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STPS1045B

Power Schottky rectifier


Datasheet production data

Description
High voltage Schottky rectifier suited for switch
mode power supply and other power converters.

$
.

Packaged in DPAK, this device is intended for use


in high frequency circuitries where low switching
losses is required.

$
.

.
Table 1. Device summary

$
$

$
$
'3$.

Symbol

Value

IF(AV)

10 A

VRRM

45 V

Tj

175 C

VF(typ)

0.50 V

Features
Very small conduction losses
Extremely fast switching
Low thermal resistance
Negligible switching losses
Low forward voltage drop
Low capacitance
Avalanche specification
ECOPACK2 compliant component for DPAK
on demand

April 2015
This is information on a product in full production.

DocID6085 Rev 8

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www.st.com

Characteristics

STPS1045B

Characteristics
Table 2. Absolute ratings (limiting values, at 25 C unless otherwise stated)
Symbol

Parameter

Value

Unit

45

Repetitive peak reverse voltage

VRRM

IF(RMS) / pin Forward rms current


IF(AV)

Average forward current, square wave

Tc = 150 C, 0.5

10

IFSM

Surge non repetitive forward current

tp = 10 ms sinusoidal

75

PARM

Repetitive peak avalanche power

tp = 10 s, Tj = 125 C

285

-65 to + 175

175

Storage temperature range

Tstg

Maximum operating junction

Tj
1.

1
dPtot <
Rth(j-a)
dTj

temperature(1)

condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance


Symbol
Rth(j-c)

Parameter

Value

Unit

C/W

Junction to case

Table 4. Static electrical characteristics


Symbol

Parameter

Test conditions

IR (1)

Reverse leakage current

Tj = 25 C
Tj = 125 C
Tj = 25 C

VF(2)

Tj = 125 C

Forward voltage drop

Tj = 25 C
Tj = 125 C

Min.

VR = VRRM

100

15

mA

0.50

0.57
V

IF = 20 A

To evaluate the conduction losses use the following equation:

DocID6085 Rev 8

Unit

0.84

2. Pulse test: tp = 380 s, < 2%

2/8

Max.

0.63
IF = 10 A

1. Pulse test: tp = 5 ms, < 2%

P = 0.42 x IF(AV) + 0.015 IF2(RMS)

Typ.

0.65

0.72

STPS1045B

Characteristics

Figure 1. Average forward power dissipation


versus average forward current

Figure 2. Average forward current versus


ambient temperature (= 0.5)

PF (AV) (W)

12
= 0.1

= 0.05

= 0.2

IF (AV) (A )

= 0.5

R th(j-a) =R th(j-c)

10

=1

R th(j-a) =15C /W

4
3

R th(j-a) =70C /W

IF (AV) (A )

0
0

=tp/T
8

10

tp

11

12

Tamb (C )

0
0

Figure 3. Normalized avalanche power derating


versus pulse duration at Tj = 125 C

P ARM ( tp )
P ARM (10 s)

25

50

75

100

125

150

175

Figure 4. Relative variation of thermal


impedance junction to case versus pulse
duration

1.0

Zth (j-c) /R th(j-c )

0.8

0.1

0.6

= 0.5

0.4

0.01

= 0.2

= 0.1

0.2

single pulse

tp(s)
0.001

1E -4

10

100

1E -3

1E -2

=tp/T
1E -1

tp
1E +0

1000

Figure 5. Reverse leakage current versus


reverse voltage applied (typical values)

Figure 6. Junction capacitance versus reverse


voltage applied (typical values)
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DocID6085 Rev 8

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Characteristics

STPS1045B

Figure 7. Forward voltage drop versus forward


current

Figure 8. Thermal resistance junction to


ambient versus copper surface under tab
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STPS1045B

Package Information

Package Information

Epoxy meets UL94,V0

Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of


ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

2.1

DPAK package information


Figure 9. DPAK package outline

E

F

(

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7KHUPDOSDG

'

'

'

+
/
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H
H

5
F

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Note:

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SODQH

This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.

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Package Information

STPS1045B
Table 5. DPAK package mechanical data
Dimensions

Ref.

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

2.18

2.40

0.085

0.094

A1

0.90

1.1

0.035

0.043

A2

0.03

0.23

0.001

0.01

0.64

0.90

0.025

0.035

b4

4.95

5.46

0.195

0.215

0.46

0.61

0.018

0.024

c2

0.46

0.60

0.018

0.024

5.97

6.22

0.235

0.245

D1

5.10

0.201

6.35

0.250

E1

4.32

0.170

e1

4.4

4.7

0.173

0.185

9.35

10.40

0.368

0.407

1.0

1.78

0.039

0.070

1.27

0.05

L2

6.73

0.265

L4

0.6

1.02

0.024

0.040

V2

Figure 10. DPAK footprint (dimensions in mm)











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STPS1045B

Ordering information

Ordering information
Table 6. Ordering information
Order code

Marking

STPS1045B

S1045

STPS1045B-TR

Package

Weight

DPAK

0.30 g

S1045

Base qty

Delivery mode

75

Tube

2500

Tape and reel

Revision history
Table 7. Document revision history
Date

Revision

Changes

Jul-2003

3B

21-Apr-2005

IPAK package removed

03-Nov-2005

DPAK foot print dimensions updated.

01-Jul-2010

Updated Figure 10 Updated ECOPACK statement.

04-Nov-2014

Updated DPAK package information, Table 2 and


Figure 5. Removed PARM (Tj = 25 C).

07-Apr-2015

Updated Table 2.
Format update to current standard.

Last issue

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STPS1045B

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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

2015 STMicroelectronics All rights reserved

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