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BTA204S Series B and C: 1. Product Profile

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BTA204S Series B and C: 1. Product Profile

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BTA204S series B and C

Three-quadrant triacs high commutation


Rev. 03 24 May 2005

Product data sheet

1. Product profile
1.1 General description
Passivated high commutation triac in a SOT428 (DPAK) plastic package. Intended for use
in circuits where high static and dynamic dV/dt and high dI/dt can occur. These devices
will commutate the full rated RMS current at the maximum rated junction temperature,
without the aid of a snubber.

1.2 Features
High maximum junction temperature

High commutation capability

1.3 Applications
Motor control

Industrial and domestic heating

1.4 Quick reference data


VDRM 600 V (BTA204S-600B)
VDRM 600 V (BTA204S-600C)
ITSM 25 A

VDRM 800 V (BTA204S-800B)


VDRM 800 V (BTA204S-800C)
IT(RMS) 4 A

2. Pinning information
Table 1:

Pinning

Pin

Description

main terminal 1 (T1)

main terminal 2 (T2)

gate (G)

mb

mounting base

Simplified outline

Symbol
mb

T2

G
sym051

[1]

2
1

SOT428 (DPAK)
[1]

Connected to main terminal 2 (T2)

T1

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

3. Ordering information
Table 2:

Ordering information

Type number

Package

BTA204S-600B

Name

Description

Version

DPAK

plastic single-ended surface mounted package; 3 leads (one lead cropped)

SOT428

BTA204S-600C
BTA204S-800B
BTA204S-800C

4. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM

Parameter
repetitive peak off-state voltage

Conditions
[1]

BTA204S-600B; BTA204S-600C

Min

Max

Unit

600

BTA204S-800B; BTA204S-800C

800

t = 20 ms

25

t = 16.7 ms

27

t = 10 ms

3.1

A2s

ITM = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/s

100

A/s

IT(RMS)

RMS on-state current

full sine wave; Tmb 107 C;


see Figure 4 and 5

ITSM

non-repetitive peak on-state current

full sine wave; Tj = 25 C prior to surge;


see Figure 2 and 3

I2t

I2t

dIT/dt

repetitive rate of rise of on-state


current after triggering

IGM

peak gate current

VGM

peak gate voltage

PGM

peak gate power

PG(AV)

average gate power

0.5

Tstg

storage temperature

40

+150

Tj

junction temperature

125

[1]

for fusing

over any 20 ms period

Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state.
The rate of rise of current should not exceed 6 A/s.

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

2 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

001aac660

8
Ptot
(W)

= 180

101
Tmb(max)
104 (C)
107

120
110

90
60

113

30
116
2

119
122

125
0

5
IT(RMS) (A)

= conduction angle

Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
001aac331

30
IT
ITSM
(A)

ITSM
t
T
Tj(init) = 25 C max

20

10

0
1

102

10

103
n

f = 50 Hz

Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal cycles; maximum values

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

3 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

001aac330

103

ITSM

IT

ITSM
(A)

T
Tj(init) = 25 C max

102

(1)
(2)

10
105

104

103

102

101
t (s)

tp 20 ms
(1) dlT/dt limit
(2) T2 G+ quadrant

Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values
001aac333

12

001aac662

5
IT(RMS)
(A)
4

IT(RMS)
(A)

107 C

8
3

2
4
1

0
102

101

1
10
surge duration (s)

0
50

50

100

150
Tmb (C)

f = 50 Hz; Tmb 107 C


Fig 4. RMS on-state current as a function of surge
duration; maximum values

Fig 5. RMS on-state current as a function of mounting


base temperature

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

4 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

5. Thermal characteristics
Table 4:

Thermal characteristics

Symbol Parameter
Rth(j-mb)
Rth(j-a)

Conditions

Min

Typ

Max

Unit

thermal resistance from


junction to mounting base

full cycle

3.0

K/W

half cycle

3.7

K/W

thermal resistance from


junction to ambient

printed-circuit board (FR4)


mounted as in Figure 13

75

K/W

001aac681

10
unidirectional
Zth(jmb)
(K/W)

bidirectional

101

102
105

PD

tp

104

103

102

101

10
tp (S)

Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

5 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

6. Static characteristics
Table 5:
Static characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter

Conditions

BTA204S-600B
BTA204S-800B
Min

gate trigger
current

IGT

latching current

IL

Typ

BTA204S-600C
BTA204S-800C

Max

Min

Typ

Unit

Max

[1]

VD = 12 V; IT = 0.1 A see Figure 8


T2+ G+

50

35

mA

T2+ G

50

35

mA

T2 G

50

35

mA

T2+ G+

30

20

mA

T2+ G

45

30

mA

VD = 12 V; IGT = 0.1 A; see Figure 10

30

20

mA

IH

holding current

VD = 12 V; IGT = 0.1 A; see Figure 11

T2 G

30

20

mA

VT

on-state voltage

IT = 5 A; see Figure 9

1.4

1.7

1.4

1.7

VGT

gate trigger
voltage

VD = 12 V; IT = 0.1 A; see Figure 7

0.7

1.5

0.7

1.5

VD = 400 V; IT = 0.1 A; Tj = 125 C

0.25

0.4

0.25

0.4

ID

off-state leakage
current

VD = VDRM(max); Tj = 125 C

0.1

0.5

0.1

0.5

mA

[1]

Device does not trigger in the T2 G+ quadrant.

001aac334

1.6

001aac677

VGT (Tj)

IGT (Tj)
IGT (25C)

VGT (25C)
1.2

(1)

2
(2)

(3)

0.8

0.4
50

50

100

150

0
50

Tj (C)

50

100

150
Tj (C)

(1) T2 G
(2) T2+ G
(3) T2+ G+

Fig 7. Normalized gate trigger voltage as a function of


junction temperature

Fig 8. Normalized gate trigger current as a function of


junction temperature

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

6 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

001aac338

12
(1) (2)

IT
(A)

001aac336

3
IL(Tj)

(3)

IL(25C)
8

0
50

0
0

50

100

150
Tj (C)

VT (V)

VO = 1.27 V; RS = 0.091
(1) Tj = 125 C; typical values
(2) Tj = 25 C; maximum values
(3) Tj = 125 C; maximum values

Fig 9. On-state current as a function of on-state


voltage; typical values

Fig 10. Normalized latching current as a function of


junction temperature
001aac337

3
IH(Tj)
IH(25C)
2

0
50

50

100

150
Tj (C)

Fig 11. Normalized holding current as a function of junction temperature

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

7 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

7. Dynamic characteristics
Table 6:
Dynamic characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter

Conditions

BTA204S-600B
BTA204S-800B

dVD/dt

critical rate of rise of


off-state voltage

VDM = 0.67VDRM(max);
Tj = 125 C; exponential
waveform; gate open circuit

1000 -

1000

dIcom/dt

critical rate of change of


commutating current

VDM = 400 V; Tj = 125 C;


IT(RMS) = 4A;
dVcom/dt = 20 V/s; gate open
circuit

A/ms

tgt

gate controlled turn-on time ITM = 12 A; VD = VDRM(max);


IG = 0.1 A; dIG/dt = 5 A/s

Min Typ

Max

BTA204S-600C
BTA204S-800C
Min Typ

Unit

Max
V/s

8. Package information
Refer to mounting instructions for SOT428 (DPAK) package.
Plastic meets requirements of UL94 V-0 at 18 inch.

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

8 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

9. Package outline
Plastic single-ended surface mounted package (DPAK); 3 leads (one lead cropped)

SOT428

y
E

A
A1

b2

E1

mounting
base

D2

D1
HD

L2
1

L1

b1

e
e1

10 mm

scale
DIMENSIONS (mm are the original dimensions)
UNIT

A1

b1

b2

D1

D2
min

E1
min

e1

HD

L1
min

L2

y
max

mm

2.38
2.22

0.93
0.73

0.89
0.71

1.1
0.9

5.46
5.00

0.56
0.20

6.22
5.98

4.0

6.73
6.47

4.45

2.285

4.57

10.4
9.6

2.95
2.55

0.5

0.9
0.5

0.2

0.2

OUTLINE
VERSION
SOT428

REFERENCES
IEC

JEDEC

JEITA

TO-252

SC-63

EUROPEAN
PROJECTION

ISSUE DATE
05-02-09
05-02-11

Fig 12. Package outline SOT428 (DPAK)


9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

9 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

10. Mounting
7.00
6.15
5.90
5.80
1.80

1.00

4.725

4.60
5.75 5.65

6.50
1.15
3.60

6.00

2.45
6.00

6.125

0.30

2.40 2.30

solder lands

1.30
1.40
1.65

1.50

solder resist

4.57
SOT428

occupied area
solder paste

Dimensions in mm

Fig 13. SOT428 (DPAK): minimum pad sizes for surface mounting

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

10 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

11. Revision history


Table 7:

Revision history

Document ID

Release date Data sheet status

Change
notice

Doc. number

Supersedes

BTA204S_SER_B_C_3

20050524

9397 750 14862

BTA204S_SERIES_B_C_2

Modifications:

Product data sheet

The format of this data sheet has been redesigned to comply with the new presentation
and information standard of Philips Semiconductors

500 V types removed


Alternative pinning types removed

BTA204S_SERIES_B_C_2 19981201

Product
specification

n.a.

BTA204S_SERIES_B_C_1

BTA204S_SERIES_B_C_1 19971001

Objective
specification

n.a.

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

11 of 13

BTA204S series B and C

Philips Semiconductors

Three-quadrant triacs high communication

12. Data sheet status


Level

Data sheet status [1]

Product status [2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

II

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

13. Definitions

customers using or selling these products for use in such applications do so


at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Short-form specification The data in a short-form specification is


extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Right to make changes Philips Semiconductors reserves the right to


make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status Production),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

Limiting values definition Limiting values given are in accordance with


the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

15. Trademarks

14. Disclaimers

Notice All referenced brands, product names, service names and


trademarks are the property of their respective owners.

Life support These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors

16. Contact information


For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]

9397 750 14862

Product data sheet

Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Rev. 03 24 May 2005

12 of 13

Philips Semiconductors

BTA204S series B and C


Three-quadrant triacs high communication

17. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Package information . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information . . . . . . . . . . . . . . . . . . . . 12

Koninklijke Philips Electronics N.V. 2005


All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 24 May 2005
Document number: 9397 750 14862

Published in The Netherlands

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