Lecture24 PDF
Lecture24 PDF
5.3.2 Co
oaxial Feed
d
The Coax
xial feed or prrobe feed is a very common technique used for feeding microstrrip patch anteennas.
As shown
n in Figure 5.6
6, the inner co
onductor of th
he coaxial coonnector extennds through thhe dielectric aand is
soldered to
t the radiatin
ng patch, whille the outer co
onductor is coonnected to thhe ground plaane.
Fig 5.6 Co
oaxial Fee Probe fed Rectaangular Micro
ostrip Patch A
Antenna
The main advantage of this type off feeding scheeme is that thhe feed can bee placed at anny desired loccation
on the pattch in order to
o match with its input impedance. This feed method is easy to fabbricate and haas low
spurious radiation.
r
However, its maajor disadvan
ntage is that itt provides naarrow bandwidth and is diffficult
to model since a hole has to be drrilled in the substrate
s
and the connectoor protrudes ooutside the ground
us not making
g it completely
y planar for th
hick substratees ( h > 0.020 ).
plane, thu
5.3.3 Ap
perture Coupled Feed
d
In this typ
pe of feeding
g technique, the
t radiating patch and thhe microstrip feed line aree separated bby the
ground pllane as shown
n in Figure 5.7
7. Coupling between
b
the ppatch and the feed line is m
made through a slot
or an aperrture in the grround plane.
5.3.4 Prroximity Co
oupled Feeed
This type of feed tech
hnique is also
o called as thee electromagnnetic couplinng scheme. A
As shown in F
Figure
bstrates are used
u
such th
hat the feed lline is betweeen the two substrates annd the
5.8, two dielectric sub
pper substrate. The main advantage oof this feed teechnique is tthat it
radiating patch is on top of the up
a provides very high ban
andwidth (as hhigh as 13%)), due to an ooverall
eliminatess spurious feeed radiation and
increase in
n the thickness of the micrrostrip patch antenna. Thiss scheme alsoo provides chhoices betweeen two
different dielectric media, one for the patch and one forr the feed liine to optim
mize the indivvidual
nces.
performan
3) Copper loss
4) Anisotropy in the substrate
5) Effects of temperature, humidity, and aging
6) Mechanical requirements: conformability, machinability, solderability, weight, elasticity, etc.
7) Cost
The first 3 factors are of special concern in the millimeter-wave range (f> 30 GHz).
ELECTRICAL PROPERTIES OF COMMONLY USED SUBSTRATE MATERIALS FOR
MICROSTRIP ANTENNAS
Material
Dielectric
Constant
Unreinforced PTFE, Cuflon
2.1
Reinforced PTFE, RT Duroid 5880 2.20 (1.5%)
Fused Quartz
3.78
96% Alumina
9.40 (5%)
99.5% Alumina
9.80 (5%)
Sapphire
9.4, 1.6
Semi-Insulating GaAs
12.9
Loss
Tangent
0.0004
0.0009
0.0001
0.0010
0.0001
0.0001
0.0020