BPUTSYLLABUS
BPUTSYLLABUS
BPUTSYLLABUS
Module-I
14
Lectures
Overview of MEMS and Microsystems. (Chapter 1 of Text Book 1)
Micromachining Techniques: Silicon as material for micromachining,
Photolithography,
thin film deposition, doping, wet and dry etching, surface and bulk micromachining,
Wafer
bonding, packaging. (Chapter 3 and Section 8.2 of Text Book 1, Chapter 2 of Text
Book 2)
Module II
10
lectures
Microsystem Modeling and Design: Mechanics of deformable bodies, Energy
method,
Estimation of stiffness and damping for different micro-structures, Modeling of
electromechanical systems, Pull-in voltage. (Section 4.1 to 4.3 and 6.2.2 of Text
Book 1,
Section 3.4 of Text Book 2)
Module III
15
Lectures
MEMS Applications: Mechanical sensors and actuators: Piezoresistive pressure
sensors,
MEMS capacitive accelerometer, Gyroscopes, Piezoelectric actuators. (Section 8.3 of
Text Book 1 and Section 5.3 and 5.11 of Text Book 2)
Optical: Micro-lens, Micro-mirror, Optical switch (Section 7.5 to 7.7 of Text Book 2)
Radio frequency MEMS: Inductor, Varactor, Filter, Resonator. (Section 9.3 to 9.7 of
Text
Book 2)
Microfluidics: Capillary action, Micropumping, Electrowetting, Lab-on-a-chip. (Section
10.1 to 10.8 of Text Book 2)
Text Books:
1. G.K. Ananthsuresh, K.J. Vinoy, S. Gopalakrishnan, K.N. Bhat and V.K.
Atre: Micro
and Smart Systems, Wiley India, New Delhi, 2010.
2. N.P. Mahalik: MEMS, Tata McGraw-Hill, New Delhi, 2007.
Reference Book:
1. T. Hsu: MEMS and Microsystems: Design and Manufacture, Tata McGrawHill, New
Delhi, 2002.
WIRELESS SENSOR NETWORK
Unit I
8Hrs
Sensor Network Concept: Introduction, Networked wireless sensor devices,
Advantages of