5,490 A.
Bi-directionally controlled thyristors (BCTs) from 2,800 to 6,500 V and
3,120 to 5,840 A.
Fast switching and reverse conducting thyristors from 1,200 to 3,000 V and
360 to 2,667 A.
Their field of applications ranges from kW DC-drives and MW rated load

commutated frequency converters to GW converters for HVDC transmission.
Power maps
8500 V Phase control
Bi-directional
6500 V
Phase control
Bi-directional
5200 V
Phase control
Bi-directional
4200 V
Phase control
Bi-directional
2800 V
Phase control
1600 V Phase control Inom (A)

0 1000 2000 3000 4000 5000 6000 7000
Phase control thyristors (PCT) and bi-directional controlled thyristors (BCT)

3000 V Standard
2500 V Reverse conducting
2400 V Medium frequency
Reverse conducting
2000 V Medium frequency
Standard
Medium frequency
1400 V
Standard
Medium frequency
1200 V
Standard I nom (A)
0 500 1000 1500 2000 2500 3000
Fast thyristors

9. Phase control and bi-directionally
controlled thyristors (PCT, BCT)
The bi-directionally controlled thyristor

Since many medium and high voltage applications use anti-
parallel connected thyristors as AC controllers, ABB has
introduced the bi-directionally controlled thyristor (BCT) which
consists of two monolithically integrated antiparallel thyristor
functions on one silicon wafer. The two thyristor halves are
individually triggered and have a separation region enabling
the design of high voltage devices with the dynamic capability
of discrete devices. Figure 1 shows a cross-section of the
BCTs silicon wafer.
ABB Semiconductors phase control thyristor has been

the backbone of the high-power electronics industry
since its introduction almost 50 years ago. Its field of
application ranges from kW DC-drives and MW rated load
commutated frequency converters to GW converters for
HVDC transmission.
Due to the growing demand for energy efficiency, the thyristor

remains at the heart of much of the equipment needed for Fig. 1 Cross-section of a BCT.
energy transmission and distribution, as it allows the best
performance in terms of cost, reliability and efficiency.
The BCT is designed, manufactured and tested using
ABB was the first company to introduce 6 thyristor products the same philosophy, technology and equipment as the
for HVDC applications and offers the most complete range well-established PCT, thus reaching the same levels of
of high-power thyristors. New thyristor products continue to performance and reliability. This enables manufacturers
be developed with focus on minimizing overall losses and of equipment for applications such as
maximizing the power rating of the device. SVC
4-quadrant DC-drives
ABBs PCT product range includes press-pack devices soft starters
with ratings of 1,600 V 8,500 V and 350 A 6,100 A used
in demanding applications such as HVDC, FACTS and to reduce part count and equipment size without jeopardizing
DC-drives. These components have set benchmark reliability reliability and performance by introducing the BCT instead
records over many years. of a conventional PCT. Examples show volume improvements
and part count reductions for equipment with BCTs in the
magnitude of 25% compared with equally rated PCT solutions.

BCT product range includes two wafer sizes available in This is in strong contrast to real-world applications where
three different housings with ratings of 2,800 V 6,500 V the junction temperature may indeed reach a maximum value
and 3,120 A 5,840 A. The ratings I TSM, and Rthjc are given of 125 C but the case temperature never exceeds, say,
for one thyristor-half of the device. IRMS is the rms-current 110 C, allowing leakage current losses to be cooled away
for a device operating in an AC-switch application. across the temperature gradient between junction and case.
BCT designs offer considerable volume and part count A more realistic method of measuring power semiconductors
reductions over conventional PCTs. Table 1 summarizes is to have a sinusoidal 50 or 60 Hz wave of peak value VDWM/
expected improvements by application and power level and VRWM and to superimpose a narrow pulse of amplitude VDRM
table 2 shows the table of replacement of PCTs by BCTs. as per figure 2. This pulse corresponds to repetitive voltage
peaks as typically caused by commutation transients (though
the RC-circuit limiting them should be designed to give a peak
Application Power level Anticipated Anticipated voltage below rated V DRM and VRRM).
average volume average parts
improvement (*) count reduction (*)
DC-drive 800 kw 30% 30%

DC-drive 2000 kw 30% 25%
Soft starter 250 kw 25% 20%
Soft starter 450 kw 30% 20%
SVC 50 mVAr 35% 35%
Tab. 1 Summary of anticipated advantages when replacing a PCT
solution with a BCT solution.
(*) Compared to conventional PCT solutions.
Replacement of PCTs by BCTs

5STB 24Q2800 replaces two 5STP 24H2800
5STB 24N2800 replaces two 5STP 24H2800
5STB 18N4200 replaces two 5STP 18H4200
5STB 17N5200 replaces two 5STP 17H5200 Fig. 2 Voltage definitions for high voltage PCTs and BCTs.
5STB 13N6500 replaces two 5STP 12K6500
5STB 25U5200 replaces two 5STP 25L5200
5STB 18U6500 replaces two 5STP 18M6500 By using this method, the voltage capability is tested at
Tab. 2 One BCT replaces two PCTs. application-like conditions and in conformance with internatio-
nal standards, without thermal runaway. This method of rating
is applied to ABBs high-voltage thyristors, VDRM/VRRM > 4,500 V.
Voltage rating definitions In the datasheets, the level for VDWM/VRWM is selected as
The development of high-voltage thyristors has lead to the maximum expected working voltage for a device chosen
increased values of dissipated power in the off-state (due to according to the recommendations in Application Note
higher voltages) even if the leakage currents themselves have 5SYA2051 Voltage ratings for high power semiconductors.
remained at similar levels to devices with lower blocking
capability. This can cause problems when such devices are
characterized and measured in outgoing inspection at ele-
vated temperature (eg 125 C) because the whole device is
heated to a constant temperature (not just the junction) and
no temperature gradient exists to sink the generated heat
away from the junction, resulting in thermal runaway during
testing. Here the applied voltage causes a leakage current
and the product (V x I) heats the device. As the device gets
hotter, leakage current increases exponentially and so does
the heating. If the cooling of the device is not adequate, the
device will get progressively hotter and will ultimately fail.

10. Fast thyristors
Standard fast thyristors

Fast switching thyristors feature an amplifying gate structure
and a special lifetime control technology. Their optimized
design ensures low on-state voltage drop and switching
losses, low reverse recovery and high di/dt performance.
Devices for serial or parallel connection are available on
request.
Medium frequency fast thyristors

Medium frequency fast thyristors are fast thyristors with an
extended distributed gate technology. They feature a special
cathode and gate design for effective operation in the
medium frequency range up to 10 kHz.
Reverse conducting fast thyristors

The reverse conducting fast thyristors feature a monolithically
ABB offers three lines of fast switching thyristors: integrated free-wheeling diode. Several types of this thyristor
the standard fast thyristor, the medium frequency fast are available as spare and replacement parts.
thyristor and the reverse conducting fast thyristor.
Applications
All fast switching thyristor types feature optimized and Fast thyristors are typically used in induction heating resonant
very short turn-on and turn-off times, large critical rates inverters, DC chopper drives, UPS and pulse power, to name
of on-state current rise, high surge current ratings and a few.
a wide operating temperature range. Further features are:
Blocking voltage from 1,200 V to 3,000 V
Average forward current from 360 A to 2,700 A
Turn-off time from 8 to 125 microseconds (s)
Critical rate of rise of on-state current 800 A/s
High surge current ratings up to 36 kA
Operating temperature from -40 C to 125 C

Induction smelting, typical application for fast thyristors.

IGCT and GTO press-packs
ABB Semiconductors IGCT portfolio offers both symmetric, asymmetric and

reverse blocking IGCTs in the voltage and current ranges of 4,500 to 6,500 V and
1,100 to 5,000 A, respectively. GTOs are offered as symmetric and asymmetric
types at 2,500 or 4,500 V and between 600 and 4,000 A.
The number of applications featuring IGCTs is manifold: medium voltage drives

(MVDs), co-generation, wind power converters and STATCOMs. GTOs are typically
used in different traction and industrial applications.
Power maps
Reverse blocking
6500 V
Asymmetric
Reverse conducting
5500 V
Asymmetric
Reverse conducting
4500 V
Asymmetric I nom (A)
0 1000 2000 3000 4000 5000 6000
Integrated gate-commutated thyristors (IGCT)
Symmetric
4500 V Asymmetric fine pattern
Asymmetric
Symmetric
2500 V
Asymmetric I nom (A)
0 500 1000 1500 2000 2500 3000 3500 4000
Gate turn-off thyristors (GTO)

11. Integrated gate-commutated
thyristors (IGCT)
IGCTs are available as reverse conducting (RC), reverse

blocking (symmetrical) and asymmetric devices. The low
losses allow hard-switched operating frequencies of up
to 600 Hz for 6.5 kV devices and 1 kHz for 4.5 kV devices
in the steady state and over 5 kHz in burst mode.
Figure 2 illustrates the basic IGCT voltage source inverter (VSI)

topology. It can be seen that diode commutation is controlled
by the inductance L. The free-wheel circuit of figure 2 minimizes
the turn-on energy in the semiconductor by storing it in L.
The inductance is the most logical fault limitation technique
in the event of catastrophic failure since, as opposed to
resistors and fuses, it has the benefit of already being there.
The press-pack construction of the IGCT, combined with the
ABB Semiconductors IGCTs are used in a multitude inductance, makes the system resistant to explosion, even
of applications due to their versatility, efficiency and when the devices surge rating is exceeded.
cost-effectiveness. With their low on-state voltage, they
achieve the lowest running costs by reaching inverter
efficiencies of 99.6 percent and more.
The IGCT is a gate-controlled turn-off switch, which turns off

like a transistor but conducts like a thyristor with the lowest
conduction losses. Figure 1 shows turn-off at 3,000 A.
GCTs are the only high power semiconductors to be supplied
already integrated into their gate units. The user thus only
needs to connect the device to a 28 40 V power supply and
an optical fiber for on/off control. Because of the topology in
which it is used, the IGCT produces negligible turn-on losses.
This, together with its low conduction losses, enables opera- Fig. 2 Basic IGCT inverter circuitand auxiliary emitter
tion at higher frequencies than formerly obtained by high
power semiconductors.
Turn-off dv/dt is also not gate-controlled, but programmed at
the device manufacturing stage by anode design and lifetime
engineering. The absence of dv/dt and di/dt control functio-
nality simplifies the gate-unit design and allows a high degree
of standardization. Some sixty publications exist on the use
of IGCTs in many applications. These can be downloaded
from the ABB Website www.abb.com/semiconductors.
Fig. 1 IGCT turn-off exhibits same waveform and losses (Eoff) as transistor

Applications
The integrated gate-commutated thyristor is the power-
switching device of choice for demanding high-power
applications such as:
MVD (medium voltage drives)
Marine drives
Co-generation
Wind power converters
STATCOMs
DVRs (dynamic voltage restorers)
BESS (battery energy storage systems)
SSB (solid state breakers)
DC traction line boosters
Traction power compensators
Interties
Outlook
The expansion of power electronics into the new fields of
energy management, renewable energy sources and cogene-
ration is driving semiconductor requirements towards higher
frequency, higher voltage and higher efficiency while increa-
sing demands for reliability and lower costs. The IGCT is
capable of still higher currents, voltages and frequencies
without series or parallel connection and the first products are
introduced as High Power Technology devices. This latest
family of IGCTs exhibit up to 30 % higher turn-off capability
compared to standard devices.
Currently in development are technologies to increase the

rated temperature for a number of devices and to increase
the current rating with larger silicon diameters.
Within 10 years of its introduction, the IGCT has established

itself as the power device of choice for high power at
high voltage by meeting the demands of a growing power
electronic market. Single inverters of over 15 MVA can now
be realised without series or parallel connection achieving
the highest inverter power densities in the industry.

12. Gate turn-off thyristors (GTO)
All ABB GTOs are press-pack devices. They are pressed with
a relatively high force onto heat sinks, which also serve as
electrical contacts to the power terminals.
ABB offers a broad portfolio of both asymmetric and symme-

tric GTOs with proven field reliability in various traction and
industrial applications.
Asymmetric GTOs
Asymmetric GTOs are divided in two categories: buffer layer
and standard. Buffer layer GTOs have exceptionally low
on-state and dynamic losses. Fine pattern types (5SGF) are
optimized for fast switching and transparent emitter (5SGT)
for low on-state losses. The Standard GTOs have excellent
trade-off between on-state and switching losses.
Symmetric GTOs
Symmetric GTOs have low on-state and turn-off losses,
One might be assuming that the rapid advance of the full reverse voltage, low gate trigger current and are suitable
IGBT would spell an equally rapid end to the GTO era. for drives and traction applications.
The demand for these devices, however, is still strong
today.
Production of GTOs commenced in the mid 1980s. A GTO

is a thyristor that can be turned off by applying a current to
the gate in the reverse direction to that required to turn it on.
GTOs are optimized for low conduction losses. The typical

on-off switching frequency is in the range of 200 500 Hz
for most applications. GTOs are, by nature, relatively slow
switches.
Typical transition times from on to off state and vice versa are
in a range of 10 to 30 microseconds. All GTOs require pro-
tective networks called snubbers for turn-on and turn-off.
The turn-on snubber circuit, in essence an inductor, limits the
rate of current rise. For turn-off, the GTO requires a device
that limits the rate of voltage rise, in essence a capacitor.

13. Test systems
ABB Switzerland Ltd., Semiconductors, designs

and manufactures test systems for high power semi-
conductors.
With more than 30 years of experience, ABB designs and

manufactures CE compliant customized test systems, cover-
ing the entire range of high power semiconductors. Presently,
over 70 test systems are in operation for routine and reliability
measurements of power semiconductors. Some test systems
have been in operation for more than 15 years.
Thanks to our close proximity to semiconductor development,

application and production, we are in an ideal position to
provide test systems to meet customers needs. Automation,
efficient handling and safety are among the designed-in
features of the test equipment. Automated IGBT and diode dies test system
ABB recently installed the next generation of IGCT test system

in production, able to test devices with the highest current
and voltage ratings on the market.
Dynamic IGCT, GTO and diode test system
Power semiconductor test systems

ABB offers static and dynamic test systems for diodes, phase
control thyristors (PCTs), bi-directionally controlled thyristors
(BCTs), switching and reverse conducting thyristors, gate turn- Baseplate flatness tester. Mechanical measurement under pressure
off thyristors (GTOs), integrated gate-commutated thyristors (resolution up to 0.1 micrometer)
(IGCTs), as well as insulated gate bipolar transistor (IGBT)

dies, substrates, submodules and modules.
Features:
Our test systems cover the range of up to 14 kilovolts and Available for various application environments (production,
10 kiloamperes and use state of the art configurable stray laboratory, failure analysis, research and development)
inductances down to 60 nanohenry. During testing, the clamped Highest quality assurance during engineering and manu-
device can be precisely heated up to 200 C for production facturing
systems or cooled down to -40 C in an environmental Safe operator handling
chamber for engineering systems. The clamping units can Remote and on-site service
handle devices up to 240 millimeter in diameter and can Automated handling
apply a clamping force of up to 240 kilonewton. European standard compliance

Test systems
Circuit-commutated turn-off time

ABB offers the following
specialized solutions
Blocking voltage AC or DC
On-state, forward voltage
Reverse recovery charge

Gate characteristics
Turn-on / turn-off
Critical dV/dt
Vcesat / Vpinch-off
Bipolar test systems
Thyristor and diode static/dynamic X X X X X X
Gate turn-off thyristor and diode static X X X X
Gate turn-off thyristor and diode dynamic X X X
IGBT test systems
IGBT and diode dies static X X X
IGBT and diode substrates static/dynamic X X X X X
IGBT and diode modules static X X X
IGBT and diode modules dynamic X X
Baseplates flatness
Reliability test systems Auxiliary unit

High temperature reverse bias Clamping unit
Intermittent operating life Capacitor discharge unit
Surge current Preheating unit
Programmable IGBT and thyristor gate units
Automation Data acquisition and parameter extraction units
Our test systems are designed for easy integration into
automated handling equipment. Its software is compatible to
commercial control systems as manufacturing execution
systems (MES) and computer-aided quality assurance (CAQ).
Substrate handling Die handling

Documentation
Product catalog, application notes and data sheets as well as SEMIS

ABBs semiconductor online simulation tool are available on ABBs
website www.abb.com/semiconductors.
Additional documentation required for the reliable application of ABBs power

semiconductors is available on the same site. An overview is given here.
IGBT dies and modules

Document title Document number
Mounting instructions for StakPaks 5SYA 2037
Mounting instructions for HiPak modules 5SYA 2039
Failure rates of HiPak modules due to cosmic rays 5SYA 2042
Load-cycling capability of HiPak IGBT modules 5SYA 2043
Thermal runaway during blocking 5SYA 2045
Voltage ratings of high power semiconductors 5SYA 2051
Applying IGBTs 5SYA 2053
IGBT diode safe operating area 5SYA 2057
Surge currents for IGBT diodes 5SYA 2058
Applying IGBT and diode dies 5SYA 2059
Thermal design and temperature ratings of IGBT modules 5SYA 2093
Paralleling of IGBT modules 5SYA 2098
Diodes
High current rectifier diodes for welding applications 5SYA 2013
Design of RC snubbers for phase control applications 5SYA 2020
High power rectifier diodes 5SYA 2029
Mechanical clamping of press-pack high power semiconductors 5SYA 2036
Field measurements on high power press-pack semiconductors 5SYA 2048
Failure rates of fast recovery diodes due to cosmic rays 5SYA 2061
Applying fast recovery diodes 5SYA 2064
Thyristors
Bi-directionally controlled thyristors 5SYA 2006
Design of RC snubbers for phase control applications 5SYA 2020
Gate-drive recommendations for phase control and bi-directionally controlled thyristors 5SYA 2034
Voltage definitions for phase control and bi-directionally controlled thyristors 5SYA 2049
Switching losses for phase control and bi-directionally controlled thyristors 5SYA 2055
Surge currents for phase control thyristors 5SYA 2102

IGCTs
Applying IGCT gate units 5SYA 2031
Applying IGCTs 5SYA 2032
Failure rates of IGCTs due to cosmic rays 5SYA 2046
GTOs
Environmental specifications
Storage of diodes, PCTs, GTOs 5SZK 9104
Transport of diodes, PCTs and GTOs 5SZK 9105
Operation of pressure contact IGCTs 5SZK 9107
Storage of IGCTs 5SZK 9109
Transport of IGCTs 5SZK 9110
Storage of HiPaks 5SZK 9111
Transport of HiPaks 5SZK 9112
Operation of industry HiPaks 5SZK 9113
Handling, packing and storage conditions for sawn wafer dies and bare dies 5SZK 9114
Operation of industry press-pack diodes, PCTs and GTOs 5SZK 9115
Operation of industry press-pack diodes, PCTs and GTOs 5SZK 9116
Operation of traction HiPaks 5SZK 9120

Notes
Contact us
ABB Switzerland Ltd Note
Doc. Number 5SYA 2109-01 March 2016

Semiconductors We reserve the right to make technical changes
or to modify the contents of this document
Fabrikstrasse 3 without prior notice.
CH-5600 Lenzburg We reserve all rights in this document and the
information contained therein. Any reproduction
Switzerland or utilisation of this document or parts thereof for
Tel: +41 58 586 14 19 commercial purposes without our prior written
Fax: +41 58 586 13 06 consent is forbidden.
Any liability for use of our products contrary to the
E-Mail: [email protected] instructions in this document is excluded.
www.abb.com/semiconductors
ABB s.r.o.
Semiconductors
Novodvorska 1768/138a
142 21 Praha 4
Czech Republic
Tel: +420 261 306 250
Fax: +420 261 306 308
E-Mail: [email protected]
www.abb.com/semiconductors

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Power semiconductors

Product brochure 2016

4 IGBT and diode dies

8 Medium-power IGBT modules

10 High-power IGBT modules

30 IGCT and GTO press-packs

2 Power semiconductors | Product broschure 2016

ABB is a leading supplier of power semiconductors with production facilities in

For information thats more technical please contact us or see our

All of the above mentioned is available for download on our website

Product broschure 2016 | Power semiconductors 3

IGBT and diode dies

4 Power semiconductors | Product broschure 2016

The newly introduced 1,700 V SPT++ chipset is the worlds

Figure 1 shows the basic difference between SPT+ and SPT++.

ABB Semiconductors has a well-established reputation in the

ABBs power semiconductor BiMOS chipsets, ie IGBTs and

Fig. 1 SPT+ planar IGBT enhanced carrier profile

Product broschure 2016 | Power semiconductors 5

150 The diode

Fig. 2 On-state curves of the 150 A 1,700 V SPT+ IGBT

Figure 3 shows the turn-off of a 150 A 1700 V SPT ++ IGBT

6 Power semiconductors | Product broschure 2016

150 Detailed technical information

Fig. 5 VF curve of a 150 A 1,700 V FSA diode

Fig. 6 Reverse recovery of a 1,700 V 150 A diode

Product broschure 2016 | Power semiconductors 7

Variable speed drives, power supplies, power quality, uninterruptible power

Medium-power IGBT modules

8 Power semiconductors | Product broschure 2016

Typical applications include:

IGBT module technology

Feature Customer value

Pre-bowed and stamped baseplate

Medium power module lines

Product broschure 2016 | Power semiconductors 9

HiPak, StakPak and LinPak

10 Power semiconductors | Product broschure 2016

The 3,300 V / 2 x 450 A LinPak offers a fast and low swit-

The 3,300 V LinPak is an enabler for more reliable, efficient

Product broschure 2016 | Power semiconductors 11

1,700 V LinPak turn-on switching curves

LinPak with basic configuration

With the help of these additional terminals the internal

LinPak with additional auxiliary emitter

12 Power semiconductors | Product broschure 2016

ABB Semiconductors HiPak modules are a family of

ABBs HiPak modules are available in three standard isolation

(soft punch through) chip technology, which combines low

Product broschure 2016 | Power semiconductors 13

Figure 2 shows the extremely high turn-off ruggedness of the

DC-link voltage of 4,500 V at a junction temperature of 125 C.

14 Power semiconductors | Product broschure 2016

Product broschure 2016 | Power semiconductors 15

connections with redundancy; in such applications, additional

StakPak is a family of high-power IGBT press-pack

Although the insulated module is the most common package

Since IGBT modules feature multiple parallel chips, there is