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CC2650MODA
SWRS187A AUGUST 2016 REVISED AUGUST 2016
CC2650MODA SimpleLink Bluetooth low energy Wireless MCU Module

1 Device Overview
1.1
Features
Microcontroller
Powerful ARM Cortex-M3
EEMBC CoreMark Score: 142
Up to 48-MHz Clock Speed
128KB of In-System Programmable Flash
8KB of SRAM for Cache
20KB of Ultra-Low-Leakage SRAM
2-Pin cJTAG and JTAG Debugging
Supports Over-The-Air (OTA) Upgrade
Ultra-Low-Power Sensor Controller
Can Run Autonomous From the Rest of the
System
16-Bit Architecture
2KB of Ultra-Low-Leakage SRAM for
Code and Data
Efficient Code Size Architecture, Placing Drivers,
Bluetooth low energy Controller, IEEE 802.15.4
Medium Access Control (MAC), and Bootloader in
ROM
Integrated Antenna
Peripherals
All Digital Peripheral Pins Can Be Routed to
Any GPIO
Four General-Purpose Timer Modules
(8 16-Bit or 4 32-Bit Timer, PWM Each)
12-Bit ADC, 200-ksamples/s, 8-Channel
Analog MUX
Continuous Time Comparator
Ultra-Low-Power Analog Comparator
Programmable Current Source
UART
2 SSI (SPI, MICROWIRE, TI)
I2C
I2S
Real-Time Clock (RTC)
AES-128 Security Module
True Random Number Generator (TRNG)
15 GPIOs
Support for Eight Capacitive Sensing Buttons
Integrated Temperature Sensor
External System
On-Chip Internal DC-DC Converter
No External Components Needed, Only Supply

Voltage
Low Power
Wide Supply Voltage Range
Operation from 1.8 to 3.8 V
Active-Mode RX: 6.2 mA
Active-Mode TX at 0 dBm: 6.8 mA
Active-Mode TX at +5 dBm: 9.4 mA
Active-Mode MCU: 61 A/MHz
Active-Mode MCU: 48.5 CoreMark/mA
Active-Mode Sensor Controller:
0.4 mA + 8.2 A/MHz
Standby: 1 A (RTC Running and RAM/CPU
Retention)
Shutdown: 100 nA (Wake Up on External
Events)
RF Section
2.4-GHz RF Transceiver Compatible With
Bluetooth low energy (BLE) 4.2 Specification
and IEEE 802.15.4 PHY and MAC
Excellent Receiver Sensitivity (97 dBm for
Bluetooth low energy and 100 dBm for
802.15.4), Selectivity, and Blocking
Performance
Programmable Output Power up to +5 dBm
Pre-certified for Compliance With Worldwide
Radio Frequency Regulations
ETSI (Europe)
IC (Canada)
FCC (USA)
ARIB STD-T66 (Japan)
JATE (Japan)
Tools and Development Environment
Full-Feature and Low-Cost Development Kits
Multiple Reference Designs for Different RF
Configurations
Packet Sniffer PC Software
Sensor Controller Studio
SmartRF Studio
SmartRF Flash Programmer 2
IAR Embedded Workbench for ARM
Code Composer Studio
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2650MODA
1.2
Applications
Building Automation
Medical and Health
Appliances
Industrial
Consumer Electronics
1.3
www.ti.com
Proximity Tags
Alarm and Security
Remote Controls
Wireless Sensor Networks
Description
The SimpleLink CC2650MODA device is a wireless microcontroller (MCU) module that targets
Bluetooth low energy applications. The CC2650MODA device can also run ZigBee and 6LoWPAN and
ZigBee RF4CE remote control applications.
The module is based on the SimpleLink CC2650 wireless MCU, a member of the CC26xx family of costeffective, ultra-low-power, 2.4-GHz RF devices. Very-low active RF and MCU current and low-power mode
current consumption provide excellent battery lifetime and allow for operation on small coin-cell batteries
and in energy-harvesting applications.
The CC2650MODA module contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main
processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. This
sensor controller is good for interfacing with external sensors or for collecting analog and digital data
autonomously while the rest of the system is in sleep mode. Thus, the CC2650MODA device is good for
applications within a wide range of products including industrial, consumer electronics, and medical
devices.
The CC2650MODA module is pre-certified for operation under the regulations of the FCC, IC, ETSI, and
ARIB. These certifications save significant cost and effort for customers when integrating the module into
their products.
The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly
running on a separate ARM Cortex-M0 processor. This architecture improves overall system
performance and power consumption and makes more flash memory available.
The Bluetooth low energy software stack (BLE-Stack) and the ZigBee software stack ( Z-Stack) are
available free of charge.
Device Information (1)
PART NUMBER
CC2650MODAMOH
(1)
PACKAGE
BODY SIZE
MOH (Module)
16.90 mm 11.00 mm
For more information, see Section 9, Mechanical Packaging and Orderable Information.
Device Overview
Copyright 2016, Texas Instruments Incorporated
Submit Documentation Feedback

Product Folder Links: CC2650MODA
CC2650MODA
www.ti.com
1.4
Functional Block Diagram

Figure 1-1 is a block diagram for the CC2650MODA device.
SimpleLinkTM CC2650MOD Wireless MCU Module
32.768-kHz
Crystal
Oscillator
24-MHz Crystal
Oscillator
RF Balun
cJTAG
RF core
ROM
Main CPU:
ADC
ADC
128-KB
Flash
ARM
Cortex-M3
Digital PLL
DSP Modem
8-KB
Cache
20-KB
SRAM
ARM
Cortex-M0
ROM
Sensor Controller
General Peripherals / Modules

I2C
4 32-bit Timers
UART
2 SSI (SPI, Wire, TI)
4-KB
SRAM
Sensor Controller Engine
12-bit ADC, 200 ks/s

I2S
Watchdog Timer
2 Analog Comparators
15 GPIOs
TRNG
SPI / I2C Digital Sensor IF
AES
Temp. / Batt. Monitor

Constant Current Source
32 ch. DMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC-DC converter
Figure 1-1. CC2650MODA Block Diagram
Device Overview

CC2650MODA
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Table of Contents
1
2
3
4
Device Overview ......................................... 1

1.1
Features .............................................. 1
1.2
Applications ........................................... 2
1.3
Description ............................................ 2
1.4
Functional Block Diagram ............................ 3
Revision History ......................................... 4

Device Comparison ..................................... 5
Terminal Configuration and Functions .............. 6
4.1
Module Pin Diagram .................................. 6
4.2
Pin Functions ......................................... 7
Specifications
............................................
5.1
Absolute Maximum Ratings .......................... 8
5.2
ESD Ratings .......................................... 8
5.3
Recommended Operating Conditions ................ 8
5.4
Power Consumption Summary ....................... 8
5.5
General Characteristics
.............................. 9
Antenna ............................................. 10
1-Mbps GFSK (Bluetooth low energy) RX ........ 10
1-Mbps GFSK (Bluetooth low energy) TX ........ 11
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
5.20
5.21
5.22
IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps)

RX ................................................... 11
IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps)
TX ................................................... 12
.............
32.768-kHz Crystal Oscillator (XOSC_LF) ..........
48-MHz RC Oscillator (RCOSC_HF) ...............
32-kHz RC Oscillator (RCOSC_LF).................
ADC Characteristics.................................
Temperature Sensor ................................
Battery Monitor ......................................
Continuous Time Comparator .......................
Low-Power Clocked Comparator ...................
Programmable Current Source .....................
DC Characteristics ..................................
24-MHz Crystal Oscillator (XOSC_HF)
12
12
12
12
13
14
14
14
14
15
15
Thermal Resistance Characteristics for MOH

Package ............................................. 16
...............................
...........................
5.25 Typical Characteristics ..............................
Detailed Description ...................................
6.1
Overview ............................................
6.2
Functional Block Diagram ...........................
6.3
Main CPU ...........................................
6.4
RF Core .............................................
6.5
Sensor Controller ...................................
6.6
Memory ..............................................
6.7
Debug ...............................................
6.8
Power Management .................................
6.9
Clock Systems ......................................
6.10 General Peripherals and Modules ..................
6.11 System Architecture .................................
6.12 Certification ..........................................
6.13 End Product Labeling ...............................
6.14 Manual Information to the End User ................
Application, Implementation, and Layout .........
7.1
Application Information ..............................
7.2
Layout ...............................................
Device and Documentation Support ...............
8.1
Device Nomenclature ...............................
8.2
Tools and Software .................................
8.3
Documentation Support .............................
8.4
Texas Instruments Low-Power RF Website ........
8.5
Low-Power RF eNewsletter .........................
8.6
Community Resources ..............................
8.7
Additional Information ...............................
8.8
Trademarks..........................................
8.9
Electrostatic Discharge Caution .....................
8.10 Export Control Notice ...............................
8.11 Glossary .............................................
5.23
Timing Requirements
5.24
Switching Characteristics
16
16
19
23
23
23
24
24
25
26
26
27
28
28
30
30
31
31
32
32
33
34
34
35
36
36
36
36
36
37
37
37
37
Mechanical, Packaging, and Orderable

Information .............................................. 37
9.1
Packaging Information
..............................
37
2 Revision History
Changes from August 25, 2016 to August 30, 2016
Changed document status to PRODUCTION DATA
Page
............................................................................
Revision History

CC2650MODA
www.ti.com
3 Device Comparison
Table 3-1. Device Family Overview
DEVICE
PHY SUPPORT
CC2650MODAMOH
(1)
Multiprotocol
(1)
FLASH (KB)
RAM (KB)
GPIO
PACKAGE
128
20
15
MOH
The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.
Device Comparison

CC2650MODA
www.ti.com
4 Terminal Configuration and Functions

Section 4.1 shows pin assignments for the CC2650MODA device.
4.1
Module Pin Diagram
Antenna
GND
25 GND
NC
24 NC
GND
23 VDD
DIO 0
22 VDD
DIO 1
DIO 2
DIO 3
DIO 4
21 DIO 14
G1
G2
G3
G4
20 DIO 13
19 DIO 12
18 DIO 11
(Exposed GND Pads)
17 DIO 10
JTAG_TMS 9
13
14
15
16
nRESET
DIO 7
DIO 8
DIO 9
(2)
12
DIO 5/JTAG_TDO
JTAG_TCK
(1)
11
DIO 6/JTAG_TDI
10
The following I/O pins marked in bold in the pinout have high-drive capabilities:
DIO 2
DIO 3
DIO 4
JTAG_TMS
DIO 5/JTAG_TDO
DIO 6/JTAG_TDI
The following I/O pins marked in italics in the pinout have analog capabilities:
DIO 7
DIO 8
DIO 9
DIO 10
DIO 11
DIO 12
DIO 13
DIO 14
Figure 4-1. CC2650MODA MOH Package

(16.9-mm 11-mm) Module Pinout
Terminal Configuration and Functions

CC2650MODA
www.ti.com
4.2
Pin Functions
Table 4-1 describes the CC2650MODA pins.
Table 4-1. Signal Descriptions MOH Package
PIN NAME
PIN NO.
PIN TYPE
DESCRIPTION
DIO_0
Digital I/O
GPIO, Sensor Controller
DIO_1
Digital I/O
GPIO, Sensor Controller
DIO_2
Digital I/O
GPIO, Sensor Controller, high-drive capability
DIO_3
Digital I/O
DIO_4
Digital I/O
DIO_5/JTAG_TDO
11
Digital I/O
GPIO, high-drive capability, JTAG_TDO
DIO_6/JTAG_TDI
12
Digital I/O
GPIO, high-drive capability, JTAG_TDI
DIO_7
14
Digital I/O, Analog I/O
GPIO, Sensor Controller, analog
DIO_8
15
DIO_9
16
DIO_10
17
DIO_11
18
DIO_12
19
DIO_13
20
DIO_14
21
EGP
G1, G2, G3, G4
Power
Ground Exposed ground pad
GND
1, 3, 25
Ground
JTAG_TCK
10
Digital I/O
JTAG TCKC
JTAG_TMS
Digital I/O
JTAG TMSC, high-drive capability
NC
2, 24
NC
Not ConnectedTI recommends leaving these pins floating
nRESET
13
Digital input
Reset, active low. No internal pullup
VDD
22, 23
Power
1.8-V to 3.8-V main chip supply
Terminal Configuration and Functions

CC2650MODA
www.ti.com
5 Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
VDD
Supply voltage
Voltage on any digital pin
Vin
(3)
Voltage on ADC input
MIN
MAX
UNIT
0.3
4.1
V
V
0.3
VDD + 0.3, max 4.1
Voltage scaling enabled
0.3
VDD
Voltage scaling disabled, internal reference
0.3
1.49
Voltage scaling disabled, VDD as reference
0.3
VDD / 2.9
5
dBm
40
85
Input RF level
Tstg
(1)
(2)
(3)
Storage temperature
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to ground, unless otherwise noted.
Including analog capable DIO.
5.2
ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC
JS001 (1)
VESD
Electrostatic discharge
Charged device model (CDM), per JESD22-C101 (2)
(1)
(2)
5.3
1000
RF pins
500
Non-RF pins
500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
Ambient temperature
Operating supply voltage (VDD)
5.4
All pins
UNIT
For operation in battery-powered and 3.3-V systems

(internal DC-DC can be used to minimize power
consumption)
MIN
MAX
40
85
UNIT
C
1.8
3.8
Power Consumption Summary
Tc = 25C, VDD = 3.0 V with internal DC-DC converter, unless otherwise noted
PARAMETER
Icore
Core current
consumption
TEST CONDITIONS
TYP
100
Shutdown. No clocks running, no retention
150
Standby. With RTC, CPU, RAM and (partial)

register retention. RCOSC_LF
Standby. With RTC, CPU, RAM and (partial)

register retention. XOSC_LF
1.2
Standby. With Cache, RTC, CPU, RAM and

(partial) register retention. RCOSC_LF
2.5
Standby. With Cache, RTC, CPU, RAM and

(partial) register retention. XOSC_LF
2.7
Idle. Supply systems and RAM powered.

Active. Core running CoreMark
MIN
Reset. RESET_N pin asserted or VDD below

Power-on-Reset threshold
UNIT
nA
550
1.45 mA +
31 A/MHz
Radio RX
6.2
Radio TX, 0-dBm output power
6.8
Radio TX, 5-dBm output power
9.4
Specifications
MAX
mA

CC2650MODA
www.ti.com
Power Consumption Summary (continued)

Tc = 25C, VDD = 3.0 V with internal DC-DC converter, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) (1)
Iperi
(1)
5.5
Peripheral power
domain
Delta current with domain enabled
20
Serial power domain
Delta current with domain enabled
13
RF core
Delta current with power domain enabled, clock

enabled, RF Core Idle
237
DMA
Delta current with clock enabled, module idle
130
Timers
113
I2C
12
I2S
36
SSI
93
UART
164
Iperi is not supported in Standby or Shutdown.
General Characteristics
Tc = 25C, VDD = 3.0 V, unless otherwise noted

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
FLASH MEMORY
Supported flash erase cycles before
failure
Flash page/sector erase current
100
Average delta current
k Cycles
12.6
mA
Flash page/sector erase time (1)
ms
Flash page/sector size
KB
8.15
mA
Flash write current
Average delta current, 4 bytes at a time
Flash write time (1)
4 bytes at a time
(1)
This number is dependent on flash aging and will increase over time and erase cycles.
Specifications

CC2650MODA
5.6
www.ti.com
Antenna
Tc = 25C, VDD = 3.0 V, unless otherwise noted.

PARAMETER
TEST CONDITIONS
MIN
Polarization
TYP
UNIT
Linear
Peak Gain
2450 MHz
1.26
Efficiency
2450 MHz
57%
5.7
MAX
dBi
1-Mbps GFSK (Bluetooth low energy) RX
RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C,
VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver sensitivity
BER = 10
97
dBm
Receiver saturation
BER = 103
dBm
Frequency error tolerance
Difference between center frequency of the received RF signal

and local oscillator frequency.
Data rate error tolerance
350
350
kHz
750
750
ppm
Co-channel rejection (1)
Wanted signal at 67 dBm, modulated interferer in channel,

BER = 103
dB
Selectivity, 1 MHz (1)
Wanted signal at 67 dBm, modulated interferer at 1 MHz,

BER = 103
7 / 3 (2)
dB

BER = 103
29 / 23 (2)
dB

BER = 103
38 / 26 (2)
dB

BER = 103
42 / 29 (2)
dB
Selectivity, 5 MHz or more (1)

BER = 103
32
dB
Selectivity, Image frequency (1)
Wanted signal at 67 dBm, modulated interferer at image

frequency, BER = 103
23
dB
Selectivity,
Image frequency 1 MHz (1)
Wanted signal at 67 dBm, modulated interferer at 1 MHz from

image frequency, BER = 103
3 / 26 (2)
dB
Out-of-band blocking (3)
30 MHz to 2000 MHz
20
dBm
Out-of-band blocking
2003 MHz to 2399 MHz
dBm
2484 MHz to 2997 MHz
dBm
3000 MHz to 12.75 GHz
dBm
Intermodulation
Wanted signal at 2402 MHz, 64 dBm. Two interferers at 2405

and 2408 MHz respectively, at the given power level
34
dBm
Spurious emissions,
30 MHz to 1000 MHz
Conducted measurement in a 50- single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440
class 2, FCC CFR47, Part 15 and ARIB STD-T-66
71
dBm
Spurious emissions,
1 GHz to 12.75 GHz
Conducted measurement in a 50- single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440
class 2, FCC CFR47, Part 15 and ARIB STD-T-66
62
dBm
RSSI dynamic range
70
dB
RSSI accuracy
dB
(1)
(2)
(3)
10
Numbers given as I/C dB

X / Y, where X is +N MHz and Y is N MHz
Excluding one exception at Fwanted / 2, per Bluetooth Specification
Specifications

CC2650MODA
www.ti.com
5.8
1-Mbps GFSK (Bluetooth low energy) TX
VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Output power, highest setting

Output power, lowest setting
Spurious emission conducted

measurement (1)
(1)
5.9
TYP
MAX
UNIT
dBm
21
dBm
f < 1 GHz, outside restricted bands
43
f < 1 GHz, restricted bands ETSI
58
f < 1 GHz, restricted bands FCC
57
f > 1 GHz, including harmonics
45
dBm
Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) RX
VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver sensitivity
PER = 1%
100
dBm
Receiver saturation
PER = 1%
dBm
Adjacent channel rejection

PER = 1%
35
dB
Alternate channel rejection

PER = 1%
52
dB
Channel rejection, 15 MHz or

more
Wanted signal at 82 dBm, undesired signal is IEEE 802.15.4

modulated channel, stepped through all channels 2405 to
2480 MHz, PER = 1%
57
dB
Blocking and desensitization,

5 MHz from upper band edge
Wanted signal at 97 dBm (3 dB above the sensitivity level),

CW jammer, PER = 1%
64
dB


CW jammer, PER = 1%
64
dB


CW jammer, PER = 1%
65
dB


CW jammer, PER = 1%
68
dB

5 MHz from lower band edge

CW jammer, PER = 1%
63
dB


CW jammer, PER = 1%
63
dB


CW jammer, PER = 1%
65
dB


CW jammer, PER = 1%
67
dB
Spurious emissions,
30 MHz to 1000 MHz
Conducted measurement in a 50- single-ended load.

Suitable for systems targeting compliance with EN 300 328,
EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66
71
dBm
Spurious emissions,
1 GHz to 12.75 GHz
Conducted measurement in a 50- single-ended load.

Suitable for systems targeting compliance with EN 300 328,
EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66
62
dBm
Frequency error tolerance
Difference between center frequency of the received RF

signal and local oscillator frequency
>200
ppm
100
dB
dB
RSSI dynamic range

RSSI accuracy
Specifications

11
CC2650MODA
www.ti.com
5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) TX

VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
Output power, highest setting

Output power, lowest setting
Error vector magnitude
Spurious emission conducted

measurement (1)
(1)
TYP
MAX
UNIT
dBm
21
dBm
At maximum output power
2%
f < 1 GHz, outside restricted bands
43
f < 1 GHz, restricted bands ETSI
58
f < 1 GHz, restricted bands FCC
57
f > 1 GHz, including harmonics
45
dBm
Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
5.11 24-MHz Crystal Oscillator (XOSC_HF) (1)

over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
Start-up time
(3)
MAX
24
Crystal frequency tolerance (2)
(1)
(2)
TYP
40
(3)
UNIT
MHz
40
150
ppm
s
Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per
Bluetooth and IEEE 802.15.4 specification
Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection
5.12 32.768-kHz Crystal Oscillator (XOSC_LF)

over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Crystal frequency
Initial crystal frequency tolerance, Bluetooth
low energy applications
TYP
MAX
32.768
Tc = 25C
Crystal aging
UNIT
kHz
20
20
ppm
-3
ppm/year
5.13 48-MHz RC Oscillator (RCOSC_HF)

PARAMETER
TEST CONDITIONS
MIN
Frequency
TYP
48
Uncalibrated frequency accuracy
1%
Calibrated frequency accuracy (1)
0.25%
Start-up time
(1)
MAX
UNIT
MHz
Accuracy relatively to the calibration source (XOSC_HF).
5.14 32-kHz RC Oscillator (RCOSC_LF)

PARAMETER
TEST CONDITIONS
Calibrated frequency
TYP
32.8
Temperature coefficient
12
MIN
50
Specifications
MAX
UNIT
kHz
ppm/C

CC2650MODA
www.ti.com
5.15 ADC Characteristics

Tc = 25C, VDD = 3.0 V and voltage scaling enabled, unless otherwise noted
PARAMETER
(1)
TEST CONDITIONS
Input voltage range
MIN
TYP
VDD
Resolution
12
Sample rate
Offset
Gain error
DNL (3)
Differential nonlinearity
INL (4)
Integral nonlinearity
Internal 4.3-V equivalent reference
(2)
, 200 ksps,
THD
(1)
(2)
(3)
(4)
(5)
LSB
2.4
LSB
>1
LSB
LSB
10
Bits
11.1
(2)
, 200 ksps,
65
VDD as reference, 200 ksps, 9.6-kHz input tone
69
Internal 1.44-V reference, voltage scaling disabled,

32 samples average, 200 ksps, 300-Hz input tone
71
dB
Internal 4.3-V equivalent reference (2), 200 ksps,

9.6-kHz input tone
60
63

69
Internal 4.3-V equivalent reference (2), 200 ksps,

9.6-kHz input tone
67
72
Internal 1.44-V reference, voltage scaling disabled, 32

samples average, 200 ksps, 300-Hz input tone
73
Conversion time
Serial conversion, time-to-output, 24-MHz clock
50
Current consumption
Internal 4.3-V equivalent reference (2)
0.66
mA
Current consumption
VDD as reference
0.75
mA
Reference voltage
Equivalent fixed internal reference (input voltage

scaling enabled). For best accuracy, the ADC
conversion should be initiated through the TI-RTOS
API to include the gain or offset compensation factors
stored in FCFG1.
SINAD
Signal-to-noise and
and SNDR distortion ratio
SFDR
ksps
9.8

Total harmonic
distortion
(2)
Effective number of bits VDD as reference, 200 ksps, 9.6-kHz input tone

9.6-kHz input tone
UNIT
Bits
200
Internal 4.3-V equivalent reference (2)

9.6-kHz input tone
ENOB
MAX
Spurious-free dynamic
range
dB
dB
clockcycles
4.3 (2) (5)
Reference voltage
Fixed internal reference (input voltage scaling

disabled). For best accuracy, the ADC conversion
should be initiated through the TI-RTOS API to include
the gain or offset compensation factors stored in
FCFG1. This value is derived from the scaled value
(4.3 V) as follows: Vref = 4.3 V 1408 / 4095
1.48
Reference voltage
VDD as reference (Also known as RELATIVE) (input

voltage scaling enabled)
VDD
Reference voltage
VDD as reference (Also known as RELATIVE) (input

voltage scaling disabled)
VDD / 2.82 (5)
Input Impedance
200 ksps, voltage scaling enabled. Capacitive input,

input impedance depends on sampling frequency and
sampling time
>1
Using IEEE Std 1241-2010 for terminology and test methods.

Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24.
For a typical example, see Figure 5-25.
Applied voltage must be within absolute maximum ratings (Section 5.1) at all times.
Specifications

13
CC2650MODA
www.ti.com
5.16 Temperature Sensor

PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
Range
40
UNIT
C
85
Accuracy
Supply voltage coefficient (1)
3.2
C/V
(1)
Automatically compensated when using supplied driver libraries.
5.17 Battery Monitor

PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
50
Range
1.8
Accuracy
UNIT
mV
3.8
13
V
mV
5.18 Continuous Time Comparator

PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Input voltage range
VDD
External reference voltage
VDD
Internal reference voltage
DCOUPL as reference
1.27
Offset
Hysteresis
Decision time
Step from 10 mV to +10 mV
Current consumption when enabled (1)

(1)
mV
<2
mV
0.72
8.6
Additionally, the bias module must be enabled when running in standby mode.
5.19 Low-Power Clocked Comparator

PARAMETER
TEST CONDITIONS
Input voltage range
MIN
TYP
Clock frequency
MAX
VDD
32
UNIT
V
kHz
Internal reference voltage, VDD / 2
1.491.51
1.011.03
0.780.79
Internal reference voltage, DCOUPL / 1
1.251.28
0.630.65
0.420.44
0.330.34
Offset
<2
Hysteresis
<5
mV
<1
clock-cycle
362
nA
Decision time
Step from 50 mV to +50 mV
Current consumption when enabled
14
Specifications
mV

CC2650MODA
www.ti.com
5.20 Programmable Current Source

Tc = 25C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
Current source programmable output range
MIN
TYP
Current consumption
(1)
UNIT
0.2520
0.25
23
Resolution
(1)
MAX
Including current source at maximum

programmable output
Additionally, the bias module must be enabled when running in standby mode.
5.21 DC Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
1.32
1.54
MAX
UNIT
TA = 25C, VDD = 1.8 V

GPIO VOH at 8-mA load
IOCURR = 2, high-drive GPIOs only
GPIO VOL at 8-mA load
IOCURR = 1
IOCURR = 1
0.21
GPIO pullup current
Input mode, pullup enabled, Vpad = 0 V
71.7
GPIO pulldown current
Input mode, pulldown enabled, Vpad = VDD
21.1
GPIO high/low input transition,

no hysteresis
IH = 0, transition between reading 0 and reading 1
0.88
GPIO low-to-high input transition,

with hysteresis
IH = 1, transition voltage for input read as 0 1
1.07
GPIO high-to-low input transition,

with hysteresis
0.74
GPIO input hysteresis
IH = 1, difference between 0 1 and 1 0 points
0.33
2.68
0.33
IOCURR = 1
2.72
IOCURR = 1
0.28
GPIO pullup current
Input mode, pullup enabled, Vpad = 0 V
277
GPIO pulldown current
Input mode, pulldown enabled, Vpad = VDD
113
GPIO high/low input transition,

no hysteresis
IH = 0, transition between reading 0 and reading 1
1.67
GPIO low-to-high input transition,

with hysteresis
1.94
GPIO high-to-low input transition,

with hysteresis
1.54
GPIO input hysteresis
IH = 1, difference between 0 1 and 1 0 points
0.4
0.26
1.32
V
0.32
1.58
V
V
0.32
TA = 25C, VDD = 3.0 V
TA = 25C, VDD = 3.8 V
TA = 25C
VIH
Lowest GPIO input voltage reliably interpreted as a

High
VIL
Highest GPIO input voltage reliably interpreted as a

Low
0.8
0.2
VDD
Specifications

VDD
15
CC2650MODA
www.ti.com
5.22 Thermal Resistance Characteristics for MOH Package

C/W (1)
(2)
AIR FLOW (m/s) (3)
NAME
DESCRIPTION
RJC
Junction-to-case
20.0
RJB
Junction-to-board
15.3
RJA
Junction-to-free air
29.6
RJMA
Junction-to-moving air
25.0
PsiJT
Junction-to-package top
8.8
PsiJB
Junction-to-board
14.8
(1)
(2)
(3)
C/W = degrees Celsius per watt.

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70C is assumed.
m/s = meters per second.
5.23 Timing Requirements

MAX
UNIT
Rising supply-voltage slew rate
MIN
0
NOM
100
mV/s
Falling supply-voltage slew rate
20
mV/s
mV/s
C/s
Falling supply-voltage slew rate, with low-power flash settings (1)

Positive temperature gradient in standby (2)
No limitation for negative

temperature gradient, or
outside standby mode
CONTROL INPUT AC CHARACTERISTICS (3)

RESET_N low duration
SYNCHRONOUS SERIAL INTERFACE (SSI) (4)

System
clocks
S1 (SLAVE) (5)
tclk_per
SSIClk period
S2 (5)
tclk_high
SSIClk high time
0.5
tclk_per
S3 (5)
tclk_low
SSIClk low time
0.5
tclk_per
(1)
(2)
(3)
(4)
(5)
12
65024
For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-F VDD input capacitor (see
Section 7.1.1) must be used to ensure compliance with this slew rate.
Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see
Section 5.14).
TA = 40C to +85C, VDD = 1.7 V to 3.8 V, unless otherwise noted.
Tc = 25C, VDD = 3.0 V, unless otherwise noted. Device operating as slave. For SSI master operation, see Section 5.24.
Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.
5.24 Switching Characteristics

Measured on the TI CC2650EM-5XD reference design with Tc = 25C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
WAKEUP AND TIMING

Idle Active
Standby Active
Shutdown Active
16
Specifications
14
151
1015

CC2650MODA
www.ti.com
Switching Characteristics (continued)

Measured on the TI CC2650EM-5XD reference design with Tc = 25C, VDD = 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
SYNCHRONOUS SERIAL INTERFACE (SSI)
MIN
TYP
MAX
UNIT
(1)
S1 (TX only) (2) tclk_per (SSIClk period)
One-way communication to SLAVE
65024
System
clocks
S1 (TX and RX) (2) tclk_per (SSIClk period)
Normal duplex operation
65024
System
clocks
S2 (2) tclk_high (SSIClk high time)

S3
(1)
(2)
(2)
tclk_low (SSIClk low time)
0.5
tclk_per
0.5
tclk_per
Device operating as master. For SSI slave operation, see Section 5.23.
Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.
S1
S2
SSIClk
S3
SSIFss
SSITx
SSIRx
MSB
LSB
4 to 16 bits
Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement
S2
S1
SSIClk
S3
SSIFss
SSITx
MSB
LSB
8-bit control
SSIRx
MSB
LSB
4 to 16 bits output data
Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
Specifications

17
CC2650MODA
www.ti.com
S1
S2
SSIClk
(SPO = 0)
S3
SSIClk
(SPO = 1)
SSITx
(Master)
MSB
SSIRx
(Slave)
MSB
LSB
LSB
SSIFss
Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1
18
Specifications

CC2650MODA
www.ti.com
5.25 Typical Characteristics

This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the
CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a
single-ended 50- reference plane at the antenna feeding point with Tc = 25C and VDD = 3.0 V, unless otherwise noted.
-95
-93
Sensitivity
Sensitivity
-96
-94
Sensitivity (dBm)
Sensitivity (dBm)
-97
-95
-96
-97
-98
-99
-100
-101
-98
-102
-99
-40 -30 -20 -10
10 20 30 40
Temperature (qC)
50
60
70
-103
-40 -30 -20 -10
80
D004
10 20 30 40
Temperature (qC)
50
-95
70
80
D005
-95
BLE Sensitivity
IEEE 802.15.4 Sensitivity

-96
Sensitivity (dBm)
-96
-97
-98
-99
-100
-97
-98
-99
-100
-101
1.8
2.3
2.8
VDDS (V)
3.3
-101
1.9
3.8
2.4
D006
Figure 5-6. Bluetooth low energy Sensitivity

vs Supply Voltage (VDD)
2.9
VDDS (V)
3.4
D007
-95
Sensitivity
Sensitivity
-95.5
Sensitivity Level (dBm)
-96
-97
-98
-99
-100
-101
2400
3.8
Figure 5-7. IEEE 802.15.4 Sensitivity

-95
Sensitivity Level (dBm)
60
Figure 5-5. IEEE 802.15.4 Sensitivity vs Temperature
Figure 5-4. Bluetooth low energy Sensitivity vs Temperature
Sensitivity (dBm)
-96
-96.5
-97
-97.5
-98
-98.5
2410
2420
2430 2440 2450

Frequency (MHz)
2460
2470
2480
-99
2400
2410
D008
Figure 5-8. IEEE 802.15.4 Sensitivity

vs Channel Frequency
2420
2430 2440 2450

Frequency (MHz)
2460
2470
2480
D009
Figure 5-9. Bluetooth low energy Sensitivity

Specifications

19
CC2650MODA
www.ti.com
Typical Characteristics (continued)
Output power (dBm)
Output Power (dBm)
4
3
2
4
3
2
1
5-dBm Setting
5-dBm Setting
0
-40 -30 -20 -10
10 20 30 40
Temperature (qC)
50
60
70
0
1.8
80
2.3
2.8
VDDS (V)
D010
Figure 5-10. TX Output Power vs Temperature
3.3
3.8
D011
Figure 5-11. TX Output Power vs Supply Voltage (VDD)
16
5-dBm Setting
15
14
13
TX Current (mA)
Output Power (dBm)
6
5
4
3
2
12
11
10
9
8
7
5-dBm setting
-1
2400
2410
2420
2430 2440 2450

Frequency (MHz)
2460
2470
4
1.8
2480
Figure 5-12. TX Output Power

9.5
9
RX Current (mA)
Current Consumption (mA)
10
8.5
8
7.5
7
6.5
6
5.5
5
2
2.25 2.5 2.75
3 3.25 3.5 3.75

Voltage (V)
4.25 4.5
2.4
7
6.9
6.8
6.7
6.6
6.5
6.4
6.3
6.2
6.1
6
5.9
5.8
5.7
5.6
5.5
-40 -30 -20 -10
D014
Figure 5-14. RX Mode Current vs Supply Voltage (VDD)
20
2.2
2.6 2.8
3
VDDS (V)
3.2
3.4
3.6
3.8
D013
Figure 5-13. TX Current Consumption

10.5
4.5
1.75
D012
RX Current
10 20 30 40
Temperature (qC)
50
60
70
80
D015
Figure 5-15. RX Mode Current Consumption vs Temperature
Specifications

CC2650MODA
www.ti.com

12
Active Mode Current Consumpstion (mA)
3.1
TX Current (mA)
10
8
6
4
2
5-dBm Setting
0
-40 -30 -20 -10
10 20 30 40
Temperature (qC)
50
60
70
Active Mode Current

3.05
2.95
2.9
2.85
-40 -30 -20 -10
80
D016
Figure 5-16. TX Mode Current Consumption vs Temperature
50
60
70
80
D006
4
Standby Mode Current
Active Mode Current
3.5
4.5
3
4
Current (uA)
Current Consumption (mA)
10 20 30 40
Temperature (qC)
Figure 5-17. Active Mode (MCU Running, No Peripherals)

Current Consumption vs Temperature
3.5
3
2.5
2
1.5
1
2.5
2
1.8
0.5
2.3
2.8
VDDS (V)
3.3
0
-20
3.8
10
20 30 40 50
Temperature (qC)
60
70
80
D008
Figure 5-19. Standby Mode Current Consumption

With RCOSC RTC vs Temperature
1006.4
11.4
11.2
-10
D007
Figure 5-18. Active Mode (MCU Running, No Peripherals)

Current Consumption vs Supply Voltage (VDD)
Fs= 200 kHz, No Averaging

Fs= 200 kHz, 32 samples averaging
1006.2
11
1006
10.8
ADC Code
Effective Number of Bits
10.6
10.4
10.2
1005.8
1005.6
1005.4
10
1005.2
9.8
1005
9.6
9.4
200 300 500
1000 2000
5000 10000 20000
Input Frequency (Hz)
100000
1004.8
1.8
D009
Figure 5-20. SoC ADC Effective Number of Bits vs Input

Frequency (Internal Reference)
2.3
2.8
VDDS (V)
3.3
3.8
D012
Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input,

Internal Reference)
Specifications

21
CC2650MODA
www.ti.com

10.5
1007.5
ENOB Internal Reference (No Averaging)

ENOB Internal Reference (32 Samples Averaging)
10.4
1007
10.3
10.2
ENOB
ADC Code
1006.5
1006
10.1
10
9.9
1005.5
9.8
1005
9.7
1004.5
-40 -30 -20 -10
10 20 30 40
Temperature (qC)
50
60
70
9.6
1k
80
10k
Sampling Frequency (Hz)
D013
Figure 5-22. SoC ADC Output vs Temperature (Fixed Input,

Internal Reference)
100k
200k
D009A
Figure 5-23. SoC ADC ENOB vs Sampling Frequency

(Input Frequency = FS / 10)
3.5
3
2.5
2
DNL
1.5
1
0.5
0
-0.5
-1
ADC Code
4200
4000
3800
3600
3400
3200
3000
2800
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
-1.5
D010
Figure 5-24. SoC ADC DNL vs ADC Code (Internal Reference)
INL
-1
-2
-3
-4
0
200
400
600
800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200
ADC Code
D011
Figure 5-25. SoC ADC INL vs ADC Code (Internal Reference)

22
Specifications

CC2650MODA
www.ti.com
6 Detailed Description
6.1
Overview
Figure 6-1 shows the core modules of the CC2650MODA device.
6.2
Functional Block Diagram
SimpleLinkTM CC2650MOD Wireless MCU Module
32.768-kHz
Crystal
Oscillator
24-MHz Crystal
Oscillator
RF Balun
cJTAG
RF core
ROM
Main CPU:
ADC
ADC
128-KB
Flash
ARM
Cortex-M3
Digital PLL
DSP Modem
8-KB
Cache
20-KB
SRAM
ARM
Cortex-M0
ROM
Sensor Controller
General Peripherals / Modules

I2C
4 32-bit Timers
UART
2 SSI (SPI, Wire, TI)
I2S
Watchdog Timer
4-KB
SRAM
Sensor Controller Engine
12-bit ADC, 200 ks/s

2 Analog Comparators
15 GPIOs
TRNG
SPI / I2C Digital Sensor IF
AES
Temp. / Batt. Monitor

Constant Current Source
32 ch. DMA
RTC
Time-to-Digital Converter
2-KB SRAM
DC-DC converter
Figure 6-1. CC2650MODA Functional Block Diagram
Detailed Description

23
CC2650MODA
6.3
www.ti.com
Main CPU
The SimpleLink CC2650MODA wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs
the application and the higher layers of the protocol stack.
The CM3 processor provides a high-performance, low-cost platform that meets the system requirements
of minimal memory implementation, and low-power consumption, while delivering outstanding
computational performance and exceptional system response to interrupts.
CM3 features include:
32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications
Outstanding processing performance combined with fast interrupt handling
ARM Thumb-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit
ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the
range of a few kilobytes of memory for microcontroller-class applications:
Single-cycle multiply instruction and hardware divide
Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral
control
Unaligned data access, enabling data to be efficiently packed into memory
Fast code execution permits slower processor clock or increases sleep mode time
Harvard architecture characterized by separate buses for instruction and data
Efficient processor core, system, and memories
Hardware division and fast digital-signal-processing oriented multiply accumulate
Saturating arithmetic for signal processing
Deterministic, high-performance interrupt handling for time-critical applications
Enhanced system debug with extensive breakpoint and trace capabilities
Serial wire trace reduces the number of pins required for debugging and tracing
Migration from the ARM7 processor family for better performance and power efficiency
Optimized for single-cycle flash memory use
Ultra-low-power consumption with integrated sleep modes
1.25 DMIPS per MHz
6.4
RF Core
The RF core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band
circuitries, handles data to and from the system side, and assembles the information bits in a given packet
structure. The RF core offers a high-level, command-based API to the main CPU.
The RF core can autonomously handle the time-critical aspects of the radio protocols (802.15.4 RF4CE
and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources for the user
application.
The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM
Cortex-M0 processor is not programmable by customers.
24

CC2650MODA
www.ti.com
6.5
Sensor Controller
The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals
in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized
CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly
reducing power consumption and offloading the main CM3 CPU.
The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and
typical use cases may be (but are not limited to):
Analog sensors using integrated ADC
Digital sensors using GPIOs and bit-banged I2C or SPI
UART communication for sensor reading or debugging
Capacitive sensing
Waveform generation
Pulse counting
Keyboard scan
Quadrature decoder for polling rotation sensors
Oscillator calibration
The peripherals in the Sensor Controller include the following:
The low-power clocked comparator can be used to wake the device from any state in which the
comparator is active. A configurable internal reference can be used with the comparator. The output of
the comparator can also be used to trigger an interrupt or the ADC.
Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used
as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take
care of baseline tracking, hysteresis, filtering and other related functions.
The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC
can be triggered by many different sources, including timers, I/O pins, software, the analog
comparator, and the RTC.
The Sensor Controller also includes a SPI/I2C digital interface.
The analog modules can be connected to up to eight different GPIOs.
The peripherals in the Sensor Controller can also be controlled from the main application processor.
Table 6-1 lists the GPIOs that are connected to the Sensor Controller.

25
CC2650MODA
www.ti.com
Table 6-1. GPIOs Connected to the Sensor Controller (1)
(1)
6.6
ANALOG CAPABLE
16.9 11 MOH DIO NUMBER
14
13
12
11
10
Up to 13 pins can be connected to the Sensor Controller. Up to eight

of these pins can be connected to analog modules
Memory
The flash memory provides nonvolatile storage for code and data. The flash memory is in-system
programmable.
The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two
4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or
disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled,
the 8KB of cache can be used as a general-purpose RAM.
The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stack
software (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader that
can be used to reprogram the device using SPI or UART.
6.7
Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)
interface.
26

CC2650MODA
www.ti.com
6.8
Power Management
To minimize power consumption, the CC2650MODA device supports a number of power modes and
power-management features (see Table 6-2).
Table 6-2. Power Modes
SOFTWARE-CONFIGURABLE POWER MODES
ACTIVE
IDLE
STANDBY
SHUTDOWN
RESET PIN
HELD
CPU
Active
Off
Off
Off
Off
Flash
On
Available
Off
Off
Off
SRAM
On
On
On
Off
Off
Radio
Available
Available
Off
Off
Off
MODE
Supply System
Current
On
On
Duty Cycled
Off
Off
1.45 mA + 31 A/MHz
550 A
1 A
0.15 A
0.1 A
14 s
151 s
1015 s
1015 s
Full
Full
Partial
No
No
Wake-up time to CPU active (1)

Register retention
SRAM retention
Full
Full
Full
No
No
High-speed clock
XOSC_HF or
RCOSC_HF
XOSC_HF or
RCOSC_HF
Off
Off
Off
Low-speed clock
XOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
Off
Off
Peripherals
Available
Available
Off
Off
Off
Sensor Controller
Available
Available
Available
Off
Off
Wake up on RTC
Available
Available
Available
Off
Off
Wake up on pin edge
Available
Available
Available
Available
Off
Wake up on reset pin
Available
Available
Available
Available
Available
Brown Out Detector (BOD)
Active
Active
Duty Cycled (2)
Off
N/A
Power On Reset (POR)
Active
Active
Active
Active
N/A
(1)
(2)
Not including RTOS overhead

The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold
between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releases
it. To avoid this, TI recommends that STANDBY mode is avoided if there is a risk that the supply voltage (VDD) may drop below the
specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a
battery replacement, triggers a Power-on-reset by ensuring that the VDD decoupling network is fully depleted before applying supply
voltage again (for example, inserting new batteries).
In active mode, the application CM3 CPU is actively executing code. Active mode provides normal
operation of the processor and all of the peripherals that are currently enabled. The system clock can be
any available clock source (see Table 6-2).
In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not
clocked and no code is executed. Any interrupt event will bring the processor back into active mode.
In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or
sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention
do not need to be reconfigured when waking up again, and the CPU continues execution from where it
went into standby mode. All GPIOs are latched in standby mode.
In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller.
The I/Os are latched with the value they had before entering shutdown mode. A change of state on any
I/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. The
CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the
reset status register. The only state retained in this mode is the latched I/O state and the flash memory
contents.

27
CC2650MODA
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The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor
Controller independently of the main CPU, which means that the main CPU does not have to wake up, for
example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current
and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to
configure the sensor controller and choose which peripherals are controlled and which conditions wake up
the main CPU.
6.9
Clock Systems
The CC2650MODA device supports two external and two internal clock sources.
A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to
create a 48-MHz clock.
The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than
500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal
32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed
crystal oscillator is designed for use with a 32-kHz watch-type crystal.
The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem.
The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal
oscillator is not used.
The 32-kHz clock source can be used as external clocking reference through GPIO.
6.10 General Peripherals and Modules

The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals
to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a
programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge
(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five
GPIOs have high-drive capabilities (marked in bold in Section 4).
The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's
synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz.
The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps.
28

CC2650MODA
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Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be
configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module.
Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0.
In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF
timer can be synchronized to the RTC.
The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface
is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave.
The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys,
initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring
oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit.
The watchdog timer is used to regain control if the system fails due to a software error after an external
device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a
predefined time-out value is reached.
The device includes a direct memory access (DMA) controller. The DMA controller provides a way to
offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the
available bus bandwidth. The DMA controller can perform transfer between memory and peripherals. The
DMA controller has dedicated channels for each supported on-chip module and can be programmed to
automatically perform transfers between peripherals and memory as the peripheral is ready to transfer
more data. Some features of the DMA controller include the following (this is not an exhaustive list):
Highly flexible and configurable channel operation of up to 32 channels
Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-toperipheral
Data sizes of 8, 16, and 32 bits
The AON domain contains circuitry that is always enabled, except in Shutdown mode (where the digital
supply is off). This circuitry includes the following:
The RTC can be used to wake the device from any state where it is active. The RTC contains three
compare and one capture registers. With software support, the RTC can be used for clock and
calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be
compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used
instead of a crystal.
The battery monitor and temperature sensor are accessible by software and give a battery status
indication as well as a coarse temperature measure.

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CC2650MODA
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6.11 System Architecture

Depending on the product configuration, CC26xx can function either as a Wireless Network Processor
(WNPan IC running the wireless protocol stack, with the application running on a separate MCU), or as
a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the
device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.
6.12 Certification
The CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable):
Table 6-3. CC2650MODA List of Certifications
REGULATORY BODY
FCC (USA)
IC (Canada)
SPECIFICATION
Part 15C:2015+MPE FCC 1.1307 RF Exposure (Bluetooth)
Part 15C:2015+MPE FCC 1.1307 RF Exposure (802.15.4)
RSS-102 (MPE) and RSS-247 (Bluetooth)
RSS-102 (MPE) and RSS-247 (IEEE 802.15.4)
ID (IF APPLICABLE)
FCC ID: ZAT26M1
ID: 451H-26M1
EN300328 v1.9.1 (Bluetooth)

EN300328 v1.9.1 (802.15.4)
IEC/EN62479:Ver 2010 (MPE)
ETSI/CE (Europe)
EN301489-1 v1.9.2:2011
EN301489-17 v2.2.1:2012 (EMC)
EN55022:2010+AC:2011
EN55024:2011
EN 60950-1:2006/A11:2009/A1:2010/A12:2011/A2:2013
Japan MIC
ARIB STD-T66
No: 201-160413/00
JATE
D 16 0092 201/00
6.12.1 Federal Communications Commission Statement

You are cautioned that changes or modifications not expressly approved by the part responsible for
compliance could void the users authority to operate the equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. This device may not cause harmful interference and
2. This device must accept any interference received, including interference that may cause undesired
operation of the device.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End
users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter
must not be colocated or operating with any other antenna or transmitter.
30

CC2650MODA
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6.12.2 Canada, Industry Canada (IC)

This device complies with Industry Canada licence-exempt RSS standards.
Operation is subject to the following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired operation of
the device
Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence
L'exploitation est autorise aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est
susceptible d'en compromettre le fonctionnement.
IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must not be co-located or
operating in conjunction with any other antenna or transmitter.
Pour se conformer aux exigences de conformit RF canadienne l'exposition, cet appareil et son antenne
ne doivent pas tre co-localiss ou fonctionnant en conjonction avec une autre antenne ou transmetteur.
6.13 End Product Labeling

This module is designed to comply with the FCC statement, FCC ID : ZAT26M1. The host system using
this module must display a visible label indicating the following text:
"Contains FCC ID: ZAT26M1"
This module is designed to comply with the IC statement, IC : 451H-26M1. The host system using this
module must display a visible label indicating the following text:
"Contains IC: 451H-26M1"
6.14 Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the users manual of the end product which integrates this module.
The end user manual must include all required regulatory information/warning as shown in this manual.

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CC2650MODA
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7 Application, Implementation, and Layout

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1
7.1.1
Application Information
Typical Application Circuit
No external components are required for the operation of the CC2650MODA device. Figure 7-1 shows the
application circuit.
VDDS
U1
VDDS
R28
100k
nReset
JTAG-TCK
JTAG-TMS
DIO0
DIO1
DIO2
DIO3
DIO4
DIO5
DIO6
DIO7
DIO8
DIO9
DIO10
DIO11
DIO12
DIO13
DIO14
4
5
6
7
8
11
12
14
15
16
17
18
19
20
21
13
10
9
1
3
25
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5/JTAG_TDO
DIO_6/JTAG_TDI
DIO_7
DIO_8
DIO_9
DIO_10
DIO_11
DIO_12
DIO_13
DIO_14
VDDS
VDDS
NC_2
NC_24
nRESET
JTAG_TCKC
JTAG_TMSC
GND
GND
GND
EGP
EGP
EGP
EGP
22
23
2
24
26
27
28
29
CC2650MODAMOH
Figure 7-1. CC2650MODA Application Circuit
32
Application, Implementation, and Layout

CC2650MODA
www.ti.com
7.2
7.2.1
Layout
Layout Guidelines
Use the following guidelines to lay out the CC2650MODA device:
The module must be placed close to the edge of the PCB.
TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in
Figure 7-2 and Figure 7-3.
TI recommends using a generous amount of ground vias to stitch together the ground planes on
different layers. Several ground vias should be placed close to the exposed ground pads of the
module.
No external decoupling is required.
The reset line should have an external pullup resistor unless the line is actively driven. Placement of
this component is not critical.
TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.
Figure 7-2. Top Layer
Figure 7-3. Bottom Layer
Application, Implementation, and Layout

33
CC2650MODA
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8 Device and Documentation Support

8.1
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC2650MODA is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, MOH).
For orderable part numbers of CC2650MODA devices in the MOH package type, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
CC2650
MOD
MOH
PREFIX
X = Experimental device
Blank = Qualified device
PACKAGE DESIGNATOR
MOH = 29-pin Module
DEVICE FAMILY
SimpleLink Multistandard
Wireless MCU
ROM version 1
Flash = 128KB
DEVICE
MOD = Module
Figure 8-1. Device Nomenclature
34
Device and Documentation Support

CC2650MODA
www.ti.com
8.2
Tools and Software

TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules.
The following products support development of the CC2650MODA device applications:
Software Tools:
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at
an early stage in the design process.
Test functions for sending and receiving radio packets, continuous wave transmit and receive
Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger
Can also be used without any hardware, but then only to generate, edit and export radio configuration
settings
Can be used in combination with several development kits for TI's CCxxxx RF-ICs
Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The
Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple
background tasks autonomously and independent of the System CPU state.
Allows for Sensor Controller task algorithms to be implemented using a C-like programming language
Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller
machine code and associated definitions
Allows for rapid development by using the integrated Sensor Controller task testing and debugging
functionality. This allows for live visualization of sensor data and algorithm verification.
IDEs and Compilers:
Code Composer Studio:
Integrated development environment with project management tools and editor
Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family
Best support for XDS debuggers; XDS100v3, XDS110 and XDS200
High integration with TI-RTOS with support for TI-RTOS Object View
IAR Embedded Workbench for ARM
IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family
Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link
RTOS plugin is available for TI-RTOS
For a complete listing of development-support tools for the CC2650MODA platform, visit the Texas
Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field
sales office or authorized distributor.

35
CC2650MODA
8.3
www.ti.com
Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
The following documents describe the CC2650MODA device. Copies of these documents are available on
the Internet at www.ti.com.
CC26xx SimpleLink Wireless MCU Technical Reference Manual
CC26xx SimpleLink Wireless MCU Errata
8.4
Texas Instruments Low-Power RF Website

TI's Low-Power RF website has all the latest products, application and design notes, FAQ section, news
and events updates. Go to www.ti.com/lprf.
8.5
Low-Power RF eNewsletter
The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers news, and
other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter
articles include links to get more online information.
Sign up at: www.ti.com/lprfnewsletter
8.6
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Online Community The TI engineer-ro-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community
Forums, videos, and blogs
RF design help
E2E interaction
Join here.
Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power
RF development partners to help customers speed up their application development. The
network consists of recommended companies, RF consultants, and independent design
houses that provide a series of hardware module products and design services, including:
RF circuit, low-power RF, and ZigBee design services
Low-power RF and ZigBee module solutions and development tools
RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
Search the Low-Power RF Developer Network to find a suitable partner.
www.ti.com/lprfnetwork
8.7
Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and
standard-based wireless applications for use in industrial and consumer applications. The selection
includes RF transceivers, RF transmitters, RF front ends, modules, and Systems-on-Chips as well as
various software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
36

CC2650MODA
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In addition, Texas Instruments provides a large selection of support collateral such as development tools,
technical documentation, reference designs, application expertise, customer support, third-party and
university programs.
The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the
chance to interact with engineers from all over the world.
With a broad selection of product solutions, end-application possibilities, and a range of technical support,
Texas Instruments offers the broadest low-power RF portfolio.
8.8
Trademarks
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
SmartRF, Code Composer Studio, SimpleLink, Z-Stack, TI-RTOS, E2E are trademarks of Texas
Instruments.
ARM7 is a trademark of ARM Limited (or its subsidiaries).
ARM, Cortex, Thumb are registered trademarks of ARM Limited (or its subsidiaries).
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IEEE Std 1241 is a trademark of The Institute of Electrical and Electronics Engineers, Inc.
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
ZigBee RF4CE is a trademark of Zigbee Alliance, Inc.
All other trademarks are the property of their respective owners.
8.9
Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.10 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.11 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9 Mechanical, Packaging, and Orderable Information

9.1
Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Mechanical, Packaging, and Orderable Information

37
PACKAGE OPTION ADDENDUM
www.ti.com
9-Sep-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
CC2650MODAMOHR
ACTIVE
QFM
MOH
29
1200
TBD
Call TI
Call TI
-40 to 85
CC2650MODAMOHT
ACTIVE
QFM
MOH
29
250
TBD
Call TI
Call TI
-40 to 85
(1)
The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Sep-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
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CC2650MODA SimpleLink Bluetooth low energy Wireless MCU Module

No External Components Needed, Only Supply

Copyright 2016, Texas Instruments Incorporated

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SWRS187A AUGUST 2016 REVISED AUGUST 2016

Functional Block Diagram

SimpleLinkTM CC2650MOD Wireless MCU Module

General Peripherals / Modules

2 SSI (SPI, Wire, TI)

Sensor Controller Engine

12-bit ADC, 200 ks/s

Temp. / Batt. Monitor

Copyright 2016, Texas Instruments Incorporated

Figure 1-1. CC2650MODA Block Diagram

Copyright 2016, Texas Instruments Incorporated

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Device Overview ......................................... 1

Functional Block Diagram ............................ 3

Revision History ......................................... 4

Module Pin Diagram .................................. 6

Pin Functions ......................................... 7

Absolute Maximum Ratings .......................... 8

ESD Ratings .......................................... 8

Recommended Operating Conditions ................ 8

Power Consumption Summary ....................... 8

IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps)

Thermal Resistance Characteristics for MOH

Mechanical, Packaging, and Orderable

Changed document status to PRODUCTION DATA

Copyright 2016, Texas Instruments Incorporated

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SWRS187A AUGUST 2016 REVISED AUGUST 2016

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4 Terminal Configuration and Functions

Module Pin Diagram

(Exposed GND Pads)

Figure 4-1. CC2650MODA MOH Package

Terminal Configuration and Functions

Copyright 2016, Texas Instruments Incorporated

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SWRS187A AUGUST 2016 REVISED AUGUST 2016

GPIO, Sensor Controller

GPIO, Sensor Controller

GPIO, Sensor Controller, high-drive capability

GPIO, Sensor Controller, high-drive capability

GPIO, Sensor Controller, high-drive capability

GPIO, high-drive capability, JTAG_TDO

GPIO, high-drive capability, JTAG_TDI

Digital I/O, Analog I/O

GPIO, Sensor Controller, analog

Digital I/O, Analog I/O

GPIO, Sensor Controller, analog

Digital I/O, Analog I/O

GPIO, Sensor Controller, analog

Digital I/O, Analog I/O

GPIO, Sensor Controller, analog

Digital I/O, Analog I/O

GPIO, Sensor Controller, analog