Si7336ADP

Vishay Siliconix

N-Channel 30-V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY
RDS(on) ()

ID (A)

0.0030 at VGS = 10 V

30

0.0040 at VGS = 4.5 V

27

VDS (V)
30

Qg (Typ.)
36

PowerPAK SO-8

APPLICATIONS

6.15 mm

Low-Side DC/DC Conversion

- Notebook
- Server
- Workstation

5.15 mm

Halogen-free available
Ultra-Low On-Resistance Using High
RoHS
Density TrenchFET Gen II Power
COMPLIANT
MOSFET Technology
Qg Optimized
New Low Thermal Resistance PowerPAK Package with
Low 1.07 mm Profile
100 % Rg Tested
100 % UIS Tested

S
2

S
3

4
D
8

D
7

D
6

Bottom View
S

Ordering Information: Si7336ADP-T1-E3 (Lead (Pb)-free)

Si7336ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted

Parameter
Drain-Source Voltage
Gate-Source Voltage

Symbol
VDS
VGS
TA = 25 C
TA = 70 C

Continuous Drain Current (TJ = 150 C)a

Pulsed Drain Current (10 s Pulse Width)
a

Continuous Source Current (Diode Conduction)

Avalanche Current
Maximum Power Dissipationa

L = 0.1 mH
TA = 25 C
TA = 70 C

ID
IDM
IS
IAS
PD
TJ, Tstg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)b, c

Limits
30
20
30
25
70
4.5
50
5.4
3.4
- 55 to 150
260

Unit
V

W
C

THERMAL RESISTANCE RATINGS

Parameter
Maximum Junction-to-Ambient

Symbol
a

t 10 s
Steady State
Steady State

RthJA

Typical
18
50
1.0

Maximum
23
65
1.5

Unit

C/W
RthJC
Maximum Junction-to-Case (Drain)
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

Document Number: 73152

S-80440-Rev. F, 03-Mar-08

www.vishay.com
1

Si7336ADP
Vishay Siliconix
MOSFET SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter

Symbol

Test Conditions

Min.
1.0

Typ.

Max.

Unit

Static
VGS(th)

VDS = VGS, ID = 250 A

Gate-Body Leakage

IGSS

VDS = 0 V, VGS = 20 V

Zero Gate Voltage Drain Current

IDSS

On-State Drain Currenta

ID(on)

Gate Threshold Voltage

Drain-Source On-State Resistancea

Forward Transconductancea
Diode Forward Voltage

V
nA

VDS = 30 V, VGS = 0 V

VDS = 30 V, VGS = 0 V, TJ = 55 C

VDS 5 V, VGS = 10 V

RDS(on)

3.0
100

30

VGS = 10 V, ID = 25 A

0.0024

0.0030

VGS = 4.5 V, ID = 19 A

0.0031

0.0040

gfs

VDS = 15 V, ID = 25 A

110

VSD

IS = 2.9 A, VGS = 0 V

0.72

1.1

Dynamicb
Input Capacitance

Ciss

Output Capacitance

Coss

Reverse Transfer Capacitance

Crss

415

Total Gate Charge

Qg

36

Gate-Source Charge

Qgs

Gate-Drain Charge

Qgd

Gate Resistance

Rg

5600
VDS = 15 V, VGS = 0 V, f = 1 MHz

VDS = 15 V, VGS = 4.5 V, ID = 20 A

0.6

1.3

VDD = 15 V, RL = 15
ID 1.0 A, VGEN = 10 V, RG = 6

td(off)

Fall Time

tf

Source-Drain Reverse Recovery Time

trr

nC

10

tr

Turn-Off Delay Time

50

18

td(on)

Turn-On Delay Time

Rise Time

pF

860

IF = 2.9 A, di/dt = 100 A/s

2.0

24

35

16

25

90

140

32

50

45

70

ns

Notes:
a. Pulse test; pulse width 300 s, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

TYPICAL CHARACTERISTICS 25 C, unless otherwise noted

60

60
VGS = 10 thru 4 V

50
I D - Drain Current (A)

I D - Drain Current (A)

50

40

30

20

40

30

20
TC = 125 C
10

10

25 C

3V

- 55 C

0
0

www.vishay.com
2

10

0
0.0

0.5

1.0

1.5

2.0

2.5

3.0

VDS - Drain-to-Source Voltage (V)

VGS - Gate-to-Source Voltage (V)

Output Characteristics

Transfer Characteristics

3.5

4.0

Document Number: 73152

S-80440-Rev. F, 03-Mar-08

Si7336ADP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
7000

0.005

VGS = 4.5 V

Ciss

5000

C - Capacitance (pF)

R DS(on) - On-Resistance ()

6000
0.004

0.003
VGS = 10 V
0.002

4000
3000
2000
Coss

0.001
1000
Crss

0.000
0

10

20

30

40

50

12

30

Capacitance

1.6
VDS = 15 V
ID = 20 A

VGS = 10 V
ID = 25 A

1.4

(Normalized)

R DS (on) - On-Resistance

VGS - Gate-to-Source Voltage (V)

24

VDS - Drain-to-Source Voltage (V)

ID - Drain Current (A)

On-Resistance vs. Drain Current

1.2

1.0

0.8

0
0

10

15

20

25

30

35

40

0.6
- 50

45

- 25

25

50

75

100

125

150

TJ - Junction Temperature (C)

Qg - Total Gate Charge (nC)

On-Resistance vs. Junction Temperature

Gate Charge
0.015

R DS(on) - On-Resistance ()

50

I S - Source Current (A)

18

10
TJ = 150 C

TJ = 25 C

0.012
ID = 25 A
0.009

0.006

0.003

0.000

0.1
0.00

0.2

0.4

0.6

0.8

1.0

VSD - Source-to-Drain Voltage (V)

Source-Drain Diode Forward Voltage

Document Number: 73152

S-80440-Rev. F, 03-Mar-08

1.2

10

VGS - Gate-to-Source Voltage (V)

On-Resistance vs. Gate-to-Source Voltage

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Si7336ADP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
0.4

200
ID = 250 A

0.2
0.0

Power (W)

VGS(th) Variance (V)

160

- 0.2
- 0.4

120

80

- 0.6
40
- 0.8
- 1.0
- 50

- 25

25

50

75

100

125

150

0
0.001

0.01

0.1

TJ - Temperature (C)

Time (s)

Threshold Voltage

Single Pulse Power

10

100
Limited
by RDS(on)*
1 ms

10

10 ms

100 ms

1s
10 s
0.1

TC = 25 C
Single Pulse

0.01
0.01

DC

0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* V GS > minimum V GS at which R DS(on) is specified

Safe Operating Area, Junction-to-Case

2

Normalized Effective Transient

Thermal Impedance

1
Duty Cycle = 0.5

0.2
Notes:

0.1
PDM

0.1
0.05

t1
t2
1. Duty Cycle, D =

t1
t2
2. Per Unit Base = R thJA = 50 C/W

0.02

3. T JM - TA = PDM Z thJA(t)

Single Pulse

4. Surface Mounted

0.01
10-4

10-3

10-2

10-1
1
Square Wave Pulse Duration (s)

10

100

600

Normalized Thermal Transient Impedance, Junction-to-Ambient

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Document Number: 73152

S-80440-Rev. F, 03-Mar-08

Si7336ADP
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
2

Normalized Effective Transient

Thermal Impedance

1
Duty Cycle = 0.5

0.2
0.1
0.1
Single Pulse
0.05

0.02

0.01
10-4

10-3

10-2
10-1
Square Wave Pulse Duration (s)

10

Normalized Thermal Transient Impedance, Junction-to-Case

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73152.

Document Number: 73152

S-80440-Rev. F, 03-Mar-08

www.vishay.com
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Package Information
www.vishay.com

Vishay Siliconix

PowerPAK SO-8, (Single/Dual)

L

E2

K
E4

D4

Z
2
D5

D2

2
D1
D

2
D

3
4

L1
E3

A1

Backside View of Single Pad

H
K
E2
E4

1
D1
D5

D2

Detail Z

K1

2
E1
E

D3 (2x) D4

3
4

Notes
1. Inch will govern.
2 Dimensions exclusive of mold gate burrs.
3. Dimensions exclusive of mold flash and cutting burrs.

E3
Backside View of Dual Pad

MILLIMETERS
DIM.

MIN.

A
0.97
A1
b
0.33
c
0.23
D
5.05
D1
4.80
D2
3.56
D3
1.32
D4
D5
E
6.05
E1
5.79
E2 (for AL product)
3.30
E2 (for other product)
3.48
E3
3.68
E4 (for AL product)
E4 (for other product)
e
K (for AL product)
K (for other product)
K1
0.56
H
0.51
L
0.51
L1
0.06

0
W
0.15
M
ECN: C13-0702-Rev. K, 20-May-13
DWG: 5881
Revison: 20-May-13

D2

INCHES

NOM.

MAX.

MIN.

NOM.

MAX.

1.04
0.41
0.28
5.15
4.90
3.76
1.50
0.57 typ.
3.98 typ.
6.15
5.89
3.48
3.66
3.78
0.58 typ.
0.75 typ.
1.27 BSC
1.45 typ.
1.27 typ.
0.61
0.61
0.13
0.25
0.125 typ.

1.12
0.05
0.51
0.33
5.26
5.00
3.91
1.68

0.038
0
0.013
0.009
0.199
0.189
0.140
0.052

0.044
0.002
0.020
0.013
0.207
0.197
0.154
0.066

6.25
5.99
3.66
3.84
3.91

0.238
0.228
0.130
0.137
0.145

0.71
0.71
0.20
12
0.36

0.022
0.020
0.020
0.002
0
0.006

0.041
0.016
0.011
0.203
0.193
0.148
0.059
0.0225 typ.
0.157 typ.
0.242
0.232
0.137
0.144
0.149
0.023 typ.
0.030 typ.
0.050 BSC
0.057 typ.
0.050 typ.
0.024
0.024
0.005
0.010
0.005 typ.

0.246
0.236
0.144
0.151
0.154

0.028
0.028
0.008
12
0.014

Document Number: 71655

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

VISHAY SILICONIX
www.vishay.com

Power MOSFETs

Application Note AN821

PowerPAK SO-8 Mounting and Thermal Considerations

by Wharton McDaniel
MOSFETs for switching applications are now available with
die on resistances around 1 m and with the capability to
handle 85 A. While these die capabilities represent a major
advance over what was available just a few years ago, it is
important for power MOSFET packaging technology to keep
pace. It should be obvious that degradation of a high
performance die by the package is undesirable. PowerPAK
is a new package technology that addresses these issues.
In this application note, PowerPAKs construction is
described. Following this mounting information is presented
including land patterns and soldering profiles for maximum
reliability. Finally, thermal and electrical performance is
discussed.

PowerPAK SO-8 SINGLE MOUNTING

The PowerPAK single is simple to use. The pin arrangement
(drain, source, gate pins) and the pin dimensions are the
same as standard SO-8 devices (see figure 2). Therefore, the
PowerPAK connection pads match directly to those of the
SO-8. The only difference is the extended drain connection
area. To take immediate advantage of the PowerPAK SO-8
single devices, they can be mounted to existing SO-8 land
patterns.

THE PowerPAK PACKAGE

The PowerPAK package was developed around the SO-8
package (figure 1). The PowerPAK SO-8 utilizes the same
footprint and the same pin-outs as the standard SO-8. This
allows PowerPAK to be substituted directly for a standard
SO-8 package. Being a leadless package, PowerPAK SO-8
utilizes the entire SO-8 footprint, freeing space normally
occupied by the leads, and thus allowing it to hold a larger
die than a standard SO-8. In fact, this larger die is slightly
larger than a full sized DPAK die. The bottom of the die
attach pad is exposed for the purpose of providing a direct,
low resistance thermal path to the substrate the device is
mounted on. Finally, the package height is lower than the
standard SO-8, making it an excellent choice for
applications with space constraints.

Standard SO-8

PowerPAK SO-8

Fig. 2

The minimum land pattern recommended to take full

advantage of the PowerPAK thermal performance see
Application Note 826, Recommended Minimum Pad
Patterns With Outline Drawing Access for Vishay Siliconix
MOSFETs. Click on the PowerPAK SO-8 single in the index
of this document.
In this figure, the drain land pattern is given to make full
contact to the drain pad on the PowerPAK package.

Fig. 1
Revision: 16-Mai-13

PowerPAK 1212 Devices

Document Number: 71622

1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

APPLICATION NOTE

This land pattern can be extended to the left, right, and top
of the drawn pattern. This extension will serve to increase
the heat dissipation by decreasing the thermal resistance
from the foot of the PowerPAK to the PC board and
therefore to the ambient. Note that increasing the drain land
area beyond a certain point will yield little decrease
in foot-to-board and foot-to-ambient thermal resistance.
Under specific conditions of board configuration, copper
weight and layer stack, experiments have found that
more than about 0.25 in2 to 0.5 in2 of additional copper
(in addition to the drain land) will yield little improvement in
thermal performance.

Application Note AN821

www.vishay.com

Vishay Siliconix

PowerPAK SO-8 Mounting and Thermal Considerations

PowerPAK SO-8 DUAL
The pin arrangement (drain, source, gate pins) and the pin
dimensions of the PowerPAK SO-8 dual are the same as
standard SO-8 dual devices. Therefore, the PowerPAK
device connection pads match directly to those of the SO-8.
As in the single-channel package, the only exception is the
extended drain connection area. Manufacturers can likewise
take immediate advantage of the PowerPAK SO-8 dual
devices by mounting them to existing SO-8 dual land
patterns.

For
the
lead
(Pb)-free
www.vishay.com/doc?73257.

solder

profile,

see

To take the advantage of the dual PowerPAK SO-8s

thermal performance, the minimum recommended land
pattern can be found in Application Note 826,
Recommended Minimum Pad Patterns With Outline
Drawing Access for Vishay Siliconix MOSFETs. Click on the
PowerPAK 1212-8 dual in the index of this document.
The gap between the two drain pads is 24 mils. This
matches the spacing of the two drain pads on the
PowerPAK SO-8 dual package.

Fig. 3 Solder Reflow Temperature Profile

REFLOW SOLDERING

Ramp-Up Rate

Vishay Siliconix surface-mount packages meet solder reflow

reliability requirements. Devices are subjected to solder
reflow as a test preconditioning and are then
reliability-tested using temperature cycle, bias humidity,
HAST, or pressure pot. The solder reflow temperature profile
used, and the temperatures and time duration, are shown in
figures 3 and 4.

Temperature at 150 - 200 C

+ 3 C /s max.
120 s max.

Temperature Above 217 C

60 - 150 s

Maximum Temperature

255 + 5/- 0 C

Time at Maximum
Temperature

30 s

Ramp-Down Rate

+ 6 C/s max.

30 s
260 C
3 C(max)

6 C/s (max.)
217 C

150 - 200 C

APPLICATION NOTE

150 s (max.)
60 s (min.)
Pre-Heating Zone

Reflow Zone

Maximum peak temperature at 240 C is allowed.

Fig. 4 Solder Reflow Temperatures and Time Durations

Revision: 16-Mai-13

Document Number: 71622

2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Application Note AN821

www.vishay.com

Vishay Siliconix

PowerPAK SO-8 Mounting and Thermal Considerations

THERMAL PERFORMANCE
Introduction
A basic measure of a devices thermal performance
is the junction-to-case thermal resistance, RthJC, or the
junction-to-foot thermal resistance, RthJF This parameter is
measured for the device mounted to an infinite heat sink and
is therefore a characterization of the device only, in other
words, independent of the properties of the object to which
the device is mounted. Table 1 shows a comparison of
the DPAK, PowerPAK SO-8, and standard SO-8. The
PowerPAK has thermal performance equivalent to the
DPAK, while having an order of magnitude better thermal
performance over the SO-8.

TABLE 1 - DPAK AND POWERPAK SO-8

EQUIVALENT STEADY STATE
PERFORMANCE

Thermal
Resistance RthJC

DPAK

PowerPAK
SO-8

Standard
SO-8

1.2 C/W

1 C/W

16 C/W

Thermal Performance on Standard SO-8 Pad Pattern

Because of the common footprint, a PowerPAK SO-8
can be mounted on an existing standard SO-8 pad pattern.
The question then arises as to the thermal performance
of the PowerPAK device under these conditions. A
characterization was made comparing a standard SO-8 and
a PowerPAK device on a board with a trough cut out
underneath the PowerPAK drain pad. This configuration
restricted the heat flow to the SO-8 land pads. The results
are shown in figure 5.

Because of the presence of the trough, this result suggests

a minimum performance improvement of 10 C/W by using
a PowerPAK SO-8 in a standard SO-8 PC board mount.
The only concern when mounting a PowerPAK on a
standard SO-8 pad pattern is that there should be no traces
running between the body of the MOSFET. Where the
standard SO-8 body is spaced away from the pc board,
allowing traces to run underneath, the PowerPAK sits
directly on the pc board.
Thermal Performance - Spreading Copper
Designers may add additional copper, spreading copper, to
the drain pad to aid in conducting heat from a device. It is
helpful to have some information about the thermal
performance for a given area of spreading copper.
Figure 6 shows the thermal resistance of a PowerPAK SO-8
device mounted on a 2-in. 2-in., four-layer FR-4 PC board.
The two internal layers and the backside layer are solid
copper. The internal layers were chosen as solid copper to
model the large power and ground planes common in many
applications. The top layer was cut back to a smaller area
and at each step junction-to-ambient thermal resistance
measurements were taken. The results indicate that an area
above 0.3 to 0.4 square inches of spreading copper gives no
additional
thermal
performance
improvement.
A
subsequent experiment was run where the copper on the
back-side was reduced, first to 50 % in stripes to mimic
circuit traces, and then totally removed. No significant effect
was observed.
Rth vs. Spreading Copper
(0 %, 50 %, 100 % Back Copper)
56

Si4874DY vs. Si7446DP PPAK on a 4-Layer Board

SO-8 Pattern, Trough Under Drain
Impedance (C/watts)

60

Impedance (C/watts)

APPLICATION NOTE

50
40
Si4874DY
30

51

46

100 %

41

Si7446DP

0%

20

50 %
36

10

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

Spreading Copper (sq in)

0
0.0001

0.01

100

10000

Fig. 6 Spreading Copper Junction-to-Ambient Performance

Pulse Duration (sec)

Fig. 5 PowerPAK SO-8 and Standard SO-0 Land Pad Thermal

Path
Revision: 16-Mai-13

Document Number: 71622

3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Application Note AN821

www.vishay.com

Vishay Siliconix

PowerPAK SO-8 Mounting and Thermal Considerations

SYSTEM AND ELECTRICAL IMPACT OF
PowerPAK SO-8
In any design, one must take into account the change in
MOSFET RDS(on) with temperature (figure 7).
On-Resistance vs. Junction Temperature
R DS(on) - On-Resistance ( ) (Normalized)

1.8
VGS = 10 V
ID = 23 A

1.6

1.2

Minimizing the thermal rise above the board temperature by

using PowerPAK has not only eased the thermal design but
it has allowed the device to run cooler, keep rDS(on) low, and
permits the device to handle more current than the same
MOSFET die in the standard SO-8 package.

1.0

CONCLUSIONS

1.4

PowerPAK SO-8 has been shown to have the same thermal

performance as the DPAK package while having the same
footprint as the standard SO-8 package. The PowerPAK
SO-8 can hold larger die approximately equal in size to the
maximum that the DPAK can accommodate implying no
sacrifice in performance because of package limitations.

0.8

0.6
- 50

- 25

25

50

75

100

125

150

TJ - Junction Temperature (C)

Fig. 7 MOSFET RDS(on) vs. Temperature

A MOSFET generates internal heat due to the current

passing through the channel. This self-heating raises the
junction temperature of the device above that of the PC
board to which it is mounted, causing increased power
dissipation in the device. A major source of this problem lies
in the large values of the junction-to-foot thermal resistance
of the SO-8 package.
PowerPAK SO-8 minimizes the junction-to-board thermal
resistance to where the MOSFET die temperature is very
close to the temperature of the PC board. Consider two
devices mounted on a PC board heated to 105 C by other
components on the board (figure 8).

PowerPAK SO-8

APPLICATION NOTE

Suppose each device is dissipating 2.7 W. Using the

junction-to-foot thermal resistance characteristics of the
PowerPAK SO-8 and the standard SO-8, the die
temperature is determined to be 107 C for the PowerPAK
(and for DPAK) and 148 C for the standard SO-8. This is a
2 C rise above the board temperature for the PowerPAK
and a 43 C rise for the standard SO-8. Referring to figure 7,
a 2 C difference has minimal effect on RDS(on) whereas a
43 C difference has a significant effect on RDS(on).

Recommended PowerPAK SO-8 land patterns are provided

to aid in PC board layout for designs using this new
package.
Thermal considerations have indicated that significant
advantages can be gained by using PowerPAK SO-8
devices in designs where the PC board was laid out for
the standard SO-8. Applications experimental data gave
thermal performance data showing minimum and
typical thermal performance in a SO-8 environment, plus
information on the optimum thermal performance
obtainable including spreading copper. This further
emphasized the DPAK equivalency.
PowerPAK SO-8 therefore has the desired small size
characteristics of the SO-8 combined with the attractive
thermal characteristics of the DPAK package.

Standard SO-8
107 C

0.8 C/W

148 C

16 C/W

PC Board at 105 C

Fig. 8 Temperature of Devices on a PC Board

Revision: 16-Mai-13

Document Number: 71622

4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Application Note 826

Vishay Siliconix

RECOMMENDED MINIMUM PADS FOR PowerPAK SO-8 Single

0.260
(6.61)
0.150
(3.81)

0.050

0.174

(4.42)

0.154

(1.27)

0.026
(0.66)

(3.91)

0.024
(0.61)

0.050

0.032

0.040

(1.27)

(0.82)

(1.02)

Recommended Minimum Pads

Dimensions in Inches/(mm)
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APPLICATION NOTE

Document Number: 72599

Revision: 21-Jan-08

www.vishay.com
15

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www.vishay.com

Vishay

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Revision: 13-Jun-16

Document Number: 91000