TECHNICAL NOTE

System Power Supply LSIs for use in automotive electronics

Highly Stable Bipolar

System Power Supply ICs
BA4911 / BA4911-V4
zDescription
The BA4911/BA4911-V4 provides multiple supply voltage outputs for use in car audio, satellite navigation systems, CD
player, radio, and other systems. In addition to overcurrent, overvoltage, and thermal shutdown circuits, it incorporates
circuitry for dealing with sudden BATTERY power failures, and is therefore ideal for car audio and satellite navigation
systems.

zFeatures
1) Built-in power supplies for car audio and satellite navigation systems
5.0 V microcontroller power supply
8.12 V audio power supply
7.9 V and 8.12 V radio power supplies
10.3 V lighting power supply
1 VDD-linked high side switch
2 VCC-linked high side switches
2) The ability to operate (VDD) using the charge stored in a backup capacitor makes the IC unlikely to malfunction in the
event of a sudden BATTERY power failure.
3) Output pins use low dropout PNP output.
4) Built-in overcurrent protection circuits
5) Built-in overvoltage protection circuit
6) Built-in thermal shutdown circuit
7) A 12-pin power package gives the IC large power dissipation capabilities and is ideal for space-saving designs.

zApplications
Car audio and satellite navigation systems

Ver.B Oct.2005

zAbsolute maximum ratings (Ta = 25C)

Parameter
Symbol
Supply Voltage
VCC
Power Dissipation
Pd
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
Maximum Junction Temperature
Tjmax
Peak Supply Voltage
VCC PEAK
*1 tr 1 ms; Bias voltage is applied for less than 200 ms.

Limits
36
3400
30 to +85
55 to +150
150
50*1

Unit
V
mW
C
C
C
V

tr 1 ms
50 V
35 V
MAX. 200 ms
(Voltage supply more than 35 V)

0V

Fig. 1 Peak Supply Voltage Waveform

zRecommended operating ranges (Ta = 25C)

Parameter
Recommended Supply Voltage Range 1
Recommended Supply Voltage Range 2
Recommended Supply Voltage Range 3

Limits
10 to 18
8.2 to 18
11.4 to 18

Unit
V
V
V

Comment
Except VDD and ILM output
VDD output
ILM output

zElectrical characteristics (Unless otherwise specified, Ta = 25C; VCC = 14.4 V)

Ist1
Ist2

Min.

Limits
Typ.
100
100

Max.
150
150

VO1
VO1
VO1
IO1
R.R1
VO1

4.80

300

3.7

5.00
0.4
2.5

55
4.0

VO2

7.8

8.12

Parameter

Symbol

Standby Circuit Current 1

Standby Circuit Current 2
Output Voltage (VDD) 1
Dropout Voltage 1
Dropout Voltage 2
Peak Output Current
Ripple Rejection
Low Vcc Output Voltage

Output Voltage (AUDIO) 2

Condition

A
A

VCC = 13.2 V

5.20
0.7
3.0

V
V
V
mA
dB
V

IO = 300 mA VCC = 10 V to 18 V
IO = 300 mA, VBU-VO1
IO = 300 mA, VCC-VO1
VO1 4.8 V
f = 100 Hz, VRR = 10 dBV
VCC = 5 V, Io = 10 mA

8.3

Dropout Voltage
VO2

0.4
0.7
Peak Output Current
IO2
200

Ripple Rejection
R.R2

55

*1 Design guarantee (Output inspection is not done on all products.)

This IC is not designed to be radiation-resistant.
Use Peak Output Current less than Limits Min. values.

2/16

Unit

V
mA
dB

IO2 = 200 mA, VCC = 10 V to 18 V

30C to 80C *1
IO2 = 200 mA, VCC-VO2
VO 2 7.8 V
f = 100 Hz, VRR = 10 dBV

zElectrical Characteristics (Unless otherwise specified, Ta = 25C; VCC = 14.4 V)

Parameter

Symbol

Dropout Voltage (P.CON) 3

Peak Output Current

VO3
IO3

Min.

300

Dropout Voltage (P.ANT) 4

Peak Output Current

VO4
IO4

300

Output Voltage (AM) 5

Dropout Voltage
Peak Output Current
Ripple Rejection

Output Voltage (FM) 6

Limits
Typ.
0.4

Max.
0.7

0.4

0.7

Unit
V
mA

IO3 = 200 mA
VO3 13.7 V

V
mA

IO4 = 200 mA
VO4 13.7 V

VO5

7.5

7.9

8.3

VO5
IO5
R.R5

50

0.4

55

0.7

V
mA
dB

VO6

7.8

8.12

8.3

VO6
IO6
R.R6

50

0.4

55

0.7

V
mA
dB

VO7

9.9

10.3

10.7

Dropout Voltage
Peak Output Current
Ripple Rejection

VO7
IO7
R.R7

250

0.4

50

0.7

V
mA
dB

Input Pin (SW1)

Standby Input Voltage
AUDIO ON
AUDIO, P-CON ON
AUDIO, P-CON, P-ANT ON
SW1 Input Impedance

Vth1-1
Vth1-2
Vth1-3
Vth1-4
Rin1

1.5
3.5
7.0
100

1.0
3.0
5.0
VCC

V
V
V
V
k

Input Pin (SW2)

Standby Input Voltage
ILM, FM ON
ILM, AM ON
SW2 Input Impedance

Vth2-1
Vth2-2
Vth2-3
Rin2

2.0
4.0
100

1.0
3.0
VCC

V
V
V
k

Dropout Voltage
Peak Output Current
Ripple Rejection

Output Voltage (ILM) 7

*1 Design guarantee (Output inspection is not done on all products.)

This IC is not designed to be radiation-resistant.
Use Peak Output Current less than limits minimum values.

3/16

Condition

IO5 = 50 mA, VCC = 10 V to

18 V
30C to 80C*1
IO5 = 50 mA
VO5 7.5 V
f = 100 Hz,VRR = 10 dBV
IO6 = 50mA, VCC = 10 V to
18 V
30C to 80C*1
IO6 = 50 mA, VCC-VO6
VO6 7.8 V
f = 100 Hz, VRR = 10 dBV
IO7 = 250 mA, VCC = 10 V to
18 V
IO7 = 250 mA, VCC-VO7
VO7 9.9 V
f = 100 Hz, VRR = 10 dBV

zReference data (Unless otherwise specified, VCC = 14.4 V)

800
From the top,
Ta = 25C
Ta = 85C
Ta = 30C

600

400

200

5
4

From the left,

Ta = 85C
Ta = 25C
Ta = 30C

3
2
1

10

15

20

SUPPLY VOLTAGE:Vcc [V]

20

30

Ta = 85C
Ta = 25C

0
180

240

40

20

4.9

100

1000

10000

100000

-40

0
10

20

30

40

Ta = 85C
6

Ta = 30C
4

Ta = 25C

AUDIO Line Regulation

(IO = No load)

40

60

80

100

Ta = 30C
0.4

0.3

0.2

Ta = 25C

Ta = 85C

0.1

SUPPLY VOLTAGE:Vcc [V]

Fig. 8

20

0.5

0
0

Fig. 7 VDD Output Voltage vs

Temperature

AUDIO DROPOUT VOLTAGE:Vo2 [V]

AUDIO OUTPUT VOLTAGE:Vo2 [V]

-20

AMBIENT TEMPERATURE:Ta []

10

From the left,

Ta = 85C
Ta = 25C
Ta = 30C

600

5.0

Fig. 6 VDD Ripple Rejection

Ratio
(IO = 300 mA)

500

5.1

FREQUENCY:f [Hz]

10

400

4.8

10

Fig. 5 VDD Dropout Voltage

(VCC = 4.8 V)

300

5.2

60

300

200

Fig. 4 VDD Load Regulation

From the top,

Ta = 25C
Ta = 85C
Ta = 30C

OUTPUT CURRENT:Io [mA]

100

OUTPUT CURRENT:Io [mA]

0
120

VDD OUTPUT VOLTAGE:Vo1 [V]

Ta = 30C
0.4

60

Ta = 25C
Ta = 30C

40

80
RIPPLE REJECTION:RR1 [dB]

VDD DROPOUT VOLTAGE:Vo1 [V]

10

Fig. 3 VDD Line Regulation

(IO = No load)

0.6

Ta = 85C

SUPPLY VOLTAGE:Vcc [V]

Fig. 2 Standby Circuit Current

0.2

AUDIO OUTPUT VOLTAGE:Vo2 [V]

VDD OUTPUT VOLTAGE:Vo1[V]

VDD OUTPUT VOLTAGE:Vo1[V]

STBY CIRCUIT CURRENT:Ist [uA]

1000

100

200

300

400

OUTPUT CURRENT:Io [mA]

Fig. 9

AUDIO Load Regulation

4/16

50

100

150

200

OUTPUT CURRENT :Io[mA]

Fig. 10

AUDIO Dropout Voltage

(VCC = 7.8 V)

60

40

20

P.CON OUTPUT VOLTAGE:Vo3 [V]

From the top,

Ta = 30C
Ta = 25C
Ta = 85C

AUDIO OUTPUT VOLTAGE:Vo2 [V]

8.2

8.1

8.0

7.9
10

100

1000

10000

100000

FREQUENCY:f [Hz]

Fig. 11

AUDIO Ripple Rejection

Ratio
(IO = 200 mA)

Fig. 12

12

From the left, Ta = 85C

Ta = 25C
Ta = 30C

20

40

60

80

100

200

300

400

From the left,

Ta = 85C
Ta = 25C
Ta = 30C

20

RIPPLE REJECTION:RR5 [dB]

30

20

30

40

AM Dropout Voltage
(VCC = 7.5 V)

30

50

60

90

120

150

OUTPUT CURRENT:Io [mA]

From the top,

Ta = 25C
Ta = 30C
Ta = 85C

60

40

20

Fig. 16

AM Load Regulation

8.0

7.9

7.8

7.7
10

OUTPUT CURRENT:Io [mA]

Fig. 17

40

0
10

From the left,

Ta = 85C
Ta = 25C
Ta = 30C

8.1

80

Ta = 85C

500

AM Line Regulation
(IO = No load)

Ta = 30C

0.2

400

0
10

Fig. 15

0.3

300

Fig. 13 P.CON Peak Output

Current

SUPPLY VOLTAGE:Vcc [V]

Ta = 25C

200

10

0.5

100

OUTPUT CURRENT:Io [mA]

500

Fig. 14 P.ANT Peak Output

Current

0.1

AUDIO Output Voltage vs

Temperature

OUTPUT CURRENT:Io [mA]

0.4

100

AM DROPOUT VOLTAGE:Vo5 [V]

AM OUTPUT VOLTAGE:Vo5 [V]

AM OUTPUT VOLTAGE:Vo5 [V]

P.CON OUTPUT VOLTAGE:Vo4 [V]

-20

10

From the left, Ta = 85C

Ta = 25C
Ta = 30C

AMBIENT TEMPERATURE:Ta []

15

12

0
-40

AM OUTPUT VOLTAGE:Vo5 [V]

RIPPLE REJECTION:RR2 [dB]

15

8.3

80

100

1000

10000

100000

FREQUENCY:f [Hz]

Fig. 18

AM Ripple Rejection
Ratio
(IO = 50 mA)

5/16

-40

-20

20

40

60

80

100

AMBIENT TEMPERATURE:Ta []

Fig. 19

AM Output Voltage vs
Temperature

6
From the left,
Ta = 85C
Ta = 25C
Ta = 30C

From the left, Ta = 85C

Ta = 25C
Ta = 30C

Ta = 30C
0.4
Ta = 25C
0.3

0.2

0.1

10

20

30

Ta = 85C

40

30

60

90

120

150

10

20

30

40

50

SUPPLY VOLTAGE:Vcc [V]

OUTPUT CURRENT:Io [mA]

OUTPUT CURRENT:Io [mA]

Fig. 20 FM Line Regulation

(IO = No load)

Fig. 21 FM Load Regulation

Fig. 22 FM Dropout Voltage

(VCC = 7.8 V)

FM OUTPUT VOLTAGE:Vo6 [V]

60

12

8.3

From the top,

Ta = 25C
Ta = 30C
Ta = 85C

40

20

ILM OUTPUT VOLTAGE:Vo7 [V]

80

8.2

8.1

8.0

7.9
10

100

1000

10000

100000

-20

20

40

60

80

100

200

300

400

500

OUTPUT CURRENT:Io [mA]

Fig. 26 ILM Load Regulation

30

40

80

From the top,

Ta = 25C
Ta = 30C
Ta = 85C

Ta = 30C
Ta = 25C
0.4

0.2

Ta = 85C

20

Fig. 25 ILM Line Regulation

(IO = No load)

RIPPLE REJECTION:RR7 [dB]

ILM DROPOUT VOLTAGE:Vo7 [V]

From the left, Ta = 85C

Ta = 25C
Ta = 30C

10

SUPPLY VOLTAGE:Vcc [V]

0.6

100

Fig. 24 FM Output Voltage vs

Temperature

12

From the left,

Ta = 85C
Ta = 25C
Ta = 30C

AMBIENT TEMPERATURE:Ta []

Fig.23 FM Ripple Rejection Ratio

(IO = 50 mA)

-40

FREQUENCY:f [Hz]

ILM OUTPUT VOLTAGE:Vo7[V]

FM DROPOUT VOLTAGE:Vo6[V]

RIPPLE REJECTION:RR6 [dB]

0.5

10

FM OUTPUT VOLTAGE:Vo6[V]

FM OUTPUT VOLTAGE:Vo6 [V]

10

60

40

20

0
0

50

100

150

200

250

10

100

1000

10000

100000

OUTPUT CURRENT:Io [mA]

FREQUENCY:f [Hz]

Fig. 27 ILM Dropout Voltage

(VCC = 9.9 V)

Fig. 28 ILM Ripple Rejection

Ratio (IO = 250 mA)

6/16

10

10.5
10.4
10.3
10.2
10.1

20

Ta = 85C
Ta = 25C
Ta = 30C

-40

-20

20

40

60

80

100

0.5

Fig. 29 ILM Output Voltage vs

Temperature

Fig. 30

20

1.5

Ta = 85C
Ta = 25C
Ta = 30C

AUDIO Input Threshold

Voltage

10

Ta = 85C
Ta = 25C
Ta = 30C

0.5

1.5

2.5

Fig. 32 P.ANT Input Threshold Voltage

Fig. 33 ILM Input Threshold Voltage

200

100

Ta = 85C
0
6

12

18

24

30

SW1/2 VOLTAGE:VSW1,2 [V]

Fig. 35 SW1/SW2 Input

Current

36

Ta = 85C
Ta = 25C
Ta = 30C

Fig.34

AM Input Threshold Voltage

10

From the left,

Ta = 85C
Ta = 25C
Ta = 30C

SW2 VOLTAGE:VSW2 [V]

AUDIO OUTPUT VOLTAGE:Vo2 [V]

AUDIO OUTPUT VOLTAGEVo2[V]

Ta = 25C

10

Ta = 30C

SW2 VOLTAGE:VSW2 [V]

300

400

10

12

12

Fig. 31 P.CON Input Threshold Voltage

SW1 VOLTAGE:VSW1 [V]

SW1 VOLTAGE:VSW1 [V]

SW1/2 CURRENT:ISW1,2 [A]

AM OUTPUT VOLTAGE:Vo5 [V]

ILM OUTPUT VOLTAGEVo7 [V]

15

2.5

15

Ta = 85C
Ta = 25C
Ta = 30C

10

SW1 VOLTAGE:VSW1 [V]

AMBIENT TEMPERATURE:Ta []

10

15

10.0

P.ANT OUTPUT VOLTAGEVo4 [V]

P.CON OUTPUT VOLTAGEVo3[V]

AUDIO OUTPUT VOLTAGEVo2 [V]

ILM OUTPUT VOLTAGE:Vo7 [V]

10.6

10

20

30

40

SUPPLY VOLTAGE:Vcc [V]

Fig. 36 Overvoltage Operation

7/16

50

100

150

200

AMBIENT TEMPERATURE:Ta []

Fig. 37 Thermal Shutdown

Operation

zBlock diagram
V CC
7
10F

Overvoltage
protection circuit

VBU
10F

Pre Reg
VBU

Vref

VDD
10F

Vf
Thermal shutdown

Vcc

AUDIO
10F

SW1

10

Vcc

4 state

P.CON
10F

Vcc

P.ANT
10F

Vcc

SW2 11
1

GND

P.CON

FM

AM

AUDIO

VCC

VDD

VBU

AM
10F

V CC

GND

BA4911

P.ANT

BA4911-V4

3 state

FM
10F

Vcc

10 SW1

12

11 SW2

ILM
10F

12 ILM

Fig. 38 Pin Assignment Diagram

zPin descriptions
1
GND
2

P.CON

P.ANT

4
5

FM
AM

AUDIO

VCC

VDD

VBU

10

SW1

11

SW2

12

ILM

Fig. 39 Block Diagram

This pin is connected to the IC's substrate.

This pin outputs a voltage that is approximately 0.4 V (TYP) lower than the VCC pin
voltage. Peak output current is 300 mA.
This pin outputs a voltage that is approximately 0.4 V (TYP) lower than the VCC pin
voltage. Peak output current is 350 mA.
This pin serves as the FM receiver power supply (8.12 V; peak output current: 50 mA).
This pin serves as the AM receiver power supply (7.9 V; peak output current: 50 mA).
This pin serves as the common system power supply for volume and sound control
(8.12 V, peak output current: 200 mA) as well as the power supply for variable
capacitance diodes and other components used for electronic tuning and cassette
player features, such as the equalizer.
This pin is connected to the car's backup and ACC power supplies.
This pin serves as the microcontroller power supply (5.0 V; peak output current: 300
mA).
This pin is connected to a capacitor for maintaining the VDD and backup voltages.
The AUDIO/AUDIO, P.CON/AUDIO, P.CON, and P.ANT outputs rise when a 2 V, 4
V, or 8 V is applied to the this pin.
The ILM, FM/ILM, and AM outputs rise when a 2.5 V or 5 V signal is applied to this
pin.
This pin serves as the lighting power supply (10.3 V; peak output current: 250 mA).
8/16

zI/O Equivalent circuit diagrams

2PIN(P.CON), 3PIN(P.ANT)
VCC

4PIN(FM)

5PIN(AM)
VCC

VCC

VCC

20K

20K

20K

P.CON
(2PIN)
AM
(5PIN)

FM
(4PIN)
160K

27.09K

27.99K

P.ANT
(3PIN)

80K

5K

5K
GND

GND

Fig.41

Fig.42

8PIN(VDD)

9PIN(VBU)

GND

Fig.40

6PIN(AUDIO)

VBU

VCC

VCC

80K

20K

5.1K

VDD
8PIN)

AUDIO
(6PIN)

610.16K

28.26K

200K

5K
GND

(9PIN)
VBU

GND

Fig.43

Fig.44

Fig.45

10PIN(SW1)

11PIN(SW2)

12PIN(ILM)
VCC

VCC

VCC
20K

110.8K

SW1

90K

SW2

(10PIN)

ILM
(12PIN)

(11PIN)
36.61K

29.2K

100K

50K

5K

GND

GND
GND

Fig.46

Fig.47

zTiming chart
V CC
VBU
V DD
SW 1
AUDIO
P.CON
P.ANT
SW 2
ILM
FM
AM

Fig. 49 Timing Chart

9/16

Fig.48

GND

MAIN AMP

B/T

AM

CS

ILM

SW2

SW1

VBU

VDD

VCC

AUDIO

AM

FM

P.ANT

BA4911
BA4911-V4
P.CON

VDD

FM

GND

IGN
SW1

CPU
SW2

zApplication circuit

ILM

BATT

10 10 10 10 10 10 10 10

10

AUTO ANT

(Unit R : , C : F)
Fig. 50

Application Circuits Example

10/16

zThermal design
50

(1)When using an infinite heat sink j-c = 2.0 (C /W)

3

(2)100 100 2 (mm ) (when usin an aluminum heat sink)

3

(3)50 50 2 (mm ) (when usin an aluminum heat sink)

40

POWER DISSIPATION:Pd [W]

37.5(1)

(4)During IC without heat sink operation. j-a = 36.8 (C /W)

Note: When using an aluminum heat sink, use a tightening
torque of 6 (kgcm) and apply silicon grease.

30

19.0(2)

20

8.0(3)

10

3.4(4)

25

50

75

100

125

150

AMBIENT TEMPERATURE:Ta [C]

Fig. 51 Power Dissipation Characteristics

Refer to the power dissipation characteristics illustrated in Fig. 51 when using the IC in an environment where Ta 25C. The
characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction
temperature Tjmax, the elements of the IC may be damaged or deteriorated. It is necessary to give sufficient consideration to the
heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability
of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction
temperature Tjmax.
The chip's (junction area) temperature Tj may rise considerably even when the IC is being used at room temperature (25C).
Always operate the IC within the power dissipation Pd.
Vcc
Vref

Load

Fig.52
The maximum power consumption PMAX (W) can be calculated as described below, where A denotes the
maximum VCC input voltage:
I1 = Max. VDD output current
I2 = Max. AUDIO output current
I3 = Max. P.CON output current
I4 = Max. P.ANT output current
I5 = Max. AM output current
I6 = Max. FM output current
I7 = Max. ILM output current
Power consumed by VDD
Power consumed by AUDIO
Power consumed by P.CON
Power consumed by P.ANT
Power consumed by AM
Power consumed by FM
Power consumed by ILM
Power consumed by each circuit's current

P1 = (A 5.0 V) x I1 + (I1 / 100 + I1 / 10) A

P2 = (A 8.12V) I2(I2/100I2/10) A
P3 = 1V I3 + (30 mA) A
P4 = 1V I4 + (30 mA) A
P5 = (A 7.9 V) I5 + (I5/20 + I5/10) A
P6 = (A 8.12 V) I6 + (I6/20 + I6/10) A
P7 = (A 10.3 V) I7 + (I7/80 + I7/10) A
P8 = A circuit current (circuit current is approximately 5 mA)

PMAX = P1 + P2 + P3 + P4 + P5 + P6 + P7 + P8
11/16

zOperating notes
1.
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection
devices, such as fuses.
2.

GND voltage

The potential of GND pin must be minimum potential in all operating conditions.
3.

Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.

4.

Pin short shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may
result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins
caused by the presence of a foreign object may result in damage to the IC.

5.

Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.

6.

Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.

7.

Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be
used.
Transistor (NPN)

Resistor
(Pin A)

(Pin B)

N
N

N
P substrate

P substrate

Parasitic element
GND

GND

Parasitic
elements
(Pin B)

(Pin A)

Parasitic element
E
GND

Other adjacent element

GND
Parasitic elements

Fig. 53 Example of a Simple Monolithic IC Architecture

12/16

8.

Ground Wiring Pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.

9.

Recommended operating ranges

Proper circuit functionality is guaranteed within the operating temperature range for supply voltages that fall within the
recommended ranges.
Although standard electrical characteristics values are not guaranteed, characteristics values will not vary suddenly
within these ranges.

10.

Output capacitors
Capacitors for stopping oscillation must be placed between the VDD (pin 8), AUDIO (pin 6), AM (pin 5), FM (pin 4),
P.CON (pin 2), P.ANT (pin 3), and ILM (pin 12) output pins and the GND pin.
It is recommended to use tantalum electrolytic capacitors, which have only slight variations in temperature and other
characteristics, with capacitance values of at least 10 F.
For capacitors that are subject to large temperature variations, characteristics can be improved by connecting an
in-series 1 F or higher ceramic capacitor and 1 resistor in parallel with the output capacitor.

11.

Applications with modes that reverse VCC and pin potentials may cause damage to internal IC circuits. For example,
such damage might occur when VCC is shorted with the GND pin while an external capacitor is charged. Table 1 lists
the maximum capacitance values for individual pins.
It is recommended to connect a diode for adverse current prevention in series to the Vcc pin or insert a bypass diode
between each pin and Vcc pin. When the possibility exists that the VCC pin will carry a lower voltage than the GND pin,
insert a protective diode between the VCC and GND pins.

Bypass diode

Back current prevention diode

Output pin

Output capacitor

AM

10 F to 22 F

AUDIO

10 F to 2200 F

VDD

10 F to 22 F

ILM

10 F to 22 F

FM

10 F to 2200 F

Vcc

Protective
diode

Output pin

Table 1
Fig. 54 Example of Back Current Prevention Diode
and Bypass Diode Insertion
12.

Overcurrent protection circuits

The IC incorporates built-in overcurrent protection circuits for the VDD (pin 8), AUDIO (pin 6), AM (pin 5), FM (pin 4),
P.CON (pin 2), P.ANT (pin 3), and ILM (pin 12) output pins. This circuit serves to protect the IC from damage when the
load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and
instantaneous current flow originating from a large capacitor or other component. These protection circuits are
effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in
applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal
designing, keep in mind that the current capability has negative characteristics to temperatures.

13.

Overvoltage protection circuit

Overvoltage protection is designed to turn off all output when the voltage differential between the VCC (pin 7) and GND
(pin 1) pins exceeds approximately 27 V (at room temperature).
Use caution when determining the supply voltage range to use.

13/16

14.

Thermal shutdown circuit (TSD)

This IC incorporates a built-in temperature protection circuit for the protection from thermal destruction. The IC should
be used within the specified power dissipation range. However, in the event that the IC continues to be operated in
excess of its power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown
circuit to turn off all output power elements. The circuit will automatically reset once the chip's temperature Tj drops.
Operation of the thermal shutdown circuit presumes that the IC's absolute maximum ratings have been exceeded.
Application designs should never make use of the thermal shutdown circuit.

15.

Ground patterns
Pattern routes connecting the ground points to the GND pin (pin 1), indicated in the application circuits example, must
be as short and thick as possible to reduce line impedance.

16.

Bypass capacitor between the VCC and GND pin

It is recommended to insert a bypass capacitor from 10 F to 10 mF between the VCC and GND pins, positioning it as
close as possible to the pins.

17.

Grounding the P.CON and P.ANT pin

When the IC's GND pin (pin 1) is open and the P.CON (pin 2) and P.ANT (pin 3) pins are connected to a negative
battery terminal, a parasitic element may occur inside the IC, resulting in damage. To prevent such damage, it is
recommended to insert a schottky diode between the P.CON and P.ANT pins and the GND pin. (See Fig. 55.)
Vcc1
Power
supply

P.CON

P.ANT

GND

Fig. 55 Ground Prevention Circuit Diagram

18.

Applications with modes where the potentials of the input (VCC) and GND pins and other output pins may be reversed
from their normal states, may cause damage to the IC's internal circuitry. It is recommended to create a bypass route
with diodes or other components when loads, including large impedance components, are connected as with the
P.ANT and P.CON pins in applications where back EMF may be generated during startup or when output is turned off.
(Example)

Output pin

Fig. 56 Example of Protective Diode Insertion

19.

Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure
to verify circuit characteristics for your particular application. Modification of constants for other externally connected
circuits may cause variations in both static and transient characteristics for external components as well as this Rohm
IC. Allow for sufficient margins when determining circuit constants.

14/16

zSelecting a model name when ordering

4 9 1 1

B A

Package

ROHM
model name

Packaging specifications:
Tube container

SIP-M12
<Dimension>

<Packing information>
Container
29.8 0.2

4.7 0.2

24.0 0.1

Quantity

300pcs

Direction
of feed

Direction of products is fixed in a container tube.

13.9 0.3

1.2

7.0 0.1
6.5 0.5

21.6 0.5

6.9 0.1

R1.8

Tube

12

2.54

0.6

0.4 0.1

1.2

(Unit:mm)

B A

When you order , please order in times the amount of package quantity.

- V 4

4 9 1 1

Package
-V4: Forming

ROHM
model name

Packaging specifications:
Tube container

SIP-M12(V4)
<Dimension>

<Packing information>
Container

Tube

Quantity

300pcs

Direction
of feed

Direction of products is fixed in a container tube.

(Unit:mm)

When you order , please order in times the amount of package quantity.

15/16

The contents described herein are correct as of October, 2005

The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD.
Any part of this application note must not be duplicated or copied without our permission.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding
upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any
warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such
infringement, or arising from or connected with or related to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other
proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer.
The products described herein utilize silicon as the main material.
The products described herein are not designed to be X ray proof.

Published by
Application Engineering Group

Catalog No.05T384Be '05.10 ROHM C 1000 TSU

Appendix

Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.

The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact your nearest sales office.

ROHM Customer Support System

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Appendix1-Rev2.0