BTA204S Series B and C: 1. Product Profile
BTA204S Series B and C: 1. Product Profile
1. Product profile
1.1 General description
Passivated high commutation triac in a SOT428 (DPAK) plastic package. Intended for use
in circuits where high static and dynamic dV/dt and high dI/dt can occur. These devices
will commutate the full rated RMS current at the maximum rated junction temperature,
without the aid of a snubber.
1.2 Features
High maximum junction temperature
1.3 Applications
Motor control
2. Pinning information
Table 1:
Pinning
Pin
Description
gate (G)
mb
mounting base
Simplified outline
Symbol
mb
T2
G
sym051
[1]
2
1
SOT428 (DPAK)
[1]
T1
Philips Semiconductors
3. Ordering information
Table 2:
Ordering information
Type number
Package
BTA204S-600B
Name
Description
Version
DPAK
SOT428
BTA204S-600C
BTA204S-800B
BTA204S-800C
4. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
repetitive peak off-state voltage
Conditions
[1]
BTA204S-600B; BTA204S-600C
Min
Max
Unit
600
BTA204S-800B; BTA204S-800C
800
t = 20 ms
25
t = 16.7 ms
27
t = 10 ms
3.1
A2s
100
A/s
IT(RMS)
ITSM
I2t
I2t
dIT/dt
IGM
VGM
PGM
PG(AV)
0.5
Tstg
storage temperature
40
+150
Tj
junction temperature
125
[1]
for fusing
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state.
The rate of rise of current should not exceed 6 A/s.
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Philips Semiconductors
001aac660
8
Ptot
(W)
= 180
101
Tmb(max)
104 (C)
107
120
110
90
60
113
30
116
2
119
122
125
0
5
IT(RMS) (A)
= conduction angle
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
001aac331
30
IT
ITSM
(A)
ITSM
t
T
Tj(init) = 25 C max
20
10
0
1
102
10
103
n
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal cycles; maximum values
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001aac330
103
ITSM
IT
ITSM
(A)
T
Tj(init) = 25 C max
102
(1)
(2)
10
105
104
103
102
101
t (s)
tp 20 ms
(1) dlT/dt limit
(2) T2 G+ quadrant
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values
001aac333
12
001aac662
5
IT(RMS)
(A)
4
IT(RMS)
(A)
107 C
8
3
2
4
1
0
102
101
1
10
surge duration (s)
0
50
50
100
150
Tmb (C)
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5. Thermal characteristics
Table 4:
Thermal characteristics
Symbol Parameter
Rth(j-mb)
Rth(j-a)
Conditions
Min
Typ
Max
Unit
full cycle
3.0
K/W
half cycle
3.7
K/W
75
K/W
001aac681
10
unidirectional
Zth(jmb)
(K/W)
bidirectional
101
102
105
PD
tp
104
103
102
101
10
tp (S)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
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6. Static characteristics
Table 5:
Static characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
Conditions
BTA204S-600B
BTA204S-800B
Min
gate trigger
current
IGT
latching current
IL
Typ
BTA204S-600C
BTA204S-800C
Max
Min
Typ
Unit
Max
[1]
50
35
mA
T2+ G
50
35
mA
T2 G
50
35
mA
T2+ G+
30
20
mA
T2+ G
45
30
mA
30
20
mA
IH
holding current
T2 G
30
20
mA
VT
on-state voltage
IT = 5 A; see Figure 9
1.4
1.7
1.4
1.7
VGT
gate trigger
voltage
0.7
1.5
0.7
1.5
0.25
0.4
0.25
0.4
ID
off-state leakage
current
VD = VDRM(max); Tj = 125 C
0.1
0.5
0.1
0.5
mA
[1]
001aac334
1.6
001aac677
VGT (Tj)
IGT (Tj)
IGT (25C)
VGT (25C)
1.2
(1)
2
(2)
(3)
0.8
0.4
50
50
100
150
0
50
Tj (C)
50
100
150
Tj (C)
(1) T2 G
(2) T2+ G
(3) T2+ G+
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001aac338
12
(1) (2)
IT
(A)
001aac336
3
IL(Tj)
(3)
IL(25C)
8
0
50
0
0
50
100
150
Tj (C)
VT (V)
VO = 1.27 V; RS = 0.091
(1) Tj = 125 C; typical values
(2) Tj = 25 C; maximum values
(3) Tj = 125 C; maximum values
3
IH(Tj)
IH(25C)
2
0
50
50
100
150
Tj (C)
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7. Dynamic characteristics
Table 6:
Dynamic characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
Conditions
BTA204S-600B
BTA204S-800B
dVD/dt
VDM = 0.67VDRM(max);
Tj = 125 C; exponential
waveform; gate open circuit
1000 -
1000
dIcom/dt
A/ms
tgt
Min Typ
Max
BTA204S-600C
BTA204S-800C
Min Typ
Unit
Max
V/s
8. Package information
Refer to mounting instructions for SOT428 (DPAK) package.
Plastic meets requirements of UL94 V-0 at 18 inch.
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Philips Semiconductors
9. Package outline
Plastic single-ended surface mounted package (DPAK); 3 leads (one lead cropped)
SOT428
y
E
A
A1
b2
E1
mounting
base
D2
D1
HD
L2
1
L1
b1
e
e1
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A1
b1
b2
D1
D2
min
E1
min
e1
HD
L1
min
L2
y
max
mm
2.38
2.22
0.93
0.73
0.89
0.71
1.1
0.9
5.46
5.00
0.56
0.20
6.22
5.98
4.0
6.73
6.47
4.45
2.285
4.57
10.4
9.6
2.95
2.55
0.5
0.9
0.5
0.2
0.2
OUTLINE
VERSION
SOT428
REFERENCES
IEC
JEDEC
JEITA
TO-252
SC-63
EUROPEAN
PROJECTION
ISSUE DATE
05-02-09
05-02-11
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Philips Semiconductors
10. Mounting
7.00
6.15
5.90
5.80
1.80
1.00
4.725
4.60
5.75 5.65
6.50
1.15
3.60
6.00
2.45
6.00
6.125
0.30
2.40 2.30
solder lands
1.30
1.40
1.65
1.50
solder resist
4.57
SOT428
occupied area
solder paste
Dimensions in mm
Fig 13. SOT428 (DPAK): minimum pad sizes for surface mounting
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Philips Semiconductors
Revision history
Document ID
Change
notice
Doc. number
Supersedes
BTA204S_SER_B_C_3
20050524
BTA204S_SERIES_B_C_2
Modifications:
The format of this data sheet has been redesigned to comply with the new presentation
and information standard of Philips Semiconductors
BTA204S_SERIES_B_C_2 19981201
Product
specification
n.a.
BTA204S_SERIES_B_C_1
BTA204S_SERIES_B_C_1 19971001
Objective
specification
n.a.
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Philips Semiconductors
Definition
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
15. Trademarks
14. Disclaimers
Life support These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
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Philips Semiconductors
17. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Package information . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information . . . . . . . . . . . . . . . . . . . . 12