Technology Corporation

ProLight PG1C-1NWx
1W White Power LED
Technical Datasheet
Version: 1.2

Features
● High flux per LED
● Very long operating life(up to 100k hours)
● Good color uniformity

● Industry best moisture senstivity level - JEDEC 2a

4 week floor life without reconditioning

● Low-temp. & lead free reflow soldering

● RoHS compliant

● More energy efficient than incandescent and

most halogen lamps

● Low Voltage DC operated

● Instant light (less than 100ns)

● No UV

● Superior ESD protection

Typical Applications
● Excellent Design for Mining Lamp
● Reading lights (car, bus, aircraft)

● Portable (flashlight, bicycle)

● Uplighters/Downlighters

● Decorative/Entertainment
● Bollards/Security/Garden
● Cove/Undershelf/Task
● Indoor/Outdoor Commercial and
Residential Architectural
● Automotive Ext (Stop-Tail-Turn,

CHMSL, Mirror Side Repeat)

1 2008/09
Emitter Mechanical Dimensions

TOP VIEW BOTTOM VIEW

Notes:
1. The cathode side of the device is denoted by a hole in the lead frame.
2. Electrical insulation between the case and the board is required --- slug of device is not
electrically neutral. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not bend the leads of LED, otherwise it will damage the LED.
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.

*The appearance and specifications of the product may be modified for improvement without notice.

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Star Mechanical Dimensions

Notes:
1. Slots in aluminum-core PCB for M3 or #4 mounting screw.
2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote
positive and negative, respectively. All positive pads are interconnected, as are all negative pads,
allowing for flexibility in array interconnection.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.

*The appearance and specifications of the product may be modified for improvement without notice.

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Part Number
Color Emitter Star Beam Pattern

White PG1C-1NWE PG1C-1NWS Lambertian

Related Illumination (Lux) at Distance 1.0meter / 250mA

Color Minimum Illumination (Lux) guarantee while using ProLight's mine reflector Beam Pattern

White 1800 Spot

LED Light
Distance
( test board to LED light)

** Please refer to the reflector datasheet for the detail.

Optical Characteristics at 250mA, Junction Temperature, Tj=25℃

Dominant Wavelength λD Temperature
Peak Wavelength λp Spectral Coefficient or
Color Temperature(CCT) Half-width (nm) Dominant Wavelength
Color Min. Typ. Max. Δλ1/2 ΔλD/ΔTj (nm/℃)
White 4100 K 5000 K 10000 K -- --

Optical Characteristics at 250mA, Junction Temperature, Tj=25℃

( Continued)
Total included Angle Viewing Angle Typical Candela
Color Beam Pattern θ0.9V (degrees) 2θ1/2 (degrees) on Axis (cd)
White Lambertian 160 140 --

Electrical Characteristics at 250mA, Junction Temperature, Tj=25℃

Temperature Thermal
Coefficient of Resistance
Forward Voltage Vf(V) Dynamic Vf (mV/℃) Junction to
Color Min. Typ. Max. Resistance (Ω) ΔVf/ΔTj Slug (℃/W)
White 2.79 3.45 3.65 1.0 -2 10

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Absolute Maximum Ratings
Parameter White
DC Forward Current (mA) 350
Peak Pulsed Forward Current (mA) 500
Average Forward Current (mA) 350
ESD Sensitivity
±4000V (Class III)
(HBM per MIL-STD-883E Method 3015.7)
LED Junction Temperature (℃) 120
Aluminum-core PCB Temperature (℃) 105
Storage & Operating Temperature (℃) -40 to +105
Soldering Temperature (℃) 235°C

Photometric Luminous Flux Bin Structure

Bin Code Minimum Illumination (Lux) Typical Illumination (Lux)
S 1800 2700

● Measurement @1.0m / 250mA by Lutron LX103 Light Meter without Glass Lens.

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Color Bins

White Binning Structure Graphical Representation

0.48

0.46

0.44

0.42 4100 K

4500 K
0.40
TM
5000 K

0.38 UM TN
5650 K
UN
y

VM T0 Planckian
6300 K
0.36 (BBL)
WM VN U0 TP
7000 K
0.34 XM WN V0 UP
XN W0 VP
0.32 X0 WP
10000 K
Y0 WQ
0.30
XP White

YA
0.28

0.26
0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40
x

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Color Bins

White Bin Structure

Typ. CCT Typ. CCT
Bin Code x y Bin Code x y
(K) (K)
0.378 0.382 0.329 0.345
T0 0.374 0.366 4300 W0 0.329 0.331 5970
0.360 0.357 0.317 0.320
0.362 0.372 0.316 0.333
0.382 0.397 0.329 0.345
TN 0.378 0.382 4300 WN 0.316 0.333 5970
0.362 0.372 0.315 0.344
0.365 0.386 0.329 0.357
0.374 0.366 0.329 0.331
TP 0.370 0.351 4300 WP 0.329 0.320 5970
0.357 0.342 0.318 0.310
0.360 0.357 0.317 0.320
0.386 0.413 0.329 0.320
TM 0.382 0.397 4300 WQ 0.329 0.310 5970
0.365 0.386 0.319 0.300
0.367 0.400 0.318 0.310
0.362 0.372 0.329 0.369
U0 0.360 0.357 4750 WM 0.329 0.357 5970
0.344 0.344 0.315 0.344
0.346 0.359 0.314 0.355
0.365 0.386 0.308 0.311
UN 0.362 0.372 4750 X0 0.305 0.322 6650
0.346 0.359 0.316 0.333
0.347 0.372 0.317 0.320
0.360 0.357 0.305 0.322
UP 0.357 0.342 4750 XN 0.303 0.333 6650
0.343 0.331 0.315 0.344
0.344 0.344 0.316 0.333
0.365 0.386 0.308 0.311
UM 0.367 0.400 4750 XP 0.317 0.320 6650
0.348 0.385 0.319 0.300
0.347 0.372 0.311 0.293
0.329 0.331 0.301 0.342
V0 0.329 0.345 5320 XM 0.314 0.355 6650
0.346 0.359 0.315 0.344
0.344 0.344 0.303 0.333
0.329 0.345 0.308 0.311
VN 0.329 0.357 5320 Y0 0.283 0.284 8000
0.347 0.372 0.274 0.301
0.346 0.359 0.303 0.333
0.329 0.331 0.308 0.311
VP 0.344 0.344 5320 YA 0.311 0.293 8000
0.343 0.331 0.290 0.270
0.329 0.320 0.283 0.284
0.329 0.357
VM 0.329 0.369 5320
0.348 0.385
0.347 0.372
● Tolerance on each color bin (x , y) is ± 0.01

Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.

7
Color Spectrum, TJ = 25°C

Relative Spectral Power 1.0

Standard Eye Response Cruve
0.8
White
Distribution

0.6

0.4

0.2

0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)

Light Output Characteristics

Relative Light Output vs. Junction Temperature at 350mA

160
White
140
Relative Light Output (%)

120

100

80

60

40

20

0
1
-20 02 3
20 4
40 5
60 6
80 7
100 8
120
Junction Temperature, T J (℃)

8
Forward Current Characteristics, TJ = 25°C

400 1.2
Average Forward Current(mA)

350 1.0

Relative Luminous Flux

300
0.8
250
200 0.6
150
0.4
100
50
0.2
0 0.0
0 0.5 1 1.5 2 2.5 3 3.5 4 0 100 200 300 400
Forward Voltage(V) Forward Current(mA)
Fig 1. Forward Current vs. Forward Fig 2. Relative Luminous Flux vs.
Voltage for White. Forward Current for White at
Tj=25℃ maintained.

Ambient Temperature vs. Maximum Forward Current

White (TJMAX = 120°C)

400
350
Forward Current (mA)

300
250 RθJ-A = 60°C/W
200 RθJ-A = 50°C/W
150 RθJ-A = 40°C/W
100 RθJ-A = 30°C/W
50
0
0 25 50 75 100 125 150
Ambient Temperature (℃)

9
Typical Representative Spatial Radiation Pattern
Lambertian Radiation Pattern

1
0.9
0.8
Relative Intensity (%)

0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)

10
Moisture Sensitivity Level - JEDEC 2a

Soak Requirements
Level Floor Life Standard Accelerated Environment
Time Conditions Time (hours) Conditions Time (hours) Conditions
≤30°C / 30°C / 60°C /
2a 4 weeks 696 +5/-0 120 +1/-0
60% RH 60% RH 60% RH

● The standard soak time includes a default value of 24 hours for semiconductor manufature's
exposure time (MET) between bake and bag and includes the maximum time allowed out of
the bag at the distributor's facility.
● Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.

Soak Requirements
Level Floor Life Standard Accelerated Environment
Time Conditions Time (hours) Conditions Time (hours) Conditions
≤30°C / 85°C /
1 Unlimited 168 +5/-0 NA NA
85% RH 85% RH
≤30°C / 85°C /
2 1 year 168 +5/-0 NA NA
60% RH 60% RH
≤30°C / 30°C / 60°C /
2a 4 weeks 696 +5/-0 120 +1/-0
60% RH 60% RH 60% RH
≤30°C / 30°C / 60°C /
3 168 hours 192 +5/-0 40 +1/-0
60% RH 60% RH 60% RH
≤30°C / 30°C / 60°C /
4 72 hours 96 +2/-0 20 +0.5/-0
60% RH 60% RH 60% RH
≤30°C / 30°C / 60°C /
5 48 hours 72 +2/-0 15 +0.5/-0
60% RH 60% RH 60% RH
≤30°C / 30°C / 60°C /
5a 24 hours 48 +2/-0 10 +0.5/-0
60% RH 60% RH 60% RH
Time on Label ≤30°C / Time on Label 30°C /
6 NA NA
(TOL) 60% RH (TOL) 60% RH

11
Qualification Reliability Testing
Stress Test Stress Conditions Stress Duration Failure Criteria
Room Temperature
25°C, IF = max DC (Note 1) 1000 hours Note 2
Operating Life (RTOL)
Wet High Temperature
85°C/60%RH, IF = max DC (Note 1) 1000 hours Note 2
Operating Life (WHTOL)
Wet High Temperature
85°C/85%RH, non-operating 1000 hours Note 2
Storage Life (WHTSL)
High Temperature
110°C, non-operating 1000 hours Note 2
Storage Life (HTSL)
Low Temperature
-40°C, non-operating 1000 hours Note 2
Storage Life (LTSL)
Non-operating -40°C to 120°C, 30 min. dwell,
200 cycles Note 2
Temperature Cycle (TMCL) <5 min. transfer
Non-operating -40°C to 120°C, 20 min. dwell,
200 cycles Note 2
Thermal Shock (TMSK) <20 sec. transfer
1500 G, 0.5 msec. pulse,
Mechanical Shock Note 3
5 shocks each 6 axis

Natural Drop On concrete from 1.2 m, 3X Note 3

Variable Vibration 10-2000-10 Hz, log or linear sweep rate,

Note 3
Frequency 20 G about 1 min., 1.5 mm, 3X/axis
Solder Heat Resistance
260°C ± 5°C, 10 sec. Note 3
(SHR)
Steam age for 16 hrs., then solder dip Solder coverage
Solderability
at 260°C for 5 sec. on lead

Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Criteria for Judgement
Item Test Condition
Min. Max.
Forward Voltage (VF) IF = max DC - Initial Level x 1.1
Luminous Flux or
IF = max DC Initial Level x 0.7 -
Radiometric Power (ΦV)
Reverse Current (IR) VR = 5V - 50 μA
* The test is performed after the LED is cooled down to the room temperature.

3. A failure is an LED that is open or shorted.

12
Recommended Solder Pad Design

● All dimensions are in millimeters.

● Electrical isolation is required between Slug and Solder Pad.

13
Reflow Soldering Condition
Low-Temp. & Pb-Free Assembly
Profile Feature Sn-Pb Eutectic Assembly
(58Bi-42Sn Eutectic Alloy)
Preheat & Soak
Temperature min (T smin) 100 °C 90 °C
Temperature max (T smax) 150 °C 120 °C
Time (T smin to T smax) 60-120 seconds 60-120 seconds
Average Ramp-Up Rate (Tsmax to T P) 3 °C / second max. 2 °C / second max.
Liquidous temperature (TL) 183°C 138°C
Time at liquidous (t L) 60-150 seconds 20-50 seconds
Peak package body temperature (TP) 235°C 185°C
Time (t P) within 5°C of the specified
20 seconds 20 seconds
classification temperature (T C)
Average ramp-down rate (TP to Tsmax) 6 °C/second max. 3 °C/second max.
Time 25°C to Peak Temperature 6 minutes max. 4 minutes max.

● All temperatures refer to topside of the package, measured on the package body surface.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
LEDs will or will not be damaged by repairing.
● Reflow soldering should not be done more than two times.
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.

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Heat Plate Soldering Condition
(1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire

Solder Paste

MCPCB

Heat Plate
MCPCB
Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate.

Emitter Solder Wire

Heat Plate

Place Emitter on MCPCB. Place Solder Wire to the solder pad of MCPCB.

Emitter

Heat Plate Heat Plate

Put MCPCB on Heat Plate until Solder Paste melt. Put Emitter on MCPCB. Take the MCPCB out
The Solder Paste sould be melted within 10 seconds. from Heat Plate within 10 seconds.
Take out MCPCB out from Heat Plate within 15 seconds.

● Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
● We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.

Manual Hand Soldering

Thermal Conductive Glue Solder Wire
MCPCB Soldering Iron
Emitter

Place Thermal Comductive Glue Place Emitter on the MCPCB. Use Soldering Iron to solder the
on the MCPCB. leads of Emtter within 5 seconds.
● For prototype builds or small series production runs it possible to place and solder the emitters by hand.
● Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
● Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause

a short circuit in the array.

● Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit

and damage emitter.

15
Emitter Tube Packaging

Star Tube Packaging

Notes:
1. Emitter 50 pieces per tube and Star 20 pieces per tube.
2. Drawing not to scale.
3. All dimensions are in millimeters.
4. All dimendions without tolerances are for reference only.

**Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads
of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB.
The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

16
Precaution for Use
● Storage
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
● The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.

● The slug is to be soldered. If not, please use the heat conductive adhesive.

● Any mechanical force or any excess vibration shall not be accepted to apply during cooling

process to normal temperature after soldering.

● Please avoid rapid cooling after soldering.

● Components should not be mounted on warped direction of PCB.

● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,

a heat plate should be used. It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
● This device should not be used in any type of fluid such as water, oil, organic solvent and etc.

When cleaning is required, isopropyl alcohol should be used.

● When the LEDs are illuminating, operating current should be decide after considering the

package maximum temperature.

● The appearance, specifications and flux bin of the product may be modified for improvement

without notice. Please refer to the below website for the latest datasheets.
http://www.prolightopto.com/

Handling of Silicone Lens LEDs

Notes for handling of silicone lens LEDs
● Please do not use a force of over 3kgf impact or pressure on the silicone lens,

otherwise it will cause a catastrophic failure.

● The LEDs should only be picked up by making contact with the sides of the LED body.

● Avoid touching the silicone lens especially by sharp tools such as Tweezers.

● Avoid leaving fingerprints on the silicone lens.

● Please store the LEDs away from dusty areas or seal the product against dust.

● When populating boards in SMT production, there are basically no restrictions

regarding the form of the pick and place nozzle, except that mechanical pressure
on the silicone lens must be prevented.
● Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)

╳ ○
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