DISCRETE SEMICONDUCTORS

DATA SHEET
dbook, halfpage

M3D252

BGY888
860 MHz, 34 dB gain push-pull
amplifier
Product specification
Supersedes data of 1999 Mar 30

2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

FEATURES

BGY888

PINNING SOT115J

Excellent linearity

PIN

Extremely low noise

DESCRIPTION

High gain

input

2, 3

Excellent return loss properties.

common

+VB

7, 8
APPLICATIONS

common

output

Single module line extender in CATV systems operating

over a frequency range of 40 to 860 MHz.
handbook, halfpage

DESCRIPTION
Hybrid high dynamic range amplifier module operating
with a voltage supply of 24 V in a SOT115J package. The
high gain module consists of two cascaded stages both in
cascode configuration.

Side view

MSA319

Fig.1 Simplified outline.

QUICK REFERENCE DATA

SYMBOL
Gp
Itot

PARAMETER

CONDITIONS

power gain
total current consumption (DC)

MIN.

MAX.

UNIT

f = 50 MHz

33.5

34.5

dB

f = 860 MHz

34

dB

VB = 24 V

340

mA

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL

PARAMETER

MIN.

MAX.

UNIT

Vi

RF input voltage

55

dBmV

Tstg

storage temperature

40

+100

Tmb

operating mounting base temperature

20

+100

2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

BGY888

CHARACTERISTICS
Table 1

Bandwidth 40 to 860 MHz; VB = 24 V; Tcase = 30 C; ZS = ZL = 75

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

Gp

power gain

f = 50 MHz

33.5

34

f = 860 MHz

34

35

dB

SL

slope cable equivalent

f = 40 to 860 MHz

0.5

1.1

2.5

dB

FL

flatness of frequency response

f = 40 to 860 MHz

0.2

0.5

dB

S11

input return losses

S22

output return losses

34.5

UNIT
dB

f = 40 to 80 MHz

20

25

dB

f = 80 to 160 MHz

18.5

28

dB

f = 160 to 320 MHz

17

28

dB

f = 320 to 640 MHz

15.5

21

dB

f = 640 to 860 MHz

14

18.5

dB

f = 40 to 80 MHz

20

25.5

dB

f = 80 to 160 MHz

18.5

28.5

dB

f = 160 to 320 MHz

17

26.5

dB

f = 320 to 640 MHz

15.5

20.5

dB

f = 640 to 860 MHz

14

21

dB

S21

phase response

f = 50 MHz

135

225

deg

CTB

composite triple beat

49 channels flat; Vo = 44 dBmV;

measured at 859.25 MHz

63.5

60

dB

Xmod

cross modulation

49 channels flat; Vo = 44 dBmV;

measured at 55.25 MHz

63

59

dB

CSO

composite second order

distortion

49 channels flat; Vo = 44 dBmV;

measured at 860.5 MHz

64

55

dB

d2

second order distortion

note 1

74

65

dB

Vo

output voltage

dim = 60 dB; note 2

58

60

dBmV

noise figure

f = 50 MHz

4.5

dB

f = 550 MHz

dB

f = 600 MHz

dB

f = 650 MHz

5.5

dB

f = 750 MHz

dB

f = 860 MHz

5.5

dB

note 3

325

340

mA

Itot

total current consumption (DC)

Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 805.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 860.5 MHz.
2. Measured according to DIN45004B:
fp = 851.25 MHz; Vp = Vo;
fq = 858.25 MHz; Vq = Vo6 dB;
fr = 860.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 849.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.
2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

Table 2

BGY888

Bandwidth 40 to 860 MHz; VB = 24 V; Tcase = 30 C; ZS = ZL = 75

SYMBOL
Gp

PARAMETER
power gain

CONDITIONS

MIN.

TYP.

MAX.

UNIT

f = 50 MHz

33.5

34

34.5

dB

f = 860 MHz

34

35

dB

2.5

dB

SL

slope cable equivalent

f = 40 to 860 MHz

0.5

1.1

FL

flatness of frequency response

f = 40 to 860 MHz

0.2

0.5

dB

S11

input return losses

f = 40 to 80 MHz

20

25

dB

f = 80 to 160 MHz

18.5

28

dB

f = 160 to 320 MHz

17

28

dB

f = 320 to 640 MHz

15.5

21

dB

f = 640 to 860 MHz

14

18.5

dB

f = 40 to 80 MHz

20

25.5

dB

f = 80 to 160 MHz

18.5

28.5

dB

f = 160 to 320 MHz

17

26.5

dB

f = 320 to 640 MHz

15.5

20.5

dB

f = 640 to 860 MHz

14

21

dB

S22

output return losses

S21

phase response

f = 50 MHz

135

225

deg

CTB

composite triple beat

129 channels flat; Vo = 44 dBmV;

measured at 859.25 MHz

47.5

46

dB

Xmod

cross modulation

129 channels flat; Vo = 44 dBmV;

measured at 55.25 MHz

53.5

50

dB

CSO

composite second order

distortion

129 channels flat; Vo = 44 dBmV;

measured at 860.5 MHz

56

48

dB

d2

second order distortion

note 1

74

65

dB

Vo

output voltage

dim = 60 dB; note 2

58

60

dBmV

noise figure

see Table 1

dB

Itot

total current consumption (DC)

note 3

325

340

mA

Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 805.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 860.5 MHz.
2. Measured according to DIN45004B:
fp = 851.25 MHz; Vp = Vo;
fq = 858.25 MHz; Vq = Vo 6 dB;
fr = 860.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 849.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.

2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

Table 3

BGY888

Bandwidth 40 to 750 MHz; VB = 24 V; Tcase = 30 C; ZS = ZL = 75

SYMBOL
Gp

PARAMETER
power gain

CONDITIONS

MIN.

TYP.

MAX.

UNIT

f = 50 MHz

33.5

34

34.5

dB

f = 750 MHz

34

dB

SL

slope cable equivalent

f = 40 to 750 MHz

0.2

2.2

dB

FL

flatness of frequency response

f = 40 to 750 MHz

0.45

dB

S11

input return losses

f = 40 to 80 MHz

20

25

dB

f = 80 to 160 MHz

18.5

28

dB

f = 160 to 320 MHz

17

28

dB

f = 320 to 640 MHz

15.5

21

dB

f = 640 to 750 MHz

14

18.5

dB

f = 40 to 80 MHz

20

25.5

dB

f = 80 to 160 MHz

18.5

28.5

dB

f = 160 to 320 MHz

17

26.5

dB

f = 320 to 640 MHz

15.5

20.5

dB

f = 640 to 750 MHz

14

21

dB

S22

output return losses

S21

phase response

f = 50 MHz

135

225

deg

CTB

composite triple beat

110 channels flat; Vo = 44 dBmV;

measured at 745.25 MHz

52.5

50

dB

Xmod

cross modulation

110 channels flat; Vo = 44 dBmV;

measured at 55.25 MHz

55.5

51

dB

CSO

composite second order

distortion

110 channels flat; Vo = 44 dBmV;

measured at 746.5 MHz

61.5

53

dB

d2

second order distortion

note 1

65

dB

Vo

output voltage

dim = 60 dB; note 2

59

dBmV

noise figure

see Table 1

dB

Itot

total current consumption (DC)

note 3

325

340

mA

Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 691.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 746.5 MHz.
2. Measured according to DIN45004B:
fp = 740.25 MHz; Vp = Vo;
fq = 747.25 MHz; Vq = Vo6 dB;
fr = 749.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 738.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.

2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

Table 4

BGY888

Bandwidth 40 to 600 MHz; VB = 24 V; Tcase = 30 C; ZS = ZL = 75

SYMBOL
Gp

PARAMETER
power gain

CONDITIONS

MIN.

TYP.

MAX.

UNIT

f = 50 MHz

33.5

34

34.5

dB

f = 600 MHz

34

dB

SL

slope cable equivalent

f = 40 to 600 MHz

dB

FL

flatness of frequency response

f = 40 to 600 MHz

0.35

dB

S11

input return losses

f = 40 to 80 MHz

20

25

dB

f = 80 to 160 MHz

18.5

28

dB

f = 160 to 320 MHz

17

28

dB

f = 320 to 600 MHz

16

21

dB

f = 40 to 80 MHz

20

25.5

dB

S22

output return losses

f = 80 to 160 MHz

18.5

28.5

dB

f = 160 to 320 MHz

17

26.5

dB

f = 320 to 600 MHz

16

20.5

dB

S21

phase response

f = 50MHz

135

225

deg

CTB

composite triple beat

85 channels flat; Vo = 44 dBmV;

measured at 595.25 MHz

56.5

55

dB

Xmod

cross modulation

85 channels flat; Vo = 44 dBmV;

measured at 55.25 MHz

58

54

dB

CSO

composite second order

distortion

85 channels flat; Vo = 44 dBmV;

measured at 596.5 MHz

69.5

56

dB

d2

second order distortion

note 1

68

dB

Vo

output voltage

dim = 60 dB; note 2

61

dBmV

noise figure (DC)

see Table 1

dB

Itot

total current consumption

note 3

325

340

mA

Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 541.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 596.5 MHz.
2. Measured according to DIN45004B:
fp = 590.25 MHz; Vp = Vo;
fq = 597.25 MHz; Vq = Vo 6 dB;
fr = 599.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 588.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.

2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

BGY888

PACKAGE OUTLINE
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

D
E

A2
1

A
L

F
S
W

w M

e1

d
U2

q2

y M B

q1

x M B

y M B
p

U1

10 mm

scale
DIMENSIONS (mm are the original dimensions)
UNIT

A2
A
max. max.

mm 20.8

9.5

OUTLINE
VERSION

D
max.

E
max.

e1

L
min.

4.15
2.04
0.51
0.25 27.2
13.75 2.54 5.08 12.7 8.8
3.85
2.54
0.38

REFERENCES
IEC

JEDEC

JEITA

q1

q2

U1

U2

2.4 38.1 25.4 10.2 4.2 44.75 8.2 6-32 0.25 0.7
44.25 7.8 UNC

EUROPEAN
PROJECTION

Z
max.

0.1

3.8

ISSUE DATE
04-02-04
10-06-18

SOT115J

2001 Oct 25

Q
max.

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

BGY888

DATA SHEET STATUS

DOCUMENT
STATUS(1)

PRODUCT
STATUS(2)

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product
development.

Preliminary data sheet

Qualification

This document contains data from the preliminary specification.

Product data sheet

Production

This document contains the product specification.

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

DEFINITIONS
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.

Suitability for use NXP Semiconductors products are

not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customers own risk.

DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.

Applications Applications that are described herein for

any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.

Customers are responsible for the design and operation of

their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customers sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customers applications and products planned, as well as
for the planned application and use of customers third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.

2001 Oct 25

NXP Semiconductors

Product specification

860 MHz, 34 dB gain push-pull amplifier

Export control This document as well as the item(s)

described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.

NXP Semiconductors does not accept any liability related

to any default, damage, costs or problem which is based
on any weakness or default in the customers applications
or products, or the application or use by customers third
party customer(s). Customer is responsible for doing all
necessary testing for the customers applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customers third party
customer(s). NXP does not accept any liability in this
respect.

Quick reference data The Quick reference data is an

extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.

Limiting values Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.

In the event that customer uses the product for design-in

and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors specifications such use shall be solely at
customers own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors standard warranty and NXP
Semiconductors product specifications.

Terms and conditions of commercial sale NXP

Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customers general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

2001 Oct 25

BGY888

NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise

Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]

NXP B.V. 2010

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands

R77/05/pp10

Date of release: 2001 Oct 25