3-NEET Webinar Slides Henager
3-NEET Webinar Slides Henager
3-NEET Webinar Slides Henager
Description of Project
Explore the development of a dense SiC-alloy with Ti3SiC2
having high thermal conductivity, high strength, and good
fracture toughness
SiC-alloy based on displacement reactions used for SiC joining
TiC + Si = Ti3SiC2
Novel use of textured Carbon nanotube (CNT) mats for thermal
conductivity and fracture toughness
Nano and micro imprinting techniques
Nanocrystalline SiC from polycarbosilane polymers, SiC-filled and
unfilled
We are learning to create gelled powder mixtures and process them into
SiC-based alloys with near full density and high thermal conductivity
Hot-press in argon at 1800C for 2 hours at 20 MPa for densification and
crystallization
Characterization
Density
Optical Microscopy
Thermal conductivity
SEM
XRD
EMTA Models
Eshelby-Mori-Tanaka approach to material models with
inclusions (pores, fibers, etc.)
Mechanics solutions
Thermophysical properties
EMTA Results
EMTA Results
SiC-alloy Synthesis
Thermal Conductivity
Sample
Hexoloy
CNT-015
052-SLMS30
Temperature (C )
Avg (W/(mK))
Avg (W/(mK))
Avg (W/(mK))
25
109.51
50.20
56.1
100
92.41
43.10
49.71
200
83.51
44.20
46.47
300
77.13
44.80
41.99
400
74.07
46.60
39.11
500
70.78
44.62
38.99
14
15
Em ( D) = Em0 (1 D)
Dcr = 1
16
Em ( f )
= 0.2
Em0
0 wt%
0.5 wt%
1.5 wt%
3 wt%
5 wt%
78
82 (0%)
90.06 (2.1%)
102.35 (3.4%)
119.19 (11.4%)
78
79.92 (2.5%)
83.71 (9%)
89.32 (9.8%)
96.63 (9.7%)
17
Process window
Crack
Material 1
Material 1
Crack
Material 2
18
Material 2
Boundary condition
u1 =
KI
2
u2 =
19
KI
2
cos( )[ 1 + 2 sin 2 ( )] ,
2
2
2
r
sin( )[ + 1 2 cos 2 ( )]
2
2
2
K IR = k c
Ramachandran et al., J. Am. Ceram. Soc. 74 (1991) 2634
Sarkar & Das, Mater. Sci. Engn. A 531 (2012) 61
21
Conclusions
SiC-alloy processing has two tasks that are making good progress
but have issues remaining to be resolved
Polymer plus powders has gradient and porosity issues to resolve
SiC-alloy microstructure forms as expected
CNT processing more difficult
CNT agglomeration issue
Texturing remains to be done
Density and Kth are promising at this stage