3 mm x 5 mm

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

16-BIT, LOW POWER, VOLTAGE OUTPUT, I C INTERFACE DIGITAL-TO-ANALOG

CONVERTER
FEATURES

DESCRIPTION

Micropower Operation: 160 A @ 5 V

Power-On Reset to Zero
Single Supply: +2.7 V to +5.5 V
16-Bit Monotonic
Settling Time: 10 s to 0.003% FSR
I2C Interface With High-Speed Mode
Supports Data Receive and Transmit
On-Chip Rail-to-Rail Output Buffer
Double-Buffered Input Register
Supports Synchronous Multichannel Update
Offset Error: 1 mV max at 25C
Full-Scale Error: 3 mV max at 25C
Small 8 Lead MSOP Package

The DAC8571 is a small low-power, 16-bit voltage

output DAC with an I2C compatible two-wire serial
interface. Its on-chip precision output amplifier allows
rail-to-rail output swing and settles within 10
microseconds. The DAC8571 architecture is 16-bit
monotonic, and factory trimming typically achieves 4
mV absolute accuracy at all codes. The DAC8571
requires an external reference voltage to set its
output voltage range.
The low power consumption and small size
part make it ideally suited to portable
operated equipment. The power consumption
cally 800 W at VDD = 5 V reducing to 1
power-down mode.

The DAC8571 incorporates a 2-wire I2C interface.

Standard, fast, and high-speed modes of I2C operation are all supported up to 3.4 MHz serial clock
speeds. Multichannel synchronous data update and
power-down operations are supported through the I2C
bus. DAC8571 is also capable of transmitting the
contents of its serial shift register, a key feature for
I2C system verification.

APPLICATIONS

of this
battery
is typiW in

Process Control
Data Acquisition Systems
Closed-Loop Servo Control
PC Peripherals
Portable Instrumentation

The DAC8571 is available in an 8-lead MSOP package and is specified over -40C to 105C.
VREF
V(SENSE)
_
Ref +
16 Bit DAC
VDD

VOUT

16
DAC Register

Temporary Register

SDA
SCL
A0

I2C Block

Power Down
Control Logic

Resistor
Network

GND

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
I2C is a trademark of Philips Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright 20022003, Texas Instruments Incorporated

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
PIN CONFIGURATIONS

VDD
VREF

V(SENSE)
VOUT

GND
SDA
SCL
A0

PIN DESCRIPTION
Pin

Name

Function

VDD

Analog voltage supply input

VREF

Positive reference voltage input

V(SENSE)

Analog output sense

VOUT

Analog output voltage from DAC

A0

Device address select

SCL

Serial clock input

SDA

Serial data input/output

GND

Ground reference point for all circuitry on the part

PACKAGE/ORDERING INFORMATION
Product

Package

Package
Designator

Specified Temperature
Range

Package
Marking

Ordering Number

Transport
Media,
Quantity

DAC8571

8-MSOP

DGK

-40C to +105C

D871

DAC8571IDGK
DAC8571IDGKR

Tube, 80
Tape & Reel,
2500

ABSOLUTE MAXIMUM RATINGS (1)

UNITS
VDD to GND

-0.3 V to +6 V

Digital input voltage to GND

-0.3V to VDD + 0.3V

VOUT to GND

-0.3V to +VDD + 0.3V

Operating temperature range

-40C to + 105C

Storage temperature range

-65C to +150C

Junction temperature range (TJmax)

+ 150C

JAThermal impedance

260C/W

JCThermal impedance

44C/W

Lead temperature, soldering

(1)

Vapor phase (60s)

215C

Infrared (15s)

220C

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

ELECTRICAL CHARACTERISTICS
VDD = +2.7 V to +5.5 V; RL = 2 k to GND; CL = 200 pF to GND; low power mode; all specifications -40C to 105C (unless
otherwise noted)
DAC8571
PARAMETER

CONDITIONS

STATIC PERFORMANCE

MIN

TYP

MAX

UNITS

(1)

Resolution

16

Bits
0.098

Relative accuracy

LSB

Measured at code 485, 25C

0.3

1.0

mV

Measured at code 485, -40C...105C

1.0

5.0

Measured at code 64714, 25C

0.5

3.0

Measured at code 64714, -40C...105C

1.0

5.0

Measured at code 64714, 25C

1.0

3.0

Measured at code 64714, -40C...105C

2.0

5.0

All zeroes loaded to DAC register

-20

V/C

-5

ppm of FSR/C

Monotonic by design

Offset error
Full-scale error
Gain error
Zero code error drift
Gain temperature coefficient
Absolute accuracy

% of FSR

0.25

Differential nonlinearity

All codes from code 485 to code 64714, 25C

2.5

All codes from code 485 to code 64714,

-40C...105C

3.5

mV
mV

mV

OUTPUT CHARACTERISTICS (2)

Output voltage range
Output voltage settling time (full
scale)

Slew rate

0
RL = 2 k; CL < 200 pF, fast settling

RL = 2 k; CL = 500 pF, fast settling

12

RL = 2 k; CL < 200 pF, low power

13

RL = 2 k; CL < 200 pF, fast settling

RL = 2 k; CL < 200 pF, low power

Capacitive load stability

VREF

10

s
s

15

s
V/s

0.5

RL =

470

RL = 2 k

pF

1000

pF

Digital-to-analog glitch impulse

20

nV-s

Digital feedthrough

0.5

nV-s

50

mA

VDD = +3 V

20

mA

Coming out of power-down mode, VDD = +5 V

2.5

Coming out of power-down mode, VDD = +3 V

DC output impedance
Short circuit current
Power-up time

VDD = +5 V

PSRR

0.75

mV/V

REFERENCE INPUT
VREFH input range

Reference input impedance

LOGIC INPUTS

VDD
140

V
k

(2)

Input current
VIN_L, Input low voltage

VDD = 2.7-5.5 V

VIN_H0 , Input high voltage

VDD = 2.7-5.5 V

0.3VDD

pF

5.5

0.7VDD

Pin capacitance

POWER REQUIREMENTS
VDD

2.7

IDD (normal operation)

(1)
(2)

DAC active, Iref included

Linearity calculated using a reduced code range of 485 to 64714. Output unloaded.
Assured by design and characterization, not production tested.
3

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

ELECTRICAL CHARACTERISTICS (continued)

VDD = +2.7 V to +5.5 V; RL = 2 k to GND; CL = 200 pF to GND; low power mode; all specifications -40C to 105C (unless
otherwise noted)
DAC8571
PARAMETER

CONDITIONS

TYP

MAX

UNITS

VDD = +4.5 V to +5.5 V

VIH = VDD, VIL = GND, fast settling

250

400

VIH = VDD, VIL = GND, low power

160

225

VIH = VDD, VIL = GND, fast settling

240

380

VIH = VDD, VIL = GND, low power

140

200

VDD = +2.7 V to +3.6 V

MIN

IDD (all power-down modes)

DAC active, Iref included

VDD = +4.5 V to +5.5 V

VIH = VDD and VIL = GND

0.2

VDD = +2.7 V to +3.6 V

VIH = VDD and VIL = GND

0.05

IL = 2 mA, VDD = +5 V

93%

MAX

UNITS

Standard mode

100

kHz

Fast mode

400

kHz

High-speed mode, CB - 100pF max

3.4

MHz

1.7

MHz

POWER EFFICIENCY
IOUT/IDD

TIMING CHARACTERISTICS
VDD = +2.7 V to +5.5 V; RL = 2 k to GND; all specifications -40C to 105C (unless otherwise noted)
SYMBOL

PARAMETER

tSCL

SCL clock frequency

tBUF

Bus free time between a STOP and

START condition

TEST CONDITIONS

MIN

High-speed mode, CB - 400pF max

tHO; tSTA

tLOW

tHIGH

tSU; tSTA

tSU; tDAT

tHD; tDAT

tRCL

Hold time (repeated) START condition

LOW period of the SCL clock

HIGH period of the SCL clock

Setup time for a repeated START

condition

Data setup time

Data hold time

Rise time of SCL signal

TYP

Standard mode

4.7

Fast mode

1.3

s
s

Standard mode

4.0

\s
ns

Fast mode

600

High-speed mode

160

ns

Standard mode

4.7

Fast mode

1.3

Standard mode

4.0

Fast mode

600

ns

High-speed mode, CB - 100pF max

60

ns

High-speed mode, CB - 400pF max

120

ns

Standard mode

4.7

Fast mode

600

ns

High-speed mode

160

ns

Standard mode

250

ns

Fast mode

100

ns

High-speed mode

10

Standard mode

0.9

Fast mode

0.9

High-speed mode, CB - 100pF max

70

ns

High-speed mode, CB - 400pF max

150

ns

Standard mode

20 + 0.1CB

1000

ns

Fast mode

20 + 0.1CB

300

ns

High-speed mode, CB - 100pF max

10

40

ns

High-speed mode, CB - 400pF max

20

80

ns

ns

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

TIMING CHARACTERISTICS (continued)

VDD = +2.7 V to +5.5 V; RL = 2 k to GND; all specifications -40C to 105C (unless otherwise noted)
SYMBOL

tRCL1

tFCL

tRCA

tFDA

tSU; tSTO
CB

PARAMETER
Rise time of SCL signal after a
repeated START condition, and
after an acknowledge BIT

Fall time of SCL signal

Rise time of SDA signal

Fall time of SDA signal

Setup time for STOP condition

MAX

UNITS

Standard mode

20 + 0.1CB

MIN

1000

ns

Fast mode

20 + 0.1CB

300

ns

Pulse width of spike suppressed

VNH

Noise margin at the HIGH level for

each connected device (including
hysteresis)
Noise margin at the LOW level for
each connected device (including
hysteresis)

TYP

High-speed mode, CB - 100pF max

10

80

ns

High-speed mode, CB - 400pF max

20

1600

ns

Standard mode

20 + 0.1CB

300

ns

Fast mode

20 + 0.1CB

300

ns

High-speed mode, CB - 100pF max

10

40

ns

High-speed mode, CB - 400pF max

20

80

ns

Standard mode

20 + 0.1CB

1000

ns

Fast mode

20 + 0.1CB

300

ns

High-speed mode, CB - 100pF max

10

80

ns

High-speed mode, CB - 400pF max

20

160

ns

Standard mode

20 + 0.1CB

300

ns

Fast mode

20 + 0.1CB

300

ns

10

80

ns

High-speed mode, CB - 400pF max

20

160

Standard mode

4.0

Fast mode

600

ns

High-speed mode

160

ns

High-speed mode, CB - 100pF max

Capacitive load for SDA and SCL

tSP

VNL

TEST CONDITIONS

ns

400

pF

Fast mode

50

ns

High-speed mode

10

ns

Standard mode
Fast mode

0.2VDO

0.1VDO

High-speed mode
Standard mode
Fast mode
High-speed mode

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

TYPICAL CHARACTERISTICS
At TA = +25C, unless otherwise noted.
DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT
CODE

LINEARITY ERROR vs DIGITAL INPUT CODE

64

0.8

48

0.4

16

0.2

DLE - LSB

Linearity Error - LSB

0.6

32

-16
-32

0
- 0.2
- 0.4
- 0.6

-48

- 0.8

-64

-1

10000

20000

30000

40000

50000

60000

Figure 1.

Figure 2.

ERROR vs TEMPERATURE

ERROR vs TEMPERATURE

FullScale

Error mV

ZeroScale

VDD = 3 V
2

Gain

Error mV

VDD = 5 V

FullScale

Gain
0

ZeroScale

3
40

20

20

40

60

80

100

40

20

TA FreeAir Temperature C

DIFFERENTIAL LINEARITY ERROR

vs
TEMPERATURE

100

1
MAX Error

Differential Linearity Error - LSB

Linearity Error - LSB

80

LINEARITY ERROR
vs
TEMPERATURE

0
MIN Error

- 32
- 48

0.8
0.6

MAX Error

0.4
0.2
0
- 0.2

MIN Error

- 0.4
- 0.6
- 0.8

0
40
80
TA - Free-Air Temperature - C

Figure 5.

60

Figure 4.

16

- 64
- 40

40

Figure 3.

32

- 16

20

TA FreeAir Temperature C

64
48

50000 60000

10000 20000 30000 40000

Digital Input Code

Digital Input Code

110

-1
- 40

40
TA - Free-Air Temperature - C

Figure 6.

80

110

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

TYPICAL CHARACTERISTICS (continued)

At TA = +25C, unless otherwise noted.
SINK CURRENT AT NEGATIVE RAIL

SOURCE CURRENT AT POSITIVE RAIL

5

0.125

VOUT - Output Voltage - V

VOUT - Output Voltage - V

0.15

VDD = 2.7 V

0.1
VDD = 5 V
0.075
0.05
VREF = VDD - 10 mV
DAC Loaded With 0000 H

0.025

4.95

4.9

VREF = VDD - 10 mV
DAC Loaded With FFFFH
VDD = 5 V

4.85

4.8
0

Figure 7.
SOURCE CURRENT AT POSITIVE RAIL

SUPPLY CURRENT vs DIGITAL INPUT CODE

250
IDD - Supply Current - A

VOUT - Output Voltage - V

Figure 8.

2.7

2.65

2.6

VREF = VDD - 10 mV
DAC Loaded With FFFFH
VDD = 2.7 V

2.55

200

VDD = 5 V

150
VDD = 3.6 V
100
50
Reference Current Included

2.5

0
0

10000

20000

30000

40000

ISOURCE - Source Current - mA

Digital Input Code

Figure 9.

Figure 10.

SUPPLY CURRENT vs TEMPERATURE

50000

60000

SUPPLY CURRENT vs SUPPLY VOLTAGE

140

250
IREF Included
VDD = 5.5 V

200

IDD - Supply Current - A

IDD Supply Current A

ISOURCE - Source Current - mA

ISINK - Sink Current - mA

150
VDD = 3.6 V
100
50

VREF = VDD, IDD Measured at Power-Up,

Reference Current Included, No Load

120
100
80
60
40
20

0
40

20

20

40

60

TA FreeAir Temperature C

Figure 11.

80

100

2.7

3.1

3.5

3.9

4.3

4.7

5.1

5.5

VDD - Supply Voltage - V

Figure 12.

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

TYPICAL CHARACTERISTICS (continued)

At TA = +25C, unless otherwise noted.
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE

HISTOGRAM OF CURRENT CONSUMPTION

2500
TA = 25C, A0 Input (All Other Inputs = GND)
Reference Current Included

IREF Included
2000

0.8
0.7

VDD = VREF = 5.5 V

0.6
VDD = VREF = 2.7 V

0.5
0.4

VDD = 5.5 V

VDD = 2.7 V

f - Frequency

IDD - Supply Current - mA

0.9

1500
1000

0.3
500

0.2
0.1

0
0

40

160

Figure 14.

5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
-0.5

240

280

OUTPUT GLITCH (Mid-Scale)

2.5

2.45

2.4
Vref = VDD - 50 mV

2.35

Code 7FFFh to 8000h

(Glitch Occurs Every N x 4096
Code Boundary)

2.3

t - Time - 5s/div

Figure 15.

10

15
t - Time - S

20

25

Figure 16.

ABSOLUTE ERROR

FULL-SCALE SETTLING TIME (Large Signal)

0.005

VDD = 5 V
VOUT Output Voltage V

0.004
0.003
0.002
0.001
0
-0.001
-0.002
-0.003

5
4
3
2
1

-0.004

VDD = VREF
=5V
Output
Loaded With
2 k and
200 pF to
GND

-0.005
0

10000 20000 30000 40000 50000 60000

t Time 12s/div, FastSettling Mode

Digital Input Code

Figure 17.

200

Figure 13.

VO (V, 50 mV/div)

VOUT - Output Voltage - V

120

IDD - Supply Current - A

EXITING POWER-DOWN MODE

Total Unadjusted Error - V

80

Logic Input Voltage - V

Figure 18.

30

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

TYPICAL CHARACTERISTICS (continued)

At TA = +25C, unless otherwise noted.
HALF-SCALE SETTLING TIME (Large Signal)

FULL-SCALE SETTLING TIME (Large Signal)

3.5

2.5
2.0
VDD = VREF
=5V
Output
Loaded With
2 k and
200 pF to
GND

1.5
1.0
0.5

3.0

VOUT Output Voltage V

VOUT Output Voltage V

3.0

2.5
2.0

VDD = VREF
= 2.7 V
Output
Loaded With
2 k and
200 pF to
GND

1.5
1.0
0.5
0.0

0.0

t Time 12s/div, FastSettling Mode

t Time 12s/div, FastSettling Mode

Figure 19.

Figure 20.

HALF-SCALE SETTLING TIME

SIGNAL-TO-NOISE RATIO vs OUTPUT FREQUENCY

SIGNAL-TO-NOISE RATIO vs OUTPUT FREQUENCY

1.50

96
VDD = 5V
94

1.00

SNR (dB)

VOUT Output Voltage V

98

VDD = VREF
= 2.7 V
Output
Loaded With
2 k and
200 pF to
GND

0.50

92
VDD = 2.7V
90
88
VDD = VREF
-1dB FSR Digital Input, FS = 52ksps
Measurement Bandwidth = 20kHz

86

0.00
84

t Time 12s/div, FastSettling Mode

500

1k

1.5k

2k

2.5k

3k

3.5k

4k

4.5k

Output Frequency (Hz), Fast-Settling Mode

Figure 21.

Figure 22.

TOTAL HARMONIC DISTORTION vs OUTPUT FREQUENCY

TOTAL HARMONIC DISTORTION vs OUTPUT FREQUENCY

OUTPUT FREQUENCY

VDD = VREF = 5V
FS = 52ksps, - 1dB FSR Digital Input
Measurement Bandwidth = 20kHz

- 10
- 20

- 20
- 30

- 30
- 40

THD (dB)

THD (dB)

VDD = VREF = 2.7V

FS = 52ksps, - 1dB FSR Digital Input
Measurement Bandwidth = 20kHz

- 10

THD

- 50
- 60

- 40
THD

- 50
- 60
- 70

- 70
- 80

- 80

3rd Harmonic

- 90

- 90

2nd Harmonic

- 100
0

500

1k

1.5k

2nd Harmonic

3rd Harmonic

- 100
2k

2.5k

3k

3.5k

Output Frequency (Hz), Fast-Settling Mode

Figure 23.

4k

500

1k

1.5k

2k

2.5k

3k

3.5k

4k

Output Frequency (Hz), Fast - Settling Mode

Figure 24.

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

TYPICAL CHARACTERISTICS (continued)

At TA = +25C, unless otherwise noted.

Small-Signal Settling
Time
5mV/div

Trigger
Signal

Time (2s/div)

Figure 25.

10

FULL-SCALE SETTLING TIME

(Small-Signal-Negative Going Step)

Output Voltage

Output Voltage

FULL-SCALE SETTLING TIME

(Small-Signal-Positive Going Step)

Small-Signal Settling
Time
5mV/div

Trigger
Signal

Time (2s/div)

Figure 26.

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

THEORY OF OPERATION
D/A SECTION
The architecture of the DAC8571 consists of a string DAC followed by an output buffer amplifier. Figure 27
shows a block diagram of the DAC architecture.
Reference Voltage
V(SENSE)

DAC Register

Ref+
Resistor
String
Ref-

_
+

VOUT

GND

Figure 27. DAC8571 Architecture

The input coding to the DAC8571 is unsigned binary, which gives the ideal output voltage as:
V OUT  VREF
D
65536
where D = decimal equivalent of the binary code that is loaded to the DAC register; it can range from 0 to 65535.

RESISTOR STRING
The resistor string section is shown in Figure 28. It is simply a divide-by-two resistor, followed by a string of
resistors, each of value R. The code loaded into the DAC register determines at which node on the string the
voltage is tapped off to be fed into the output amplifier by closing one of the switches connecting the string to the
amplifier. Because it is a string of resistors, it is assured monotonic.
VREF

To Output
Amplifier

GND

Figure 28. Resistor String.

11

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

THEORY OF OPERATION (continued)

Output Amplifier
The output buffer is a gain-of-2 noninverting amplifier capable of generating rail-to-rail voltages at its output,
which gives an output range of 0 V to VDD. It is capable of driving a load of 2 k in parallel with 1000 pF to GND.
The source and sink capabilities (fast settling) of the output amplifier can be seen in the typical curves. The slew
rate is 1 V/s with a full-scale settling time of 10 s with the output loaded. The feedback and gain setting
resistors of the amplifier are in the order of 50 k. Their absolute value can be off significantly, but they are
matched to within 0.1%.
The inverting input of the output amplifier is brought out to the VSENSE pin, through the feedback resistor. This
allows for better accuracy in critical applications by tying the VSENSE point and the amplifier output together
directly at the load. Other signal conditioning circuitry may also be connected between these points for specific
applications including current sourcing.

I2C Interface
The DAC8571 uses the I2C interface (see I2C-Bus Specification Version 2.1, January 2000, Philips
Semiconductor) to receive and transmit digital data. I2C is a 2-wire serial interface that allows multiple devices on
the same bus to communicate with each other. The serial bus consists of the serial data (SDA) and serial clock
(SCL) lines. Connections to the SDA and SCL lines of the bus are made through open drain IO pins of each
device on the bus. Since the devices that connect to the bus have open drain outputs, the bus should include
pullup structures. When the bus is not active, both SCL and SDA lines are pulled high by these pullup devices.
The DAC8571 supports the I2C serial bus and data transmission protocol, in all three defined modes: standard
(100 Kbps), fast (400 kBps), and high speed (3.4 Mbps).
I2C specification states that the device that controls the message is called a master, and the devices that are
controlled by the master are slaves. The master device generates the SCL signal. A master device also
generates special timing conditions (start condition, repeated start condition, and stop condition) on the bus to
indicate the start or stop of a data transfer. Device addressing is also done by the master. The master device on
an I2C bus is usually a microcontroller or a digital signal processor (DSP). The DAC8571 on the other hand,
operates as a slave device on the I2C bus. A slave device acknowledges master's commands and upon master's
control, either receives or transmits data.
I2C specification states that a device that sends data onto the bus is defined as a transmitter, and a device
receiving data from the bus is defined as a receiver. DAC8571 normally operates as a slave receiver. A master
device writes to DAC8571, a slave receiver. However, if a master device inquires DAC8571 internal register data,
DAC8571, operates as a slave transmitter. In this case, the master device reads from the DAC8571, a slave
transmitter. According to I2C terminology, read and write are with respect to the master device.
Other than specific timing signals, I2C interface works with serial bytes. At the end of each byte, a 9th clock cycle
is used to generate/detect an acknowledge signal. An acknowledge is when the SDA line is pulled low during the
high period of 9th clock cycle. A not-acknowledge is when SDA line is left high during the high period of the 9th
clock cycle.
SDA

SCL
Data Line
Stable;
Data Valid

Change of Data Allowed

Figure 29. Valid Data

12

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

THEORY OF OPERATION (continued)

Data Output
by Transmitter
Not Acknowledge
Data Output
by Receiver
Acknowledge
SCL From
Master

Clock Pulse for

Acknowledgement

START
Condition

Figure 30. Acknowledge on the I2C Bus

Recognize START or
REPEATED START
Condition

Recognize STOP or
REPEATED START
Condition
Generate ACKNOWLEDGE
Signal
P

SDA
MSB

Acknowledgement
Signal From Slave

Sr

Address

R/W

SCL
S
or
Sr
START or
Repeated START
Condition

9
ACK

3-8

9
ACK

Sr
or
P

Clock Line Held Low While

Interrupts are Serviced
STOP or
Repeated START
Condition

Figure 31. Bus Protocol

13

DAC8571
SLAS373A DECEMBER 2002 REVISED JULY 2003

www.ti.com

Master Writing to a Slave Receiver (Standard/Fast Modes)

I2C protocol starts when the bus is idle, that is, when SDA and SCL lines are stable high. The master then pulls
the SDA line low while SCL is still high indicating that serial data transfer has started. This is called a start
condition, and can only be asserted by the master. After the start condition, the master generates the serial clock
pulses and puts out an address byte, ADDRESS<7:0>. While generating the bit stream, the master ensures the
timing for valid data. For each valid I2C bit, SDA line should remain stable during the entire high period of the
SCL line. The address byte consists of 7 address bits (1001100, assuming A0=0) and a direction bit (R/W=0).
After sending the address byte, the master generates a 9th SCL pulse and monitors the state of the SDA line
during the high period of this 9th clock cycle. The SDA line being pulled low by a receiver during the high period
of 9th clock cycle is called an acknowledge signal. If the master receives an acknowledge signal, it knows that a
DAC8571 successfully matched the address the master sent. Upon the receipt of this acknowledge, the master
knows that the communication link with a DAC8571 has been established and more data could be sent. The
master continues by sending a control byte C<7:0>, which sets DAC8571's operation mode. After sending the
control byte, the master expects an acknowledge signal. Upon receipt of the acknowledge, the master sends a
most significant byte M<7:0> that represents the eight most significant bits of DAC8571's 16-bit digital-to-analog
conversion data. Upon receipt of the M<7:0>, DAC8571 sends an acknowledge. After receiving the acknowledge,
the master sends a least significant byte L<7:0> that represents the eight least significant bits of DAC8571's
16-bit conversion data. After receiving the L<7:0>, the DAC8571 sends an acknowledge. At the falling edge of
the acknowledge signal following the L<0>, DAC8571 performs a digital to analog conversion. For further DAC
updates, the master can keep repeating M<7:0> and L<7:0> sequences, expecting an acknowledge after each
byte. After the required number of digital-to-analog conversions is complete, the master can break the
communication link with DAC8571 by pulling the SDA line from low to high while SCL line is high. This is called a
stop condition. A stop condition brings the bus back to idle (SDA and SCL both high). A stop condition indicates
that communication with DAC8571 has ended. All devices on the bus including DAC8571 then await a new start
condition followed by a matching address byte. DAC8571 stays at its current state upon receipt of a stop
condition. Table 1 demonstrates the sequence of events that should occur while a master transmitter is writing to
DAC8571.

14

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

Table 1. Master Transmitter Writing to Slave Receiver (DAC8571)

Standard/Fast Mode Write Sequence - Data Input
Transmitter

MSB

Master
Master

DAC8571
Master

Load 1

LSB

Comment

A0

R/W

Write addressing (LSB=0)

Brcsel

PD0

Control byte (PD0=0)

D10

D9

D8

Writing dataword, high byte

D2

D1

D0

Writing dataword, low byte

Begin sequence

Load 0

DAC8571 Acknowledges
D15

D14

D13

D7

D6

D5

DAC8571
Master

DAC8571 Acknowledges

DAC8571
Master

3
Start

D12

D11

DAC8571 Acknowledges

DAC8571

D4

D3

DAC8571 Acknowledges
Stop or Repeated Start (1) (2)

Master

Done

(1) High byte, low byte sequence can repeat.

(2) Use repeated start to secure bus operation and loop back to the stage of write addressing for next Write.
Standard/Fast Mode Write Sequence-Power Down Input
Transmitter

MSB

Master
Master

Load 1

DAC8571
Master

DAC8571
Master
(1)
(2)

LSB

Comment

A0

R/W

Write addressing (LSB=0)

Brcsel

PD0

Control byte (PD0=1)

Writing dataword, high byte

Writing dataword, low byte

Begin sequence

Load 0

DAC8571 Acknowledges
PD1

PD2

PD3

DAC8571
Master

DAC8571 Acknowledges

DAC8571
Master

3
Start

DAC8571 Acknowledges
0

DAC8571 Acknowledges
Stop or Repeated Start (1) (2)

Done

High byte, low byte sequence can repeat.

Use repeated start to secure bus operation and loop back to the stage of write addressing for next Write.

15

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

Master Reading From a Slave Transmitter (Standard/Fast Modes)

I2C protocol starts when the bus is idle, that is, when SDA and SCL lines are stable high. The master then pulls
the SDA line low while SCL is still high indicating that serial data transfer has started. This is called a start
condition, and can only be asserted by the master. After the start condition, the master generates the serial clock
pulses and puts out an address byte, ADDRESS<7:0>. While generating the bit stream, the master ensures the
timing for valid data. For each valid I2C bit, SDA line should remain stable during the entire high period of the
SCL line. The address byte consists of seven address bits (1001100, assuming A0=0) and a direction bit
(R/W=1). After sending the address byte, the master generates a 9th SCL pulse and monitors the state of the
SDA line during the high period of this 9th clock cycle (master leaves the SDA line high). The SDA line being
pulled low by a receiver during the high period of 9th clock cycle is called an acknowledge signal. If the master
receives an acknowledge signal, it knows that a DAC8571 successfully matched the address the master sent.
Since the R/W bit in the address byte was set, master also knows that DAC8571 is ready to transmit data. Upon
the receipt of this acknowledge, the master knows that the communication link with a DAC8571 has been
established and more data could be received. The master continues by sending eight clock cycles during which
DAC8571 transmits a most significant byte, M<7:0>. If the master detects all bits of the M<7:0> as valid data, it
sends an acknowledge signal in the 9th cycle. DAC8571 detects this acknowledge signal and prepares to send
more data. Upon the receipt of eight clock cycles from the master, DAC8571 transmits the least significant byte
L<7:0>. If the master detects all bits of the L<7:0> as valid data, it sends an acknowledge signal to DAC8571
during the 9th clock cycle. DAC8571 detects this acknowledge signal and prepares to send more data. Upon the
receipt of 8 more clock cycles from the master, DAC8571 transmits the control byte C<7:0>. During the 9th clock
cycle, the master transmits a not-acknowledge signal to DAC8571 and terminates the sequence with a stop
condition, by pulling the SDA line from low to high while clock is high. M<7:0> and L<7:0> data could be either
DAC data or could be the data stored in the temporary register. Bits in the C<7:0> reveal this information.
Table 2 demonstrates the sequence of events that should occur while a master receiver is reading from
DAC8571.
Table 2. Master Receiver Reads From Slave Transmitter (DAC8571)
Standard/Fast Mode Read Sequence-Data Transmit
Transmitter

MSB

Master
Master

D15

D14

D13

DAC8571
DAC8571

LSB

Comment

A0

R/W

D10

D9

D8

High byte

D2

D1

D0

Low byte

C2

C1

C0

Control byte

Begin sequence
Read addressing (R/W = 1)

D12

D11

Master Acknowledges
D7

D6

D5

Master
DAC8571

DAC8571 Acknowledges

Master
DAC8571

3
Start

D4

D3

Master Acknowledges
C7

C6

C5

C4

C3

Master

Master Not Acknowledges

Master

Stop or Repeated Start

Master signal end of read

Done

Master Writing to a Slave Receiver (High-Speed Mode)

All devices must start operation in standard/fast mode and switch to high-speed mode using a well defined
protocol. This is required because high-speed mode requires the on chip filter settings of each I2C device (for
SDA and SCL lines) to be switched to support 3.4 Mbps operation. A stop condition always ends the high speed
mode and puts all devices back to standard/fast mode.
I2C protocol starts when the bus is idle, that is, when SDA and SCL lines are stable high. The master then pulls
the SDA line low while SCL is still high indicating that serial data transfer has started. This is called a start
condition, and can only be asserted by the master. After the start condition, the master device puts out the
high-speed master code 0000 1xxx. No device is allowed to acknowledge the master code, but the devices are
required to switch their internal settings to support 3.4 Mbps operation upon the receipt of this code. After the
not-acknowledge signal, the master is allowed to operate at high speed. Now at much higher speed, the master
generates a repeated start condition. After the start condition, master generates the serial clock pulses and puts
out an address byte, ADDRESS<7:0>. While generating the bit stream, the master ensures the timing for valid
data. For each valid I2C bit, SDA line should remain stable during the entire high period of the SCL line. The
address byte consists of seven address bits and a direction bit (R/W=0). After sending the address byte, the
16

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

th

master generates a 9 SCL pulse and monitors the state of the SDA line during the high period of this 9th clock
cycle (master leaves the SDA line high). The SDA line being pulled low by the receiver during the high period of
9th clock cycle is called an acknowledge signal. If the master receives an acknowledge signal, it knows that a
DAC8571 successfully matched the address the master sent. Upon the receipt of this acknowledge, the master
knows that the high-speed communication link with a DAC8571 has been established and more data could be
sent. The master continues by sending a control byte, C<7:0>, which sets DAC8571 operation mode. After
sending the control byte, master expects an acknowledge. Upon the receipt of an acknowledge, the master
sends a most significant byte, M<7:0> that represents the eight most significant bits of DAC8571's 16-bit
digital-to-analog conversion data. Upon the receipt of the M<7:0>, DAC8571 sends an acknowledge. After
receiving the acknowledge, the master sends a least significant byte, L<7:0>, that represents the eight least
significant bits of DAC8571's 16-bit conversion data. After receiving the L<7:0>, the DAC8571 sends an
acknowledge. At the falling edge of the acknowledge signal following the L<0>, DAC8571 performs a digital to
analog conversion, depending on the operational mode. For further DAC updates, the master can keep repeating
M<7:0> and L<7:0> sequences, expecting an acknowledge after each byte. After the required number of digital
to analog conversions is complete, the master can break the communication link with DAC8571 by pulling the
SDA line from low to high while SCL line is high. This is called a stop condition. A stop condition brings the bus
back to idle (SDA and SCL both high). A stop condition indicates that communication with a device (DAC8571)
has ended. All devices on the bus including DAC8571 then await a new start condition followed by a matching
address byte. DAC8571 stays at its current state upon the receipt of a stop condition. A stop condition during the
high-speed mode also indicates the end of the high-speed mode. Table 3 demonstrates the sequence of events
that should occur while a master transmitter is writing to DAC8571 in I2C high-speed mode.
Table 3. Master Transmitter Writes to Slave Receiver in High-Speed Mode
HS Mode Write Sequence-Data Input
Transmitter

MSB

Master
Master

Load 1

Begin sequence (1)

1

HS mode master code

No device may acknowledge HS
master code

A0

R/W

Write addressing (LSB = 0)

Load 0

Brcsel

PD0

Control byte (PD0=0)

D10

D9

D8

Writing dataword, high byte

D2

D1

D0

Writing dataword, low byte

DAC8571 Acknowledges
D15

D14

D13

D7

D6

D5

DAC8571

D12

D11

DAC8571 Acknowledges
D4

D3

DAC8571

DAC8571 Acknowledges

Master

Stop or Repeated Start (2)

(1)
(2)

Comment

DAC8571 Acknowledges

DAC8571

Master

LSB

Repeated Start
1

DAC8571

Master

Not Acknowledge

Master

Master

Start

NONE

Master

Done

High-byte, low-byte sequences can repeat

Use repeated start to secure bus operation and loop back to the stage of write addressing for next Write.

17

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

Master Receiver Reading From a Slave Transmitter (High-Speed Mode)

I2C protocol starts when the bus is idle, that is, when SDA and SCL lines are stable high. The master then pulls
the SDA line low while SCL is still high indicating that serial data transfer has started. This is called a start
condition, and can only be asserted by the master. After the start condition, the master device puts out the
high-speed master code 0000 1xxx. No device is allowed to acknowledge the master code, but the devices are
required to switch their internal settings to support 3.4 Mbps operation upon the receipt of this code. After the
not-acknowledge signal, the master is allowed to operate at high speed. Now at much higher speed, the master
generates a repeated start condition. After the start condition, the master generates the serial clock pulses and
puts out an address byte, ADDRESS<7:0>. While generating the bit stream, the master ensures the timing for
valid data. For each valid I2C bit, SDA line should remain stable during the entire high period of the SCL line. The
address byte consists of seven address bits and a direction bit (R/W=1). After sending the address byte, the
master generates a 9th SCL pulse and monitors the state of the SDA line during the high period of this 9th clock
cycle (master leaves the SDA line high). The SDA line being pulled low by the receiver during the high period of
9th clock cycle is called an acknowledge signal. If the master receives an acknowledge signal, it knows that a
DAC8571 successfully matched the address the master sent. Since the R/W bit in the address byte was set,
master also knows that DAC8571 is ready to transmit data. Upon the receipt of this acknowledge, the master
knows that the communication link with a DAC8571 has been established and more data could be received. The
master continues by sending eight clock cycles during which DAC8571 transmits an M<7:0>. If the master
detects all bits of the M<7:0> as valid data, it sends an acknowledge signal in the 9th cycle. DAC8571 detects
this acknowledge signal and prepares to send more data. Upon the receipt of eight more clock cycles from the
master, DAC8571 transmits L<7:0>. If the master detects all bits of the L<7:0> as valid data, it sends an
acknowledge signal to DAC8571 during the 9th clock cycle. DAC8571 detects this acknowledge signal and
prepares to send more data. Upon the receipt of eight more clock cycles from the master, DAC8571 transmits
the control byte, C<7:0>. In the 9th clock cycle the master transmits a not-acknowledge signal to DAC8571 and
terminates the sequence with a stop condition, by pulling the SDA line from low to high while clock is high.
M<7:0> and L<7:0> data could be either DAC data or could be the data stored in the temporary register. Bits in
the C<7:0> reveal this information. A stop condition during the high-speed mode also indicates the end of the
high-speed mode. Table 4 demonstrates the sequence of events that should occur while a master receiver is
reading from DAC8571 in I2C high-speed mode.
Table 4. Master Receiver Reads Data From Slave Transmitter in High-Speed Mode
HS Mode Read Sequence-Data Transmit
Transmitter

MSB

Master
Master

LSB

Start
0

Begin sequence

NONE

Not Acknowledge

Master

Repeated Start

Master

DAC8571
DAC8571

D15

D14

D13

No device may acknowledge HS

master code
A0

R/W

Read addressing (R/W=1)

D12

D11

D10

D9

D8

High byte

D2

D1

D0

Low byte

C2

C1

C0

Control byte

Master Acknowledges
D7

D6

D5

Master
DAC8571

HS Mode master code

DAC8571 Acknowledges

Master
DAC8571

Comment

D4

D3

Master Acknowledges
C7

C6

C5

C4

C3

Master

Master Not Acknowledges

Master signal end of read

Master

Stop or Repeated Start (1)

Done

(1)

18

Use repeated start to secure bus operation and loop back to the stage of write addressing for next Write.

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

DAC8571 Update Sequence

DAC8571 requires a start condition, a valid I2C address, a control byte, an MS byte and an LS byte for an
update. The control byte sets the operational mode of the DAC8571. After the receipt of the control byte,
DAC8571 expects an MS byte and an LS byte. After the receipt of each byte, DAC8571 acknowledges by pulling
the SDA line low. At the falling edge of the acknowledge signal that follows the LS byte, DAC8571 performs an
update.
After the first update, further data can be sent as MS byte and LS byte sequences and DAC8571 keeps updating
at the falling edge of the acknowledge signal that follows each LS byte. The bits of the last control byte
determine the type of update being performed. Thus, for the first update, DAC8571 requires a start condition, a
valid I2C address, a control byte, an MS byte and an LS byte. For all consecutive updates, DAC8571 needs an
MS byte and an LS byte.
Using the I2C high-speed mode, the clock running a 3.4 MHz, each 16-bit DAC update can be done within
18-clock cycles (MS byte, acknowledge bit, LS byte, acknowledge bit), at 188.88 KSPS. Using the fast mode,
clock running at 400 kHz, maximum DAC update rate is limited to 22.22 KSPS.

DAC8571 Address Byte

MSB
1

LSB
0

A0

R/W

The address byte is the first byte received following a START condition from the master device. The first five bits
(MSBs) of the slave address are factory preset to 10011. The next bit of the address byte is the device select bit
A0, followed by a fixed 0 and the read/write direction bit R/W. In order for DAC8571 to respond, the 7-bit address
should be 10011A00, where the state of the A0 bit matches the state of the A0 pin. A maximum of two DAC8571
devices with the same preset code can therefore be connected on the same bus at one time. The A0 Address
inputs can be permanently connected to VDD or digital ground, or can be actively driven by TTL or CMOS logic
levels. The device address is set by the state of these pins upon power up of the DAC8571. The last bit of the
address byte (R/W) defines the direction of the data flow. When set to a 1, a read operation is selected (master
device reads from DAC8571); when set to a 0, a write operation is selected (master device writes to DAC8571).
Following the START condition, the DAC8571 monitors the SDA bus, checking the device address being
transmitted. Upon receiving the 10011A00 code, and the R/W bit, the DAC8571 outputs an acknowledge signal
on the SDA line.
Broadcast addressing is also supported by DAC8571. Broadcast addressing can be used for synchronously
updating or powering down multiple DAC8571 devices on the same bus. DAC8571 is designed to work with other
members of DAC857x, DAC757x families to support multichannel synchronous update. When broadcast
addressing is used, DAC8571 responds regardless of the state of the A0 pin. Broadcast address is only valid for
write operation and cannot be used for read operation. Broadcast address is as follows.
MSB
1

LSB
0

Control Byte
After transmitting an acknowledge pulse following a valid address, DAC8571 expects a control byte C<7:0>.
Control byte functionality is shown in Table 5.
The first two MSBs C<7> and C<6> of the control byte must be zeroes for DAC8571 to update. If these two bits
are not assigned to zero, DAC8571 ignores all update commands, but still generates an acknowledge signal.
C<5> and C<4> are used for setting the update mode. Some of these modes are designed to support
multichannel synchronous operation between multiple devices.
C<5>=0, C<4>=0: Store I2C data. The contents of MS byte and LS byte data (or power-down information)
are stored into the temporary register. This mode does not change the DAC output.
C<5>=0, C<4>=1: Update DAC with I2C data. Most common mode. The contents of MS byte and LS byte
data (or power-down information) are stored into the temporary data register and into the DAC register. This
mode changes the DAC output with the contents of I2C MS byte and LS byte data.

19

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

C<5>=1, C<4>=0: Update with previously stored data. The contents of MS byte and LS byte data (or
power-down information) are ignored. The DAC is updated with the contents of the data previously stored in
the temporary register. This mode changes the DAC output.
C<5>=1, C<4>=1: Broadcast update, If C<2>=0, DAC is updated with the contents of its temporary register.
If C<2>=1, DAC is updated with I2C MS byte and LS byte data. C<7> and C<6> do not have to be zeroes in
order for DAC8571 to update. This mode is intended to help DAC8571 work with other DAC857x and
DAC757x devices for multichannel synchronous update applications.

C<3> should always be zero.

C<2> is utilized only when C<5>=C<4>=1. Otherwise, C<2> must be assigned to zero.
C<1> should always be zero.
C<0> should be zero during normal DAC operation. C<0>=1 is a power-down flag. If C<0>=1, M<7>, M<6>, and
M<5> indicate a powerdown operation as shown in Table 6.
Table 5. Control Byte Functionality
C<7>

C<6>

C<5>

C<4>

C<3>

Load1 Load0

C<2>

C<1>

Brcsel

C<0>

M<7>

M<6>

M<5>

PD0

MSB

MSB-1

MSB-2...LSB

DAC8571 FUNCTION

Data

Write temporary register with data

See Table 6

Data

See Table 6

Update DAC with temporary register

data or power down

Load all DACs, all devices with temporary register data

Load all DACs, all devices with data

Write temporary register with power

down command
Write temporary register and load
DAC with data
Power down DAC

Broadcast Commands
x

Data

See Table 6

Power down all DACs, all devices

Most Significant Byte

Most Significant Byte M<7:0> consists of 8 most significant bits of D/A conversion data. When C<0>=1. M<7>,
M<6>, M<5> indicate a powerdown operation as shown in Table 6.

Least Significant Byte

Least Significant Byte L<7:0> consists of the 8 least significant bits of D/A conversion data. DAC8571 updates at
the falling edge of the acknowledge signal that follows the L<0> bit.

Data Transmit and Read-Back

I2C bus can be noisy and data integrity and can be a problem in a system of many I2C devices. To enable I2C
system verification, DAC8571 provides read back capability for the user. During read back operation, the
contents of the control byte, MS byte and the LS byte can be sent back to the master device using the I2C bus.
This read-back function is also useful if a device on the I2C bus inquires DAC8571 data.
For read-back operation, the master device sends the I2C address and sets the R/W bit. DAC8571
acknowledges. Then, upon the receipt of clock pulses from the master, DAC8571 sends the MS byte. If the
master acknowledges, DAC8571 sends the LS byte. If the master acknowledges, DAC8571 sends the control
byte. This sequence is interrupted by the master sending a not acknowledge signal.
Depending on the contents of the control byte transmitted by the DAC8571, the MS byte and LS byte information
(transmitted by the DAC8571) is interpreted as follows:
C<5>

C<4>

C<2>

20

MS and LS bytes represent temporary register data

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

C<5>

C<4>

C<2>

MS and LS bytes represent temporary and DAC register data

MS and LS bytes represent I2C data that is discarded

MS and LS bytes represent I2C data that is discarded

MS and LS bytes represent temporary and DAC register data

EXAMPLES (A0 TIED TO GND, VDD = 5 V)

EXAMPLE 1: Write 1/4 scale to DAC8571
ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0001 0000

M<7...0>
ACK

0100 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = 1.25 V

EXAMPLE 2: Switch DAC8571 to fast settling mode

ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0001 0001

M<7...0>
ACK

0010 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = 0 V

EXAMPLE 3: Switch DAC8571 back to low power mode

ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0001 0001

M<7...0>
ACK

0000 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = 0 V

EXAMPLE 4: Power-down DAC8571 with Hi-Z output

ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0001 0001

M<7...0>
ACK

1100 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = Hi-Z

EXAMPLE 5: Power-down DAC8571 with 1K output impedance to ground

ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0001 0001

M<7...0>
ACK

0100 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = 0 V

EXAMPLE 6: Power-down DAC8571 with 100K output impedance to ground

ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0001 0001

M<7...0>
ACK

1000 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = 0 V

EXAMPLE 7: Store full scale data in temporary register

ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0000 0000

M<7...0>
ACK

1111 1111

L<7...0>
ACK

1111 1111

ACK

STOP

Previous output voltage is valid

EXAMPLE 8: Update DAC8571 with the data previously stored in the temporary register
ADDRESS <7...0>
START

1001 1000

C<7...0>
ACK

0010 0000

M<7...0>
ACK

XXXX XXXX

L<7...0>
ACK

XXXX XXXX

Previous output voltage is valid

ACK

STOP

New Vout valid

EXAMPLE 9: Broadcast a powerdown command to all DAC8571s on the I2C bus

ADDRESS <7...0>
START

1001 0000

C<7...0>
ACK

0011 0101

M<7...0>
ACK

1100 0000

L<7...0>
ACK

0000 0000

Previous output voltage is valid

ACK

STOP

Vout = Hi-Z

EXAMPLE 10: Broadcast update. All DAC8571s on the I2C bus update synchronously with the contents of their temporary
registers
ADDRESS <7...0>
START

1001 0000

Previous output voltage is valid

C<7...0>
ACK

0011 0000

M<7...0>
ACK

XXXX XXXX

L<7...0>
ACK

XXXX XXXX

ACK

STOP

New Vout valid

21

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

EXAMPLE 11: Read back DAC8571 internal data. V denotes valid logic.
ADDRESS<7...0>
START

1001 1001

ACK

M<7...0>

MASTER

L<7...0>

MASTER

VVVV VVVV

ACK

VVVV VVVV

ACK

C<7...0>

MASTER

VVVV VVVV NOT ACK STOP

EXAMPLE 12: Ramp generation in high speed mode (up to code 7 is shown)
HS Master Code
START

0000 1000

ADDRESS
NOT ACK

REPEATED START

1001 1000

C<7...0>
ACK

0001 0000

ACK

Previous Vout voltage valid

MSB<7...0>

LSB<7...0>

0000 0000

ACK

0000 0000

Previous Vout voltage valid

MSB<7...0>

MSB<7...0>
ACK

ACK

ACK

0000 0001

Vout = 0 V
LSB<7...0>

0000 0000

0000 0000

LSB<7...0>

0000 0010

MSB<7...0>
ACK

0000 0000

LSB<7...0>
ACK

0000 0011

Vout = 2 76 V

Vout = 76 V
MSB<7...0>

LSB<7...0>

0000 0000

ACK

0000 0100

Vout = 3 76 V

0000 0000

LSB<7...0>
ACK

0000 0101

Vout = 4 76 V

MSB<7...0>

LSB<7...0>

0000 0000

ACK

0000 0110

Vout = 5 76 V

0000 0000

ACK
Vout = 5 76 V

MSB<7...0>
ACK

ACK
Vout = 3 76 V

MSB<7...0>
ACK

ACK
Vout = 76 V

LSB<7...0>
ACK

Vout = 6 76 V

0000 0111

ACK
Vout = 7 76 V

Power-On Reset
The DAC8571 contains a power-on-reset circuit that controls the output voltage during power-up. On power-up,
the DAC register is filled with zeros and the output voltage is 0V; it remains there until a valid write sequence is
made to the DAC. This is useful in applications where it is important to know the state of the output of the DAC
while it is in the process of powering up. No input is brought high before the power is applied.

Power-Down Modes
The DAC8571 contains five separate power settings. These modes are programmable when C<0>=1. When
C<0>=1, M<7>, M<6>, and M<5> bits represent power setting control bits, and M<4...0> and L<7...0> are
assigned to zeroes. Power setting of DAC8571 is updated at the falling edge of the acknowledge signal that
follows the least significant byte. To set the power consumption of the device, following I2C sequence is used.
Start_condition ->
Valid_address

(1001 1000) -> ack

C<7:0>

(0001 0001) -> ack

M<7:0>

( vvv0 0000) -> ack

L<7:0>

(0000 0000) -> ack

Stop_condition

Table 6. Power Settings for the DAC8571 (C<0>=1)

M<7>

M<6>

M<5>

Operating Mode

Low power mode, default

Fast settling mode

PWD. 1k to GND

PWD. 100 k to GND

PWD. Output Hi-Z

22

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

After power-up, the device works in low power mode with its normal power consumption of 170 A at 5 V. At fast
settling mode, device consumes 250 A nominally, but settles in 10 s. For the three power-down modes, the
supply current falls to 200 nA at 5 V (50 nA at 3 V). Not only does the supply current fall but the output stage is
also internally switched from the output of the amplifier to a resistor network of known values. This has the
advantage that the output impedance of the device is known while in power-down mode. There are three
different options: The output is connected internally to GND through a 1-k resistor, a 100-k resistor or it is left
open-circuit (high impedance). The output stage is illustrated in Figure 32.
A power on reset starts the DAC8571 in the low power mode. Low power mode and fast-settling mode settings
stay unchanged during DAC8571 data updates, unless they are specifically overwritten as explained in Table 6.
On the other hand, each new data sequence requiring a DAC update brings the DAC8571 out of the three
power-down conditions.
DAC8571 power settings can be stored in the temporary register, just like data (use C<7:0> = 0000 0001). This
allows simultaneous powerdown capability for multichannel applications.
VSense

Amplifier
_
Resistor
String DAC

VOUT

Powerdown
Circuitry

Resistor
Network

Figure 32. Output Stage During Power-Down

All linear circuitry is shut down when the power-down mode is activated. However, the contents of the DAC
register are unaffected when in power-down. The time to exit power-down is typically 2.5 s for VDD = 5 V and
5 s for VDD = 3 V. (See the Typical Characteristics section for additional information.)

CURRENT CONSUMPTION
In the low power mode, the DAC8571 typically consumes 170 A at VDD = 5 V and 150 A at VDD = 3 V including
reference current consumption. Fast settling mode adds 80 A of current consumption, but ensures 10-s
settling. Additional current consumption can occur at the digital inputs if VIH<<VDD. For most efficient power
operation, CMOS logic levels are recommended at the digital inputs to the DAC. In power-down mode, typical
current consumption is 200 nA.

DRIVING RESISTIVE AND CAPACITIVE LOADS

The DAC8571 output stage is capable of driving loads of up to 1000 pF while remaining stable. Within the offset
and gain error margins, the DAC8571 can operate rail-to-rail when driving a capacitive load. Resistive loads of 2
k can be driven by the DAC8571 while achieving a very good load regulation. Load regulation error increases
when the DAC output voltage is close to supply rails. When the outputs of the DAC are driven to the positive rail
under resistive loading, the PMOS transistor of each Class-AB output stage can enter into the linear region.
When this occurs, the added IR voltage drop deteriorates the linearity performance of the DAC. This only occurs
within approximately the top 20 mV of the DAC's digital input-to-voltage output transfer characteristic. The
reference voltage applied to the DAC8571 may be reduced below the supply voltage applied to VDD in order to
eliminate this condition if good linearity is a requirement at full scale (under resistive loading conditions).

AC PERFORMANCE
DAC8571 can achieve typical ac performance of 96-dB signal-to-noise ratio (SNR) and 65-dB total harmonic
distortion (THD), making the DAC8571 a solid choice for applications requiring low SNR at output frequencies at
or below 4 kHz.

23

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

OUTPUT VOLTAGE STABILITY

The DAC8571 exhibits excellent temperature stability of 5 ppm/C typical output voltage drift over the specified
temperature range of the device. This enables the output voltage of each channel to stay within a 25 V window
for a 1C ambient temperature change. Good power supply rejection ratio (PSRR) performance reduces supply
noise present on VDD from appearing at the outputs to well below 10 V. Combined with good dc noise
performance and true 16-bit differential linearity, the DAC8571 becomes a perfect choice for closed-loop control
applications.

SETTLING TIME AND OUTPUT GLITCH PERFORMANCE

Settling time to within the 16-bit accurate range of the DAC8571 is achievable within 10 s for a full-scale code
change at the input. Worst case settling times between consecutive code changes is typically less than 2 s,
therefore, the update rate is limited by the I2C interface for digital input signals changing code-to-code. For
full-scale output swings, the output stage of each DAC8571 channel typically exhibits less than 100-mV
overshoot and undershoot when driving a 200-pF capacitive load. Code-to-code change glitches are extremely
low (~10V) given that the code-to-code transition does not cross an Nx4096 code boundary. Due to internal
segmentation of the DAC8571, code-to-code glitches occur at each crossing of an Nx4096 code boundary.
These glitches can approach 100 mVs for N = 15, but settle out within ~2 s.

USING REF02 AS A POWER SUPPLY FOR DAC8571

Due to the extremely low supply current required by the DAC8571, a possible configuration is to use a REF02
5-V precision voltage reference to supply the required voltage to the DAC8571's supply input as well as the
reference input, as shown in Figure 33. This is especially useful if the power supply is quite noisy or if the system
supply voltages are at some value other than 5 V. The REF02 outputs a steady supply voltage for the DAC8571.
If the REF02 is used, the current it needs to supply to the DAC8571 is 160-A typical and 225-A max for VDD =
5 V. When a DAC output is loaded, the REF02 also needs to supply the current to the load. The total typical
current required (with a 5-k load on a given DAC output) is:
15 V
REF02

2-Wire
l2C
Interface

A0
SCL
SDA

5V

VDD, Vref
DAC8571

VOUT = 0 V to 5 V

Figure 33. REF02 as a Power Supply

160 A
5 V  1.16 mA
5 k

The load regulation of the REF02 is typically 0.005%/mA, which results in an error of 290 V for a 1.16-mA
current drawn. This corresponds to a 3.82 LSB error for a 0-V to 5-V output range.

LAYOUT
A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power
supplies.
The power applied to VDD and VREF should be well regulated and low noise. Switching power supplies and dc/dc
converters often has high-frequency glitches or spikes riding on the output voltage. In addition, digital
components can create similar high-frequency spikes as their internal logic switches states. This noise easily
couples into the DAC output voltage through various paths between the power connections and analog output.

24

DAC8571
www.ti.com

SLAS373A DECEMBER 2002 REVISED JULY 2003

As with the GND connection, VDD is connected to a +5-V power supply plane or trace that is separate from the
connection for digital logic until they are connected at the power entry point. In addition, the 1-F to 10-F, and
0.1-F bypass capacitors are strongly recommended. In some situations, additional bypassing may be required,
such as a 100-F electrolytic capacitor or even a Pi filter made up of inductors and capacitorsall designed to
essentially lowpass filter the 5-V supply, removing the high frequency noise.

25

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package

Drawing
Qty

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Op Temp (C)

Top-Side Markings

(3)

(4)

DAC8571IDGK

ACTIVE

VSSOP

DGK

80

Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR

& no Sb/Br)

-40 to 105

D871

DAC8571IDGKG4

ACTIVE

VSSOP

DGK

80

Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR

& no Sb/Br)

-40 to 105

D871

DAC8571IDGKR

ACTIVE

VSSOP

DGK

2500

Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR

& no Sb/Br)

-40 to 105

D871

DAC8571IDGKRG4

ACTIVE

VSSOP

DGK

2500

Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR

& no Sb/Br)

-40 to 105

D871

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

26-Jan-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

DAC8571IDGKR

Package Package Pins

Type Drawing
VSSOP

DGK

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

2500

330.0

12.4

Pack Materials-Page 1

5.3

B0
(mm)

K0
(mm)

P1
(mm)

3.4

1.4

8.0

W
Pin1
(mm) Quadrant
12.0

Q1

PACKAGE MATERIALS INFORMATION

www.ti.com

26-Jan-2013

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

DAC8571IDGKR

VSSOP

DGK

2500

367.0

367.0

35.0

Pack Materials-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2013, Texas Instruments Incorporated